Chip pick-and-place bonding apparatus

Abstract

This invention relates to the field of semiconductor processing and manufacturing technology, and more particularly to a chip pick-up and bonding apparatus. The apparatus provided by this invention includes a support, a sleeve, a pick-up shaft, a ball bushing, and an adjusting structure. The sleeve is fixedly connected to the support. The pick-up shaft has a hollow structure for creating a vacuum environment to pick up chips. The ball bushing is fitted outside the pick-up shaft, and the pick-up shaft and ball bushing are relatively stationary. The sleeve is fitted outside the ball bushing, allowing the ball bushing to slide within the sleeve. The adjusting structure includes a pressing member that abuts against an annular protrusion on the pick-up shaft. By fitting a ball bushing outside the pick-up shaft, the gap between the pick-up shaft and the sleeve can be effectively reduced, preventing radial displacement of the pick-up shaft during movement. By pressing the annular protrusion with the adjusting structure, the axial gap of the pick-up shaft can be effectively reduced, preventing axial displacement of the pick-up shaft during movement, further improving the bonding accuracy of the apparatus.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing and manufacturing, and in particular to a chip pick-up and bonding apparatus. Background Technology

[0002] In semiconductor packaging equipment, chip bonding is a method of directly mounting and interconnecting chips to substrates. Typically, a pick-up device is used to quickly transfer the chip from the wafer to the processed substrate after visual adjustment. Therefore, the chip pick-up bonding device is the key component of chip bonding equipment. The bonding process requires control of the bonding force, the horizontal angle of the chip, and the position of the chip, which determines the accuracy, efficiency, and reliability of chip packaging.

[0003] Currently, the most common application of chip pick-up and bonding devices is that the front end of the device is driven by a drive device to move along the guide rail. This allows for adjustment of the pick-up and put-down force in the Z-axis direction. At the same time, the pick-up axis in the moving structure can adjust the chip angle through the synchronous belt, synchronous pulley and drive device. However, during high-speed movement, displacement may occur due to the large inertial force of the front moving structure and gaps in the guide rail or pick-up axis assembly process. After the displacement occurs, it will first directly affect the positional accuracy, and will also make the calibrated force control standard unable to match due to the displacement change in the Z-axis direction, thus affecting the control accuracy.

[0004] Therefore, there is an urgent need for a chip pick-up and bonding device to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a chip pick-up and bonding device that can reduce the radial and axial gaps of the pick-up shaft during assembly and improve bonding accuracy.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A chip pick-up and bonding apparatus, including a support, further comprising:

[0008] A sleeve, which is fixedly connected to the bracket;

[0009] The pickup shaft has a hollow structure for creating a vacuum environment to adsorb and pick up chips. The pickup shaft is disposed inside the sleeve and can slide within the sleeve. The pickup shaft has annular protrusions in its circumferential direction.

[0010] A ball bushing is sleeved outside the pickup shaft, the pickup shaft and the ball bushing are relatively stationary, and a sleeve is sleeved outside the ball bushing, the ball bushing can slide inside the sleeve;

[0011] An adjustment structure is provided, comprising a pressing member that contacts the top surface of the annular protrusion and is capable of pressing the annular protrusion.

[0012] As a preferred technical solution of the above-mentioned chip pick-up and bonding device, the adjustment structure includes a connecting block, an elastic element adjustment seat, and an elastic element. The connecting block is slidably disposed on the bracket, the pressing member is connected to the connecting block, the elastic element adjustment seat is fixedly disposed on the bracket, and the two ends of the elastic element are respectively connected to the top surface of the connecting block and the working surface of the elastic element adjustment seat.

[0013] As a preferred technical solution of the above-mentioned chip pickup and bonding device, the adjustment structure further includes an adjustment screw, one end of which passes through the elastic element adjustment seat and is connected to one end of the elastic element, and the adjustment screw is threadedly connected to the elastic element adjustment seat.

[0014] As a preferred embodiment of the aforementioned chip pick-up and bonding device, the adjustment structure further includes a guide structure for guiding the linear movement of the connecting block.

[0015] As a preferred technical solution of the above-mentioned chip pick-up and bonding device, the guide structure includes a guide rail and a slider. The guide rail is disposed on the side of the bracket, and the slider is fixedly disposed on the side of the connecting block. The guide rail and the slider are slidably connected.

[0016] Alternatively, the guide structure includes a guide post, which is vertically arranged and one end of the guide post passes through the connecting block.

[0017] As a preferred embodiment of the aforementioned chip pickup and bonding device, the top of the connecting block is provided with a mounting groove, and the other end of the elastic element is fixedly disposed in the mounting groove.

[0018] As a preferred technical solution of the above-mentioned chip pick-up and bonding device, the chip pick-up and bonding device further includes a first driving device and a displacement sensor. The first driving device is fixedly mounted on the bracket, and the first driving device is connected to the connecting block and can drive the connecting block to move. The displacement sensor is disposed on the side of the connecting block for detecting the vertical displacement of the connecting block.

[0019] As a preferred technical solution of the above-mentioned chip pick-up and bonding device, the chip pick-up and bonding device further includes a rotating structure, which is used to drive the pick-up shaft to rotate the ball bushing inside the sleeve.

[0020] As a preferred technical solution of the above-mentioned chip pickup and bonding device, an angle sensor is provided on one side of the pickup shaft, and an angle sensing plate is provided on the top of the pickup shaft. The angle sensor and the angle sensing plate cooperate to detect the rotation angle of the pickup shaft.

[0021] As a preferred technical solution of the above-mentioned chip pickup and bonding device, the angle sensing sheet has a threaded connecting rod, the threaded connecting rod has a hollow structure, the pickup shaft has an internal thread, and the threaded connecting rod is threadedly connected to the pickup shaft.

[0022] The beneficial effects of this invention are as follows: The chip pickup and bonding device provided by this invention includes a support, a sleeve, a pickup shaft, a ball bushing, and an adjustment structure. The sleeve is fixedly connected to the support. The pickup shaft has a hollow structure for creating a vacuum environment to pick up the chip. The pickup shaft is located inside the sleeve and can slide within the sleeve. An annular protrusion is provided circumferentially at the lower part of the pickup shaft. The ball bushing is sleeved outside the pickup shaft. The pickup shaft and the ball bushing are relatively stationary. The sleeve is sleeved outside the ball bushing, and the ball bushing can slide within the sleeve. The adjustment structure includes a pressing member that contacts the top surface of the annular protrusion and can press the annular protrusion. By sleeved with a ball bushing outside the pickup shaft, the gap between the pickup shaft and the sleeve can be effectively reduced, preventing radial displacement of the pickup shaft during movement. By pressing the annular protrusion with the adjustment structure, the axial gap of the pickup shaft can be effectively reduced, preventing axial displacement of the pickup shaft during movement, and further improving the bonding accuracy of the device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0024] Figure 1 This is a front view of the chip pickup and bonding apparatus provided in an embodiment of the present invention;

[0025] Figure 2 for Figure 1 A cross-sectional view along the AA direction;

[0026] Figure 3 This is a top view of the chip pickup and bonding apparatus provided in an embodiment of the present invention.

[0027] In the picture:

[0028] 1. Bracket; 2. First drive unit; 3. Pneumatic counterweight; 4. Second drive unit; 5. Mounting base; 6. Synchronous belt; 7. Drive pulley; 8. Connecting block; 9. Pressing component; 10. Elastic component; 11. Adjusting screw; 12. Pick-up shaft; 13. Driven pulley; 14. Angle sensor; 15. Guide rail; 16. Ball bushing; 17. Locking nut; 18. Displacement sensor; 19. Annular protrusion; 20. Sleeve; 21. Elastic component adjusting seat; 22. Angle sensing plate; 23. Flange bearing; 24. Mounting groove. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0030] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0033] like Figures 1 to 3As shown, the present invention provides a chip pick-up and bonding device for picking up and bonding chips during semiconductor processing.

[0034] The device includes a bracket 1, a sleeve 20, a pickup shaft 12, a ball bushing 16, and an adjustment mechanism. See details below. Figure 1 and Figure 2 The sleeve 20 is fixedly connected to one end of the bracket 1 and is vertically arranged. The pickup shaft 12 has a hollow structure for creating a vacuum environment to adsorb and pick up the chip. The pickup shaft 12 is located inside the sleeve 20 and can slide within the sleeve 20. A ball bushing 16 is sleeved on the outside of the pickup shaft 12, and the outer wall of the pickup shaft 12 is in close contact with the inner wall of the ball bushing 16 to prevent relative displacement between the two. The sleeve 20 is sleeved on the outside of the ball bushing 16, and the outer wall of the ball bushing 16 contacts the inner wall of the sleeve 20, allowing the ball bushing 16 to slide within the sleeve 20. By setting the ball bushing 16 between the pickup shaft 12 and the sleeve 20, the gap between the pickup shaft 12 and the sleeve 20 is reduced. Thus, during high-speed movement of the device, the pickup shaft 12 will not experience radial displacement, improving positional accuracy. The pickup shaft 12 is provided with an annular protrusion 19 in its circumferential direction. The adjustment structure includes a pressing member 9, which contacts the top surface of the annular protrusion 19 and can press the annular protrusion. By pressing the pickup shaft 12 with the annular protrusion 19, the axial clearance of the pickup shaft 12 can be reduced, preventing the pickup shaft 12 from shifting axially during high-speed movement, thereby affecting the control accuracy.

[0035] like Figure 3 As shown, the adjustment structure includes a connecting block 8, an elastic element adjustment seat 21, and an elastic element 10. The connecting block 8 is slidably disposed on one side of the bracket 1. A pressing member 9 is connected to the lower side of the connecting block 8. The elastic element adjustment seat 21 is fixedly disposed on the upper part of the bracket 1 by bolts. The pressing member 9 can roll and contacts the top surface of the annular protrusion 19, pressing down on the annular protrusion 19 without affecting the rotation of the pickup shaft 12. The elastic element 10 is located between the connecting block 8 and the elastic element adjustment seat 21. One end of the elastic element 10 is connected to the top surface of the connecting block 8, and the other end of the elastic element 10 is connected to the working surface of the elastic element adjustment seat 21. Since the position of the elastic element adjustment seat 21 remains unchanged, the elastic element 10 always exerts a downward pressing force on the connecting block 8, causing the connecting block 8 to move downward. The pressing element 9 is located below the side of the connecting block 8, causing the pressing element 9 to move downward until it contacts the top surface of the annular protrusion 19 and presses down on the annular protrusion 19, that is, presses down on the pickup shaft 12.

[0036] For example, the lower pressure member 9 is a bearing that can rotate relative to the annular protrusion 19, and will not affect the rotation of the pickup shaft 12, especially when the pickup shaft 12 rotates.

[0037] Furthermore, in order to better adjust the compression length of the elastic element 10, the adjustment structure also includes an adjusting screw 11. One end of the adjusting screw 11 passes through the elastic element adjusting seat 21 and is connected to the upper end of the elastic element 10. The adjusting screw 11 and the elastic element adjusting seat 21 are connected by threads. The elastic element 10 can be compressed by rotating the adjusting screw 11, thereby increasing the downward pressure.

[0038] Furthermore, to ensure the smooth downward movement of the connecting block 8, the adjustment structure also includes a guide structure for guiding the connecting block 8 in linear motion. Specifically, the guide structure includes a guide rail 15 and a slider. The guide rail 15 is disposed on the side of the bracket 1, and the slider is fixedly disposed on the side of the connecting block 8, with the slider slidably connected to the guide rail 15. For example, the guide rail 15 can be fixed to the bracket 1 by bolts, and the slider can be fixedly disposed on the side of the connecting block 8 by bolts.

[0039] Of course, in some other embodiments, the guide structure includes a guide post, which is vertically arranged and one end of the guide post passes through the connecting block 8. In this way, the connecting block 8 can move stably along the guide post without shaking.

[0040] Furthermore, in order to prevent the elastic element 10 from falling off, a mounting groove 24 is provided on the top of the connecting block 8, so that the other end of the elastic element 10 is fixedly installed in the mounting groove 24.

[0041] Furthermore, in order to achieve the purpose of pressing the chip by the chip pick-up bonding device, when the chip pick-up bonding device comes into contact with the product, the elastic force of the elastic element 10 alone is not enough to meet the force control requirements. At this time, the first driving device 2 installed on the bracket 1 drives the connecting block 8 to move downward along the guide rail 15 through the slider, and applies a downward force to the pick-up shaft 12 through the pressing element 9 to achieve pressing the chip. Then, the displacement sensor 18 detects the vertical displacement of the connecting block 8, thereby controlling the magnitude of the pressing force.

[0042] Furthermore, in this embodiment, a pneumatic counterweight 3 is also fixedly installed on the bracket 1. The pneumatic counterweight 3 is connected to the connecting block 8 through a connecting rod. One end of the connecting rod is connected to the bottom surface of the pneumatic counterweight 3, and the other end of the connecting rod is connected to the top surface of the connecting block 8. The pneumatic counterweight 3 applies a downward force to the connecting block 8, assisting the first driving device 2 in driving the connecting block 8, thereby realizing the pressing of the chip by the pickup shaft 12.

[0043] For example, the first driving device 2 is a voice coil motor, which can precisely control the downward displacement of the connecting block 8, thereby precisely controlling the pressing force of the device on the chip.

[0044] Furthermore, such as Figure 1As shown, to control the rotation angle of the chip pick-up bonding device, the device also includes a rotating structure. This rotating structure drives the pick-up shaft 12 to rotate the ball bushing 16 within the sleeve 20. Since the pick-up shaft 12 and the ball bushing 16 are tightly connected, the pick-up shaft 12 drives the ball bushing 16 to rotate synchronously. At the same time, the ball bushing 16 and the sleeve 20 are connected by balls, and the sleeve 20 does not affect the rotation of the ball bushing 16. Therefore, the pick-up shaft 12 and the ball bushing 16 rotate as a whole within the sleeve 20.

[0045] Furthermore, in this embodiment, the rotating structure includes a second driving device 4, a driven wheel 13, a driving wheel 7, and a timing belt 6. The side of the bracket 1 has a mounting bracket 5. The second driving device 4 is fixedly mounted on the mounting base 5. The second driving device 4 drives the driving wheel 7 to move. The driven wheel 13 is fixedly sleeved on the pickup shaft 12 and located below the annular protrusion 19. The driven wheel 13 can follow the pickup shaft 12 to move in the Z direction. The driving wheel 7 and the driven wheel 13 are connected by a timing belt 6. Since the displacement of the pickup shaft 12 in the Z direction is very small, and the driven wheel 13 itself has a limiting function, the timing belt 6 will not fall off when the pickup shaft 12 moves in the Z direction.

[0046] Furthermore, an angle sensor 14 is provided on one side of the pickup shaft 12, and an angle sensing plate 22 is provided on the top of the pickup shaft 12. The angle sensor 14 and the angle sensing plate 22 cooperate to detect the rotation angle of the pickup shaft 12. Specifically, during operation, the device can detect the required rotation angle of the pickup shaft 12 through the cooperation of the angle sensor 14 and the angle sensing plate 22. Then, the output shaft of the second drive device 4 drives the drive wheel 7 to move. The drive wheel 7 is driven by the synchronous belt 6, which drives the driven wheel 13 sleeved on the pickup shaft 12 to move. This can accurately control the bonding angle of the chip and improve the bonding accuracy.

[0047] For example, the second driving device 4 is a stepper motor. The stepper motor can precisely control the rotation angle of the pickup axis 12, thereby precisely controlling the bonding angle of the device on the chip and realizing precise bonding of the chip.

[0048] Furthermore, such as Figure 1 and Figure 2As shown, the angle sensing plate 22 has a threaded connecting rod, and an air pipe connector is installed on the top of the angle sensing plate 22. The air pipe connector is connected to the vacuum generator through an air pipe. Both the threaded connecting rod and the pickup shaft 12 are hollow structures, which work together with the vacuum generator to create a vacuum environment. The pickup shaft 12 has an internal thread, and the threaded connecting rod is threadedly connected to the pickup shaft 12. A locking nut 17 is provided between the angle sensing plate 22 and the pickup shaft 12. The locking nut 17 is threadedly connected to the threaded connecting rod on the angle sensing plate 22. The specific installation sequence is as follows: first, install the locking nut 17 on the angle sensing plate 22, and then install the angle sensing plate 22 on the pickup shaft 12. The locking nut 17 is located at the bottom of the angle sensing plate 22, which can securely install the angle sensing plate 22 and control the height of the angle sensing plate 22 to prevent it from loosening. A flange bearing 23 is fixedly installed on the bracket 1. The flange bearing 23 is coaxially arranged with the sleeve 20, and part of the flange bearing 23 extends into the sleeve 20. The pickup shaft 12 passes through the flange bearing 23 and can slide along the inner surface of the flange bearing 23. The bottom of the locking nut 17 contacts the flange bearing 23, and the flange bearing 23 supports the locking nut 17. In this way, the locking nut 17 can prevent the pickup shaft 12 from moving downward, and the flange bearing 23 can ensure that the rotation of the pickup shaft 12 is not affected.

[0049] Furthermore, such as Figure 2 and Figure 3 As shown, the connecting block 8, pickup shaft 12, driven wheel 13, guide rail 15 and locking nut 17 are all made of aluminum, which reduces the overall weight of the chip pickup and bonding device. The current weight of the chip pickup and bonding device is 1 / 3 of the weight of the chip pickup and bonding device in the prior art. Due to the reduction in weight, the displacement caused by the inertial force on the movable structure of the chip pickup and bonding device during high-speed movement is also reduced.

[0050] The chip pickup and bonding device provided by this invention can be directly mounted on a moving mechanism, which enables the vertical and horizontal movement of the entire device. First, the moving mechanism moves the entire device downwards. Since the threaded connecting rods of the pickup shaft 12 and the angle sensing plate 22 are both hollow structures, the moving mechanism stops moving when the vacuum nozzle at the bottom of the pickup shaft 12 contacts the chip. The vacuum generator then adsorbs the chip, completing the chip pickup operation. Next, the moving mechanism moves the entire device upwards and horizontally to the position where the chip needs to be installed. Finally, the moving mechanism moves the entire device downwards, simultaneously adjusting the chip's angle. Based on the required rotation angle of the chip, the second drive device 4 is activated. The output shaft of the second drive device 4 drives the driving wheel 7, which in turn drives the driven wheel 13 via a synchronous belt 6. The driven wheel 13 is fixedly connected to the pickup shaft 12, causing the pickup shaft 12 to rotate. An angle sensing plate 22 is installed at the top of the pickup shaft 12, and an angle sensor 14 detects the angle. The rotation angle of the sensing element 22 is adjusted. When the pickup shaft 12 rotates to a suitable angle, the second drive device 4 stops working. Since the pickup shaft 12 is always under the action of the elastic element 10, the pickup shaft 12 moves downward by a certain displacement until the locking nut 17 abuts against the flange bearing 23. When the chip contacts the product, the moving mechanism continues to press down. At this time, the pickup shaft 12 is moved upward by the reaction force of the product until the nut above the annular protrusion 19 abuts against the sleeve 20. Since the displacement is very small, the synchronous belt 6 will not fall off. Then, the first drive device 2 installed on the bracket 1 drives the connecting block 8 to move downward along the guide rail 15 through the slider. The pressing element 9 applies a downward force to the pickup shaft 12. The magnitude of the force is determined by the displacement sensor 18 to meet the force control requirements, complete the chip bonding work, the vacuum adsorption stops, the first drive device 2 stops working, and the moving mechanism moves upward. In addition, if the force control requirements cannot be met by the first drive device 2 alone, the pneumatic counterweight 3 can be used to apply a downward force to the connecting block 8 to assist the first drive device 2 in pressing the chip with the pick-up shaft 12, thus meeting the force control requirements and completing the chip bonding process.

[0051] Furthermore, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A chip pick-up and bonding device, comprising a support (1), characterized in that: The chip pick-up and bonding device further includes: Sleeve (20), the sleeve (20) is fixedly connected to the bracket (1); Pick-up shaft (12), the pick-up shaft (12) is a hollow structure, used to create a vacuum environment to adsorb and pick up chips, the pick-up shaft (12) is disposed inside the sleeve (20), the pick-up shaft (12) can slide inside the sleeve (20), and the pick-up shaft (12) is provided with annular protrusions (19) in the circumferential direction; A ball bushing (16) is sleeved on the outside of the pickup shaft (12). The pickup shaft (12) and the ball bushing (16) are relatively stationary. A sleeve (20) is sleeved on the outside of the ball bushing (16). The ball bushing (16) can slide inside the sleeve (20). An adjustment structure is provided, comprising a pressing member (9) that contacts the top surface of the annular protrusion (19) and is capable of pressing the annular protrusion (19).

2. The chip pickup and bonding apparatus according to claim 1, characterized in that: The adjustment structure further includes a connecting block (8), an elastic element adjustment seat (21), and an elastic element (10). The connecting block (8) is slidably disposed on the bracket (1). The pressing member (9) is connected to the connecting block (8). The elastic element adjustment seat (21) is fixedly disposed on the bracket (1). The two ends of the elastic element (10) are respectively connected to the top surface of the connecting block (8) and the working surface of the elastic element adjustment seat (21).

3. The chip pickup and bonding apparatus according to claim 2, characterized in that: The adjustment structure also includes an adjustment screw (11), one end of which passes through the elastic element adjustment seat (21) and is connected to one end of the elastic element (10). The adjustment screw (11) is threadedly connected to the elastic element adjustment seat (21).

4. The chip pickup and bonding apparatus according to claim 2, characterized in that: The adjustment structure also includes a guide structure for guiding the linear movement of the connecting block (8).

5. The chip pickup and bonding apparatus according to claim 4, characterized in that: The guide structure includes a guide rail (15) and a slider. The guide rail (15) is disposed on the side of the bracket (1), and the slider is fixedly disposed on the side of the connecting block (8). The guide rail (15) and the slider are slidably connected. Alternatively, the guide structure may include a guide post, which is vertically arranged and one end of the guide post passes through the connecting block (8).

6. The chip pickup and bonding apparatus according to claim 2, characterized in that: The top of the connecting block (8) is provided with a mounting groove (24), and the other end of the elastic element (10) is fixedly disposed in the mounting groove (24).

7. The chip pickup and bonding apparatus according to claim 2, characterized in that: The chip pick-up and bonding device further includes a first driving device (2) and a displacement sensor (18). The first driving device (2) is fixedly mounted on the bracket (1). The first driving device (2) is connected to the connecting block (8) and can drive the connecting block (8) to move. The displacement sensor (18) is disposed on the side of the connecting block (8) to detect the vertical displacement of the connecting block (8).

8. The chip pickup and bonding apparatus according to any one of claims 1-7, characterized in that: The chip pickup and bonding device also includes a rotating structure, which drives the pickup shaft (12) to rotate the ball bushing (16) within the sleeve (20).

9. The chip pickup and bonding apparatus according to claim 8, characterized in that: An angle sensor (14) is provided on one side of the pickup shaft (12), and an angle sensing plate (22) is provided on the top of the pickup shaft (12). The angle sensor (14) and the angle sensing plate (22) cooperate to detect the rotation angle of the pickup shaft (12).

10. The chip pickup and bonding apparatus according to claim 9, characterized in that: The angle sensing plate (22) has a threaded connecting rod, which is a hollow structure. The pickup shaft (12) has an internal thread, and the threaded connecting rod is threadedly connected to the pickup shaft (12).

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