Power module

Abstract

The power module includes two power input terminals, two main substrates, a plurality of first switches, a plurality of second switches and a bridge main unit. Each first switch includes a first control terminal, a first input terminal and a first output terminal. Each second switch includes a second control terminal, a second input terminal and a second output terminal. The bridge main unit is connected across the two main substrates and includes a first bridge subunit and a second bridge subunit. Each first bridge subunit and second bridge subunit includes a first conductive region on a bottom surface and a second conductive region and a third conductive region on a top surface. The first conductive region transmits a current signal of a current path of a switching circuit formed by the power input terminals, the first switches and the second switches. The second conductive region connects the first control terminal and the second control terminal. The third conductive region connects the first output terminal and the second output terminal.

Description

Technical Field

[0001] This invention relates to a power conversion technology, and more particularly to a power module. Background Technology

[0002] With rising environmental awareness, devices powered by renewable energy, such as electric vehicles, are gaining popularity. Electric vehicle motors have power modules for power management. The power module has two main substrates fixed to the housing. One of these main substrates has a portion of the upper arm circuit and a portion of the lower arm circuit in a switching circuit, while the other main substrate has another portion of the upper arm circuit and another portion of the lower arm circuit in the same switching circuit. The two main substrates are electrically connected by wires (e.g., through wire bonding) to form the switching circuit. Compared to the housing, the main substrate has a lower coefficient of thermal expansion; therefore, if a single main substrate is used to implement the switching circuit, it may be damaged by thermal stress.

[0003] With technological advancements, the current used in electric vehicle motors is gradually increasing. Therefore, power modules also need to be able to withstand higher currents. However, the conductors on the main circuit board are too thin to withstand large currents. While replacing the conductors with a large-area metal plate could allow for greater current handling, the larger coefficient of thermal expansion of the metal plate compared to the main circuit board could cause thermal stress between the main circuit board and the metal plate, potentially leading to damage. Summary of the Invention

[0004] In view of the above, the present invention provides a power module. The power module includes a first power input terminal, a second power input terminal, a first main substrate, a second main substrate, a plurality of first switches, a plurality of second switches, and a bridge main unit. The first power input terminal includes a plurality of first ports. The second power input terminal includes a plurality of second ports. The first main substrate includes a first surface. The second main substrate includes a second surface. Each first switch includes a first control terminal, a first input terminal, and a first output terminal. Each second switch includes a second control terminal, a second input terminal, and a second output terminal. The bridge main unit is connected across the first surface and the second surface. The bridge main unit includes at least one first bridge sub-unit and at least one second bridge sub-unit. Each first bridge sub-unit and second bridge sub-unit includes a bottom surface, a top surface opposite the bottom surface, a first conductive region, a second conductive region, and a third conductive region. The bottom surface faces the first surface and the second surface, the first conductive region is located on the bottom surface, and the second and third conductive regions are located on the top surface. At least one first bridge subunit has a first conductive region connected between the first output terminals of the first switches and the second input terminals of the second switches. At least one second bridge subunit has a first conductive region connected between the first input terminals of the first switches and the first power input terminal, or between the second output terminals of the second switches and the second power input terminal, to transmit current signals between the first power input terminal, the first switches, the second switches, and the second power input terminal. The second conductive regions of at least one first bridge subunit and at least one second bridge subunit are connected to the first control terminals of the first switches and the second control terminals of the second switches to transmit control signals for the first switches and the second switches. The third conductive regions of at least one first bridge subunit and at least one second bridge subunit are connected to the first output terminals of the first switches and the second output terminals of the second switches to transmit output signals for the first switches and the second switches.

[0005] In summary, according to some embodiments, the power module can withstand larger current signals and is less susceptible to damage from thermal stress by using the bridge master unit. In some embodiments, the bridge master unit enables the transmission of other types of signals (such as source and gate signals of the first and second switches) in addition to transmitting larger current signals between the first and second master substrates. Attached Figure Description

[0006] Figure 1 This is a three-dimensional schematic diagram of a power module according to some embodiments of the present invention.

[0007] Figure 2 This is a schematic diagram of the switching circuit of a power module according to some embodiments of the present invention.

[0008] Figure 3This is a top view schematic diagram of the power module according to the first embodiment of the present invention.

[0009] Figure 4 This is a top view schematic diagram of the power module according to the second embodiment of the present invention.

[0010] Figure 5 This is a top view schematic diagram of the power module according to the third embodiment of the present invention.

[0011] Figure 6 This is a top view schematic diagram of the power module according to the fourth embodiment of the present invention.

[0012] Figure 7 This is a bottom view of the main bridge unit according to the first embodiment of the present invention.

[0013] Figure 8 This is a bottom view of the first bridge subunit of the second embodiment of the present invention.

[0014] Figure 9 This is a bottom view of the first bridge subunit according to the third embodiment of the present invention.

[0015] Figure 10 This is a bottom view of the first bridge subunit according to the fourth embodiment of the present invention.

[0016] Figure 11 This is a bottom view of the second bridge subunit according to the second embodiment of the present invention.

[0017] Figure 12 This is a bottom view of the second bridge subunit according to the third embodiment of the present invention.

[0018] Figure 13 This is a bottom view of the second bridge subunit according to the fourth embodiment of the present invention.

[0019] [Symbol Explanation]

[0020] 1: Power Module

[0021] 10: First power input terminal

[0022] 11: First Port

[0023] 20: Second power input terminal

[0024] 21: Second Port

[0025] 30: First main substrate

[0026] SF1: First Surface

[0027] 40: Second main substrate

[0028] SF2: Second Surface

[0029] 50: First switch

[0030] G1: First control terminal

[0031] D1: First input terminal

[0032] S1: First output terminal

[0033] 60: Second switch

[0034] G2: Second control terminal

[0035] D2: Second input terminal

[0036] S2: Second output terminal

[0037] 70: Main Bridge Unit

[0038] 71: First Bridge Subunit

[0039] 72: Second Bridge Subunit

[0040] CA1: First Conduction Zone

[0041] CA2: Second Conduction Zone

[0042] CA3: Third Conduction Zone

[0043] SF3: Bottom surface

[0044] SF4: Top surface

[0045] 80: Switching circuit

[0046] 81: Upper Arm Circuit

[0047] 82: Lower Arm Circuit

[0048] AA: Current path

[0049] 91, 92: Power output terminals

[0050] 93: First driving end

[0051] 94: Second drive end

[0052] 95: First Detection Terminal

[0053] 96: Second Detection Terminal

[0054] 97: Power supply current terminal

[0055] MA1: First Installation Main Zone

[0056] MA2: Second Installation Main Zone

[0057] CD0: First power master area

[0058] CD1: First Power Sub-region

[0059] CD2: Fourth Power Sub-sector

[0060] CE0: Second power supply main area

[0061] CE1: Second power supply sub-region

[0062] CE2: Third Power Sub-region

[0063] CE3: Fifth Power Sub-region

[0064] CF1: First Control Area

[0065] CF2: Second Control Area

[0066] CH1: First Detection Main Area

[0067] CH2: Second Detection Main Area

[0068] L1, L2: Axis

[0069] 99: Thermistor

[0070] 110: First Connection Zone

[0071] 120: Second connection area

[0072] 130: Third Connection Area

[0073] 140: Fourth Connection Zone Detailed Implementation

[0074] For ease of explanation, some embodiments of the icons may show only one component, but the present invention is not limited thereto, and the number of components may be multiple.

[0075] Reference Figure 1This is a perspective view of a power module 1 according to some embodiments of the present invention. The power module 1 includes a first power input terminal 10, a second power input terminal 20, a first main substrate 30, a second main substrate 40, a plurality of first switches 50, a plurality of second switches 60, and a bridge main unit 70. The first power input terminal 10 includes a plurality of first ports 11. The second power input terminal 20 includes a plurality of second ports 21. The first main substrate 30 carries the first switches 50. The second main substrate 40 carries the second switches 60. The first power input terminal 10 and the second power input terminal 20 provide DC power to the circuit formed by the first switches 50 and the second switches 60. For example, the first power input terminal 10 provides a positive potential of the DC power, and the second power input terminal 20 provides a negative potential of the DC power. The first main substrate 30 includes a first surface SF1. The second main substrate 40 includes a second surface SF2. The bridge main unit 70 is connected across the first surface SF1 and the second surface SF2 to transmit current signals between the first power input terminal 10, the first switch 50, the second switch 60, and the second power input terminal 20; to transmit control signals for the first switch 50 and the second switch 60; and to transmit output signals for the first switch 50 and the second switch 60. In some embodiments, the first switch 50 and the second switch 60 can be implemented by electronic switches, such as insulated gate bipolar transistors (IGBTs) or circuits formed by connecting an IGBT and a diode in parallel.

[0076] In some embodiments, the first main substrate 30 and the second main substrate 40 are separate from each other. For example, the first main substrate 30 and the second main substrate 40 are arranged along a direction parallel to the long side of the first main substrate 30 and the second main substrate 40, and there is a gap between the edge of the first main substrate 30 adjacent to the second main substrate 40 and the second main substrate 40.

[0077] Reference Figure 2 This is a schematic diagram of the switching circuit 80 of the power module 1 according to some embodiments of the present invention. The first switch 50 includes a first control terminal G1, a first input terminal D1, and a first output terminal S1. For example, assuming the first switch 50 is formed by an N-type insulated-gate bipolar transistor (IGBT), then the first control terminal G1 is the gate of the IGBT, the first input terminal D1 is the drain of the IGBT, and the first output terminal S1 is the source of the IGBT. The second switch 60 includes a second control terminal G2, a second input terminal D2, and a second output terminal S2. For example, assuming the second switch 60 is formed by an IGBT, then the second control terminal G2 is the gate of the IGBT, the second input terminal D2 is the drain of the IGBT, and the second output terminal S2 is the source of the IGBT.

[0078] like Figure 2 As shown, the switching circuit 80 of the power module 1 includes an upper arm circuit 81 and a lower arm circuit 82. The upper arm circuit 81 is formed by first switches 50 connected in parallel. For example, the first input terminals D1 of the first switches 50 are connected to each other, and the first output terminals S1 of the first switches 50 are connected to each other. The lower arm circuit 82 is formed by second switches 60 connected in parallel. For example, the second input terminals D2 of the second switches 60 are connected to each other, and the second output terminals S2 of the second switches 60 are connected to each other. The upper arm circuit 81 is connected in series with the lower arm circuit 82. For example, the connected second input terminals D2 of the lower arm circuit 82 are connected to the connected first output terminals S1 of the upper arm circuit 81. A first power input terminal 10 is connected to the upper arm circuit 81, and a second power input terminal 20 is connected to the lower arm circuit 82 to provide DC power to the switching circuit 80. For example, the first power input terminal 10 is connected to the connected first input terminals D1 of the upper arm circuit 81, and the second power input terminal 20 is connected to the connected second output terminals S2 of the lower arm circuit 82.

[0079] In some embodiments, such as Figure 1 and Figure 2 As shown, the power module 1 also includes two power output terminals 91 and 92. The power output terminals 91 and 92 are connected to the series connection point between the upper arm circuit 81 and the lower arm circuit 82. For example, the power output terminals 91 and 92 are connected to the first output terminal S1 of the upper arm circuit 81 and the second input terminal D2 of the lower arm circuit 82. Thus, the power output terminals 91 and 92 can output AC power to supply power to electronic devices (e.g., motors). In some embodiments, such as... Figure 1 and Figure 2 As shown, the power module 1 also includes two drive terminals 93 and 94 (hereinafter referred to as the first drive terminal 93 and the second drive terminal 94, respectively) for connection to a drive device. The first drive terminal 93 outputs a first control signal to drive the first switch 50 of the upper arm circuit 81. The second drive terminal 94 outputs a second control signal to drive the second switch 60 of the lower arm circuit 82. For example, as Figure 2 As shown, the first control terminals G1 of the first switches 50 are connected to each other and receive a first control signal from the first drive terminal 93. The second control terminals G2 of the second switches 60 are connected to each other and receive a second control signal from the second drive terminal 94. In some embodiments, as Figure 1 and Figure 2 As shown, the power module 1 also includes two detection terminals 95 and 96 (hereinafter referred to as the first detection terminal 95 and the second detection terminal 96, respectively), for connection to a measuring device (e.g., an ammeter) to determine the current consumed by the upper arm circuit 81 and the lower arm circuit 82. For example, as Figure 2As shown, the first output terminal S1 of the upper arm circuit 81, which is connected to each other, generates a first output signal and transmits it to the first detection terminal 95. The first output signal refers to the current signal output by the first output terminal S1. The second output terminal S2 of the lower arm circuit 82, which is connected to each other, generates a second output signal and transmits it to the second detection terminal 96. The second output signal refers to the current signal output by the second output terminal S2. In some embodiments, such as Figure 1 and Figure 2 As shown, the power module 1 also includes a power supply current terminal 97 for connection to a measuring device, so that the measuring device can know the current value supplied to the switching circuit 80 (i.e., the current value of the current signal from the first power input terminal 10). For example, as Figure 2 As shown, the first power input terminal 10 outputs a current signal to the power current terminal 97.

[0080] Reference Figures 3 to 6 . Figure 3 This is a top view of the power module 1 according to the first embodiment of the present invention. Figure 4 This is a top view of the power module 1 according to the second embodiment of the present invention. Figure 5 This is a top view of the power module 1 according to the third embodiment of the present invention. Figure 6 This is a top view schematic diagram of the power module 1 according to the fourth embodiment of the present invention. The bridge main unit 70 is connected across the first surface SF1 and the second surface SF2. The bridge main unit 70 includes at least one first bridge sub-unit 71 and at least one second bridge unit 72. In some embodiments, such as Figures 4 to 6 As shown, each first bridge subunit 71 and second bridge subunit 72 is independent, meaning that each first bridge subunit 71 and second bridge subunit 72 is separate and has a distance between them. In other embodiments, such as Figure 3 As shown, the first bridge sub-unit 71 and the second bridge sub-unit 72 are connected. For example, as... Figure 3 As shown, the bridge main unit 70 is divided into two second bridge sub-units 72 and a first bridge sub-unit 71 connected between the two second bridge sub-units 72 by two axes L1 and L2 parallel to the long side direction of the first main substrate 30 and the second main substrate 40. Compared with the connected first bridge unit 71 and second bridge unit 72, the independent first bridge unit 71 and second bridge unit 72 can reduce the thermal stress effect.

[0081] Reference Figures 3 to 13 . Figure 7 This is a bottom view of the bridge main unit 70 according to the first embodiment of the present invention. Figure 8 This is a bottom view of the first bridge subunit 71 in the second embodiment of the present invention. Figure 9 This is a bottom view of the first bridge subunit 71 in the third embodiment of the present invention. Figure 10This is a bottom view of the first bridge subunit 71 in the fourth embodiment of the present invention. Figure 11 This is a bottom view of the second bridge subunit 72 according to the second embodiment of the present invention. Figure 12 This is a bottom view of the second bridge subunit 72 in the third embodiment of the present invention. Figure 13 This is a bottom view of the second bridge subunit 72 according to the fourth embodiment of the present invention. Each first bridge subunit 71 and second bridge subunit 72 includes a bottom surface SF3, a top surface SF4 opposite to the bottom surface SF3, a first conductive region CA1, a second conductive region CA2, and a third conductive region CA3. The bottom surface SF3 faces the first surface SF1 and the second surface SF2. That is, the bottom surface SF3 is the inner surface, and the top surface SF4 is the outer surface. The first conductive region CA1 is located on the bottom surface SF3. The second conductive region CA2 and the third conductive region CA3 are located on the top surface SF4.

[0082] The first conductive region CA1 of the first bridge subunit 71 is connected between the first output terminal S1 of the first switch 50 and the second input terminal D2 of the second switch 60 to transmit the current signal from the first output terminal S1 of the first switch 50 to the second input terminal D2 of the second switch 60. Specifically, the first output terminal S1 of the first switch 50 and the second input terminal D2 of the second switch 60 are connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later), and the first conductive region CA1 of the first bridge subunit 71 is connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later) to transmit the current signal from the first output terminal S1 of the first switch 50 to the second input terminal D2 of the second switch 60.

[0083] The first conductive region CA1 of the second bridge subunit 72 is connected between the first input terminal D1 and the first power input terminal 10 of the first switch 50 to transmit the current signal from the first power input terminal 10 to the first input terminal D1 of the first switch 50; or the first conductive region CA1 of the second bridge subunit 72 is connected between the second output terminal S2 and the second power input terminal 20 of the second switch 60 to transmit the current signal from the second output terminal S2 of the second switch 60 to the second power input terminal 20. Specifically, as follows... Figure 3 and Figure 4 As shown, the first input terminal D1 of the first switch 50 and the first port 11 of the first power input terminal 10 are connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later), and the first conductive area CA1 of the second bridge sub-unit 72 is connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later), so as to transmit the current signal from the first output terminal S1 of the first switch 50 to the second input terminal D2 of the second switch 60. Figure 5 and Figure 6 As shown, the second output terminal S2 of the second switch 60 and the second port 21 of the second power input terminal 20 are connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later), and the first conductive area CA1 of the second bridge sub-unit 72 is connected to the mounting main area and / or power main area of ​​the first surface SF1 and the second surface SF2 (details to be described later), so as to transmit the current signal from the second output terminal S2 of the second switch 60 to the second power input terminal 20. Thus, the first bridge sub-unit 71 and the second bridge sub-unit 72 can form a current path AA with the first power input terminal 10, the first switch 50, the second switch 60, and the second power input terminal 20 (e.g., Figure 2 As shown, a current signal is transmitted between the first power input terminal 10, the first switch 50, the second switch 60, and the second power input terminal 20. The current signal may have a current value greater than 450 amperes.

[0084] The second conductive region CA2 of the first bridge subunit 71 and the second bridge subunit 72 is connected to the first control terminal G1 of the first switch 50 and the second control terminal G2 of the second switch 60 to transmit control signals of the first switch 50 and the second switch 60. Specifically, as follows... Figures 3 to 6 As shown, the first drive terminal 93 and the second drive terminal 94 are connected to the second conductive region CA2 of the first bridge subunit 71 and / or the second bridge subunit 72 (described in detail later). The first control terminal G1 of the first switch 50 and the second control terminal G2 of the second switch 60 are connected to the main control regions of the first surface SF1 and the second surface SF2 (described in detail later). The second conductive region CA2 of the first bridge subunit 71 and the second bridge subunit 72 is connected to the main control regions of the first surface SF1 and the second surface SF2 (described in detail later). Thus, the second conductive region CA2 of the first bridge subunit 71 and the second bridge subunit 72 can transmit the first control signal and the second control signal from the first drive terminal 93 and the second drive terminal 94 to the first control terminal G1 of the first switch 50 and the second control terminal G2 of the second switch 60.

[0085] The third conduction region CA3 of the first bridge subunit 71 and the second bridge subunit 72 is connected to the first output terminal S1 of the first switch 50 and the second output terminal S2 of the second switch 60 to transmit the output signals of the first switch 50 and the second switch 60. Specifically, as follows... Figures 3 to 6As shown, the first detection terminal 95 and the second detection terminal 96 are connected to the third conductive region CA3 of the first bridge sub-unit 71 and / or the second bridge sub-unit 72 (described in detail later). The first output terminal S1 of the first switch 50 and the second output terminal S2 of the second switch 60 are connected to the main detection regions of the first surface SF1 and the second surface SF2 (described in detail later). The third conductive region CA3 of the first bridge sub-unit 71 and the second bridge sub-unit 72 is connected to the main detection regions of the first surface SF1 and the second surface SF2 (described in detail later). Thus, the third conductive region CA3 of the first bridge sub-unit 71 and the second bridge sub-unit 72 can transmit the first output signal and the second output signal from the first output terminal S1 and the second output terminal S2 to the first detection terminal 95 and the second detection terminal 96.

[0086] In some embodiments, the first main substrate 30 and the second main substrate 40 may be made of a substrate with a low coefficient of thermal expansion (e.g., a ceramic substrate). The first bridge unit 71 and the second bridge unit 72 may be made of a substrate with a low coefficient of thermal expansion. Compared to a large-area metal plate, a substrate with a low coefficient of thermal expansion is less prone to damage due to thermal stress. The mounting main area, power main area, control main area, and detection main area of ​​the aforementioned first surface SF1 and second surface SF2 are made of conductive material. The aforementioned first conductive area CA1, second conductive area CA2, and third conductive area CA3 are made of conductive material. The conductive material may specifically be a metal layer, formed by patterning a metal layer laid on the substrate through dry etching or wet etching. The material of the metal layer may be a conductive metal such as copper or aluminum. The mounting main area, power main area, control main area, and detection main area on the first surface SF1 are separated from each other and have a spacing. The mounting main area, power main area, control main area, and detection main area on the second surface SF2 are separated from each other and have a spacing. The second conduction region CA2 and the third conduction region CA3 in the same first bridge subunit 71 and second bridge subunit 72 are separated from each other and have a gap.

[0087] like Figures 3 to 6 As shown, in some embodiments, the first bridge sub-unit 71 and the second bridge sub-unit 72 are arranged along the short side direction parallel to the first main substrate 30 and the second main substrate 40. In some embodiments, the second conductive regions CA2 in the first bridge sub-unit 71 and the second bridge sub-unit 72 that transmit the same control signal can be connected to each other (e.g., connected to each other via connectors). For example, the second conductive regions CA2 in the first bridge sub-unit 71 and the second bridge sub-unit 72 that transmit the first control signal (second control signal) are connected to each other. In some embodiments, the third conductive regions CA3 in the first bridge sub-unit 71 and the second bridge sub-unit 72 that transmit the same output signal can be connected to each other (e.g., connected to each other via connectors). For example, the third conductive regions CA3 in the first bridge sub-unit 71 and the second bridge sub-unit 72 that transmit the first output signal (second output signal) are connected to each other.

[0088] like Figures 3 to 6 As shown, in some embodiments, the first main substrate 30 further includes a first mounting main area MA1 located on the first surface SF1. The second main substrate 40 further includes a second mounting main area MA2 located on the second surface SF2. The first input terminal D1 of the first switch 50 is connected to the first mounting main area MA1, and the second input terminal D2 of the second switch 60 is connected to the second mounting main area MA2. In some embodiments, the first switches 50 are arranged in a two-dimensional array in the first mounting main area MA1, and the second switches 60 are arranged in a two-dimensional array in the second mounting main area MA2. In some embodiments, the first mounting main area MA1 includes two first mounting sub-areas. Some of the first switches 50 are arranged in one of the two first mounting sub-areas along a direction parallel to the long side of the first main substrate 30 and the second main substrate 40, and other parts of the first switches 50 are arranged in the other of the two first mounting sub-areas along a direction parallel to the long side of the first main substrate 30 and the second main substrate 40. The second mounting main area MA2 includes two second mounting sub-areas. One portion of the second switches 60 are arranged in one of the two second mounting sub-regions along the long side direction parallel to the first main substrate 30 and the second main substrate 40, while the other portion of the second switches 60 are arranged in the other of the two second mounting sub-regions along the long side direction parallel to the first main substrate 30 and the second main substrate 40.

[0089] like Figures 3 to 10 As shown, in some embodiments, the first main substrate 30 further includes a first power main region CD0 located on the first surface SF1. The first power main region CD0 includes at least one first power sub-region CD1, which is connected to the first output terminal S1 of the first switch 50. The first conductive region CA1 of the first bridge sub-unit 71 is connected to the first power sub-region CD1 and the second mounting main region MA2 on both sides. In some embodiments, the first power sub-region CD1 is adjacent to the first mounting main region MA1.

[0090] For example, such as Figure 3 and Figure 4 As shown, in the first and second embodiments, the first power sub-region CD1 has a bonding main area and a connection main area, with the connection main area connected to the bonding main area. The bonding main area of ​​the first power sub-region CD1 is connected to the first output terminal S1 of the first switch 50 via a connector. The bonding main area of ​​the first power sub-region CD1 is located between the two first mounting sub-regions of the first mounting main area MA1. Figure 5 As shown, in the third embodiment, the first power supply sub-region CD1 surrounds the two first mounting sub-regions of the first mounting main region MA1 in an open ring, so that the first output terminal S1 of the first switch 50 can be connected via a connector. The notch of the open ring is located away from the bridge main unit 70. Figure 6As shown, in the fourth embodiment, the first power supply sub-region CD1 has two branch regions, located on both sides of the first mounting main region MA1, so that the first output terminal S1 of the first switch 50 can be connected via a connector.

[0091] In some embodiments, with the first conductive region CA1 of the second bridge subunit 72 connected between the first input terminal D1 and the first power input terminal 10 of the first switch 50 (described in detail later), the two power output terminals 91 and 92 are connected to the first power subregion CD1 of the first power main region CD0. For example... Figure 3 and Figure 4 As shown, in the first embodiment and the second embodiment (i.e., the first conduction region CA1 of the second bridge sub-unit 72 is connected between the first input terminal D1 of the first switch 50 and the first power input terminal 10), the two power output terminals 91 and 92 are connected to the connection main region of the first power sub-region CD1 of the first power main region CD0.

[0092] like Figures 3 to 6 As shown, in some embodiments, the second main substrate 40 further includes a second power main region CE0 located on the second surface SF2. The second power main region CE0 includes at least one second power sub-region CE1, which is connected to the second output terminal S2 and the second power input terminal 20 of the second switch 60. In some embodiments, the second power sub-region CE1 is adjacent to the second mounting main region MA2.

[0093] For example, such as Figure 3 and Figure 4 As shown, in the first and second embodiments, the second power sub-region CE1 has a connection main region and a bonding main region, with the connection main region connected to the bonding main region. The bonding main region of the second power sub-region CE1 is connected to the second output terminal S2 of the second switch 60 via a connector. The second port 21 of the second power input terminal 20 is connected to the connection main region of the second power sub-region CE1. The bonding main region of the second power sub-region CE1 is located between the two second mounting sub-regions of the second mounting main region MA2. Figure 5 As shown, in the third embodiment, the second power sub-region CE1 surrounds the second mounting main region MA2 in an open ring, allowing the second output terminal S2 of the second switch 60 to be connected via a connector. The second power sub-region CE1 is connected to the second port 21 of the second power input terminal 20 via the first conductive region CA1 of the second bridge sub-unit 72 and the fourth power sub-region CD2 of the first power main region (described in detail later). The gap in the open ring is adjacent to the bridge main unit 70. Figure 6As shown, in the fourth embodiment, the second power sub-region CE1 has two branch regions located on both sides of the second mounting main region MA2, so that the second output terminal S2 of the second switch 60 can be connected via a connector, and the second power sub-region CE1 is connected to the second port 21 of the second power input terminal 20 via the first conduction region CA1 of the second bridge sub-unit 72 and the fourth power sub-region CD2 of the first power main region (described in detail later).

[0094] like Figure 3 , Figure 4 , Figure 7 and Figure 11 As shown, in the first and second embodiments, the second power main area CE0 includes at least one third power sub-area CE2, which is connected to the first port 11 of the first power input terminal 10. The first conductive area CA1 of the second bridge sub-unit 72 is connected to the first mounting main area MA1 and the third power sub-area CE2 on both sides, respectively. Since the first mounting main area MA1 is connected to the first input terminal D1 of the first switch 50, and the third power sub-area CE2 is connected to the first port 11 of the first power input terminal 10, in the first and second embodiments, the first conductive area CA1 of the second bridge sub-unit 72 is connected between the first input terminal D1 of the first switch 50 and the first power input terminal 10 via the first mounting main area MA1 and the third power sub-area CE2.

[0095] like Figure 3 and Figure 4 As shown, in the first and second embodiments, the third power sub-region CE2 surrounds the second mounting main region MA2 and the second power sub-region CE1 to form an open ring with a gap. The bridge main unit 70 is adjacent to the gap of the open ring.

[0096] like Figure 5 , Figure 6 , Figure 12 and Figure 13As shown, in the third and fourth embodiments, the second power sub-region CE1 of the second power main region CE0 is connected to the second output terminal S2 of the second switch 60. Specifically, the second power sub-region CE1 of the second power main region CE0 is connected to the second output terminal S2 of the second switch 60 via a connector. The first power main region CD0 includes at least one fourth power sub-region CD2, which is connected to the second port 21 of the second power input terminal 20. The two sides of the first conductive region CA1 of the second bridge sub-unit 72 are respectively connected to the second power sub-region CE1 and the fourth power sub-region CD2. Since the second power sub-region CE1 is connected to the second output terminal S2 of the second switch 60, and the fourth power sub-region CD2 is connected to the second port 21 of the second power input terminal 20, in the third and fourth embodiments, the first conductive region CA1 of the second bridge sub-unit 72 is connected between the second output terminal S2 and the second power input terminal 20 of the second switch 60 via the second power sub-region CE1 and the fourth power sub-region CD2.

[0097] In some embodiments, the fourth power sub-region CD2 is adjacent to the first power sub-region CD1. For example, as Figure 5 As shown, in the third embodiment, the fourth power sub-region CD2 is located on one side of the first power sub-region CD1. Figure 6 As shown, in the fourth embodiment, the fourth power sub-region CD2 surrounds the first power sub-region CD1 and the first mounting main region MA1 in an open ring. The notch of the open ring is adjacent to the bridge main unit 70.

[0098] like Figure 5 and Figure 6 As shown, in the third and fourth embodiments (i.e., where the first conductive region CA1 of the second bridge subunit 72 is connected between the second output terminal S2 of the second switch 60 and the second power input terminal 20), the two power output terminals 91 and 92 are connected to the second mounting main region MA2. The difference from the fourth embodiment is that in the third embodiment (as shown in the image),... Figure 5As shown, the second power main area CE0 includes at least one fifth power sub-area CE3. The fifth power sub-area CE3 is adjacent to the second power sub-area CE1 of the second power main area CE0. For example, the fifth power sub-area CE3 is located on one side of the second power sub-area CE1 and away from the bridge main unit 70. The two power output terminals 91 and 92 are connected to the fifth power sub-area CE3, which is connected (specifically via a connector) to the second mounting main area MA2. The connector between the fifth power sub-area CE3 and the second mounting main area MA2 may include a first connector and a second connector. The connector is described as being implemented with wires. To withstand larger currents, the connector requires a specific number of wires. However, due to the limited length of the edge of the second mounting main area MA2 adjacent to the fifth power sub-area CE3, it may not be possible to arrange all the wires on the same plane. Therefore, by arranging a portion of the wires (first connectors) on the first plane to connect between the fifth power sub-area CE3 and the second mounting main area MA2, and arranging another portion of the wires (second connectors) on the second plane overlapping the first plane to connect between the fifth power sub-area CE3 and the second mounting main area MA2, the connectors can meet a specific number of wires.

[0099] like Figure 4 and Figure 6 As shown, in some embodiments, the first port 11 of the first power input terminal 10 and the second port 21 of the second power input terminal 20 are arranged in pairs, alternately and dispersed on the first surface SF1 of the first main substrate 30 or the second surface SF2 of the second main substrate 40, along a direction parallel to the short sides of the first main substrate 30 and the second main substrate 40. The first port 11 and the second port 21 are separated from each other and have a gap. For example, as Figure 4 As shown, a second port 21 is sandwiched between every two first ports 11, so that the first ports 11 and second ports 21 are arranged in a staggered, paired manner. That is, the first ports 11 and second ports 21 are alternately staggered. However, the invention is not limited to this; for example, as... Figure 6 As shown, the two first ports 11 adjacent to the long side of the first main substrate 30 are respectively sandwiched between two different second ports 21, and the remaining first ports 11 (i.e., the first ports 11 away from the long side of the first main substrate 30) are all sandwiched between the same two second ports 21. In this way, the parasitic inductance of the power module 1 can be reduced.

[0100] like Figure 4As shown, in some embodiments, the second power sub-region of the second power main region CE0 has a plurality of first connection regions 110 for connection to the second port 21 of the second power input terminal 20. Specifically, each first connection region 110 is for connection to one second port 21. The third power sub-region CE2 of the second power main region CE0 has a plurality of second connection regions 120 for connection to the first port 11 of the first power input terminal 10. Specifically, each second connection region 120 is for connection to one first port 11. The aforementioned connection main region of the second power main region CE0 can be formed by the first connection regions 110. The first connection regions 110 and second connection regions 120 are arranged in pairs and staggered on the second surface SF2 of the second main substrate 40 along a direction parallel to the short sides of the first main substrate 30 and the second main substrate 40. The first connection regions 110 and second connection regions 120 are separated from each other and have a spacing. For example, as... Figure 4 As shown, a second connection region 120 is sandwiched between every two first connection regions 110, so that the first connection regions 110 and the second connection regions 120 are arranged in pairs and staggered. That is, the first connection regions 110 and the second connection regions 120 are staggered one after another. In this way, the parasitic inductance of the power module 1 can be reduced.

[0101] like Figure 6 As shown, in some embodiments, the first mounting main area MA1 has a plurality of third connection areas 130 for connection to the first port 11 of the first power input terminal 10. Specifically, each third connection area 130 is connected to one first port 11. The fourth power sub-area CD2 has a plurality of fourth connection areas 140 for connection to the second port 21 of the second power input terminal 20. Specifically, each fourth connection area 140 is connected to one second port 21. The third connection areas 130 and fourth connection areas 140 are arranged in pairs and staggered on the first surface SF1 of the first main substrate 30 along a direction parallel to the short side of the first main substrate 30 and the second main substrate 40. The third connection areas 130 and fourth connection areas 140 are separated from each other and have a spacing. For example, as Figure 6 As shown, the two fourth connection regions 140 adjacent to the long side of the first main substrate 30 are sandwiched between two different third connection regions 130, and the remaining fourth connection regions 140 (i.e., the fourth connection regions 140 away from the long side of the first main substrate 30) are all sandwiched between the same two third connection regions 130. In this way, the parasitic inductance of the power module 1 can be reduced.

[0102] like Figure 4 and Figure 6As shown, in some embodiments, the first power input terminal 10 and the second power input terminal 20 each include a connecting base. A first port 11 of the first power input terminal 10 extends from the connecting base of the first power input terminal 10. A second port 21 of the second power input terminal 20 extends from the connecting base of the second power input terminal 20. The connecting bases of the first power input terminal 10 and the second power input terminal 20 may overlap each other.

[0103] like Figures 3 to 6 In some embodiments, the first main substrate 30 further includes a first control main region CF1 located on the first surface SF1. The second main substrate 40 further includes a second control main region CF2 located on the second surface SF2. The first control terminal G1 of the first switch 50 is connected to the first control main region CF1. The second control terminal G2 of the second switch 60 is connected to the second control main region CF2. The first control main region CF1 and the second control main region CF2 are connected to the second conductive region CA2 of the first bridge subunit 71 and the second bridge subunit 72.

[0104] For example, such as Figure 3 and Figure 4 As shown, in the first and second embodiments, the first control main area CF1 includes two first control sub-areas, located on both sides of the first mounting main area MA1 and adjacent to the long edge of the first main substrate 30. The second control main area CF2 includes two second control sub-areas, located on both sides of the third power sub-area CE2 of the second power main area CE0 and adjacent to the long edge of the second main substrate 40. The second conductive area CA2 of the first bridge sub-unit 71 and the second bridge sub-unit 72 includes two second conductive sub-areas, arranged along a direction parallel to the long side of the first main substrate 30 and the second main substrate 40. The first control terminal G1 of the first switch 50 is connected to the two first control sub-areas via a connector, the two first control sub-areas are connected to one of the two second conductive sub-areas of the second conductive area CA2 of the two second bridge sub-units 72 via a connector, and one of the two second conductive sub-areas of the second conductive area CA2 of the two second bridge sub-units 72 is connected to the first drive terminal 93 via a connector. In this configuration, one of the two second conductive sub-regions of the second conductive region CA2 of the two second bridge sub-units 72 is connected to each other (for example, the end of one of the two second conductive sub-regions of the second conductive region CA2 of one of the two second bridge sub-units 72 and the end of one of the two second conductive sub-regions of the second conductive region CA2 of the other two second bridge sub-units 72 are respectively connected to the two ends of one of the two second conductive sub-regions of the second conductive region CA2 of the first bridge unit 71; or one of the two second conductive sub-regions of the second conductive region CA2 of the two second bridge units 72 is connected to each other via one of the two second conductive sub-regions of the second conductive region CA2 of the first bridge unit 71 and a connector). Thus, the first control terminal G1 of the first switch 50 can obtain a first control signal from the first drive terminal 93.

[0105] The second control terminal G2 of the second switch 60 is connected to the second control sub-region via a connector. The two second control sub-regions are connected to the other of the two second conduction sub-regions of the second conduction region CA2 of the two second bridge sub-units 72 via a connector. The other of the two second conduction sub-regions of the second conduction region CA2 of one of the two second bridge units 72 is connected to the second drive terminal 94 via a connector. The other of the two second conduction sub-regions of the second conduction region CA2 of the two second bridge units 72 is connected to each other (for example, the end of the other of the two second conduction sub-regions of the second conduction region CA2 of one of the two second bridge units 72 and the end of the other of the two second conduction sub-regions of the second conduction region CA2 of the other two second bridge units 72 are respectively connected to the two ends of the other of the two second conduction sub-regions of the second conduction region CA2 of the first bridge unit 71; or the other of the two second conduction sub-regions of the second conduction region CA2 of the two second bridge units 72 are connected to each other via the other of the two second conduction sub-regions of the second conduction region CA2 of the first bridge unit 71 and a connector). Thus, the second control terminal G2 of the second switch 60 can obtain the second control signal from the second drive terminal 94.

[0106] like Figure 5 As shown, the difference from the first and second embodiments is that in the third embodiment, the first mounting main area MA1 surrounds the first control main area CF1 in an open ring, and the second mounting main area MA2 surrounds the second control main area CF2. The first control terminal G1 of the first switch 50 is connected to the first control main area CF1 via a connector. The first control main area CF1 is connected to the second conduction area CA2 of one of the two first bridge sub-units 71 via a connector. The second conduction area CA2 of one of the two first bridge sub-units 71 is connected to the first drive terminal 93 via a connector. Thus, the first control terminal G1 of the first switch 50 can obtain a first control signal from the first drive terminal 93. The second control terminal G2 of the second switch 60 is connected to the second control main area CF2 via a connector. The second control main area CF2 is connected to the second conduction area CA2 of the other of the two first bridge sub-units 71 via a connector. The second conduction area CA2 of the other of the two first bridge sub-units 71 is connected to the second conduction area CA2 of the second bridge unit 72 via a connector. The second conduction area CA2 of the second bridge unit 72 is connected to the second drive terminal 94 via a connector. Thus, the second control terminal G2 of the second switch 60 can obtain the second control signal from the second drive terminal 94.

[0107] like Figure 6As shown, the difference from the first, second, and third embodiments is that in the fourth embodiment, the first mounting main area MA1 surrounds the first control main area CF1, and the second mounting main area MA2 surrounds the second control main area CF2. The first control terminal G1 of the first switch 50 is connected to the first control main area CF1 via a connector. The first control main area CF1 is connected to the second conduction area CA2 of one of the two first bridge sub-units 71 via a connector. The second conduction area CA2 of one of the two first bridge sub-units 71 is connected to the second conduction area CA2 of one of the two second bridge sub-units 72 via a connector. The second conduction area CA2 of one of the two second bridge sub-units 72 is connected to the first drive terminal 93 via a connector. Thus, the first control terminal G1 of the first switch 50 can obtain a first control signal from the first drive terminal 93. The second control terminal G2 of the second switch 60 is connected to the second control master area CF2 via a connector. The second control master area CF2 is connected to the second conduction area CA2 of the other of the two first bridge sub-units 71 via a connector. The second conduction area CA2 of the other of the two first bridge sub-units 71 is connected to the second conduction area CA2 of the other of the two second bridge sub-units 72 via a connector. The second conduction area CA2 of the other of the two second bridge sub-units 72 is connected to the second drive terminal 94 via a connector. In this way, the second control terminal G2 of the second switch 60 can obtain a second control signal from the second drive terminal 94.

[0108] like Figure 4 and Figure 5 As shown, in some embodiments, the first control master area CF1 is provided with a plurality of first resistors, and the second control master area CF2 is provided with a plurality of second resistors. These first resistors correspond one-to-one with the first switch 50. These second resistors correspond one-to-one with the second switch 60. The first resistors have the same resistance value. The second resistors have the same resistance value. Thus, in the switching circuit 80 (e.g....) Figure 2 As shown, a first resistor is connected in series between the first control terminal G1 and the first drive terminal 93 of each first switch 50, thereby ensuring that the switching speed of all first switches 50 can be consistent. A second resistor is connected in series between the second control terminal G2 and the second drive terminal 94 of each second switch 60, thereby ensuring that the switching speed of all second switches 60 can be consistent.

[0109] like Figures 3 to 6 In some embodiments, the first main substrate 30 further includes a first detection main region CH1 located on the first surface SF1. The second main substrate 40 further includes a second detection main region CH2 located on the second surface SF2. The first output terminal S1 of the first switch 50 is connected to the first detection main region CH1. The second output terminal S2 of the second switch 60 is connected to the second detection main region CH2. The first detection main region CH1 and the second detection main region CH2 are connected to the third conductive region CA3 of the first bridge sub-unit 71 and the second bridge sub-unit 72.

[0110] For example, such as Figure 3 and Figure 4 As shown, in the first and second embodiments, the first detection main area CH1 includes two first detection sub-areas, located on both sides of the first mounting main area MA1 and adjacent to the long edge of the first main substrate 30. The second detection main area CH2 includes two second detection sub-areas, located on both sides of the third power sub-area CE2 of the second power main area CE0 and adjacent to the long edge of the second main substrate 40. The third conductive area CA3 of the first bridge sub-unit 71 and the second bridge sub-unit 72 includes two third conductive sub-areas, arranged along a direction parallel to the long side of the first main substrate 30 and the second main substrate 40. The first output terminal S1 of the first switch 50 is connected to the two first detection sub-areas via a connector, the two first detection sub-areas are connected to one of the two third conductive sub-areas of the third conductive area CA3 of the two second bridge sub-units 72 via a connector, and one of the two third conductive sub-areas of the third conductive area CA3 of the two second bridge sub-units 72 is connected to the first detection terminal 95 via a connector. In this configuration, one of the two third conductive sub-regions of the third conductive region CA3 of the two second bridge sub-units 72 is connected to each other (for example, the end of one of the two third conductive sub-regions of the third conductive region CA3 of one of the two second bridge sub-units 72 and the end of one of the two third conductive sub-regions of the third conductive region CA3 of the other of the two second bridge sub-units 72 are respectively connected to the two ends of one of the two third conductive sub-regions of the third conductive region CA3 of the first bridge sub-unit 71; or one of the two third conductive sub-regions of the third conductive region CA3 of the two second bridge sub-units 72 is connected to each other via one of the two third conductive sub-regions of the third conductive region CA3 of the first bridge unit 71 and a connector). Thus, the first output signal of the first output terminal S1 of the first switch 50 can be output to the first detection terminal 95.

[0111] The second output terminal S2 of the second switch 60 is connected to the second second detection sub-region via a connector. The second second detection sub-region is connected to the other of the two third conduction sub-regions of the third conduction region CA3 of the second second bridge sub-unit 72 via a connector. The other of the two third conduction sub-regions of the third conduction region CA3 of one of the second bridge units 72 is connected to the second detection terminal 96 via a connector. The other of the two third conduction sub-regions of the third conduction region CA3 of the second second bridge units 72 is connected to each other (for example, the end of the other of the two third conduction sub-regions of the third conduction region CA3 of one of the second bridge units 72 and the end of the other of the two third conduction sub-regions of the third conduction region CA3 of the other second bridge unit 72 are respectively connected to the two ends of the other of the two third conduction sub-regions of the third conduction region CA3 of the first bridge unit 71; or the other of the two third conduction sub-regions of the third conduction region CA3 of the second second bridge unit 72 is connected to each other via the other of the two third conduction sub-regions of the third conduction region CA3 of the first bridge unit 71 and a connector). Thus, the second output signal of the second output terminal S2 of the second switch 60 can be output to the second detection terminal 96.

[0112] like Figure 5 As shown, the difference from the first and second embodiments is that in the third embodiment, the first mounting main area MA1 surrounds the first detection main area CH1 in an open ring, and the second mounting main area MA2 surrounds the second detection main area CH2. The first output terminal S1 of the first switch 50 is connected to the first detection main area CH1 via a connector. The first detection main area CH1 is connected to the third conduction area CA3 of one of the two first bridge sub-units 71 via a connector. The third conduction area CA3 of one of the two first bridge sub-units 71 is connected to the first detection terminal 95 via a connector. Thus, the first output signal of the first output terminal S1 of the first switch 50 can be output to the first detection terminal 95. The second output terminal S2 of the second switch 60 is connected to the second detection main area CH2 via a connector. The second detection main area CH2 is connected to the third conduction area CA3 of the other of the two first bridge sub-units 71 via a connector. The third conduction area CA3 of the other of the two first bridge sub-units 71 is connected to the third conduction area CA3 of the second bridge unit 72 via a connector. The third conduction area CA3 of the second bridge unit 72 is connected to the second detection terminal 96 via a connector. In this way, the second output signal of the second output terminal S2 of the second switch 60 can be output to the second detection terminal 96.

[0113] like Figure 6As shown, the difference from the first, second, and third embodiments is that in the fourth embodiment, the first mounting main area MA1 surrounds the first detection main area CH1, and the second mounting main area MA2 surrounds the second detection main area CH2. The first output terminal S1 of the first switch 50 is connected to the first detection main area CH1 via a connector. The first detection main area CH1 is connected to the third conduction area CA3 of one of the two first bridge sub-units 71 via a connector. The third conduction area CA3 of one of the two first bridge sub-units 71 is connected to the third conduction area CA3 of one of the two second bridge sub-units 72 via a connector. The third conduction area CA3 of one of the two second bridge sub-units 72 is connected to the first detection terminal 95 via a connector. Thus, the first output signal of the first output terminal S1 of the first switch 50 can be output to the first detection terminal 95. The second output terminal S2 of the second switch 60 is connected to the second detection main area CH2 via a connector. The second detection main area CH2 is connected to the third conduction area CA3 of the other of the two first bridge sub-units 71 via a connector. The third conduction area CA3 of the other of the two first bridge sub-units 71 is connected to the third conduction area CA3 of the other of the two second bridge sub-units 72 via a connector. The third conduction area CA3 of the other of the two second bridge sub-units 72 is connected to the second detection terminal 96 via a connector. In this way, the second output signal of the second output terminal S2 of the second switch 60 can be output to the second detection terminal 96.

[0114] like Figures 3 to 5 As shown, in some embodiments, the power module 1 further includes a thermistor 99 for connection to a measuring device (e.g., an ohmmeter). Thus, the measuring device determines the temperature of the power module 1 by observing the change in the resistance value of the thermistor 99.

[0115] In some embodiments, the aforementioned connector is made of a conductive material. The conductive material can be a metal conductive wire or a metal wire strip, etc. The material of the metal conductive wire and the metal wire strip can be a conductive metal such as copper or aluminum.

[0116] In summary, according to some embodiments, the power module can withstand larger current signals and is less susceptible to damage from thermal stress by using the bridge master unit. In some embodiments, the bridge master unit enables the transmission of other types of signals (such as source and gate signals of the first and second switches) in addition to transmitting larger current signals between the first and second master substrates.

Claims

1. A power module, comprising: A first power input terminal, including multiple first ports; A second power input terminal, including multiple second ports; A first main substrate, including a first surface; A second main substrate, including a second surface; Multiple first switches, each of which includes a first control terminal, a first input terminal and a first output terminal; Multiple second switches, each second switch including a second control terminal, a second input terminal and a second output terminal; and A bridge main unit is connected across the first surface and the second surface. The bridge main unit includes at least one first bridge sub-unit and at least one second bridge unit. Each of the first bridge unit and the second bridge unit includes a bottom surface, a top surface opposite to the bottom surface, a first conductive region, a second conductive region and a third conductive region. The bottom surface faces the first surface and the second surface. The first conductive region is located on the bottom surface, and the second conductive region and the third conductive region are located on the top surface. Wherein, the first conductive region of the at least one first bridge sub-unit is connected between the first output terminals of the first switches and the second input terminals of the second switches, and the first conductive region of the at least one second bridge sub-unit is connected between the first input terminals of the first switches and the first power input terminal or between the second output terminals of the second switches and the second power input terminal, so as to transmit current signals between the first power input terminal, the first switches, the second switches and the second power input terminal; The second conductive regions of the at least one first bridge sub-unit and the at least one second bridge sub-unit are connected to the first control terminals of the first switches and the second control terminals of the second switches to transmit control signals of the first switches and the second switches. The third conductive regions of the at least one first bridge sub-unit and the at least one second bridge sub-unit are connected to the first output terminals of the first switches and the second output terminals of the second switches to transmit the output signals of the first switches and the second switches.

2. The power module as described in claim 1, wherein, The first ports and the second ports are staggered in pairs along a direction parallel to the short sides of the first main substrate and the second main substrate. They are scattered on the first surface of the first main substrate or the second surface of the second main substrate.

3. The power module as described in claim 1, wherein, The at least one first bridge unit and the at least one second bridge unit are arranged along the short side direction parallel to the first main substrate and the second main substrate.

4. The power module as described in claim 1, wherein, The first main substrate further includes a first mounting main area located on the first surface, and the second main substrate further includes a second mounting main area located on the second surface. The first input terminals of the first switches are connected to the first mounting main area, and the second input terminals of the second switches are connected to the second mounting main area.

5. The power module as described in claim 4, wherein, The first main substrate further includes a first power main area located on the first surface. The first power main area includes at least one first power sub-area and connects to the first output terminals of the first switches. The two sides of the first conductive area of ​​the at least one first bridge sub-unit are respectively connected to the at least one first power sub-area and the second mounting main area.

6. The power module as described in claim 5, wherein, The at least one first power sub-area is adjacent to the first installation main area.

7. The power module of claim 5 further includes two power output terminals, wherein the first conductive region of the at least one second bridge sub-unit is connected between the first input terminals of the first switches and the first power input terminal, and the two power output terminals are connected to the at least one first power sub-region of the first power main region.

8. The power module as described in claim 5, wherein, The second main substrate further includes a second power main area located on the second surface, the second power main area including at least one second power sub-area, which connects the second output terminals of the second switches and the second power input terminal.

9. The power module as described in claim 8, wherein, The at least one second power sub-area is adjacent to the second installation main area.

10. The power module as claimed in claim 8, wherein, With the first conductive region of the at least one second bridge sub-unit connected between the first input terminals of the first switches and the first power input terminal, the second power main region includes at least one third power sub-region connected to the first ports of the first power input terminal, and the first mounting main region and the at least one third power sub-region are respectively connected to the two sides of the first conductive region of the at least one second bridge sub-unit.

11. The power module as claimed in claim 10, wherein, The at least one third power sub-region surrounds the second mounting main region and the at least one second power sub-region to form an open ring with a gap, and the bridge main unit is adjacent to the gap.

12. The power module as claimed in claim 10, wherein, The at least one second power sub-region has a plurality of first connection areas for connecting to the second ports of the second power input terminal, and the at least one third power sub-region has a plurality of second connection areas for connecting to the first ports of the first power input terminal. The first connection areas and the second connection areas are arranged in pairs and staggered on the second surface of the second main substrate along the direction parallel to the short side of the first main substrate and the second main substrate.

13. The power module as claimed in claim 8, wherein, With the first conductive region of the at least one second bridge sub-unit connected between the second output terminals and the second power input terminals of the second switches, at least one second power sub-region of the second power main region is connected to the second output terminals of the second switches. The first power main region includes at least one fourth power sub-region, which is connected to the second ports of the second power input terminals. The two sides of the first conductive region of the at least one second bridge sub-unit are respectively connected to the at least one second power sub-region and the at least one fourth power sub-region.

14. The power module as claimed in claim 13, wherein, The at least one fourth power sub-region is adjacent to the at least one first power sub-region.

15. The power module as claimed in claim 13, wherein, The first mounting main area has a plurality of third connection areas for connecting the first ports of the first power input terminal, and the at least one fourth power sub-area has a plurality of fourth connection areas for connecting the second ports of the second power input terminal. The third connection areas and the fourth connection areas are arranged in pairs and staggered on the first surface of the first main substrate along the direction parallel to the short side of the first main substrate and the second main substrate.

16. The power module of claim 8 further includes two power output terminals, wherein the two power output terminals are connected to the second mounting main area, wherein the first conductive region of the at least one second bridge subunit is connected between the second output terminals of the second switches and the second power input terminal.

17. The power module as claimed in claim 16, wherein, The second power main area includes at least one fifth power sub-area, the two power output terminals are connected to the at least one fifth power sub-area, and the at least one fifth power sub-area is connected to the second mounting main area.

18. The power module as claimed in claim 16, wherein, The at least one fifth power sub-region is adjacent to the at least one second power sub-region.

19. The power module as claimed in claim 1, wherein, The first main substrate further includes a first control main region located on the first surface, and the second main substrate further includes a control main region located on the second surface. A second control master area, wherein the first control terminals of the first switches are connected to the first control master area, the second control terminals of the second switches are connected to the second control master area, and the first control master area and the second control master area are connected to the second conduction areas of the at least one first bridge sub-unit and the at least one second bridge sub-unit.

20. The power module as claimed in claim 1, wherein, The first main substrate further includes a first detection main area located on the first surface, and the second main substrate further includes a second detection main area located on the second surface. The first output terminals of the first switches are connected to the first detection main area, and the second output terminals of the second switches are connected to the second detection main area. The first detection main area and the second detection main area are connected to the third conductive areas of the at least one first bridge sub-unit and the at least one second bridge sub-unit.

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