Detection transfer device, detection transfer method of light emitting chip and display panel

Abstract

The present application relates to a kind of detection transfer devices, it includes: first transfer component, detection component and second transfer component, first transfer component is placed with multiple light emitting chips, detection component includes first transmission element, chip detection unit, first clamping unit, second clamping unit and detection unit, wherein, first transmission element is used to transmit the light emitting chip transferred by first transfer component;Chip detection unit sends detection signal when detecting light emitting chip;Second clamping unit and first clamping unit clamp light emitting chip according to detection signal after preset time, and turn on light emitting chip;Detection unit is used to screen out qualified light emitting chip in light emitting chip;The other end of first transmission element is connected with second transfer component, and qualified light emitting chip is transferred to predetermined position by second transfer component.The present application also provides a kind of detection transfer method of light emitting chip and the display panel with the qualified light emitting chip.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a detection and transfer device, a detection and transfer method for a light-emitting chip, and a display panel. Background Technology

[0002] Micro LEDs (Micro Light Emitting Diodes) have advantages such as small size, low power consumption, wide color gamut, and long lifespan. Furthermore, with the maturation of manufacturing processes and the decrease in price, the mass transfer technology for Micro LEDs has gradually matured in recent years. Post-mass transfer repair of Micro LEDs, measurement of photoelectric parameters such as wavelength and brightness, and related screening methods are also beginning to attract attention.

[0003] Currently, the commonly used mass transfer technology for Micro LEDs in the industry is polydimethylsiloxane (PDMS) imprint transfer. However, it is difficult to measure the photoelectric parameters of Micro LEDs, such as wavelength and brightness, and to screen Micro LEDs using PDMS imprint transfer. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a detection and transfer device, a detection and transfer method for light-emitting chips, and a display panel, which aims to realize electroluminescence detection and related screening after mass transfer of light-emitting chips.

[0005] A detection and transfer device includes a first transfer component, a detection component, and a second transfer component. The first transfer component holds a plurality of light-emitting chips. The detection component includes a first transmission element, a chip detection unit, a first clamping unit, a second clamping unit, and a detection unit. One end of the first transmission element is connected to the first transfer component for transmitting the light-emitting chips transferred by the first transfer component. The chip detection unit is disposed on one side of the first transmission element and emits a detection signal when it detects a light-emitting chip. The second clamping unit is disposed on opposite sides of the first transmission element and aligned with it. It clamps the light-emitting chip after a preset time according to the detection signal and turns on the light-emitting chip. The detection unit is disposed on the side of the first clamping unit away from the first transmission element for screening out qualified light-emitting chips from the light-emitting chips. The other end of the first transmission element is connected to the second transfer component, and qualified light-emitting chips are transferred to a predetermined position by the second transfer component.

[0006] In summary, in the detection and transfer device of this application, the detection unit performs electroluminescence detection on the light-emitting chip and filters the light-emitting chip according to photoelectric parameters, thereby improving the visual effect of the product. The second transfer component completes the transfer of qualified light-emitting chips from the light-emitting chips, thereby reducing the transfer cost.

[0007] Optionally, the first transfer component includes a first accommodating unit and a first magnetic element, wherein the first accommodating unit contains a solution, the first accommodating unit is disposed on one side of the first magnetic element, the first accommodating unit is connected to the first transmission element, and the light-emitting chip is transferred to the first transmission element by the solution under the action of the first magnetic element; the first magnetic element is used to keep the light-emitting chip in a horizontal state in the first accommodating unit.

[0008] Optionally, the detection assembly further includes an air blowing unit and an air blowing gate, wherein the air blowing unit and the air blowing gate are respectively opened on opposite sides of the first transmission element, and the air blowing unit is used to remove the unqualified light-emitting chips screened out by the detection unit from the first transmission element through the air blowing gate.

[0009] Optionally, the second transfer assembly includes a second receiving unit, a second magnetic element, a pressure block control gate, and a second transmission element. The second receiving unit is connected to the first transmission element and is disposed on one side of the second magnetic element. The second magnetic element is used to keep the qualified light-emitting chip in a horizontal state in the second receiving unit. The pressure block control gate is connected to the outlet end of the second receiving unit and is close to the second transmission element. The second transmission element controls the opening or closing of the outlet end of the second receiving unit by the pressure block control gate. When the pressure block control gate is open, the qualified light-emitting chip is transferred from the second receiving unit to the second transmission element.

[0010] Optionally, the second transmission element includes a main body and a plurality of protrusions protruding from the periphery of the main body. The pressure block control door is close to the main body and located on the rotation path of the protrusions. The pressure block control door opens relative to the outlet end of the second accommodating unit under the push of the protrusions, and a qualified light-emitting chip is introduced from the second accommodating unit into the second transmission element.

[0011] Optionally, the second transfer assembly further includes a third transmission element and a third receiving unit, wherein the third transmission element is disposed below the second transmission element and is used to transfer a qualified light-emitting chip transmitted from the second transmission element to a predetermined position; the third receiving unit is disposed below the second receiving unit and the third transmission element and is used to collect the solution flowing out from the second receiving unit.

[0012] Optionally, the first transmission element is a pipe, the chip detection unit is an infrared sensor, and the detection unit is a colorimeter.

[0013] Optionally, the weight of the electrode portion of the light-emitting chip is greater than the weight of the light-emitting portion, and the electrode portion of the light-emitting chip is a magnetic metal.

[0014] In summary, in the detection and transfer device of this application, the detection unit performs electroluminescence detection on the light-emitting chips and filters the light-emitting chips according to photoelectric parameters. The unqualified light-emitting chips are output through the air blowing unit and the air blowing gate, thereby improving the quality of the light-emitting chips and thus improving the visual effect of the product. The second transfer component completes the transfer of qualified light-emitting chips. At the same time, the third containment unit can also recover the solution used in the entire transfer process, thereby reducing the transfer cost.

[0015] Based on the same inventive concept, this application also provides a detection and transfer method for light-emitting chips, which includes: transferring a plurality of light-emitting chips to a detection component through a first transfer component; detecting and screening the light-emitting chips through the detection component, and transferring the screened qualified light-emitting chips to a second transfer component; and transferring the qualified light-emitting chips to a predetermined position through the second transfer component.

[0016] In summary, in the detection and transfer method of the light-emitting chip of this application, the detection unit performs electroluminescence detection on the light-emitting chip and filters the light-emitting chip according to photoelectric parameters. The second transfer component completes the transfer of qualified light-emitting chips. At the same time, the third containment unit can also recover the solution used in the entire transfer process, thereby reducing the transfer cost.

[0017] Optionally, the step of transferring the plurality of light-emitting chips to the detection component via the first transfer component includes: providing a growth substrate having the plurality of light-emitting chips, and aligning the plurality of light-emitting chips toward and aligning them with the first transfer component; peeling the light-emitting chips on the growth substrate into a first receiving unit of the first transfer component; and transferring the light-emitting chips to the detection component.

[0018] Optionally, the step of detecting and screening the light-emitting chips through the detection component and transferring the screened qualified light-emitting chips to the second transfer component includes: detecting the light-emitting chips through the chip detection unit of the detection component; clamping and conducting the light-emitting chips through the first clamping unit and the second clamping unit of the detection component; detecting the light-emitting chips through the detection unit of the detection component; removing the detected unqualified light-emitting chips through the air blowing unit and the air blowing gate of the detection component; and transferring the detected qualified light-emitting chips to the second transfer component through the first transmission element of the detection component.

[0019] Optionally, the step of transferring the qualified light-emitting chip to a predetermined position via the second transfer component includes: receiving the qualified light-emitting chip transmitted by the first transmission element through a second receiving unit of the second transfer component; transferring the qualified light-emitting chip from the second receiving unit to a second transmission element of the second transfer component; transferring the qualified light-emitting chip from the second transmission element to a third transmission element of the second transfer component; and transferring the qualified light-emitting chip from the third transmission element to a predetermined position.

[0020] In summary, the detection and transfer method for light-emitting chips in this application involves using the detection unit to perform electroluminescence detection on the light-emitting chips and screening them based on photoelectric parameters. The unqualified light-emitting chips are then output through the air blowing unit and the air blowing port, thereby improving the quality of the light-emitting chips and enhancing the visual effect of the product. The second transfer component completes the transfer of qualified light-emitting chips, and the third containment unit can also recover the solution used in the entire transfer process, thus reducing transfer costs.

[0021] Based on the same inventive concept, this application also provides a display panel, which includes a display backplate and a plurality of qualified light-emitting chips that are detected and transferred by the above-described detection and transfer device, wherein the plurality of qualified light-emitting chips are electrically connected to the display backplate.

[0022] In summary, in the display panel of this application, the light-emitting chips undergo electroluminescence detection by the detection unit, and the light-emitting chips are screened according to photoelectric parameters. The screened unqualified light-emitting chips are output through the air blowing unit and the air blowing gate, thereby improving the quality of the light-emitting chips and thus improving the visual effect of the product. The second transfer component completes the transfer of qualified light-emitting chips, and the third containment unit can also recover the solution used in the entire transfer process, thereby reducing the transfer cost. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a detection and transfer device disclosed in an embodiment of this application;

[0025] Figure 2 This is a schematic flowchart of a detection and transfer method for a light-emitting chip disclosed in an embodiment of this application;

[0026] Figure 3 for Figure 2 The flowchart of step S10 in the detection and transfer method shown is as follows;

[0027] Figure 4 for Figure 3 A schematic diagram of the corresponding structures formed by steps S11 and S12 in the detection and transfer method shown;

[0028] Figure 5 for Figure 3 A schematic diagram of the corresponding structure formed in step S13 of the detection and transfer method shown;

[0029] Figure 6 for Figure 2 The flowchart of step S20 in the detection and transfer method shown is as follows;

[0030] Figure 7 for Figure 6 A schematic diagram of the corresponding structure formed in step S21 of the detection and transfer method shown;

[0031] Figure 8 for Figure 6 A schematic diagram of the corresponding structures formed by steps S22 and S23 in the detection and transfer method shown;

[0032] Figure 9 for Figure 6 A schematic diagram of the corresponding structures formed by steps S24 and S25 in the detection and transfer method shown;

[0033] Figure 10 for Figure 2 The flowchart of step S30 in the detection and transfer method shown is as follows;

[0034] Figure 11 for Figure 2 The diagram shows the corresponding structures formed by steps S31, S32 and S33 in the detection and transfer method.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10 - Growth substrate;

[0037] 20-Light-emitting chip;

[0038] 20a - Defective LED chip;

[0039] 20b - Qualified LED chip;

[0040] 100 - Detection and transfer device;

[0041] 110 - First transfer component;

[0042] 120 - Detection Component;

[0043] 130 - Second transfer component;

[0044] 111 - First accommodating unit;

[0045] 111a - Open end;

[0046] 111b - First Pipeline;

[0047] 112 - First magnetic component;

[0048] 121 - First transmission element;

[0049] 122 - Chip detection unit;

[0050] 123 - First gripping unit;

[0051] 124 - Second gripping unit;

[0052] 125 - Detection unit;

[0053] 126 - Air blowing unit;

[0054] 127 - Air inlet gate;

[0055] 131 - Second accommodating unit;

[0056] 131b - Second pipe;

[0057] 132 - Second magnetic component;

[0058] 133-Pressure block control door;

[0059] 134 - Second transmission element;

[0060] 1341 - Main body;

[0061] 1343 - Protrusion;

[0062] 135 - Third transmission element;

[0063] 136 - Third accommodating unit;

[0064] The steps of the detection and transfer method for S10-S30 light-emitting chips;

[0065] S11-S13 - Step S10 in the detection and transfer method of the light-emitting chip;

[0066] S21-S25 - Step S20 in the detection and transfer method of the light-emitting chip;

[0067] Step S30 in the detection and transfer method of the light-emitting chip (S31-S34) Detailed Implementation

[0068] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0069] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0070] Micro LEDs (Micro Light Emitting Diodes) possess advantages such as small size, low power consumption, wide color gamut, and long lifespan. Furthermore, with the maturation of manufacturing processes and the decrease in price, mass transfer technology for Micro LEDs has gradually matured in recent years. Post-mass transfer repair of Micro LEDs, measurement of photoelectric parameters such as wavelength and brightness, and related screening of Micro LEDs have also begun to attract attention. Currently, the commonly used mass transfer technology for Micro LEDs in the industry is polydimethylsiloxane (PDMS) imprint transfer. However, PDMS imprint transfer makes it difficult to measure photoelectric parameters such as wavelength and brightness of Micro LEDs and to screen them accordingly. Therefore, how to achieve electroluminescence (EL) detection and related screening after mass transfer of light-emitting chips is a problem that urgently needs to be solved by those skilled in the art.

[0071] Based on this, this application aims to provide a detection solution that can solve the above-mentioned technical problems. It can realize electroluminescence (EL) detection and related screening after mass transfer of light-emitting chips. The details will be described in subsequent embodiments.

[0072] This application provides a detailed description of the detection and transfer device, the detection and transfer method of the light-emitting chip, and the display panel.

[0073] Please see Figure 1 This is a schematic diagram of the structure of a detection and transfer device disclosed in an embodiment of this application. Figure 1 As shown, this application provides a detection and transfer device 100, mainly used for measuring photoelectric parameters such as wavelength and brightness of light-emitting chips and for screening light-emitting chips, and also for transferring light-emitting chips. In the embodiments of this application, the detection and transfer device 100 may include at least a first transfer component 110, a detection component 120, and a second transfer component 130, wherein the first transfer component 110 is connected to the detection component 120, and the detection component 120 is connected to the second transfer component 130, that is, the first transfer component 110, the detection component 120, and the second transfer component 130 are connected sequentially, and multiple light-emitting chips 20 (see reference) are transferred. Figure 4 EL detection, screening and transfer are performed sequentially through the first transfer component 110, the detection component 120 and the second transfer component 130.

[0074] In an exemplary embodiment of this application, the first transfer component 110 includes a first accommodating unit 111 and a first magnetic element 112. The first accommodating unit 111 may be a liquid accommodating tank containing a solution. The first magnetic element 112 is located below the first accommodating unit 111 and spaced apart from the bottom of the first accommodating unit 111, i.e., the first accommodating unit 111 is disposed on one side of the first magnetic element 112. The first magnetic element 112 is used to keep the light-emitting chip 20 in a horizontal state within the first accommodating unit 111. The first accommodating unit 111 is connected to the detection component 120, and under the action of the first magnetic element 112, the light-emitting chip 20 is transferred to the detection component 120 through the solution.

[0075] In this embodiment of the application, the first accommodating unit 111 has an opening end 111a, and the light-emitting chip 20 can be dropped into the solution of the first accommodating unit 111 through the opening end 111a after being laser-lifted (LLO).

[0076] The first magnetic element 112 is used to keep the light-emitting chip 20 in a horizontal state within the first accommodating unit 111. The first accommodating unit 111 is connected to the detection component 120, and under the action of the first magnetic element 112, the light-emitting chip 20 is transferred to the detection component 120 through a solution.

[0077] In this embodiment, the first accommodating unit 111 further includes a first conduit 111b, which is located at the bottom of the first accommodating unit 111 and close to the first magnetic element 112. The first accommodating unit 111 is connected to the detection component 120 through the first conduit 111b. Multiple light-emitting chips 20 are transferred to the detection component 120 through the first conduit 111b under the action of the first magnetic element 112. Because the first conduit 111b is close to the first magnetic element 112, the light-emitting chips remain horizontal as they pass through the first conduit 111b to the detection component 120, facilitating corresponding detection.

[0078] In this embodiment, the light-emitting chip 20 is a flip-chip. The weight of the electrode portion of the light-emitting chip 20 is greater than the weight of the light-emitting portion. This ensures that after the light-emitting chip 20 falls into the solution of the first containing unit 111, the electrode portion faces the bottom of the first containing unit 111, thus maintaining the chip's shape in the solution. Furthermore, the electrode portion of the light-emitting chip can be a magnetic metal, and the magnetism of the electrode portion is the same as the magnetism of the side of the first magnetic element 112 facing the first containing unit 111. This design allows the light-emitting chip to be adjusted to a horizontal state in the solution, and then, with the help of fluid force and gravity, the light-emitting chip 20 horizontally enters the first pipe 111b.

[0079] In the embodiments of this application, the solution is a non-conductive solution.

[0080] like Figure 1 As shown in the embodiment of this application, the detection component 120 may include at least a first transmission element 121, a chip detection unit 122, a first clamping unit 123, a second clamping unit 124, a detection unit 125, an air blowing unit 126, and an air blowing port 127. The first transmission element 121 is connected to the first receiving unit 111 via the first conduit 111b, and is used to transmit the light-emitting chip 20 transferred by the first receiving unit 111. That is, the light-emitting chip 20 is transmitted to the first transmission element 121 via the first conduit 111b, and EL detection and screening are completed sequentially through the first transmission element 121.

[0081] It is understood that the first transmission element 121 may be integrally disposed with the first conduit 111b, or the first transmission element 121 may be an extension of the first conduit 111b. In the embodiments of this application, the first transmission element 121 and the first conduit 111b may be hollow conduits made of high-transparency material.

[0082] In this embodiment, the chip detection unit 122 is disposed on one side of the first transmission element 121, and is used to detect the corresponding detection signal emitted by the light-emitting chip 20, and transmit the detection signal to the first clamping unit 123 and the second clamping unit 124. That is, the chip detection unit 122 is disposed at any position outside the first transmission element 121 (e.g., Figure 1 As shown above the first transmission element 121, it is used to detect whether there is a light-emitting chip 20 passing through the first transmission element 121 corresponding to the position of the chip detection unit 122. When the chip detection unit 122 detects the light-emitting chip 20, it sends out a corresponding detection signal and transmits the detection signal to the first clamping unit 123 and the second clamping unit 124.

[0083] In this embodiment, the first clamping unit 123 and the second clamping unit 124 are respectively located on opposite sides of the first transmission element 121, and the first clamping unit 123 is disposed adjacent to the chip detection unit 122 and on the same side of the first transmission element 121. The positions of the first clamping unit 123 and the second clamping unit 124 are relatively aligned, and they can be relatively far apart or close together. Specifically, the first clamping unit 123 is disposed on one side of the first transmission element 121 (e.g., Figure 1 As shown, it is located above the first transmission element 121, and the second gripping unit 124 is disposed on the other side of the first transmission element 121 (e.g., located above the first transmission element 121). Figure 1 As shown below the first transmission element 121, the second gripping unit 124 and the first gripping unit 123 are aligned and disposed on opposite sides of the first transmission element 121, and the two can be relatively far apart or close together.

[0084] Both the first clamping unit 123 and the second clamping unit 124 are configured to move closer to each other based on the detection signal transmitted by the chip detection unit 122, and clamp the light-emitting chip 20 after a preset time. The second clamping unit 124 is further configured to turn on the light-emitting chip 20 when clamping it, causing the light-emitting chip 20 to emit light. The preset time can be calculated using the flow rate of the solution in the first transmission element 121 and the distance between the chip detection unit 122 and the first clamping unit 123.

[0085] It is understood that the detection and transfer device 100 may further include a drive motor (not shown), which is electrically connected to the chip detection unit 122. Simultaneously, the drive motor is also connected to the first clamping unit 123 and the second clamping unit 124, and can drive the first clamping unit 123 and the second clamping unit 124 to move away from or towards each other. For example, when the drive motor receives a detection signal from the chip detection unit 122, the drive motor drives the first clamping unit 123 and the second clamping unit 124 to move closer together, so as to clamp the light-emitting chip 20 after a preset time.

[0086] In an exemplary embodiment, the first clamping unit 123 may be a transparent clamping block, and the second clamping unit 124 may be a conductive metal ball that can be connected to a power supply circuit. After clamping the light-emitting chip 20, the second clamping unit 124 connects to the power supply circuit to provide power to the light-emitting chip 20, so that the light-emitting chip 20 emits light.

[0087] The detection unit 125 is disposed on the side of the first clamping unit 123 away from the first transmission element 121, and is used to perform EL detection on the light-emitting chip 20 to obtain the photoelectric parameters of the light-emitting chip 20, and to screen the light-emitting chip 20 according to the photoelectric parameters. In this embodiment, the detection unit 125 is disposed on the side of the first clamping unit 123 away from the first transmission element 121, and corresponds to the light-emitting part of the light-emitting chip 20. In this application, after the second clamping unit 124 clamps the light-emitting chip 20, it turns on the power circuit. At this time, the light-emitting part of the light-emitting chip 20 emits light. Since the first clamping unit 123 is a transparent clamping block, the light emitted by the light-emitting chip 20 is transmitted to the detection unit 125 through the first clamping unit 123. The photoelectric parameters may include at least the brightness and wavelength of the light-emitting chip.

[0088] The air blowing unit 126 and the air blowing gate 127 are respectively located on opposite sides of the first transmission element 121 and are respectively connected to the first transmission element 121. The air blowing unit 126 is disposed adjacent to the first gripping unit 123 and the detection unit 125 and is located on the same side of the first transmission element 121. The positions of the air blowing unit 126 and the air blowing gate 127 are aligned. Specifically, the air blowing unit 126 is located on one side of the first transmission element 121 (e.g., Figure 1 The air inlet gate 127 is located on the other side of the first transmission element 121 (as shown in the diagram), adjacent to the first gripping unit 123, and on the same side of the first transmission element 121 as the first gripping unit 123 and the detection unit 125. Figure 1 The air blowing unit 126 and the air blowing port 127 are located on opposite sides of the first transmission element 121, as shown in the diagram, adjacent to the second clamping unit 124 of the first transmission element 121. That is, the air blowing unit 126 and the air blowing port 127 are aligned and arranged on opposite sides of the first transmission element 121.

[0089] In an exemplary embodiment, the detection unit 125 detects the photoelectric parameters of the light-emitting chip 20 and filters the light-emitting chip 20 according to the photoelectric parameters to determine whether the light-emitting chip 20 is qualified.

[0090] The blowing unit 126 is used to blow air onto the defective light-emitting chip 20a detected by the detection unit 125, and remove the defective light-emitting chip 20a from the first transmission element 121 through the blowing port 127. The blowing port 127 is also used to output the defective light-emitting chip 20a to the recycling device for recycling. Specifically, when the detection unit 125 detects that the light-emitting chip 20a is defective, the blowing unit 126 blows air onto the defective light-emitting chip 20a. Since the blowing unit 126 and the blowing port 127 are aligned, and under the action of gravity, the defective light-emitting chip 20a is removed from the first transmission element 121 through the blowing port 127, and the defective light-emitting chip 20a removed from the first transmission element 121 is recycled into the recycling device. When the detection unit 125 detects that the light-emitting chip 20 is qualified, the qualified light-emitting chip 20b is transferred to the second transfer component 130 through the first transmission element 121 for transfer.

[0091] In an exemplary embodiment of this application, the first transmission element 121 may be a pipe, the chip detection unit 122 may be an infrared sensor, the detection unit 125 may be a colorimeter, and the air blowing unit 126 may be an air blowing port.

[0092] In this embodiment, the second transfer assembly 130 may include at least a second receiving unit 131, a second magnetic element 132, a pressure block control gate 133, a second transmission element 134, a third transmission element 135, and a third receiving unit 136. The second receiving unit 131 is connected to the first transmission element 121 and is used to transfer qualified light-emitting chips 20b from the first transmission element 121 to the second transmission element 134. In this embodiment, the second receiving unit 131 also includes a second conduit 131b, located at the bottom of the second receiving unit 131. Multiple qualified light-emitting chips 20b are transferred to the second conduit 131b under the action of the second magnetic element 132.

[0093] The second magnetic element 132 is disposed below the second accommodating unit 131 and spaced apart from the bottom of the second accommodating unit 131, that is, the second accommodating unit 131 is disposed on one side of the second magnetic element 132. The second magnetic element 132 is used to keep the qualified light-emitting chip 20b in a horizontal state within the second accommodating unit 131. In this embodiment, both the first magnetic element 112 and the second magnetic element 132 can be magnets.

[0094] The pressure block control door 133 is connected to the outlet end of the second pipe 131b and is located between the second pipe 131b and the second transmission element 134. That is, the pressure block control door 133 is connected to the outlet end of the second pipe 131b and is close to the second transmission element 134. The pressure block control door 133 is movably connected to the outlet end of the second pipe 131b to open or close the outlet end of the second pipe 131b. When the pressure block control door 133 is open relative to the outlet end of the second pipe 131b, a qualified light-emitting chip 20b is transferred from the second pipe 131b to the second transmission element 134; when the pressure block control door 133 is closed relative to the outlet end of the second pipe 131b, a qualified light-emitting chip 20b is contained within the second pipe 131b.

[0095] In this embodiment of the application, the second transmission element 134 includes a main body 1341 and a plurality of protrusions 1343 protruding from the periphery of the main body 1341. The main body 1341 may be cylindrical in shape and rotatable about its axis of rotation. The plurality of protrusions 1343 protruding from the periphery of the main body 1341 are arranged radially.

[0096] The pressure block control door 133 is located near the main body 1341 and on the rotation path of the protrusion 1343. Under the push of the protrusion 1343, the pressure block control door 133 opens relative to the outlet end of the second pipe 131b. A qualified light-emitting chip 20b is introduced from the second pipe 131b to the second transmission element 134 and then transferred from the second transmission element 134 to the third transmission element 135. Specifically, when the second transmission element 134 rotates around its axis (e.g., counterclockwise), multiple protrusions 1343 collide with the pressure block control door 133 at a preset frequency, pushing the pressure block control door 133 to open relative to the outlet end of the second pipe 131b. At this time, a qualified light-emitting chip 20b is introduced from the second pipe 131b to the second transmission element 134. Then, the qualified light-emitting chip 20b falls to the third transmission element 135 as the second transmission element 134 rotates.

[0097] The third transmission element 135 is disposed below the second transmission element 134 and is used to transfer the qualified light-emitting chip 20b transmitted from the second transmission element 134 to a predetermined position. The predetermined position may be a location in the display back panel for mounting the qualified light-emitting chip 20b, and the electrical connection between the qualified light-emitting chip 20b and the display back panel may be (e.g., soldering the qualified light-emitting chip 20b to pads on the display back panel).

[0098] The third receiving unit 136 is disposed below the second pipe 131b and the third transmission element 135, and is disposed opposite to the second transmission element 134 on both sides of the third transmission element 135, for collecting the solution flowing out of the second pipe 131b.

[0099] In this embodiment of the application, the second transmission element 134 may be a roller, and the third transmission element 135 may be a track.

[0100] In summary, in the detection and transfer device 100 of this application, the detection unit 125 performs EL detection on the light-emitting chip 20 and filters the light-emitting chip 20 according to photoelectric parameters. The unqualified light-emitting chip 20a is output through the air blowing unit 126 and the air blowing gate 127, thereby improving the quality of the light-emitting chip and thus improving the visual effect of the product. The second transfer component 130 completes the transfer of qualified light-emitting chips 20b from the light-emitting chip 20. At the same time, the third containment unit 136 can also recover the solution used in the entire transfer process, thereby reducing the transfer cost.

[0101] Please see Figure 2 This is a flowchart illustrating a detection and transfer method for a light-emitting chip disclosed in an embodiment of this application. In this embodiment, the detection and transfer method is used to... Figure 1 The detection and transfer device 100 shown detects, filters, and transfers the light-emitting chips, thereby improving the quality of the chips and enhancing the visual effect of the product. Since the detection and transfer device 100 has been described in detail in the above embodiments, the description of the detection and transfer device 100 involved in the light-emitting chip detection and transfer method in this embodiment can be directly referred to the above embodiments and will not be repeated here. Figure 2 As shown in the embodiments of this application, the detection and transfer method of the light-emitting chip may include at least the following steps.

[0102] S10. Transfer multiple light-emitting chips to the detection component through the first transfer component.

[0103] Please see Figure 3 In this embodiment, step S10 may include at least the following steps.

[0104] S11. A growth substrate having a plurality of light-emitting chips is provided, and the plurality of light-emitting chips are oriented toward and aligned with the first transfer component.

[0105] Specifically, in the embodiments of this application, such as Figure 4 As shown, a growth substrate 10 with a plurality of light-emitting chips 20 is provided. The growth substrate 10 is moved above the first transfer component 110, and the plurality of light-emitting chips 20 are oriented toward and aligned with the first transfer component 110.

[0106] S12. The light-emitting chip on the growth substrate is peeled off into the first receiving unit of the first transfer component.

[0107] Specifically, in the embodiments of this application, such as Figure 4 As shown, a laser needle can be used to laser-peel the light-emitting chip 20 at a predetermined position on the growth substrate 10 from the growth substrate 10, and the peeled light-emitting chip 20 is transferred to the first receiving unit 111 of the first transfer assembly 110. The first receiving unit 111 can be a liquid receiving tank containing a solution.

[0108] In this embodiment, the light-emitting chip 20 is a flip chip. Specifically, the weight of the electrode portion of the light-emitting chip 20 is greater than the weight of the light-emitting portion. This ensures that after the light-emitting chip 20 falls into the solution of the first containing unit 111, the electrode portion faces the bottom of the first containing unit 111, thus maintaining the chip's shape in the solution.

[0109] S13. Transfer the light-emitting chip to the detection component.

[0110] Specifically, in the embodiments of this application, such as Figure 5 As shown, the first magnetic element 112 is located below the first accommodating unit 111 and spaced apart from the bottom of the first accommodating unit 111, meaning the first accommodating unit 111 is disposed on one side of the first magnetic element 112. The first magnetic element 112 is used to keep the light-emitting chip 20 in a horizontal state within the first accommodating unit 111. The first accommodating unit 111 is connected to the detection component 120, and under the action of the first magnetic element 112, the light-emitting chip 20 is transferred to the detection component 120 through a solution. The first accommodating unit 111 also includes a first conduit 111b, which is located at the bottom of the first accommodating unit 111 and close to the first magnetic element 112. The first accommodating unit 111 is connected to the detection component 120 through the first conduit 111b, and multiple light-emitting chips 20 are transferred to the detection component 120 through the first conduit 111b under the action of the first magnetic element 112. Since the first pipe 111b is close to the first magnetic element 112, under the action of the first magnetic element 112, the light-emitting chip remains horizontal as it passes through the first pipe 111b and is transferred to the detection component 120 so as to facilitate the corresponding detection.

[0111] S20. The light-emitting chip is detected and screened by the detection component, and the qualified light-emitting chip is transferred to the second transfer component.

[0112] Please see Figure 6 In this embodiment, step S20 may include at least the following steps.

[0113] S21. The light-emitting chip is detected by the chip detection unit of the detection component.

[0114] Specifically, in the embodiments of this application, such as Figure 7 As shown, the chip detection unit 122 is disposed on one side of the first transmission element 121. The chip detection unit 122 detects the corresponding detection signal emitted by the light-emitting chip 20 and transmits the detection signal to the first clamping unit 123 and the second clamping unit 124. That is, the chip detection unit 122 is disposed at any position outside the first transmission element 121 (e.g., Figure 1As shown above the first transmission element 121, it is used to detect whether there is a light-emitting chip 20 passing through the first transmission element 121 corresponding to the position of the chip detection unit 122. When the chip detection unit 122 detects the light-emitting chip 20, it sends out a corresponding detection signal and transmits the detection signal to the first clamping unit 123 and the second clamping unit 124.

[0115] In an exemplary embodiment of this application, the first transmission element 121 may be a pipe, and the chip detection unit 122 may be an infrared sensor.

[0116] S22. The light-emitting chip is clamped and turned on by the first clamping unit and the second clamping unit of the detection component.

[0117] Specifically, in the embodiments of this application, such as Figure 8 As shown, the first clamping unit 123 and the second clamping unit 124 are located on opposite sides of the first transmission element 121, with the first clamping unit 123 adjacent to the chip detection unit 122 and located on the same side of the first transmission element 121. The positions of the first clamping unit 123 and the second clamping unit 124 are relatively aligned, and they can be relatively far apart or close together. Both the first clamping unit 123 and the second clamping unit 124 move closer to each other based on the detection signal transmitted by the chip detection unit 122 to clamp the light-emitting chip 20 after a preset time. The second clamping unit 124 is also used to turn on the light-emitting chip 20 when clamping it, causing the light-emitting chip 20 to emit light. The preset time can be calculated using the flow rate of the solution in the first transmission element 121 and the distance between the chip detection unit 122 and the first clamping unit 123.

[0118] In an exemplary embodiment, the first clamping unit 123 may be a transparent clamping block, and the second clamping unit 124 may be a conductive metal ball that can be connected to a power supply circuit. After clamping the light-emitting chip 20, the second clamping unit 124 connects to the power supply circuit to provide power to the light-emitting chip 20, so that the light-emitting chip 20 emits light.

[0119] S23. The light-emitting chip is detected by the detection unit of the detection component.

[0120] Specifically, in the embodiments of this application, such as Figure 8As shown, the detection unit 125 is disposed on the side of the first clamping unit 123 away from the first transmission element 121. The detection unit 125 performs EL detection on the light-emitting chip 20 to obtain the photoelectric parameters of the light-emitting chip 20, and filters the light-emitting chip 20 according to the photoelectric parameters. In this embodiment, the detection unit 125 is disposed on the side of the first clamping unit 123 away from the first transmission element 121, and corresponds to the light-emitting part of the light-emitting chip 20. In this application, after the second clamping unit 124 clamps the light-emitting chip 20, it turns on the power circuit. At this time, the light-emitting part of the light-emitting chip 20 emits light. Since the first clamping unit 123 is a transparent clamping block, the light emitted by the light-emitting chip 20 is transmitted to the detection unit 125 through the first clamping unit 123. The photoelectric parameters may include at least the brightness and wavelength of the light-emitting chip.

[0121] In an exemplary embodiment, the detection unit 125 detects the photoelectric parameters of the light-emitting chip 20 and filters the light-emitting chip 20 according to the photoelectric parameters to determine whether the light-emitting chip 20 is qualified.

[0122] In an exemplary embodiment of this application, the detection unit 125 may be a colorimeter.

[0123] S24. The detected defective light-emitting chips are removed through the air blowing unit and air blowing port of the detection component.

[0124] Specifically, in the embodiments of this application, such as Figure 9As shown, the air blowing unit 126 and the air blowing gate 127 are respectively located on opposite sides of the first transmission element 121 and are respectively connected to the first transmission element 121. The air blowing unit 126 is disposed adjacent to the first clamping unit 123 and the detection unit 125 and is located on the same side of the first transmission element 121. The positions of the air blowing unit 126 and the air blowing gate 127 are aligned. The air blowing unit 126 blows air onto the defective light-emitting chips 20a detected by the detection unit 125 and removes the defective light-emitting chips 20a from the first transmission element 121 through the air blowing gate 127. The air blowing gate 127 is also used to output the defective light-emitting chips 20a to a recycling device for recycling. Specifically, when the detection unit 125 detects that the light-emitting chip 20 is unqualified, the blowing unit 126 blows air onto the unqualified light-emitting chip 20a. Since the blowing unit 126 and the blowing port 127 are aligned and set together, and under the action of gravity, the unqualified light-emitting chip 20a is moved out of the first transmission element 121 through the blowing port 127. The unqualified light-emitting chip 20a that has been moved out of the first transmission element 121 is recycled into the recycling device.

[0125] In an exemplary embodiment of this application, the air blowing unit 126 may be an air blowing port.

[0126] S25. The detected qualified light-emitting chip is transferred to the second transfer component through the first transmission element of the detection component.

[0127] Specifically, in the embodiments of this application, such as Figure 9 As shown, when the detection unit 125 detects that the light-emitting chip 20 is qualified, the qualified light-emitting chip 20b is transferred to the second transfer component 130 through the first transmission element 121 for transfer.

[0128] S30. The qualified light-emitting chip is transferred to a predetermined position by the second transfer component.

[0129] Please see Figure 10 In this embodiment, step S30 may include at least the following steps.

[0130] S31. The qualified light-emitting chip transmitted by the first transmission element is received through the second accommodating unit of the second transfer component.

[0131] Specifically, in the embodiments of this application, such as Figure 11As shown, the second accommodating unit 131 is connected to the first transmission element 121, and the second accommodating unit 131 transmits qualified light-emitting chips 20b from the first transmission element 121 to the second transmission element 134. In this embodiment, the second accommodating unit 131 further includes a second channel 131b, which is located at the bottom of the second accommodating unit 131. Multiple qualified light-emitting chips 20b are transferred to the second channel 131b under the action of the second magnetic element 132.

[0132] The second magnetic element 132 is disposed below the second accommodating unit 131 and spaced apart from the bottom of the second accommodating unit 131, that is, the second accommodating unit 131 is disposed on one side of the second magnetic element 132. The second magnetic element 132 is used to keep the qualified light-emitting chip 20b in a horizontal state within the second accommodating unit 131. In this embodiment, both the first magnetic element 112 and the second magnetic element 132 can be magnets.

[0133] S32. Transfer the qualified light-emitting chip from the second accommodating unit to the second transmission element of the second transfer component.

[0134] Specifically, in the embodiments of this application, such as Figure 11 As shown, the pressure block control door 133 is connected to the outlet end of the second pipe 131b and is located between the second pipe 131b and the second transmission element 134. That is, the pressure block control door 133 is connected to the outlet end of the second pipe 131b and is close to the second transmission element 134. The pressure block control door 133 is movably connected to the outlet end of the second pipe 131b to open or close the outlet end of the second pipe 131b. The pressure block control door 133 is close to the main body 1341 of the second transmission element 134 and is located on the rotation path of the protrusion 1343 of the second transmission element 134. The pressure block control door 133 is opened relative to the outlet end of the second pipe 131b under the push of the protrusion 1343, and a qualified light-emitting chip 20b is introduced from the second pipe 131b to the second transmission element 134.

[0135] In this embodiment, the second transmission element 134 may be a roller.

[0136] S33. Transfer the qualified light-emitting chip from the second transmission element to the third transmission element of the second transfer assembly.

[0137] Specifically, in the embodiments of this application, such as Figure 11As shown, the third transmission element 135 is disposed below the second transmission element 134, and the qualified light-emitting chip 20b falls to the third transmission element 135 as the second transmission element 134 rotates.

[0138] The third receiving unit 136 is disposed below the second pipe 131b and the third transmission element 135, and is disposed opposite to the second transmission element 134 on both sides of the third transmission element 135. The third receiving unit 136 collects the solution flowing out of the second receiving unit 131 through the second pipe 131b.

[0139] In this embodiment of the application, the third transmission element 135 may be a track.

[0140] S34. Transfer the qualified light-emitting chip from the third transmission element to the predetermined position.

[0141] Specifically, in the embodiments of this application, such as Figure 11 As shown, the third transmission element 135 transfers the qualified light-emitting chip 20b transmitted from the second transmission element 134 to a predetermined position. The predetermined position may be a location in the display back panel used to mount the qualified light-emitting chip 20b, and the electrical connection between the qualified light-emitting chip 20b and the display back panel (e.g., soldering the qualified light-emitting chip 20b to pads on the display back panel).

[0142] In summary, in the detection and transfer method of the light-emitting chip of this application, the light-emitting chip is subjected to EL detection by the detection unit 125, and the light-emitting chip is screened according to photoelectric parameters. The unqualified light-emitting chip 20a is output by the air blowing unit 126 and the air blowing gate 127, thereby improving the quality of the light-emitting chip and thus improving the visual effect of the product. The second transfer component 130 completes the transfer of qualified light-emitting chip 20b. At the same time, the third containment unit 136 can also recover the solution used in the entire transfer process, thereby reducing the transfer cost.

[0143] This application also provides a display panel, which includes a display backplate and a plurality of qualified light-emitting chips 20b detected and transferred by the detection and transfer method of the light-emitting chips described in the above embodiments, or a plurality of qualified light-emitting chips 20b detected and transferred by the detection and transfer device described in the above embodiments. The plurality of qualified light-emitting chips 20b are electrically connected to the display backplate. The qualified light-emitting chips 20b may be red LED chips, green LED chips, or blue LED chips. In other embodiments, the display panel may further include a display area and a non-display area. The display area is used for image display, and the non-display area is disposed around the display area and is not used for image display. The display panel may use liquid crystal material as the display medium, but this application is not limited thereto.

[0144] Understandably, the display panel can be used in electronic devices that include functions such as a Personal Digital Assistant (PDA) and / or a music player, such as mobile phones, tablets, and wearable electronic devices with wireless communication capabilities (such as smartwatches). The aforementioned electronic devices can also be other electronic devices, such as laptops with touch-sensitive surfaces (e.g., touch panels). In some embodiments, the electronic device may have communication capabilities, i.e., it can establish communication with a network via 2G (second-generation mobile communication technology), 3G (third-generation mobile communication technology), 4G (fourth-generation mobile communication technology), 5G (fifth-generation mobile communication technology), or W-LAN (wireless local area network) or other communication methods that may emerge in the future. For the sake of simplicity, this application embodiment does not further limit this aspect.

[0145] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A detection and transfer device, characterized in that, The detection and transfer device includes a first transfer component, a detection component, and a second transfer component. The first transfer component holds a plurality of light-emitting chips. The detection component includes a first transmission element, a chip detection unit, a first clamping unit, a second clamping unit, and a detection unit. One end of the first transmission element is connected to the first transfer component and is used to transfer the light-emitting chips transferred by the first transfer component. The chip detection unit is disposed on one side of the first transmission element and emits a detection signal when it detects a light-emitting chip. The second clamping unit is disposed on opposite sides of the first transmission element and aligned with each other. It clamps the light-emitting chip after a preset time according to the detection signal and turns on the light-emitting chip. The detection unit is disposed on the side of the first clamping unit away from the first transmission element and is used to screen out qualified light-emitting chips from the light-emitting chips. The other end of the first transmission element is connected to the second transfer component, and qualified light-emitting chips are transferred to a predetermined position through the second transfer component.

2. The detection and transfer device as described in claim 1, characterized in that, The first transfer component includes a first accommodating unit and a first magnetic element. The first accommodating unit contains a solution and is disposed on one side of the first magnetic element. The first accommodating unit is connected to the first transmission element and, under the action of the first magnetic element, transfers the light-emitting chip to the first transmission element through the solution. The first magnetic element is used to keep the light-emitting chip in a horizontal state in the first accommodating unit.

3. The detection and transfer device as described in claim 1, characterized in that, The detection assembly further includes an air blowing unit and an air blowing port, wherein the air blowing unit and the air blowing port are respectively opened on opposite sides of the first transmission element, and the air blowing unit is used to remove the unqualified light-emitting chips screened out by the detection unit from the first transmission element through the air blowing port.

4. The detection and transfer device as described in claim 2, characterized in that, The second transfer assembly includes a second accommodating unit, a second magnetic component, a pressure block control gate, and a second transmission element. The second accommodating unit is connected to the first transmission element and is disposed on one side of the second magnetic component. The second magnetic component is used to keep the qualified light-emitting chip in a horizontal state in the second accommodating unit. The pressure block control door is connected to the outlet end of the second accommodating unit and is close to the second transmission element. The second transmission element controls the pressure block control door to open or close the outlet end of the second accommodating unit. When the pressure block control door is open, qualified light-emitting chips are transferred from the second accommodating unit to the second transmission element.

5. The detection and transfer device as described in claim 4, characterized in that, The second transmission element includes a main body and a plurality of protrusions protruding from the periphery of the main body. The pressure block control door is close to the main body and located on the rotation path of the protrusions. The pressure block control door opens relative to the outlet end of the second accommodating unit under the push of the protrusions, and a qualified light-emitting chip is introduced from the second accommodating unit into the second transmission element.

6. The detection and transfer device as described in claim 4, characterized in that, The second transfer assembly further includes a third transmission element and a third receiving unit, wherein the third transmission element is disposed below the second transmission element and is used to transfer a qualified light-emitting chip transmitted from the second transmission element to a predetermined position; the third receiving unit is disposed below the second receiving unit and the third transmission element and is used to collect the solution flowing out from the second receiving unit.

7. The detection and transfer apparatus according to any one of claims 1-6, characterized in that, The first transmission element is a pipe, the chip detection unit is an infrared sensor, and the detection unit is a colorimeter.

8. The detection and transfer apparatus according to any one of claims 1-6, characterized in that, The weight of the electrode portion of the light-emitting chip is greater than the weight of the light-emitting portion, and the electrode portion of the light-emitting chip is a magnetic metal.

9. A detection and transfer method for a light-emitting chip, utilizing the detection and transfer apparatus as described in any one of claims 1 to 8, characterized in that, include: Multiple light-emitting chips are transferred to the detection component via a first transfer component; The detection component detects and filters the light-emitting chips, and the qualified light-emitting chips are transferred to the second transfer component. The qualified light-emitting chip is transferred to a predetermined position by the second transfer component.

10. The detection and transfer method for a light-emitting chip as described in claim 9, characterized in that, The step of transferring multiple light-emitting chips to the detection component via a first transfer component includes: A growth substrate having a plurality of said light-emitting chips is provided, and the plurality of said light-emitting chips are oriented toward and aligned with the first transfer component; The light-emitting chip on the growth substrate is peeled off into the first receiving unit of the first transfer component; The light-emitting chip is transferred to the detection component.

11. The detection and transfer method for a light-emitting chip as described in claim 10, characterized in that, The step of detecting and screening the light-emitting chips through the detection component, and transferring the qualified light-emitting chips to the second transfer component, includes: The light-emitting chip is detected by the chip detection unit of the detection component; The light-emitting chip is gripped and turned on by the first gripping unit and the second gripping unit of the detection component; The light-emitting chip is detected by the detection unit of the detection component; The defective light-emitting chips detected are removed by the air blowing unit and air blowing port of the detection component; The detected qualified light-emitting chips are transferred to the second transfer component through the first transmission element of the detection component.

12. The detection and transfer method for a light-emitting chip as described in claim 11, characterized in that, The step of transferring the qualified light-emitting chip to a predetermined position via the second transfer component includes: The qualified light-emitting chip transmitted by the first transmission element is received by the second receiving unit of the second transfer component; The qualified light-emitting chip is transferred from the second accommodating unit to the second transmission element of the second transfer assembly; The qualified light-emitting chip is transferred from the second transmission element to the third transmission element of the second transfer assembly; The qualified light-emitting chip is transferred from the third transmission element to a predetermined position.

13. A display panel, characterized in that, The device includes a display backplane and a plurality of qualified light-emitting chips that have been detected and transferred by the detection and transfer device as described in any one of claims 1-8, wherein the plurality of qualified light-emitting chips are electrically connected to the display backplane.

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