A micropore processing method for high-entropy ceramics and composites thereof

Abstract

This application relates to the field of ultra-fine micromachining technology for ceramic matrix composites, and discloses a method for micro-hole processing of high-entropy ceramics and their composites, comprising: step 101: ultrasonically cleaning the sample by immersion in alcohol, and obtaining the cleaned sample after drying; step 102: micro-hole processing of the cleaned sample using a femtosecond laser; step 103: ultrasonically cleaning and drying the processed sample by immersion in alcohol, and removing residual debris from the surface and hole walls; wherein, during the micro-hole processing of the sample, depending on the material of the sample, one or two drilling operations are selected, and the laser parameters and processing method used in the second drilling are exactly the same as those used in the first drilling.

Description

Technical Field

[0001] This application relates to the field of ultra-fine micromachining technology for ceramic matrix composites, for example, to a method for micropore machining of high-entropy ceramics and their composites. Background Technology

[0002] Currently, the surface temperature of hypersonic vehicles during flight typically exceeds 2000 ℃, which traditional ultra-high temperature materials struggle to withstand. In recent years, high-entropy ceramics and their composites have shown great potential. The four major effects of high-entropy materials (high-entropy effect, lattice distortion effect, hysteresis diffusion effect, and "cocktail" effect) endow them with excellent properties, such as high hardness and high-temperature stability, structural durability under extreme conditions, low thermal conductivity, oxidation resistance, and corrosion resistance. Therefore, they hold promise for application in the thermal protection systems of hypersonic vehicles.

[0003] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0004] High-entropy ceramics and their composites possess the characteristics of high hardness and brittleness found in traditional ceramic materials. When applied to turbine blades and combustion chambers of aircraft engines, they often involve the machining of numerous holes. Traditional machining methods are prone to defects such as cracking, chipping, and pitting, and are difficult to achieve in the machining of high-precision micro-holes. Furthermore, long-pulse laser drilling technology can produce defects such as large heat-affected zones and thick casting layers, making it unsuitable for the demands of high-precision micro-hole machining.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0007] This disclosure provides a micropore machining method for high-entropy ceramics and their composites to achieve high-precision micropore machining of high-entropy ceramics and their composites.

[0008] In some embodiments, the micropore fabrication method includes:

[0009] Step 101: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample.

[0010] Step 102: Micropores are fabricated on the cleaned sample using a femtosecond laser;

[0011] Step 103: The processed sample is ultrasonically cleaned and dried under alcohol immersion, and residual debris on the surface and pore walls is removed.

[0012] In the process of micro-hole processing of the sample, depending on the material of the sample, the sample is selected to be drilled once or twice, and the laser parameters and processing methods used in the second drilling are exactly the same as those used in the first drilling.

[0013] Optionally, in step 101, the drying method used is vacuum drying, the drying temperature is 80°C, and the drying time is 2 hours.

[0014] Optionally, the laser parameters are: wavelength 1020-1080nm, pulse width 200-500fs, laser output power 1-20W, and laser repetition frequency 1-600kHz.

[0015] Optionally, the processing method is a variable-focus plane spiral processing, with a scanning speed of 100-500 mm / s, a processing step of 0.008-0.020 mm, a maximum spiral surface processing diameter of 0.2-1.5 mm, and a spiral spacing of 5-12.5 μm.

[0016] Optionally, the process of using a femtosecond laser to fabricate micropores in the cleaned sample includes:

[0017] Step 201: Place the cleaned sample on the processing platform corresponding to the femtosecond laser, and focus the femtosecond laser beam through the objective lens at the center of the hole to be processed on the sample surface, with a focal length of 150mm.

[0018] Step 202: The femtosecond laser scans along a set spiral trajectory, starting from the center of the hole to be processed;

[0019] Step 203: After scanning one layer, the laser returns to the center of the hole to be processed and the focus moves down one layer by the set processing step distance. Then the laser continues to scan and process along the set spiral trajectory.

[0020] Step 204: Repeat steps 201 to 203 above until the entire micro-hole processing is completed.

[0021] Optionally, in step 103, the drying method used is vacuum drying, the drying temperature is 80°C, and the drying time is 2 hours.

[0022] Optionally, the sample is a high-entropy carbide ceramic (Ti). 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2In the case of material C, the number of drilling operations is two.

[0023] Optionally, the sample has a size of φ20mm×3mm and is prepared by spark plasma sintering.

[0024] Optionally, in the sample being Cf / (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2 In the case of C-SiC composite material, the number of drilling operations is one.

[0025] Optionally, the sample has a size of 30mm × 30mm × 3.5mm and is prepared by precursor impregnation and pyrolysis.

[0026] The micropore fabrication method for high-entropy ceramics and their composites provided in this disclosure can achieve the following technical effects:

[0027] This application allows for the production of high-quality micropores from easily drillable materials such as high-entropy ceramic matrix composites using a single drilling process. For materials like high-entropy ceramics, where powder accumulation during processing can lead to poor micropore quality, a double drilling process—drilling twice consecutively using the same parameters—results in high-quality micropores. Furthermore, neither the single nor double drilling methods employed in this application require pre-processing of the pores or a final oxide layer removal process; the process is simple and consistently yields high-quality micropores.

[0028] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0029] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0030] Figure 1 This is a schematic diagram of a micropore fabrication method for high-entropy ceramics and their composites provided in an embodiment of this disclosure;

[0031] Figure 2 This is a schematic diagram of another micropore fabrication method for high-entropy ceramics and their composites provided in this disclosure embodiment;

[0032] Figure 3(a) shows an entry point for a high-entropy ceramic single-drilling process provided in an embodiment of this disclosure;

[0033] Figure 3(b) shows the outlet of a high-entropy ceramic single-drilling method provided in an embodiment of this disclosure;

[0034] Figure 4(a) shows an entry point for a high-entropy ceramic double-drilling process provided in an embodiment of this disclosure;

[0035] Figure 4(b) shows an outlet for a high-entropy ceramic double-drilling method provided in an embodiment of this disclosure;

[0036] Figure 5(a) shows the entry point for a single drilling of a high-entropy ceramic matrix composite material provided in an embodiment of this disclosure;

[0037] Figure 5(b) shows the outlet of a single-drilling high-entropy ceramic matrix composite material provided in an embodiment of this disclosure. Detailed Implementation

[0038] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0039] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0040] Unless otherwise stated, the term "multiple" means two or more.

[0041] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0042] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0043] The term "correspondence" can refer to an association or binding relationship. The correspondence between A and B means that there is an association or binding relationship between A and B.

[0044] Currently, relevant technologies disclose a method for machining deep and long through holes in inorganic non-metallic ceramic materials. This method first uses a diamond drill bit with a length of 100-150 mm to drill, and then switches to a diamond drill bit with a 200-300 mm long shank and a cooling device for drilling. After drilling one side, the same method is used to drill the other side until both sides are drilled through. This method can produce deep and long through holes, but it can only achieve the machining of micro-holes with a diameter of 5-10 mm, and cannot achieve the machining of higher precision micro-holes.

[0045] Meanwhile, the related technology also discloses a method for micro-hole processing on a single-crystal yttrium iron garnet ferrite thick film composite substrate. This method uses a picosecond laser to process micro-holes on the single-crystal yttrium iron garnet ferrite thick film composite substrate. The processing technology has the advantages of stability, high efficiency and high precision, but the quality of the obtained micro-holes is not high enough, and there are obvious recrystallization layers and oxide layers around the micro-holes.

[0046] In addition, the related technology also discloses a method for processing holes using a picosecond laser. This method uses a picosecond laser to process micropores in silicon carbide ceramic matrix composites. The processing adopts a multi-step processing method, mainly including three steps: pre-forming the hole, eliminating the taper of the pre-forming hole, and forming the hole. It partially eliminates the oxide layer and resolidified layer around the hole. However, the overall process of this method is relatively complicated, and the quality of the obtained micropores is still insufficient.

[0047] In order to solve the technical problems existing in the aforementioned related technologies, and in combination with Figure 1 As shown, this disclosure provides a micropore fabrication method for high-entropy ceramics and their composites, comprising:

[0048] Step 101: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample.

[0049] Step 102: Use a femtosecond laser to process micropores on the cleaned sample.

[0050] Step 103: The processed sample is ultrasonically cleaned and dried under alcohol immersion, and residual debris on the surface and pore walls is removed.

[0051] In the process of micro-hole processing of the sample, depending on the material of the sample, the sample is selected to be drilled once or twice, and the laser parameters and processing methods used in the second drilling are exactly the same as those used in the first drilling.

[0052] Optionally, in step 101, the drying method used is vacuum drying, the drying temperature is 80°C, and the drying time is 2 hours.

[0053] Optionally, the laser parameters of this application are: wavelength 1020-1080nm, pulse width 200-500fs, laser output power 1-20W, and laser repetition frequency 1-600kHz.

[0054] Optionally, the processing method of this application is a variable-focus plane spiral processing, with a scanning speed of 100-500 mm / s, a processing step of 0.008-0.020 mm, a maximum spiral surface processing diameter of 0.2-1.5 mm, and a spiral spacing of 5-12.5 μm.

[0055] Optionally, in step 103, the drying method used is vacuum drying, the drying temperature is 80°C, and the drying time is 2 hours.

[0056] In one embodiment of this application, combined with Figure 2 As shown, a femtosecond laser is used to process micropores in the cleaned sample, including:

[0057] Step 201: Place the cleaned sample on the processing platform corresponding to the femtosecond laser, and focus the femtosecond laser beam through the objective lens onto the center of the hole to be processed on the sample surface, with a focal length of 150mm.

[0058] Step 202: The femtosecond laser scans along a set spiral trajectory, starting from the center of the hole to be processed.

[0059] Step 203: After scanning one layer, the laser returns to the center of the hole to be processed and the focus moves down one layer by the set processing step distance. Then the laser continues to scan and process along the set spiral trajectory.

[0060] Step 204: Repeat steps 201 to 203 above until the entire micro-hole processing is completed.

[0061] The micropore processing method for high-entropy ceramics and their composites provided in this disclosure allows for the production of high-quality micropores with a single drilling operation, particularly for easily drillable materials such as high-entropy ceramic matrix composites. For high-entropy ceramics and other materials prone to powder accumulation during processing, resulting in poor micropore quality, a double drilling process—drilling twice consecutively using the same parameters—can yield high-quality micropores. Furthermore, neither the single nor double drilling method employed in this application requires pre-processing of the pores or a final oxide layer removal process; the process is simple and consistently yields high-quality micropores. Specific implementation examples:

[0063] Example 1

[0064] The micropore fabrication method for high-entropy ceramics and their composites proposed in this embodiment is applicable to high-entropy carbide ceramics (Ti). 0.2 Zr 0.2Hf 0.2 Nb 0.2 Ta 0.2 Material C, the sample size is φ20mm×3mm, the preparation process is spark plasma sintering, and the number of drilling times is one.

[0065] The specific process of this implementation is as follows:

[0066] Step 1: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample.

[0067] Step 2: Micropores are fabricated on the sample from Step 1 using a femtosecond laser.

[0068] Step 3: The sample processed in Step 2 is ultrasonically cleaned and dried under alcohol immersion to remove residual debris from the surface and pore walls.

[0069] In step 1, the drying temperature is 80℃ and the drying time is 2 hours.

[0070] In step 2, the laser parameters are as follows: wavelength 1030nm, pulse width 290fs, laser output power 5W, laser repetition frequency 100kHz, processing method is variable focal plane spiral processing, scanning speed is 500mm / s, processing step is 0.012mm, maximum diameter of spiral surface processing is 0.5mm, and spiral spacing is 8μm.

[0071] The specific processing procedure is as follows: The cleaned sample is placed on the processing platform corresponding to the femtosecond laser used. The femtosecond laser beam is focused through the objective lens onto the center of the hole to be processed on the sample surface, with a focal length of 150mm. A variable-focus, spiral processing method is employed. The laser scans along a set spiral trajectory, starting from the center of the hole. After scanning one layer, the laser returns to the center of the hole and the focal point shifts down one layer by a set processing step. Then, the laser continues scanning along the set spiral trajectory. This process is repeated until the hole is fully processed.

[0072] In step 3, vacuum drying is used, with a drying temperature of 80℃ and a drying time of 2 hours.

[0073] The holes obtained in this embodiment are shown in Figures 3(a) and 3(b).

[0074] Example 2

[0075] The micropore fabrication method for high-entropy ceramics and their composites proposed in this embodiment is applicable to high-entropy carbide ceramics (Ti). 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2Material C, the sample size is φ20mm×3mm, the preparation process is spark plasma sintering, and the number of drillings is two.

[0076] The specific process of this implementation is as follows:

[0077] Step 1: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample.

[0078] Step 2: Use a femtosecond laser to process micropores in the sample from Step 1. Each hole is processed twice with the same parameters.

[0079] Step 3: The sample processed in Step 2 is ultrasonically cleaned and dried under alcohol immersion to remove residual debris from the surface and pore walls.

[0080] In step 1, the drying temperature is 80℃ and the drying time is 2 hours.

[0081] In step 2, the laser parameters are as follows: wavelength 1030nm, pulse width 290fs, laser output power 5W, laser repetition frequency 100kHz, processing method is variable focal plane spiral processing, scanning speed is 500mm / s, processing step is 0.012mm, maximum diameter of spiral surface processing is 0.5mm, and spiral spacing is 8μm.

[0082] The specific processing procedure is as follows: The cleaned sample is placed on the processing platform corresponding to the femtosecond laser used. The femtosecond laser beam is focused through the objective lens onto the center of the hole to be processed on the sample surface, with a focal length of 150mm. A variable-focus spiral processing method is used. The laser scans along a set spiral trajectory, starting from the center of the hole. After scanning one layer, the laser returns to the center of the hole and the focal point moves down one layer by the set processing step. Then, the laser continues scanning along the set spiral trajectory. This process is repeated to complete the first hole processing. A second drilling is then performed, repeating the first drilling process with the same parameters until the second hole processing is completed.

[0083] In step 3, vacuum drying is used, with a drying temperature of 80℃ and a drying time of 2 hours.

[0084] The holes obtained in this embodiment are shown in Figures 4(a) and 4(b).

[0085] Example 3

[0086] The micropore fabrication method for high-entropy ceramics and their composites proposed in this embodiment is applicable to Cf / (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta0.2 The C-SiC composite material sample was 30mm×30mm×3.5mm in size. The preparation process used was precursor impregnation and pyrolysis, and the number of pores was one.

[0087] The specific process of this implementation is as follows:

[0088] Step 1: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample.

[0089] Step 2: Micropores are fabricated on the sample from Step 1 using a femtosecond laser.

[0090] Step 3: The sample processed in Step 2 is ultrasonically cleaned and dried under alcohol immersion to remove residual debris from the surface and pore walls.

[0091] In step 1, the drying temperature is 80℃ and the drying time is 2 hours.

[0092] In step 2, the laser parameters are as follows: wavelength 1030nm, pulse width 290fs, laser output power 5W, laser repetition frequency 100kHz, processing method is variable focal plane spiral processing, scanning speed is 500mm / s, processing step is 0.012mm, maximum diameter of spiral surface processing is 0.5mm, and spiral spacing is 8μm.

[0093] The specific processing procedure is as follows: The cleaned sample is placed on the processing platform corresponding to the femtosecond laser used. The femtosecond laser beam is focused through the objective lens onto the center of the hole to be processed on the sample surface, with a focal length of 150mm. A variable-focus, spiral processing method is employed. The laser scans along a set spiral trajectory, starting from the center of the hole. After scanning one layer, the laser returns to the center of the hole and the focal point shifts down one layer by a set processing step. Then, the laser continues scanning along the set spiral trajectory. This process is repeated until the hole is fully processed.

[0094] In step 3, vacuum drying is used, with a drying temperature of 80℃ and a drying time of 2 hours.

[0095] The holes obtained in this embodiment are shown in Figures 5(a) and 5(b).

[0096] Thus, the femtosecond laser used in this application has the characteristics of "cold processing," with almost no heat-affected zone, resulting in high processing quality. The processing method in this application is a variable-focus planar spiral processing, which enables the processing of micro-holes with high aspect ratios. The laser processing technology used in this application has advantages such as controllable energy, minimal material damage, and high processing precision. It can also achieve high-precision micro-hole processing for high-entropy ceramic materials with high hardness and brittleness.

[0097] Meanwhile, the sample formed by the processing method of this application has virtually no re-condensed layer or oxide layer, and only requires simple cleaning without any other subsequent processing. It can achieve the processing of high aspect ratio and high-precision micropores below 1mm, with good processing quality.

[0098] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0099] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0100] The methods and products disclosed in the embodiments herein (including but not limited to devices and equipment) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units may be merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to implement this embodiment according to actual needs. In addition, the functional units in the embodiments of this disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0101] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A method for micropore fabrication in high-entropy ceramics and their composites, characterized in that, include: Step 101: The sample is ultrasonically cleaned by immersion in alcohol and then dried to obtain the cleaned sample. Step 102: Micropore processing is performed on the cleaned sample using a femtosecond laser; specifically, this includes... Step 201: Place the cleaned sample on the processing platform corresponding to the femtosecond laser, and focus the femtosecond laser beam through the objective lens at the center of the hole to be processed on the sample surface, with a focal length of 150mm. Step 202: The femtosecond laser scans along a set spiral trajectory, starting from the center of the hole to be processed; Step 203: After scanning one layer, the laser returns to the center of the hole to be processed and the focus moves down one layer by the set processing step distance. Then the laser continues to scan and process along the set spiral trajectory. Step 204: Repeat steps 201 to 203 above until the entire micro-hole processing is completed; The laser parameters are as follows: wavelength 1020-1080nm, pulse width 200-500fs, laser output power 1-20W, and laser repetition frequency 1-600kHz; the processing method is variable-focus plane spiral processing, the scanning speed is 100-500mm / s, the processing step is 0.008-0.020mm, the maximum diameter of the spiral surface is 0.2-1.5mm, and the spiral spacing is 5-12.5μm. Step 103: The processed sample is ultrasonically cleaned and dried under alcohol immersion, and residual debris on the surface and pore walls is removed. In the process of micro-hole processing of the sample, depending on the material of the sample, one or two holes are selected to be drilled on the sample, and the laser parameters and processing methods used in the second hole are exactly the same as those used in the first hole. The sample is Cf / (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2 In the case of C-SiC composite materials, the number of drilling operations is one. The sample was a high-entropy carbide ceramic (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2 In the case of material C, the number of drilling operations is two.

2. The micro-hole fabrication method according to claim 1, characterized in that, In step 101, the drying method used is vacuum drying, the drying temperature is 80℃, and the drying time is 2 hours.

3. The micro-hole fabrication method according to claim 1, characterized in that, In step 103, the drying method used is vacuum drying, the drying temperature is 80℃, and the drying time is 2 hours.

4. The micro-hole fabrication method according to claim 1, characterized in that, The sample was a high-entropy carbide ceramic (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2 In the case of material C, the sample has a size of φ20mm×3mm and is prepared by spark plasma sintering.

5. The micro-hole fabrication method according to claim 1, characterized in that, The sample is Cf / (Ti 0.2 Zr 0.2 Hf 0.2 Nb 0.2 Ta 0.2 In the case of C-SiC composite material, the sample size is 30mm×30mm×3.5mm, and the preparation process is precursor impregnation pyrolysis.

Images