Electronic devices and methods of making the same

Abstract

The application discloses an electronic device and a preparation method thereof. The electronic device comprises a substrate, a first pad, a trace and a first conductive layer. The first pad is arranged on a first surface of the substrate. A first end of the trace is arranged on at least part of a surface of the first pad and is electrically connected with the first pad. The first conductive layer covers at least part of the first end of the trace and is electrically connected with the first pad and the trace. The electronic device provided by the application can reduce the contact resistance between the first pad and the trace and increase the bonding force between the first pad and the trace.

Description

Technical Field

[0001] This application belongs to the field of electronic device technology, and in particular relates to an electronic device and its preparation method. Background Technology

[0002] With the development of technology, electronic devices are ubiquitous in daily life. In electronic devices, pads are typically connected to signal lines to achieve signal transmission.

[0003] Existing solutions generally suffer from problems such as high resistance between the pads and signal lines, and high power consumption. Summary of the Invention

[0004] This application provides an electronic device and a method for fabricating the same, which can reduce the contact resistance between the first pad and the trace and increase the bonding force between the first pad and the trace.

[0005] A first aspect of this application provides an electronic device, the electronic device comprising: a substrate; a first pad disposed on a first surface of the substrate; a trace having a first end disposed on at least a portion of the surface of the first pad and electrically connected to the first pad; and a first conductive layer covering at least a portion of the first end of the trace and simultaneously electrically connected to both the first pad and the trace.

[0006] Wherein, the first end of the trace is disposed on a portion of the surface of the first pad, and the first conductive layer extends from the first end of the trace to the portion of the first pad not covered by the trace.

[0007] Wherein, the orthographic projection of the first conductive layer on the first pad covers the orthographic projection of the trace on the first pad; preferably, the orthographic projection of the first conductive layer on the first surface of the substrate covers the orthographic projection of the trace on the first surface of the substrate.

[0008] Wherein, the first conductive layer is made of the same material as the first pad; preferably, the material of the trace is different from the material of the first conductive layer.

[0009] The first pad includes a third surface facing away from the substrate and a first side surface and a second side surface adjacent to the third surface. The first side surface and the second side surface are disposed opposite to each other. The first end of the trace extends from the first side surface, through the third surface, to the second side surface. Preferably, the first pad further includes a third side surface and a fourth side surface disposed opposite to each other. The third side surface is adjacent to the first side surface, and the fourth side surface is adjacent to the second side surface. Both the third side surface and the fourth side surface are exposed.

[0010] The first pad includes a plurality of conductive blocks stacked sequentially. In the plurality of conductive blocks, the orthographic projection of any conductive block on the substrate is covered by the orthographic projection of another conductive block located between the conductive block and the substrate and adjacent to the conductive block on the substrate. Preferably, the central axes of the plurality of conductive blocks coincide.

[0011] The electronic device further includes: a second pad disposed on a second surface of the substrate opposite to the first surface, wherein a second end of the trace is disposed on at least a portion of the surface of the second pad and electrically connected to the second pad; a second conductive layer covering at least a portion of the second end of the trace and electrically connected to both the second pad and the trace; preferably, the second end of the trace is disposed on a portion of the surface of the second pad, and the second conductive layer extends from the second end of the trace to a portion of the second pad not covered by the trace; preferably, the material of the second conductive layer is the same as the material of the second pad; preferably, the material of the second conductive layer is different from the material of the trace; preferably, the material of the second pad is the same as the material of the first pad.

[0012] A second aspect of this application provides a method for fabricating an electronic device, the method comprising: forming a first pad on a first surface of a substrate; forming a trace, wherein a first end of the trace is disposed on at least a portion of the surface of the first pad and electrically connected to the first pad; and forming a first conductive layer, wherein the first conductive layer covers at least a portion of the first end of the trace and is electrically connected to both the first pad and the trace.

[0013] The step of forming a first pad on the first surface of the substrate includes: forming a plurality of conductive blocks stacked sequentially on the first surface of the substrate, wherein, among the plurality of conductive blocks, the orthographic projection of any conductive block on the substrate is covered by the orthographic projection of another conductive block located between the conductive block and the substrate and adjacent to the conductive block on the substrate.

[0014] The step of forming a first pad on the first surface of the substrate includes: forming a plurality of first pads spaced apart on the first surface of the substrate; and / or, the step of forming traces includes: forming traces corresponding to each of the plurality of first pads; and / or, the step of forming a first conductive layer includes: forming a conductive layer on the first surface of the substrate that simultaneously covers the plurality of first pads and the plurality of traces; and patterning the conductive layer to at least remove the conductive layer located between two adjacent first pads.

[0015] In the electronic device of this application, the first conductive layer covers at least a portion of the first end of the trace and is electrically connected to both the first pad and the trace. This reduces the contact resistance between the first pad and the trace and increases the bonding force between the first pad and the trace, preventing the trace from detaching from the first pad. Furthermore, due to the coverage of the first conductive layer, the portion of the trace covered by the first conductive layer is protected from external water and oxygen intrusion, thus providing protection for the trace. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of the structure of one embodiment of the electronic device of this application; Figure 2 yes Figure 1 A schematic diagram of the electronic device when it is positioned at another angle; Figure 3 yes Figure 1 A schematic diagram of a substrate and multiple traces in an electronic device; Figure 4 yes Figure 2 Enlarged structural diagram of the first pad in the middle; Figure 5 This is a solution found in existing technology; Figure 6 This is a schematic flowchart of one embodiment of the method for fabricating the electronic device of this application; Figure 7 It corresponds Figure 6 Schematic diagram of the preparation process of the method; Figure 8 This is a diagram illustrating the fabrication process of forming the first and second pads on a substrate in an application scenario. Figure 9 This is a diagram illustrating the fabrication process of forming the first and second pads on a substrate in another application scenario. Figure 10 This is a diagram illustrating the fabrication process of forming the first and second conductive layers in an application scenario. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] First, it should be noted that the electronic device protected by this application can be any type of device. For example, the electronic device is a display panel, and the display panel frame can be any type of display panel such as a Micro-LED display panel or an LCD display panel, or the electronic device is a sound-emitting device, a sound-collecting device, etc.

[0019] See Figure 1 and Figure 2 In one embodiment of this application, the electronic device 100 includes a substrate 110, a first pad 120, a trace 130, a first conductive layer 140, a second pad 150, and a second conductive layer 160. Figure 2 It is along Figure 1 The structure of the electronic device 100 is observed from direction A.

[0020] The substrate 110 serves a supporting function and can be any type of support plate, such as a glass plate or a plastic plate. The substrate 110 includes a first surface 1101 and a second surface 1102 disposed opposite to each other.

[0021] The first pad 120 is disposed on the first surface 1101 of the substrate 110; the second pad 150 is disposed on the second surface 1102 of the substrate 110.

[0022] The first end 1301 of the trace 130 is disposed on at least a portion of the surface of the first pad 120 and electrically connected to the first pad 120. The second end 1302 of the trace 130 is disposed on at least a portion of the surface of the second pad 150 and electrically connected to the second pad 150. That is, the trace 130 is electrically connected to the first pad 120 and the second pad 150. It can be understood that since the first pad 120 and the second pad 150 are respectively disposed on opposite sides of the substrate 110, the trace 130 passes through the side of the substrate 110.

[0023] The first conductive layer 140 covers at least a portion of the first end 1301 of the trace 130 and is electrically connected to both the first pad 120 and the trace 130.

[0024] Specifically, the first conductive layer 140 covers at least a portion of the first end 1301 of the trace 130 and is electrically connected to both the first pad 130 and the trace 130. This can prevent the covered portion of the trace 130 from being invaded by external water and oxygen, and can also increase the bonding force between the trace 130 and the first pad 120, preventing the trace 130 from detaching from the first pad 120.

[0025] Combination Figure 1 and Figure 2 In this embodiment, the first end 1301 of the trace 130 is disposed on a portion of the surface of the first pad 120, and the first conductive layer 140 extends from the first end 1301 of the trace 130 to the portion of the first pad 120 not covered by the trace 130.

[0026] In other words, the first end 1301 of the trace 130 will not cover the entire surface of the first pad 120.

[0027] This configuration serves two purposes. First, it allows the surface of the first pad 120 not covered by the trace 130 to be electrically connected to the trace 130 through the first conductive layer 140, increasing the contact area between the first pad 120 and the trace 130. This reduces the contact resistance between the first pad 120 and the trace 130 and increases the bonding force between them, preventing the trace 130 from detaching from the first pad 120. Second, due to the coverage of the first conductive layer 140, the portion of the trace 130 covered by the first conductive layer 140 and the portion of the first pad 120 covered by the trace 130 are protected from external water and oxygen intrusion, thus protecting the trace 130.

[0028] Experiments have shown that, due to the aforementioned configuration of the first conductive layer 140, the contact resistance between the trace 130 and the first pad 120 can be reduced by up to 50%.

[0029] It should be noted that in other embodiments, the trace 130 may also completely cover the first pad 120, in which case the first conductive layer 140 does not directly contact the first pad 120.

[0030] The second conductive layer 160 covers at least a portion of the second end 1302 of the trace 130 and is electrically connected to both the second pad 150 and the trace 130.

[0031] In this embodiment, combined with Figure 1 and Figure 2 The second end 1302 of the trace 130 is disposed on a portion of the surface of the second pad 150, and the second conductive layer 160 extends from the second end 1302 of the trace 130 to the portion of the second pad 150 not covered by the trace 130.

[0032] In other words, the second end 1302 of trace 130 will not cover the entire surface of the second pad 150.

[0033] The relative positions of the second pad 150, the second end 1302 of the trace 130, and the second conductive layer 160 are the same as those of the first pad 120, the first end 1301 of the trace 130, and the first conductive layer 140. For details, please refer to the above-mentioned content, which will not be repeated here.

[0034] It should be noted that, in other embodiments, the electrical connection between the second pad 150 and the trace 130 can be the same as any electrical connection method in the prior art. Also in other embodiments, the first pad 120 and the second pad 150 can be disposed on the same surface of the substrate 110.

[0035] In this embodiment, such as Figure 1 and Figure 3 As shown, there are multiple first pads 120, traces 130 and second pads 150. Multiple first pads 120 are spaced apart, multiple second pads 150 are spaced apart, and multiple first pads 120, multiple traces 130 and multiple second pads 150 are arranged in a one-to-one correspondence. At the same time, multiple traces 130 are all arranged on the same side of the substrate 110.

[0036] It should be noted that in other embodiments, the multiple traces 130 may not be located on the same side of the substrate 110. Similarly, the multiple first pads 120 may not be located on the same side of the substrate 110, and the multiple second pads 150 may not be located on the same side of the substrate 110. This is as long as each trace 130 can electrically connect the corresponding first pad 120 and the corresponding second pad 150.

[0037] It should be noted that in other embodiments, the number of the first pad 120, the trace 130, and the second pad 150 can all be one.

[0038] It should be noted that Figure 3 Only the substrate 110 and the traces 130 are shown to illustrate that multiple traces 130 are arranged on the same side of the substrate 110, and do not represent that from... Figure 2 From the angle shown, other components such as the first pad 120, the first conductive layer 140, the second pad 150, and the second conductive layer 160 are not visible.

[0039] Combination Figure 1 and Figure 2In order to further enhance the protective effect of the first conductive layer 140 on the trace 130 and increase the bonding force between the first pad 120 and the trace 130, the orthographic projection of the first conductive layer 140 on the first pad 120 covers the orthographic projection of the trace 130 on the first pad 120. That is, the part of the trace 130 located on the first pad 120 is completely covered by the first conductive layer 140.

[0040] Simultaneously combined Figure 1 and Figure 2 To further enhance the protective effect of the first conductive layer 140 on the trace 130, the orthographic projection of the first conductive layer 140 on the first surface 1101 of the substrate 110 covers the orthographic projection of the trace 130 on the first surface of the substrate 110. In other words, the portion of the trace 130 located on the first surface 1101 of the substrate 110 is completely covered by the first conductive layer 140. When looking down at the first surface 1101 of the substrate 110 from directly above the substrate 110, the trace 130 cannot be observed.

[0041] It should be noted that in other embodiments, the orthographic projection of the first conductive layer 140 on the first pad 120 may only cover the portion of the orthographic projection of the trace 130 on the first pad 120, or the orthographic projection of the first conductive layer 140 on the first pad 120 may cover the orthographic projection of the trace 130 on the first pad 120, but the orthographic projection of the first conductive layer 140 on the first surface 1101 of the substrate 110 may only cover the portion of the orthographic projection of the trace 130 on the first surface 1101 of the substrate 110.

[0042] In this embodiment, the first conductive layer 140 and the first pad 120 are made of the same material. Specifically, setting the first conductive layer 140 to be made of the same material as the first pad 120 ensures the connection strength between the first conductive layer 140 and the trace 130. In one application scenario, considering that copper is an readily available, low-cost material with good conductivity, both the first conductive layer 140 and the first pad 120 are made of copper. In other application scenarios, the materials of the first pad 120 and the first conductive layer 140 can also be other conductive materials such as molybdenum.

[0043] In other embodiments, the materials of the first conductive layer 140 and the first pad 120 may be different, as long as both materials are conductive.

[0044] Furthermore, this embodiment also features a first conductive layer 140 made of a different material than the trace 130. Specifically, compared to the trace 130, the first conductive layer 140 can be made of a material with stronger corrosion resistance, thereby providing better protection for the trace 130. In one application scenario, the material of the trace 130 includes, but is not limited to, copper paste, silver paste, etc.

[0045] Continue reading Figure 1 and Figure 2 In this embodiment, the first pad 120 includes a third surface 1201 facing away from the substrate 110 and a first side surface 1202 and a second side surface 1203 adjacent to the third surface 1201. The first side surface 1202 and the second side surface 1203 are arranged opposite to each other. The first end 1301 of the trace 130 extends from the first side surface 1202, through the third surface 1201 to the second side surface 1203.

[0046] Specifically, the first end 1301 of the trace 130 extends from the first side 1202, through the third surface 1201 of the first pad 120, to the second side 1203, which can ensure the contact area between the trace 130 and the first pad 120, thereby ensuring the bonding strength between the two.

[0047] Meanwhile, the first pad 120 further includes a third side 1024 and a fourth side 1025 disposed opposite to each other. The third side 1024 is adjacent to the first side 1202, and the fourth side 1025 is adjacent to the second side 1203. Both the third side 1204 and the fourth side 1205 are exposed.

[0048] Specifically, the third side 1204 and the fourth side 1205 of the first pad 120 are not covered by the first conductive layer 140, which can prevent bridging and short circuits between two adjacent first pads 120.

[0049] Of course, in other embodiments, the third side 1204 and the fourth side 1205 of the first pad 120 can also be covered by the first conductive layer 140, provided that the two adjacent first pads 120 do not short-circuit.

[0050] Combination Figure 2 and Figure 4 The first pad 120 includes a plurality of conductive blocks 121 stacked sequentially. Among the plurality of conductive blocks 121, the orthographic projection of any conductive block 121 on the substrate 110 is covered by the orthographic projection of another conductive block 121 located between the conductive block 121 and the substrate 110 and adjacent to the conductive block 121 on the substrate 110.

[0051] Specifically, in the direction away from the substrate 110, a plurality of conductive blocks 121 are stacked sequentially, and the orthogonal projection of the plurality of conductive blocks 121 on the substrate 110 gradually decreases, so that the structure of the first pad 120 is a pyramid-like structure.

[0052] See Figure 5 In the prior art, the surface of the pad 1 facing away from the substrate 2 is a plane, and the contact between the trace 3 and the pad 1 is a planar contact.

[0053] Simultaneously, an etching process is typically used to form the pad 1. This process includes: forming a conductive layer on the surface of the substrate 2, then etching the conductive layer to remove excess conductive layer, and the final conductive layer remaining is the pad 1. Due to limitations in etching process capabilities, there is an upper limit to the thickness of the conductive layer when forming it. Therefore, the height of the resulting pad 1 is limited, and the contact area between the pad 1 and the trace 3 is limited, which may cause the contact resistance between the pad 1 and the trace 3 to not meet expectations.

[0054] In this embodiment, the structure of the first pad 120 is configured as a pyramid-like structure, so that the contact between the first pad 120 and the trace 130 is a three-dimensional contact. During the fabrication process, the first pad 120 can be formed by a layer etching process, which generally includes: A first conductive layer is formed on the surface of the substrate 110, and then the first conductive layer is etched to obtain a first conductive block 121. A second conductive layer is then formed to cover the first conductive block 121, and then the second conductive layer is etched to obtain a second conductive block 121, and so on. The detailed process is described below.

[0055] Alternatively, a first conductive layer may be formed on the substrate 110, and then the first conductive layer may be etched layer by layer to obtain a plurality of stacked conductive blocks 121. This process is detailed below.

[0056] The first pad 120 is formed by the above-mentioned layer etching process. On the one hand, it can increase the surface area of ​​the first pad 120, increase the contact area between the trace 130 and the first pad 120, and reduce the contact resistance between the trace 130 and the first pad 120. On the other hand, it is not required that the orthographic projections of the conductive blocks 121 obtained by the two consecutive etchings on the substrate 110 completely overlap, which can reduce the alignment requirements and reduce the manufacturing difficulty.

[0057] Experiments have shown that the pyramid-like design of the first pad 120 can double the contact area between the first pad 120 and the trace 130, and reduce the contact resistance by 50%.

[0058] In this embodiment, such as Figure 2 and Figure 4 As shown, the central axes L of the multiple conductive blocks 121 coincide, making the first pad 120 a symmetrical structure. Of course, in other embodiments, the central axes of the multiple conductive blocks 121 may not coincide.

[0059] It should be noted that in other embodiments, the first pad 120 can also be set as Figure 5 The structure of pad 1 in the middle.

[0060] The structure and relative position of the first pad 120, the first end 1301 of the trace 130, and the first conductive layer 140 have been described above. The relative position of the second pad 150, the second end 1302 of the trace 130, and the second conductive layer 160 is the same as that of the first pad 120, the first end 1301 of the trace 130, and the first conductive layer 140, so it will not be described again. Please refer to the relevant content above for details.

[0061] It should be noted that the material of the second pad 150 can be the same as or different from that of the first pad 120. The material of the second conductive layer 160 can also be the same as or different from that of the first conductive layer 140, and can be flexibly set according to requirements.

[0062] The structure of electronic device 100 has been described above. The fabrication process of electronic device 100 will be described below, in conjunction with... Figure 6 and Figure 7 The process includes: S110: A first pad 120 is formed on the first surface 1101 of the substrate 110.

[0063] When the electronic device 100 also includes a second pad 150, in step S110, while forming the first pad 120, the second pad 150 is also formed on the second surface 1102 of the substrate 110. That is, the second pad 150 is formed simultaneously with the first pad 120. For ease of explanation, the formation process of the first pad 120 will be described in detail below.

[0064] When the first pad 120 includes a plurality of conductive blocks 121 stacked sequentially, the process includes: forming a plurality of conductive blocks 121 stacked sequentially on the first surface 1101 of the substrate 110, wherein, among the plurality of conductive blocks 121, the orthographic projection of any conductive block 121 on the substrate 110 is covered by the orthographic projection of another conductive block 121 located between the conductive block 121 and the substrate 110 and adjacent to the conductive block 121 on the substrate 110.

[0065] Among them, combined Figure 8 In one application scenario, the formation process of the first pad 120 includes: (a1) First, a first conductive layer 101 is formed on the first surface 1101 of the substrate 110, and then the first conductive layer 101 is exposed, developed and etched to obtain the first conductive block 121.

[0066] (b1) A second conductive layer 102 is formed covering the first conductive block 121, and then the second conductive layer 102 is exposed, developed and etched to obtain the second conductive block 121.

[0067] (c1) A third conductive layer 103 is formed covering the second conductive block 121. Then, the third conductive layer 103 is exposed, developed and etched to obtain the third conductive block 121, and finally the first pad 120 is obtained.

[0068] Combination Figure 9 In another application scenario, the process of forming the first pad 120 can also be: (a1) First, a first conductive layer 101 is formed on the first surface 1101 of the substrate 110. Using the first mask A as a mask, the first conductive layer 101 is exposed, developed and etched to obtain the first conductive block 121. At this time, during etching, the area not covered by the first mask A will not be completely etched away. (b1) Using the second mask B as a mask, the remaining first conductive layer 101 is exposed and developed to obtain the second conductive block 121. The size of the second mask B is smaller than the size of the first mask A.

[0069] (c1) Using the third mask B as a mask, the remaining first conductive layer 101 is exposed and developed to obtain the third conductive block 121, and finally the first pad 120 is obtained. The size of the third mask C is smaller than the size of the second mask B.

[0070] S120: Forming a trace 130, wherein a first end 1301 of the trace 130 is disposed on at least a portion of the surface of the first pad 120 and is electrically connected to the first pad 120.

[0071] When the second surface 1102 of the substrate 110 is also provided with a second pad 150, the second end 1302 of the trace 130 is provided on at least a portion of the surface of the second pad 150 and is electrically connected to the second pad 150.

[0072] S130: Form a first conductive layer 140, wherein the first conductive layer 140 covers at least a portion of the first end 1301 of the trace 130 and is electrically connected to the first pad 120 and the trace 130.

[0073] When the electronic device 100 also includes a second pad 150, step S130 forms a second conductive layer 160 simultaneously with the formation of the first conductive layer 140. The second conductive layer 160 covers at least a portion of the second end 1302 of the trace 130 and is electrically connected to both the second pad 150 and the trace 130.

[0074] When there are multiple instances of the first pad 120, trace 130, and second pad 150, refer to [the relevant documentation]. Figure 10Step S130 specifically includes: forming a conductive layer 170 on the first surface 1101 of the substrate 110 that simultaneously covers multiple first pads 120 and multiple traces 130; patterning the first conductive layer 170 to at least remove the conductive layer 170 located between two adjacent first pads 120, and finally obtaining the first conductive layer 140 corresponding to each first pad 120.

[0075] Specifically, the formed conductive layer 170 covers multiple first pads 120 and multiple traces 130. Then, the conductive layer 170 is patterned, that is, the conductive layer 170 is subjected to exposure, development and etching processes to form multiple patterns on the conductive layer 170, and finally the first conductive layer 140 corresponding to each first pad 120 is obtained. The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: substrate; A first pad is disposed on a first surface of the substrate; the first pad includes a third surface facing away from the substrate and a first side surface and a second side surface adjacent to the third surface, the first side surface and the second side surface being disposed opposite to each other; the first pad includes a plurality of conductive blocks stacked sequentially, wherein the orthographic projection of any conductive block on the substrate is covered by the orthographic projection of another conductive block located between the conductive block and the substrate and adjacent to the conductive block on the substrate. The trace has a first end disposed on at least a portion of the surface of the first pad and electrically connected to the first pad; the first end of the trace extends from the first side surface, through the third surface, to the second side surface; A first conductive layer covers at least a portion of the first end of the trace and is electrically connected to both the first pad and the trace.

2. The electronic device according to claim 1, characterized in that, The first end of the trace is disposed on a portion of the surface of the first pad, and the first conductive layer extends from the first end of the trace to the portion of the first pad not covered by the trace.

3. The electronic device according to claim 1, characterized in that, The orthographic projection of the first conductive layer on the first pad covers the orthographic projection of the trace on the first pad.

4. The electronic device according to claim 1, characterized in that, The orthographic projection of the first conductive layer on the first surface of the substrate overlaps the orthographic projection of the trace on the first surface of the substrate.

5. The electronic device according to claim 1, characterized in that, The first conductive layer is made of the same material as the first pad.

6. The electronic device according to claim 1, characterized in that, The material of the trace is different from the material of the first conductive layer.

7. The electronic device according to claim 1, characterized in that, The first pad further includes a third side and a fourth side disposed opposite to each other, the third side being adjacent to the first side and the fourth side being adjacent to the second side, wherein both the third side and the fourth side are exposed.

8. The electronic device according to claim 1, characterized in that, The central axes of the plurality of conductive blocks coincide.

9. The electronic device according to claim 1, characterized in that, The electronic device further includes: The second pad is disposed on a second surface of the substrate opposite to the first surface, wherein the second end of the trace is disposed on at least a portion of the surface of the second pad and is electrically connected to the second pad; A second conductive layer covers at least a portion of the second end of the trace and is electrically connected to both the second pad and the trace.

10. The electronic device according to claim 9, characterized in that, The second end of the trace is disposed on a portion of the surface of the second pad, and the second conductive layer extends from the second end of the trace to the portion of the second pad not covered by the trace.

11. The electronic device according to claim 9, characterized in that, The material of the second conductive layer is the same as the material of the second pad.

12. The electronic device according to claim 9, characterized in that, The material of the second conductive layer is different from the material of the trace.

13. The electronic device according to claim 9, characterized in that, The material of the second pad is the same as that of the first pad.

14. A method for fabricating an electronic device, characterized in that, The preparation method includes: A first pad is formed on a first surface of a substrate; the first pad includes a third surface facing away from the substrate and a first side surface and a second side surface adjacent to the third surface, wherein the first side surface and the second side surface are disposed opposite to each other; A trace is formed, wherein a first end of the trace is disposed on at least a portion of the surface of the first pad and is electrically connected to the first pad; the first end of the trace extends from the first side surface, through the third surface, to the second side surface; A first conductive layer is formed, wherein the first conductive layer covers at least a portion of a first end of the trace and is electrically connected to both the first pad and the trace. The step of forming a first pad on the first surface of the substrate includes: A plurality of conductive blocks are formed on the first surface of the substrate in sequence, wherein, among the plurality of conductive blocks, the orthographic projection of any conductive block on the substrate is covered by the orthographic projection of another conductive block located between the conductive block and the substrate and adjacent to the conductive block on the substrate.

15. The preparation method according to claim 14, characterized in that, The step of forming a first pad on a first surface of a substrate includes: A plurality of first pads are formed at intervals on the first surface of the substrate; And / or, the step of forming the trace includes: Each of the first pads is formed with its corresponding trace. And / or, the step of forming the first conductive layer includes: A conductive layer is formed on the first surface of the substrate, simultaneously covering multiple first pads and multiple traces; The conductive layer is patterned to at least remove the conductive layer located between two adjacent first pads.

Images