Method for managing electronic components

Abstract

Provided is an electronic component management method that enables various forms of management on the manufacturer side and the user side of an accommodation body that accommodates a plurality of electronic components. The method includes: a manufacturer-side step; a step of receiving a shipment of a bulk container that has been shipped; a step of reading an inherent ID accommodated in an RFID tag; and a step of obtaining manufacturer-side information accommodated in a manufacturer-side information accommodation area in the cloud based on the read inherent ID. In the manufacturer-side step, a step of preparing a bulk container that accommodates an RFID tag that accommodates an inherent ID (unique number) and accommodates a plurality of electronic components, a step of accommodating manufacturer-side information in the manufacturer-side information accommodation area in the cloud (external storage device) in association with the inherent ID, and a step of shipping the plurality of electronic components per bulk container.

Description

Technical Field

[0001] This invention relates to a method for managing electronic components. Background Technology

[0002] Conventionally, component manufacturers producing small electronic components such as semiconductor chips and capacitor chips store multiple manufactured electronic components in a single container, transporting and storing them within the factory, and then shipping each container to an assembly manufacturer. Besides containers with carrier tape wound on a spool to hold the electronic components individually, and boxes that arrange the electronic components in an orderly fashion, bulk boxes and bags for storing components in a loose, unpackaged state are also known (see, for example, Patent Document 1). On the other hand, for manufacturing management, technology using a wireless tag system is known, in which an RFID tag is attached to the individual being managed, and the ID information pre-set on the RFID tag is read (see, for example, Patent Document 2).

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-324839

[0006] Patent Document 2: Japanese Patent Application Publication No. 2002-358494 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] With the significant progress in miniaturization of electronic components, storage containers are being considered as a means of managing large numbers of electronic components. However, patent documents 1 and 2 mentioned above do not mention aspects of managing storage containers in various forms, leaving room for improvement.

[0009] The purpose of this invention is to provide a storage body for accommodating multiple electronic components, and a management method for electronic components that enables various management methods on both the manufacturer's and user's sides.

[0010] means for solving problems

[0011] The electronic component management method of the present invention comprises: a manufacturer-side step performed at a manufacturer-side facility where a manufacturer manufactures electronic components; and a user-side step performed at a user-side facility where a user uses electronic components manufactured by the manufacturer-side facility. The manufacturer-side step includes the following steps: preparing a housing that houses multiple electronic components and has an RFID tag with a unique number; storing manufacturer-side information associated with the unique number in a manufacturer-side information storage area of ​​an external storage device; and shipping the housing containing the multiple electronic components. The user-side step includes the following steps: receiving the shipped housing; reading the unique number stored in the RFID tag; and obtaining manufacturer-side information stored in the manufacturer-side information storage area of ​​the external storage device based on the read unique number.

[0012] The electronic component management method of the present invention comprises: a manufacturer-side step performed at a manufacturer-side facility where a manufacturer manufactures electronic components; and a user-side step performed at a user-side facility where a user uses electronic components manufactured by the manufacturer-side facility. The manufacturer-side step includes the following steps: preparing a housing containing multiple electronic components and having an RFID tag; preparing a unique number associated with manufacturer-side information; storing the manufacturer-side information and the unique number in a manufacturer-side information storage area of ​​an external storage device; writing the unique number to the RFID tag; and shipping the housing containing the multiple electronic components. The user-side step includes the following steps: receiving the shipped housing; reading the unique number stored in the RFID tag; and obtaining manufacturer-side information stored in the manufacturer-side information storage area of ​​the external storage device based on the read unique number.

[0013] Invention Effects

[0014] According to the present invention, a storage body for accommodating multiple electronic components can be provided, enabling various management methods for electronic components to be implemented on both the manufacturer's and user's sides. Attached Figure Description

[0015] Figure 1 This is a perspective view schematically illustrating the electronic components and bulk packaging of the embodiment.

[0016] Figure 2 This is a top view showing an RFID tag illustrating an implementation method.

[0017] Figure 3A This is a block diagram illustrating the hardware structure for managing electronic components, possessed by the component manufacturer and assembly manufacturer, respectively, in an embodiment.

[0018] Figure 3B This is a diagram schematically illustrating the structure within the cloud in an embodiment.

[0019] Figure 4 This is a diagram illustrating the writing of a unique ID onto an RFID tag provided with a bulk container in an embodiment.

[0020] Figure 5 This is a block diagram showing the structure of a component supply device included in the installer of the installation device as an embodiment, and also showing an image of writing a specified unique ID to the component supply device.

[0021] Figure 6 This is a flowchart illustrating an outline of a method for managing electronic components according to an embodiment.

[0022] Figure 7 This is a method for managing electronic components according to an implementation plan, and is a flowchart showing the details of the manufacturer's steps on the component manufacturer's side.

[0023] Figure 8 This is a method for managing electronic components according to an implementation method, and it is a flowchart showing the details of the user steps on the assembly manufacturer's side.

[0024] Figure 9 This is a perspective view illustrating an example of how information is read from RFID tags on bulk containers at a component manufacturer.

[0025] Figure 10 This is a perspective view illustrating an example of how information is read from RFID tags on bulk containers picked up from a storage location at a component manufacturer.

[0026] Figure 11 This is a perspective view showing a bulk box with a label affixed to the component manufacturer's side.

[0027] Figure 12 This is a perspective view showing an example of how multiple bulk containers are bundled when shipping them.

[0028] Figure 13 This is a perspective view showing the reading of RFID tags during the transport of multiple bundled bulk containers at the time of shipment.

[0029] Figure 14 This is a 3D diagram showing other ways to read RFID tags during shipment.

[0030] Figure 15 This is a perspective view of a bulk box with identification stickers affixed to a label on the assembly manufacturer's side.

[0031] Figure 16 This diagram schematically illustrates the scenario where the inherent ID is read by the box handler at the assembly manufacturer.

[0032] Figure 17 This is a diagram illustrating how component manufacturers and assembly manufacturers use separate unique IDs and how these unique IDs are associated with a common unique ID. Detailed Implementation

[0033] The embodiments will now be described with reference to the accompanying drawings.

[0034] Figure 1 The bulk container 20, which serves as the storage body in this embodiment, and the electronic components 10 stored inside the bulk container 20 are shown. Figure 2 An example of the structure of the RFID tag 30 provided on the bulk container 20 is shown. Figure 3A The diagram illustrates the hardware structures for managing the electronic component 10, possessed by both the component manufacturer G (manufacturing the electronic component 10) and the assembly manufacturer S (using the electronic component 10). The component manufacturer G is an example of a manufacturer-side facility for manufacturing the electronic component 10. The assembly manufacturer S is an example of a user-side facility for using the electronic component 10.

[0035] like Figure 1 As shown, the bulk container 20 is a box formed from a rigid material such as resin into a relatively thin rectangular shape. The bulk container 20 stores loose, i.e., bulk, electronic components 10 in units ranging from several thousand to hundreds of thousands. The bulk container 20 is equipped with an RFID tag 30. The RFID tag 30 is affixed to one end face of the bulk container 20 or housed inside the bulk container 20.

[0036] The electronic component 10 in this embodiment is a capacitor, inductor, resistor, etc., for example, a small electronic component with a cuboid shape and a length of 1.2 mm or less in the long side direction.

[0037] like Figure 2 As shown, the RFID tag 30 is a passive transponder comprising a rectangular resin sheet 30a as a substrate, an RFID chip 30b including a semiconductor integrated circuit, and multiple antennas 30c for communicating with external devices. The RFID chip 30b and antennas 30c are attached to the sheet 30a. The RFID tag 30 may also be of the type where the RFID chip 30b and antennas 30c are embedded within the sheet 30a. Furthermore, it may be of the type including a power supply. The RFID chip 30b includes a CPU, memory, communication circuitry, etc.

[0038] RFID tag 30 can use types such as Read Only (RO), Wright Once Read Many (WORM), and Read and Wright (R / W). When the RFID tag 30 is of type RO or WORM, although less information is written compared to R / W, costs can be reduced.

[0039] like Figure 4 As shown, an inherent ID 30X, serving as a unique identifier for the bulk container 20, is written into the RFID tag 30. The inherent ID 30X is written into the RFID chip 30b. It should be noted that the inherent ID 30X comprises multiple strings or sequences of numbers, symbols, and letters, varying for each RFID tag 30; however, here, these unique inherent IDs, varying for each RFID tag 30, are collectively referred to as the inherent ID 30X.

[0040] When the RFID tag 30 is RO, the RFID tag 30, pre-written with its unique ID 30X, is affixed to the bulk box 20. When the RFID tag 30 is WORM or R / W, its unique ID 30X is written to it via the writing unit 40 before it is stored. The writing of the unique ID 30X to the RFID tag 30 can be done before or after the RFID tag 30 is affixed to the bulk box 20.

[0041] like Figure 3A As shown, the component manufacturer G has a writing unit 40 capable of writing a unique ID 30X associated with information on the component manufacturer G's side (i.e., manufacturer-side information) to the RFID tag 30 on the bulk container 20; a reading unit 42 capable of reading the unique ID 30X associated with the manufacturer-side information recorded in the RFID tag 30 on the bulk container 20; and a database server 44. It should be noted that the writing unit 40 and the reading unit 42 can also be a single integrated read / write unit. The database server 44 is located on the component manufacturer G's side.

[0042] The writing unit 40 writes the inherent ID 30X and manufacturer information to the RFID tag 30. The inherent ID 30X and manufacturer information are stored in association in the database server 44. The reading unit 42 reads the inherent ID 30X written to the RFID tag 30. When the component manufacturer G uses the reading unit 42 to read the inherent ID 30X, it can access the database server 44 to read the manufacturer information associated with the inherent ID 30X stored in the database server 44.

[0043] The database server 44 on the component manufacturer G side can connect to the cloud 60 on the Internet together with the database server 54 on the assembly manufacturer S side (described later). It should be noted that "cloud" is short for cloud computing. Cloud computing refers to the general term for services that utilize various resources such as software, hardware, databases, and storage areas via communication lines such as the Internet. In this embodiment, cloud 60 is an example of an external storage device; more specifically, the storage area in cloud computing is an example of an external storage device.

[0044] It should be noted that the external storage device does not necessarily have to be a storage area in the cloud computing environment; it can be any storage device that the component manufacturer G and the assembly manufacturer S can access via communication lines. It should also be noted that database server 44 and database server 54 can also be located on cloud 60.

[0045] like Figure 3B As shown, cloud 60 has a manufacturer-side information storage area 60G for storing manufacturer-side information, and a user-side information storage area 60S for storing user-side information from the assembly manufacturer S (described later). The inherent ID 30X and part or all of the manufacturer-side information stored in the database server 44 on the component manufacturer G side are copied to cloud 60 and stored thereon. The inherent ID 30X and part or all of the user-side information stored in the database server 54 on the assembly manufacturer S side are also copied to cloud 60 and stored thereon. Both component manufacturer G and assembly manufacturer S can share information associated with their respective inherent IDs 30X by accessing cloud 60.

[0046] The writing unit 40 includes multiple RFID writers 41 capable of writing information in a contactless manner. The multiple RFID writers 41 are respectively configured in designated locations within the component manufacturer G's factory. The RFID writers 41 copy part or all of the unique ID 30X and manufacturer-side information read from the database server 44 to the manufacturer-side information storage area 60G of the cloud 60 for storage. The reading unit 42 includes multiple RFID readers 43 capable of reading the unique ID 30X associated with the manufacturer-side information in a contactless manner. The multiple RFID readers 43 are respectively configured in designated locations within the component manufacturer G's factory. The reading information from the RFID readers 43 is stored in the database server 44 and the manufacturer-side information storage area 60G of the cloud 60.

[0047] The assembly manufacturer S includes a writing unit 50 capable of writing a unique ID 30X associated with information on the assembly manufacturer S side, i.e., user-side information, to the RFID tag 30 on the bulk container 20; a reading unit 52 capable of reading the unique ID 30X recorded in the RFID tag 30 on the bulk container 20; a database server 54; and an installer 56. The installer 56 is an example of an installation device. It should be noted that when the type of RFID tag 30 is WORM or R / W, the writing unit 50 is sometimes omitted.

[0048] The writing unit 50 writes the unique ID 30X and user-side information to the database server 54. The database server 54 stores the unique ID 30X and user-side information in a mutually associated manner. The reading unit 52 reads the unique ID 30X written to the RFID tag 30. When reading the unique ID 30X, the reading unit 52 can access the database server 54 and read the user-side information associated with the unique ID 30X stored in the database server 54.

[0049] The writing unit 50 includes multiple RFID writers 51 capable of writing information in a contactless manner. The multiple RFID writers 51 are respectively configured in designated locations within the assembly manufacturer S's factory. The RFID writers 51 can write the unique ID 30X associated with user-side information and manufacturer-side information to the RFID tag 30 for recording. The reading unit 52 includes multiple RFID readers 53 capable of reading the unique ID 30X in a contactless manner. The reading unit 52 is an example of a first reading unit. The multiple RFID readers 53 are respectively configured in designated locations within the assembly manufacturer S's factory. The reading information from the RFID readers 53 is stored in the database server 54 and the user-side information storage area 60S of the cloud 60.

[0050] At component manufacturer G, reading unit 42 is capable of reading part or all of the user information (e.g., the number of electronic components 10 used, etc.) stored in the user-side information storage area 60S of cloud 60 associated with the inherent ID 30X. Furthermore, at assembly manufacturer S, reading unit 52 is capable of reading part or all of the manufacturer information (e.g., the number of electronic components 10 produced, etc.) stored in the manufacturer-side information storage area 60G of cloud 60 associated with the inherent ID 30X.

[0051] The mounter 56 is a device for mounting at least one electronic component 10 onto an electronic circuit board of an electronic device assembly. The mounter 56 includes a plurality of component supply devices 57. Each component supply device 57 is provided with a bulk container 20, which supplies the electronic component 10 to the mounter 56.

[0052] like Figure 5As shown, in each component supply device 57 of the mounter 56, a designated unique ID 57X is electronically written and stored. Furthermore, each component supply device 57 of the mounter 56 has an RFID reader 58 that reads the RFID tags 30 attached to the bulk container 20. The designated unique ID 57X is an example of a designated unique number. The RFID reader 58 is an example of a second reading unit.

[0053] Component manufacturer G stores multiple electronic components 10 manufactured in its factory within bulk containers 20 for transportation and storage, and then ships them to assembly manufacturer S. Assembly manufacturer S receives multiple bulk containers 20 and installs the electronic components 10 contained within the bulk containers 20 onto the electronic circuit board of an electronic device assembly using a mounter 56. Assembly manufacturer S manufactures the electronic circuit board, etc.

[0054] like Figure 6 As shown, a manufacturer-side step S1 is performed at component manufacturer G. This manufacturer-side step S1 at component manufacturer G includes the packaging process of electronic component 10 and the product inspection / shipping process. Furthermore, a user-side step S2 is performed at assembly manufacturer S. This user-side step S2 at assembly manufacturer S includes the receiving process, storage process, manufacturing process, and handling process of electronic component 10. At component manufacturer G, multiple manufactured electronic components 10 are stored in bulk containers 20, and multiple bulk containers 20 are shipped from component manufacturer G. The multiple bulk containers 20 shipped from component manufacturer G are received and used by assembly manufacturer S.

[0055] The following is for reference Figure 7 and Figure 8 The process for electronic component 10 at component manufacturer G and assembly manufacturer S is described.

[0056] [Manufacturer-side steps at component manufacturer G]

[0057] Figure 7 Details of the manufacturer-side step S1 of the process for electronic component 10, which is assembled by the manufacturer S, are shown.

[0058] At the component manufacturer G, a database server 44 is prepared in advance to store the manufacturer-side information described later (step S101). In addition, at the component manufacturer G, a unique ID 30X for identifying each bulk box 20 is prepared (step S102).

[0059] (Encapsulation process)

[0060] During the packaging process, if the RFID tag 30 is WORM or R / W, the prepared unique ID 30X is written to the RFID tag 30 affixed before or after the bulk box 20 (step S103). Next, the manufactured multiple electronic components 10 are placed in the bulk box 20 (step S104). Thus, the bulk box 20 is prepared to hold multiple electronic components 10 and has an RFID tag 30 with a unique ID 30X.

[0061] It should be noted that when the RFID tag 30 affixed to the bulk container 20 is RO, the inherent ID 30X is pre-stored in the RFID tag 30. In this case, step S103 is omitted, and multiple electronic components 10 are stored in the bulk container 20.

[0062] During the packaging process, manufacturer-side information is associated with the unique ID 30X held by the RFID tag 30 affixed to the bulk container 20 and stored in the database server 44, and then stored in the manufacturer-side information storage area 60G of the cloud 60 (step S105). Manufacturer-side information consists of multiple pieces of information related to the electronic component 10 stored in the bulk container 20, set or held by the component manufacturer G. This manufacturer-side information includes the batch number of the electronic component 10, the quantity of the electronic component 10 stored in the bulk container 20, product information such as performance related to the electronic component 10, environmental information related to the electronic component 10, and the inspection number of the electronic component 10. Depending on the type of electronic component 10, an MSL (Moisture Sensitivity Level) is recorded. MSL represents the risk level of a malfunction caused by volume expansion due to the vaporization of moisture contained in the electronic component 10. It should be noted that information about the manufacturing process of the electronic component 10 can also be obtained through the batch number. In this case, the inherent ID 30X is used as a keyword or the keyword stored together in the RFID tag 30 is used to obtain information.

[0063] Within the factory of component manufacturer G, the RFID tag 30 of the bulk container 20 is read using a designated RFID reader 43 to manage the bulk container 20 by reading the manufacturer-side information associated with its inherent ID 30X. When reading the inherent ID 30X of the RFID tag 30, for example, as... Figure 9 As shown, the RFID reader 43 installed on the table 61 reads the inherent ID 30X of the RFID tag 30 of the bulk box 20 placed on the table 61.

[0064] Multiple bulk containers 20, each bearing the unique ID 30X of the RFID tag 30, are transported within the factory and stored in a designated storage location (step S106). Furthermore, until the next product inspection / processing cycle, based on the unique ID 30X stored in the RFID tag 30, factory inventory information management, location management based on movement paths, and anti-theft management are performed. Inventory information management, location management, and anti-theft management are based on reading information from RFID readers 43 configured within the factory. RFID readers 43 are configured, for example, at doors in passageways or entrances / exits for indoor areas, and read the unique ID 30X recorded on the RFID tag 30 as the bulk container 20 passes through.

[0065] Inventory information management is performed by confirming whether bulk containers 20 are stored in designated storage locations. For example, if the inventory is confirmed by reading the inherent ID 30X of the RFID tag 30 through a door installed at the entrance / exit of the designated storage location, an RFID reader 43 installed at that door will read the RFID tag 30.

[0066] Location management involves tracking the location of each bulk container 20 as it passes through multiple doors or enters / exits designated areas within the factory. Since RFID tags 30 cannot be detected by RFID readers 43 when stored inside metal boxes, using metal detectors and X-ray inspection devices simultaneously allows for more accurate location tracking.

[0067] Anti-theft management, for example, involves determining that a shipment of bulk container 20 arriving outside the factory without confirmation of shipment based on, for example, RFID tag 30, is not a legitimate shipment and taking measures such as issuing a warning.

[0068] (Product inspection / shipping process)

[0069] During the product inspection / shipment process, the bulk box 20 is picked up from the storage location (step S107), and then the inherent ID 30X stored in the RFID tag 30 affixed to the picked bulk box 20 is read (step S108).

[0070] For example, Figure 10As shown, bulk containers 20 are picked up from storage areas 62 such as storage shelves and placed on transport trolleys 63. On the trolley 63, the inherent ID 30X of the RFID tag 30 is read by the RFID reader 43 via the sensor 64. The RFID reader 43 is located at an appropriate position on the trolley 63. This information, such as the bulk container 20 being shipped, is then entered into the database server 44. Even when the bulk container 20 is at a greater readable distance from the reader 43, the inherent ID 30X recorded on the RFID tag 30 can be read via the sensor 64 near the bulk container 20.

[0071] Here, the new manufacturer-side information is further associated with the inherent ID 30X of the RFID tag 30 of the picked bulk container 20 and stored in the manufacturer-side information storage area 60G of the cloud 60 via the database server 44 (step S109). The new manufacturer-side information here may be, for example, the part number used by the assembly manufacturer S, the order number from the assembly manufacturer S, the factory number of the component manufacturer G, the manufacturing date, the supplier number, etc., but is not limited to these.

[0072] In this embodiment, such as Figure 11 As shown, a label 71 is affixed to the bulk container 20 (step S110). The label 71 is pre-printed with at least one piece of manufacturer-side information associated with the unique ID 30X and stored in the manufacturer-side information storage area 60G of the database server 44 and cloud 60, or other manufacturer-side information required at the time of shipment. The manufacturer-side information printed on the label 71 can be visually verified. The label 71 may also include at least one of a one-dimensional barcode and a two-dimensional barcode associated with the manufacturer-side information.

[0073] The RFID reader 43 reads the unique ID 30X of the RFID tag 30 of each bulk box 20 to perform product inspection of the bulk box 20 (step S111).

[0074] Multiple bulk cartons 20, after product inspection, are bundled together and shipped to assembly manufacturer S (step S112). For example, as... Figure 12 As shown, a specified number of bulk containers 20 are stored in an outer container 81, and multiple outer containers 81 are stacked in two layers in a transport outer container 82, and then multiple transport outer containers 82 are loaded onto a pallet 83.

[0075] The outer packaging box 81 may also have an RFID tag 31 that records the unique ID 30X of the RFID tags 30 of each of the multiple bulk boxes 20 stored in the outer packaging box 81. Furthermore, the transport outer box 82 may also have an RFID tag 32 that records the RFID tags 31 of each of the multiple outer packaging boxes 81 stored in the transport outer box 82. Additionally, the pallet 83 may also have an RFID tag 33 that records the RFID tags 32 of each of the multiple transport outer boxes 82 loaded on the pallet 83. In this case, the unique ID 30X of the stored bulk boxes 20, associated with the RFID tags 31, RFID tags 32, and RFID tags 33, is stored in the manufacturer-side information storage area 60G of the database server 44 and the cloud 60. Thus, the unique ID 30X of multiple bulk boxes 20 can be read simultaneously for each outer packaging box 81, each transport outer box 82, and each pallet 83.

[0076] When multiple transport outer boxes 82 are loaded onto a pallet 83 as described above, the pallet 83 is as follows: Figure 13 As shown, the goods are transported to the shipping location by forklift 65. As the forklift 65 passes through door 66, RFID reader 43 reads RFID tags 31, RFID tags 32 and RFID tags 33 via sensor 64 located on door 66, thereby enabling shipment management to confirm that multiple bulk containers 20 associated with these RFID tags 31, RFID tags 32 and RFID tags 33 have been shipped.

[0077] Figure 14 Other methods for reading RFID tag 30 at the time of shipment are shown. Figure 14 While the outer packaging box 81 containing the bulk box 20 is being moved by the transfer table 67 through the tunnel-shaped door 68, the RFID reader 43 reads the inherent ID 30X of the RFID tag 30 via the sensor 64 installed on the door 68. The RFID reader 43, which accesses the database server 44, reads the manufacturer information associated with the read inherent ID 30X.

[0078] [User-side steps at assembly manufacturer S]

[0079] Figure 8 Details of the manufacturer-side step S2 of the process for electronic component 10, which is the assembly manufacturer S side, are shown.

[0080] At the assembly manufacturer S, a database server 54 is prepared in advance to store the user-side information described later (step S201).

[0081] (Procurement process)

[0082] During the receiving process, multiple bulk boxes 20 are first delivered to the assembly manufacturer S's factory (step S202). During the receiving process, a designated RFID reader 53 is used to read the RFID tags 30 of the delivered bulk boxes 20, and the unique ID 30X contained in the RFID tag 30 is read (step S203). As a result, at the assembly manufacturer S, based on the read unique ID 30X, manufacturer-side information is obtained via cloud 60 (step S204). The manufacturer-side information to be obtained includes the batch number of the electronic component 10, the quantity of electronic components 10 contained in the bulk box 20, product information such as performance related to the electronic component 10, environmental information related to the electronic component 10, and the inspection number of the electronic component 10.

[0083] like Figure 12 As shown, when multiple bulk boxes 20 are housed in an outer box 81 or, further, multiple outer boxes 81 are housed in a transport outer box 82 to deliver the electronic component 10 to the assembly manufacturer S, the RFID reader 53 reads the RFID tag 31 on the outer box 81 and the RFID tag 32 on the transport outer box 82. Thus, the unique ID 30X of multiple bulk boxes 20 can be read simultaneously for each outer box 81 or each transport outer box 82.

[0084] At the assembly manufacturer S, the manufacturer-side information obtained based on the inherent ID 30X read from the RFID tag 30 of the incoming bulk container 20 is stored in the user-side information storage area 60S of the cloud 60 (step S205). At the assembly manufacturer S, sometimes the user-side information required by the assembly manufacturer S is also stored as additional information in the user-side information storage area 60S of the cloud 60 (step S206).

[0085] In this embodiment, such as Figure 15 As shown, a unique identification sticker 72 for the assembly manufacturer S is affixed to the bulk box 20 (step S207). The identification sticker 72 is a sticker available in one of three colors: red, blue, or yellow, and can be affixed to the label 71. The bulk box 20 is differentiated within the assembly manufacturer S based on the color of the identification sticker 72. For example, the manufacturing line or manufacturing sequence may be selected according to the color of the identification sticker 72.

[0086] (Storage process)

[0087] At the assembly manufacturer S, if the bulk container 20 is stored in a designated storage location or picked up from the storage location for transport before being transferred to the manufacturing process, the assembly manufacturer S also uses a designated RFID reader 53 to read the inherent ID 30X of the RFID tag 30 to manage the location of the bulk container 20, i.e., to manage the location detection (step S208). It should be noted that, similarly to the component manufacturer G, the RFID tag 30 can be used for inventory information management, anti-theft management, etc., of the bulk container 20. When the RFID tag 30 is stored inside a metal box, it cannot be detected by the RFID reader 53, therefore, a metal detector and X-ray inspection device are used simultaneously.

[0088] Furthermore, at the assembly manufacturer S, such as Figure 16 As shown, the box handler 90 that processes the bulk container 20 reads the unique ID 30X of the RFID tag 30, and determines the box handler 90 as the handler of the bulk container 20 based on the read unique ID 30X (step S209). The box handler 90 is an example of a container handler, such as a worker, a work robot, or an automated guided vehicle (AGV) transporting the bulk container 20. When the box handler 90 is a worker, a portable RFID reader is used to read the RFID tag 30. Furthermore, when the box handler is a work robot or an AAV, an RFID reader mounted on the work robot or AAV is used to read the RFID tag 30.

[0089] (Manufacturing process)

[0090] During the manufacturing process, bulk boxes 20 are delivered from the storage location toward the installer 56, and the bulk boxes 20 are respectively placed into multiple component supply devices 57 provided on the installer 56. In each component supply device 57, an RFID reader 58 is used to read the inherent ID 30X of the RFID tag 30 provided on the bulk box 20, and the read inherent ID 30X is checked against the designated inherent ID 57X assigned to the component supply device 57 itself (step S210).

[0091] Therefore, it can be confirmed whether the bulk container 20 contains the electronic component 10 that should be installed by the component supply device 57, thus preventing the incorrect removal of the electronic component 10. For example, if a bulk container 20 is provided that contains an electronic component 10 that is not suitable for the component supply device 57, the component supply device 57 will not operate, the bulk container 20 will be removed from the component supply device 57, and a new bulk container 20 will be provided.

[0092] Electronic components 10 are supplied one by one from the bulk container 20 provided in the component supply device 57 to the mounter 56, and the electronic components 10 are mounted on the electronic circuit board (step S211).

[0093] In each component supply device 57, based on the quantity information of electronic components 10 stored in the bulk container 20 obtained in step S204, the consumption of electronic components 10 disposed on the electronic circuit board and the remaining quantity of electronic components 10 in the bulk container 20 based on the consumption are determined. Furthermore, if the remaining quantity of electronic components 10 is lower than a predetermined quantity, other bulk containers 20 that have been delivered are prepared (step S212).

[0094] Furthermore, the consumption of electronic component 10 is associated with its unique ID 30X and stored in the database server 54, and then stored in the manufacturer-side information storage area 60G of the cloud 60 (step S213). At the component manufacturer G, the consumption of electronic component 10 at the assembly manufacturer S can be quickly confirmed by reading the unique ID 30X. It should be noted that the consumption of electronic component 10 at the assembly manufacturer S can also be transmitted to the component manufacturer G via electronic transmission means such as the Internet or LAN, or via physical transmission means such as delivery stored in a storage device or a recording medium such as a CD-ROM.

[0095] On the other hand, the consumption of electronic component 10 is transmitted from assembly manufacturer S to component manufacturer G in the manner described above. At component manufacturer G, the remaining quantity of electronic component 10 at assembly manufacturer S is predicted based on the consumption quantity of electronic component 10 transmitted from assembly manufacturer S. If the remaining quantity of electronic component 10 is lower than a predetermined remaining quantity, the operation of storing electronic component 10 in bulk container 20 is initiated at component manufacturer G, in preparation for shipment.

[0096] At assembly manufacturer S, after all electronic components 10 are installed in bulk container 20, the empty bulk container 20 is removed from component supply device 57 and discarded (step S214). The empty bulk container 20 is sometimes returned to component manufacturer G for reuse.

[0097] In the post-manufacturing processing, for example, the bulk boxes 20 containing residual electronic components 10 are stored as interim inventory in a designated location. In this case, the RFID tag 30 of the bulk box 20 is read by the RFID reader 53, and the remaining quantity of the bulk box 20 as interim inventory is managed (step S215).

[0098] Furthermore, during the processing, by reading the RFID tag 30 of the bulk container 20, it is possible to perform manufacturing trend management based on the type of electronic components 10 used or the quantity of electronic equipment groups to be manufactured, as well as anti-theft management of the bulk container 20.

[0099] The user-side information in step S206 can also be stored in the cloud 60.

[0100] Alternatively, it could be possible to access user-side information stored in the cloud 60 from the component manufacturer G. By having access from the component manufacturer G, the component manufacturer G can grasp the specifications, form, and inventory information of the assembly manufacturer S, and therefore can anticipate the requirements of the assembly manufacturer S and respond flexibly to them.

[0101] Data stored on Cloud60 can also be stored using blockchain. By using blockchain, data stored on Cloud60 becomes more difficult to tamper with, thus increasing its reliability.

[0102] It should be noted that, in the above embodiment, the inherent ID 30X written to the RFID tag 30 is common (common inherent ID) at both the component manufacturer G and the assembly manufacturer S. A single inherent ID 30X is consistently used from component manufacturer G to assembly manufacturer S, but... Figure 17 As shown, on the component manufacturer G side, a unique inherent ID 30Y can be used, and on the assembly manufacturer S side, a unique inherent ID 30Z can be used. In this case, the component manufacturer-side inherent ID 30Y and the assembly manufacturer-side inherent ID 30Z can share various information written to the RFID tag 30 in association with a common inherent ID 30X.

[0103] Alternatively, either the component manufacturer's inherent ID 30X or the assembly manufacturer's inherent ID 30Z may be the same as the inherent ID 30X, and either the component manufacturer's inherent ID 30X or the assembly manufacturer's inherent ID 30Z may be associated with the inherent ID 30X.

[0104] The implementation method described above achieves the following effects.

[0105] (1) The electronic component management method of this embodiment includes: a manufacturer-side step performed at a component manufacturer G, which manufactures electronic components 10 as a manufacturer; and a user-side step performed at an assembly manufacturer S, which uses electronic components 10 manufactured by component manufacturer G as a user. The manufacturer-side step includes the following steps: preparing a bulk box 20 as a storage body, which stores multiple electronic components 10 and has an RFID tag 30 containing an inherent ID 30X as a unique number; storing manufacturer-side information associated with the inherent ID 30X in a manufacturer-side information storage area 60G of a cloud 60; and shipping the bulk box 20 containing multiple electronic components 10. The user-side step includes the following steps: receiving the shipped bulk box 20; reading the inherent ID 30X stored in the RFID tag 30; and obtaining manufacturer-side information stored in the manufacturer-side information storage area 60G of the cloud 60 based on the read inherent ID 30X.

[0106] Therefore, for the bulk container 20 containing multiple electronic components 10, various management methods can be implemented on both the component manufacturer G and the assembly manufacturer S sides using the inherent ID 30X of the RFID tag 30 provided on the bulk container 20. In addition, the electronic components 10 can be managed consistently from the component manufacturer G to the assembly manufacturer S using the inherent ID 30X written to the RFID tag 30.

[0107] (2) The electronic component management method of this embodiment includes: a manufacturer-side step performed at a component manufacturer G, which manufactures the electronic component 10 as a manufacturer; and a user-side step performed at an assembly manufacturer S, which uses the electronic component 10 manufactured by the component manufacturer G as a user. The manufacturer-side step includes the following steps: preparing a bulk box 20 as a storage container, which stores a plurality of electronic components 10 and is equipped with an RFID tag 30; preparing a unique number associated with manufacturer-side information. The user-side steps include: receiving the shipped bulk box 20; reading the inherent ID 30X stored in the RFID tag 30; and obtaining the manufacturer-side information stored in the manufacturer-side information storage area 60G of the cloud 60 based on the read inherent ID 30X.

[0108] Therefore, for the bulk container 20 containing multiple electronic components 10, various management methods can be implemented on both the component manufacturer G and the assembly manufacturer S sides using the inherent ID 30X of the RFID tag 30 provided on the bulk container 20. Furthermore, consistent component management can be achieved from the component manufacturer G to the assembly manufacturer S using the RFID tag 30.

[0109] (3) The electronic component management method of this embodiment further includes the following steps in the manufacturer-side step: reading manufacturer-side information based on the inherent ID 30X, making a label 71 based on the read manufacturer-side information, and affixing the label 71 to the bulk box 20.

[0110] Therefore, manufacturer-side information can be visually confirmed by viewing the label 71, eliminating the need for reading devices such as RFID readers, and enabling rapid management based on manufacturer-side information.

[0111] (4) The electronic component management method of this embodiment further includes the following steps in the manufacturer-side steps: when shipping a bulk box 20 containing multiple electronic components 10, the inherent ID 30X is read from the RFID tags 30 of the multiple bulk boxes 20.

[0112] Therefore, at the component manufacturer G, the effort of reading the RFID tags 30 of each bulk box 20 can be eliminated, thus achieving efficient management.

[0113] (5) The electronic component management method of this embodiment also includes the following steps in the user-side steps: when receiving the shipped bulk boxes 20, read the inherent ID 30X from the RFID tags 30 of multiple bulk boxes 20.

[0114] Therefore, at the assembly manufacturer S, the effort of reading the RFID tags 30 of each bulk box 20 can be eliminated, and management efficiency can be achieved.

[0115] (6) The electronic component management method of this embodiment further includes the following steps in the user-side steps: using an RFID reader 53, which is set at a predetermined location of the assembly manufacturer S as a first reading unit, to read the RFID tag 30 and detect the location of the bulk box 20.

[0116] Therefore, the location of the bulk container 20 can always be known, enabling various management functions such as inventory information management, location management, and anti-theft management.

[0117] (7) The electronic component management method of this embodiment further includes the following step in the user-side step: the box handler is identified by reading the RFID tag 30 by the box handler, which is configured at a specified location of the assembly manufacturer S as the storage body handler.

[0118] Therefore, at the assembly manufacturer S, it is possible to always identify the personnel, transport vehicles, etc. that have handled the bulk container 20, and to conduct management such as reliably knowing the current location of the bulk container 20.

[0119] (8) The electronic component management method of this embodiment further includes the following steps in the user-side steps: The component supply device 57, which is an installation device, arranges a plurality of electronic components 10 stored in the bulk box 20 on the electronic circuit board. The component supply device 57 stores a designated unique ID 57X which is designated as a designated unique number, and has an RFID reader 58 as a second reading unit for reading RFID tags 30. The RFID reader 58 checks the unique ID 30X stored in the RFID tag 30 stored in the RFID tag 30 with the designated unique ID 57X designated by the component supply device 57.

[0120] Therefore, it can be confirmed whether the inherent ID 30X of the bulk container 20 is the bulk container 20 containing the electronic component 10 that should be installed by the component supply device 57, and as a result, the misrepresentation of the electronic component 10 can be prevented.

[0121] (9) The electronic component management method of this embodiment further includes the following steps in the manufacturer-side step: storing the quantity information of the electronic components 10 stored in the bulk container 20 as manufacturer-side information in the manufacturer-side information storage area 60G of the cloud 60. In the user-side step, it further includes the following steps: based on the quantity information obtained based on the inherent ID 30X, determining the consumption of the electronic components 10 disposed on the electronic circuit board by the component supply device 57, and preparing other bulk containers 20 that have been delivered based on the consumption.

[0122] Therefore, at the assembly manufacturer S, after the supply of electronic component 10 is completed, the bulk container 20 from which the supply of electronic component 10 has ended by the component supply device 57 can be quickly replaced with a new bulk container 20, and the installation of electronic component 10 can be carried out continuously even if the bulk container 20 is replaced. As a result, productivity can be improved.

[0123] (10) In the electronic component management method of this embodiment, the consumption of electronic component 10 is associated with inherent ID 30X, which is stored in the user-side information storage area 60S of cloud 60 and transmitted to the manufacturer.

[0124] Therefore, preparation for the process of storing electronic components 10 in bulk containers 20 can be reliably carried out on the component manufacturer G side based on the consumption of electronic components 10 at the assembly manufacturer S.

[0125] (11) In the electronic component management method of this embodiment, the manufacturer stores the electronic components 10 in the bulk container 20 based on the consumption of the electronic components 10 delivered from the user.

[0126] Therefore, at the component manufacturer G, the process of storing the electronic component 10 in the bulk container 20 can be carried out efficiently based on the consumption of the electronic component 10 on the assembly manufacturer S side.

[0127] (12) In the electronic component management method of this embodiment, at the component manufacturer G, the inherent ID 30Y on the component manufacturer G side is used as an inherent ID, and at the assembly manufacturer S, the inherent ID 30Z on the assembly manufacturer S side is used as an inherent ID. Either the inherent ID 30Y on the component manufacturer G side and the inherent ID 30Z on the assembly manufacturer S side are the same as the inherent ID 30X, and either the inherent ID 30Y on the component manufacturer G side and the inherent ID 30Z on the assembly manufacturer S side are associated with the inherent ID 30X.

[0128] (13) In the electronic component management method of this embodiment, the component manufacturer G uses the inherent ID 30Y on the component manufacturer G side as an inherent ID, and the assembly manufacturer S uses the inherent ID 30Z on the assembly manufacturer S side as an inherent ID. The component manufacturer-side inherent ID 30Y and the assembly manufacturer-side inherent ID 30Z are associated with a common inherent ID 30X.

[0129] Therefore, each component manufacturer G and assembly manufacturer S, or either component manufacturer G or assembly manufacturer S, can use its own unique ID (unique ID 30Y, unique ID 30Z). Thus, it can be used by each manufacturer without changing the previous methods or patterns of adding unique IDs.

[0130] The embodiments have been described above, but the present invention is not limited to the embodiments described above. The present invention includes modifications and improvements within the scope of achieving the purpose of the present invention.

[0131] For example, at component manufacturer G, database server 44 can be omitted, and the inherent ID 30X and manufacturer-side information can be directly stored in the manufacturer-side information storage area 60G of cloud 60. Similarly, at assembly manufacturer S, database server 54 can be omitted, and the inherent ID 30X and user-side information can be directly stored in the user-side information storage area 60S of cloud 60.

[0132] Explanation of reference numerals in the attached figures

[0133] 10 electronic components;

[0134] 20 bulk boxes (storage units);

[0135] 30 RFID tags;

[0136] 30X Unique ID (unique identifier);

[0137] 30Y component manufacturer-side unique ID (manufacturer-side unique number);

[0138] 30Z Assembly Manufacturer-Side Unique ID (User-Side Unique Number);

[0139] 52 Reading Unit (First Reading Unit);

[0140] 56. Installer (installation device);

[0141] 57X specifies a unique ID (a unique identifier);

[0142] 58 RFID reader (second reading unit);

[0143] 60 Cloud (external storage device);

[0144] 60G manufacturer-side information storage area;

[0145] 60S user-side information storage area;

[0146] 71 slips;

[0147] 90 boxes of storage solution;

[0148] G component manufacturer (manufacturer-side facility);

[0149] S Assembly Manufacturer (User-Side Facility).

Claims

1. A method for managing electronic components, comprising: Manufacturer-side steps performed at the manufacturer-side facility where the manufacturer manufactures electronic components; and User-side steps performed by the user at a user-side facility where the user uses electronic components manufactured by the manufacturer-side facility. The manufacturer-side steps include the following steps: Prepare a storage container that houses multiple electronic components and is equipped to store RFID tags with unique numbers; Manufacturer-side information associated with the unique number is stored in the manufacturer-side information storage area of ​​an external storage device; and The housing containing multiple electronic components will be shipped. The user-side steps include the following steps: The already shipped storage units will be received; Read the unique number stored in the RFID tag; and Based on the unique number read, the manufacturer-side information stored in the manufacturer-side information storage area of ​​the external storage device is obtained. In the manufacturer-side step, a plurality of the housings are housed in an outer box, and the outer box is housed in a shipping carton. The outer box and the shipping carton are respectively provided with RFID tags that record information related to the housings.

2. The method for managing electronic components according to claim 1, wherein, The manufacturer-side step also includes the following steps: reading the manufacturer-side information based on the unique number, creating a label based on the read manufacturer-side information, and affixing the label to the storage body.

3. The method for managing electronic components according to claim 1 or 2, wherein, The manufacturer-side steps also include the following step: when shipping the housing containing multiple electronic components, reading the unique number from the RFID tags of the multiple housings together.

4. The method for managing electronic components according to claim 1 or 2, wherein, The user-side steps also include the following steps: when receiving the already shipped storage units, reading the unique number from the RFID tags of multiple storage units.

5. The method for managing electronic components according to claim 1 or 2, wherein, The user-side step also includes the following step: the user uses a first reading unit located at a predetermined location on the user-side facility to read the RFID tag and detect the location of the storage unit.

6. The method for managing electronic components according to claim 1 or 2, wherein, The user-side step also includes the following step: identifying the storage unit handler by reading the RFID tag by a storage unit handler located at a designated location in the user-side facility.

7. The method for managing electronic components according to claim 1 or 2, wherein, The user-side step further includes the following step: the mounting device arranges multiple electronic components housed in the housing onto an electronic circuit board. The installation device contains a designated unique number and has a second reading unit that reads the RFID tag. The unique number contained in the RFID tag read by the second reading unit is compared with the designated unique number specified for the installation device.

8. The method for managing electronic components according to claim 7, wherein, The manufacturer-side step further includes the following step: storing the quantity information of the electronic components stored in the storage body as manufacturer-side information in the manufacturer-side information storage area of ​​the external storage device. The user-side steps also include the following steps: based on the quantity information obtained based on the unique number, determining the consumption of electronic components of the mounting device disposed on the electronic circuit board, and based on the consumption, preparing other of the received storage units.

9. The method for managing electronic components according to claim 8, wherein, The consumption of the electronic components is associated with the unique serial number, which is stored in the user-side information storage area of ​​the external storage device and transmitted to the manufacturer.

10. The method for managing electronic components according to claim 9, wherein, The manufacturer stores the electronic components in the housing based on the amount of electronic components consumed from the user.

11. The method for managing electronic components according to claim 1, wherein, At the manufacturer-side facility, a manufacturer-side unique number is used as the unique number. At the user-side facility, a user-side unique number is used as the unique number. Either the manufacturer-side unique number or the user-side unique number is the same as the unique number, and either the manufacturer-side unique number or the user-side unique number is associated with the unique number.

12. The method for managing electronic components according to claim 1, wherein, At the manufacturer-side facility, a manufacturer-side unique number is used as the unique number. At the user-side facility, a user-side unique number is used as the unique number. The manufacturer-side unique number and the user-side unique number are associated with the unique number.

13. A method for managing electronic components, comprising: Manufacturer-side steps performed at the manufacturer-side facility where the manufacturer manufactures electronic components; and User-side steps performed by the user at a user-side facility where the user uses electronic components manufactured by the manufacturer-side facility. The manufacturer-side steps include the following steps: Prepare a storage unit that houses multiple electronic components and is equipped with RFID tags; Prepare a unique number associated with the manufacturer's information; The manufacturer-side information is associated with the unique number and stored in the manufacturer-side information storage area of ​​the external storage device; Write the unique number into the RFID tag; as well as The housing containing multiple electronic components will be shipped. The user-side steps include the following steps: The already shipped storage units will be received; Read the unique number stored in the RFID tag; and Based on the unique number read, the manufacturer-side information stored in the manufacturer-side information storage area of ​​the external storage device is obtained. In the manufacturer-side step, a plurality of the housings are housed in an outer box, and the outer box is housed in a shipping carton. The outer box and the shipping carton are respectively provided with RFID tags that record information related to the housings.

14. The method for managing electronic components according to claim 13, wherein, The manufacturer-side step also includes the following steps: reading the manufacturer-side information based on the unique number, creating a label based on the read manufacturer-side information, and affixing the label to the storage body.

15. The method for managing electronic components according to claim 13 or 14, wherein, The manufacturer-side steps also include the following step: when shipping the housing containing multiple electronic components, reading the unique number from the RFID tags of the multiple housings together.

16. The method for managing electronic components according to claim 13 or 14, wherein, The user-side steps also include the following steps: when receiving the already shipped storage units, reading the unique number from the RFID tags of multiple storage units.

17. The method for managing electronic components according to claim 13 or 14, wherein, The user-side step also includes the following step: the user uses a first reading unit located at a predetermined location on the user-side facility to read the RFID tag and detect the location of the storage unit.

18. The method for managing electronic components according to claim 13 or 14, wherein, The user-side step also includes the following step: identifying the storage handler by reading the RFID tag by a storage handler located at a designated location in the user-side facility.

19. The method for managing electronic components according to claim 13 or 14, wherein, The user-side step further includes the following step: the mounting device arranges multiple electronic components housed in the housing onto an electronic circuit board. The installation device contains a designated unique number and has a second reading unit that reads the RFID tag. The unique number contained in the RFID tag read by the second reading unit is compared with the designated unique number specified for the installation device.

20. The method for managing electronic components according to claim 19, wherein, The manufacturer-side step further includes the following step: storing the quantity information of the electronic components stored in the storage body as manufacturer-side information in the manufacturer-side information storage area of ​​the external storage device. The user-side steps also include the following steps: based on the quantity information obtained based on the unique number, determining the consumption of electronic components of the mounting device disposed on the electronic circuit board, and based on the consumption, preparing other of the received storage units.

21. The method for managing electronic components according to claim 20, wherein, The consumption of the electronic components is associated with the unique serial number, which is stored in the user-side information storage area of ​​the external storage device and transmitted to the manufacturer.

22. The method for managing electronic components according to claim 21, wherein, The manufacturer stores the electronic components in the housing based on the amount of electronic components consumed from the user.

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