Air tightness testing device and air tightness testing method for electronic components

Abstract

The application provides a kind of air tightness detection device and air tightness detection method of electronic component, device includes lower cover plate, pedestal and upper cover plate, transmission pipeline is through lower cover plate, and with first recess communication, transmission pipeline is connected with gas detection piece;Pedestal is set to the side of lower cover plate with first recess, to form sealed vacuum chamber;Upper cover plate is set to the side of pedestal away from lower cover plate, the side of upper cover plate close to pedestal is provided with second recess, and forms sealed pressurizing chamber with pedestal, pressurizing chamber is connected with pressurizing piece;Pedestal includes through the air hole of pedestal to be communicated with vacuum chamber and pressurizing chamber, the electronic component to be detected is placed in pressurizing chamber, and the cavity thereof is communicated with vacuum chamber through air hole, to form sealed connection between the electronic component to be detected and vacuum chamber, to improve the air tightness detection efficiency of electronic component.

Description

Technical Field

[0001] This application relates to the field of airtightness testing technology, specifically to an airtightness testing device and a method for airtightness testing of electronic components. Background Technology

[0002] Existing electronic components require airtightness testing before leaving the factory to confirm their airtightness. Currently, airtightness testing is done visually, such as by manually applying soap foam, observing bubbles in a liquid, or injecting colored gas to make leaks visually observable. However, this method is time-consuming, significantly reducing the efficiency of airtightness testing. Summary of the Invention

[0003] In view of this, this application provides an airtightness testing device and an airtightness testing method for electronic components to solve the problem of low efficiency in existing airtightness testing of electronic components.

[0004] This application provides an airtightness testing device, comprising:

[0005] The lower cover plate includes a first groove and a transmission pipe, the transmission pipe passing through the lower cover plate and communicating with the first groove through the bottom of the first groove, and the transmission pipe being connected to a gas detection element;

[0006] A base is connected to the lower cover plate and disposed on the side of the lower cover plate where the first groove is provided, so as to form a sealed vacuum chamber;

[0007] An upper cover plate is connected to the base and disposed on the side of the base away from the lower cover plate. A second groove is provided on the side of the upper cover plate near the base. The second groove and the base form a sealed pressurized chamber. The pressurized chamber is connected to a pressurizing component.

[0008] The base includes multiple vent holes, each of which penetrates the base to communicate with the vacuum chamber and the pressurized chamber. The electronic component to be tested is placed in the pressurized chamber, and the cavity of the electronic component to be tested is connected to the vacuum chamber through the vent holes, so that a sealed connection is formed between the electronic component to be tested and the vacuum chamber.

[0009] In some embodiments, the airtightness testing device further includes a sealing gasket disposed in the pressurized chamber. The sealing gasket has a plurality of through holes, each of which communicates with a vent hole. The sealing gasket is located between the electronic component to be tested and the base. The cavity communicates with the vacuum chamber through the through holes and the vent hole.

[0010] In some embodiments, the airtightness testing device further includes a first fixing member disposed in the pressurized chamber, the first fixing member being used to fix the sealing gasket to the base.

[0011] In some embodiments, the first fixing member is disposed on the side of the sealing gasket away from the base, and the first fixing member is located on the sealing gasket on which the electronic component to be tested is not disposed.

[0012] In some embodiments, the upper cover plate further includes a second fixing member, one end of which is connected to the bottom wall of the second groove, and the other end of which is disposed on the side of the electronic component to be tested near the upper cover plate, so as to fix the electronic component to be tested on the base.

[0013] In some embodiments, the airtightness testing device further includes a first sealing ring located between the upper cover plate and the base, and disposed around the pressurized chamber.

[0014] In some embodiments, the upper cover plate further includes a protrusion disposed around the edge of the second groove, and the base further includes a sealing groove disposed around the pressurized chamber, wherein the protrusion engages with the sealing groove.

[0015] In some embodiments, the base further includes a plurality of sealing plugs for sealing the vent holes where no electronic component to be tested is located.

[0016] In some embodiments, the airtightness testing device further includes an adapter that communicates with the pressurized chamber, and the pressurizing element communicates with the pressurized chamber through the adapter.

[0017] This application also provides a method for testing the airtightness of electronic components, using the airtightness testing device described above, including:

[0018] Open the top cover and base, and place the electronic component to be tested in the pressurized chamber, wherein the cavity of the electronic component to be tested is sealed to the vacuum chamber through the vent hole;

[0019] Seal the upper cover plate with the base;

[0020] The vacuum chamber is evacuated.

[0021] A detection gas is introduced into the pressurized chamber through a pressurizing component connected to the pressurized chamber to detect the electronic component to be tested in the pressurized chamber;

[0022] Analyze the data detected by the detection device connected to the vacuum chamber.

[0023] This application provides an airtightness testing device and a method for airtightness testing of electronic components. The airtightness testing device includes a lower cover plate, a base, and an upper cover plate. The lower cover plate includes a first groove and a transmission pipe. The transmission pipe passes through the lower cover plate and communicates with the first groove through the bottom of the first groove. The transmission pipe is connected to a gas detection element. The base is connected to the lower cover plate and is disposed on the side of the lower cover plate where the first groove is provided to form a sealed vacuum chamber. The upper cover plate is connected to the base and is disposed on the side of the base away from the lower cover plate. The side of the upper cover plate near the base has a second groove, which forms a sealed pressurized chamber with the base. The pressurized chamber is connected to a pressurizing element. The base includes multiple vent holes, each of which passes through the base to communicate with the vacuum chamber and the pressurized chamber. The electronic component to be tested is placed in the pressurized chamber, and the cavity of the electronic component to be tested communicates with the vacuum chamber through the vent holes, so that a sealed connection is formed between the electronic component to be tested and the vacuum chamber, thereby improving the airtightness testing efficiency of the electronic component. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the airtightness testing device provided in this application;

[0026] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the airtightness testing device along line AB;

[0027] Figure 3 This is a flowchart illustrating the airtightness testing method for electronic components provided in this application.

[0028] Figure label:

[0029] 10. Air tightness testing device; 20. Electronic component to be tested; 100. Lower cover plate; 110. First groove; 111. Protrusion; 120. Transmission pipe; 130. First fixing hole; 140. Second sealing ring; 150. Third sealing ring; 200. Base; 210. Third groove; 220. Fixing groove; 230. Vent hole; 240. Reinforcing groove; 250. Sealing groove; 260. First protrusion; 270. Second protrusion; 280. Sealing plug; 300. Top cover plate; 310, second groove; 320, protrusion; 330, second fastener; 340, engaging groove; 350, first through hole; 360, second through hole; 370, recess; 400, sealing gasket; 410, through hole; 420, reinforcing hole; 500, first fastener; 600, third fastener; 700, fourth fastener; 800, spherical bearing; 900, wing nut; 1000, adapter; 1100, handle; 1200, pressure detection component. Detailed Implementation

[0030] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0031] This application provides an airtightness testing device, which includes a lower cover plate, a base, and an upper cover plate. The lower cover plate includes a first groove and a transmission pipe, which penetrates the lower cover plate and communicates with the first groove through the bottom of the first groove. The transmission pipe is connected to a gas detection element. The base is connected to the lower cover plate and is disposed on the side of the lower cover plate where the first groove is provided, to form a sealed vacuum chamber. The upper cover plate is connected to the base and is disposed on the side of the base away from the lower cover plate. The side of the upper cover plate near the base has a second groove, which forms a sealed pressurized chamber with the base. The pressurized chamber is connected to a pressurizing element. The base includes multiple vent holes, each of which penetrates the base to communicate with the vacuum chamber and the pressurized chamber. The electronic component to be tested is placed in the pressurized chamber, and the cavity of the electronic component to be tested communicates with the vacuum chamber through the vent holes, so that a sealed connection is formed between the electronic component to be tested and the vacuum chamber.

[0032] In this application, the airtightness testing device mainly consists of an upper cover plate, a lower cover plate, a base, a gas detection element, and a pressurizing element. The upper cover plate and the base are closed to form a pressurized chamber, and the base and the lower cover plate are closed to form a vacuum chamber. After the electronic component to be tested is placed in the pressurized chamber, the vacuum chamber can be evacuated to create a vacuum condition. Then, the pressurizing element introduces the detection gas into the pressurized chamber, and the data detected by the gas detection element is observed. This completes the airtightness testing of the electronic component without the need for manually applying foam to the electronic component and then placing it in a liquid to judge whether the airtightness of the electronic component is qualified by manually observing whether there are bubbles. This greatly shortens the testing time and improves the testing efficiency of the airtightness of the electronic component.

[0033] Please refer to Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural schematic diagram of the airtightness testing device provided in this application; Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the airtightness testing device along line AB. This application provides an airtightness testing device 10, which includes a lower cover plate 100, a base 200, an upper cover plate 300, a sealing gasket 400, a first fixing member 500, a third fixing member 600, a fourth fixing member 700, a spherical bearing 800, a first sealing ring, a third sealing ring 150, a wing nut 900, an adapter 1000, a pressure testing member 1200, and a carrying component 1100, as described in detail below.

[0034] The lower cover plate 100 includes a first groove 110 and a transmission pipe 120. The transmission pipe 120 passes through the lower cover plate 100 and is connected to the first groove 110 through the bottom of the first groove 110. The transmission pipe 120 is connected to the gas detection element. Specifically, the lower cover plate 100 includes a first groove 110, a transmission pipe 120, a first fixing hole 130, a first receiving groove, a second receiving groove, a second sealing ring 140, a third sealing ring 150, and a sealing plug 280. One side of the lower cover plate 100 has the first groove 110, and the lower cover plate 100 has a protrusion 111 near the edge of the first groove 110, so that the plane of the area near the edge of the first groove 110 is higher than the plane of the surrounding area away from the edge of the first groove 110. The transmission pipe 120 passes through the lower cover plate 100 and communicates with the first groove 110 through the bottom of the first groove 110. The diameter of the pipe opening of the transmission pipe 120 away from the first groove 110 is larger than the diameter of the transmission pipe 120 near the first groove 110. The opening opposite to the first groove 110 is also called a gas detection connector, which is used to connect to a gas detection device, which can be a helium mass spectrometer. The first receiving groove and the second receiving groove are disposed on the side of the lower cover plate 100 where the first groove 110 is disposed, and the first receiving groove and the second receiving groove 310 are disposed around the first groove 110. The first receiving groove is located between the first groove 110 and the second receiving groove. The second sealing ring 140 is disposed in the first receiving groove, and the third sealing ring 150 is disposed in the second receiving groove. There are multiple first fixing holes 130. The first fixing holes 130 penetrate the lower cover plate 100 and are located at the edge of the lower cover plate 100. The inner wall of the first fixing hole 130 has internal threads. The first fixing hole 130 is located on the side of the second receiving groove away from the first receiving groove.

[0035] The base 200 is connected to the lower cover plate 100 and is disposed on the side of the lower cover plate 100 where the first groove 110 is provided, to form a sealed vacuum chamber. Specifically, the base 200 includes a third groove 210, a fixing groove 220, a vent 230, a reinforcing groove 240, a sealing groove 250, a third receiving groove, a fourth receiving groove, a first protrusion 260, a second protrusion 270, and a sealing plug 280. The third groove 210 is provided on the side of the base 200 near the lower base 200, and the protrusion 111 is disposed in the third groove 210, that is, the diameter of the third groove 210 is larger than the diameter of the first groove 110, that is, the first groove 110 is engaged in the third groove 210 to form a sealed vacuum chamber; the fixing groove 220 is disposed on the side of the base 200 near the lower cover plate 100, the fixing groove 220 is located around the vacuum chamber, and the fixing groove 220 is paired with the first fixing hole 130 one by one. The fixing groove 220 should be configured such that its inner wall has internal threads, and the third fixing member 600 is inserted into the first fixing hole 130 and the fixing groove 220 to fix the lower cover plate 100 and the base 200. The third fixing member 600 has external threads, and the internal threads of the fixing groove 220 and the first fixing hole 130 match the external threads of the third fixing member 600 so that the lower cover plate 100 and the base 200 form a threaded connection. The third fixing member 600 can be a bolt or a screw.

[0036] Multiple vent holes 230 and reinforcing grooves 240 are provided. Each vent hole 230 penetrates the base 200 to communicate with the vacuum chamber. The inner wall of each vent hole 230 is provided with internal threads to facilitate the installation of the sealing plug 280. Each reinforcing groove 240 is spaced apart from the vent hole 230. The sealing gasket 400 is provided on the side of the base 200 away from the lower cover plate 100, and the sealing gasket 400 is located in the area where the vent hole 230 is provided. The Shore hardness of the sealing gasket 400 is less than or equal to 30HD. The sealing gasket 400 has multiple through holes 410 and reinforcing holes 420 penetrating the sealing gasket 400. Each through hole 410 and reinforcing hole penetrates the sealing gasket 400, and each through hole 410 communicates with a vent hole 230. The electronic component 20 to be tested is disposed on the side of the sealing gasket 400 away from the lower cover plate 100, and the cavity of the electronic component 20 corresponds to the through hole 410 and the vent hole 230, so that the cavity can communicate with the vacuum chamber through the through hole 410 and the vent hole 230, and a sealed connection is formed between the electronic component 20 to be tested and the vacuum chamber. The first fixing member 500 is a stainless steel plate, which is disposed on the side of the sealing gasket 400 away from the lower cover plate 100, and is located in the area of ​​the sealing gasket 400 where the electronic component 20 to be tested is not disposed, so as to fix the sealing gasket 400 to the base 200. The first fixing member 500 also includes a plurality of stabilizing holes penetrating the first fixing member 500, each stabilizing hole corresponding to a reinforcing groove 240 and a reinforcing hole 420. The fourth fixing member 700 is inserted into the stabilizing hole, the reinforcing hole 420 and the reinforcing groove 240 to fix the sealing gasket 400 to the base 200. Optionally, the first fastener 500 can be an adhesive layer disposed between the sealing gasket 400 and the base 200 to fix the sealing gasket 400 to the base 200. In this embodiment, a stainless steel plate is used as an example for the first fastener 500.

[0037] A sealing groove 250 is provided on the side of the base 200 away from the lower cover plate 100, and the sealing groove 250 surrounds the sealing gasket 400. A third receiving groove is provided on the side of the sealing groove 250 away from the sealing gasket 400, and the first sealing ring is disposed in the third receiving groove; a fourth receiving groove is provided on the side of the third receiving groove away from the isolation gasket, spaced apart from the third receiving groove, and the third sealing ring 150 is disposed in the fourth receiving groove; the first protrusion 260 and the second protrusion 270 protrude outward 320 from the edge of the base 200, that is, the first protrusion 260 and the second protrusion 270 protrude outward 320 from the edge of the base 200 away from the vacuum chamber; in the direction of the base 200 toward the lower cover plate 100, the first protrusion 260 and The projection of the second protrusion 270 is located outside the projection of the lower cover plate 100, that is, the projection of the base 200 is larger than the projection of the lower cover plate 100. There are multiple first protrusions 260 and second protrusions 270. Each first protrusion 260 is adjacent to and spaced apart from a second protrusion 270. The space between each first protrusion 260 and a second protrusion 270 is a recessed area. Each first protrusion 260 has a second fixing hole penetrating through it, and each second protrusion 270 has a third fixing hole penetrating through it. The second fixing holes and third fixing holes are arranged in a one-to-one correspondence. There are multiple sealing plugs 280, which are used to seal the vent 230 where no electronic component 20 to be tested is installed.

[0038] The upper cover plate 300 is connected to the base 200 and is located on the side of the base 200 opposite to the lower cover plate 100. A second groove 310 is provided on the side of the upper cover plate 300 near the base 200. The second groove 310 and the base 200 form a sealed pressurized chamber, which is connected to a pressurizing component. Specifically, the upper cover plate 300 includes a second groove 310, a protrusion 320, a second fixing component 330, a locking groove 340, a first through hole 350, a second through hole 360, a locking groove, and a recess 370. The side of the upper cover plate 300 with the second groove 310 covers the side of the base 200 near the upper cover plate 300, forming a sealed pressurized chamber. From the base 200 towards the lower cover plate 100, the orthographic projection of the pressurized chamber is larger than the orthographic projection of the vacuum chamber. A protrusion 320 is disposed on the surface of the upper cover plate 300 near the base 200, and the protrusion 320 is disposed around the edge of the second groove 310. The protrusion 320 engages with the sealing groove 250, that is, the sealing groove 250 and the protrusion 320 are disposed around the pressurized chamber. On the bottom surface of the upper cover plate 300 near the base 200, there is a locking groove 340 that corresponds one-to-one with the vent hole 230. The locking groove 340 has an internal thread, that is, the locking groove 340 is located on the bottom wall of the second groove 310.The second fastener 330 includes a snap-fit ​​part and a limiting part. The diameter of the snap-fit ​​part near the upper cover plate 300 is smaller than the diameter of the snap-fit ​​part away from the upper cover plate 300, and the diameter of the snap-fit ​​part near the upper cover plate 300 matches the diameter of the engaging groove 340. The snap-fit ​​part has an external thread, and the internal thread matches the external thread. The limiting part has a first limiting hole, a second limiting hole, a third limiting hole, and a fourth limiting hole. The inner walls of the first limiting hole, the second limiting hole, the third limiting hole, and the fourth limiting hole are all provided with internal threads. From the base 200 toward the lower cover plate 100, the first limiting hole, the second limiting hole, the third limiting hole, and the fourth limiting hole are arranged sequentially. The diameter of the first limiting hole is smaller than the diameter of the second limiting hole, and the diameter of the first limiting hole matches the diameter of the snap-fit ​​part away from the upper cover plate 300. The diameter of the second limiting hole is larger than the diameter of the third limiting hole. The diameter of the snap-fit ​​part on one side of the cover plate 300 is smaller than the diameter of the third limiting hole than the diameter of the first limiting hole. The diameter of the third limiting hole is also smaller than the diameter of the snap-fit ​​part on the side away from the upper cover plate 300. The diameters of the third limiting hole, the second limiting hole, and the first limiting hole are all smaller than the diameter of the fourth limiting hole. One end of the snap-fit ​​part near the upper cover plate 300 passes through the snap-fit ​​groove 340, and the other end of the snap-fit ​​part away from the upper cover plate 300 passes through the first limiting hole and... In the second limiting hole, when the airtightness testing device 10 is in operation, the side of the limiting part away from the upper cover plate 300 is used to abut against the electronic component 20 to be tested, so as to fix the electronic component 20 to be tested on the base 200. That is, one end of the second fixing member 330 is connected to the bottom wall of the second groove 310, and the other end of the second fixing member 330 is provided on the side of the electronic component 20 to be tested near the upper cover plate 300, so as to fix the electronic component 20 to be tested on the base 200.

[0039] The bottom wall of the second groove 310 has a first through hole 350 and a second through hole 360 ​​penetrating the upper cover plate 300 to communicate with the pressurization chamber. One end of the adapter 1000 passes through the first through hole 350, and the other end of the adapter 1000 is connected to the pressurization component. Specifically, the adapter 1000 includes a conversion connector, a ball valve, and a quick connector. One end of the conversion connector passes through the first through hole 350 and has a first air transmission hole penetrating the conversion connector and communicating with the pressurization chamber. Ball valve grooves are provided at opposite ends of the ball valve. One ball valve groove is inserted into the other end of the conversion connector. The bottom wall of the ball valve groove is provided with a second air transmission hole, which communicates with the first air transmission hole. One end of the quick connector is inserted into the other ball valve groove, and the other end of the quick connector is connected to the pressurization component.

[0040] The pressure sensing element 1200 is connected to the pressurized chamber through the second through hole 360. The pressure sensing element 1200 can be a pressure gauge. A snap-fit ​​groove is provided on the side of the upper cover plate 300 away from the base 200 and is located on the bottom wall of the second groove. One end of the handle 1100 is snapped into the snap-fit ​​groove. The diameter of the handle 1100 on the side away from the upper cover plate 300 is larger than the diameter of the handle 1100 on the side closer to the upper cover plate 300, so as to avoid the risk of falling off when picking up or putting down the upper cover plate 300, and to make it easier to pick up or put down the upper cover plate 300.

[0041] From the base 200 toward the lower cover plate 100, the projected edge of the upper cover plate 300 coincides with the projected edge of the base 200. A recess 370 is provided on the edge of the upper cover plate 300, and the recess 370 is located on the side of the upper cover plate 300 away from the pressurization chamber. Each recess 370 is provided corresponding to a recessed area. Each wing nut 900 is provided in a recess 370 and a recessed area, that is, the wing nut 900 is provided between the first protrusion 260 and the second protrusion 270 and in the recess 370. The wing nut 900 has a through hole 410 corresponding to the second fixing hole and the third fixing hole. The spherical bearing 800 passes through the second fixing hole, the third fixing hole and the through hole 410 to fix the upper cover plate 300 to the base 200.

[0042] It should be noted that some components of the airtightness testing device 10 can be removed as needed, such as the conversion part, the third sealing ring 150, or the handle part 1100.

[0043] The working principle of the airtightness testing device 10 for testing the airtightness of products is as follows: (1) Open the butterfly nut 900 and the upper cover plate 300, and place the electronic component 20 to be tested in the pressurized chamber; (2) Cover the upper cover plate 300 and lock the butterfly nut 900; (3) The vacuum chamber is evacuated by a vacuum pump connected to the gas detection element, and a vacuum condition is formed in the vacuum chamber. The electronic component 20 to be tested presses against the base 200 under the pressure difference, forming a sealing condition; (4) Pressurization will pass the detection gas into the pressurized chamber through the quick connector; (5) Close the ball valve and maintain the pressure for a period of time; (6) The gas detection element outputs the test result; (7) Open the ball valve to release the detection gas, and the airtightness test of the electronic component can be completed. The electronic component can be a multilayer ceramic substrate.

[0044] In this application, the airtightness testing device 10 is mainly composed of an upper cover plate 300, a lower cover plate 100, a base 200, a gas detection element, and a pressurizing element. The upper cover plate 300 and the base 200 are closed to form a pressurized chamber, and the base 200 and the lower cover plate 100 are closed to form a vacuum chamber. This allows the electronic component 20 to be tested to be placed in the pressurized chamber, and then the vacuum chamber can be evacuated to create a vacuum condition. Afterward, the pressurizing element introduces a detection gas into the pressurized chamber, and the data detected by the gas detection element is observed, thus completing the airtightness testing of the electronic component 10. This eliminates the need for manual application of foam to electronic components, followed by immersion in liquid and manual observation of the presence of bubbles to determine airtightness. This significantly reduces the time required for manual testing, thus improving the efficiency of airtightness testing. Furthermore, the airtightness testing device 10 is simple in structure, consisting of an upper cover plate 300, a lower cover plate 100, a base 200, a gas detection element, and a pressurizing element. It is easy to install and disassemble during operation, further reducing installation and disassembly time and improving overall airtightness testing efficiency.

[0045] In this application, by setting a sealing plug 280, the number of detection positions of electronic components can be increased or decreased according to the yield rate of the produced electronic components during the airtightness test, thereby improving the detection accuracy of electronic components and the detection efficiency of airtightness of electronic components.

[0046] In this application, a transmission pipe 120 is provided on the lower cover plate 100, and the diameter of the pipe opening of the transmission pipe 120 away from the first groove 110 is larger than the diameter of the transmission pipe 120 near the first groove 110, so that the transmission pipe 120 can be directly connected to the gas detection element without the need for other conversion elements, thereby enabling the gas detection element to be quickly connected to the transmission pipe 120, thereby further improving the detection efficiency of the airtightness of electronic components.

[0047] In this application, a protrusion 111 is provided on the edge of the lower cover plate 100 near the first groove 110, and the protrusion 111 is disposed in the third groove 210, that is, the diameter of the third groove 210 is larger than the diameter of the first groove 110, so that the first groove 110 can be well engaged in the third groove 210, reducing the risk of gaps appearing in the vacuum chamber formed by the base 200 and the first groove 110 of the lower cover plate 100, thereby ensuring the accuracy of airtightness testing of electronic components.

[0048] In this application, a first receiving groove and a second receiving groove are provided on the lower cover plate 100, and a second sealing ring 140 and a fourth sealing ring are respectively provided in the first receiving groove and the second receiving groove, so as to further reduce the risk of gaps appearing in the vacuum chamber formed by the base 200 and the first groove 110 of the lower cover plate 100, thereby ensuring the accuracy of airtightness testing of electronic components.

[0049] In this application, a first fixing hole 130 with internal threads is provided on the edge of the lower cover plate 100, and a fixing groove 220 with internal threads corresponding to the first fixing hole 130 is provided on the base 200, so that the lower cover plate 100 and the base 200 can be threadedly connected by a third fixing member 600 with external threads, which facilitates the disassembly and installation of the lower cover plate 100 and the base 200, thereby greatly shortening the installation and disassembly time of the device and improving the detection efficiency of the airtightness of electronic components.

[0050] In this application, a sealing gasket 400 is provided between the electronic component 20 to be tested and the base 200, and the Shore hardness of the sealing gasket 400 is set to be less than or equal to 30HD. This is so that during the operation of the device, the electronic component 20 to be tested presses the sealing gasket 400 under pressure difference. Through the deformation of the sealing gasket 400, the risk of gaps appearing between the cavity of the electronic component 20 to be tested and the base 200 is further reduced, thereby ensuring the accuracy of the airtightness test of the electronic component.

[0051] In this application, by setting a first fixing member 500 in the pressurized chamber, the sealing gasket 400 is fixed to the base 200 by the first fixing member 500, so as to avoid the risk of the sealing gasket 400 moving during operation, thereby ensuring the accuracy of the airtightness test of electronic components.

[0052] In this application, by providing a reinforcing groove 240 on the base 200, a through hole 410 on the sealing gasket 400, and a stabilizing hole on the first fixing member 500, the reinforcing groove 240, the stabilizing hole, and the reinforcing hole 420 are provided in a one-to-one correspondence, so that the sealing gasket 400 can be fixed on the base 200 by the fourth fixing member 700, further avoiding the risk of the sealing gasket 400 moving during operation, thereby ensuring the accuracy of the airtightness test of electronic components.

[0053] In this application, a sealing groove 250 is provided on the side of the base 200 away from the lower cover plate 100, and a protrusion 320 that engages with the sealing groove 250 is provided on the side of the upper cover plate 300 close to it, so that the upper cover plate 300 can be well engaged on the base 200, thereby further reducing the risk of gaps in the pressurized chamber and further ensuring the accuracy of airtightness testing of electronic components.

[0054] In this application, a third receiving groove and a fourth receiving groove are sequentially provided on the side of the sealing groove 250 away from the sealing gasket 400, and a first sealing ring and a third sealing ring 150 are respectively provided in the third receiving groove and the fourth receiving groove, so as to further reduce the risk of gaps appearing in the pressurized chamber, thereby further ensuring the accuracy of airtightness testing of electronic components.

[0055] In this application, by setting a wing nut 900 and a spherical bearing 800, a threaded connection is formed between the upper cover plate 300 and the base 200, which facilitates the disassembly and installation of the upper cover plate 300 and the base 200, thereby greatly shortening the installation and disassembly time of the device and improving the detection efficiency of the airtightness of electronic components.

[0056] In this application, a second fastener 330 is provided to fix the electronic component 20 to be tested on the base 200, so as to reduce the risk of movement of the electronic component 20 during operation, thereby ensuring the accuracy of the airtightness test of the electronic component.

[0057] In this application, the second fixing member 330 is composed of a snap-fit ​​part and a limiting part, and the snap-fit ​​part is threadedly connected to the upper cover plate 300, so as to adjust the length of the second fixing member 330 to fix the electronic component 20 to be tested on the base 200, thereby further ensuring the accuracy of the airtightness test of the electronic component.

[0058] In this application, by setting the snap-fit ​​part and the limiting part to be threaded connection, the length of the second fixing member 330 can be adjusted to fix the electronic component 20 to be tested on the base 200, thereby further ensuring the accuracy of the airtightness test of the electronic component.

[0059] In this application, by setting the diameter of the third limiting hole to be smaller than the diameter of the end of the snap-fit ​​part that is 300 away from the upper cover plate, the risk of the snap-fit ​​part and the limiting part falling off is reduced, thereby further ensuring the accuracy of the airtightness test of electronic components.

[0060] This application also provides a method for testing the airtightness of electronic components, using the airtightness testing device provided in this application, including:

[0061] S11. Open the top cover and base, and place the electronic component to be tested in the pressurized chamber. The cavity of the electronic component to be tested is sealed to the vacuum chamber through the vent hole.

[0062] S12. Seal the top cover plate with the base.

[0063] S13. Evacuate the vacuum chamber.

[0064] S14. Test gas is introduced into the pressurized chamber through a pressurizing component connected to the pressurized chamber to test the electronic components to be tested in the pressurized chamber.

[0065] S15. Analyze the data detected by the detection device connected to the vacuum chamber.

[0066] This application provides a method for testing the airtightness of electronic components. The airtightness testing device provided in this application is mainly composed of an upper cover plate, a lower cover plate, a base, a gas detection element, and a pressurizing element. The upper cover plate and the base together form a pressurized chamber, and the base and the lower cover plate together form a vacuum chamber. After placing the electronic component to be tested in the pressurized chamber, the vacuum chamber is evacuated to create a vacuum condition. Then, the pressurizing element introduces a detection gas into the pressurized chamber, and the data detected by the gas detection element is observed. This completes the airtightness testing of the electronic component without the need for manually applying foam to the electronic component, placing it in a liquid, and manually observing the presence of bubbles to determine if the airtightness of the electronic component is acceptable. The method has a simple structure, is easy to operate, and greatly shortens the testing time, thus improving the efficiency of airtightness testing of electronic components.

[0067] Please see Figure 3 , Figure 3 This is a flowchart illustrating the airtightness testing method for electronic components provided in this application. This application also provides an airtightness testing method for electronic components, using the airtightness testing device 10 provided in this application for testing, specifically including:

[0068] S11. Open the top cover and base, and place the electronic component to be tested in the pressurized chamber. The cavity of the electronic component to be tested is sealed to the vacuum chamber through the vent hole.

[0069] Specifically, the wing nut 900 and the spherical bearing 800 are disassembled; then, the upper cover plate 300 and the base 200 are opened, and the electronic component 20 to be tested is placed on the sealing gasket 400. The cavity of the electronic component 20 to be tested is set to correspond with the through hole 410 of the sealing gasket 400, so that the cavity, through hole 410 and vent hole 230 of the electronic component 20 to be tested form a sealed area with the vacuum chamber. The positions corresponding to the through hole 410 and the vent hole 230 are the testing positions.

[0070] In one embodiment, after step S11, the method further includes:

[0071] Adjust the length of the second fixing member 330 until the second fixing member 330 can abut the electronic component 20 to be tested against the base 200.

[0072] S12. Seal the top cover plate with the base.

[0073] Specifically, the upper cover plate 300 is closed to the base 200; then, the wing nut 900 is assembled with the spherical bearing 800 and the wing nut 900 is locked to form a seal between the upper cover plate 300 and the base 200.

[0074] In one embodiment, if the number of electronic components 20 to be tested is less than the number of detection positions, after step S12, the method further includes: removing the third fixing member 600 from the fixing hole and fixing groove 220, opening the lower cover plate 100 and the base 200, placing a sealing plug 280 in the vent hole 230 where no electronic components 20 to be tested are provided; then, closing the lower cover plate 100 and the base 200, and inserting the third fixing member 600 through the fixing hole and fixing groove 220 to connect the lower cover plate 100 and the base 200.

[0075] S13. Evacuate the vacuum chamber.

[0076] Specifically, a vacuum pump connected to a gas detection device evacuates the vacuum chamber to create a vacuum condition.

[0077] S14. Test gas is introduced into the pressurized chamber through a pressurizing component connected to the pressurized chamber to test the electronic components to be tested in the pressurized chamber.

[0078] Specifically, the ball valve is opened, and the pressurizing component introduces the detection gas into the pressurizing chamber through the adapter 1000. At this time, the electronic component 20 to be tested presses against the sealing gasket 400 under the action of the pressure difference. Due to the deformation of the sealing gasket 400, a sealing condition is formed between the electronic component 20 to be tested and the sealing gasket 400. Then, observe whether the pressure value displayed on the pressure detection component 1200 is within the pressure threshold. If not, continue to introduce the detection gas into the pressurizing chamber. If it is, close the ball valve and maintain the pressure for a period of time.

[0079] S15. Analyze the data detected by the detection device connected to the vacuum chamber.

[0080] Specifically, the data detected by the test component is compared with the gas threshold to analyze whether the detected data is within the gas threshold. If it is, the airtightness of the electronic component 20 under test is qualified; if it is not, the airtightness of the electronic component 20 under test is unqualified, and there are defective products in the electronic component 20 under test. The airtightness test of the electronic component 20 under test is then completed.

[0081] In one embodiment, after step S15, the method further includes: opening the ball valve to release the detection gas in the pressurized chamber.

[0082] This application provides a method for testing the airtightness of electronic components. The airtightness testing device 10 provided in this application is used for airtightness testing. The airtightness testing device 10 mainly consists of an upper cover plate 300, a lower cover plate 100, a base 200, a gas detection element, and a pressurizing element. The upper cover plate 300 and the base 200 are closed to form a pressurized chamber, and the base 200 and the lower cover plate 100 are closed to form a vacuum chamber. After placing the electronic component 20 to be tested in the pressurized chamber, the vacuum chamber can be evacuated to create a vacuum condition. Then, the pressurizing element introduces a detection gas into the pressurized chamber, and the data detected by the gas detection element is observed. This completes the airtightness testing of the electronic component 10 without the need for manually applying foam to the electronic component, placing it in a liquid, and manually observing the presence of bubbles to determine if the airtightness of the electronic component is qualified. The method has a simple structure and is easy to operate, greatly shortening the testing time and improving the efficiency of airtightness testing of electronic components.

[0083] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, such as the combination of technical features between embodiments, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An airtightness testing device, characterized in that, include: The lower cover plate includes a first groove and a transmission pipe, the transmission pipe passing through the lower cover plate and communicating with the first groove through the bottom of the first groove, and the transmission pipe being connected to a gas detection element; A base is connected to the lower cover plate and disposed on the side of the lower cover plate where the first groove is provided, so as to form a sealed vacuum chamber; An upper cover plate is connected to the base and disposed on the side of the base away from the lower cover plate. A second groove is provided on the side of the upper cover plate near the base. The second groove and the base form a sealed pressurized chamber. The pressurized chamber is connected to a pressurizing component. The base includes multiple vent holes, each of which penetrates the base to communicate with the vacuum chamber and the pressurized chamber. The electronic component to be tested is placed in the pressurized chamber, and the cavity of the electronic component to be tested is connected to the vacuum chamber through the vent holes, so that a sealed connection is formed between the electronic component to be tested and the vacuum chamber. The airtightness testing device further includes a sealing gasket disposed in the pressurized chamber. The sealing gasket has multiple through holes, each of which communicates with a vent hole. The sealing gasket is located between the electronic component to be tested and the base. The cavity communicates with the vacuum chamber through the through holes and the vent hole. The airtightness testing device further includes a first fixing member, which is disposed in the pressurized chamber and is used to fix the sealing gasket on the base; The first fixing member is disposed on the side of the sealing gasket away from the base, and the first fixing member is located on the sealing gasket on which the electronic component to be tested is not disposed; The upper cover plate also includes a second fixing member. One end of the second fixing member is connected to the bottom wall of the second groove, and the other end of the second fixing member is disposed on the side of the electronic component to be tested near the upper cover plate, so as to fix the electronic component to be tested on the base.

2. The airtightness testing device according to claim 1, characterized in that, The airtightness testing device also includes a first sealing ring, which is located between the upper cover plate and the base and is arranged around the pressurized chamber.

3. The airtightness testing device according to claim 1, characterized in that, The upper cover plate also includes a protrusion that surrounds the edge of the second groove, and the base also includes a sealing groove that surrounds the pressurized chamber, with the protrusion engaging in the sealing groove.

4. The airtightness testing device according to claim 1, characterized in that, The base also includes a plurality of sealing plugs, which are used to seal the vent holes where the electronic components to be tested are not located.

5. The airtightness testing device according to claim 1, characterized in that, The airtightness testing device also includes an adapter, which is connected to the pressurized chamber, and the pressurizing component is connected to the pressurized chamber through the adapter.

6. A method for testing the airtightness of electronic components, characterized in that, The airtightness testing is performed using the airtightness testing device as described in any one of claims 1-5, comprising: Open the top cover and base, and place the electronic component to be tested in the pressurized chamber, wherein the cavity of the electronic component to be tested is sealed to the vacuum chamber through the vent hole; Seal the upper cover plate with the base; The vacuum chamber is evacuated. A detection gas is introduced into the pressurized chamber through a pressurizing component connected to the pressurized chamber to detect the electronic component to be tested in the pressurized chamber; Analyze the data detected by the detection device connected to the vacuum chamber.

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