A machining unit for axial diodes

Abstract

The application discloses a processing unit for semiconductor devices, comprising: a shaft body and a product ribbon wound on the shaft body, both ends of the shaft body are provided with a left side plate and a right side plate, a plurality of through holes are formed in the left side plate and the right side plate and are arranged at intervals in the circumferential direction, a left conductive layer and a right conductive layer are arranged on the side of the left side plate and the right side plate close to the product ribbon, the left conductive layer and the right conductive layer for electrically contacting the pins of the diodes in the product ribbon are arranged between adjacent through holes. The application not only solves the problem that axial diodes are prone to bending in the electroplating process, but also ensures that fine particles in the electroplating solution are fully exchanged and reduced in the cathode area, and further improves the electroplating effect.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and in particular to a processing unit for axial diodes. Background Technology

[0002] Currently, in the electroplating industry, axial diodes are all electroplated using barrel plating, which involves plating a layer of tin onto the product's leads. This improves the product's solderability and gives it advantages such as good conductivity and resistance to oxidation, thus meeting customer application needs.

[0003] However, barrel plating can easily cause bent diode leads and uneven plating thickness, requiring machine or manual straightening before proceeding to the next process. This leads to a significant waste of human and material resources, resulting in substantial cost increases for the factory. Figure 1 The diagram shown is an exploded view of the electroplating process for axial diodes in the prior art. The processes of squeezing, loading, unloading, and packaging are all extremely prone to causing the product leads to bend. Summary of the Invention

[0004] The purpose of this invention is to provide a processing unit for axial diodes. This processing unit for axial diodes not only solves the problem of axial diodes being prone to bending during electroplating, but also ensures that fine particles in the electroplating solution are fully exchanged and reduced in the cathode area, thereby further improving the electroplating effect.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a processing unit for axial diodes, comprising: a shaft and a product tape wound on the shaft, wherein a left side plate and a right side plate are installed at both ends of the shaft, the product tape is located between the left side plate and the right side plate, and the product tape includes a plurality of diodes arranged at intervals, each diode including a body and a first pin and a second pin extending to both sides of the body; The product tape also includes: a first tape and a second tape arranged in parallel, and a plurality of axial diodes arranged at intervals along the length of the first tape and the second tape. The lower surface of the first pin and the second pin of each axial diode, away from its own body, is bonded to the upper surface of the first tape and the second tape coated with adhesive layer. The first tape and the second tape are respectively covered with a first conductive strip and a second conductive strip. The first conductive strip and the second conductive strip, which are thinner than the first tape and the second tape, cover the outer surface of the first pin and the second pin, and their lower surfaces are bonded to the areas of the first tape and the second tape located on both sides of the first pin and the second pin. Both the left and right side plates are provided with a number of through holes spaced apart along the circumference. Each of the left and right side plates has a left conductive layer and a right conductive layer on the side closest to the product tape. The left and right conductive layers, which are used for electrical contact with the pins of the diodes in the product tape, are disposed between adjacent through holes.

[0006] The following are further improvements to the above technical solution: 1. In the above scheme, the left side plate and the right side plate are each provided with 4 through holes that are equally spaced along the circumference.

[0007] 2. In the above scheme, the through hole is a fan-shaped through hole.

[0008] 3. In the above scheme, a left conductive layer or a right conductive layer is provided between any two through holes.

[0009] 4. In the above scheme, one end of each of the left conductive layer and the right conductive layer is connected to the shaft, and the other end extends radially along the shaft to the edge of the left or right side plate.

[0010] 5. In the above scheme, the ends of the left conductive layers that are away from the axis and the ends of the right conductive layers that are away from the axis are all connected by an annular conductive layer.

[0011] 6. In the above scheme, the left conductive layer and the right conductive layer are conductive sheets installed between the left side plate, the right side plate and the shaft.

[0012] 7. In the above scheme, the first pin and the second pin of the axial diode are both cylindrical pins, and the first conductive strip and the second conductive strip tightly cover at least half of the circumference of the first pin and the second pin.

[0013] 8. In the above scheme, the thickness ratio between the first tape and the second tape of equal thickness and the first conductive tape and the second conductive tape of equal thickness is 10:1~4.

[0014] Due to the application of the above technical solution, the present invention has the following advantages and effects compared with the prior art: This invention relates to a processing unit for axial diodes. It ensures that a large number of axial diodes remain in an orderly state during prolonged electroplating processes in high-temperature, high-acid, and high-alkali environments, preventing pin bending due to collisions between diodes. It also guarantees uniformity and consistency in the processing of each pin, improving processing quality, reducing noise in the production environment, and increasing production efficiency. Furthermore, the first and second conductive strips, with a thickness less than the first and second adhesive tapes, cover the outer surfaces of the first and second pins, and their lower surfaces are bonded to the areas of the first and second adhesive tapes located on either side of the first and second pins. The diodes are then connected via the conductive strips. By connecting the pins in series to form a conductive circuit, the area of ​​the electrical contact region between the conductive strip and the pins and the stability of the electrical connection are ensured, thus guaranteeing the electroplating effect. Furthermore, several through holes are provided on both the left and right side plates, spaced apart circumferentially. Each of the left and right side plates has a left conductive layer and a right conductive layer on the side closest to the product tape. The left and right conductive layers, which are used for electrical contact with the pins of the diodes in the product tape, are located between adjacent through holes. This ensures the electrical conductivity of each diode pin stacked and wound on the shaft, and also ensures that fine particles in the electroplating solution are fully exchanged and reduced in the cathode area, further improving the electroplating effect. Attached Figure Description

[0015] Appendix Figure 1 This is an exploded view of the electroplating process for axial diodes in the prior art; Appendix Figure 2 This is a schematic diagram of the product tape and reel structure in the processing unit for axial diodes according to the present invention; Appendix Figure 3 This is a magnified view of a portion of the product tape feeding mechanism in the processing unit of this invention, taken from one perspective. Appendix Figure 4 This is a magnified view of a partial structure of the product tape feeding unit in the processing unit of the present invention from another perspective; Appendix Figure 5 This is a partial structural schematic diagram of the processing unit for axial diodes according to the present invention; Appendix Figure 6 This is a partial structural exploded view of the processing unit for axial diodes according to the present invention. Figure 1 ; Appendix Figure 7 This is a partial structural exploded view of the processing unit for axial diodes according to the present invention. Figure 2 ; Appendix Figure 8 This is a schematic diagram of the processing unit for axial diodes according to the present invention.

[0016] In the above figures: 100, body; 201, first pin; 202, second pin; 1, shaft; 11, annular groove; 12, mounting hole; 21, left side plate; 22, right side plate; 23, mounting through hole; 31, first adhesive tape; 32, second adhesive tape; 41, first conductive strip; 42, second conductive strip; 5, left conductive layer; 6, right conductive layer; 7, through hole; 8, annular conductive layer. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments: Example 1: A processing unit for axial diodes includes: a shaft 1 and a product tape wound on the shaft 1. A left side plate 21 and a right side plate 22 are installed at both ends of the shaft 1. The product tape is located between the left side plate 21 and the right side plate 22. The product tape includes a plurality of diodes arranged at intervals. Each diode includes a body 100 and a first pin 201 and a second pin 202 extending to both sides of the body 100. The product tape also includes: a first tape 31 and a second tape 32 arranged in parallel, and a plurality of axial diodes arranged at intervals along the length direction of the first tape 31 and the second tape 32. The lower surface of the first pin 201 and the second pin 202 of each axial diode away from its body 1 is bonded to the upper surface of the first tape 31 and the second tape 32 coated with adhesive layer. The first tape 31 and the second tape 32 are respectively covered with a first conductive strip 41 and a second conductive strip 42. The thickness of the first conductive strip 41 and the second conductive strip 42 is less than that of the first tape 31 and the second tape 32. The first conductive strip 41 and the second conductive strip 42 cover the outer surface of the first pin 201 and the second pin 202, and their lower surfaces are bonded to the areas of the first tape 31 and the second tape 32 located on both sides of the first pin 201 and the second pin 202. Both the left side plate 21 and the right side plate 22 have a plurality of through holes 7 spaced apart along the circumference. Each of the left side plate 21 and the right side plate 22 has a left conductive layer 5 and a right conductive layer 6 on the side closest to the product tape. The left conductive layer 5 and the right conductive layer 6, which are used to make electrical contact with the pins of the diodes in the product tape, are disposed between adjacent through holes 7.

[0018] The left side plate 21 and the right side plate 22 are each provided with four through holes 7 evenly spaced along the circumference; the through holes 7 are fan-shaped through holes; a left conductive layer 5 or a right conductive layer 6 is provided between any two through holes 7; one end of each of the left conductive layer 5 and the right conductive layer 6 is connected to the shaft 1, and the other end extends radially along the shaft 1 to the edge of the left side plate 21 or the right side plate 22; the ends of several left conductive layers 5 away from the shaft 1 and the ends of several right conductive layers 4 away from the shaft 1 are connected by an annular conductive layer 8; the left conductive layer 5 and the right conductive layer 6 are conductive sheets installed between the left side plate 21, the right side plate 22 and the shaft 1. The first pin 201 and the second pin 202 of the aforementioned axial diode are both cylindrical pins. The first conductive strip 41 and the second conductive strip 42 tightly cover half of the circumference of the first pin 201 and the second pin 202. The thickness ratio between the first adhesive tape 31 and the second adhesive tape 32 of equal thickness and the first conductive strip 41 and the second conductive strip 42 of equal thickness is 10:2. The first conductive strip 41 and the second conductive strip 42 are copper foil tape and conductive film tape.

[0019] Example 2: A processing unit for axial diodes, comprising: a shaft 1 and a product tape wound on the shaft 1, wherein a left side plate 21 and a right side plate 22 are mounted at both ends of the shaft 1, the product tape is located between the left side plate 21 and the right side plate 22, and the product tape includes a plurality of diodes arranged at intervals, each diode including a body 100 and a first pin 201 and a second pin 202 extending to both sides of the body 100; The product tape also includes: a first tape 31 and a second tape 32 arranged in parallel, and a plurality of axial diodes arranged at intervals along the length direction of the first tape 31 and the second tape 32. The lower surface of the first pin 201 and the second pin 202 of each axial diode away from its body 1 is bonded to the upper surface of the first tape 31 and the second tape 32 coated with adhesive layer. The first tape 31 and the second tape 32 are respectively covered with a first conductive strip 41 and a second conductive strip 42. The thickness of the first conductive strip 41 and the second conductive strip 42 is less than that of the first tape 31 and the second tape 32. The first conductive strip 41 and the second conductive strip 42 cover the outer surface of the first pin 201 and the second pin 202, and their lower surfaces are bonded to the areas of the first tape 31 and the second tape 32 located on both sides of the first pin 201 and the second pin 202. Both the left side plate 21 and the right side plate 22 have a plurality of through holes 7 spaced apart along the circumference. Each of the left side plate 21 and the right side plate 22 has a left conductive layer 5 and a right conductive layer 6 on the side closest to the product tape. The left conductive layer 5 and the right conductive layer 6, which are used to make electrical contact with the pins of the diodes in the product tape, are disposed between adjacent through holes 7.

[0020] The first pin 201 and the second pin 202 of the aforementioned axial diode are both cylindrical pins. The first conductive strip 41 and the second conductive strip 42 tightly cover three-quarters of the circumference of the first pin 201 and the second pin 202. The thickness ratio between the first adhesive strip 31 and the second adhesive strip 32 of equal thickness and the first conductive strip 41 and the second conductive strip 42 of equal thickness is 10:4. The first tape 31 and the second tape 32 mentioned above each include a PET substrate layer and an adhesive layer coated on one side of the PET substrate layer. The first tape 31 and the second tape 32 mentioned above are insulating tapes, and the first conductive tape 41 and the second conductive tape 42 mentioned above are conductive cloth tapes. The shaft 1 has an annular clearance groove in the center along the circumferential direction that mates with the body 100 of the diode. The left side plate 21 and the right side plate 22 each have a mounting through hole 23 in the center. The two ends of the shaft 1 are respectively embedded in the mounting through holes 23 on the left side plate 21 and the right side plate 22. Both ends of the aforementioned shaft 1 have an annular groove 11 extending circumferentially. The inner walls of the mounting through holes 23 on the left side plate 21 and the right side plate 22 are in close contact with the circumferential surfaces of the corresponding annular grooves 11. The left side plate 21 and the right side plate 22 are fixedly connected to the shaft 1 by a number of bolts distributed circumferentially on the outside of the mounting through holes 23. The shaft 1 has a hanging hole 12 with both ends through it in the center, which is used to cooperate with the hanger in the electroplating equipment.

[0021] Based on the information described in the background art, the inventors discovered during the analysis of the causes of bending that the main cause was the disordered arrangement of products and the collision of leads in each process. In other words, material bending was the result, and rolling electroplating was the cause. To overcome this, it was necessary to change the original electroplating method and reduce bending.

[0022] When using the aforementioned processing unit for axial diodes, a large number of axial diodes remain in an orderly state during long-term electroplating processes in high-temperature, high-acid, and high-alkali environments. This avoids pin bending caused by collisions between a large number of diodes, ensures uniformity and consistency in the processing of each pin, improves processing quality, reduces noise in the production environment, and increases production efficiency. Furthermore, the first and second conductive strips, which are thinner than the first and second adhesive tapes, cover the outer surfaces of the first and second pins, and their lower surfaces are bonded to the areas of the first and second adhesive tapes located on both sides of the first and second pins. The diodes are then connected via the conductive strips. By connecting the pins in series to form a conductive circuit, the area of ​​the electrical contact region between the conductive strip and the pins and the stability of the electrical connection are ensured, thus guaranteeing the electroplating effect. Furthermore, several through holes are provided on both the left and right side plates, spaced apart circumferentially. Each of the left and right side plates has a left conductive layer and a right conductive layer on the side closest to the product tape. The left and right conductive layers, which are used for electrical contact with the pins of the diodes in the product tape, are located between adjacent through holes. This ensures the electrical conductivity of each diode pin stacked and wound on the shaft, and also ensures that fine particles in the electroplating solution are fully exchanged and reduced in the cathode area, further improving the electroplating effect.

[0023] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A processing unit for axial diodes, comprising: A shaft (1) and a product tape wound around the shaft (1), wherein a left side plate (21) and a right side plate (22) are installed at both ends of the shaft (1), and the product tape is located between the left side plate (21) and the right side plate (22). The product tape includes a plurality of diodes arranged at intervals, each of the diodes including a body (100) and a first pin (201) and a second pin (202) extending to both sides of the body (100). The product tape is characterized in that: the product tape further includes: a first tape (31) and a second tape (32) arranged in parallel, and a plurality of axial diodes are arranged at intervals along the length direction of the first tape (31) and the second tape (32), and the lower surface of the first pin (201) and the second pin (202) of each axial diode away from its body (100) is bonded to the upper surface of the first tape (31) and the second tape (32) coated with adhesive layer; The first tape (31) and the second tape (32) are respectively covered with a first conductive strip (41) and a second conductive strip (42). The first conductive strip (41) and the second conductive strip (42) with a thickness less than the first tape (31) and the second tape (32) cover the outer surface of the first pin (201) and the second pin (202), and their lower surfaces are bonded to the areas of the first tape (31) and the second tape (32) located on both sides of the first pin (201) and the second pin (202). The left side plate (21) and the right side plate (22) are each provided with a number of through holes (7) spaced apart along the circumference. The left side plate (21) and the right side plate (22) are each provided with a left conductive layer (5) and a right conductive layer (6) on the side close to the product tape. The left conductive layer (5) and the right conductive layer (6) for electrical contact with the pins of the diode in the product tape are provided between adjacent through holes (7).

2. The processing unit for axial diodes according to claim 1, characterized in that: The left side plate (21) and the right side plate (22) are each provided with four through holes (7) that are equally spaced along the circumference.

3. The processing unit for axial diodes according to claim 1 or 2, characterized in that: The through hole (7) is a fan-shaped through hole.

4. The processing unit for axial diodes according to claim 1, characterized in that: A left conductive layer (5) or a right conductive layer (6) is provided between any two through holes (7).

5. The processing unit for axial diodes according to claim 1 or 4, characterized in that: One end of each of the left conductive layer (5) and the right conductive layer (6) is connected to the shaft (1), and the other end extends radially along the shaft (1) to the edge of the left side plate (21) or the right side plate (22).

6. The processing unit for axial diodes according to claim 5, characterized in that: The ends of the left conductive layers (5) that are away from the axis (1) and the ends of the right conductive layers (6) that are away from the axis (1) are connected by an annular conductive layer (8).

7. The processing unit for axial diodes according to claim 1, characterized in that: The left conductive layer (5) and the right conductive layer (6) are conductive sheets installed between the left side plate (21), the right side plate (22) and the shaft (1).

8. The processing unit for axial diodes according to claim 1, characterized in that: The first pin (201) and the second pin (202) of the axial diode are both cylindrical pins, and the first conductive strip (41) and the second conductive strip (42) tightly cover at least half of the circumference of the first pin (201) and the second pin (202).

9. The processing unit for axial diodes according to claim 1, characterized in that: The thickness ratio between the first tape (31) and the second tape (32) of equal thickness and the first conductive tape (41) and the second conductive tape (42) of equal thickness is 10:1~4.

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