Power module assembly, motor controller, and vehicle

Abstract

The application discloses a power module assembly, a motor controller and a vehicle, and relates to the technical field of power module assemblies. The power module assembly comprises a chip layer, a first heat dissipation part and a second heat dissipation part, wherein the chip layer comprises a substrate and a chip arranged on the substrate; the chip layer is arranged between the first heat dissipation part and the second heat dissipation part; one side of the first heat dissipation part, which is away from the chip layer, is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer; and the second heat dissipation part is provided with a phase change medium and absorbs heat of the chip layer through phase change. The power module assembly designed according to the application adopts a one-side water cooling mode and a one-side phase change material heat absorption mode to dissipate heat of the chip, and the power module assembly has rapid cooling and obvious cooling effect.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a power module assembly, a motor controller, and a vehicle. Background Technology

[0002] In related technologies, vehicles are equipped with power processing modules. These modules contain chips, and to prevent chip overheating and failure, they are equipped with cooling structures. Existing technologies employ double-sided water cooling for the power module components. This requires both sides of the module to be sealed to the water channels, placing high demands on mechanical structure and precision control. Furthermore, since double-sided water cooling relies on water cooling as its foundation, and given a fixed water pump in the vehicle, the water flow rate and resistance are limited, resulting in limited improvement in cooling effect for the power module components. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a power module assembly. The power module assembly designed according to this invention employs a water-cooling method on one side and a phase change material heat absorption method on the other side for chip heat dissipation, resulting in rapid and significant cooling.

[0004] The present invention also proposes a motor controller having the above-mentioned power module components.

[0005] The present invention also proposes a vehicle having the above-mentioned motor controller.

[0006] The power module assembly according to the present invention includes: a chip layer, the chip layer including a substrate and a chip disposed on the substrate; a first heat dissipation part and a second heat dissipation part, the chip layer being disposed between the first heat dissipation part and the second heat dissipation part; wherein the side of the first heat dissipation part away from the chip layer is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer, and the second heat dissipation part is provided with a phase change medium and absorbs the heat of the chip layer through a phase change.

[0007] In the power module assembly involved in this invention, the chip layer is disposed between the first heat dissipation part and the second heat dissipation part. By integrating the first heat dissipation part and the second heat dissipation part, the chip layer can be cooled. One side of the chip layer is cooled by heat exchange from the first heat dissipation part, and the other side is cooled by heat absorption from the second heat dissipation part. The cooling is rapid and the cooling effect is obvious, which can solve the problem of the chip temperature of the power module assembly rising too fast and too high.

[0008] According to some embodiments of the present invention, the power module assembly further includes: a support member disposed between the first heat dissipation portion and the second heat dissipation portion, the support member having a conductive surface that conforms to the surface of the chip and transfers the heat generated by the chip to the first heat dissipation portion and / or the second heat dissipation portion.

[0009] According to some embodiments of the present invention, the support member is disposed between the first heat dissipation part and the chip layer and / or the second heat dissipation part and the chip layer.

[0010] According to some embodiments of the present invention, the second heat dissipation part includes: a phase change housing, wherein a phase change material receiving cavity for receiving phase change material is formed in the phase change housing, and the phase change housing is in direct and / or indirect contact with the support member.

[0011] According to some embodiments of the present invention, the second heat dissipation part includes a heat-conducting part, which is disposed on the inner wall of the phase change material receiving cavity and protrudes toward the interior of the phase change material receiving cavity.

[0012] According to some embodiments of the present invention, the heat-conducting portion is configured as a plurality of heat-conducting pins extending from the phase change material receiving cavity near the chip layer to away from the chip layer.

[0013] According to some embodiments of the present invention, the heat-conducting part is configured as a heat-conducting plate formed inside the phase change material receiving cavity, the heat-conducting plates being disposed inside the phase change material receiving cavity and spaced apart from each other to form heat dissipation channels.

[0014] According to some embodiments of the present invention, the heat-conducting plate extends in the thickness direction from the side of the phase change material receiving cavity near the chip layer to the side away from the chip layer, and the heat-conducting plate is configured in the length direction as a zigzag or curved and / or wavy shape.

[0015] According to some embodiments of the present invention, the support member is constructed as a conductive member, and a first insulating layer is provided between the second heat dissipation part and the support member and / or a second insulating layer is provided between the chip layer and the first heat dissipation part.

[0016] According to some embodiments of the present invention, both the first insulating layer and the second insulating layer include: a thermally conductive insulating layer, the thermally conductive insulating layer being constructed as a thermally conductive ceramic; and a thermally conductive metal layer disposed on both sides of the thermally conductive insulating layer in the thickness direction.

[0017] According to some embodiments of the present invention, the support member includes: a body portion having a heat-conducting surface disposed thereon, the heat-conducting surface abutting against the first insulating layer or the second insulating layer; a chip heat transfer portion disposed on the body portion and extending toward the chip, the free end of the chip heat transfer portion forming a conductive surface in contact with the chip surface; and a support foot disposed on the body portion and extending toward the substrate, the free end of the support foot forming a support surface in contact with the substrate surface.

[0018] According to some embodiments of the present invention, a wire harness channel is formed between the chip heat transfer section and the support foot at an interval.

[0019] According to some embodiments of the present invention, the first heat dissipation part includes: a heat dissipation base plate, which exchanges heat with the chip layer; and heat dissipation fins, which are disposed on the heat dissipation base plate and extend in a direction away from the chip layer, and are adapted to contact with an external heat dissipation medium for heat exchange.

[0020] According to some embodiments of the present invention, the power module assembly further includes: a heat dissipation channel, the heat dissipation channel being fitted to the heat dissipation base plate and having a medium channel inside suitable for the flow of heat dissipation medium, the heat dissipation fins being housed within the medium channel.

[0021] According to some embodiments of the present invention, the power module assembly further includes: a molding compound layer covering at least a portion of the outer periphery of the first heat dissipation portion, the chip layer and the second heat dissipation portion, wherein the heat dissipation fins protrude from the molding compound layer.

[0022] According to some embodiments of the present invention, a heat dissipation port is provided on the encapsulation layer, and the heat dissipation port is directly opposite the phase change housing of the second heat dissipation part.

[0023] According to some embodiments of the present invention, the phase change medium is constructed as a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material.

[0024] The motor controller according to another embodiment of the present invention is briefly described below.

[0025] The motor controller according to the present invention includes the power module component described in any of the above embodiments. Since the motor controller according to the present invention is provided with the power module component described in the above embodiments, the motor controller integrates water cooling on one side and heat absorption by phase change material on the other side to cool down, resulting in rapid cooling and significant cooling effect.

[0026] The vehicle according to another embodiment of the present invention is briefly described below.

[0027] The vehicle according to the present invention includes the motor controller described in the above embodiments. Since the vehicle according to the present invention is equipped with the motor controller described in the above embodiments, the vehicle can solve the problem of excessively rapid and excessive chip temperature rise, and the vehicle has good safety in use.

[0028] In summary, the power module assembly of this invention employs a water-cooling method on one side and a phase change material heat absorption method on the other side for chip heat dissipation, achieving efficient heat dissipation on both sides. This improves the module's current carrying capacity, reduces the flow rate and power requirements of the water pump, further lowers costs, and achieves efficient heat dissipation on both sides of the power module assembly, resulting in rapid and significant cooling and improved module current carrying capacity. The single-sided water-cooled sealing reduces the requirements for water channel sealing, expands the application scenarios of the power module assembly, and reduces the actual use difficulty and cost of the power module assembly, making it suitable for mass production. The use of a first insulating layer and a second insulating layer achieves heat dissipation and insulation for the chip, ensuring the safety of the power module assembly in use. At the same time, it can expand the selection range of phase change materials and improve the thermal conductivity of the phase change materials.

[0029] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0031] Figure 1 This is a front view of a power module assembly according to an embodiment of the present invention.

[0032] Figure 2 This is a top view of a power module assembly according to an embodiment of the present invention.

[0033] Figure 3 This is an internal structural diagram of a power module assembly according to an embodiment of the present invention.

[0034] Figure 4 This is a structural diagram of the second heat dissipation unit according to an embodiment of the present invention.

[0035] Figure 5 This is a structural diagram of the second heat dissipation unit according to another embodiment of the present invention.

[0036] Figure 6 This is a structural diagram of the second heat dissipation unit according to yet another embodiment of the present invention.

[0037] Figure 7 This is a chip layer structure diagram according to an embodiment of the present invention.

[0038] Figure 8 This is a structural diagram of the chip layer and the support component after welding according to an embodiment of the present invention.

[0039] Figure 9 This is a structural diagram of the chip layer after it is welded to the first insulating component and the second insulating component according to an embodiment of the present invention.

[0040] Figure 10 This is a structural diagram of the first heat dissipation part after welding according to an embodiment of the present invention.

[0041] Figure 11 This is a structural diagram of the second heat dissipation part after welding according to an embodiment of the present invention.

[0042] Figure 12 This is an injection molding diagram of a power module assembly according to an embodiment of the present invention.

[0043] Figure 13 This is a schematic diagram of the waterway of a power module assembly according to an embodiment of the present invention.

[0044] Figure 14 This is a schematic diagram of the internal structure of a power module assembly according to an embodiment of the present invention.

[0045] Figure label:

[0046] Power module assembly 1; First high-voltage terminal 100; Solder layer 151; Support surface 152; Thermally conductive surface 153; Conductive surface 154; Wiring harness channel 155; Heat dissipation base plate solder layer 156; Molding layer 200; High-voltage output terminal 300; Second heat dissipation part 350; Phase change housing 351; Phase change material 352; Thermal conductive pin 353; Phase change material receiving cavity 354; Thermal conductive plate 355; Support member 360; Second high-voltage terminal 400; Chip 450; Third high-voltage terminal 500; Heat dissipation port 600; Upper metal layer 601; Ceramic substrate 602; Lower metal layer 603; Low-voltage terminal 700; Heat dissipation fins 800; Heat dissipation base plate 801; Medium channel 900; Heat dissipation water channel 901. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0051] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0052] In related technologies, vehicles are equipped with power processing modules. These modules contain chips, and to prevent chip overheating and failure, they are equipped with cooling structures. Existing technologies employ double-sided water cooling for the power module components. This requires both sides of the module to be sealed to the water channels, placing high demands on mechanical structure and precision control. Furthermore, since double-sided water cooling relies on water cooling as its foundation, and given a fixed water pump in the vehicle, the water flow rate and resistance are limited, resulting in limited improvement in cooling effect for the power module components.

[0053] The following is for reference. Figures 1-14 A power module component 1 according to an embodiment of the present invention is described.

[0054] like Figure 3As shown, the power module assembly 1 according to the present invention includes: a chip layer, a first heat dissipation section, and a second heat dissipation section 350. The chip layer includes a substrate and a chip 450 disposed on the substrate; the chip layer is disposed between the first heat dissipation section and the second heat dissipation section 350; wherein the side of the first heat dissipation section away from the chip layer is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer, and the second heat dissipation section 350 is provided with a phase change medium and absorbs the heat of the chip layer through phase change. Specifically, the chip 450 of the chip layer rapidly generates a large amount of heat when a large current passes through the power module assembly 1. The chip layer is located between the first heat dissipation section and the second heat dissipation section 350. The first heat dissipation section reduces the temperature of the chip layer by exchanging heat with an external heat dissipation medium, and the second heat dissipation section 350 absorbs the heat of the chip layer through the phase change of the phase change medium to reduce the temperature of the chip layer. The first heat dissipation section and the second heat dissipation section 350 work together to achieve cooling of the chip layer, thereby preventing the power module assembly 1 from malfunctioning due to high temperature.

[0055] In the power module assembly 1 involved in this invention, the chip layer is disposed between the first heat dissipation part and the second heat dissipation part 350. By integrating the first heat dissipation part and the second heat dissipation part 350, the chip layer can be cooled. One side of the chip layer is cooled by heat exchange from the first heat dissipation part, and the other side is cooled by heat absorption from the second heat dissipation part 350. The cooling is rapid and the cooling effect is obvious, which can solve the problem of the chip 450 temperature of the power module assembly 1 rising too fast and too high.

[0056] In some embodiments of the present invention, the substrate is constructed as a DBC substrate, which is composed of a ceramic insulator, Al2O3 (aluminum oxide), or AlN (aluminum nitride). On the DBC substrate, a pure metal layer is tightly and firmly bonded to the ceramic through a high-temperature melting and diffusion process. Such a DBC substrate has high thermal conductivity, high heat resistance, and strong heat dissipation capability, resulting in better heat dissipation for the chip.

[0057] According to some embodiments of the present invention, such as Figures 3-4 as well as Figures 8-14 As shown, the power module assembly 1 also includes a support member 360. The support member 360 is disposed between the first heat dissipation portion and the second heat dissipation portion 350. The support member 360 has a conductive surface 154 that adheres to the surface of the chip 450 and transfers the heat generated by the chip 450 to the first heat dissipation portion and / or the second heat dissipation portion 350. Specifically, the support member 360 can space the chip 450 from the first heat dissipation portion and the second heat dissipation portion 350, wherein the conductive surface 154 of the support member 360 adheres to the surface of the chip 450, and the support member 360 is disposed between the first heat dissipation portion and the second heat dissipation portion 350. The support member 360 can be constructed as a metal or non-metal component with good thermal conductivity to transfer the heat of the chip 450 to the first heat dissipation portion and / or the second heat dissipation portion 350, thereby cooling the chip 450.

[0058] According to some embodiments of the present invention, such as Figures 3-4 as well as Figures 8-14 As shown, the support member 360 is disposed between the first heat dissipation part and the chip layer and / or the second heat dissipation part 350 and the chip layer. Specifically, the support member 360 can space the chip 450 away from the first heat dissipation part and / or the second heat dissipation part 350 to leave space for the arrangement of circuits and realize the arrangement of circuits within the power module assembly 1.

[0059] According to some embodiments of the present invention, such as Figures 4-6 As shown, the second heat dissipation unit 350 includes a phase change housing 351. A phase change material receiving cavity 354 for accommodating the phase change material 352 is formed within the phase change housing 351, and the phase change housing 351 is in direct and / or indirect contact with the support member 360. Specifically, the phase change material 352 is housed within the phase change material receiving cavity 354 of the phase change housing 351, and the phase change housing 351 is in direct and / or indirect contact with the support member 360 to conduct heat from the chip 450 to the phase change housing 351.

[0060] According to some embodiments of the present invention, such as Figures 4-6 As shown, the second heat dissipation section 350 also includes a heat-conducting section. The heat-conducting section is disposed on the inner wall of the phase change material receiving cavity 354 and protrudes towards the interior of the phase change material receiving cavity 354. Specifically, the heat-conducting section can guide the heat transferred by the phase change shell 351 to the phase change material 352. The heat-conducting section improves the heat conduction efficiency of the second heat dissipation section 350 and the heat absorption efficiency of the phase change material 352.

[0061] According to some embodiments of the present invention, such as Figure 5 As shown, the heat-conducting part is constructed as a plurality of heat-conducting pins 353 extending from the side of the phase change material receiving cavity 354 near the chip layer to the side away from the chip layer. Specifically, the heat-conducting pins 353 can conduct heat into the interior of the phase change material 352, which facilitates heat conduction inside the phase change material 352 and improves the heat conduction and heat absorption efficiency of the phase change material 352.

[0062] According to some embodiments of the present invention, such as Figure 6 As shown, the heat-conducting part is constructed as a heat-conducting plate 355 formed inside the phase change material receiving cavity 354. The heat-conducting plates 355 are disposed inside the phase change material receiving cavity 354 and spaced apart from each other to form heat dissipation channels. Specifically, heat-conducting plates 355 are added to the phase change shell 351. The heat-conducting plates 355 can conduct heat into the phase change material 352. The heat dissipation channels between the heat-conducting plates 355 are suitable for heat dissipation to avoid heat accumulation in the second heat dissipation part 350, facilitate heat conduction inside the phase change material 352, and improve the heat conduction and heat absorption efficiency of the phase change material 352.

[0063] According to some embodiments of the present invention, such as Figure 6As shown, the heat-conducting plate 355 extends from the side of the phase change material receiving cavity 354 near the chip layer to the side away from the chip layer in the thickness direction, and the heat-conducting plate 355 is constructed in a zigzag shape, a curved shape, and / or a wavy shape in the length direction. Specifically, the heat-conducting plate 355 can be constructed in a wavy shape or other shapes that facilitate heat conduction, which can enhance the heat conduction effect while increasing the heat dissipation channel.

[0064] According to some embodiments of the present invention, such as Figure 3 As shown, the support member 360 is constructed as a conductive component. Specifically, the material of the support member 360 can be set as a metal material with conductive properties. The metal support member 360 not only has good thermal conductivity and rapid heat conduction, making it suitable for transferring the heat of the chip to the first heat dissipation layer and the second heat dissipation layer to dissipate heat from the chip, thus improving the heat dissipation efficiency of the power module component; at the same time, the metal support member 360 also has electrical conductivity, realizing the electrical connection between the metal layer circuit on the DBC substrate and the first chip 30 and the second chip 31 according to the circuit design of the metal layer on the substrate, completing the routing of the high voltage section and simplifying the circuit structure.

[0065] Furthermore, to prevent short circuits in chip 450, a first insulating layer is provided between the second heat dissipation part 350 and the support member 360, and a second insulating layer is provided between the support member 360 and the first heat dissipation part. By providing the first and second insulating layers, the support member 360 can be insulated from the second heat dissipation part 350 and the first heat dissipation part respectively, thereby ensuring the safe use of the power module assembly 1.

[0066] Specifically, the metal support 360 has good thermal conductivity. Since the support 360 is a conductive component, according to some embodiments of the present invention, such as... Figure 3 , Figure 9 As shown, both the first and second insulating layers include a thermally conductive insulating layer 602 and a thermally conductive metal layer 601. The thermally conductive insulating layer 602 is constructed as thermally conductive ceramic; the thermally conductive metal layer 601 is disposed on both sides of the thermally conductive insulating layer 602 in the thickness direction. Specifically, in order to achieve heat dissipation for the chip 450 by the second heat dissipation part 350 and the first heat dissipation part, the first and second insulating layers should be thermally conductive while providing insulation. The thermally conductive insulating layer 602 of the first insulating layer is disposed between the second heat dissipation part 350 and the chip layer. The thermally conductive insulating layer 602 is connected to the second heat dissipation part 350 through the thermally conductive metal layer 601, and the thermally conductive insulating layer 602 is also connected to the chip layer through the thermally conductive metal layer 601. The length of the thermally conductive insulating layer 602 is greater than the length of the thermally conductive metal layer 601 to separate the thermally conductive metal layers 601 on both sides. It can be understood that the structure of the second insulating layer is the same as that of the first insulating layer.

[0067] According to some embodiments of the present invention, such as Figure 3As shown, the support member 360 includes a body, a chip heat transfer section, and a support foot. A heat-conducting surface 153 is provided on the body, abutting against a first insulating layer or a second insulating layer. The chip heat transfer section is disposed on the body and extends toward the chip 450, with a conductive surface 154 formed at its free end, contacting the surface of the chip 450. The support foot is disposed on the body and extends toward the substrate, with a support surface 152 formed at its free end, contacting the surface of the substrate. Specifically, the heat-conducting surface 153 of the body abuts against the first insulating layer or the second insulating layer, and the support surface 152 of the support foot contacts the substrate. The body and the support foot can support the support member 360 between the first insulating layer and the substrate or between the second insulating layer and the substrate. The conductive surface 154 of the chip heat transfer section contacts the chip 450 to conduct heat from the chip 450 to the first insulating layer or the second insulating layer, thereby conducting it to the second heat dissipation section 350 and / or the first heat dissipation section.

[0068] According to some embodiments of the present invention, a wiring harness channel 155 is provided and formed between the chip heat transfer section and the support foot at an interval. Specifically, the wiring harness channel 155 is adapted to carry wires, and the wiring harness channel 155 formed between the chip heat transfer section and the support foot at an interval facilitates the arrangement of the wiring of the power module assembly 1.

[0069] According to some embodiments of the present invention, such as Figure 13 As shown, the first heat dissipation section includes a heat dissipation base plate 801 and heat dissipation fins 800. The heat dissipation base plate 801 exchanges heat with the chip layer; the heat dissipation fins 800 are disposed on the heat dissipation base plate 801 and extend in a direction away from the chip layer, and the heat dissipation fins 800 are adapted to contact with the external heat dissipation medium for heat exchange. Specifically, the heat dissipation base plate 801 and the heat dissipation fins 800 are connected, and the heat dissipation fins 800 contact with the external heat dissipation medium for heat dissipation. The heat dissipation fins 800 can expand the heat conduction surface 154, promote heat dissipation, and increase heat transfer efficiency.

[0070] According to some embodiments of the present invention, such as Figure 13 As shown, the power module assembly 1 also includes a heat dissipation channel 901. The heat dissipation channel 901 is attached to the heat dissipation base plate 801 and has a medium channel 900 inside suitable for the flow of heat dissipation medium. The heat dissipation fins 800 are housed within the medium channel 900. Specifically, the medium channel 900 is designed with the heat dissipation channel 901. The heat dissipation channel 901 and the heat dissipation base plate 801 can be an integral structure or a separate structure. The heat dissipation fins 800 are embedded in the heat dissipation channel 901. The heat dissipation base plate 801 is attached to the upper surface of the medium channel 900. The heat dissipation channel 901 has a simple structure, high feasibility, and is easy to implement.

[0071] According to some embodiments of the present invention, such as Figure 13As shown, the power module assembly 1 also includes a molding compound 200. The molding compound 200 covers at least a portion of the outer periphery of the first heat sink, the chip layer, and the second heat sink 350, wherein the heat sink pins 800 protrude from the molding compound 200. Specifically, the injection molding compound 200 can completely encapsulate the entire power module assembly 1 except for the heat sink base plate 801 and the heat sink pins 800, reducing thermal resistance and the number of processes, and improving production efficiency.

[0072] According to some embodiments of the present invention, a heat dissipation vent is provided on the molding layer 200, and the heat dissipation vent is directly opposite the phase change housing 351 of the second heat dissipation part 350. Specifically, the heat dissipation vent exposes a portion of the surface of the phase change housing 351, which can achieve heat conduction and further improve the heat dissipation efficiency.

[0073] According to some embodiments of the present invention, the phase change medium is constructed as a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material. Specifically, the second heat dissipation part 350 consists of a phase change housing 351 and a heat-conducting part. The phase change medium inside the phase change housing 351 can be a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material. The phase change housing 351 can avoid leakage problems and improve the reliability of the power module assembly 1.

[0074] The motor controller according to another embodiment of the present invention is briefly described below.

[0075] The motor controller according to the present invention includes the power module component 1 described in any of the above embodiments. Since the motor controller according to the present invention is provided with the power module component 1 of the above embodiments, the motor controller integrates water cooling on one side and heat absorption by phase change material 352 on the other side to cool down, resulting in rapid cooling and significant cooling effect.

[0076] The vehicle according to another embodiment of the present invention is briefly described below.

[0077] The vehicle according to the present invention includes the motor controller described in the above embodiments. Since the vehicle according to the present invention is equipped with the motor controller described in the above embodiments, the vehicle can solve the problem of excessively rapid and excessive temperature rise of chip 450, and the vehicle has good safety in use.

[0078] In some embodiments of the present invention, such as Figures 1-2As shown, the peripheral structure of the power module assembly 1 consists of a molding compound 200, a second heat sink 350, a first high-voltage terminal 100, a second high-voltage terminal 400, a third high-voltage terminal 500, a high-voltage output terminal 300, and a low-voltage terminal 700. The high-voltage terminal and the low-voltage terminal 700 are made of metal (such as copper) and serve as the external interface for the power module assembly 1, connecting to DC forward current, DC negative current, AC output, temperature sampling, and the power module controller, respectively. The chip 450 is a power semiconductor made of Si / SiC material. During use, the chip 450 will experience a temperature rise due to heat loss. Therefore, designing a heat dissipation structure is crucial to prevent the chip 450 temperature from exceeding its junction temperature and causing chip failure.

[0079] The molding compound 200 uses injection molding to cover the internal components, providing insulation, isolation, and heat dissipation. It is typically made of thermosetting plastics, such as epoxy resin or phenolic resin. The second heat dissipation unit 350 uses phase change material 352. Utilizing the characteristic of phase change material 352 to absorb a large amount of latent heat during its phase change process, it absorbs the large amount of heat generated by the chip 450 under high current conditions, achieving efficient and rapid cooling. Phase change material 352 is generally formulated with different proportions to suit various operating conditions. Figure 1 As shown, the surface of the second heat dissipation part 350 is not completely sealed, and part of the surface is still exposed to the outside through the heat dissipation port 600. The outside of the second heat dissipation part 350 is made of metal, and the exposed metal surface can achieve heat conduction, further improving the heat dissipation effect.

[0080] like Figure 2 As shown, the other side of the power module assembly 1 is the first heat dissipation section. The main structural component of the first heat dissipation section is the heat dissipation fin 800, which is inserted into the heat dissipation channel 901 (e.g., Figure 13 For heat dissipation, the heat dissipation fins 800 are used to expand the heat conduction surface, increase water resistance, promote heat dissipation, and increase heat transfer efficiency. The heat dissipation fins 800 and the heat dissipation base plate 801 are generally an integral structure, which can be achieved by casting. The first heat dissipation part is made of metal material with high thermal conductivity. The solder layer 156 of the heat dissipation base plate generally uses solder paste to fix the DBC substrate and the heat dissipation base plate.

[0081] The DBC substrate consists of an upper metal layer 601, a ceramic substrate 602, and a lower metal layer 603. The upper metal layer 601 is typically made of a metal, such as copper, and serves for heat dissipation, fulfilling the circuit functional requirements of the chip 450 while also providing electrical and thermal conductivity. The ceramic substrate 602 is typically made of a ceramic material, such as Si3N4, Al2O3, or AlN. The ceramic substrate 602 insulates the circuitry of the chip 450 from the lower first heat sink while simultaneously conducting heat from the chip 450 to the first heat sink, thus providing both electrical and thermal conductivity. The lower metal layer 603 is similar to the upper metal layer 601 and can be made of a metal, typically copper. The primary function of the lower metal layer 603 is to solder the first heat sink and provide thermal conductivity.

[0082] The support surface 152 of the support member 360 is connected to the upper metal layer 601 of the DBC substrate to which the chip 450 is connected, and the heat-conducting surface 153 of the support member 360 is connected to the second heat sink 350. The support member 360 can realize the circuit overcurrent function of the chip 450. A certain height is designed between the first heat sink and the second heat sink 350 to avoid the binding wires in the low voltage circuit of the chip 450 and prevent dangerous situations such as short circuits. The support member 360 is located between the first heat sink and the second heat sink 350 and forms a wire harness channel 155 for arranging the circuit. A DBC substrate is also provided at the second heat sink 350 to realize the insulation between the support member 360 and the second heat sink 350. The support member 360 can also realize the heat conduction function of the chip 450. The heat-conducting surface 153 of the support member 360 realizes the connection with the DBC substrate at the second heat sink 350, and the solder layer 151 realizes the connection between the DBC substrate and the second heat sink 350.

[0083] Two support members 360 are constructed, each connecting to one of the two chips 450. Together with the circuit design on the metal-clad layer 601 and the first high-voltage terminal 100, second high-voltage terminal 400, third high-voltage terminal 500, and high-voltage output terminal 300, they establish high-voltage line connections between the two chips 450. Since the two support members 360 respectively handle the high-voltage lines of different chips 450, insulation between them is essential. If a support member 360 is directly connected to the second heat sink 350, which is made of conductive material, it would directly cause an electrical connection between the two support members 360, potentially leading to a short circuit in the chips 450. To avoid this danger, a DBC substrate composed of a metal-clad layer 604, a metal-clad layer 605, and a ceramic substrate 606 is added between the support member 360 and the second heat sink 350 to achieve insulation between the two support members 360 and between the support member 360 and the second heat sink 350.

[0084] The support component 360 can be designed in M-shape or N-shape. On the one hand, it can reduce the supporting force on the chip 450 while supporting the second heat dissipation part 350, thus avoiding damage to the chip 450. On the other hand, it can leave room for the arrangement and processing of low-voltage wiring in the module.

[0085] like Figure 4 The diagram shows an embodiment of the second heat dissipation unit 350, which consists of a phase change housing 351 and a phase change material 352. The phase change housing 351 seals the phase change material 352, and the internal metal layer of the phase change material 352 serves as the outer shell of the module. The internal metal layer of the phase change material 352 can be a solid-solid phase change material, a solid-liquid phase change material, or a gas-liquid phase change material. The internal metal layer of the phase change material 352 can solve the sealing and fixing problems, avoid leakage problems, and improve the reliability of the module.

[0086] like Figure 5 The diagram shown is a schematic of another embodiment of the second heat dissipation unit 350. In the diagram, a heat-conducting pin 353 structure is added to the phase change housing 351, and the phase change material 352 is loaded into the phase change material receiving cavity 354. The heat-conducting pin 353 can conduct heat into the interior of the phase change material 352, which facilitates heat conduction inside the phase change material 352 and improves the heat conduction and heat absorption efficiency of the phase change material 352.

[0087] like Figure 6 The diagram shown is a schematic of another embodiment of the second heat dissipation unit 350. In the diagram, a corrugated heat-conducting plate 355 is added to the phase change housing 351, and the phase change material receiving cavity 354 contains the phase change material 352. The corrugated heat-conducting plate 355 can conduct heat into the phase change material 352, and the principle is similar to... Figure 5 Similar to what is described in the text.

[0088] like Figures 7 to 12 This describes a method for fabricating power module component 1. For example... Figure 7 As shown, the DBC substrate is an assembly formed by connecting an upper metal layer 601, a ceramic substrate 602, and a lower metal layer 603. The chip 450 is fixed to the DBC substrate by a solder layer 155.

[0089] like Figure 8 As shown, in Figure 7 Based on the manufacturing process, the first high-voltage terminal 100 is welded; one end of the support member 360 is fixed to the chip 450, and the other end of the support member 360 is fixed to the upper metal layer 601 of the DBC substrate. The mass of the support post and the pressing surface of the end of the support member 360 fixed to the chip 450 is less than the mass of the support member 360 fixed to the upper metal layer 601. The upper metal layer 601 bears the main supporting force of the support member 360, preventing the chip 450 from being cracked by the second heat dissipation part 350 and causing module failure.

[0090] like Figure 9As shown, in Figure 8 Based on this, the DBC substrate below the second heat dissipation part 350 is fixed on the support member 360, and the metal arrangement of the metal-clad layer of the DBC substrate is consistent with that of the support member 360 to ensure that the electrical circuit is not interfered with.

[0091] like Figure 10 As shown, in Figure 9 Based on this, the metal layer 603 under the bottom DBC is connected to the heat dissipation base plate 801 through the heat dissipation base plate solder layer 156.

[0092] like Figure 11 As shown, in Figure 10 Based on this, the second heat dissipation part 350 is connected to the metal cladding layer of the DBC substrate below the second heat dissipation part 350 by a solder layer 151. Since the second heat dissipation part 350 is composed of a phase change shell 351 and a phase change material 352, the phase change shell 351 and the metal cladding layer can be made of the same material, such as copper, which is beneficial for achieving high-strength welding.

[0093] like Figure 12 As shown, in Figure 11 Based on this, a molding compound 200 is injection molded. The molding compound 200 completely encapsulates the entire power module assembly 1 except for the heat dissipation base plate 801 and the heat dissipation pins 800, reducing thermal resistance, reducing the number of processes, and improving production efficiency.

[0094] Figure 13 This is a schematic diagram of the module's water channel. A heat dissipation channel 901 is designed on the medium channel 900, and heat dissipation pins 800 are embedded in the water channel 901. The heat dissipation base plate 801 is attached to the upper surface of the medium channel 900 and sealed by a sealing ring. In multi-module applications, the water channels can be arranged in series or parallel; the diagram shows a schematic diagram of a series water channel. The heat dissipation channel 901 in the diagram has a simple structure, high feasibility, and is easy to implement.

[0095] Under normal operating conditions, the power module component 1 can dissipate heat from the chip 450 by using the first heat dissipation part water cooling. When a large current surge occurs, the chip 450 heats up significantly. The second heat dissipation part 350 phase change material 352 can be used to absorb heat for auxiliary heat dissipation. The latent heat of the phase change material 352 is used to absorb the excess heat. After the temperature of the chip 450 drops, the heat can be dissipated.

[0096] The power module component 1 of this application places the chip layer between the first heat dissipation part and the second heat dissipation part 350. By integrating the first heat dissipation part and the second heat dissipation part 350, the chip layer can be cooled. One side of the chip layer is cooled by heat exchange from the first heat dissipation part, and the other side is cooled by heat absorption from the second heat dissipation part 350. The cooling is rapid and the cooling effect is obvious.

[0097] In summary, the power module assembly 1 of the present invention employs a water-cooling method on one side and a heat absorption method using phase change material 352 on the other side for heat dissipation of the chip 450, achieving efficient heat dissipation on both sides. This improves the module's current carrying capacity, reduces the flow rate and power requirements of the water pump, further reduces costs, and achieves efficient heat dissipation on both sides of the power module assembly 1, resulting in rapid and significant cooling and improved current carrying capacity. The single-sided water-cooled sealing reduces the requirements for water channel sealing, expands the application scenarios of the power module assembly 1, and reduces the actual usage difficulty and cost of the power module assembly 1, making it suitable for mass production. The use of a first insulating layer and a second insulating layer achieves heat dissipation and insulation of the chip 450, ensuring the safe use of the power module assembly 1, while also expanding the selection range of phase change material 352 and improving the thermal conductivity of the phase change material 352.

[0098] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0099] Although embodiments of the present invention have been shown and described above, variations, modifications, substitutions and alterations can be made to the above embodiments.

Claims

1. A power module assembly, characterized in that, include: A chip layer, the chip layer including a substrate and a chip (450) disposed on the substrate. A first heat dissipation section and a second heat dissipation section (350), wherein the chip layer is disposed between the first heat dissipation section and the second heat dissipation section (350); wherein The side of the first heat dissipation part away from the chip layer is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer. The second heat dissipation part (350) is provided with a phase change medium and absorbs the heat of the chip layer through phase change. A support member (360) is disposed between the first heat dissipation part and the second heat dissipation part (350). The support member (360) has a conductive surface (154) that is in contact with the surface of the chip (450) and transfers the heat generated by the chip (450) to the first heat dissipation part and / or the second heat dissipation part (350). The support member (360) is disposed between the first heat dissipation part and the chip layer and / or the second heat dissipation part (350) and the chip layer; The second heat dissipation unit (350) includes: A phase change housing (351) has a phase change material receiving cavity (354) formed inside the phase change housing (351) for receiving the phase change material (352), and the phase change housing (351) is in direct or indirect contact with the support member (360); The support member (360) is constructed as a conductive member, and a first insulating layer is provided between the second heat dissipation part (350) and the support member (360), and a second insulating layer is provided between the support member (360) and the first heat dissipation part.

2. The power module assembly according to claim 1, characterized in that, The second heat dissipation part (350) further includes a heat-conducting part, which is disposed on the inner wall of the phase change material receiving cavity (354) and protrudes toward the interior of the phase change material receiving cavity (354).

3. The power module assembly according to claim 2, characterized in that, The heat-conducting part is constructed as a plurality of heat-conducting pins (353) extending from the phase change material receiving cavity (354) near the chip layer to away from the chip layer.

4. The power module assembly according to claim 2, characterized in that, The heat-conducting part is constructed as a heat-conducting plate (355) formed inside the phase change material receiving cavity (354). The heat-conducting plates (355) are disposed inside the phase change material receiving cavity (354) and spaced apart from each other to form a heat dissipation channel.

5. The power module assembly according to claim 4, characterized in that, The heat-conducting plate (355) extends away from the chip layer from the phase change material receiving cavity (354) in the thickness direction, and the heat-conducting plate (355) is constructed in a zigzag or curved shape in the length direction.

6. The power module assembly according to claim 1, characterized in that, Both the first insulating layer and the second insulating layer include: A thermally conductive insulating layer (602) is constructed of thermally conductive ceramic. A thermally conductive metal layer (601) is disposed on both sides of the thermally conductive insulating layer (602) in the thickness direction.

7. The power module assembly according to claim 1, characterized in that, The support member (360) includes: The main body is provided with a heat-conducting surface (153), which abuts against the first insulating layer or the second insulating layer. A chip heat transfer section is disposed on the body section and extends toward the chip (450), and the free end of the chip heat transfer section has a conductive surface (154) that contacts the surface of the chip (450). The support foot is disposed on the body portion and extends toward the substrate, and the free end of the support foot forms a support surface (152) that contacts the surface of the substrate.

8. The power module assembly according to claim 7, characterized in that, The chip heat transfer section and the support foot are spaced apart to form a wire harness channel (155).

9. The power module assembly according to claim 1, characterized in that, The first heat dissipation unit includes: A heat dissipation base plate (801) is used for heat exchange with the chip layer; Heat dissipation fins (800) are disposed on the heat dissipation base plate (801) and extend in a direction away from the chip layer. The heat dissipation fins (800) are adapted to contact with the external heat dissipation medium for heat exchange.

10. The power module assembly according to claim 9, characterized in that, Also includes: The heat dissipation channel (901) is attached to the heat dissipation base plate (801) and has a medium channel (900) inside that is suitable for the flow of heat dissipation medium. The heat dissipation fins (800) are housed in the medium channel (900).

11. The power module assembly according to claim 9, characterized in that, Also includes: A molding layer (200) covers at least a portion of the outer periphery of the first heat dissipation part, the chip layer and the second heat dissipation part (350), wherein the heat dissipation fins (800) protrude from the molding layer (200).

12. The power module assembly according to claim 11, characterized in that, The encapsulation layer (200) is provided with a heat dissipation port (600), which is directly opposite the phase change shell (351) of the second heat dissipation part (350).

13. The power module assembly according to any one of claims 1-12, characterized in that, The phase change medium is constructed as a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material.

14. A motor controller, characterized in that, Includes the power module assembly as described in any one of claims 1-13.

15. A vehicle, characterized in that, Includes the motor controller described in claim 14.

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