Halftoning scheme for maskless lithography
Patent Information
- Application Number
- CN202311162092.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-02-19
- Filing Date
- 2020-01-24
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2040-01-24
Smart Images

Figure CN117192912B_ABST
Abstract
Description
[0001] This application is a divisional application of the invention patent application filed on January 24, 2020, with application number 202080015262.9 and invention title "Halftone Scheme for Maskless Lithography Technology". Technical Field
[0002] The embodiments of this disclosure generally relate to photolithography systems. More specifically, the embodiments of this disclosure relate to systems, software applications, and methods for photolithography processes for writing full-tone and grayscale portions in a single pass. Background Technology
[0003] Photolithography is widely used in the manufacture of semiconductor devices (such as for back-end processing of semiconductor devices) and display devices (such as liquid crystal displays (LCDs)). For example, large-area substrates are often used in the manufacture of LCDs. LCDs (or flat panel displays) are commonly used in active-matrix displays, such as computers, touchpad devices, personal digital assistants (PDAs), mobile phones, television screens, and the like. Generally, a flat panel display consists of a layer of liquid crystal material sandwiched between two plates, which serves as the phase-change material at each pixel. When power from a power source is applied to or through the liquid crystal material, the amount of light passing through the liquid crystal material is controlled (i.e., selectively modulated) at the pixel location, allowing an image to be generated on the display.
[0004] Using known photolithography systems, in order to write a pattern having multiple full-tone portions (each with a full-tone dose) and multiple grayscale portions (each with a grayscale dose) into photoresist disposed on a substrate, the substrate needs to pass through the writable area of the photolithography system multiple times. Multiple passes of the substrate through the writable area of a digital photolithography system reduce yield.
[0005] Therefore, there is a need in the art for systems, software applications, and methods for photolithography processes that write full-tone and grayscale portions in a single pass. Summary of the Invention
[0006] In one embodiment, a system is provided. The system includes a flat plate and a movable platform disposed on the flat plate. The platform is configured to support a substrate having photoresist disposed thereon, and an encoder is coupled to the platform and configured to provide the substrate position to a controller, the controller being configured to provide mask pattern data to a lithography system. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons. A lithography system support is coupled to the flat plate and has an opening to allow the platform to pass beneath the lithography system support. The lithography system has a processing unit having a plurality of image projection systems that receive the mask pattern data. Each image projection system includes a spatial light modulator having a plurality of spatial light modulator pixels for projecting multiple shots. The controller is configured to spatially divide the plurality of spatial light modulator pixels by at least a gray-tone group and a full-tone group of spatial light modulator pixels. When divided by the controller, the gray-tone group of spatial light modulator pixels is operable to project a first number of multiple shots onto the plurality of full-tone exposure polygons and the plurality of gray-tone exposure polygons. When divided by the controller, the spatial light modulator pixels of the full-tone group are operable to project a second number of multiple emissions onto multiple full-tone exposure polygons.
[0007] In another embodiment, a non-transitory computer-readable medium is provided. The computer-readable medium stores instructions that, when executed by a processor, cause a computer system to perform the following steps: providing mask pattern data having multiple exposure polygons to a processing unit of a photolithography system; during a single scan of a substrate on which photoresist is disposed under multiple image projection systems, projecting at least a first number of multiple emissions through spatial light modulator pixels of a grayscale group onto multiple full-tone exposure polygons and multiple grayscale exposure polygons; and projecting at least a second number of multiple emissions through spatial light modulator pixels of a full-tone group onto multiple full-tone exposure polygons. The processing unit has multiple image projection systems for receiving the mask pattern data. The mask pattern data has multiple full-tone exposure polygons and multiple grayscale exposure polygons.
[0008] In another embodiment, a method is provided. The method includes providing mask pattern data having a plurality of exposure polygons to a processing unit of a photolithography system. The processing unit has a plurality of image projection systems for receiving the mask pattern data. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons. In a single scan of a substrate on which photoresist is disposed under the plurality of image projection systems, the method includes: projecting at least a first number of multiple emissions onto the plurality of full-tone exposure polygons and the plurality of gray-tone exposure polygons through spatial light modulator pixels of a gray-tone group, and projecting at least a second number of multiple emissions onto the plurality of full-tone exposure polygons through spatial light modulator pixels of a full-tone group. Attached Figure Description
[0009] As a way to understand the above-described features of this disclosure in detail, a more specific description of the disclosure, which has been briefly summarized above, can be obtained by referring to embodiments, some of which are depicted in the accompanying drawings. However, it should be noted that the drawings depict only typical embodiments of this disclosure and should therefore not be considered as limiting the scope of this disclosure, and other equally effective embodiments are permissible.
[0010] Figure 1 A perspective view of a system according to one embodiment.
[0011] Figure 2A A schematic cross-sectional view of an image projection system according to one embodiment.
[0012] Figure 2B and Figure 2C A schematic diagram of a spatial light modulator according to one embodiment.
[0013] Figure 3 A schematic diagram of a computing system according to one embodiment.
[0014] Figure 4 A schematic diagram of a single-pass lithography application according to one embodiment.
[0015] Figure 5 A schematic diagram of a controller according to one embodiment.
[0016] Figure 6A A schematic plan view of a substrate after photolithography according to one embodiment.
[0017] Figures 6B to 6D A cross-sectional view of photoresist exposure at a cross section according to one embodiment.
[0018] Figure 7 A flowchart of a photolithography process according to one embodiment.
[0019] Figure 8 A flowchart of a photolithography process according to one embodiment.
[0020] Figure 9 A flowchart of a photolithography process according to one embodiment.
[0021] Figures 10A to 10S A schematic plan view of full-tone exposure polygons and gray-tone exposure polygons during the photolithography process according to an embodiment.
[0022] Figure 11 A flowchart of a photolithography process according to one embodiment.
[0023] Figures 12A to 12F A schematic plan view of full-tone exposure polygons and gray-tone exposure polygons during a photolithography process according to one embodiment.
[0024] To facilitate understanding, the same reference numerals are used wherever possible to indicate common elements in the figures. It is conceivable that elements and features in one embodiment may be beneficially incorporated into other embodiments without further description. Detailed Implementation
[0025] The embodiments described herein provide systems, software applications, and methods for photolithography processes (such as digital lithography) that write full-tone and grayscale portions in a single pass. One embodiment of the system includes a controller configured to provide mask pattern data to a photolithography system. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of grayscale exposure polygons. The photolithography system has a processing unit having a plurality of image projection systems that receive the mask pattern data. Each image projection system includes a spatial light modulator having a plurality of spatial light modulator pixels for projecting multiple emissions. The controller is configured to spatially divide the plurality of spatial light modulator pixels by at least a grayscale group of spatial light modulator pixels and a full-tone group of spatial light modulator pixels. When divided by the controller, the grayscale group of spatial light modulator pixels is operable to project a first number of multiple emissions onto the plurality of full-tone exposure polygons and the plurality of grayscale exposure polygons. When divided by the controller, the full-tone group of spatial light modulator pixels is operable to project a second number of multiple emissions onto the plurality of full-tone exposure polygons.
[0026] Figure 1 This is a perspective view of system 100 (such as a digital lithography system), which can benefit from the embodiments described herein. System 100 includes a platform 114 and a processing device 104. Platform 114 is supported by a pair of tracks 116 disposed on a flat plate 102. Substrate 120 is supported by platform 114. Platform 114 is supported by a pair of tracks 116 disposed on flat plate 102. Figure 1 As indicated by the coordinate system shown, platform 114 moves along a pair of tracks 116 in the X direction. In one embodiment, which may be combined with other embodiments described herein, the pair of tracks 116 are a pair of parallel magnetic channels. As shown, each track of the pair of tracks 116 extends in a straight path. Encoder 118 is coupled to platform 114 to provide controller 122 with information about the position of platform 114.
[0027] Controller 122 is typically designed to facilitate the control and automation of the processing techniques described herein. Controller 122 may be coupled to or communicate with processing device 104, platform 114, and encoder 118. Processing device 104 and encoder 118 may provide controller 122 with information regarding substrate processing and substrate alignment. For example, processing device 104 may provide information to controller 122 to alert controller 122 that substrate processing is complete. Controller 122 facilitates the control and automation of the photolithography process to write full-tone and grayscale portions in a single pass. A program (or computer instructions) (which may be referred to as an imaging program) readable by controller 122 determines which tasks can be performed on substrate 120. The program includes mask pattern data and codes to monitor and control processing time and substrate position. The mask pattern data corresponds to a pattern to be written into the photoresist using electromagnetic radiation.
[0028] Substrate 120 comprises any suitable material, such as glass, which serves as a component of a flat panel display. In other embodiments that may be combined with other embodiments described herein, substrate 120 is made of other materials that can be used as components of a flat panel display. Substrate 120 has a thin film layer to be patterned thereon (such as pattern etching thereon), and a photoresist layer formed on the thin film layer to be patterned, the photoresist layer being sensitive to electromagnetic radiation (e.g., UV or deep UV "light"). Positive photoresist includes portions of the photoresist that, when exposed to radiation, are soluble in the photoresist developer applied to the photoresist after the pattern has been written into the photoresist using electromagnetic radiation. Negative photoresist includes portions of the photoresist that, when exposed to radiation, will be insoluble in the photoresist developer applied to the photoresist after the pattern has been written into the photoresist using electromagnetic radiation. The chemical composition of the photoresist determines whether it is a positive or negative photoresist. Examples of photoresists include (but are not limited to) at least one of the following: diazonoquinone, phenolic resin, polymethyl methacrylate, polymethyl glutarimide, and SU-8. After exposing the photoresist to electromagnetic radiation, the photoresist is developed to leave a patterned photoresist layer on the underlying thin film layer. Then, using the patterned photoresist, the underlying thin film is etched through openings in the photoresist to form part of the electronic circuitry system of the display panel.
[0029] The processing apparatus 104 includes a support 108 and a processing unit 106. The processing apparatus 104 spans a pair of tracks 116 and is mounted on a flat plate 102, and therefore includes an opening 112 allowing the pair of tracks 116 and a platform 114 to pass beneath the processing unit 106. The processing unit 106 is supported on the flat plate 102 by the support 108. In one embodiment that may be combined with other embodiments described herein, the processing unit 106 is a pattern generator configured to expose photoresist in a photolithography process. In some embodiments that may be combined with other embodiments described herein, the pattern generator is configured to perform a maskless photolithography process. The processing unit 106 includes a plurality of image projection systems. An example of an image projection system is shown... Figure 2A In one embodiment, which may be combined with other embodiments described herein, processing unit 106 includes up to 84 image projection systems. Each image projection system is disposed within housing 110. Processing unit 106 can be used for maskless direct patterning of photoresist or other electromagnetically sensitive materials.
[0030] Figure 2A This is a schematic cross-sectional view of an image projection system 200, which can be used in system 100. The image projection system 200 includes a spatial light modulator 210 and projection optics 212. The components of the image projection system 200 vary depending on the spatial light modulator 210 used. The spatial light modulator 210 includes an array of electrically addressed elements. Electrically addressed elements include (but are not limited to) digital micromirrors, liquid crystal displays (LCDs), liquid crystal on silicon (LCoS) devices, ferroelectric liquid crystal on silicon (LCoS) devices, and microshutters. The spatial light modulator 210 includes a plurality of spatial light modulator pixels. Each of the plurality of spatial light modulator pixels is individually controllable and configured to project a write beam corresponding to one of the plurality of pixels. The aggregation of the plurality of pixels forms a pattern written in photoresist, referred to herein as a mask pattern. The projection optics 212 includes a projection lens, such as a 10x objective lens, for projecting light onto a substrate 120. During operation, based on the mask pattern data provided to the spatial light modulator 210 by the controller 122, each of the plurality of spatial light modulator pixels is in an "on" or "off" position. Each spatial light modulator pixel in the "on" position forms a write beam, which is then projected by the projection optics 212 onto the surface of the photoresist layer of the substrate 120 to form a pixel of the mask pattern.
[0031] In one embodiment that can be combined with other embodiments described herein, the spatial light modulator 210 is a DMD. The image projection system 200 includes a light source 202, an aperture 204, a lens 206, a suppressed prism assembly 208, the DMD, and projection optics 212. The DMD includes a plurality of mirrors (i.e., a plurality of spatial light modulator pixels). Each of the plurality of mirrors corresponds to one pixel, which may correspond to one pixel of a mask pattern. In some embodiments that can be combined with other embodiments described herein, the DMD includes more than approximately 4,000,000 mirrors. The light source 202 is any suitable light source capable of generating light with a predetermined wavelength, such as a light-emitting diode (LED) or a laser. In one embodiment that can be combined with other embodiments described herein, the predetermined wavelength is in the blue or near-ultraviolet (UV) range, such as less than approximately 450 nm. The suppressed prism assembly 208 includes a plurality of reflective surfaces. In operation, a beam 201 is generated by the light source 202. The beam 201 is reflected by the suppressed prism assembly 208 to the DMD. When beam 201 reaches the mirrors of the DMD, each mirror in the "on" position reflects beam 201, forming a write beam (also known as an "emission"). Projection optics 212 then projects this write beam onto the photoresist layer surface of substrate 120. Multiple write beams 203 (also known as multiple emissions) form multiple pixels of the mask pattern.
[0032] Figure 2B and Figure 2C This is a schematic diagram of a spatial light modulator 210 for a DMD. Multiple mirrors 213 (also known as multiple spatial light modulator pixels) are arranged in a grid with M rows and N columns. Figure 2B The image shows rows 214, 216, 218, 220, 222, 224, and columns 215, 217, 219, 221, 223, and 225. In the photolithography method 700 for writing full-tone and grayscale portions in a single pass, the controller 122 (e.g., ...) Figure 2BAs shown, the mirrors 213 in N columns and M rows are divided into grayscale groups 226 and full-color groups 227. In embodiments of methods 700, 800, and 900 (as described herein), the division of the mirrors 213 in N columns and M rows depends on the movement of platform 114. When the movement of platform 114 is approximately perpendicular to the N columns, the N columns are divided by controller 122. When the movement of platform 114 is approximately perpendicular to the M rows, the M rows are divided by controller 122. When the movement of platform 114 is neither approximately perpendicular to the N columns nor approximately perpendicular to the M rows, an array of grids with M rows and N columns is divided by controller 122. In the embodiments described below, the movement of platform 114 is approximately perpendicular to the N columns, therefore the N columns are divided by controller 122. However, the embodiments of methods 700, 800, and 900 described below can be performed by dividing N rows when the movement of platform 114 is approximately perpendicular to N rows, and by dividing an array of grids having M rows and N columns when the movement of platform 114 is neither approximately perpendicular to N columns nor approximately perpendicular to M rows. In one embodiment of method 700 that can be combined with other embodiments described herein, grayscale group 226 and full-tone group 227 have the same number of columns. In method 800 of the photolithography process of writing full-tone portions and grayscale portions in a single pass, controller 122 (e.g. Figure 2B (As shown) the N columns of mirrors 213 are divided into grayscale groups 226 and full-tone groups 227 with different numbers of columns. In the photolithography process 900 that writes the full-tone portion and the grayscale portion in a single pass, the controller 122 (as shown) Figure 2C As shown, the N columns of mirror 213 are divided into grayscale group 226, full-tone group 227, and the remaining groups 228. In one embodiment, which may be combined with other embodiments described herein, grayscale group 226 and full-tone group 227 have the same number of columns. In another embodiment, which may be combined with other embodiments described herein, grayscale group 226 and full-tone group 227 have different numbers of columns.
[0033] Figure 3 This is a schematic diagram of a computing system 300 constructed for writing full-tone and grayscale portions in a single pass, in which embodiments of the present disclosure can be implemented. Figure 3As shown, the computing system 300 may include multiple servers 308, a single-pass lithography application 312, and multiple controllers (i.e., computers, personal computers, mobile / wireless devices) 122 (only two are shown for clarity), each connected to a communication network 306 (e.g., the Internet). Servers 308 may communicate with database 314 via a local connection (e.g., a storage area network (SAN) or network attached storage (NAS)) or via the Internet. Servers 308 are configured to directly access data included in database 314 or connect to a database manager configured to manage the data included in database 314.
[0034] Each controller 122 may include known components of a computing device, such as a processor, system memory, hard disk drive, battery, input devices (such as a mouse and keyboard), and / or output devices (such as a monitor or graphical user interface), and / or combinations of input / output devices (such as a touch screen that not only receives input but also displays output). Each server 308 and single-pass lithography application 312 may include a processor and system memory (not shown) and may be configured to utilize, for example, relational database software and / or file systems to manage the contents stored in database 314. I / O device interface 408 (such as...) Figure 4 The device shown can be programmed to use network protocols, such as (e.g.) TCP / IP, to interface with another I / O device, controller 122, and single-pass lithography application 312. Single-pass lithography application 312 can communicate directly with controller 122 via communication network 306. Controller 122 is programmed to execute software 304 (such as programs and / or other software applications) and access applications managed by server 308.
[0035] In the embodiments described below, the user can operate the controller 122 separately, which is connected to the server 308 via the communication network 306. Pages, images, data, documents, and the like can be displayed to the user via the controller 122. Information and images can be displayed via a display device and / or a graphical user interface that communicates with the controller 122.
[0036] It should be noted that controller 122 may be a personal computer, a laptop mobile computing device, a smartphone, a video game console, a home digital media player, a connected television, a set-top box, and / or other computing devices having components suitable for communicating with communication network 306 and / or the desired application or software. Controller 122 may also execute other software applications configured to receive content and information from one-way lithography application 312.
[0037] Figure 4This is a schematic diagram of a single-pass lithography application 312. The single-pass lithography application 312 includes (but is not limited to) a central processing unit (CPU) 402, a network interface 404, a memory 420, and a storage device 430 communicating via interconnect 406. The single-pass lithography application 312 may also include an I / O device interface 408 for connecting I / O devices 410 (e.g., keyboard, video, mouse, audio, touch screen, etc.). The single-pass lithography application 312 may further include a network interface 504 (displayed on...) Figure 5 (In the middle), network interface 504 is configured to transmit data via a data communication network.
[0038] CPU 402 retrieves and executes program instructions stored in memory 420, and typically controls and coordinates the operation of other system components. Similarly, CPU 402 stores and retrieves application data residing in memory 420. CPU 402 is included to represent a single CPU, multiple CPUs, a single CPU with multiple processing cores, etc. Interconnect 406 is used to transfer program instructions and application data between CPU 402, I / O device interface 408, memory 430, network interface 404, and memory 420.
[0039] Memory 420 is typically included to represent random access memory, and in operation, it stores software applications and data for use by CPU 402. Although illustrated as a single unit, storage device 430 can be a combination of fixed and / or removable storage devices, such as fixed disk drives, floppy disk drives, hard disk drives, flash drives, tape drives, removable memory cards, CD-ROMs, DVD-ROMs, Blu-ray, HD-DVDs, optical storage, network attached storage (NAS), cloud storage, or storage area networks (SANs) constructed to store non-volatile data.
[0040] Memory 420 may store instructions and logic for executing application platform 426, which may include single-pass lithography application software 428. Storage device 430 may include database 432, which is configured to store data 434 and associated application platform content 436. Database 432 may be any type of storage device.
[0041] A network computer is another type of computer system that can be used in conjunction with the disclosures provided herein. A network computer typically does not include a hard disk or other large storage device; instead, the executable program is loaded from the network connection into memory 420 for the CPU 502 (displayed on the CPU). Figure 5 (Execution in the middle). A typical computer system will usually include at least one processor, memory, and interconnects that couple the memory to the processor.
[0042] Figure 5This is a schematic diagram of controller 122, which is used to access single-pass lithography application 312 and retrieve or display data associated with application platform 426. Controller 122 may include (but is not limited to) a central processing unit (CPU) 502, a network interface 504, an interconnect 506, a memory 520, a storage device 530, and support circuitry 540. Controller 122 may also include an I / O device interface 508 for connecting I / O devices 510 (e.g., keyboard, display, touch screen, and mouse) to controller 122.
[0043] Similar to CPU 402, CPU 502 is included to represent a single CPU, multiple CPUs, a single CPU with multiple processing cores, etc., while memory 520 is typically included to represent random access memory. Interconnect 506 can be used to transfer program instructions and application data between CPU 502, I / O device interface 508, storage device 530, network interface 504, and memory 520. Network interface 504 can be configured to transfer data via communication network 306, for example, to transfer content from a one-way lithography application 312. Storage device 430 (such as a hard disk drive or solid-state storage drive (SSD)) can store non-volatile data. Storage device 530 may include database 531. Database 531 may include data 532, other content 534, and an image processing unit 536 having data 538 and control logic 539. For example, memory 520 may include application interface 522, which itself can display software instructions 524 and / or store or display data 526. Application interface 522 can provide one or more software applications that allow the controller to access data or other content controlled by single-pass lithography application 312.
[0044] like Figure 1 As shown, system 100 includes a controller 122. The controller 122 includes a central processing unit (CPU) 502, memory 520, and support circuitry 540 (or I / O 508). The CPU 502 can be one of any form of computer processor used in industrial settings to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitor processes (e.g., processing time and substrate position). Memory 520 (e.g., ...) Figure 5The memory (shown in the diagram) is connected to the CPU 502 and can be one or more commercially available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of digital storage, whether local or remote. Software instructions and data may be encoded and stored in the memory to instruct the CPU 502. Support circuitry 540 is also connected to the CPU 502 to support the processor in a known manner. Support circuitry 540 may include known cache 542, power supply 544, clock circuitry 546, input / output circuitry system 548, subsystem 550, and the like. A program (or computer instructions) readable by the controller 122 determines which tasks can be performed on the substrate 120. The program may be controller-readable software and may include code to monitor and control, for example, processing time and substrate position.
[0045] However, it should be remembered that all these terms and the like are associated with appropriate physical quantities and are merely convenient labels applied to those quantities. As will be apparent from the following description, unless otherwise stated otherwise, it will be understood that throughout the specification, descriptions using terms such as “processing” or “calculating” or “operating” or “determining” or “displaying” or similar terms refer to actions or programs of a computer system (or similar electronic computing device) that manipulate data represented as physical (electronic) quantities in the computer system’s registers and memories and convert them into other data similarly represented as physical quantities in the computer system’s memory or registers or other such information storage, transmission, or display devices.
[0046] This example also relates to a device for performing the operations described herein. This device may be specifically constructed for the necessary purpose, or it may contain a general-purpose computer that is selectively enabled or reconfigured by computer programs stored within it. Such computer programs may be stored in computer-readable storage media, such as (but not limited to) read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, flash memory, magnetic or optical cards, any type of disk (including floppy disks, optical disks, CD-ROMs, and magnetic optical disks), or any type of media suitable for storing electronic instructions and each coupled to a computer system interconnect.
[0047] The algorithms and displays presented in this paper are not inherently associated with any particular computer or other device. Various general-purpose systems can be used with the programs taught in this paper, or it will prove convenient to construct more specific devices to perform the necessary methodological operations. The structures applicable to a wide variety of such systems are readily apparent from the above description. Furthermore, this example is not illustrated with reference to any particular programming language, and therefore various examples can be implemented using a wide range of programming languages.
[0048] As described in more detail herein, embodiments of this disclosure relate to photolithography applications, specifically the ability to apply mask pattern data 610 to a substrate 120 in a single-pass photolithography process. The embodiments described herein relate to a software application platform. This software application platform includes methods for writing full-tone and grayscale portions in a single pass.
[0049] Figure 6A This is a schematic plan view of the substrate 120 after the photolithography process. Multiple full-tone portions 602 and multiple gray-tone portions 604 are written into the photoresist 601. The multiple full-tone portions 602 are exposed to a full-tone dose 606 of the intensity of light emitted from the light source 202 (shown in the diagram). Figures 6B to 6D In the middle), multiple grayscale portions 604 are exposed to a grayscale dose 608 of light intensity emitted from light source 202 (displayed in the middle). Figures 6B to 6D (in the middle). In one embodiment that can be combined with other embodiments described herein, the strength is approximately 10 mJ / cm. 2 Up to approximately 200 mJ / cm 2 During the photolithography process, the mask pattern data 610 has a plurality of full-tone exposure polygons 612 corresponding to the full-tone portions 602 formed by the photolithography process, and a plurality of gray-tone exposure polygons 614 corresponding to the gray-tone portions 604 formed by the photolithography process. Photoresist 601 is disposed on the substrate 120. In one embodiment, which may be combined with other embodiments described herein, the substrate 120 has a thin film layer to be patterned (e.g., by pattern etching) formed thereon, and the photoresist is disposed on the thin film layer to be patterned.
[0050] Figures 6B to 6DThis is a cross-sectional view of the exposure of photoresist 601 located at section 603. Section 603 includes a plurality of full-tone portions 602 exposed to full-tone dose 606 and a plurality of gray-tone portions 604 exposed to gray-tone dose 608. Full-tone dose 606 corresponds to the percentage of photoresist 601 developed by exposing the plurality of full-tone portions 602 to the full-tone percentage of the light intensity emitted from light source 202. Gray-tone dose 608 corresponds to the percentage of photoresist 601 developed by exposing the plurality of gray-tone portions 604 to the gray-tone percentage of the light intensity emitted from light source 202. The width of each of the plurality of full-tone portions 602 controls the full-tone dose 606 from the full-tone percentage of the intensity, unless the width of one of the plurality of full-tone portions 602 is greater than the width of one of the spatial light modulator pixels. For example, the width of one of the plurality of full-tone portions 602 that is smaller than the width of one of the spatial light modulator pixels results in the full-tone dose 606 of the full-tone portion being less than the full-tone percentage. The width of one of a plurality of full-tone portions 602 that is greater than or equal to the width of one of the spatial light modulator pixels causes the full-tone dose 606 of the full-tone portion to be equal to the full-tone percentage. The width of each of a plurality of grayscale portions 604 controls the grayscale dose 608 from the grayscale percentage in the intensity, unless the width of one of the plurality of grayscale portions 604 is greater than the width of one of the spatial light modulator pixels. For example, the width of one of the plurality of grayscale portions 604 that is less than the width of one of the spatial light modulator pixels causes the grayscale dose 608 of the grayscale portion to be less than the grayscale percentage. The width of one of the plurality of grayscale portions 604 that is greater than or equal to the width of one of the spatial light modulator pixels causes the grayscale dose 608 of the grayscale portion to be equal to the grayscale percentage. In one embodiment that may be combined with other embodiments described herein, each of the plurality of full-tone portions 602 and the plurality of grayscale portions 604 has the same width that is less than the width of the spatial light modulator pixel.
[0051] like Figure 6BAs shown and further explained herein, method 700 uses grayscale groups 226 and full-tone groups 227 having the same number of columns to make the grayscale percentage half the full-tone percentage. For example, grayscale groups 226 with 50% of the columns and full-tone portions with 50% of the columns result in a grayscale percentage of 50% and a full-tone percentage of 100%. Grayscale dose 608 is 42% of the grayscale percentage developed by 50% of the intensity of the light emitted by light source 202, which is exposed to each of a plurality of grayscale portions 604 having the same width less than the width of a spatial light modulator pixel. Full-tone dose 606 is 84% of the full-tone percentage developed by 100% of the intensity of the light emitted by light source 202, which is exposed to each of a plurality of full-tone portions 602 having the same width less than the width of a spatial light modulator pixel.
[0052] like Figure 6C As shown and further explained herein, method 800 achieves a grayscale percentage greater than half the full-tone percentage by using grayscale groups 226 and full-tone groups 227 with different column numbers. For example, grayscale groups 226 with 55% columns and full-tone portions with 45% columns achieve a grayscale percentage of 55% and a full-tone percentage of 95%. Grayscale dose 608 is 48.1% of the intensity of light emitted by light source 202, which is exposed to each of a plurality of grayscale portions 604 having the same width less than the width of a spatial light modulator pixel. Full-tone dose 606 is 87.5% of the intensity of light emitted by light source 202, which is exposed to each of a plurality of full-tone portions 602 having the same width less than the width of a spatial light modulator pixel.
[0053] like Figure 6D As shown and further explained herein, method 900 uses grayscale group 226, full-tone group 227, and remaining group 228 (grayscale group 226 and full-tone group 227 have the same number of columns) to make the grayscale percentage less than half the full-tone percentage. For example, grayscale group 226 with 48% columns, full-tone portion with 48% columns, and remaining group 228 with 4% columns make the grayscale percentage 48% and the full-tone percentage 104%. Grayscale dose 608 is 40.86% of the intensity of light emitted by light source 202, which is exposed to each of a plurality of grayscale portions 604 having the same width less than the width of a spatial light modulator pixel. The full-tone dose 606 is 85.47% of the full-tone percentage of 104% of the intensity of the light emitted by the light source 202, which is exposed to each of a plurality of full-tone portions 602 having the same width less than the width of the spatial light modulator pixel.
[0054] Figure 7 This is a flowchart of a photolithography process 700 that involves writing the full-tone portion 602 and the gray-tone portion 604 in a single pass. Figures 10A to 10F This is a schematic plan view of the full-tone exposure polygon 1002 and gray-tone exposure polygon 1004 during method 700. In operation 701, as described above, the controller 122 divides the N columns of mirrors 213 into gray-tone groups 226 and full-tone groups 227 with the same number of columns. In operation 702, while the substrate 120 is scanned under the image projection system 200 in a single pass, the processing unit 106 projects multiple emissions into the full-tone exposure polygon 1002 and gray-tone exposure polygon 1004. As each emission of the multiple emissions is projected to one of a plurality of address points 1008, a plurality of spatial light modulator pixels of the spatial light modulator 210 form a converged emission pattern 1006. Each address point represents the center point of a pixel. In one embodiment that can be combined with other embodiments described herein, the converged emission pattern 1006 is a hexagonal close-packed (HCP) pattern; however, other patterns may be used for the converged emission pattern 1006. Multiple firings are a certain number of firings to form multiple full-tone portions 602 exposed to the full-tone dose 606. For example, multiple firings are between 50 firings and 500 firings.
[0055] like Figure 10A As shown, a first grayscale emission 1010a in a plurality of emissions from grayscale group 226 of spatial light modulator 210 is projected onto full-tone exposure polygon 1002 and grayscale exposure polygon 1004, and onto at least a first address point 1008a of a plurality of address points 1008. Each emission in the plurality of emissions in full-tone exposure polygon 1002 and grayscale exposure polygon 1004 has an intensity of light emitted from light source 202. Figure 10B As shown, a second grayscale emission 1010b from grayscale group 226 is projected onto full-tone exposure polygon 1002 and grayscale exposure polygon 1004. Figure 10C As shown, grayscale group 226 is repeatedly used to project multiple emissions from grayscale group 226 to full-tone exposure polygon 1002 and grayscale exposure polygon 1004 until the final grayscale emission 1010n in the multiple emissions is projected to at least one final address point 1008n. The partitioning of spatial light modulator 210 for method 700 results in the final grayscale emission 1010n being half a point of the multiple emissions. Figure 10D As shown, the full-tone group 227 projects a first full-tone emission 1012a from multiple emission sources onto at least one first address point 1008a of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10E As shown, the full-tone group 227 projects a second full-tone emission 1012b from multiple emissions onto at least one second address point 1008b of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10F As shown, the full-tone group 227 is repeatedly used to project multiple emissions until the final full-tone emission 1012n in the multiple emissions is projected to at least one final address point 1008n.
[0056] Figure 8 This is a flowchart of a photolithography process 800 that involves writing the full-tone portion 602 and the gray-tone portion 604 in a single pass. Figures 10G to 10L This is a schematic plan view of the full-tone exposure polygon 1002 and gray-tone exposure polygon 1004 during method 800. In operation 801, as described above, the controller 122 divides the N columns of mirrors 213 into gray-tone groups 226 and full-tone groups 227 with different numbers of columns. The gray-tone group 226 has more columns than the full-tone group 227. In operation 802, when the substrate 120 is scanned under the image projection system 200 in a single pass, the processing unit 106 projects multiple emissions in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004.
[0057] like Figure 10G As shown, a first grayscale emission 1010a in multiple emissions from the grayscale group 226 of the spatial light modulator 210 is projected onto the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004, while at least one first address point 1008a of a plurality of address points 1008 is also projected. Each emission in the multiple emissions from the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004 has an intensity of light emitted from the light source 202. Figure 10H As shown, a second grayscale emission 1010b from grayscale group 226 is projected onto full-tone exposure polygon 1002 and grayscale exposure polygon 1004. Figure 10I As shown, grayscale group 226 is repeatedly used to project multiple emissions from grayscale group 226 to full-tone exposure polygon 1002 and grayscale exposure polygon 1004 until the final grayscale emission 1010n in the multiple emissions is projected to at least one final address point 1008n. The partitioning of spatial light modulator 210 for method 800 results in the final grayscale emission 1010n being emitted more times than half the number of times half the points in the multiple emissions are emitted. Therefore, the final full-tone emission 1012n will not address each of the address points 1008 in full-tone exposure polygon 1002, resulting in a grayscale percentage greater than half the full-tone percentage, because a portion of the multiple address points 1008 inside full-tone exposure polygon 1002 will not be addressed twice.
[0058] like Figure 10J As shown, the full-tone group 227 projects a first full-tone emission 1012a from multiple emission sources onto at least one first address point 1008a of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10K As shown, the full-tone group 227 projects a second full-tone emission 1012b from multiple emissions onto at least one second address point 1008b of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10L As shown, the full-tone group 227 is repeatedly used to project multiple emissions until the final full-tone emission 1012n in the multiple emissions is projected to at least one final address point 1008n. After the final full-tone emission 1012n is projected to at least one final address point 1008n, a portion of the plurality of address points 1008 inside the full-tone exposure polygon 1002 will not be addressed twice.
[0059] Figure 9 This is a flowchart of a photolithography process 900 that involves writing the full-tone portion 602 and the gray-tone portion 604 in a single pass. Figures 10M to 10S This is a schematic plan view of the full-tone exposure polygon 1002 and gray-tone exposure polygon 1004 during method 900. In operation 901, as described above, the controller 122 divides the N columns of mirrors 213 into a gray-tone group 226, a full-tone group 227, and the remaining groups 228. The gray-tone group 226 and the full-tone group 227 have the same number of columns. In operation 902, when the substrate 120 is scanned under the image projection system 200 in a single pass, the processing unit 106 projects multiple emissions in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004.
[0060] like Figure 10M As shown, a first grayscale emission 1010a from multiple emissions of the grayscale group 226 from the spatial light modulator 210 is projected onto the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004, and is projected onto at least one first address point 1008a of a plurality of address points 1008. Each emission from the multiple emissions in the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004 has the intensity of light emitted from the light source 202. Figure 10N As shown, a second grayscale emission 1010b from grayscale group 226 is projected onto full-tone exposure polygon 1002 and grayscale exposure polygon 1004. Figure 10OAs shown, grayscale group 226 is repeatedly used to project multiple emissions from grayscale group 226 to full-tone exposure polygon 1002 and grayscale exposure polygon 1004 until the final grayscale emission 1010n in the multiple emissions is projected to at least one final address point 1008n. The partitioning of spatial light modulator 210 for method 900 results in each of the multiple address points 1008 inside grayscale exposure polygon 1004 being addressed.
[0061] like Figure 10P As shown, the full-tone group 227 projects a first full-tone emission 1012a from multiple emission sources onto at least one first address point 1008a of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10Q As shown, the full-tone group 227 projects a second full-tone emission 1012b from multiple emissions onto at least one second address point 1008b of a plurality of address points 1008 inside the full-tone exposure polygon 1002. Figure 10R As shown, the full-tone group 227 is repeatedly used to project multiple emissions until the final full-tone emission 1012n in the multiple emissions is projected to at least one final address point 1008n. Figure 10S As shown, the remaining group 228 of the spatial light modulator 210 projects the remaining emissions 1014 from multiple emissions onto address points inside the full-tone exposure polygon 1002, resulting in a full-tone percentage that is more than half the grayscale percentage. In embodiments that can be combined with other embodiments described herein, the remaining group 228 of the spatial light modulator 210 projects the remaining emissions 1014 from multiple emissions onto address points inside the grayscale exposure polygon 1004, resulting in a full-tone percentage that is less than half the grayscale percentage.
[0062] Figure 11 This is a flowchart of a photolithography process 1100 that writes the full-tone portion 602 and the gray-tone portion 604 in a single pass. Figures 12A to 12F This is a schematic plan view of the full-tone exposure polygon 1002 and grayscale exposure polygon 1004 during method 1100. Controller 122 temporally divides a plurality of spatial light modulator pixels of spatial light modulator 210 by first and second emissions during multiple emissions in the full-tone exposure polygon 1002 and grayscale exposure polygon 1004. Controller 122 includes an emission counter to temporally divide the first and second emissions during multiple emissions. Controller 122 includes a control loop for simulating the intensity of light emitted from light source 202. This control loop provides simulated emission of the intensity of the first and second emissions at predetermined locations throughout the photoresist 601.
[0063] When the substrate 120 is scanned under the image projection system 200 in a single pass, the processing unit 106 projects multiple emissions. The first and second emissions of the multiple emissions are projected onto the full-tone exposure polygon 1002. In one embodiment, which may be combined with other embodiments described herein, as shown, only the first emission of the multiple emissions is projected onto the grayscale exposure polygon 1004. In another embodiment, which may be combined with other embodiments described herein, only the second emission of the multiple emissions is projected onto the grayscale exposure polygon 1004.
[0064] To facilitate explanation, reference will be made to the grayscale emission projected onto the grayscale exposure polygon 1004, and to the grayscale and pantone emission projected onto the pantone exposure polygon 1002, to illustrate the concept. Figure 11 and Figures 12A to 12F Note that in one embodiment that can be combined with other embodiments described herein, such as Figures 12A to 12F As shown, grayscale emission is the first emission and full-tone emission is the second emission, while in another embodiment that may be combined with other embodiments described herein, grayscale emission is the second emission and full-tone emission is the first emission.
[0065] In operation 1101, multiple emission points are projected onto the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004. For example... Figure 12A As shown, multiple emitted grayscale emissions 1210a (which are grayscale emissions) are projected onto the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004, and projected onto at least one first address point 1008a of a plurality of address points 1008. Figure 12B As shown, when the substrate 120 is scanned under the image projection system 200, multiple emissions of full-tone emission 1210b (which is full-tone emission) are projected onto the inside of the full-tone exposure polygon 1002 to at least one second address point 1008b. In one embodiment that can be combined with other embodiments described herein, such as Figure 12CAs shown, the multiple-emission half-point emission 1210h is a grayscale emission projected inside the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004 to at least one final address point 1008n. In another embodiment that can be combined with other embodiments described herein, the multiple-emission half-point emission 1210h is a full-tone emission projected inside the full-tone exposure polygon 1002. After the multiple-emission half-point emission 1210h, a plurality of grayscale portions 604 have grayscale emission address points among a plurality of address points 1008 exposed to a first intensity percentage. A plurality of full-tone portions 602 have grayscale emission address points exposed to a second intensity percentage (i.e., grayscale percentage of intensity) and full-tone emission address points exposed to the first intensity percentage. In one embodiment that can be combined with other embodiments described herein, the second intensity is less than the first intensity. The combination of the first and second intensities (i.e., full-tone percentage of intensity) corresponds to full-tone dose 606. The second intensity (i.e., grayscale percentage) corresponds to grayscale dose 608.
[0066] In one embodiment that can be combined with other embodiments described herein, such as Figure 12D As shown, in a series of multiple emission events, emission 1210d following the half-point emission 1210h as a grayscale emission is a full-tone emission, which is projected onto the full-tone exposure polygon 1002 and onto at least one first address point 1008a of a plurality of address points 1008. In another embodiment that may be combined with other embodiments described herein, emission 1210d following the half-point emission 1210h as a full-tone emission is a full-tone emission projected onto the full-tone exposure polygon 1002. In an embodiment that may be combined with other embodiments described herein, where the grayscale emission is the second emission and the full-tone emission is the first emission, emission 1210d following the half-point emission 1210h as a grayscale emission is a grayscale emission projected onto both the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004. Figure 12E As shown, when the substrate 120 is scanned by the image projection system 200, the full-tone emission 1210e, which is emitted multiple times after the half-point emission 1210h, is projected onto the full-tone exposure polygon 1002 and the grayscale exposure polygon 1004 to at least one second address point 1008b. Figure 12F As shown, the final emission 1210n, which is a full-tone emission in a series of emission events, is projected inside the full-tone exposure polygon 1002 to at least one final address point 1008n.
[0067] Through multiple emission events, multiple grayscale portions 604 have full-tone emission and grayscale emission address points among multiple address points 1008 exposed to a second intensity. Multiple full-tone portions 602 have full-tone emission and grayscale emission address points exposed to a combination of a second intensity and a first intensity. The time division of grayscale emission and full-tone emission in multiple emission events, as well as the ability to simulate emission at the first intensity and the second intensity, will allow the full-tone dose 606 for the multiple full-tone portions 602 and the grayscale dose 608 for the multiple grayscale portions 604 to vary across the entire photoresist 601.
[0068] In summary, a system, software application, and method are provided for a photolithography process that writes full-tone and grayscale portions in a single pass. The single pass provides greater throughput. The system's spatial light modulator provides simulated emissions of a second and first intensity from the light source in a single pass through temporal and spatial division between the first and second emissions in multiple emissions. The simulated emissions of the second hue and the first intensity allow for variation of the full-tone dose for each of the multiple full-tone portions and the grayscale dose for each of the multiple grayscale portions across the entire photoresist. Variations in the full-tone and grayscale doses across the entire photoresist can accommodate variations caused by: photoresist thickness, developer inhomogeneity during photoresist development, inhomogeneity during etch transfer processing, and any other processes before or after the photolithography process.
[0069] While the foregoing relates to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present invention, the scope of which is defined by the appended claims.
Claims
1. A photolithography system, comprising: A photolithography system having a processing unit having multiple image projection systems for receiving mask pattern data; each image projection system comprising a spatial light modulator having multiple spatial light modulator pixels for projecting multiple emissions; and A controller configured to provide the photolithography system with the mask pattern data, the mask pattern data having multiple full-tone exposure polygons and multiple gray-tone exposure polygons, wherein... The controller is configured to spatially divide the spatial light modulator pixels by at least one of the following: Gray tone group and full tone group, wherein the gray tone group and the full tone group have the same number of spatial light modulator pixels in columns; The grayscale group and the full-tone group, wherein the grayscale group and the full-tone group have different numbers of spatial light modulator pixels; and The grayscale group, the full-tone group, and the remaining groups, wherein the grayscale group and the full-tone group have the same number of spatial light modulator pixels in columns, and the remaining groups have the remaining number of pixels in columns, and When the partitioning is performed by the controller The grayscale group is operable to project a first number of the multiple emissions onto the full-tone exposure polygon and the grayscale exposure polygon; The full-tone group is operable to project a second number of the multiple emitting events onto the full-tone exposure polygon; and The remaining group is operable to project a third number of the multiple emission onto the full-tone exposure polygon.
2. The system of claim 1, wherein each of the plurality of spatial light modulator pixels of the spatial light modulator is independently controllable and configured to project a write beam corresponding to one of the plurality of pixels.
3. The system of claim 2, wherein the spatial optical modulator is an array of electrically addressable elements.
4. The system of claim 3, wherein the spatial light modulator pixel of at least one electrically addressed element is a mirror spatially divided by at least one of the grayscale group, the full-tone group, and the remaining groups.
5. The system according to claim 1, wherein: The gray tone group and the full tone group, which have the same number of spatial light modulator pixels, make the gray tone dose equal to half of the full tone dose; The grayscale group and the full-tone group of spatial light modulator pixels with different column numbers cause the grayscale dose to be greater than half of the full-tone dose; and The gray tone group of spatial light modulator pixels with the same number of columns, together with the full tone group and the remaining group of pixels with the remaining number of columns, make the gray tone dose greater than half of the full tone dose.
6. A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to perform the following steps: A mask pattern data having multiple exposure polygons is provided to a processing unit of a photolithography system. The processing unit has multiple image projection systems that receive the mask pattern data. The mask pattern data has multiple full-tone exposure polygons and multiple gray-tone exposure polygons. The spatial light modulator pixels of each of the image projection systems are divided into one of the following: Gray tone group and full tone group, wherein the gray tone group and the full tone group have the same number of spatial light modulator pixels in columns; The grayscale group and the full-tone group, wherein the grayscale group and the full-tone group have different numbers of spatial light modulator pixels; and The grayscale group, the full-tone group, and the remaining groups, wherein the grayscale group and the full-tone group have the same number of spatial light modulator pixels in columns, and the remaining groups have the remaining number of pixels in columns; and During a single scan of the substrate using the multiple image projection systems: Multiple emissions corresponding to a first number of grayscale groups are projected onto the full-tone exposure polygon and the grayscale exposure polygon; The multiple emissions, corresponding to a second number of the full-tone group, are projected onto the full-tone exposure polygon; and The multiple emission corresponding to the third number of the remaining groups is projected onto the full-tone exposure polygon.
7. The non-transitory computer-readable medium of claim 6, wherein the spatial light modulator pixel projects the multiple emissions onto a plurality of address points of a converged emission pattern.
8. The non-transitory computer-readable medium of claim 7, wherein the multiple emissions form a plurality of grayscale portions having grayscale emission address points exposed to the first number of the multiple emissions, and the multiple emissions form a plurality of full-tone portions having full-tone emission address points exposed to the first number and the second number of the multiple emissions, or having full-tone emission address points exposed to the first number, the second number and the third number of the multiple emissions.
9. The non-transitory computer-readable medium of claim 6, wherein the first number of the multiple emissions corresponds to a grayscale dose, and the combination of the first number and the second number of the multiple emissions corresponds to a full-tone dose.
10. The non-transitory computer-readable medium of claim 6, wherein the first number of multiple emissions corresponds to a grayscale dose, and the combination of the first number, the second number, and the third number of multiple emissions corresponds to a full-tone dose.
11. The non-transitory computer-readable medium of claim 6, wherein the light beam generated by the light source of each image projection system has intensity.
12. The non-transitory computer-readable medium of claim 11, wherein the intensity is 10 mJ / cm². 2 Up to 200 mJ / cm 2 .
13. A photolithography process, comprising the following steps: A mask pattern data having multiple exposure polygons is provided to a processing unit of a photolithography system. The processing unit has multiple image projection systems that receive the mask pattern data. The mask pattern data has multiple full-tone exposure polygons and multiple gray-tone exposure polygons. The spatial light modulator pixels of each of the image projection systems are divided into one of the following: Gray tone group and full tone group, wherein the gray tone group and the full tone group have the same number of spatial light modulator pixels in columns; The grayscale group and the full-tone group, wherein the grayscale group and the full-tone group have different numbers of spatial light modulator pixels; and The grayscale group, the full-tone group, and the remaining groups, wherein the grayscale group and the full-tone group have the same number of spatial light modulator pixels in columns, and the remaining groups have the remaining number of pixels in columns; and During a single scan of the substrate using the multiple image projection systems: Multiple emissions corresponding to a first number of grayscale groups are projected onto the full-tone exposure polygon and the grayscale exposure polygon; The multiple emissions, corresponding to a second number of the full-tone group, are projected onto the full-tone exposure polygon; and The multiple emission corresponding to the third number of the remaining groups is projected onto the full-tone exposure polygon.
14. The method of claim 13, wherein the spatial light modulator pixel projects the multiple emissions onto a plurality of address points of a converged emission pattern.
15. The method of claim 14, wherein the multiple emission forms a plurality of grayscale portions, the plurality of grayscale portions having grayscale emission address points exposed to the first number of the multiple emission, and the multiple emission forms a plurality of full-tone portions, the plurality of full-tone portions having full-tone emission address points exposed to the first number and the second number of the multiple emission, or having full-tone emission address points exposed to the first number, the second number and the third number of the multiple emission.
16. The method of claim 13, wherein the first number of the multiple emissions corresponds to a grayscale dose, and the combination of the first number and the second number of the multiple emissions corresponds to a full-tone dose.
17. The method of claim 13, wherein the first number of multiple emissions corresponds to a grayscale dose, and the combination of the first number, the second number, and the third number of multiple emissions corresponds to a full-tone dose.
18. The method of claim 13, wherein the light beam generated by the light source of each image projection system has intensity.
19. The method of claim 18, wherein the strength is 10 mJ / cm 2 Up to 200 mJ / cm 2 .
20. The method of claim 13, wherein the multiple launches are between 50 launches and 500 launches.
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