Fingerprint recognition module

Abstract

The present application provides a fingerprint recognition module, comprising a first dielectric layer, a processing unit, a plurality of first sensing series and a plurality of second sensing series. The first side of the first dielectric layer is provided with a plurality of first metal contacts, and the second side is provided with a plurality of second metal contacts. The first metal contacts are electrically connected to the second metal contacts. The processing unit is arranged on the first side and has a plurality of first conductive pads for electrically connecting the first metal contacts. The first sensing series is arranged between the first dielectric layer and the second dielectric layer and is electrically connected to the first conductive pads. The second sensing series is arranged between the second dielectric layer and the third dielectric layer and is electrically connected to the second conductive pads. The first conductive pads are electrically connected to the third conductive pads through the first conductive pillars, and the second conductive pads and the third conductive pads are electrically connected to the second metal contacts.

Description

Technical Field

[0001] This application relates to a fingerprint recognition module, and more particularly to a fingerprint recognition module that can integrate a chip and a sensing film. Background Technology

[0002] Traditionally, fingerprint recognition modules are manufactured by first creating a fingerprint-detecting sensing film on a glass or semiconductor substrate. Next, the glass or semiconductor substrate with the sensing film is cut off using a machine, and a flat cable is connected to it. This flat cable then connects to a circuit board containing the chip or processing unit. As can be seen, traditional fingerprint recognition modules require more complex semiconductor technology, and the subsequent assembly of the sensing film and circuit board not only increases manufacturing costs but also reduces product yield. Furthermore, the overall size of traditional fingerprint recognition modules is limited by the substrate, flat cable, and circuit board, making them unsuitable for small or thin electronic devices. Therefore, the industry needs a new fingerprint recognition module that can reduce manufacturing costs and shrink size for application in small or thin electronic devices. Summary of the Invention

[0003] The technical problem to be solved by this application is to provide a fingerprint recognition module, wherein the fingerprint recognition module can directly assemble a sensing film layer and a processing unit, so that the processing unit and the fingerprint recognition area can be located on opposite sides of the fingerprint recognition module. The fingerprint recognition module of this application can be further reduced in size and can achieve a higher assembly yield.

[0004] This application proposes a fingerprint recognition module, which includes a first dielectric layer, a processing unit, a plurality of first sensing serial lines, and a plurality of second sensing serial lines. The first dielectric layer defines a first side and a second side. A transition substrate is disposed on the first side, and a plurality of first metal contacts and a plurality of second metal contacts are disposed on both sides of the transition substrate. The plurality of first metal contacts are electrically connected to the plurality of second metal contacts. The processing unit is disposed on the first side and has a plurality of first conductive pads, each of which is electrically connected to one of the plurality of first metal contacts. The plurality of first sensing serial lines are disposed between the first dielectric layer and the second dielectric layer and are electrically connected to a plurality of first wires. The plurality of second sensing serial lines are disposed between the second dielectric layer and the third dielectric layer and are electrically connected to a plurality of second wires. Each first wire is electrically connected to a plurality of third wires via a first conductive post, and the plurality of second wires and the plurality of third wires are electrically connected to the plurality of second metal contacts.

[0005] In some embodiments, the plurality of first sensing serial lines are arranged along a first direction, and the plurality of second sensing serial lines are arranged along a second direction, wherein the first direction may be perpendicular to the second direction. Furthermore, the third dielectric layer has a first side and a second side. The plurality of second conductive lines and the plurality of third conductive lines may be disposed on the second side of the third dielectric layer, and the second side of the third dielectric layer is provided with a plurality of second conductive pads. Each second conductive line is electrically connected to one of the plurality of second conductive pads, and each third conductive line is electrically connected to one of the plurality of second conductive pads. Additionally, each second metal contact may contact one of the plurality of second conductive pads. The plurality of second metal contacts may be disposed at the edge of the second side, and the first area may be smaller than the second area.

[0006] In some embodiments, a fingerprint recognition region is defined on the first side of the third dielectric layer. This fingerprint recognition region overlaps with the area surrounded by the plurality of first sensing serial lines and the plurality of second sensing serial lines, and the area of ​​the fingerprint recognition region may be smaller than the second area. Furthermore, the fingerprint recognition module may include a metal casing or a metal conductive film layer disposed on the first side of the third dielectric layer, and surrounding the fingerprint recognition region. The plurality of second conductive lines and the plurality of third conductive lines may be coplanar.

[0007] In some embodiments, the fingerprint recognition module may include an anti-static via connecting a metal housing or a metal conductive film layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer. One end of the anti-static via exposes the metal housing or the metal conductive film layer, and the other end exposes the third dielectric layer. Furthermore, the fingerprint recognition module may also include a via protection member covering the anti-static via exposed in the metal housing or the metal conductive film layer. Additionally, the fingerprint recognition module may further include a first adhesive layer disposed between the first dielectric layer and the second dielectric layer, and covering the first sensing serial line.

[0008] This application also provides a fingerprint recognition module, which includes an adapter substrate on which a sensing film and a processing unit can be assembled. The fingerprint recognition module of this application can be further reduced in size and has a higher assembly yield.

[0009] This application proposes a fingerprint recognition module, which includes a first dielectric layer, a plurality of first sensing serial lines, a plurality of second sensing serial lines, and an adapter substrate. The first dielectric layer has a plurality of first conductive pillars. The plurality of first sensing serial lines are disposed between the first and second dielectric layers and electrically connected to a plurality of first wires, each first wire being electrically connected to one of the plurality of first conductive pillars. The plurality of second sensing serial lines are disposed between the second and third dielectric layers and electrically connected to a plurality of second wires. The adapter substrate is connected to the first dielectric layer and has a plurality of first adapter contacts and a plurality of second adapter contacts. The plurality of first adapter contacts are electrically connected to the plurality of second adapter contacts, each first adapter contact being used to electrically connect to one of the plurality of first conductive pillars. Each second wire is electrically connected to one of a plurality of third wires via a second conductive pillar, and each third wire is electrically connected to one of the plurality of first conductive pillars.

[0010] In some embodiments, the plurality of first transition contacts and the plurality of second transition contacts may be on opposite sides of the transition substrate. The projected area surrounded by the plurality of first transition contacts may overlap the projected area surrounded by the plurality of second transition contacts. Furthermore, the plurality of first transition contacts and the plurality of second transition contacts may also be on the same side of the transition substrate. The fingerprint recognition module may further include a processing unit having a plurality of first conductive pads, each first conductive pad being used to electrically connect to one of the plurality of first transition contacts. Additionally, the plurality of first conductive posts are exposed on a first dielectric layer adjacent to the transition substrate to form a plurality of first metal contacts on the surface of the first dielectric layer.

[0011] In summary, the fingerprint recognition module provided in this application allows for direct assembly of the sensing film and processing unit, enabling the processing unit and fingerprint recognition area to be located on opposite sides of the fingerprint recognition module. This allows for a smaller overall size and higher assembly yield. Furthermore, another fingerprint recognition module provided in this application can have an extended adapter substrate, on which processing units can be assembled, similarly reducing the size of the fingerprint recognition module and achieving even higher assembly yield.

[0012] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a top view schematic diagram of a fingerprint recognition module according to an embodiment of this application;

[0015] Figure 2 This is a cross-sectional schematic diagram of a fingerprint recognition module according to an embodiment of this application along a first direction;

[0016] Figure 3 This is a cross-sectional schematic diagram of a fingerprint recognition module along the second direction according to an embodiment of this application;

[0017] Figure 4 This is a cross-sectional view of the fingerprint recognition module along the first direction according to another embodiment of this application;

[0018] Figure 5 This is a cross-sectional schematic diagram of the fingerprint recognition module along the second direction according to another embodiment of this application;

[0019] Figure 6 This is a side view of a fingerprint recognition module according to another embodiment of this application;

[0020] Figure 7 This is a side view of a fingerprint recognition module according to another embodiment of this application;

[0021] Figure 8 This is a side view of a fingerprint recognition module according to another embodiment of this application.

[0022] Symbol Explanation

[0023] 1: Fingerprint recognition module 10: First dielectric layer 10a: First side

[0024] 10b: Second side; 100a: First metal contact; 100b: Second metal contact

[0025] 12: Processing unit 120: Adapter substrate 14: First sensing serial line

[0026] 14a: Second conductive pad; 140: First conductor; 142: First conductive post

[0027] 16: Second sensing serial line; 160: Second wire; 162: Third wire

[0028] 18: Metal casing; 20: Second dielectric layer; 30: Third dielectric layer

[0029] 30a: First side; 30b: Second side; 300: Fingerprint recognition area

[0030] 4: Fingerprint recognition module 40: First dielectric layer 40a: Top surface

[0031] 400: First conductive post; 402: First sensing serial line; 404: First wire

[0032] 406: Third conductor; 42: Second dielectric layer; 420: Second sensing serial line.

[0033] 422: Second conductor; 424: Second conductive post; 44: Third dielectric layer

[0034] 44a: Lower surface; 46: Adhesive layer; 48: Metal casing

[0035] 480: Through hole; 5: Adapter substrate; 50: First adapter contact.

[0036] 52: Second transfer point 6: Processing unit D1, D2: Width Detailed Implementation

[0037] In the embodiments described below, the positional relationships include: up, down, left, and right. Unless otherwise specified, they are all based on the direction shown by the components in the diagram.

[0038] Please refer to the following: Figures 1 to 3 , Figure 1 This is a top view schematic diagram of a fingerprint recognition module according to an embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of a fingerprint recognition module according to an embodiment of this application along a first direction. Figure 3 This is a cross-sectional schematic diagram of a fingerprint recognition module according to an embodiment of this application along a second direction. As shown, the fingerprint recognition module 1 includes a first dielectric layer 10, a processing unit 12, a plurality of first sensing serial lines 14, and a plurality of second sensing serial lines 16. The plurality of first sensing serial lines 14 are disposed between the first dielectric layer 10 and the second dielectric layer 20, while the plurality of second sensing serial lines 16 are disposed between the second dielectric layer 20 and the third dielectric layer 30. Figure 2 and Figure 3As can be seen, the first dielectric layer 10, the second dielectric layer 20, and the third dielectric layer 30 form a stacked structure, and the dimensions of the first dielectric layer 10, the second dielectric layer 20, and the third dielectric layer 30 can be different. For example, the area of ​​the second dielectric layer 20 can be smaller, and it can be centrally covered by the first dielectric layer 10 and the third dielectric layer 30. In practice, the second dielectric layer 20 is generally parallel to the third dielectric layer 30, and the first dielectric layer 10 is a flexible material that covers the second dielectric layer 20, thereby forming a sandwich structure of the second dielectric layer 20 between the first dielectric layer 10 and the third dielectric layer 30. Since the second dielectric layer 20 has a certain thickness, the first dielectric layer 10 will bend down and its edges will adhere to the third dielectric layer 30. This embodiment does not limit whether there are gaps between the first dielectric layer 10, the second dielectric layer 20, and the third dielectric layer 30. For example, if there is a gap between the first dielectric layer 10 and the third dielectric layer 30 (e.g., around the second dielectric layer 20), the gap can be filled with an adhesive material. It is worth mentioning that... Figure 1 This is viewed from one side of the third dielectric layer 30, but it will be understood by those skilled in the art. Figure 1 This is not a depiction of the actual appearance of the fingerprint recognition module 1, but rather an indication of the relative positions of each component on the horizontal plane.

[0039] The first dielectric layer 10 defines a first side 10a and a second side 10b. The first side 10a of the first dielectric layer 10 may be provided with a transition substrate 120. Multiple first metal contacts 100a and multiple second metal contacts 100b may be located on opposite sides of the transition substrate 120, and the multiple first metal contacts 100a can be electrically connected to the multiple second metal contacts 100b in a one-to-one manner. Here, the inner layer of the transition substrate 120 may be provided with one-to-one metal traces, allowing the multiple first metal contacts 100a and multiple second metal contacts 100b to be electrically connected to each other. This embodiment does not impose any limitations. Generally, the processing unit 12 can be a commercially available microprocessor chip, such as a chip specifically designed for fingerprint recognition. Common microprocessor chips typically have the manufacturer and specifications marked on one surface, while multiple bumps are exposed on the opposite surface. Those skilled in the art will understand that the aforementioned bumps are located on the surface of the processing unit 12 near the first dielectric layer 10, and these bumps are the first conductive pads (not shown) of the processing unit 12. In one example, the first metal contact 100a is in direct contact with the first conductive pad of the processing unit 12, thus from the vertical ( Figure 2 From a top-down perspective, the area enclosed by the multiple first metal contacts 100a on the first side 10a can be roughly the area occupied by the processing unit 12 on the first side 10a.

[0040] In addition, due to Figure 2The fingerprint recognition module 1 is along the first direction ( Figure 1 A cross-sectional diagram of the AA line from top to bottom, therefore Figure 2 Although the diagram shows one second metal contact 100b on each side, in reality, multiple second metal contacts 100b should surround the periphery of the first dielectric layer 10, and the first dielectric layer 10 should not cover the second metal contacts 100b, so that the second metal contacts 100b can be directly connected to the adapter substrate 120. The periphery can be represented in, for example... Figure 1 As illustrated above, the plurality of first metal contacts 100a are located in the region near the center of the adapter substrate 120, while the plurality of second metal contacts 100b are located around the periphery of the first dielectric layer 10. When the areas of the first side 10a and the second side 10b of the first dielectric layer 10 are the same when projected perpendicularly, the area enclosed by the plurality of second metal contacts 100b (the second area) should be different from the area enclosed by the plurality of first metal contacts 100a (the first area); for example, the second area can be larger than the first area. In terms of width (the length of one side of the area), the plurality of first metal contacts 100a occupy width D1, and the plurality of second metal contacts 100b occupy width D2; width D1 is smaller than width D2. Furthermore, the adapter substrate 120 may also be provided with other metal contacts, which can be used, for example, to connect circuit boards with other functions to transmit signals emitted by the processing unit 12. Alternatively, the metal contacts can be connected to a power source to supply power to the fingerprint recognition module 1; this embodiment does not impose any limitations on this.

[0041] by Figure 2 For example, multiple first sensing serial lines 14 are disposed on the second dielectric layer 20 and covered by the first dielectric layer 10. These multiple first sensing serial lines 14 are electrically connected to the processing unit 12, but along... Figure 2 The cross-sectional direction of the AA line will not show the conductor used to transmit signals (first conductor). A plurality of second sensing serial lines 16, a plurality of second conductors 160, and a plurality of second conductive pads 14a may be disposed on the third dielectric layer 30. The second dielectric layer 20 is disposed on the third dielectric layer 30 and at least covers the plurality of second sensing serial lines 16. In practice, the third dielectric layer 30 may be defined with a first side 30a and a second side 30b, the second side 30b facing the first dielectric layer 10 and the second dielectric layer 20, and the first side 30a facing the opposite side. That is, the plurality of second sensing serial lines 16, the plurality of second conductors 160, and the plurality of second conductive pads 14a are disposed on the second side 30b of the third dielectric layer 30.

[0042] The second dielectric layer 20 covers multiple second sensing serial lines 16, preventing direct connection between the multiple first sensing serial lines 14 and the multiple second sensing serial lines 16, thus avoiding short circuits. Furthermore, the second dielectric layer 20 can cover a portion of a second conductor 160, while another portion of the second conductor 160 can be covered by the first dielectric layer 10 (e.g., ...). Figure 2 As shown, this embodiment does not limit the proportion of the second conductor 160 covered by the second dielectric layer 20. Furthermore, each second sensing serial line 16 can be electrically connected to at least one second conductive pad 14a via at least one second conductor 160. In one example, to improve sensing sensitivity, a second sensing serial line 16 can be connected to a second conductor 160 at both ends, and each of the two second conductors 160 can be connected to a second conductive pad 14a. When the first dielectric layer 10 is bent and its edges are attached to the second side 30b of the third dielectric layer 30, multiple second metal contacts 100b are electrically connected to multiple second conductive pads 14a. That is, the multiple second conductive pads 14a should not be covered by the second dielectric layer 20, and signals on the multiple second conductive pads 14a can be transmitted to the processing unit 12 via the multiple second metal contacts 100b. Additionally, the number of second conductive pads 14a can be the same as the number of second metal contacts 100b, and the second conductive pads 14a and second metal contacts 100b can be connected one-to-one.

[0043] This embodiment assumes Figure 2 It is along Figure 1 Fingerprint recognition module 1, with cross-sectional view of the AA line extension direction (first direction). Figure 3 It is along Figure 1 The fingerprint recognition module 1, viewed in cross-section along the BB line extension direction (second direction), indicates that the fingerprint recognition module 1 should have different internal structures depending on the direction of the cross-section. Figure 3 As illustrated in the example, the fingerprint recognition module 1 can also contain multiple first conductive posts 142. These first conductive posts 142 can be conductive vias disposed within the second dielectric layer 20, or they can be disposed around the periphery of the second dielectric layer 20. This embodiment does not impose any limitations on this. In practice, any conductive material whose function is to electrically connect the traces on both sides of the second dielectric layer 20 should fall within the scope of the first conductive posts 142 demonstrated in this embodiment.

[0044] As previously described, each first sensing serial line 14 is electrically connected to a first conductive line 140. Since the first conductive line 140 and the first sensing serial line 14 are both on the second dielectric layer 20, between the second dielectric layer 20 and the first dielectric layer 10, the first conductive line 140 needs to be electrically connected to the second conductive pad 14a to transmit the signal from the first sensing serial line 14 to the processing unit 12. However, since the second conductive pad 14a is located on the second side 30b of the third dielectric layer 30, there is a height difference (e.g., the thickness of the second dielectric layer 20) between the first conductive line 140 and the second conductive pad 14a. To ensure a stable electrical connection between the first conductive line 140 and the second conductive pad 14a, the first conductive line 140 is first connected to a first conductive post 142, which then connects to a third conductive line 162, and finally the third conductive line 162 connects to the second conductive pad 14a. In other words, the second conductor 160 can extend directly to the second conductive pad 14a, but the first conductor 140 needs to be connected to the second conductive pad 14a via the first conductive post 142 and the third conductor 162. Therefore, the length of the first conductor 140 is shorter than that of the second conductor 160. In one example, to make the sensing more sensitive, a first sensing serial line 14 can also be connected to a first conductor 140 at both ends, and each of the two first conductors 140 will be connected to a first conductive post 142, which will then connect to the third conductor 162, and finally the third conductor 162 will connect to the second conductive pad 14a.

[0045] Viewed from the third dielectric layer 30, the plurality of first sensing serial lines 14 and the plurality of second sensing serial lines 16 are approximately perpendicular to each other. In practice, each first sensing serial line 14 can be formed by connecting multiple diamond-shaped conductive sheets together, and each second sensing serial line 16 can also be formed by connecting diamond-shaped conductive sheets of a similar shape. This embodiment does not limit the shape of the first sensing serial lines 14 and the second sensing serial lines 16. Furthermore, the plurality of first sensing serial lines 14 and the plurality of second sensing serial lines 16 demonstrated in this embodiment can each be a capacitive sensing serial line. For example, the plurality of first sensing serial lines 14 and the plurality of second sensing serial lines 16 can be pre-charged to a specific voltage. When the fingerprint protrusion contacts a specific position, the fingerprint protrusion will absorb the charge, thereby allowing the voltage drop to be measured in the corresponding first sensing serial line 14 and second sensing serial line 16. Generally, the intersection point of the first sensing serial line 14 and the second sensing serial line 16 can be regarded as a fingerprint detection point, and the fingerprint detection point density of the fingerprint recognition module 1 will be above 500 dpi. Since this embodiment does not focus on the principle of fingerprint recognition, the method by which the fingerprint recognition module 1 measures fingerprints will not be described in detail here. It is worth mentioning that the fingerprint recognition module 1 may define a fingerprint recognition region 300 on the first side 30a of the third dielectric layer 30. The fingerprint recognition region 300 is approximately located in the center of the third dielectric layer 30, and the fingerprint recognition region 300 may be the area where the first sensing serial line 14 and the second sensing serial line 16 intersect and overlap, that is, the area with fingerprint detection points.

[0046] To structurally protect the fingerprint recognition module 1 and avoid electrostatic interference, a metal shell (or a conductive metal film layer) 18 may be provided on the first side 30a of the third dielectric layer 30. In one example, the metal shell 18 may be a hollow frame, and the hollow metal shell 18 may surround the fingerprint recognition area 300. In practice, the metal shell 18 may be electrically connected to the system ground terminal. This embodiment does not limit the location of the system ground terminal, and those skilled in the art can choose their own location. Although the figure shows the metal shell 18 disposed on the third dielectric layer 30, in practice, the metal shell 18 may also cover part of the fingerprint recognition module 1 (e.g., cover the first dielectric layer 10).

[0047] Structurally, the second conductor 160 and the third conductor 162 do not overlap or connect together. Specifically, although both the second conductor 160 and the third conductor 162 are disposed on the second side 30b of the third dielectric layer 30, their orientations are different. For example, the second conductor 160 generally faces... Figure 1 The upper and lower sides (first direction), while the third conductor 162 is roughly oriented towards. Figure 1 The left and right sides (second direction). Furthermore, with Figure 1For example, since the extension direction of the first sensing serial 14 is Figure 1 The left and right sides, therefore in Figure 1 Cross-sections in the left and right directions ( Figure 3 What you will see is the transition structure between the first conductor 140 and the third conductor 162, as well as the first conductive post 142. Conversely, in Figure 1 Cross-section in the upper and lower directions ( Figure 2 Therefore, the first conductive post 142 is not required; instead, the second conductive wire 160 will be visible. Of course, the second conductive pads 14a corresponding to the first sensing serial line 14 and the second sensing serial line 16 can be located on different sides of the fingerprint recognition module 1. For example, the second conductive pads 14a corresponding to the first sensing serial line 14 (first conductive wire 140 and third conductive wire 162) are located on... Figure 1 On the left and right sides of the third dielectric layer 30, the second conductive pad 14a corresponding to the second sensing serial line 16 (second wire 160) is... Figure 1 The top and bottom sides of the third dielectric layer 30 are shown.

[0048] In one example, each first conductor 140 and its corresponding third conductor 162 extend in the same direction, the only difference being that the third conductor 162 is on the third dielectric layer 30, while the first conductor 140 is on the second dielectric layer 20. Furthermore, Figure 1 This demonstrates that adjacent first sensing serial lines 14 may correspond to first wires 140 of unequal length, third wires 162 may also be of unequal length, and adjacent first conductive posts 142 may not be on the same vertical and horizontal axis. One reason for this is that, unlike... Figure 1 The diagram shows a small number of second conductive pads 14a, but in reality, there are many first sensing serial lines 14 and second sensing serial lines 16, and the number of second conductive pads 14a is also quite large. To maintain structural strength, avoid interference between signals, or ensure that each sensing serial line has the same signal transmission speed, it can be seen that the first conductive post 142 closer to the corner is closer to the second conductive pad 14a, while the first conductive post 142 closer to the center is farther away from the second conductive pad 14a.

[0049] This application also provides another fingerprint recognition module, please refer to it as well. Figures 4 to 5 , Figure 4 This is a cross-sectional view of the fingerprint recognition module along the first direction according to another embodiment of this application. Figure 5This is a cross-sectional schematic diagram of a fingerprint recognition module along a second direction according to another embodiment of this application. As shown in the figure, the fingerprint recognition module 4 includes a first dielectric layer 40, a second dielectric layer 42, and a third dielectric layer 44. Multiple first conductive posts 400 and multiple first sensing serial lines 402 are located between the first dielectric layer 40 and the second dielectric layer 42, and multiple second sensing serial lines 420 are located between the second dielectric layer 42 and the third dielectric layer 44. Similar to the previous embodiment, the first dielectric layer 40 may also include multiple first wires 404 and multiple third wires 406, and each first wire 404 can be connected to a first conductive post 400 and a first sensing serial line 402 at both ends. Furthermore, the second dielectric layer 42 may also include multiple second wires 422 and multiple second conductive posts 424, and the second wires 422 can be electrically connected to corresponding third wires 406 via corresponding second conductive posts 424. In this case, each end of the third wire 406 can be connected to a first conductive post 400 and a second conductive post 424. In other words, the signals from the first sensing serial 402 and the second sensing serial 420 can both be directed to a first conductive post 400.

[0050] Multiple first sensing serial lines 402 are disposed on the second dielectric layer 42 and covered by the first dielectric layer 40. The multiple first sensing serial lines 402 are electrically connected to their respective first conductive posts 400. Multiple second sensing serial lines 420, multiple second wires 422, and multiple second conductive posts 424 may be disposed on the third dielectric layer 44. The second dielectric layer 42 is disposed on the third dielectric layer 44. In one example, these first conductive posts 400 are exposed on the upper surface 40a of the first dielectric layer 40, thereby forming multiple first metal contacts on the upper surface 40a of the first dielectric layer 40. This embodiment does not limit whether the first conductive posts 400 protrude from the upper surface 40a, nor does it limit whether the first conductive posts 400 penetrate the first dielectric layer 40; those skilled in the art can design them freely as needed. Furthermore, an adhesive layer 46 may be disposed between the third dielectric layer 44 and the second dielectric layer 42. The adhesive layer 46 may come into contact with multiple second sensing serial lines 420, multiple second wires 422, and multiple second conductive posts 424 in the second dielectric layer 42. This embodiment does not impose any limitations on this. In practice, the adhesive layer 46 can be an adhesive between dissimilar materials, thereby protecting the circuitry within the first dielectric layer 40 and the second dielectric layer 42.

[0051] Regarding signal transmission, each first sensing serial line 402 is electrically connected to a first wire 404, which transmits the signal from the first sensing serial line 402 to the first conductive post 400. Conversely, a second sensing serial line 420 in the opposite direction is electrically connected to a second wire 422, which is shorter than the first wire 404. It first connects to the second conductive post 424, and then connects to the upper layers from the second conductive post 424. For example, the second conductive post 424 connects to a third wire 406 in the first dielectric layer 40, and then the third wire 406 connects to the first conductive post 400, allowing the signal from the second sensing serial line 420 to also be transmitted to the first conductive post 400. As shown in the figure, the length of the third wire 406 is also shorter than the first wire 404, and the combined length of the second wire 422 and the third wire 406 is approximately equal to the length of the first wire 404.

[0052] Similar to the previous embodiment, when viewed from the third dielectric layer 44, the plurality of first sensing serial lines 402 and the plurality of second sensing serial lines 420 are substantially perpendicular to each other. In practice, each first sensing serial line 402 can be formed by connecting multiple diamond-shaped conductive sheets, and each second sensing serial line 420 can also be formed by connecting diamond-shaped conductive sheets of a similar shape. This embodiment does not limit the shape of the first sensing serial lines 402 and second sensing serial lines 420. Furthermore, the fingerprint recognition module 4 may also have a touchable area (e.g., a fingerprint recognition area) on the lower surface 44a of the third dielectric layer 44, substantially located in the center of the third dielectric layer 44. In practice, the area where the first sensing serial lines 402 and second sensing serial lines 420 intersect and overlap, containing fingerprint detection points, can be the fingerprint recognition area.

[0053] To structurally protect the fingerprint recognition module 4 and avoid electrostatic interference, a metal shell or a metal conductive film layer 48 can be provided at the edge of the lower surface 44a of the third dielectric layer 44. In one example, the metal shell or metal conductive film layer 48 can be a hollow frame, and the hollow metal shell or metal conductive film layer 48 can surround the fingerprint recognition area. In practice, the metal shell or metal conductive film layer 48 can have through holes 480, which can penetrate the entire fingerprint recognition module 4 and be exposed on the upper surface 40a of the first dielectric layer 40, so that the through holes 480 can form multiple second metal contacts on the upper surface 40a. Of course, this embodiment does not limit whether the through holes 480 protrude from the upper surface 40a. Unlike the previous embodiment, the first dielectric layer 40, the second dielectric layer 42, and the third dielectric layer 44 in this embodiment can have approximately the same size, which is beneficial for the packaging operation. Although the illustration shows a metal casing or metal conductive film layer 48 disposed on the third dielectric layer 44, in practice, the metal casing or metal conductive film layer 48 may also cover part of the fingerprint recognition module 4 (e.g., cover the first dielectric layer 40), and this embodiment does not impose any limitations.

[0054] As described above, the upper surface 40a of the first dielectric layer 40 can expose numerous metal contacts, which can be used not only to transmit signals of the first sensing serial number 402 and the second sensing serial number 420, but also for grounding. In this embodiment, the fingerprint recognition module 4 may also include an adapter substrate to connect the contacts exposed on the upper surface 40a, and the adapter substrate is connected to the processing unit. Please refer to [further details omitted]. Figure 6 , Figure 7 and Figure 8 , Figure 6 This is a side view of a fingerprint recognition module according to another embodiment of this application. Figure 7 This is a side view of a fingerprint recognition module according to another embodiment of this application. Figure 8 This is a side view of a fingerprint recognition module according to another embodiment of this application. As shown, the fingerprint recognition module 4 can be connected to the processing unit 6 via a connector substrate 5. The connector substrate 5 is provided with a plurality of first connector contacts 50 and a plurality of second connector contacts 52. The plurality of first connector contacts 50 and the plurality of second connector contacts 52 are mutually connected and can be arranged in arrays. For example, one first connector contact 50 corresponds to one second connector contact 52. Through the transmission of the internal wiring of the connector substrate 5, the signal received by the first connector contact 50 can be transmitted to the second connector contact 52. In practice, the plurality of first connector contacts 50 are connected one-to-one to the metal contacts exposed on the upper surface 40a of the first dielectric layer 40, for example, connecting a plurality of first conductive pillars 400 and a plurality of through holes 480.

[0055] The adapter substrate 5 can have a large area of ​​metal, thus serving as a system ground, allowing static electricity from the fingerprint recognition module 4 to be conducted to the adapter substrate 5 through the through-hole 480. Furthermore, the second adapter contact 52 can correspond to the conductive pad of the processing unit 6, allowing the processing unit 6 to process the signals of the first sensing serial line 402 and the second sensing serial line 420. This embodiment demonstrates that the processing unit 6 can be connected in various locations. For example, Figure 6 and Figure 7 The demonstration shows that the first adapter contact 50 and the second adapter contact 52 can be located on opposite sides of the adapter substrate 5, the difference being... Figure 7 The adapter substrate 5 is relatively large, allowing the processing unit 6 to be located further away from the fingerprint recognition module 4. In practice, the fingerprint recognition module 4, the adapter substrate 5, and the processing unit 6 may be packaged in the same housing, and because... Figure 6 The processing unit 6 and the fingerprint recognition module 4 are located on the back of the adapter substrate 5, therefore Figure 6 It can be adapted to a smaller volume casing. Figure 6 In the example, the projected area surrounded by the first transition point 50 will overlap at least a portion of the projected area surrounded by the second transition point 52. Since the projected area surrounded by the second transition point 52 is roughly positively correlated with the size of the processing unit 6, and since the size of the processing unit 6 may be smaller than the size of the fingerprint recognition module 4, the projected area surrounded by the second transition point 52 will be smaller than the projected area surrounded by the first transition point 50.

[0056] On the other hand, the adapter substrate 5 may be a flexible substrate, thereby Figure 7 and Figure 8 The processing unit 6 can also be redirected to other locations, away from the fingerprint recognition module 4, via the adapter substrate 5. As shown in the figure, Figure 7 and Figure 8 The difference may simply be that the first adapter contact 50 and the second adapter contact 52 are on the same side or opposite sides of the adapter substrate 5, but Figure 7 and Figure 8 They can all be adapted to shells of different shapes.

[0057] In summary, the fingerprint recognition module provided in this application allows for direct assembly of the sensing film and processing unit, enabling the processing unit and fingerprint recognition area to be located on opposite sides of the fingerprint recognition module. This allows for a smaller overall size and higher assembly yield. Furthermore, another fingerprint recognition module provided in this application can have an extended adapter substrate, on which processing units can be assembled, similarly reducing the size of the fingerprint recognition module and achieving even higher assembly yield.

[0058] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A fingerprint recognition module, characterized in that, Include: A first dielectric layer is defined with a first side and a second side. A transition substrate is disposed on the first side. Multiple first metal contacts and multiple second metal contacts are disposed on both sides of the transition substrate. The first metal contacts are electrically connected to the second metal contacts. A processing unit is disposed on the first side and has a plurality of first conductive pads, each of which is used to electrically connect to one of the first metal contacts; Multiple first sensors are serially disposed between the first dielectric layer and a second dielectric layer, and electrically connected to multiple first wires; as well as Multiple second sensing series are disposed between the second dielectric layer and a third dielectric layer, and are electrically connected to multiple second wires; Each of the first conductors is electrically connected to one of a plurality of third conductors via a first conductive post, and the second conductors are electrically connected to the third conductors via the second metal contacts. The first metal contacts surround a first area, the second metal contacts surround a second area, and the first area is smaller than the second area. The third dielectric layer has a first side and a second side. The second conductors and the third conductors are disposed on the second side of the third dielectric layer. The second side of the third dielectric layer is provided with a plurality of second conductive pads. Each second conductor is electrically connected to one of the second conductive pads, and each third conductor is electrically connected to one of the second conductive pads. In the third dielectric layer, the first conductive post located at the corner is closer to the electrically connected second conductive pad, while the first conductive post located in the center is further away from the electrically connected second conductive pad.

2. The fingerprint recognition module according to claim 1, characterized in that, The first sensing serial lines are arranged along a first direction, and the second sensing serial lines are arranged along a second direction, the first direction being perpendicular to the second direction.

3. The fingerprint recognition module according to claim 1, characterized in that, Each of the second metal contacts contacts one of the second conductive pads.

4. The fingerprint recognition module according to claim 3, characterized in that, These second metal contacts are located on the edge of the second side.

5. The fingerprint recognition module according to claim 1, characterized in that, The first side of the third dielectric layer defines a fingerprint recognition region that overlaps with the area surrounded by the first sensing serial lines and the second sensing serial lines, and the area of ​​the fingerprint recognition region is smaller than the second area.

6. The fingerprint recognition module according to claim 5, characterized in that, It further includes a metal casing or a metal conductive film layer, the metal casing or the metal conductive film layer being disposed on the first side of the third dielectric layer, and the metal casing or the metal conductive film layer surrounding the fingerprint recognition area.

7. The fingerprint recognition module according to claim 6, characterized in that, It further includes an antistatic through-hole that connects the metal casing or the metal conductive film layer, the first dielectric layer, the second dielectric layer and the third dielectric layer. One end of the antistatic through-hole is exposed in the metal casing or the metal conductive film layer, and the other end of the antistatic through-hole is exposed in the third dielectric layer.

8. The fingerprint recognition module according to claim 7, characterized in that, It also includes a through-hole protection element that covers the antistatic through-hole exposed on the metal casing or the metal conductive film layer.

9. The fingerprint recognition module according to claim 1, characterized in that, The second conductors and the third conductors are coplanar.

10. The fingerprint recognition module according to claim 1, characterized in that, It further includes a first adhesive layer disposed between the first dielectric layer and the second dielectric layer, and covering the first sensing serial lines.

11. A fingerprint recognition module, characterized in that, Include: A first dielectric layer is provided with multiple first conductive pillars; Multiple first sensing sequences are disposed between the first dielectric layer and a second dielectric layer, and electrically connected to multiple first wires, each of which is electrically connected to one of the first conductive pillars; Multiple second sensing series are disposed between the second dielectric layer and a third dielectric layer, and are electrically connected to multiple second wires; as well as A transition substrate is connected to the first dielectric layer and is provided with a plurality of first transition contacts and a plurality of second transition contacts. The first transition contacts are electrically connected to the second transition contacts, and each of the first transition contacts is used to electrically connect to one of the first conductive pillars. Each of the second conductors is electrically connected to one of a plurality of third conductors via a second conductive post, and each of the third conductors is electrically connected to one of the first conductive posts; The third dielectric layer is provided with a plurality of second conductive pads, each of the second conductors is electrically connected to one of the second conductive pads, and each of the third conductors is electrically connected to one of the second conductive pads; In the third dielectric layer, the first conductive post located at the corner is closer to the electrically connected second conductive pad, while the first conductive post located in the center is further away from the electrically connected second conductive pad.

12. The fingerprint recognition module according to claim 11, characterized in that, The projected area enclosed by these first transition points overlaps with the projected area enclosed by these second transition points.

13. The fingerprint recognition module according to claim 11, characterized in that, It further includes a processing unit having a plurality of first conductive pads, each of which is used to electrically connect to one of the first transition contacts.

14. The fingerprint recognition module according to claim 11, characterized in that, The first conductive pillars are exposed on the first dielectric layer adjacent to the adapter substrate to form a plurality of first metal contacts on the surface of the first dielectric layer.

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