Display panel, manufacturing method and electronic device

Abstract

The present disclosure provides a display panel, a manufacturing method and an electronic device, wherein the display panel comprises a plurality of pixel units and a photosensitive layer, the photosensitive layer is arranged on the light-emitting side of the pixel units, and the photosensitive layer is configured to generate photo-generated carriers under light to represent the ambient light characteristics of the environment in which the display panel is located. By arranging the photosensitive layer on the light-emitting side of the pixel units, the area of the photosensitive layer receiving ambient light is improved, and the photosensitive layer is not disturbed by the self-emission of the pixel units, so that the photosensitive layer can accurately reflect the ambient light intensity and other ambient light characteristics, thereby improving the recognition accuracy of the photosensitive layer integrated in the display panel. When the display panel is applied to the electronic device, the electronic device can accurately provide appropriate color temperature and illumination for the user according to the change of the photo-generated carriers.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method, and an electronic device. Background Technology

[0002] An ambient light sensor is a device that converts light signals into electrical signals based on the photoelectric effect. It is used to detect ambient light levels, color, and other information, enabling electronic devices to automatically adjust the brightness and color temperature of their displays under different ambient light conditions, thus providing users with a better visual experience.

[0003] Currently, in order to increase the screen-to-body ratio of the display area, ambient light sensors for electronic devices are generally placed in the narrow gaps of the electronic device's bezel or directly under the screen. However, these settings result in less ambient light being received by the ambient light sensor, reducing its resolution. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this disclosure provides a display panel, a manufacturing method, and an electronic device.

[0005] According to a first aspect of the present disclosure, a display panel is provided, the display panel comprising:

[0006] Multiple pixel units;

[0007] A photosensitive layer is disposed on the light-emitting side of the pixel unit. The photosensitive layer is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located.

[0008] In some embodiments of this disclosure, the photosensitive layer includes a plurality of photosensitive material portions, which are used to absorb light of a preset wavelength to generate photogenerated carriers. The projection of the photosensitive material portions in a first plane is offset from the projection of the plurality of pixel units in the first plane, and the first plane is parallel to the photosensitive layer.

[0009] In some embodiments of this disclosure, the plurality of photosensitive material portions include:

[0010] The first photosensitive material part is used to absorb infrared light and light with wavelengths shorter than the infrared light band.

[0011] The second photosensitive material part is used to absorb red light and light with wavelengths shorter than the red light band.

[0012] The third photosensitive material part is used to absorb green light and light with wavelengths shorter than the green light band.

[0013] The fourth photosensitive material section is used to absorb blue light and light with wavelengths shorter than the blue light band.

[0014] In some embodiments of this disclosure, the material of the photosensitive material portion includes an aluminum indium gallium nitride quaternary compound.

[0015] In some embodiments of this disclosure, the photosensitive layer further includes a conductive connection portion for connecting adjacent photosensitive material portions.

[0016] In some embodiments of this disclosure, the material of the conductive connection portion is a transparent conductive material.

[0017] In some embodiments of this disclosure, the plurality of pixel units are arranged in an array, and the plurality of photosensitive material portions are disposed in the inter-row region between the pixel units in adjacent rows and / or the inter-column region between the pixel units in adjacent columns.

[0018] In some embodiments of this disclosure, the materials of each photosensitive material portion disposed in the same row area or the same column area are used to absorb light of the same wavelength band, and the photosensitive material portions disposed in the same row area or the same column area are connected by the conductive connection portion to form a photosensitive strip.

[0019] In some embodiments of this disclosure, the display panel includes an encapsulation layer covering the pixel unit and a protective cover plate disposed outside the encapsulation layer, and the photosensitive layer is disposed on the encapsulation layer or the protective cover plate.

[0020] According to a second aspect of the present disclosure, a method for manufacturing a display panel is provided, the method comprising:

[0021] Provide substrate;

[0022] Multiple pixel units are formed on the substrate;

[0023] A photosensitive layer is provided on the light-emitting side of the pixel unit. The photosensitive layer is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located.

[0024] In some embodiments of this disclosure, the provision of a photosensitive layer on the light-emitting side of the pixel unit includes:

[0025] Multiple photosensitive material portions are formed, each photosensitive material portion being used to absorb light of a preset wavelength to generate photogenerated carriers. The projection of the photosensitive material portion in a first plane is offset from the projection of the multiple pixel units in the first plane. The first plane is parallel to the photosensitive layer.

[0026] A conductive connection portion is formed, which is used to connect the adjacent photosensitive material portion.

[0027] In some embodiments of this disclosure, the photosensitive material portion is formed by chemical vapor deposition; the conductive connection portion is formed by sputtering or spin coating.

[0028] In some embodiments of this disclosure, the photosensitive material portion is made of an aluminum indium gallium nitride quaternary compound; the conductive connection portion is made of a transparent conductive material.

[0029] According to a third aspect of the present disclosure, an electronic device is provided, the electronic device including a detection device and a display panel as described above, the detection device being used to detect changes in photogenerated carriers generated by the photosensitive layer in the display panel, so as to determine the ambient light characteristics of the environment in which the display panel is located.

[0030] In some embodiments of this disclosure, the electronic device includes data scan lines for driving pixel units in the display panel to emit light, and the photosensitive layer is connected to the data scan lines.

[0031] In some embodiments of this disclosure, the electronic device includes a driving transistor, the data scan line is connected to the gate of the driving transistor, a first electrode of the driving transistor is connected to the photosensitive layer, and a second electrode of the driving transistor is connected to the detection device.

[0032] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: by placing the photosensitive layer on the light-emitting side of the pixel unit, the area of ​​the photosensitive layer that receives ambient light is increased and is not interfered with by the self-emission of the pixel unit, enabling the photosensitive layer to accurately reflect ambient light characteristics such as ambient light intensity, thereby improving the recognition accuracy of the photosensitive layer integrated in the display panel. When the display panel is applied to electronic devices, the electronic devices can accurately provide users with appropriate color temperature and illuminance based on changes in photogenerated carriers.

[0033] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0035] Figure 1 This is a cross-sectional schematic diagram of a display panel shown in an exemplary embodiment.

[0036] Figure 2 This is a top view schematic diagram illustrating a display panel in an exemplary embodiment.

[0037] Figure 3 This is a top view schematic diagram illustrating a display panel in an exemplary embodiment.

[0038] Figure 4 This is a schematic side cross-sectional view of a display panel illustrating an exemplary embodiment.

[0039] Figure 5 This is a schematic flowchart illustrating a method for manufacturing a display panel, as shown in an exemplary embodiment.

[0040] Figure 6 This is a schematic flowchart illustrating a method for manufacturing a display panel, as shown in an exemplary embodiment.

[0041] Figure 7 This is a block diagram illustrating an electronic device in an exemplary embodiment.

[0042] Figure 8 This is a schematic diagram of the structure of an electronic device shown in an exemplary embodiment. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0044] It should be noted that, unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of this disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in a common dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as being interpreted in an idealized or highly formalized sense, unless expressly defined herein.

[0045] For example, the terms "comprising" or "including" and similar words used in this disclosure and the claims mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects. Terms indicating orientation or positional relationship, such as "above," "below," "row / row direction," and "column / column direction," are based on the orientation or positional relationship shown in the drawings and are only for the purpose of simplifying the description of the technical solution of this disclosure, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0046] For example, in some cases, embodiments involving the "row direction" can be implemented in the "column direction," and vice versa. Rotation or mirroring of the solutions described in this disclosure also falls within the scope of this disclosure.

[0047] Ambient light sensors (ALS) can be divided into two categories: those that can only measure ambient light illuminance and those that can measure ambient light color temperature and illuminance. In related technologies, to increase the screen-to-body ratio, ambient light color temperature and illuminance sensors for terminal devices are typically placed in narrow bezels within the device's frame or directly under the screen. However, with the continuous development of display technology, terminal device bezels are becoming increasingly narrower to further improve the screen-to-body ratio. This results in less ambient light being received by the ambient light color temperature and illuminance sensors. Furthermore, because these sensors are affected by light noise emitted from the device's display screen, their resolution and accuracy decrease.

[0048] To address the aforementioned technical issues, this disclosure provides a display panel including multiple pixel units and a photosensitive layer. The photosensitive layer is disposed on the light-emitting side of the pixel unit and configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located. By placing the photosensitive layer on the light-emitting side of the pixel unit, the area of ​​the photosensitive layer that receives ambient light is increased and is not interfered with by the self-emission of the pixel unit. This allows the photosensitive layer to accurately reflect ambient light characteristics such as ambient light intensity, thereby improving the recognition accuracy of the photosensitive layer integrated in the display panel. When the display panel is applied to electronic devices, the electronic devices can accurately provide users with appropriate color temperature and illuminance based on changes in photogenerated carriers.

[0049] Display panels can include OLED (Organic Light-Emitting Diode) display panels, LCD (Liquid Crystal Display) display panels, etc. The following mainly uses OLED as an example to specifically explain the technical solution of this disclosure.

[0050] Figure 1 This is a cross-sectional schematic diagram of a display panel shown in an exemplary embodiment, such as... Figure 1 As shown, the display panel 10 includes a plurality of pixel units 1 and a photosensitive layer 2. The photosensitive layer 2 is disposed on the light-emitting side of the pixel unit 1. The photosensitive layer 2 is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel 10 is located.

[0051] Continue to refer to Figure 1The display panel 10 includes an array substrate 5 and a plurality of pixel units 1 disposed on the array substrate 5. It can be understood that a pixel unit 1 refers to a sub-pixel that can emit a single color. For example, according to the different colors of emission, the pixel unit 1 can be a red pixel unit 1-R, a green pixel unit 1-G, and a blue pixel unit 1-B. A plurality of pixel units 1 with different emission colors can form a pixel. For example, a red pixel unit 1-R, a green pixel unit 1-G, and a blue pixel unit 1-B form a pixel.

[0052] The photosensitive layer 2 is disposed on the light-emitting side of the pixel unit 1, that is, on the outside of the pixel unit 1. This prevents the photosensitive layer 2 from being interfered with by the light noise generated by the light emitted by the pixel unit 1, allowing the photosensitive layer 2 to fully sense ambient light outside the display panel. The photosensitive layer 2 has a sufficient light-receiving area, thereby improving its resolution. The photosensitive layer 2 can generate photogenerated carriers when illuminated. Photogenerated carriers are those generated when light irradiates a semiconductor; if the energy of the photon is equal to or greater than the band gap of the semiconductor, electrons in the valence band absorb the photon and enter the conduction band, generating electron-hole pairs. Since the energy of a photon is related to the frequency of light, and the frequency of light determines color, the higher the frequency, the greater the photon energy. In ambient light, red light has a longer wavelength and a lower frequency, so red light photons have lower energy; violet light has a shorter wavelength and a higher frequency, so violet light photons have higher energy. The intensity of ambient light determines the number of photons emitted by the light source per unit time. Therefore, the number of photogenerated carriers is directly proportional to the intensity of the corresponding wavelength in the ambient light. Thus, photogenerated carriers can characterize the characteristics of the ambient light in the environment where the display panel is located, such as the intensity of the ambient light.

[0053] In one exemplary embodiment, such as Figure 1 As shown, the photosensitive layer 2 includes multiple photosensitive material portions, which are used to absorb light of a preset wavelength to generate photogenerated carriers. The projection of the photosensitive material portions in the first plane is offset from the projection of the multiple pixel units in the first plane. The first plane is a plane parallel to the photosensitive layer.

[0054] Because ambient light has a continuous absorption spectrum of different wavelengths, it can be divided into visible light and invisible light. Visible light has a wavelength of 400–760 nm, and after scattering, it is divided into seven colors: red, orange, yellow, green, cyan, blue, and violet, which together form white light. Invisible light is further divided into two types: infrared light, located outside the red light region, has a wavelength greater than 760 nm, with a maximum length of 5300 nm; ultraviolet light, located outside the violet light region, has a wavelength of 290–400 nm. Therefore, the photosensitive layer 2 needs to be provided with multiple photosensitive material sections 21 to absorb light of different wavelengths to generate photogenerated carriers. Since the photosensitive layer 2 is located on the light-emitting side of the pixel unit 1, in order not to affect the display effect of the pixel unit 1, the projections of multiple photosensitive material parts 21 in the first plane parallel to the photosensitive layer 2 and the projections of multiple pixel units 1 in the first plane parallel to the photosensitive layer 2 are staggered. This ensures that the photosensitive material parts 21 do not block the light-emitting path of the pixel unit 1, thereby maximizing the light-receiving area of ​​the photosensitive material parts 21 without affecting the display effect of the pixel unit 1, reducing the degree of photoelectric signal distortion generated by the photosensitive layer 2, and thus improving the recognition accuracy of the photosensitive layer 2.

[0055] In some possible implementations, such as Figure 2 As shown, the plurality of photosensitive material sections 21 include: a first photosensitive material section 21-IR, a second photosensitive material section 21-R, a third photosensitive material section 21-G, and a fourth photosensitive material section 21-B. The first photosensitive material section 21-IR is used to absorb infrared light and light with wavelengths shorter than the infrared band; the second photosensitive material section 21-R is used to absorb red light and light with wavelengths shorter than the red band; the third photosensitive material section 21-G is used to absorb green light and light with wavelengths shorter than the green band; and the fourth photosensitive material section 21-B is used to absorb blue light and light with wavelengths shorter than the blue band. Since red, green, and blue light have relatively wide wavelength ranges in the spectrum, by selecting photosensitive material sections 21 that respond to light in these three wavelength ranges and photosensitive material sections 21 that respond to infrared light, different photosensitive material sections 21 can detect the light intensity of different wavelengths in ambient light, thereby achieving a wider spectral response range for the photosensitive layer 2. When these four photosensitive material sections 21 are irradiated with corresponding wavelength spectrum, they generate photogenerated carriers. Since the number of photogenerated carriers is proportional to the light intensity of the corresponding wavelength in the ambient light, the photogenerated carriers can characterize the ambient light characteristics of the display panel 10.

[0056] For example, the photosensitive material section 21 may also include a photosensitive material section 21 that responds to ultraviolet wavelength light, or a photosensitive material section 21 that responds to the wavelength corresponding to violet light, orange light, yellow light, etc., so as to realize that the corresponding photosensitive material section 21 generates photogenerated carriers under the irradiation of the corresponding wavelength spectrum. This disclosure does not limit this.

[0057] In some possible implementations, the photosensitive material section 21 is made of an aluminum indium gallium nitride (AlGaN) quaternary compound. Since the bandgap Eg = 1239.8 / λ, where λ is the wavelength, and the bandgap of aluminum nitride (ALN), gallium nitride (GaN), and indium nitride (InN) at room temperature (300K) are 6.2 eV, 3.39 eV, and 0.67 eV, respectively, calculations show that AlInGaN quaternary compounds with bandgap corresponding to the three primary colors of red, green, and blue light, as well as the infrared light band, can be achieved through combinations of Al, Ga, and In materials. Different combinations of Al, Ga, and In in the AlInGaN quaternary compound allow for the absorption of different wavelengths of light by different AlInGaN quaternary compounds. For example, AlInGaN-IR is the first photosensitive material section 21-IR, AlInGaN-R is the second photosensitive material section 21-R, AlInGaN-G is the third photosensitive material section 21-G, and AlInGaN-B is the fourth photosensitive material section 21-B. Furthermore, since AlInGaN-IR, AlInGaN-R, AlInGaN-G, and AlInGaN-B are semiconductors, the AlInGaN quaternary compound is an insulator at room temperature (300K). However, when placed under ambient light, because ambient light contains red, green, blue, and infrared light components, AlInGaN-IR, AlInGaN-R, AlInGaN-G, and AlInGaN-B absorb the corresponding wavelengths of light and generate photogenerated carriers, thus transforming from an insulator into a conductor. The AlInGaN quaternary compound is transparent in its thin-layer state and is interleaved with the pixel unit 1, therefore it does not affect the display effect of the display panel 10.

[0058] For example, the band gaps of Ge, silicon carbide (SiC), and silicon (Si) are 0.7 eV, 3.4-3.5 eV, and 1.12 eV, respectively. Different combinations of Ge, SiC, and Si can be used to achieve band gaps corresponding to the three primary colors of red light, green light, and blue light, as well as the infrared light band, so as to generate photogenerated carriers when irradiated by the corresponding band of ambient light. This disclosure does not limit the materials used in the photosensitive material section 21.

[0059] In one exemplary embodiment, such as Figure 1 As shown, the photosensitive layer 2 also includes a conductive connection portion 22, which is used to connect adjacent photosensitive material portions 21. Since the photosensitive material portions 21 generate photogenerated carriers, by connecting adjacent photosensitive material portions 21 through the conductive connection portion 22, the photogenerated carriers generated by multiple photosensitive material portions 21 can converge through the conductive connection portion 22. In this way, the light intensity of ambient light can be characterized by detecting the number of photogenerated carriers in the photosensitive layer 2.

[0060] For example, the conductive connection part 22 is made of a transparent conductive material. The photosensitive material part 21 is connected through the conductive connection part 22 of the transparent conductive material, so that the photosensitive layer 2 can realize the photosensitive function without affecting the display effect of the display panel 10, thereby providing users with a good visual experience. For example, the conductive connection part 22 may include carbon nanotubes (CNT), indium tin oxide (ITO), etc. as transparent conductive materials, so that the photogenerated carriers generated by multiple photosensitive material parts 21 can be gathered through the transparent conductive material, thereby realizing the detection of the number of photogenerated carriers and thus characterizing the light intensity of ambient light.

[0061] In one exemplary embodiment, such as Figure 2 As shown, multiple pixel units 1 are arranged in an array, and multiple photosensitive material portions 21 are disposed in the inter-row area between adjacent rows of pixel units 1. By disposing of multiple photosensitive material portions 21 in the inter-row area between adjacent rows of pixel units 1, the photosensitive material portions 21 can be distributed across all areas of the display panel 10, increasing the light-receiving area of ​​the photosensitive material portions 21, thereby increasing the signal intensity of the photoelectric signal generated by the photosensitive material portions 21.

[0062] Multiple pixel units 1 are arranged in an array, including multiple red pixel units 1-R, multiple green pixel units 1-G, and multiple blue pixel units 1-B. By adjusting the different pixel units 1, the display panel 10 can display and image. For example, the pixel units 1 can be arranged in various ways, such as RGB arrangement, where each pixel on the screen is composed of three closely adjacent red pixel units 1-R, green pixel units 1-G, and blue pixel units 1-B arranged neatly; or RGB Pentile arrangement, where each pixel is composed of red pixel units 1-R and green pixel units 1-G or green pixel units 1-G and blue pixel units 1-B; or diamond arrangement, where each pixel is composed of half a red pixel unit 1-R, half a blue pixel unit 1-B, and one green pixel unit 1-G; or Delta arrangement, where each pixel is composed of one red pixel unit 1-R, one blue pixel unit 1-B, and two green pixel units 1-G, with the two green pixel units 1-G being diagonally distributed.

[0063] Figure 2 An exemplary top view of a display panel 10 in which multiple pixel units 1 are arranged in RGB penstiles is shown. It can be understood that... Figure 2 The diagram only shows a partial arrangement of multiple pixel units 1 arranged in an array; the remaining unshown pixel units 1 are also arranged according to the aforementioned RGB Pentile pattern. (Reference) Figure 2Multiple photosensitive material portions 21 are disposed in the interrow area between adjacent rows of pixel units 1, so that the photosensitive material portions 21 can be distributed in all areas of the display panel 10, thereby increasing the light-receiving area of ​​the photosensitive material portions 21 without affecting the display effect of the pixel units 1, thereby improving the recognition accuracy of the photosensitive layer 2.

[0064] In some possible implementations, such as Figure 3 As shown, multiple photosensitive material units 21 are disposed in the inter-column region between adjacent column pixel units 1. This allows the photosensitive material units 21 to be distributed across all areas of the display panel 10, increasing the light-receiving area of ​​the photosensitive material units 21 and thereby increasing the signal intensity of the photoelectric signal generated by the photosensitive material units 21.

[0065] For example, the photosensitive material section 21 may also be provided in the inter-row region between adjacent row pixel units 1 and the inter-column region between adjacent column pixel units 1, thereby increasing the number of photosensitive material sections 21 on the display panel 10, thereby increasing the signal quantity of the photoelectric signal generated by the photosensitive material section 21 and improving the recognition accuracy of the photosensitive layer 2.

[0066] It is understood that in a display panel 10 in which multiple pixel units 1 are arranged in other ways, the photosensitive material part 21 may also be provided in the inter-row area between adjacent rows of pixel units 1 and the inter-column area between adjacent columns of pixel units 1, and this disclosure does not limit this.

[0067] It is understood that the photosensitive material sections 21 disposed in the same row area or the same column area can be the same type of photosensitive material section 21, for example, they can all be the first photosensitive material section 21-IR, or the third photosensitive material section 21-G, etc.; or they can be different types of photosensitive material sections 21, for example, the first photosensitive material section 21-IR, the second photosensitive material section 21-R, the third photosensitive material section 21-G, and the fourth photosensitive material section 21-B are arranged in a regular or irregular staggered manner, etc. As long as the signal quantity of the photoelectric signal generated by the photosensitive material section 21 is increased, thereby improving the recognition accuracy of the photosensitive layer 2, this disclosure does not impose any restrictions on this.

[0068] In some possible implementations, such as Figure 2 and Figure 3 As shown, the materials of each photosensitive material section 21 disposed in the same row area or the same column area are used to absorb light of the same wavelength. The photosensitive material sections 21 disposed in the same row area or the same column area are connected by conductive connection sections 22 to form a photosensitive strip.

[0069] By placing photosensitive material sections 21 that absorb light of the same wavelength in the same row or column region, the photosensitive material sections 21 in the same row or column region generate photogenerated carriers under the illumination of the same wavelength spectrum in ambient light. After connecting the photosensitive material sections 21 in the same row or column region into photosensitive strips through conductive connection sections 22, the light intensity of the corresponding wavelength in ambient light can be characterized by detecting the number of photogenerated carriers generated by each photosensitive strip, thereby realizing the photosensitive function of the photosensitive layer 2.

[0070] In one exemplary embodiment, such as Figure 4 As shown, the display panel 10 includes an encapsulation layer 3 covering the pixel unit 1 and a protective cover plate 4 disposed on the outside of the encapsulation layer 3, and the photosensitive layer 2 is disposed on the encapsulation layer 3 or the protective cover plate 4.

[0071] The encapsulation layer 3 can be an organic thin film covering the pixel unit 1, providing good water and oxygen isolation properties for the pixel unit and good sealing properties for the internal environment and space of the display panel 10. Simultaneously, since the pixel unit 1 experiences surface plasmon resonance during light emission, reducing the emitted light efficiency, the encapsulation layer 3 can suppress this effect. Furthermore, since a Fabry-Palow optical resonator is formed inside the display panel 10, adjusting the encapsulation layer 3 can regulate the resonator, thereby adjusting the emitted light efficiency and selecting the spectrum.

[0072] The protective cover 4 can be a high-temperature resistant glass cover, used to cover the encapsulation layer 3 and protect the display panel 10. The photosensitive layer 2 can be disposed on the outside of the encapsulation layer 3, or on the protective cover 4 opposite to the encapsulation layer 3, so that the photosensitive layer 2 is disposed on the outside of the pixel unit 1, and the protective cover 4 can protect the photosensitive layer 2 from corrosion and oxidation by moisture in the environment, ensuring the sensitivity of the photosensitive layer 2. The photosensitive layer 2 is distributed throughout the entire display panel 10, increasing the light-receiving area of ​​the photosensitive material section 21, thereby increasing the signal quantity of the photoelectric signal generated by the photosensitive material section 21 and improving the resolution of the photosensitive layer 2.

[0073] like Figure 5 As shown, an exemplary embodiment of this disclosure provides a method for manufacturing a display panel, the method comprising:

[0074] S100, providing a substrate;

[0075] S200: Multiple pixel units are formed on the substrate;

[0076] S300: A photosensitive layer is provided on the light-emitting side of the pixel unit. The photosensitive layer is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located.

[0077] In step S100, the substrate may include a flexible substrate or a rigid substrate, and the display panel formed by different substrate materials may include a flexible display panel or a rigid display panel. The rigid substrate includes glass, while the flexible substrate includes polyimide materials and polymer / nano-inorganic multilayer stacked structures, etc.

[0078] In step S200, taking a flexible substrate as an example, a buffer layer of SiNx and SiOx can be deposited on the substrate using plasma-enhanced chemical vapor deposition (PECVD). Then, an a-Si film is deposited by excimer laser annealing (ELA) to serve as a polysilicon channel layer. After gate-insulator (GI) deposition, molybdenum is sputtered and patterned as a gate cutoff. P+ implantation is then performed to form the source / drain junction. After interlayer dielectric (ILD) deposition, annealing at below 450°C is performed to activate the implanted dopants and enhance TFT characteristics. Contacts and source / drain electrodes are then formed through a metal layer, thereby forming multiple pixel units on the substrate.

[0079] For example, the multiple pixel units may include multiple red pixel units, multiple green pixel units, and multiple blue pixel units. By adjusting the different pixel units, various colors can be modulated, thereby realizing the imaging of the display panel. The arrangement of the multiple pixel units on the substrate may be, for example, an RGB arrangement, an RGB Pentile arrangement, a diamond arrangement, or a Delta arrangement, etc., and this disclosure does not limit this.

[0080] In step S300, the photosensitive layer can be disposed on the encapsulation layer or protective cover plate on the light-emitting side of the pixel unit, so that the photosensitive layer 2 is not interfered with by the light noise generated by the light emission of the pixel unit 1. The photosensitive layer 2 can fully sense the ambient light outside the display panel, and the light-receiving area of ​​the photosensitive layer 2 is sufficient, thereby improving the resolution of the photosensitive layer 2. The photosensitive layer 2 can generate photogenerated carriers when illuminated. The number of photogenerated carriers is proportional to the light intensity of the corresponding wavelength in the ambient light, thus enabling the photogenerated carriers to characterize the ambient light of the environment in which the display panel is located.

[0081] In one exemplary embodiment, such as Figure 6 As shown, in step S300, a photosensitive layer is formed on the light-emitting side of the pixel unit, including:

[0082] S301. A plurality of photosensitive material portions are formed. The photosensitive material portions are used to absorb light of a preset wavelength to generate photogenerated carriers. The projection of the photosensitive material portions in the first plane is staggered from the projection of the plurality of pixel units in the first plane. The first plane is parallel to the photosensitive layer.

[0083] S302. A conductive connection portion is formed, which is used to connect adjacent photosensitive material portions.

[0084] In step S301, multiple photosensitive material portions are formed on the encapsulation layer or protective cover. These photosensitive material portions may include a first photosensitive material portion, a second photosensitive material portion, a third photosensitive material portion, and a fourth photosensitive material portion. Different photosensitive material portions can absorb light of corresponding wavelengths to generate photogenerated carriers. Since the photosensitive layer is located on the light-emitting side of the pixel unit, in order not to affect the display effect of the pixel unit, the projections of the multiple photosensitive material portions in a first plane parallel to the photosensitive layer are staggered with the projections of the multiple pixel units in the same plane. This maximizes the light-receiving area of ​​the photosensitive material portions without affecting the display effect of the pixel unit, reduces the degree of photoelectric signal distortion generated by the photosensitive layer, and thus improves the recognition accuracy of the photosensitive layer.

[0085] In step S302, a conductive connection is formed on the encapsulation layer or glass cover plate that forms multiple photosensitive material parts, so that the conductive connection connects adjacent photosensitive material parts, thereby allowing photogenerated carriers generated by multiple photosensitive material parts to converge through the conductive connection, thereby realizing the detection of the number of photogenerated carriers to characterize the ambient light intensity characteristics of the environment where the display panel is located.

[0086] In some possible implementations, the photosensitive material portion is formed by chemical vapor deposition, and the conductive connection portion is formed by sputtering or spin coating.

[0087] Chemical vapor deposition (CVD) can be a method such as organometallic chemical vapor deposition (MCVD). In MCVD, all reactants are in the form of gaseous organometallic compounds. Hydrogen or nitrogen is used as the carrier gas to deliver the reactant gas to the reaction chamber. The carrier gas mixes with the reactant gas, and a thermal decomposition reaction occurs on a heated encapsulation layer or protective cover to form a compound semiconductor. This is a method for growing semiconductor thin films on a substrate. When the material used to prepare the photosensitive material is aluminum indium gallium nitride (AIGaN), nitrogen is used as the carrier gas; when the material used to prepare the photosensitive material is of other components, hydrogen is used as the carrier gas. For example, after preparing a certain type of photosensitive material in the encapsulation layer or protective cover, an etching process is used to deposit this photosensitive material in the inter-row region between adjacent rows of pixel units and / or the inter-column region between adjacent columns of pixel units in the display panel. Then, the remaining three types of photosensitive materials are prepared on the encapsulation layer or protective cover using MCVD and etching processes, respectively.

[0088] Spin coating controls film thickness by adjusting the spin coating time, rotation speed, drop volume, and the concentration and viscosity of the solution used. An encapsulation layer or protective cover is set to rotate on an axis perpendicular to its surface. A liquid ITO or CNT transparent conductive material is coated onto the encapsulation layer or protective cover, creating conductive connections between adjacent photosensitive material sections that absorb the same wavelength. Etching then connects the photosensitive material sections located in the same row or column region, forming a photosensitive strip. Sputtering, on the other hand, uses particles (ions, neutral atoms, or molecules) of a certain energy to bombard a solid surface, causing near-surface atoms or molecules to gain sufficient energy and escape. Magnetron sputtering is typically used, with ITO or CNT transparent conductive material as the target. ITO or CNT is deposited between adjacent photosensitive material sections, and etching then connects the photosensitive material sections located in the same row or column region, forming a photosensitive strip.

[0089] For example, after the photosensitive layer is applied, a silica coating can be prepared on the surface of the photosensitive layer using plasma-enhanced chemical vapor deposition to cover the photosensitive layer and form a waterproof and dustproof protective film. See also Figure 4 One method is to cover the surface of the pixel unit with an encapsulation layer containing a photosensitive layer, and then place a protective cover plate on the outside of the encapsulation layer to obtain a display panel; another method is to place the photosensitive layer on the protective cover plate, cover the pixel unit with the encapsulation layer, and then attach the side of the protective cover plate with the photosensitive layer to the encapsulation layer to obtain a display panel.

[0090] like Figure 7 As shown, an exemplary embodiment of this disclosure provides an electronic device 100. For example, the electronic device 100 can be a mobile electronic device such as a mobile phone, smartphone, personal digital assistant, or tablet computer, or a fixed electronic device such as a desktop computer or television. The electronic device 100 includes a detection device 20 and the aforementioned display panel 10. The detection device 20 is used to detect changes in photogenerated carriers generated by the photosensitive layer 2 in the display panel 10, so as to determine the ambient light characteristics of the environment in which the display panel 10 is located.

[0091] The detection device 20 can be, for example, a current tester, a Hall current sensor, etc. Since the photosensitive layer 2 is located on the light-emitting side of the pixel unit 1 in the display panel 10, the photosensitive layer 2 is not affected by the light noise emitted by the pixel unit, while simultaneously increasing the light-receiving area of ​​the photosensitive layer 2 for ambient light, thereby improving the recognition accuracy of the photosensitive layer 2. Because the number of photogenerated carriers generated by the multiple photosensitive material sections 21 in the photosensitive layer 2 can characterize the light intensity of the corresponding wavelength band in the ambient light, the photosensitive layer 2 generates more photogenerated carriers under high-intensity ambient light illumination and fewer photogenerated carriers under low-intensity ambient light illumination.

[0092] In one exemplary embodiment, the electronic device 100 includes a data scan line 30, which drives the pixel unit 1 in the display panel 10 to emit light. The photosensitive layer 2 is connected to the data scan line 30. In this embodiment, connecting the photosensitive layer 2 to the data scan line 30 allows the pixel unit 1 and the photosensitive layer 2 to have the same frequency, while saving the cost and space of designing separate circuits.

[0093] For example, such as Figure 8 As shown, the electronic device 100 includes a driving transistor 40, a data scan line 30 connected to the gate of the driving transistor 40, a first electrode of the driving transistor 40 connected to a photosensitive layer 2, and a second electrode of the driving transistor 40 connected to a detection device 20. For example, the source of the driving transistor 40 is connected to VDD, the drain is grounded, the photosensitive layer 2 is connected between the source and VDD, and the detection device 20 is connected between the drain and ground.

[0094] Data scan line 30 is connected to the gate of driving transistor 40. Data scan line 30 inputs a write voltage to the gate of driving transistor 40. Driving transistor 40 generates a driving current according to the write voltage written to its gate, and pixel unit 1 emits light in response to the driving current. Since the first terminal of driving transistor 40 is connected to photosensitive layer 2 and the second terminal of driving transistor 40 is connected to detection device 20, detection device 20 can detect changes in the photocurrent formed by multiple photogenerated carriers in photosensitive layer 2 in real time, in accordance with the refresh frequency of data scan line 30. Detection device 20 detects changes in the photocurrent generated by photosensitive layer 2, determines the ambient light intensity based on the magnitude of the photocurrent, and driving transistor 40 then adjusts the color temperature and illuminance of the display panel according to the ambient light intensity detected by detection device 20, thereby effectively enabling electronic device 100 to provide users with suitable color temperature and illuminance. For example, when the ambient brightness is high, electronic device 100 automatically adjusts to high brightness, and when the ambient environment is dark, electronic device 100 automatically adjusts to low brightness.

[0095] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0096] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Multiple pixel units; A photosensitive layer is disposed on the light-emitting side of the pixel unit. The photosensitive layer is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located. The photosensitive layer includes multiple different photosensitive material portions and conductive connection portions for connecting adjacent photosensitive material portions. The different photosensitive material portions are used to absorb light of different wavelengths to generate photogenerated carriers. The multiple photosensitive material portions are disposed in the inter-row region between adjacent rows of pixel units and / or the inter-column region between adjacent columns of pixel units. The material of each photosensitive material portion disposed in the same inter-row region or the same inter-column region is used to absorb light of the same wavelength. The photosensitive material portions disposed in the same inter-row region or the same inter-column region are connected by the conductive connection portions to form a photosensitive strip. The number of photogenerated carriers generated by each photosensitive strip is used to characterize the light intensity of the corresponding wavelength in the ambient light.

2. The display panel according to claim 1, characterized in that, The plurality of photosensitive material portions include: The first photosensitive material part is used to absorb infrared light and light with wavelengths shorter than the infrared light band. The second photosensitive material part is used to absorb red light and light with wavelengths shorter than the red light band. The third photosensitive material part is used to absorb green light and light with wavelengths shorter than the green light band. The fourth photosensitive material section is used to absorb blue light and light with wavelengths shorter than the blue light band.

3. The display panel according to claim 1, characterized in that, The photosensitive material comprises an aluminum indium gallium nitride quaternary compound.

4. The display panel according to claim 1, characterized in that, The material of the conductive connection is a transparent conductive material.

5. The display panel according to claim 1, characterized in that, The multiple pixel units are arranged in an array.

6. The display panel according to any one of claims 1 to 5, characterized in that, The display panel includes an encapsulation layer covering the pixel unit and a protective cover plate disposed outside the encapsulation layer, and the photosensitive layer is disposed on the encapsulation layer or the protective cover plate.

7. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes: Provide substrate; Multiple pixel units are formed on the substrate; A photosensitive layer is provided on the light-emitting side of the pixel unit, and the photosensitive layer is configured to generate photogenerated carriers under illumination to characterize the ambient light characteristics of the environment in which the display panel is located. The photosensitive layer includes multiple different photosensitive material portions and conductive connection portions for connecting adjacent photosensitive material portions. The different photosensitive material portions are used to absorb light of different wavelengths to generate photogenerated carriers. The multiple photosensitive material portions are disposed in the inter-row region between adjacent rows of pixel units and / or the inter-column region between adjacent columns of pixel units. The material of each photosensitive material portion disposed in the same inter-row region or the same inter-column region is used to absorb light of the same wavelength. The photosensitive material portions disposed in the same inter-row region or the same inter-column region are connected by the conductive connection portions to form a photosensitive strip. The number of photogenerated carriers generated by each photosensitive strip is used to characterize the light intensity of the corresponding wavelength in the ambient light.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The provision of a photosensitive layer on the light-emitting side of the pixel unit includes: Multiple photosensitive material portions are formed; The conductive connection portion is formed.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The photosensitive material is formed by chemical vapor deposition; the conductive connection is formed by sputtering or spin coating.

10. The method for manufacturing a display panel according to claim 8, characterized in that, The photosensitive material is made of an aluminum indium gallium nitride quaternary compound; the conductive connection is made of a transparent conductive material.

11. An electronic device, characterized in that, The electronic device includes a detection device and a display panel as described in any one of claims 1 to 6, wherein the detection device is used to detect changes in photogenerated carriers generated by the photosensitive layer in the display panel, so as to determine the ambient light characteristics of the environment in which the display panel is located.

12. The electronic device according to claim 11, characterized in that, The electronic device includes data scan lines, which are used to drive pixel units in the display panel to emit light, and the photosensitive layer is connected to the data scan lines.

13. The electronic device according to claim 12, characterized in that, The electronic device includes a driving transistor, the data scan line is connected to the gate of the driving transistor, the first electrode of the driving transistor is connected to the photosensitive layer, and the second electrode of the driving transistor is connected to the detection device.

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