Wafer cleaning apparatus

Abstract

The present application relates to wafer processing technology field, concretely for a kind of wafer cleaning equipment, including installation platform, the installation platform is equipped with working cavity, the exhaust device is connected below the working cavity, the installation platform is rotatably installed for closing the cover plate of working cavity, the installation platform is located inside working cavity and is equipped with spraying device, drying device, fixing device.The present application is by being provided with scraper on installation platform, when cover plate closes, cover plate extrudes scraper, and water droplet on the surface of cover plate is cleaned by motor drive screw rod rotation driven scraper movement, and scraper is equipped with W-shaped scraper with two water tanks, so that the water cleaned by scraper can be entered into water tank, when scraper moves to the edge of working cavity, internal water flow can be discharged by drainage assembly, prevent because of condensation into large droplet water droplet on cover plate, under the influence of vibration or rotating air flow when cover plate opens, drop on wafer, cause wafer drying not completely produce water mark influence wafer quality problem.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, specifically to a wafer cleaning device. Background Technology

[0002] The chip is one of the most important raw materials for LEDs and also the core part of LEDs. The quality of the chip directly determines the performance of the LED. During the production process, the chip needs to be polished to ensure the flatness of the chip surface. Then, it undergoes multiple cleaning steps to remove various organic contaminants, particulate contaminants, and metal contaminants remaining after polishing.

[0003] Wafer cleaning is generally divided into methods such as ultrasonic cleaning, rotary brushing, and rotary spraying. Ultrasonic cleaning is usually used to remove oil stains from the wafer surface to prevent oil stains from encapsulating particulate and metal contaminants, thus preventing subsequent cleaning agents from contacting the contaminants. Rotary brushing is mainly used to remove particulate and metal contaminants with strong adhesion. Rotary spraying is a non-contact cleaning method used to clean particulate and metal contaminants adsorbed on the wafer surface. Therefore, rotary spraying is usually set as the last step in the cleaning process.

[0004] In the wafer polishing and cleaning process, the "dry in, dry out" principle must be followed. This means the wafer enters the equipment in a dry state for polishing and exits the equipment in a dry state after cleaning. Therefore, after rotary spraying, rotary drying is performed directly to achieve "dry out" of the wafer. During rotary cleaning and rotary drying, a cover plate must be used to prevent external impurities from entering. Cleaning is then performed, followed by drying. During cleaning and drying, the high-speed rotation of the wafer splashes water onto the cover plate, and the cover plate is in a high-temperature, high-humidity environment. Over time, large water droplets will condense on the cover plate surface. When the cover plate is opened to remove the wafer after drying, or during operation, the rotating airflow can cause these large water droplets to fall onto the wafer, resulting in incomplete drying and watermarks that affect wafer quality. (See "Reducing..."). The paper "Optimization Study of Contaminant Particles on 180nm Node Wafer Surface" mentioned that water droplets adhering to the cover plate covering the flywheel and wafer could fall onto the wafer surface when the cover plate was opened after spin drying due to improper opening and closing. The paper proposed a method to prevent water droplets from falling by regularly checking the lubrication of the cover plate piston and applying lubricant periodically to ensure smooth cover plate movement. However, large water droplets could still fall after they were formed. In some equipment that uses nitrogen drying, nitrogen is used to blow directly onto the cover plate to prevent the formation of large water droplets on the surface. When using gas to clean water droplets, the droplets would fall directly onto the wafer, affecting the wafer drying efficiency. The nitrogen used for wafer drying needs to be kept sufficiently clean, and this nitrogen requires multiple cleaning processes during production, which is expensive. Using nitrogen cleaning would increase the operating cost of the equipment.

[0005] Therefore, to prevent large water droplets from forming on the cover plate surface and falling onto the wafer surface when the cover plate is opened or affected by the internal rotating airflow, a wafer cleaning device is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer cleaning device. By setting a scraper inside the device and setting a driving component outside the working cavity of the device, the scraper is connected to the driving component by magnetic attraction. The scraper is driven by the driving component to move and clean the water accumulated on the device cover plate. The water tank on the scraper can catch the water after cleaning, thereby preventing the accumulation of water droplets from affecting product quality. Moreover, the driving component is electrically driven, resulting in lower equipment operating costs.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A wafer cleaning device includes a mounting platform with a working chamber. An exhaust device is connected below the working chamber. A cover plate for sealing the working chamber is rotatably mounted on the mounting platform, and a drive device for rotating the cover plate is provided on the mounting platform. Inside the working chamber, the mounting platform is equipped with a spraying device, a drying device, and a fixing device. The fixing device is used to fix the wafer. The spraying device can use megasonic nozzles or a contact-type megasonic spraying method. The drying device can use heated nitrogen gas for air drying or use heating tubes for drying. The fixing device is located at the center of the working cavity. The fixing device is a suction cup fixing device in the prior art. The suction cup is rotatably mounted on the mounting platform and is connected to a vacuum. The mounting platform is equipped with a power device for driving the fixing device to rotate. The power device is a servo motor. A flywheel is keyed to the output shaft of the servo motor, and the output shaft of the servo motor is keyed to the suction cup. The mounting platform is equipped with a cleaning device that regularly cleans water from the surface of the cover plate to prevent the formation of large water droplets on the surface of the cover plate. It can also store the cleaned water and drain the water from the side of the working cavity to prevent the cleaned water from falling onto the wafer.

[0008] Preferably, the cleaning device includes two lead screws symmetrically arranged on both sides of the mounting platform. A transmission assembly for synchronously rotating the two lead screws is connected to each lead screw. The transmission assembly can be a belt drive, chain drive, or synchronous belt drive. A drive motor is mounted on the mounting platform, and its output end is connected to the transmission assembly. Nut seats are helically connected to each lead screw, and a scraper is connected to both nut seats. The scraper has a raised section in the middle, and two water grooves are provided on both sides of the raised section, forming a W shape. The two water grooves are interconnected. A cleaning plate is provided above the raised section. When the cover is closed, the cleaning plate fits against the cover, and the two water grooves are interconnected. A drainage assembly is provided on the scraper to drain water accumulated inside the water grooves to the edge of the working chamber when the scraper moves to the side of the working chamber. A water removal assembly is provided on the side wall of the working chamber to prevent large water droplets from accumulating on the two sides of the scraper in the direction of movement.

[0009] During use, the high-speed rotation of the suction cup causes water droplets to splash onto the cover plate. Since the cover plate is in a high-temperature and high-humidity environment, water droplets easily form. During the drying process, these droplets fall onto the wafer, preventing proper drying and causing water seals on the wafer surface, resulting in substandard product quality. To address this, a scraper is installed on the mounting platform. When the cover plate closes, it presses against the scraper, ensuring the scraper adheres to the cover plate. Then, the motor starts, driving the lead screw to rotate, which in turn moves the scraper to clean the water droplets from the cover plate surface. To prevent the cleaned water droplets from falling directly onto the wafer and affecting normal equipment operation, the scraper is designed in a W shape with two interconnected water tanks. During use, the middle of the scraper adheres to the cover plate, allowing the water cleaned by the scraper to enter the water tanks. When the scraper moves to the edge of the working chamber, the internal water is drained through the drainage component, ensuring that cleaning the water droplets from the cover plate does not affect the normal operation of the equipment.

[0010] In this invention, a rotary scraper can also be used to clean the cover plate, and a servo motor can be installed on the cover plate. The scraper is connected to the output end of the servo motor. However, in this method, the scraper is always located above the wafer, and water is more likely to accumulate on the scraper surface and fall onto the wafer surface. Moreover, the water on the scraper surface is not easy to clean. Therefore, a lead screw linear transmission is used to move the scraper to the edge of the working cavity. The edge of the working cavity is more likely to be equipped with a water removal component to clean the water accumulated on the scraper.

[0011] Preferably, the mounting platform is provided with an isolation cavity, which is not connected to the working cavity. Both lead screws are located inside the isolation cavity, and the scraper is connected to the nut seat by magnetic attraction.

[0012] When using a lead screw drive, lubrication is required between the lead screw and the nut seat. During operation, the internal air needs to be kept clean to prevent wafer contamination. The evaporation of lubricating oil will undoubtedly contaminate the working chamber. Therefore, isolation chambers are set on both sides of the working chamber to separate the lead screw from the working chamber. The scraper and the nut seat are fixed by magnetic attraction, so that the movement of the lead screw can drive the scraper without contaminating the working chamber. The isolation plate between the scraper and the nut seat needs to have a small surface roughness and be non-magnetic to prevent the scraper from falling off. For this purpose, glass or an alloy with low surface roughness that cannot be attracted by magnets can be used.

[0013] Preferably, the cleaning plate is elastically connected to the scraper, and the top of the cleaning plate is tapered so that the cover plate and the cleaning plate make line contact.

[0014] When the cover plate is pressed down and contacts the cleaning pad, the movement of the scraper will cause the cleaning pad to clean the water accumulated on the cover plate. The cleaning pad can be made of flexible silicone or rubber. When the cover plate is closed, the cleaning pad is squeezed to keep it in contact with the cover plate. However, at this time, the contact between the cleaning pad and the cover plate is a surface contact. When cleaning with a surface contact, water is easily trapped under the contact surface, which makes it easy for water stains to overflow on the cover plate after the cleaning pad has cleaned once, thus negating the cleaning effect of the scraper. However, when the cleaning pad is made of a rigid material and is elastically connected to the scraper, the cleaning pad is squeezed and contracted when the cover plate is pressed down. The top of the cleaning pad is set as a cone. At this time, the contact between the cleaning pad and the cover plate is a line contact. Line contact does not trap water, so no water stains are left after cleaning, resulting in a better cleaning effect.

[0015] Preferably, the drainage assembly includes outlets located on both sides of the scraper and connected to two water tanks respectively. Each outlet is equipped with a spring-loaded one-way valve, and the spring force is parallel to the axis of the outlet. The mounting platform is bolted to both sides of the scraper's moving direction, and push rods for opening the spring-loaded one-way valves are bolted to the platform. When the push rods open the spring-loaded one-way valves, the water accumulated inside the water tanks is discharged along the outlets to the edge of the working chamber.

[0016] Preferably, the scraper is provided with a V-shaped water guide plate at the water outlet, the front end of the water guide plate is set as a pointed tip, the push rod is arc-shaped, when the scraper stops, the pointed part of the water guide plate contacts the push rod, the water accumulated inside the water tank is discharged from the water outlet and flows to the side wall of the working chamber under the guidance of the diversion pipe.

[0017] When using air drying, the water in the tank is directly discharged, which causes the water flow to be affected by the airflow, resulting in water scattering and affecting the operation of the equipment. Therefore, the water in the tank needs to be discharged at the edge of the working chamber. The drainage device is a spring one-way valve set at the outlet. When the scraper moves to the side of the working chamber, the push rod pushes the spring one-way valve to open, thereby draining water at the edge of the working chamber. This drainage method is simple, relying on the movement of the scraper to automatically drain water. A water guide plate is set at the outlet, and the front end of the water guide plate has a pointed tip. The pointed tip of the water guide plate can reduce the surface tension of the water and reduce the adsorption force between the water guide plate and the water, preventing water from sticking to the water guide plate and causing water droplets to fall when the scraper moves, affecting the operation of the equipment. The push rod is set in an arc shape. When the scraper moves to the maximum stroke, the push rod contacts the pointed part of the water guide plate, thereby playing a guiding role and further preventing water droplets from forming on the water guide plate.

[0018] Preferably, the drainage assembly includes a water outlet formed on the scraper and communicating with two water tanks, and a drain pipe is connected to the water outlet, the drain pipe being fitted against the side wall of the working chamber.

[0019] When using electric heating tubes for drying, only the airflow of the exhaust system exists inside. At this time, the airflow is relatively small, so water can be discharged directly. To prevent the water from spreading at the outlet due to surface tension and splashing under the action of airflow, a guide pipe is installed at the outlet. The guide pipe is attached to the side wall of the working chamber. The water is guided to the side wall of the working chamber through the guide pipe, thereby avoiding the problem of water spreading when it flows out and affecting the operation of the equipment.

[0020] Preferably, the water removal assembly includes water removal chambers provided on both sides of the working chamber sidewall in the direction of scraper movement, the water removal chambers are provided with sponges, the scraper enters the water removal chambers and fits against the sponges and squeezes the sponges, and the mounting platform is provided with a blocking assembly for sealing the water removal chambers.

[0021] Preferably, the blocking assembly includes a baffle that is rotatably mounted on the mounting platform and is located outside the water removal chamber. A counterweight is fixedly installed below the baffle to ensure that the center of gravity of the baffle is always below the baffle. The baffle is made of corrosion-resistant rubber.

[0022] To prevent water from splashing on the scraper and water vapor from condensing on the scraper surface, sponges are placed on both sides of the working chamber edge. When the scraper enters one side, one side of the scraper contacts the sponge, thereby removing moisture from the scraper surface. As the scraper moves, it squeezes the sponge, keeping the sponge relatively dry and preventing water droplets from forming on the side.

[0023] It should be noted that the scraper moves after the wafer has been rotating and drying for a period of time, at which time no water splashing will occur. After the scraper enters the working chamber, the blocking component can separate the dewatering chamber from the working chamber, so that splashing water cannot splash onto the scraper. Therefore, the dewatering component only needs to remove the water droplets condensed by water vapor. Since the water droplets condensed by water vapor need to accumulate for a long time, the scraper is made to contact the sponge back and forth on both sides to prevent water droplets from forming on the scraper surface.

[0024] Under normal conditions, the baffle remains vertical due to the counterweight, thus always blocking the dewatering chamber. When the scraper moves into the dewatering chamber, it pushes the baffle to rotate and flip. When the scraper is fully inside the dewatering chamber, the baffle rotates back to a vertical position under the action of the counterweight, blocking the dewatering chamber again and preventing water from splashing onto the scraper. This method has a simple structure, relies on the power of the scraper to close, and does not require an external power source, effectively reducing the manufacturing cost of the equipment.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The wafer cleaning equipment of the present invention uses a scraper with a cleaning blade on a mounting platform. A motor drives a lead screw to rotate, which moves the scraper to clean water droplets on the surface of a cover plate, preventing water droplets from forming on the cover plate surface. The scraper and nut seat are magnetically connected to isolate the lead screw and nut seat from the working chamber, preventing the lubricating oil on the lead screw from evaporating and contaminating the wafer. The scraper is designed as a W-shaped scraper with two water tanks, so that the water cleaned by the scraper enters the water tanks. When the scraper moves to the edge of the working chamber, the internal water can be discharged through the drainage component, preventing the cleaned water droplets from dripping onto the wafer and affecting the wafer drying. Compared with the prior art that uses gas to clean water droplets, this method ensures product quality without contaminating the gas inside the working chamber, and the power source is electricity, resulting in lower operating costs.

[0026] 2. The wafer cleaning equipment of the present invention includes a push rod at the edge of the working chamber and a spring check valve at the outlet. When the scraper moves to the side of the working chamber, the push rod pushes the spring check valve to open, thereby draining water at the edge of the working chamber. This drainage method relies on the movement of the scraper for automatic drainage, which is simple in structure and low in cost. A water guide plate is provided at the outlet, with a pointed tip at the front end. The push rod is arc-shaped. When the scraper moves to its maximum stroke, the push rod contacts the pointed tip of the water guide plate. The pointed tip of the water guide plate can reduce the surface tension of the water and reduce the adsorption force between the water guide plate and the water. The contact between the push rod and the pointed tip of the water guide plate can also play a guiding role, thereby preventing water from being adsorbed at the outlet due to the surface tension of the water and falling onto the wafer when the scraper moves, thus affecting the drying of the wafer.

[0027] 3. The wafer cleaning equipment of the present invention provides a dewatering chamber on the side wall of the working chamber. When the scraper moves into the dewatering chamber, a blocking component isolates the dewatering chamber from the working chamber, preventing water from splashing onto the scraper surface and falling off during scraper movement, thus affecting wafer drying. Furthermore, a sponge is provided inside the dewatering chamber. When the scraper enters the dewatering chamber, the sponge adheres to one side of the scraper. The back-and-forth movement of the scraper ensures that both sides of the scraper are in contact with the sponge. The sponge absorbs condensate on the scraper surface, preventing water droplets from forming on the scraper surface. The movement of the scraper also compresses the sponge, keeping it in an absorbent state, thereby ensuring that large water droplets do not fall from the scraper surface and affect wafer drying. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of the cover plate of the present invention when it is opened; Figure 2 This is a schematic diagram of the overall structure of the cover plate of the present invention when it is closed; Figure 3 For the present invention Figure 2 A partial sectional view from the side; Figure 4 For the present invention Figure 3 Enlarged view of a portion of point A in the middle; Figure 5 This is a schematic diagram of the structure of the scraper moving to the baffle of the present invention; Figure 6 This is a schematic diagram of the scraper structure of the present invention; Figure 7 For the present invention Figure 1 Enlarged view of a section at point B in the middle; Figure 8 This is a partial structural schematic diagram of Embodiment 2 of the present invention.

[0029] In the diagram: 1. Mounting platform; 2. Working chamber; 3. Cover plate; 4. Spraying device; 5. Fixing device; 6. Lead screw; 7. Drive motor; 8. Nut seat; 9. Scraper; 10. Water tank; 11. Isolation chamber; 12. Water outlet; 13. Spring check valve; 14. Push rod; 15. Drainage pipe; 16. Water guide plate; 17. Water removal chamber; 18. Sponge; 19. Baffle; 20. Counterweight; 21. Drying device; 22. Drive device; 23. Cleaning plate. Detailed Implementation

[0030] Example 1, as Figures 1 to 7 As shown, this embodiment is a cleaning device that uses nitrogen to dry wafers, as detailed below: A wafer cleaning device includes a mounting platform 1 with a working chamber 2. An exhaust device, which uses an air pump, is connected below the working chamber 2. Inside the working chamber 2, the mounting platform 1 is a spray device 4, a drying device 21, a fixing device 5, and a power unit. The spray device 4 uses mega-sound spraying, the drying device 21 uses nitrogen drying, the fixing device 5 is a vacuum suction cup, and the power unit is a servo motor. The output of the servo motor is connected to the vacuum suction cup to drive its rotation. The vacuum suction cup is used to adsorb and fix the wafer. The spray device 4 sprays deionized water to clean impurities from the wafer surface, and the drying device 21... Clean nitrogen gas is blown out. A cover plate 3 is rotatably mounted on top of the mounting platform 1. The mounting platform 1 is equipped with a drive device 22 for closing the cover plate 3. The drive device 22 is a cylinder, and the output end of the cylinder is rotatably connected to the cover plate 3. The mounting platform 1 is equipped with a cleaning device for cleaning water droplets on the surface of the cover plate 3. The cleaning device includes two lead screws 6 rotatably mounted on the mounting platform 1, and nut seats 8 are screw-driven on the lead screws 6. An isolation chamber 11 is set on the mounting platform 1, and the two lead screws 6 are located inside the isolation chamber 11. A transmission assembly is connected to the two lead screws 6. A drive motor 7 is bolted to the mounting platform 1. The transmission assembly adopts a worm gear drive. The mounting platform 1 has a rotating mounting shaft with two worm gears keyed to it. Two lead screws 6 are keyed to worm gears. The output of the drive motor 7 is connected to the rotating shaft. The two worm gears mesh with the two worm gears respectively. Two nut seats 8 are magnetically connected to scrapers 9. The scraper 9 has a raised section in the middle, and two water troughs 10 are provided on both sides of the raised section. The two water troughs 10 are interconnected. A cleaning plate 23 is elastically connected above the raised section. The top of the cleaning plate 23 is conical. When the cover plate 3 is closed, the cleaning plate 23 fits against the cover plate 3. The mounting platform 1 is equipped with a drainage assembly for draining water accumulated inside the water troughs 10 at the edge of the working chamber 2. The drainage component is an outlet 12 on the scraper 9. A spring check valve 13 is installed inside the outlet 12. A push rod 14 is installed on the side wall of the working chamber 2. The push rod 14 can push the spring check valve 13 to open. The push rod 14 is arc-shaped. A water guide plate 16 is connected to the scraper 9 at the outlet 12. The front end of the water guide plate 16 is pointed. When the scraper 9 stops, the pointed part of the water guide plate 16 contacts the push rod 14. Water removal chambers 17 are opened on both sides of the working chamber 2. A sponge 18 is installed inside the water removal chamber 17. A baffle 19 is rotatably installed on the mounting platform 1 outside the water removal chamber 17. A counterweight 20 is integrally connected below the baffle 19.

[0031] Before starting work, check whether the nitrogen pressure and vacuum level of the vacuum suction cup are normal. Once the pressure is normal, you can start working.

[0032] During operation, the scraper 9 is located inside the dewatering chamber 17. A robotic arm places the wafer onto the fixing device 5. Then, the drive device 22 activates to close the cover plate 3, and a vacuum suction cup connects to the vacuum, securing the wafer. The power device then drives the fixing device 5 to rotate. Subsequently, the spray device 4 starts, rinsing the wafer surface. After the set spray time, the spray device 4 stops, and then the drying device 21 starts to dry the wafer surface. Five seconds before the wafer drying is complete, the water on the wafer and fixing device 5 is mostly removed. Then, the drive motor 7 starts, driving the lead screw 6 to rotate via the transmission assembly, thereby moving the scraper 9. As the scraper 9 moves, the baffle 19 flips under the thrust of the scraper 9, opening the dewatering chamber 17. After the scraper 9 completely moves out of the dewatering chamber 17, it adheres to the cover plate 3, and the baffle 19 returns to a vertical position under the action of the counterweight 20. As the scraper 9 moves, the water on the cover plate 3 is also scraped off by the cleaning blade 23. This prevents large water droplets from forming on the cover plate 3. When the scraper 9 moves into another dewatering chamber 17, it pushes the baffle 19 of that chamber, causing it to flip. After the scraper 9 has fully entered the dewatering chamber 17, the baffle 19 returns to a vertical position under the action of the counterweight 20, blocking the chamber and preventing water from splashing onto the scraper 9 during the next rinse. Then, the scraper 9 comes into contact with the sponge 18, absorbing the moisture generated by condensation on its surface. The scraper 9 also compresses the sponge 18. The scraper 9 is kept in a water-absorbing state, and the push rod 14 pushes the spring check valve 13 to open, draining the water in the water tank 10. The push rod 14 contacts the tip of the water guide plate 16, draining the water adsorbed on the water guide plate 16. At this time, the water in the cover plate 3 can be cleaned. After the water is cleaned, the power device stops, the fixing device 5 disconnects from the vacuum, and the drive device 22 starts again to drive the cover plate 3 to open. At this time, the wafer can be taken out, and the cleaning of a single wafer is completed.

[0033] Example 2, as Figures 1 to 8 As shown, this embodiment is a cleaning device that uses a heater to dry wafers, as detailed below: In the second embodiment, the water outlet 12 is located below the scraper 9, and the water outlet 12 is connected to the drainage pipe 15, which is attached to the side wall of the working chamber 2.

[0034] When the scraper 9 moves, it will directly clean the water into the water tank 10. The water in the water tank 10 can be discharged directly through the water outlet 12. The drainage pipe 15 can prevent water from adhering to the water outlet 12 due to surface tension and splashing due to the exhaust airflow. This embodiment is simpler in structure than the first embodiment. However, when using nitrogen drying, due to the large internal airflow, direct drainage can easily cause water to splash. Therefore, the first embodiment is used when using gas drying. It should be noted that in the second embodiment, when the scraper 9 moves to the water removal chamber 17, the drainage pipe 15 needs to be in contact with the surface to prevent water from accumulating on the surface of the drainage pipe 15.

[0035] For any implementation methods not mentioned in Example 2, they are the same as in Example 1, and will not be described in detail here.

[0036] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning device, comprising a mounting platform (1), a working chamber (2) is provided on the mounting platform (1), an exhaust device is connected below the working chamber (2), a cover plate (3) for sealing the working chamber (2) is rotatably mounted on the mounting platform (1), and a driving device (22) for driving the cover plate (3) to rotate is provided on the mounting platform (1), a spraying device (4), a drying device (21) and a fixing device (5) are provided inside the working chamber (2) of the mounting platform (1), the fixing device (5) is used to fix the wafer, the fixing device (5) is located at the center of the working chamber (2), and a power device for driving the fixing device (5) to rotate is provided on the mounting platform (1); Its features are, The mounting platform (1) is equipped with a cleaning device on the side of the working chamber (2). The cleaning device includes a scraper (9) and a driving component. The scraper (9) is mounted on the mounting platform (1) and spans the working chamber (2). The middle part of the scraper (9) is a protrusion, and two water troughs (10) are provided on both sides of the protrusion on the scraper (9). The two water troughs (10) are interconnected and are used to store the water collected after cleaning. A cleaning plate (23) is provided above the protrusion. When the cover plate (3) is closed, the cleaning plate (23) is in contact with the cover plate (3). The driving component is mounted on the mounting platform (1) and is used to drive the scraper (9) to move. It also includes a drainage component and a water removal component. The system includes two outlets (12) on the scraper (9), both of which are connected to the water tank (10). The water in the water tank (10) is discharged through the two outlets (12) to the edge or side wall of the working chamber (2). The water removal assembly is used to prevent large water droplets from forming on the surface of the scraper (9). It includes two water removal chambers (17) on the side wall of the working chamber (2) located on both sides of the scraper (9) in the direction of movement. The two water removal chambers (17) are provided with sponges (18). When the scraper (9) enters the water removal chamber (17), one side of the scraper (9) is in contact with the sponge (18) and squeezes the sponge (18). The mounting platform (1) is provided with a blocking assembly for blocking the water removal chambers (17).

2. The wafer cleaning equipment according to claim 1, characterized in that: The driving component includes two lead screws (6) symmetrically arranged on both sides of the mounting platform (1). The two lead screws (6) are connected to a transmission assembly for synchronous rotation of the two lead screws (6). The mounting platform (1) is provided with a drive motor (7) for driving the transmission assembly. Nut seats (8) are helically connected to the lead screws (6). The scraper (9) is connected to the two nut seats (8). The mounting platform (1) is provided with an isolation cavity (11). The isolation cavity (11) is not connected to the working cavity (2). Both lead screws (6) are located inside the isolation cavity (11). The scraper (9) is connected to the nut seats (8) by magnetic attraction.

3. The wafer cleaning equipment according to claim 2, characterized in that: The cleaning plate (23) is elastically connected to the scraper (9), and the top of the cleaning plate (23) is set in a cone shape so that the cover plate (3) and the cleaning plate (23) make line contact.

4. The wafer cleaning equipment according to claim 2, characterized in that: The outlet (12) is equipped with a spring check valve (13), and the spring force is parallel to the axis of the outlet (12). The mounting platform (1) is provided with push rods (14) on both sides of the scraper (9) moving direction for opening the spring check valve (13). When the push rod (14) pushes the spring check valve (13) to open, the water inside the water tank (10) is discharged along the outlet (12) to the edge of the working chamber (2).

5. The wafer cleaning equipment according to claim 2, characterized in that: The drainage assembly includes an outlet (12) on the scraper (9) and connected to two water tanks (10). A drain pipe (15) is connected to the outlet (12). The drain pipe (15) is attached to the side wall of the working chamber (2). The outlet (12) is located below the scraper (9). Water accumulated inside the water tank (10) is discharged from the outlet (12) and flows to the side wall of the working chamber (2) under the drainage action of the drain pipe (15).

6. The wafer cleaning apparatus according to claim 4, characterized in that: The scraper (9) is provided with a V-shaped water guide plate (16) at the water outlet (12). The front end of the water guide plate (16) is set as a pointed tip. The push rod (14) is arc-shaped. When the scraper (9) stops, the pointed part of the water guide plate (16) contacts the push rod (14).

7. The wafer cleaning equipment according to claim 2, characterized in that: The blocking assembly includes a baffle (19) rotatably mounted on the mounting platform (1), and a counterweight (20) is fixedly installed below the baffle (19). The counterweight (20) is used to keep the center of gravity of the baffle (19) always below the baffle (19) so that the baffle (19) remains vertical and blocks the water removal chamber (17). The baffle (19) is made of corrosion-resistant rubber.

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