Semiconductor device and method of manufacturing the same

Abstract

A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a resin layer, an ink, and a film. The ink is provided on an upper surface of the resin layer. The film covers the resin layer and the ink. A surface roughness of the film is different between a first region where the ink is provided and a second region where the ink is not provided.

Description

[0001] [Citation of relevant applications]

[0002] This application is based on and claims the priority of Japanese Patent Application No. 2022-090983, filed on June 3, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This embodiment relates to a semiconductor device and a method for manufacturing the same. Background Technology

[0004] Sometimes, markings, product names, country of origin, and information codes are displayed on the outside of semiconductor devices. Information codes may include barcodes, for example. Display methods include laser marking and ink marking.

[0005] Ink markings are printed onto the shielding film of semiconductor packages, for example, using an inkjet printer. However, the ink may disappear or the printed content may become thinner due to organic solvents or physical friction. Summary of the Invention

[0006] One embodiment provides a semiconductor device that can protect ink and a method for manufacturing the same.

[0007] The semiconductor device of this embodiment includes a resin layer, an ink, and a film. The ink is disposed on the upper surface of the resin layer. The film covers the resin layer and the ink. The surface roughness of the film differs between a first region where ink is disposed and a second region where ink is not disposed.

[0008] Based on the above configuration, a semiconductor device capable of protecting ink and a method for manufacturing the same can be provided. Attached Figure Description

[0009] Figure 1 This is a cross-sectional view showing an example of the configuration of the semiconductor device according to the first embodiment.

[0010] Figure 2 This is a cross-sectional view showing an example of the composition of the ink and its surroundings in the first embodiment.

[0011] Figure 3A This is an example of the appearance of the surface of the membrane according to the first embodiment.

[0012] Figure 3B This is an example of the appearance of the surface of the membrane according to the first embodiment.

[0013] Figure 3C This is an example of the appearance of the surface of the membrane according to the first embodiment.

[0014] Figure 4AThis is a graph representing an example of the success rate of reading the barcode in the first embodiment.

[0015] Figure 4B This is a graph representing an example of the success rate of reading the barcode in the first embodiment.

[0016] Figure 4C This is a graph representing an example of the success rate of reading the barcode in the first embodiment.

[0017] Figure 5A This is an enlarged photograph showing an example of a surface in the first embodiment where an area containing ink is provided.

[0018] Figure 5B This is an enlarged photograph showing an example of a surface in the first embodiment where an area containing ink is provided.

[0019] Figure 5C This is an enlarged photograph showing an example of a surface in the first embodiment where an area containing ink is provided.

[0020] Figure 6 This is an enlarged photograph showing an example of a surface in the first embodiment where no ink has been applied.

[0021] Figure 7 This is a graph showing an example of the measurement results of the surface distortion of the membrane in the first embodiment.

[0022] Figure 8A This is a cross-sectional view illustrating an example of a method for manufacturing a semiconductor device according to the first embodiment.

[0023] Figure 8B It means succession Figure 8A A cross-sectional view of an example of a method for manufacturing a semiconductor device.

[0024] Figure 9 This is a cross-sectional view showing an example of the configuration of the semiconductor device in the first comparative example.

[0025] Figure 10 This is a cross-sectional view showing an example of the composition of the ink and its surroundings in the second comparative example.

[0026] Figure 11 This is a cross-sectional view showing an example of the composition of the ink and its surroundings in the second embodiment. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described with reference to the drawings. These embodiments do not limit the present invention. In the following embodiments, the vertical direction of the semiconductor substrate refers to the relative direction with the surface on which the semiconductor element is disposed facing upwards, and may sometimes differ from the vertical direction along the acceleration due to gravity. The drawings are schematic or conceptual, and the proportions of the parts may not be the same as in reality. In the specification and drawings, elements identical to those described in previously presented drawings are given the same reference numerals, and detailed descriptions are appropriately omitted.

[0028] (First Embodiment) Figure 1 This is a cross-sectional view showing an example of the configuration of the semiconductor device 1 according to the first embodiment. The semiconductor device 1 includes a wiring substrate 10, semiconductor chips 30-33, bonding wires 90, sealing resin 91, ink 100, and a film 110. The semiconductor device 1 is, for example, a package of NAND flash memory.

[0029] The wiring substrate 10 may be a printed substrate or an interlayer comprising a wiring layer (not shown) and an insulating layer (not shown). The wiring layer may be, for example, a low-resistance metal such as copper (Cu), nickel (Ni), or an alloy thereof. The insulating layer may be, for example, an insulating material such as glass epoxy resin. The wiring substrate 10 may also have a multilayer wiring structure formed by stacking multiple wiring layers and multiple insulating layers. The wiring substrate 10 may also have, for example, a through electrode penetrating its front and back sides, similar to an interlayer.

[0030] The wiring substrate 10 has a ground wire 11. The ground wire 11 electrically connects a metal bump 13 disposed on the lower surface of the wiring substrate 10 to the film 110. The metal bump 13 is provided for electrically connecting other components (not shown) to the wiring substrate 10.

[0031] Semiconductor chip 30 is, for example, a memory chip containing NAND flash memory. Semiconductor chip 30 has semiconductor elements (not shown) on its surface (upper surface). These semiconductor elements may be, for example, a memory cell array and its peripheral circuitry (CMOS (complementary metal oxide semiconductor) circuitry). The memory cell array may also be a three-dimensional memory cell array composed of multiple memory cells arranged in three dimensions. Furthermore, semiconductor chip 31 is attached to semiconductor chip 30 via an adhesive layer (not shown). Semiconductor chip 32 is attached to semiconductor chip 31 via an adhesive layer. Semiconductor chip 33 is attached to semiconductor chip 32 via an adhesive layer. Semiconductor chips 31-33 are, for example, memory chips containing NAND flash memory, similar to semiconductor chip 30. Semiconductor chips 30-33 may also be the same type of memory chip. In the figure, there are four semiconductor chips 30-33 stacked as memory chips. However, the number of semiconductor chip stacks may be three or fewer, or five or more.

[0032] Bonding lines 90 connect to the wiring substrate 10 and any pads of the semiconductor chips 30-33. Because bonding lines 90 are used for connection, the semiconductor chips 30-33 are offset from the pads to perform layering.

[0033] Furthermore, the sealing resin 91 seals the semiconductor chips 30-33 and the bonding wires 90. Thus, the semiconductor device 1 is a semiconductor package consisting of multiple semiconductor chips 30-33 on the wiring substrate 10.

[0034] Ink 100 is applied to the surface F91 (upper surface) of the sealing resin 91. From Figure 1 When viewed from the paper surface, ink 100 displays, for example, markings, product names, country of origin, and information codes (see reference). Figures 3A-3C The information code may include, for example, a barcode. The ink 100 may be printed using, for example, an inkjet printer. The ink 100 may be any ink that can change from a liquid or semi-solid state to a solid state.

[0035] The membrane 110 is coated with sealing resin 91 and ink 100. The membrane 110 is disposed on the ink 100 and on the sealing resin 91 in areas where the ink 100 is not disposed. Figure 1 As shown, ink 100 is not exposed but covered by film 110. This protects ink 100. Film 110 is made of a material that has higher hardness, abrasion resistance, chemical resistance, oil resistance, heat resistance, and flame retardancy than ink 100.

[0036] Furthermore, the membrane 110 is preferably made of a conductive material such as metal. The membrane 110 is electrically connected to the grounding wire of the mounting substrate via the grounding wire 11 and the metal bump 13, and the membrane 110 functions as a shielding membrane for electromagnetic waves.

[0037] Figure 2 This is a cross-sectional view showing an example of the configuration of the ink 100 and its surroundings in the first embodiment. Figure 2 yes Figure 1 An enlarged view of the dashed box D shown.

[0038] Ink 100 is set in area R1. Ink 100 is not set in area R2.

[0039] Ink 100 comprises resin and pigment 101. The resin is, for example, a UV (Ultraviolet) curing resin. The color of ink 100 varies depending on the type of pigment 101 used for coloring. See also the following: Figures 3A-3C The differences caused by the type of ink 100 will be explained.

[0040] Membrane 110 has membrane 111, membrane 112 and membrane 113.

[0041] Membrane 111 has a higher adhesion to the sealing resin 91 than membrane 112. Membrane 111 is made of stainless steel such as SUS304.

[0042] The film 112 has high electrical conductivity. The film 112 is made of, for example, copper (Cu).

[0043] Membrane 113 protects membrane 112 from oxidation and other effects. Membrane 113 is made of stainless steel such as SUS304.

[0044] Next, the different types of ink 100 will be explained.

[0045] Figures 3A-3C This is an external photograph showing an example of the surface F110 of the membrane 110 according to the first embodiment. For example... Figures 3A-3C As shown, text and a barcode are displayed on surface F110 using ink 100. The barcode is, for example, a two-dimensional barcode.

[0046] Figures 3A-3C The photographs show examples of text and barcodes printed using black, green, and white inks, respectively. The pigment 101 for the black ink is, for example, carbon black. The pigment 101 for the white ink is, for example, titanium dioxide (IV).

[0047] Furthermore, since ink 100 is covered by film 110, the differences in the color of ink 100 are not visible on surface F110. The difference in how the printed content is viewed is revealed by the reflection of light on surface F110.

[0048] Figures 3A-3C In the examples shown, the printed content with black ink has the highest visibility. Furthermore, the visibility of the printed content decreases in the order of black ink, green ink, and white ink.

[0049] Figures 3A-3C In the example shown, the surface F110 of the area R2 where ink 100 (text and barcode) is not set is a rough surface and is in a matte state.

[0050] Figure 3C In the example shown, the surface F110 of area R1, where ink 100 (text and barcode) is located, is also in a matte state. Since both areas R1 and R2 are in a matte state, the visibility of the printed content is low.

[0051] Figure 3A and Figure 3B In the example shown, the surface of face F110 of area R1, where ink 100 (text and barcode) is located, is relatively smooth. Light is reflected unidirectionally to some extent in area R1, making it appear bright. The surface of face F110 of area R2, outside of area R1, is rough, resulting in diffuse reflection of light in area R2. Area R2, serving as the background, appears darker, while area R1, representing the printed content, appears brighter, increasing the difference in brightness (gloss) between areas R1 and R2. Consequently, the printed content is more clearly visible.

[0052] Additionally, see the following text. Figures 5A-5C and Figure 6 Provide details about the surface condition.

[0053] Figures 4A to 4C This is a graph illustrating an example of the barcode reading success rate according to the first embodiment. The vertical axis of the graph represents the barcode reading success rate. The horizontal axis of the graph represents the barcode size. To evaluate the readability of the barcode, the reading success rate was measured using multiple barcode sizes of 2.0 mm, 2.5 mm, 3.0 mm, and 4.0 mm. Furthermore, the barcode reading success rate is the measurement result after the film 110 is formed.

[0054] Figures 4A to 4C The graphs represent the printing of text and barcodes using black ink, green ink, and white ink, respectively.

[0055] The success rate of barcode reading is determined using a barcode reader. A barcode reader, for example, converts an image captured by a built-in camera into a black-and-white binary image using internal processing, and reads the barcode from this binary image.

[0056] like Figure 4AAs shown, when using black ink as ink 100, the barcode size with a reading success rate of 2.5mm or larger is 100%.

[0057] like Figure 4B As shown, when using green ink as ink 100, the reading success rate is 100% for a barcode size of 4.0 mm.

[0058] like Figure 4C As shown, when using white ink as ink 100, the reading success rate is 0% for all barcode sizes between 2.0mm and 4.0mm.

[0059] For any color of ink 100, the larger the barcode size, the higher the read success rate. When comparing barcodes of the same size, black ink has the highest read success rate. Furthermore, the read success rate decreases in the order of black ink, green ink, and white ink. This trend in read success rate aligns with the tendency of the printed content to be easily identifiable.

[0060] Next, the differences in the surface condition of surface F110 caused by the type of ink 100 will be explained.

[0061] Figures 5A to 5C This is an enlarged photograph showing an example of the surface F110 of the region R1 where ink 100 is provided in the first embodiment.

[0062] Figures 5A to 5C The photos show examples of text and barcodes printed using black, green, and white ink, respectively.

[0063] The reflective properties of surface F110 are affected by the surface condition of surface F110. More specifically, the reflective properties of surface F110 are affected by the surface roughness of surface F110. The surface roughness of surface F110 may be affected, for example, by the particle size and density (concentration) of pigment 101.

[0064] The pigment 101 in black ink has a relatively small particle size. For example... Figure 5A As shown, the unevenness caused by pigment 101 is not clearly visible, and the surface F110 of region R1 is relatively smooth.

[0065] The particle size of pigment 101 in the green ink is approximately the same as that of pigment 101 in the white ink described below. However, the concentration of pigment 101 in the green ink is lower than that in the white ink. Figure 5B As shown, the surface F110 of region R1 contains both a relatively smooth part and a rough part (bumps).

[0066] The pigment 101 in white ink has a relatively large particle size. The concentration of pigment 101 in white ink is relatively high. Therefore, as... Figure 5CAs shown, there are uneven surfaces in the surface F110 of region R1 caused by pigment 101, and the surface F110 of region R1 is in an matte state.

[0067] Figure 6 This is an enlarged photograph of an example of the surface F110 of the region R2 where no ink 100 is provided in the first embodiment.

[0068] like Figure 6 As shown, surface F110 in region R2 is a rough surface, in a matte state. The reason for this is as follows (see below). Figure 8A As explained, the outer surface of the sealing resin 91 is a rough surface. In addition, the outer surface includes the upper surface (surface F91) and the side surface.

[0069] Figure 7 This is a graph showing an example of the measurement results of the skewness in the surface F110 of the film 110 of the first embodiment. The horizontal axis of the graph represents the type of ink. The vertical axis of the graph represents the skewness (Rsk). Skewness is one of the roughness parameters.

[0070] The method for measuring the skewness is laser-based (non-contact). Figure 7 The distortion shown was measured according to the standards described in JIS (Japanese Industrial Standards) B0601:2001 (ISO (International Organization for Standardization) 4287:1997). The distortion was measured on the ink portion and the molding roughening portion of surface F110. That is, the distortion was measured after film 110 was formed. The ink portion corresponds to region R1 where ink 100 is provided. The molding roughening portion corresponds to region R2 where ink 100 is not provided.

[0071] Furthermore, surface roughness can sometimes vary depending on the measurement location. Therefore, Figure 7 The skewness shown is, for example, the average value of multiple measurement locations. Figure 7 The skewness shown is the average value at any 10 points.

[0072] The skewness of the surface F110 of the molded rough surface is in the range of about 0.3 to about 0.4, and remains roughly constant regardless of the type of ink 100. On the other hand, the skewness of the surface F110 of the ink part varies in the range of about -0.3 to about 0.4 depending on the type of ink 100.

[0073] When black ink is used as ink 100, the difference in skewness of surface F110 between the roughened molded surface and the inkd surface is approximately 0.6. When green ink is used as ink 100, the difference in skewness of surface F110 between the roughened molded surface and the inkd surface is approximately 0.2. When white ink is used as ink 100, the difference in skewness of surface F110 between the roughened molded surface and the inkd surface is approximately 0.05 or less.

[0074] like Figures 3A-3C , Figures 4A to 4C ,and Figure 7 As shown, the higher the difference in the skewness of surface F110, the higher the visibility or reading success rate. That is, a strong correlation has been found between the difference in skewness and the visibility or reading success rate. The difference in skewness of the film 110 between the region R1 where ink 100 is provided and the region R2 where ink 100 is not provided is preferably 0.2 or more. The larger the difference, the better; more preferably, it is a difference of 0.3 to 0.6, and even more preferably, it is a difference of 0.6 or more. In the first embodiment, the skewness of the film 110 in region R1 is preferably 0.2 or more lower than the skewness of the film 110 in region R2. More preferably, it is 0.3 to 0.6 lower, and even more preferably, it is 0.6 or more lower. This improves the visibility of the printed content or the readability of the barcode.

[0075] Next, the method for forming ink 100 and film 110 will be explained.

[0076] Figure 8A and Figure 8B This is a cross-sectional view showing an example of a manufacturing method of the semiconductor device 1 according to the first embodiment.

[0077] First, semiconductor chips 30-33 are deposited on the wiring substrate 10, and bonding lines 90 are formed to electrically connect the wiring substrate 10 to the semiconductor chips 30-33. Then, as... Figure 8A As shown, semiconductor chips 30-33 and bonding lines 90 are formed (refer to...) Figure 1 ) sealing resin 91.

[0078] The surface F91 of the sealing resin 91 is formed to have a rough (matte) finish. The surface condition of surface F91 can sometimes be affected, for example, by the surface condition of the release film disposed between the sealing resin 91 and the mold during the formation of the sealing resin 91. For instance, a release film with a rough surface is used, and the pattern of the rough surface of the release film is transferred to surface F91. In addition to being affected by the release film, the surface condition of surface F91 can sometimes be affected by the filler and type of resin within the sealing resin 91.

[0079] In addition, to improve the adhesion between the sealing resin 91 and the ink 100, the sealing resin 91 can be subjected to O2 plasma treatment before the ink 100 is formed.

[0080] Next, as Figure 8B As shown, ink 100 is applied to the upper surface (surface F91) of the sealing resin 91. The ink 100 is formed, for example, by printing markings, text, and information codes using an inkjet printer. The ink 100 can be changed from a liquid or semi-solid state to a solid state. The ink 100 is temporarily cured using ultraviolet light, and then cured by heat.

[0081] Next, as Figure 2 As shown, a film 110 is formed, coated with sealing resin 91 and ink 100. The film 110 is formed, for example, by sputtering. Subsequently, it is completed by providing metal bumps 13. Figure 1 Semiconductor device 1 is shown.

[0082] As described above, according to the first embodiment, the membrane 110 is coated with sealing resin 91 and ink 100. As a result, the ink 100 is protected.

[0083] Between the region R1 where ink 100 is applied and the region R2 where ink 100 is not applied, the surface color of the film 110 is approximately the same. However, between the region R1 where ink 100 is applied and the region R2 where ink 100 is not applied, the surface reflectivity of the film 110 is different, thereby improving the recognizability of text and the readability of barcodes.

[0084] Furthermore, the surface roughness of the membrane 110 differs between the region R1 where ink 100 is provided and the region R2 where ink 100 is not provided. In the first embodiment, the surface roughness of the membrane 110 in region R1 is less than that in region R2.

[0085] Furthermore, in one of regions R1 and R2, light is easily reflected unidirectionally, while in the other, light is easily diffusely reflected. This affects the difference in reflectivity. The difference in reflectivity will affect the legibility of text and the readability of barcodes. Therefore, the difference in reflectivity between the film 110 in region R1 where ink 100 is provided and region R2 where ink 100 is not provided is preferably 30% or more. In the first embodiment, the reflectivity of the film 110 in region R1 is 30% or more higher than the reflectivity of the film 110 in region R2. More preferably, the difference is 40% or more.

[0086] Furthermore, in the first embodiment, the cases where the color of the ink 100 (pigment 101) is black, green, or white were described. However, more than the color of the ink 100, the surface state of the surface F100 after the ink 100 has hardened has a greater impact on the surface state and reflective properties of the surface F110.

[0087] When the surface F91 of the sealing resin 91 is rough, the components of the ink 100, such as pigment 101, are selected to make the surface (surface F100) of the ink 100 smooth. As a result, light is reflected unidirectionally to some extent on the surface F110 of region R1. The surface F110 of region R2 is rough and matte, therefore light is diffusely reflected on the surface F110 of region R2. Consequently, region R2, as the background, appears darker, while region R1, as the printed content, appears brighter. By increasing the difference in brightness between region R1 and region R2, the visibility of the printed content and the readability of the barcode can be improved.

[0088] The average particle size of the pigment 101 contained in the ink 100 is preferably, for example, about 100 nm or less. The average particle size of the carbon black used for black ink is, for example, tens of nm.

[0089] The concentration of pigment 101 contained in ink 100 is preferably 10% or less. More preferably, it is 5% or less. Furthermore, ink 100 may also be free of pigment 101. That is, the concentration of pigment 101 may be zero. In this case, the color of ink 100 is colorless and transparent, or a base color of components other than pigment 101.

[0090] also, Figure 2 The membrane 110 shown is a multilayer membrane. However, membrane 110 can also be a single-layer membrane.

[0091] (Comparative Example) Figure 9 This is a cross-sectional view showing an example of the configuration of the semiconductor device 1a of the first comparative example. The first comparative example differs from the first embodiment in that it uses a mark 100a instead of ink 100.

[0092] In the first comparative example, mark 100a is a laser mark. In this case, mark 100a is formed by irradiating the package surface with laser light to remove or melt it.

[0093] Here, semiconductor packaging requires miniaturization and thinning. To achieve thinning, for example, it is considered to thin the wiring substrate 10 and the semiconductor chips 30-33, and to thin the sealing resin 91. However, if the sealing resin 91 is thinned, the sealing resin 91 on the semiconductor chips 30-33 and the sealing resin 91 on the bonding wire 90 will also become thinner. Figure 6 The thickness T1 shown represents the thickness of the sealing resin 91 on the bonding line 90. The thickness T2 represents the thickness of the sealing resin 91 on the semiconductor chips 30-33. If the thicknesses T1 and T2 become too thin, the semiconductor chips 30-33 may be damaged by the laser light passing through the sealing resin 91, or the bonding line 90 and the semiconductor chips 30-33 may be exposed due to laser etching of the sealing resin 91. To suppress the transmission of laser light, or to set the etching margin marked 100a, the thickness of the sealing resin 91 should not be made extremely thin.

[0094] Figure 10 This is a cross-sectional view showing an example of the configuration of the ink 100b and its surroundings in the second comparative example. The second comparative example differs from the first embodiment in that the ink 100b is disposed on the membrane 110.

[0095] In the second comparative example, ink 100b is an ink mark. Compared with laser marking, ink marking has less impact on the bonding lines 90 and semiconductor chips 30-33 within the semiconductor package. Therefore, by using ink marking, the sealing resin 91 can be thinned, thereby facilitating the miniaturization of the semiconductor package.

[0096] However, ink 100b may disappear due to organic solvents or mechanical friction, or the printed content may be missing or thinned. Furthermore, ink 100b may discolor during high-temperature testing. Additionally, the outer surface of semiconductor packages sometimes requires flame retardancy, and it can be difficult to make ink 100b suitable for flame retardancy.

[0097] In contrast, in the first embodiment, after the ink 100, which serves as an ink marker, is formed in the semiconductor package, a film 110 is formed. Thus, the ink 100 is covered by the film 110. As a result, the ink 100 is protected from physical friction, chemicals, oils, etc. Furthermore, the ink 100 can be printed to a thinner thickness, thus reducing the thickness of the sealing resin 91 relative to the ink 100 thickness, allowing for a thinner overall semiconductor package. Additionally, the thickness of the ink 100 is, for example, 4 μm or more. Therefore, compared to the first and second comparative examples, the semiconductor package can be made thinner by thinning the sealing resin 91, and the ink 100 can be protected.

[0098] Furthermore, since the ink 100 is not exposed on the packaging surface, there is no need to consider the discoloration of the ink 100. In addition, the ink 100 is covered by a non-flammable film 110 (e.g., a metal film), so there is no need to consider the flame retardancy of the ink 100.

[0099] (Variation Example) In a variation example, the surface F110 of the film 110 in the region R2 where no ink 100 is provided is mirror-like, which is different from the first embodiment.

[0100] The surface F91 of the sealing resin 91 is mirror-like. Figure 8A In the process shown, for example, a sealing resin 91 with a mirror-like surface F91 can be formed by using a release film with a mirror-like surface. As a result, the surface F110 of the film 110 in region R2 is also mirror-like.

[0101] In the variation examples, the reading success rate was highest when white ink was used. In the variation examples, the tendency of visibility or reading success rate to be related to the type of ink is opposite to that in the first embodiment.

[0102] When using white ink, the surface of face F110 in area R1, where ink 100 (text and barcode) is located, is rough, resulting in diffuse light reflection in area R1. The surface of face F110 in area R2, outside of area R1, is mirror-like, causing some degree of unidirectional light reflection in area R2, making area R2 appear brighter. The background area R2 appears brighter, while area R1, which contains the printed content, appears darker, increasing the difference in brightness (gloss) between areas R1 and R2. This results in higher visibility of the printed content.

[0103] In the variation example, the surface roughness of the membrane 110 in region R1 is greater than that of the membrane 110 in region R2.

[0104] In the variation example, the reflectivity of the film 110 in region R1 is more than 30% lower than that of the film 110 in region R2. Preferably, it is more than 40% lower.

[0105] When the surface F91 of the sealing resin 91 is mirror-like, the components of the ink 100, such as the pigment 101, are selected such that the surface of the ink 100 (surface F100) becomes rough. In addition, the surface roughness of the surface F110 is not limited to the pigment 101, but can be produced by additives or the like in the ink 100.

[0106] The larger the average particle size of the pigment in ink 100, the better. The average particle size of pigment 101 contained in ink 100 is, for example, about 300 nm or more. In addition, the average particle size of titanium dioxide (IV) used in white ink is, for example, about 300 nm.

[0107] For ink 100, the higher the pigment concentration, the better.

[0108] Furthermore, when the film 110 is thicker, it is possible that the rough recesses on the surface of the ink 100 are filled by the constituent material of the film 110, or that the rough protrusions on the surface of the ink 100 become rounded due to the adhering constituent material of the film 110. That is, the roughness of the surface of the ink 100 is reduced. The reduction in the roughness of the surface of the ink 100 may reduce the difference in the degree of light reflection on the surface F110 between the region R1 where the ink 100 is disposed and the region R2 where the ink 100 is not disposed. As a result, the visibility of the printed content and the readability of the barcode are reduced. Therefore, the film 110 is more preferably thinner.

[0109] As a variation, the surface F110 of the film 110 in the region R2 where no ink 100 is provided can also be mirror-like. The ink 100 used can also be changed according to the surface condition of the surface F91 of the sealing resin 91.

[0110] The semiconductor device 1 in the variation example can achieve the same effect as the first embodiment.

[0111] (Second Implementation) Figure 11 This is a cross-sectional view showing an example of the configuration of the ink 100 and its surroundings in the second embodiment. The second embodiment differs from the first embodiment in terms of the exposure of the film 112.

[0112] Membrane 113 is disposed on membrane 112. Membrane 113 has a different color than membrane 112.

[0113] The membrane 112 is exposed from the membrane 113 in the region R1 where the ink 100 is provided. The membrane 112 is not exposed from the membrane 113 in the region R2 where the ink 100 is not provided.

[0114] Film 112 can also be oxidized or otherwise treated to become black. This increases the difference in brightness or color between film 112 and film 113. As a result, the legibility of printed content and the readability of barcodes can be improved.

[0115] In addition, as mentioned above, film 112 is, for example, copper, and film 113 is, for example, stainless steel that is not easily oxidized.

[0116] In the second embodiment, the recognizability of text and the readability of barcodes can be improved by the difference in color between film 112 and film 113.

[0117] The other configurations of the semiconductor device 1 in the second embodiment are the same as the corresponding configurations of the semiconductor device 1 in the first embodiment, so detailed descriptions are omitted.

[0118] Next, the manufacturing method of membrane 110 will be explained.

[0119] After setting ink level 100 (see reference) Figure 8B ),like Figure 2 The film 110 is formed as shown. The film 110 is formed by sequentially forming films 111, 112, and 113. Furthermore, the step of forming film 110 includes: forming a film 112 coated with sealing resin 91 and ink 100; and forming a film 113 coated with film 112 and having a different color from film 112.

[0120] Next, as Figure 11 As shown, the film 113 in the region R1 where the ink 100 is disposed is selectively removed. The removal of the film 113 can also be performed, for example, by grinding the film 113 until the film 112 in the region R1 where the ink 100 is disposed is exposed. Furthermore, the removal of the film 113 can be performed by etching using a mask, or by thin-film removal using a laser.

[0121] Next, a process is performed to oxidize the exposed membrane 112. The oxidation process is, for example, heat treatment.

[0122] As in the second embodiment, the visibility of printed content and the readability of barcodes can also be improved by using the different colors or brightness differences of the multiple films 112 and 113.

[0123] The semiconductor device 1 of the second embodiment can achieve the same effect as the first embodiment.

[0124] Furthermore, the surface state of surface F110 in region R2 increases the difference in brightness between film 112 and film 113, thus also allowing for... Figure 11 The exposed surface of the membrane 112 shown is treated with a mirror finish.

[0125] Several embodiments of the present invention have been described, but these embodiments are merely illustrative and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, as well as within the scope of the invention as described in the claims and the same scope thereof.

Claims

1. A semiconductor device comprising: Resin layer; Ink, disposed on the upper surface of the resin layer; and A film, coated with the resin layer and the ink; and The surface roughness of the film differs between the first region where the ink is applied and the second region where the ink is not applied. The difference in the skewness of the film between the first region where the ink is provided and the second region where the ink is not provided is 0.2 or more; The membrane is a conductive membrane containing metal.

2. A semiconductor device comprising: Resin layer; Ink, disposed on the upper surface of the resin layer; and A film, coated with the resin layer and the ink; and The surface roughness of the film differs between the first region where the ink is applied and the second region where the ink is not applied. The membrane has the following characteristics: First membrane; and A second film, disposed on the first film, has a different color than the first film; and The first membrane is exposed from the second membrane in the first region where the ink is provided, but not in the second region where the ink is not provided.

3. The semiconductor device according to claim 1 or 2, wherein The surface roughness of the membrane in the first region is less than that of the membrane in the second region.

4. The semiconductor device according to claim 1 or 2, wherein The difference in reflectivity of the film between the first region where the ink is applied and the second region where the ink is not applied is 30% or more.

5. The semiconductor device according to claim 1 or 2, wherein The average particle size of the pigments contained in the ink is less than 100 nm.

6. The semiconductor device according to claim 1 or 2, wherein The average particle size of the pigments contained in the ink is above 300 nm.

7. The semiconductor device according to claim 1 or 2, wherein The concentration of pigment contained in the ink is less than 10%.

8. The semiconductor device according to claim 1 or 2, wherein The ink does not contain pigments.

9. The semiconductor device according to claim 1 or 2, wherein The film has at least one of the following properties that are higher than those of the ink: hardness, abrasion resistance, oil resistance, heat resistance, and flame retardancy.

10. A method for manufacturing a semiconductor device, comprising: Ink is applied to the upper surface of the resin layer; and A film is formed covering the resin layer and the ink; and The surface roughness of the film differs between the first region where the ink is applied and the second region where the ink is not applied. The difference in the skewness of the film between the first region where the ink is provided and the second region where the ink is not provided is 0.2 or more; The membrane is a conductive membrane containing metal.

11. A method for manufacturing a semiconductor device, comprising: Ink is applied to the upper surface of the resin layer; and A film is formed covering the resin layer and the ink; and The surface roughness of the film differs between the first region where the ink is applied and the second region where the ink is not applied. The step of forming the membrane includes: Forming a first film covering the resin layer and the ink; and A second film is formed that covers the first film and has a different color from the first film; and the method for manufacturing the semiconductor device further comprises: After the first film and the second film are formed, the second film in the first region where the ink is disposed is selectively removed.

12. The method of manufacturing a semiconductor device according to claim 11, wherein... After the second membrane is selectively removed, the exposed first membrane is oxidized.

13. The method of manufacturing a semiconductor device according to claim 10 or 11, wherein The difference in reflectivity of the film between the first region where the ink is applied and the second region where the ink is not applied is 30% or more.

14. The method of manufacturing a semiconductor device according to claim 10 or 11, wherein The average particle size of the pigments contained in the ink is less than 100 nm.

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