Display panel, manufacturing method thereof, driving assembly and display device

Abstract

The application discloses a display panel and a manufacturing method, a driving assembly and a display device, and belongs to the technical field of display. The display panel can comprise a substrate, a light emitting device and a first pad. The area of the orthographic projection of each row of first pads on the first substrate gradually decreases in the direction close to the display area, so that the distance between any two adjacent first pads in a row of first pads close to the display area is greater, and / or the distance between the row of first pads closest to the display area and the row of first pads farthest from the display area is smaller. In the example, when the distance between any two adjacent first pads in a row of first pads arranged close to the display area is greater, the excess glue squeezed out between the first pad and the second pad can flow faster in the direction close to the display area, so that the effect of electrically connecting the second pad and the first pad is better, and the display effect of the display panel is effectively improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and its manufacturing method, driving components, and display device. Background Technology

[0002] With the development of display technology, display devices are becoming increasingly widely used. Common display devices include smartphones, tablets, televisions, and monitors.

[0003] Display devices typically include a display panel and a flexible circuit board. The display panel has a display area and a non-display area. The display panel may include multiple light-emitting devices located in the display area and multiple first pads located in the non-display area. These first pads can be electrically connected to the light-emitting devices via signal lines. The flexible circuit board has multiple second pads, and after being bonded to the non-display area of ​​the display panel, the multiple second pads of the flexible circuit board can be electrically connected to the multiple first pads in a one-to-one correspondence. Here, the flexible circuit board is typically bonded to the display panel using anisotropic conductive adhesive (ACF). In this way, the flexible circuit board can control the light-emitting devices in the display area of ​​the display panel to emit light, enabling the display panel to display the corresponding image.

[0004] However, after the flexible circuit board is bonded to the non-display area of ​​the display panel, the electrical connection between the multiple first pads of the display panel and the multiple second pads of the flexible circuit board via ACF is poor, resulting in a poor display effect of the display panel. Summary of the Invention

[0005] This application provides a display panel, its manufacturing method, driving components, and a display device. It can solve the problem of poor display effect in existing display panels. The technical solution is as follows:

[0006] On one hand, a display panel is provided, the display panel having a display area and a non-display area located around the display area, the display panel comprising:

[0007] First substrate;

[0008] Multiple light-emitting devices located within the display area;

[0009] The plurality of first pads are located in the non-display area. The plurality of first pads are used to electrically connect to the plurality of light-emitting devices and to the driving component. The plurality of first pads are arranged in multiple rows, and the multiple rows of first pads are distributed sequentially in a direction away from the display area.

[0010] The area of ​​the orthographic projection of the first pad in each row onto the first substrate gradually decreases along the direction closer to the display area.

[0011] Optionally, the plurality of first pads are arranged in multiple rows along a first direction and in multiple columns along a second direction;

[0012] Among them, the width of each first pad in the first pad in the same column in the first direction and / or the width in the second direction gradually decreases along the direction closer to the display area.

[0013] Optionally, the width of the first pads in different rows is equal in the first direction, and the distance between adjacent first pads in every two rows is equal;

[0014] The width of each first pad in the same column of the first pads in the second direction gradually decreases along the direction closer to the display area; and the distance between every two adjacent first pads in each row of the first pads gradually increases along the direction closer to the display area.

[0015] Optionally, the width of the first pads in different rows is equal in the second direction, and the distance between any two adjacent first pads in each row is equal.

[0016] The width of each first pad in the first direction within the same column of the first pads gradually decreases as it approaches the display area; and the distance between two adjacent rows of the first pads gradually increases as it approaches the display area.

[0017] Optionally, the width of each first pad in the first pad in the same column in the first direction and the width in the second direction gradually decrease along the direction closer to the display area; the distance between every two adjacent first pads in each row of the first pads gradually increases along the direction closer to the display area; and the distance between two adjacent first pads in two rows gradually increases along the direction closer to the display area.

[0018] Optionally, the width of the first pads in different rows is equal in the second direction, the distance between any two adjacent first pads in each row is equal, and the distance between any two adjacent first pads in each row is equal.

[0019] The width of each first pad in the first direction within the same column of the first pads gradually decreases along the direction closer to the display area.

[0020] Optionally, the distance between any two adjacent first pads in each row is equal;

[0021] The width of each first pad in the first pad of the same column in the first direction and the width in the second direction gradually decrease along the direction closer to the display area; and the distance between every two adjacent first pads in each row of the first pads gradually increases along the direction closer to the display area.

[0022] Optionally, for two adjacent first pads in the same column, the width of the first pad closer to the display area in the first direction is 5% to 10% smaller than the width of the other first pad in the first direction.

[0023] Optionally, for two adjacent first pads within the same column of first pads, the width of the first pad closer to the display area in the second direction is 5% to 10% smaller than the width of the other first pad in the second direction.

[0024] Optionally, the first pad has multiple corners, the corners including at least one of rounded corners and chamfers.

[0025] Optionally, when the corner is a rounded corner, the radius of the rounded corner ranges from 10% to 50% of the width of the first pad in the first direction.

[0026] Optionally, when the corner is a chamfer, the angle between the chamfer's bevel and the second direction ranges from 15° to 45°, and the width of the chamfer in the second direction ranges from 10% to 20% of the width of the first pad in the second direction.

[0027] Optionally, when the corner includes the rounded corner and the chamfer, the angle between the chamfer's bevel and the second direction ranges from 15° to 45°, and the width of the chamfer in the second direction ranges from 10% to 20% of the width of the first pad in the second direction.

[0028] The radius of the fillet ranges from 10% to 50% of the target width, where the target width is the difference between the width of the first pad in the second direction and the width of the two chamfers in the second direction.

[0029] Optionally, the plurality of first pad arrays are arranged in at least 4 rows.

[0030] Optionally, the areas of the orthographic projections of each first pad in the same row onto the first substrate are the same, and the distance between any two adjacent first pads in the same row is the same.

[0031] On the other hand, a driving component is provided, the driving component having a device region and a connection region located on one side of the device region, the driving component comprising:

[0032] Second substrate;

[0033] The driver chip located within the device area;

[0034] The plurality of second pads are located within the connection area. The plurality of second pads are used for electrical connection with the driver chip and the display panel. The plurality of second pads are arranged in multiple rows, and the multiple rows of second pads are distributed sequentially in a direction away from the device area.

[0035] The area of ​​the orthogonal projection of each row of the second pads onto the second substrate gradually decreases along the direction away from the device region.

[0036] In another aspect, a display device is provided, comprising: any of the above-described display panels and a driving component, wherein a plurality of first pads in the display panel are electrically connected to a plurality of second pads in the driving component in a one-to-one correspondence.

[0037] The beneficial effects of the technical solutions provided in this application include at least the following:

[0038] A display panel includes a substrate, light-emitting devices, and first pads. The area of ​​the orthographic projection of each row of first pads onto the first substrate gradually decreases towards the display area, such that the distance between any two adjacent first pads in a row of first pads closer to the display area is larger, and / or the distance between the row of first pads closest to the display area and the row of first pads farthest from the display area is smaller. Furthermore, during the bonding of the driving components to the display panel via an ACF (Advanced Particulate Fiber), after excess adhesive in the ACF between the second and first pads is squeezed out, this excess adhesive can flow towards the display area. Thus, when the distance between any two adjacent first pads in a row of first pads arranged closer to the display area is larger, the excess adhesive squeezed out from between the first and second pads in the ACF can flow towards the display area more quickly. Similarly, when the distance between the row of first pads closest to the display area and the row of first pads furthest from the display area is small, the excess adhesive squeezed out from between the first and second pads in the ACF flows a shorter distance towards the display area, allowing the excess adhesive to overflow the bonding area more quickly. This prevents excess adhesive from accumulating in the bonding area between the second and first pads, ensuring that the conductive particles between the second and first pads can make close contact with both pads respectively. This results in a better electrical connection between the second and first pads, effectively improving the display effect of the display panel. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a top view of a display device provided by related technologies;

[0041] Figure 2 yes Figure 1 A schematic cross-sectional view of the display device at point A-A' is shown;

[0042] Figure 3 This is a schematic diagram of the arrangement of the first pad in a non-display area provided by related technologies;

[0043] Figure 4 This is a three-dimensional structural diagram of a display panel provided in an embodiment of this application;

[0044] Figure 5 This is a cross-sectional schematic diagram of the bonding of a display panel and a driving component provided in an embodiment of this application;

[0045] Figure 6 This is a schematic diagram of the arrangement of a first pad provided in an embodiment of this application;

[0046] Figure 7 This is a schematic diagram of another arrangement of the first pads provided in an embodiment of this application;

[0047] Figure 8 This is a schematic diagram of the first type of first pad arrangement provided in the embodiments of this application;

[0048] Figure 9 yes Figure 8 A cross-sectional schematic diagram showing the bonding of multiple rows of first pads to their corresponding second pads;

[0049] Figure 10 This is a schematic diagram of the second type of first pad arrangement provided in the embodiments of this application;

[0050] Figure 11 This is a schematic diagram of the third type of first pad arrangement provided in the embodiments of this application;

[0051] Figure 12 This is a schematic diagram of the fourth type of first pad arrangement provided in the embodiments of this application;

[0052] Figure 13 This is a schematic diagram of the fifth type of first pad arrangement provided in the embodiments of this application;

[0053] Figure 14 This is a schematic diagram of a first pad and a second pad provided in an embodiment of this application;

[0054] Figure 15 This is a top view of a first pad provided in an embodiment of this application;

[0055] Figure 16 This is a top view of yet another first pad provided in an embodiment of this application;

[0056] Figure 17 This is a top view of another first pad provided in an embodiment of this application;

[0057] Figure 18 This is a top view of a display panel provided in an embodiment of this application;

[0058] Figure 19 This is a top view of a driving component provided in an embodiment of this application;

[0059] Figure 20 This is a schematic diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0061] Please refer to the relevant technologies. Figure 1 and Figure 2 , Figure 1 This is a top view of a display device provided by related technologies. Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the display device at point A-A'. The display device 00 typically includes a display panel 10, a flexible circuit board 20, and an ACF 30 located between the display panel 10 and the flexible circuit board 20. The display panel 10 has a display area 1a and a non-display area 1b surrounding the display area 1a. The flexible circuit board 20 can be bonded to the non-display area 1b of the display panel 00 via the ACF 30. The area of ​​the orthographic projection of the ACF 30 onto the display panel 10 is typically the bonding area.

[0062] The display panel 10 may include a plurality of light-emitting devices (not shown) located in the display area, and a plurality of first pads 11 located in the non-display area 1b. The plurality of first pads 11 may be electrically connected to the light-emitting devices via signal lines. The plurality of first pads 11 may be distributed in the bonding area of ​​the non-display area 1b.

[0063] The flexible circuit board 20 has multiple second pads 21, and the multiple second pads 21 of the flexible circuit board 20 can be electrically connected to multiple first pads 11 in a one-to-one correspondence. In this way, the flexible circuit board 20 can apply electrical signals to the display panel 10 through the electrically connected second pads 21 and first pads 11 to control the light-emitting devices in the display panel 10 to emit light, thereby enabling the display panel 10 to display the corresponding image.

[0064] The second pad of the flexible circuit board 20 and the corresponding first pad 11 of the display panel 10 can be electrically connected via the ACF 30. During the bonding process between the flexible circuit board and the display panel 10 via the ACF, pressure needs to be applied to the flexible circuit board 20 to expel the adhesive within the ACF 30 located between the second pad 21 and the first pad 11, allowing the second pad 21 and the first pad 11 to be electrically connected via the conductive particles F within the ACF. Furthermore, heating is typically required during this process to allow excess adhesive in the ACF 30 within the bonding area to overflow through the area between two adjacent first pads 11, thereby ensuring a good electrical connection between the second pad 21 and the first pad 11 via the conductive particles F.

[0065] like Figure 1 As shown, the non-display area 1b of the display panel 10 typically also has multiple electrical pads 12. These electrical pads 12 are arranged in a direction away from the display area 1a, opposite to the multiple first pads 11. After the flexible circuit board is bonded to the non-display area 1b of the display panel 10 via the ACF 30, the multiple electrical pads 12 can also be electrically connected to the flexible circuit board 20 via the ACF 30, allowing the multiple electrical pads 12 to be electrically connected to the power supply components via the flexible circuit board 20. Thus, during the bonding process of the flexible circuit board to the display panel 10 via the ACF 30, excess adhesive in the ACF 30 is squeezed out into the area between two adjacent first pads 11. This excess adhesive then flows primarily in a direction away from the multiple electrical pads 12 (i.e., closer to the display area 1a) to overflow from the bonding area.

[0066] However, in order for the display panel 10 to achieve high resolution, more signal lines need to be arranged in the display panel 10, and each signal line is electrically connected to a first pad 11. This results in an increase in the number of first pads 11 arranged in the non-display area of ​​the display panel 10.

[0067] In this case, please refer to Figure 3 , Figure 3This is a schematic diagram of the arrangement of the first pads in a non-display area provided by related technologies. The number of rows of the first pads 11 distributed in the non-display area needs to be increased, and the number of first pads 11 arranged within each row also needs to be increased. Thus, the number of rows of the first pads 11 distributed in the non-display area is relatively large, and the number of first pads 11 arranged within each row is also relatively large.

[0068] During the bonding process, excess adhesive in the ACF 30 needs to flow towards the display area 1a. Therefore, when there are many rows of first pads 11 distributed in the non-display area, the length T2 of the channel used to allow the adhesive to overflow from the bonding area is relatively large. Here, the channel used to allow the adhesive to overflow from the bonding area refers to the area located between two rows of first pads 11. Furthermore, the longer the length T2 of the channel used to allow the adhesive to overflow from the bonding area, the less likely excess adhesive in the ACF 30 is to overflow from this channel. Therefore, when there are many rows of first pads 11 distributed in the non-display area, the adhesive located between the second pad 21 and the first pad 11 is difficult to drain, which severely affects the electrical connection effect between the second pad 21 and the first pad 11 through the conductive particles F in the ACF.

[0069] When there are many first pads 11 arranged in each row of first pads 11, the width between any two adjacent first pads 11 is small, resulting in a smaller channel width T1 for the adhesive to overflow from the bonding area. Furthermore, the smaller the channel width T1 for the adhesive to overflow from the bonding area, the less likely excess adhesive in the ACF 30 will overflow from this channel. Therefore, when there are many first pads 11 arranged in each row of first pads 11, it exacerbates the difficulty of adhesive removal between the second pad 21 and the first pad 11, further affecting the effectiveness of the electrical connection between the second pad 21 and the first pad 11 through the conductive particles F within the ACF.

[0070] Furthermore, after applying pressure to the flexible circuit board 20, the temperature of the ACF 03 decreases, causing the ACF 03 adhesive located between the flexible circuit board 20 and the display panel 10 to solidify. As a result, since the adhesive between the second pad 21 and the first pad 11 does not overflow from the channel, excess adhesive between the second pad 21 and the first pad 11 solidifies. This solidified adhesive between the second pad 21 and the first pad 11 prevents the conductive particles F between the second pad 21 and the first pad 11 from making close contact, leading to poor bonding between the second pad 21 and the first pad 11.

[0071] Please refer to Figure 4 , Figure 4This is a three-dimensional structural schematic diagram of a display panel provided in an embodiment of this application. The display panel 000 has a display area 00a and a non-display area 00b located around the display area 00a. The display panel 000 may include: a first substrate 100, a light-emitting device (not shown) located in the display area 00a, and a plurality of first pads 200 located in the non-display area 00b.

[0072] Multiple first pads 200 are used for electrical connection with multiple light-emitting devices and with a driving component. The multiple first pads 200 are arranged in multiple rows, with the rows of first pads 200 distributed sequentially in a direction away from the display area 00a. Here, the driving component can be a flexible circuit board or a separate driving chip. When the driving component is a flexible circuit board, the driving chip can be integrated within the flexible circuit board. For example, the driving component has multiple second pads corresponding one-to-one with the multiple first pads 200. After the driving component is bonded to the display panel 000, the multiple second pads can be electrically connected one-to-one with the multiple first pads 200. It should be noted that this embodiment only illustrates the case where the driving component is a flexible circuit board.

[0073] To better understand the electrical connections between the driver components and the display panel 000, please refer to [the relevant documentation / reference]. Figure 5 , Figure 5 This is a cross-sectional schematic diagram of the bonding between a display panel and a driving component according to an embodiment of this application. The second pad 011 in the driving component 111 can be electrically connected to the first pad 200 in the display panel 000 via an ACF 222. Thus, during the bonding process of the driving component 111 to the display panel 000, pressure can be applied to the driving component 111, causing excess adhesive in the ACF 222 between each second pad 011 and its corresponding first pad 200 to be squeezed out, thereby allowing the second pad 011 and the first pad 200 to be electrically connected via conductive particles E in the ACF. In this way, the driving component 111 can be electrically connected to multiple first pads 200 in a one-to-one correspondence via multiple second pads 011, controlling the light-emitting devices within the display panel 000 to emit light, thereby enabling the display panel 000 to display a corresponding image. The area where the driving component 111 is bonded to the display panel 000 is typically a bonding area, and this bonding area is located within the non-display area 00b of the display panel 000.

[0074] In this embodiment, the display panel 000 may further include a plurality of power-connecting pads 300 located within the non-display area 00b, the plurality of power-connecting pads 300 being located on the side of the plurality of first pads 200 facing away from the display area 00a. Here, the plurality of power-connecting pads 300 may be arranged in a row, and the power-connecting pads 300 are used to supply power to the driving component 111 electrically connected thereto. After the driving component 111 is bonded to the non-display area 00b of the display panel 000 via the ACF 222, the plurality of power-connecting pads 300 also need to be electrically connected to the driving component 111 via the ACF 222, so that the plurality of power-connecting pads 300 can be electrically connected to the power supply component via the driving component 111. Thus, during the bonding process of the drive component 111 to the display panel 000 via the ACF 222, after the excess adhesive in the ACF 222 is squeezed out into the area between two adjacent first pads 200, this excess adhesive mainly flows away from the multiple electrical pads 300 (i.e., towards the display area 00a) to overflow from the bonding area.

[0075] To get a clearer view of the layout of the first pad 200, please refer to... Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the arrangement of a first pad provided in an embodiment of this application. Figure 7 This is a schematic diagram of another arrangement of the first pads provided in an embodiment of this application. The area of ​​the orthographic projection of each row of first pads 200 on the first substrate 100 gradually decreases along the direction closer to the display area 00a. Here, the area of ​​the orthographic projection of each first pad 200 in the same row on the first substrate 100 is the same, and the distance between any two adjacent first pads 200 in the same row is the same.

[0076] In one case, such as Figure 6As shown, the area of ​​each first pad 200 projected onto the first substrate 100 is smaller the closer it is to the display area 00a, and the greater the distance between any two adjacent first pads 200 in this row. In this case, during the bonding process of the drive component 111 to the display panel 000 via the ACF 222, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out, and this excess adhesive can flow towards the display area 00a. Therefore, when the distance between any two adjacent first pads 200 in a row of first pads 200 arranged closer to the display area 00a is greater, the excess adhesive squeezed out from between the first pad 200 and the second pad 011 in the ACF 222 can flow towards the display area 00a more quickly. In this way, excess adhesive between the second pad 011 and the first pad 200 will not accumulate in the bonding area, allowing the conductive particles E between the second pad 011 and the first pad 200 to make close contact with the second pad 011 and the first pad 200 respectively, thereby achieving a better electrical connection between the second pad 011 and the first pad 200.

[0077] In another case, such as Figure 7 As shown, the area of ​​each first pad 200 in a row of first pads 200 arranged closer to the display area 00a on the first substrate 100 is smaller, and the distance between the row of first pads 200 closest to the display area 00a and the row of first pads 200 farthest from the display area 00a is smaller. In this case, since excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out during the bonding process of the drive component 111 to the display panel 000 via the ACF 222, this excess adhesive can flow towards the display area 00a. Therefore, when the distance between the row of first pads 200 closest to the display area 00a and the row of first pads 200 farthest from the display area 00a is small, the excess adhesive squeezed out from between the first pad 200 and the second pad 011 in the ACF 222 flows a shorter distance towards the display area 00a, allowing the excess adhesive to overflow the bonding area more quickly. In this way, excess adhesive between the second pad 011 and the first pad 200 will not accumulate in the bonding area, allowing the conductive particles E between the second pad 011 and the first pad 200 to make close contact with the second pad 011 and the first pad 200 respectively, thereby achieving a better electrical connection between the second pad 011 and the first pad 200.

[0078] Thus, even though there are a large number of first pads 200 distributed in the non-display area 00b, it can still ensure that the adhesive squeezed out between the second pad 011 and the first pad 200 can more easily overflow from the bonding area of ​​the display panel 000, without affecting the effect of the second pad 011 and the first pad 200 being electrically connected through the conductive particles E, resulting in a better display effect of the display panel 000.

[0079] In summary, the display panel provided in this application includes: a substrate, a light-emitting device, and first pads. The area of ​​the orthographic projection of each row of first pads on the first substrate gradually decreases along the direction closer to the display area, such that the distance between any two adjacent first pads in a row of first pads closer to the display area is larger, and / or the distance between the row of first pads closest to the display area and the row of first pads farthest from the display area is smaller. Furthermore, during the bonding and connection of the driving components to the display panel via the ACF, after excess adhesive in the ACF between the second pad and the first pad is squeezed out, the excess adhesive can flow towards the direction closer to the display area. Thus, when the distance between any two adjacent first pads in a row of first pads arranged closer to the display area is larger, the excess adhesive squeezed out from between the first pad and the second pad in the ACF can flow towards the direction closer to the display area more quickly. Similarly, when the distance between the row of first pads closest to the display area and the row of first pads furthest from the display area is small, the excess adhesive squeezed out from between the first and second pads in the ACF flows a shorter distance towards the display area, allowing the excess adhesive to overflow the bonding area more quickly. This prevents excess adhesive from accumulating in the bonding area between the second and first pads, ensuring that the conductive particles between the second and first pads can make close contact with both pads respectively. This results in a better electrical connection between the second and first pads, effectively improving the display effect of the display panel.

[0080] In the embodiments of this application, such as Figure 4 As shown, multiple first pads 200 are arranged in multiple rows along a first direction D1 and in multiple columns along a second direction D2. Here, the first direction D1 and the second direction D2 can be two mutually perpendicular directions.

[0081] Specifically, the width of each first pad 200 within the same column of first pads 200 in the first direction D1 and / or the width in the second direction D2 gradually decreases towards the display area 00a. Thus, the area of ​​the orthographic projection of the first pad 200 closer to the display area 00a in the same column of first pads 200 onto the first substrate 100 is smaller. It should be noted that the first pads 200 in each row of first pads 200 are arranged at equal intervals, so that the central axes of the first pads 200 in a column of first pads 200 coincide.

[0082] In this embodiment, since the width of the first pads 200 in the same column in the first direction D1 and the width in the second direction D2 can be combined in multiple ways, there are multiple possible arrangements of the multiple first pads 200 in the display panel 000. This embodiment only uses the following five examples for illustrative purposes.

[0083] It should be noted that, in order to facilitate the description of the arrangement of the first pad 200 in the following embodiments, in this application, the width of the first pad 200 in the first direction D1 is represented as K1; the distance between adjacent first pads 200 in the first direction D1 is represented as K2; the width of the first pad 200 in the second direction D2 is represented as K3; and the distance between adjacent first pads 200 in the second direction D2 is represented as K4.

[0084] For the first optional implementation method, please refer to... Figure 8 , Figure 8 This is a schematic diagram of the arrangement of the first pads provided in the embodiments of this application. The width K1 of the first pads 200 in different rows is equal in the first direction D1, and the distance K2 between any two adjacent first pads 200 in each row is equal.

[0085] The width K3 of each first pad 200 within the same column of first pads 200 in the second direction D2 gradually decreases towards the display area 00a. The distance K4 between any two adjacent first pads 200 within each row of first pads 200 gradually increases towards the display area 00a, such that the distance between adjacent columns of first pads 200 gradually increases towards the display area 00a. This ensures that the area of ​​the orthographic projection of the first pad 200 closer to the display area 00a on the first substrate 100 is smaller. Thus, excess adhesive between the second pad 011 and the first pad 200 mainly flows towards the display area 00a within the region between adjacent columns of first pads 200. Here, the region between two columns of first pads 200 can serve as a channel for excess adhesive to overflow from the bonding area.

[0086] In this case, please refer to Figure 9 , Figure 9 yes Figure 8 The diagram shows a cross-sectional view of multiple rows of first pads bonded to their corresponding second pads. Assume that... Figure 8The multiple first pads 200 are arranged in 5 rows, with the row of first pads furthest from the display area 00a designated as the first row, and the row of first pads closest to the display area 00a designated as the fifth row. The distance between any two adjacent first pads in the first row is K41, in the second row it is K42, in the third row it is K43, in the fourth row it is K44, and in the fifth row it is K45. In this configuration, the values ​​of K41, K42, K43, K44, and K45 gradually increase, resulting in a wider channel width closer to the display area 00a for the adhesive to overflow from the bonding area. Thus, during the bonding of the drive component 111 to the non-display area 00b of the display panel 000, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out into the area between two adjacent columns of first pads 200. Since the channel width for the adhesive to overflow from the bonding area is larger closer to the display area 00a, the excess adhesive squeezed out between the two adjacent columns of first pads 200 can flow out of the bonding area more quickly towards the display area 00a. It should be noted that... Figure 9 This illustration is based on the example where the arrangement and size of the multiple second pads 011 in the driving component 111 are the same as the arrangement and size of the first pad 200. In other possible implementations, the size of each second pad 011 in the driving component 111 can be the same, and this embodiment does not limit this.

[0087] In this embodiment of the application, for two adjacent first pads 200 in the same column of first pads 200, the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is 5% to 10% smaller than the width K3 of the other first pad 200 in the second direction D2.

[0088] For example, assume that the first pad in the row furthest from display area 00a is the first pad in row 1, and the first pad in the row closest to display area 00a is the first pad in row N. Furthermore, the width of each first pad in row 1 (200) in the first direction D1 is K11, and the width of each first pad in row N (200) in the first direction D1 is K1. N The distance between the first pad in row 1 and the first pad in row 2 is K21, and the distance between the first pad in row N-1 and the first pad in row N is K2. N-1The width of each first pad in the first row of the first pad is K31 in the second direction D2, and the width of each first pad in the first row of the Nth row is K3. N The distance between any two adjacent first pads in the first row is K41, and the distance between any two adjacent first pads in the first row is K4. N .

[0089] Then, in Figure 8 In the arrangement of the first pads shown, the dimensions of each first pad satisfy the following relationship:

[0090] K11 = K12 = ... = K1 N ;

[0091] K21 = K22 = ... = K2 N-1 ;

[0092] K32=K31-K31(5%~10%),...,K3 N =K3 N-1 -K3 N-1 (5%–10%)

[0093] K42=K41+K31(5%~10%),……,K4 N =K4 N-1 +K3 N-1 (5% to 10%).

[0094] For the second optional implementation method, please refer to... Figure 10 , Figure 10 This is a schematic diagram of the second type of first pad arrangement provided in the embodiments of this application. The width K3 of the first pads 200 in different rows is equal in the second direction D2, and the distance K4 between any two adjacent first pads 200 in each row is equal.

[0095] The width K1 of each first pad 200 within the same column of first pads 200 in the first direction D1 gradually decreases towards the display area 00a. The distance K2 between two adjacent rows of first pads 200 gradually increases towards the display area 00a. This ensures that the area of ​​the orthographic projection of the first pad 200 closer to the display area 00a on the first substrate 100 is smaller. Thus, excess adhesive between the second pad 011 and the first pad 200 mainly flows in the second direction D2 within the region between two adjacent rows of first pads 200. Here, the region between two rows of first pads 200 can serve as a channel for excess adhesive to overflow from the bonding area.

[0096] In this scenario, during the bonding of the drive assembly 111 to the non-display area 00b of the display panel 000, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out into the area between two adjacent rows of first pads 200. Furthermore, since the area between two adjacent rows of first pads 200 is wider closer to the display area 00a, that is, the channel width for the adhesive to overflow from the bonding area is larger, the excess adhesive squeezed out between the two adjacent rows of first pads 200 flows out of the bonding area more quickly in the second direction D2.

[0097] In this embodiment of the application, for two adjacent first pads 200 in the same column of first pads 200, the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is 5% to 10% smaller than the width K1 of the other first pad 200 in the first direction D1.

[0098] For example, assume that the first pad in the row furthest from display area 00a is the first pad in row 1, and the first pad in the row closest to display area 00a is the first pad in row N. Furthermore, the width of each first pad in row 1 (200) in the first direction D1 is K11, and the width of each first pad in row N (200) in the first direction D1 is K1. N The distance between the first pad in row 1 and the first pad in row 2 is K21, and the distance between the first pad in row N-1 and the first pad in row N is K2. N-1 The width of each first pad in the first row of the first pad is K31 in the second direction D2, and the width of each first pad in the first row of the Nth row is K3. N The distance between any two adjacent first pads in the first row is K41, and the distance between any two adjacent first pads in the first row is K4. N .

[0099] Then, in Figure 10 In the arrangement of the first pads shown, the dimensions of each first pad satisfy the following relationship:

[0100] K12=K11-K11(5%~10%),...,K1 N =K1 N-1 -K1 N-1 (5%–10%)

[0101] K22=K21+K11(5%~10%),...,K2 N-1 =K2 N-2 +K1 N-1 (5%–10%)

[0102] K31 = K32 = ... = K3 N ;

[0103] K41 = K42 = ... = K4 N .

[0104] For the third optional implementation method, please refer to... Figure 11 , Figure 11 This is a schematic diagram of the third type of first pad arrangement provided in this application embodiment. The width K1 of each first pad 200 in the same column of first pads 200 in the first direction D1 and the width K3 in the second direction D2 gradually decreases along the direction closer to the display area 00a. The distance K4 between any two adjacent first pads 200 in each row of first pads 200 gradually increases along the direction closer to the display area 00a, such that the distance between two adjacent columns of first pads 200 gradually increases along the direction closer to the display area 00a. Furthermore, the distance K2 between two adjacent rows of first pads 200 gradually increases along the direction closer to the display area 00a. This ensures that the projected area of ​​each first pad 200 closer to the display area 00a on the first substrate 100 is smaller. Thus, excess adhesive between the second pad 011 and the first pad 200 can flow in the area between two adjacent rows of first pads 200 and between two adjacent columns of first pads 200, and this excess adhesive can flow in the second direction D2 or towards the display area 00a. Here, the area between two rows of first pads 200 can serve as a channel for excess adhesive to overflow from the bonding area, and the area between two columns of first pads 200 can also serve as a channel for excess adhesive to overflow from the bonding area.

[0105] In this case, the closer to the display area 00a, the greater the distance between any two adjacent first pads 200 in a row of first pads 200, and the greater the distance between any two adjacent first pads 200 in a column of first pads 200. That is, the wider channel for the adhesive to overflow from the bonding area is larger. During the bonding of the drive assembly 111 to the non-display area 00b of the display panel 000, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out to the area between two adjacent rows of first pads 200 and the area between two adjacent columns of first pads 200, so that a portion of this excess adhesive flows out of the bonding area in the second direction D2, and another portion of this excess adhesive flows out of the bonding area in the direction closer to the display area 00a.

[0106] In this embodiment, for two adjacent first pads 200 within the same column of first pads 200, the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is 5% to 10% smaller than the width K1 of the other first pad 200 in the first direction D1. Furthermore, for two adjacent first pads 200 within the same column of first pads 200, the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is 5% to 10% smaller than the width K3 of the other first pad 200 in the second direction D2.

[0107] For example, assume that the first pad in the row furthest from display area 00a is the first pad in row 1, and the first pad in the row closest to display area 00a is the first pad in row N. Furthermore, the width of each first pad in row 1 (200) in the first direction D1 is K11, and the width of each first pad in row N (200) in the first direction D1 is K1. N The distance between the first pad in row 1 and the first pad in row 2 is K21, and the distance between the first pad in row N-1 and the first pad in row N is K2. N-1 The width of each first pad in the first row of the first pad is K31 in the second direction D2, and the width of each first pad in the first row of the Nth row is K3. N The distance between any two adjacent first pads in the first row is K41, and the distance between any two adjacent first pads in the first row is K4. N .

[0108] Then, in Figure 11 In the arrangement of the first pads shown, the dimensions of each first pad satisfy the following relationship:

[0109] K12=K11-K11(5%~10%),...,K1 N =K1 N-1 -K1 N-1 (5%–10%)

[0110] K22=K21+K11(5%~10%),...,K2 N-1 =K2 N-2 +K1 N-1 (5%–10%)

[0111] K32=K31-K31(5%~10%),...,K3 N =K3 N-1 -K3 N-1 (5%–10%)

[0112] K42=K41+K31(5%~10%),……,K4N =K4 N-1 +K3 N-1 (5% to 10%).

[0113] Furthermore, if any two adjacent first pads 200 in a column of first pads 200 near the display area 00a are closely arranged, the distance between the first pad in the Nth row closest to the display area 00a and the first pad in the 1st row farthest from the display area 00a is smaller, thus reducing the length of the channel used to allow the adhesive to overflow from the bonding area. In this way, excess adhesive in the areas between adjacent rows of first pads 200 and between adjacent columns of first pads 200 is more likely to flow and overflow from the bonding area towards the display area 00a through the channel between adjacent columns of first pads 200.

[0114] For the fourth optional implementation method, please refer to... Figure 12 , Figure 12 This is a schematic diagram of the fourth type of first pad arrangement provided in the embodiments of this application. The width K3 of the first pads 200 in different rows is equal in the second direction D2, the distance K4 between any two adjacent first pads 200 in each row is equal, and the distance K2 between any two adjacent first pads 200 in each row is equal.

[0115] The width K1 of each first pad 200 within the same column of first pads 200 gradually decreases in the direction D1 towards the display area 00a. This results in a smaller distance between the row of first pads 200 closest to the display area 00a and the row of first pads 200 furthest from the display area within the bonding area; that is, the length of the region between adjacent columns of first pads 200 is shorter, thus creating a shorter channel for the adhesive to overflow from the bonding area. Consequently, excess adhesive between the second pad 011 and the first pads 200 mainly flows towards the display area 00a within the region between adjacent columns of first pads 200. Here, the region between two columns of first pads 200 can serve as a channel for excess adhesive to overflow from the bonding area.

[0116] In this scenario, during the bonding of the drive assembly 111 to the non-display area 00b of the display panel 000, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out into the area between two adjacent columns of first pads 200. Furthermore, because the channel length within the bonding area for the adhesive to overflow from the bonding area is relatively short, the excess adhesive squeezed out between the two adjacent columns of first pads 200 flows a shorter distance towards the display area 00a, making it easier for the excess adhesive to overflow from the bonding area towards the display area 00a through the channel between the two adjacent columns of first pads 200.

[0117] In this embodiment of the application, for two adjacent first pads 200 in the same column of first pads 200, the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is 5% to 10% smaller than the width K1 of the other first pad 200 in the first direction D1.

[0118] For example, assume that the first pad in the row furthest from display area 00a is the first pad in row 1, and the first pad in the row closest to display area 00a is the first pad in row N. Furthermore, the width of each first pad in row 1 (200) in the first direction D1 is K11, and the width of each first pad in row N (200) in the first direction D1 is K1. N The distance between the first pad in row 1 and the first pad in row 2 is K21, and the distance between the first pad in row N-1 and the first pad in row N is K2. N-1 The width of each first pad in the first row of the first pad is K31 in the second direction D2, and the width of each first pad in the first row of the Nth row is K3. N The distance between any two adjacent first pads in the first row is K41, and the distance between any two adjacent first pads in the first row is K4. N .

[0119] Then, in Figure 12 In the arrangement of the first pads shown, the dimensions of each first pad satisfy the following relationship:

[0120] K12=K11-K11(5%~10%),...,K1 N =K1 N-1 -K1 N-1 (5%–10%)

[0121] K21 = K22 = ... = K2 N-1 ;

[0122] K31 = K32 = ... = K3 N ;

[0123] K41 = K42 = ... = K4 N .

[0124] For the fifth optional implementation method, please refer to... Figure 13 , Figure 13 This is a schematic diagram of the fifth type of first pad arrangement provided in the embodiments of this application. The distance K2 between any two adjacent first pads 200 in each row is equal.

[0125] The width K1 of each first pad 200 in the first direction D1 and the width K3 in the second direction D2 within the same column of first pads 200 gradually decreases towards the display area 00a, and the distance K4 between any two adjacent first pads 200 in each row of first pads 200 gradually increases towards the display area 00a. Here, the projected area of ​​each first pad 200 on the first substrate 100 near the display area 00a gradually decreases, the distance between two adjacent columns of first pads 200 gradually increases, and the length of the region between two adjacent columns of first pads 200 in the bonding area is relatively short. Thus, excess adhesive between the second pad and the first pad 200 mainly flows towards the display area 00a within the region between two adjacent columns of first pads 200. Here, the region between two columns of first pads 200 can serve as a channel for excess adhesive to overflow from the bonding area.

[0126] In this scenario, during the bonding of the drive assembly 111 to the non-display area 00b of the display panel 000, excess adhesive in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out into the area between two adjacent columns of first pads 200. Furthermore, because the length of the area between two adjacent columns of first pads 200 within the bonding area is relatively short, and the distance between two adjacent columns of first pads 200 near the display area 00a is relatively large—that is, the channel for the adhesive to overflow from the bonding area is relatively short and relatively wide—the excess adhesive squeezed out between the adjacent columns of first pads 200 can more easily flow towards the display area 00a, and more excess adhesive overflows from the bonding area, effectively improving the electrical connection between each second pad 011 and the first pad 200 within the bonding area.

[0127] In this embodiment, for two adjacent first pads 200 within the same column of first pads 200, the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is 5% to 10% smaller than the width K1 of the other first pad 200 in the first direction D1. Furthermore, for two adjacent first pads 200 within the same column of first pads 200, the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is 5% to 10% smaller than the width K3 of the other first pad 200 in the second direction D2.

[0128] For example, assume that the first pad in the row furthest from display area 00a is the first pad in row 1, and the first pad in the row closest to display area 00a is the first pad in row N. Furthermore, the width of each first pad in row 1 (200) in the first direction D1 is K11, and the width of each first pad in row N (200) in the first direction D1 is K1. NThe distance between the first pad in row 1 and the first pad in row 2 is K21, and the distance between the first pad in row N-1 and the first pad in row N is K2. N-1 The width of each first pad in the first row of the first pad is K31 in the second direction D2, and the width of each first pad in the first row of the Nth row is K3. N The distance between any two adjacent first pads in the first row is K41, and the distance between any two adjacent first pads in the first row is K4. N .

[0129] Then, in Figure 11 In the arrangement of the first pads shown, the dimensions of each first pad satisfy the following relationship:

[0130] K12=K11-K11(5%~10%),...,K1 N =K1 N-1 -K1 N-1 (5%–10%)

[0131] K21 = K22 = ... = K2 N-1 ;

[0132] K32=K31-K31(5%~10%),...,K3 N =K3 N-1 -K3 N-1 (5%–10%)

[0133] K42=K41+K31(5%~10%),……,K4 N =K4 N-1 +K3 N-1 (5% to 10%).

[0134] In this application, please refer to the above-mentioned optional implementation methods. Figure 14 , Figure 14This is a schematic diagram of a first pad and a second pad provided in an embodiment of this application. To avoid a situation where the orthographic projection area of ​​the first pad 200 on the first substrate 100 is too small, resulting in poor electrical connection between the second pad and the first pad 200, this application requires that the orthographic projection area of ​​each first pad 200 near the display area 00a on the first substrate 100 is not too small. For example, the orthographic projection area of ​​each first pad 200 in the row of first pads closest to the display area 00a on the flexible substrate 100 needs to be greater than or equal to a preset area threshold. This preset area threshold is the minimum overlapping area of ​​the orthographic projections of the second pad 011 on the flexible substrate 100 and the first pad 200 on the flexible substrate 100. In this way, a larger electrical connection area between the second pad and the first pad 200 can be ensured, thereby resulting in a better electrical connection between the second pad 011 and the first pad 200. It should be noted that this preset area threshold is also related to the size of the area that ACF 222 can effectively bond. Different types of ACF 222 have different preset area thresholds.

[0135] In the embodiments of this application, please refer to Figure 15 , Figure 15 This is a top view of a first pad provided in an embodiment of this application. The first pad 200 has a plurality of corner portions 201, which may include at least one of rounded corners and chamfers. For example, the shape of the orthographic projection of the first pad 200 onto the substrate 100 is rectangular, and the number of corner portions 201 in the first pad 200 is four, with the four corner portions 201 respectively distributed at the four apex corners of the first pad 200.

[0136] In this case, for four first pads 200 arranged in two rows and two columns among a plurality of first pads 200, by setting the corners 201 of these four first pads 200 to at least one of rounded corners and chamfers, it is easier to guide the excess adhesive between two first pads 200 into channels for the flow of excess adhesive.

[0137] Since the corner 201 of the first pad 200 may include at least one of rounded corners and chamfers, the embodiments of this application will be described in the following three cases.

[0138] The first case, such as Figure 15 As shown, when the corner 202 is a rounded corner, the radius R of the rounded corner is in the range of 10% to 50% of the width K1 of the first pad 200 in the first direction D1.

[0139] For the second scenario, please refer to [the relevant documentation / reference]. Figure 16 , Figure 16This is a top view of another first pad provided in an embodiment of this application. When the corner 201 is chamfered, the angle α between the chamfered surface 201a and the second direction D2 ranges from 15° to 45°, and the width K5 of the chamfer in the second direction D2 ranges from 10% to 20% of the width K3 of the first pad 200 in the second direction D2.

[0140] For the third scenario, please refer to [the relevant documentation / reference]. Figure 17 , Figure 17 This is a top view of another first pad provided in an embodiment of this application. When the corner 201 may include a rounded corner and a chamfer, the angle α between the chamfered surface 201a and the second direction D2 ranges from 15° to 45°, and the width K5 of the chamfer in the second direction D2 ranges from 10% to 20% of the width K3 of the first pad 200 in the second direction D2.

[0141] The radius R of the fillet ranges from 10% to 50% of the target width. The target width can be the difference between the width K3 of the first pad 200 in the second direction D2 and the width K5 of the two chamfers 201a in the second direction D2.

[0142] It should be noted that, for the first optional implementation method mentioned above, such as Figure 8 and Figure 9 As shown, when the width K1 of the first pad 200 in different rows is equal in the first direction D1, and the corner of the first pad 200 has a rounded corner, the radius R of the rounded corner of the first pad 200 can gradually decrease along the direction closer to the display area 00a. For example, the radius R of the rounded corners of each first pad 200 in the first row is 10% of the width K1 of the first pad 200 in the first direction D1; the radius R of the rounded corners of each first pad 200 in the second row is 20% of the width K1 of the first pad 200 in the first direction D1; the radius R of the rounded corners of each first pad 200 in the third row is 30% of the width K1 of the first pad 200 in the first direction D1; the radius R of the rounded corners of each first pad 200 in the fourth row is 40% of the width K1 of the first pad 200 in the first direction D1; and the radius R of the rounded corners of each first pad 200 in the fifth row is 50% of the width K1 of the first pad 200 in the first direction D1. In this way, excess adhesive closer to the display area 00a between two first pads 200 is more easily guided into the channels for the excess adhesive to flow.

[0143] For the second to fifth optional implementation methods described above, since the width K1 of each first pad 200 within the same column of first pads 200 in the first direction D1 gradually decreases along the direction closer to the display area 00a, and when the corner of the first pad 200 has a rounded corner, the radius R of the rounded corner of the first pad 200 is related to the width K1 of the first pad 200 in the first direction D1. Therefore, the radius R of the rounded corner of the first pad 200 can gradually decrease along the direction closer to the display area 00a.

[0144] In this embodiment, the plurality of first pads 200 in the display panel 000 are arranged in at least four rows. The number of rows for the plurality of first pads 200 can be determined based on the number of signal lines in the display panel 000. The more signal lines in the display panel 000, the more rows of first pads 200 can be arranged.

[0145] In the embodiments of this application, please refer to Figure 18 , Figure 18 This is a top view of a display panel provided in an embodiment of this application. The display panel 000 may further include: multiple signal lines L1 located in the display area 00a, and multiple fan-out leads L2 located in the non-display area 00b.

[0146] In this design, multiple light-emitting devices are arranged in multiple columns. Each column of light-emitting devices is electrically connected to the same signal line L1. Multiple signal lines L1 are electrically connected one-to-one with multiple fan-out leads L2, and each fan-out lead L2 is electrically connected one-to-one with multiple first pads 200. Thus, each signal line L1 can apply an electrical signal to the multiple light-emitting devices in the display panel 000, causing the devices to emit light. One end of each fan-out lead L2 is electrically connected to a signal line L1, and the other end of each fan-out lead L2 can be electrically connected to a driving component 111 via the first pads 200. In this way, electrical signals from the driving component 111 can be applied to the multiple light-emitting devices in the display panel 000 via the fan-out leads L2 and the signal lines L1, enabling the display panel 000 to display an image.

[0147] It should be noted that in other possible implementations, a first pad 200 may also correspond to at least two fan-out leads L2. In this case, the first pad 200, which is electrically connected to multiple fan-out leads L2, needs to be electrically connected to a multiplexer. In this way, the display panel 000 can use the multiplexer to time-division drive multiple fan-out leads L2 electrically connected to the first pad 200, so that the light-emitting devices in the display panel 000 emit light.

[0148] The display panel provided in this application includes a substrate, light-emitting devices, and first pads. The area of ​​the orthographic projection of each row of first pads on the first substrate gradually decreases along the direction closer to the display area, such that the distance between any two adjacent first pads in a row of first pads closer to the display area is larger, and / or the distance between the row of first pads closest to the display area and the row of first pads farthest from the display area is smaller. Furthermore, during the bonding and connection of the driving components to the display panel via an ACF (Acoustic Coating Forming), after excess adhesive in the ACF between the second pad and the first pad is squeezed out, this excess adhesive can flow towards the direction closer to the display area. Thus, when the distance between any two adjacent first pads in a row of first pads arranged closer to the display area is larger, the excess adhesive squeezed out from between the first pad and the second pad in the ACF can flow towards the direction closer to the display area more quickly. Similarly, when the distance between the row of first pads closest to the display area and the row of first pads furthest from the display area is small, the excess adhesive squeezed out from between the first and second pads in the ACF flows a shorter distance towards the display area, allowing the excess adhesive to overflow the bonding area more quickly. This prevents excess adhesive from accumulating in the bonding area between the second and first pads, ensuring that the conductive particles between the second and first pads can make close contact with both pads respectively. This results in a better electrical connection between the second and first pads, effectively improving the display effect of the display panel.

[0149] This application also provides a driver component, please refer to... Figure 19 , Figure 19 This is a top view of a driving component provided in an embodiment of this application. The driving component 111 has a device region 11a and a connection region 11b located on one side of the device region 11a. The driving component 111 may include: a second substrate 010, a driving chip 013 located in the device region 11a, and a plurality of second pads 011 located in the connection region 11b.

[0150] Multiple second pads 011 are used for electrical connection to the driver chip 013 and the display panel 000. The multiple second pads 011 are arranged in multiple rows, and the multiple rows of second pads 011 are distributed sequentially in a direction away from the device area 11a. In this way, the driver chip 013 in the driving assembly 111 can apply an electrical signal to the fan-out lead L2 electrically connected to it through the second pads 011. Then, the fan-out lead L2 can apply the electrical signal to multiple light-emitting devices in the display panel 000 through a signal line L1.

[0151] In this configuration, the area of ​​the orthographic projection of each row of second pads 011 onto the second substrate 010 gradually decreases along the direction away from the device region 11a. Thus, when the driving assembly 111 and the display panel 000 are electrically connected via the ACF 222, the first pads 200 and second pads 011 can be electrically connected in a one-to-one correspondence, and the electrical connection between the first pads 200 and second pads 011 is effective.

[0152] In this embodiment, the driving component 111 may further include a third pad 012 located on the second substrate 010 and corresponding one-to-one with the plurality of power-connecting pads 300. In this way, the power-connecting pads 300 in the display panel 000 can also be electrically connected to the third pad 012 in the driving component 111 through the ACF 222, so that the devices in the driving component 111 can be powered.

[0153] It should be noted that the multiple second pads 011 correspond one-to-one with the multiple first pads 200. Therefore, for the arrangement of the multiple second pads 011 in the driving component 111 and the size of each second pad 011, please refer to the corresponding part in the above-described embodiment regarding the structure of the display panel. The embodiments of this application will not be repeated here.

[0154] This application also provides a method for manufacturing a display panel, which is used to manufacture the display panel shown in the above embodiments. The method for manufacturing the display panel may include:

[0155] Multiple light-emitting devices and multiple first pads are formed on the first substrate.

[0156] The display panel has a display area and a non-display area located around the display area. Multiple light-emitting devices are distributed in the display area, and multiple first pads are distributed in the non-display area.

[0157] Multiple first pads are used for electrical connection with multiple light-emitting devices and electrical connection with driving components, and the array of multiple first pads is arranged in multiple rows, with the multiple rows of first pads distributed sequentially along the direction away from the display area.

[0158] Among them, the area of ​​the first pad of each row projected onto the first substrate gradually decreases along the direction closer to the display area.

[0159] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific principles of the display panel described above can be found in the corresponding content of the aforementioned embodiment of the display panel structure, and will not be repeated here.

[0160] This application also provides a display device. Please refer to... Figure 20 , Figure 20This is a schematic diagram of a display device provided in an embodiment of this application. The display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. The display device can include any of the aforementioned display panels 000 and a driving component. The driving component can be a flexible circuit board or a separate driving chip. When the driving component is a flexible circuit board, the driving chip can be integrated within the flexible circuit board, and the plurality of first pads 200 in the display panel 000 are electrically connected to the plurality of second pads 011 in the flexible circuit board 111 in a one-to-one correspondence. When the driving component is a driving chip, the driving chip also has second pads 011 that are electrically connected to the plurality of first pads 200 in a one-to-one correspondence.

[0161] In this embodiment, the display device may further include an ACF 222 located between the display panel 000 and the driving component 111. The ACF 222 enables the display panel 000 to be electrically connected to the driving component 111.

[0162] In this application, the display panel can be an OLED display panel or an active matrix organic light-emitting diode (AM-OLED) display panel.

[0163] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0164] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0165] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0166] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located around the display area. The display panel includes: First substrate; Multiple light-emitting devices located within the display area; Multiple first pads are located within the non-display area. These first pads are used for electrical connection with the multiple light-emitting devices and the driving component. The multiple first pads are arranged in multiple rows along a first direction and in multiple columns along a second direction. The multiple rows of first pads are distributed sequentially in a direction away from the display area. The axis of the i-th first pad in each row of first pads lies on the same first straight line, which is parallel to the first direction. Here, i is a positive integer. Among them, the area of ​​the orthographic projection of each first pad in the same column of the first pads onto the first substrate gradually decreases along the direction closer to the display area; the distance between two adjacent rows of the first pads in the first direction gradually increases along the direction closer to the display area.

2. The display panel according to claim 1, characterized in that, The width of each first pad in the first pad of the same column in the first direction and / or the width in the second direction gradually decreases along the direction closer to the display area.

3. The display panel according to claim 2, characterized in that, The width of the first pad in different rows is equal in the first direction; The width of each first pad in the same column of the first pads in the second direction gradually decreases along the direction closer to the display area; and the distance between every two adjacent first pads in each row of the first pads gradually increases along the direction closer to the display area.

4. The display panel according to claim 2, characterized in that, The width of the first pads in different rows is equal in the second direction, and the distance between any two adjacent first pads in each row is equal; The width of each first pad in the first direction within the same column of the first pads gradually decreases along the direction closer to the display area.

5. The display panel according to claim 2, characterized in that, The width of each first pad in the first pad of the same column in the first direction and the width in the second direction gradually decrease along the direction closer to the display area; the distance between every two adjacent first pads in each row of the first pads gradually increases along the direction closer to the display area.

6. The display panel according to claim 4 or 5, characterized in that, For two adjacent first pads in the same column of the first pads, the width of the first pad closer to the display area in the first direction is 5% to 10% smaller than the width of the other first pad in the first direction.

7. The display panel according to claim 3 or 5, characterized in that, For two adjacent first pads in the same column of the first pads, the width of the first pad closer to the display area in the second direction is 5% to 10% smaller than the width of the other first pad in the second direction.

8. The display panel according to any one of claims 2-5, characterized in that, The first pad has multiple corners, the corners including at least one of rounded corners and chamfers.

9. The display panel according to claim 8, characterized in that, When the corner is a rounded corner, the radius of the rounded corner is in the range of 10% to 50% of the width of the first pad in the first direction.

10. The display panel according to claim 8, characterized in that, When the corner is a chamfer, the angle between the chamfer's bevel and the second direction is between 15° and 45°, and the width of the chamfer in the second direction is between 10% and 20% of the width of the first pad in the second direction.

11. The display panel according to claim 8, characterized in that, When the corner portion includes the fillet and the chamfer, the angle between the chamfer's bevel and the second direction ranges from 15° to 45°, and the width of the chamfer in the second direction ranges from 10% to 20% of the width of the first pad in the second direction. The radius of the fillet is in the range of 10% to 50% of the target width, where the target width is the difference between the width of the first pad in the second direction and the width of the two chamfers in the second direction.

12. The display panel according to any one of claims 1-5, characterized in that, The plurality of first pad arrays are arranged in at least 4 rows.

13. The display panel according to any one of claims 1-5, characterized in that, The areas of the orthographic projections of each first pad in the same row onto the first substrate are the same, and the distance between any two adjacent first pads in the same row is the same.

14. A driving component, characterized in that, The driving component has a device region and a connection region located on one side of the device region, and the driving component includes: Second substrate; The driver chip located within the device area; Multiple second pads are located within the connection area. These multiple second pads are used for electrical connection with the driver chip and the display panel. The multiple second pads are arranged in multiple rows along a first direction and in multiple columns along a second direction. The multiple rows of second pads are distributed sequentially in a direction away from the device area. The axis of the i-th second pad in each row of second pads is located on the same first straight line, which is parallel to the first direction. Here, i is a positive integer. The area of ​​the orthogonal projection of each second pad in the same column of the second pads onto the second substrate gradually decreases along the direction away from the device area; the distance between two adjacent rows of second pads in the first direction gradually increases along the direction away from the device area.

15. A display device, characterized in that, include: According to any one of claims 1-13, the plurality of first pads in the display panel are electrically connected to the plurality of second pads in the driving component in a one-to-one correspondence.

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