Differential transmission plate sets and assemblies

Abstract

A differential transmission board set includes a mounting board on which a compression connector is mounted, and a contact board for contacting the compression connector. In the contact board, a second conductor layer is a ground layer and has a through hole. The through hole is formed so that a first signal pad and a second signal pad are each located inside an inner edge of the through hole. In the contact board, the through hole is formed so as to overlap with an outer side area of the first ground pad and an outer side area of the second ground pad. In the mounting board, the through hole is formed so as to be away from the first ground pad and the second ground pad when viewed in a vertical direction.

Description

Technical Field

[0001] This invention relates to a differential transmission board assembly and components. Background Technology

[0002] As in the present invention Figure 36 As shown, Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2017-27721) discloses a switching plate 1002, which is a multilayer board in which multiple conductor layers 1000 and multiple insulating layers 1001 are alternately stacked. The multiple conductor layers 1000 include a first conductor layer 1000A, a second conductor layer 1000B, a third conductor layer 1000C, and a fourth conductor layer 1000D. The multiple insulating layers 1001 include a first insulating layer 1001A, a second insulating layer 1001B, and a third insulating layer 1001C. The layers are arranged from the surface to the inner layer in the order of the first conductor layer 1000A, the first insulating layer 1001A, the second conductor layer 1000B, the second insulating layer 1001B, the third conductor layer 1000C, the third insulating layer 1001C, and the fourth conductor layer 1000D.

[0003] The first conductor layer 1000A includes two cable connection pads 1003 and two grounding pads 1004. The two signal line conductors of the differential signal transmission cable are soldered to the two cable connection pads 1003, and the two cable connection pads 1003 are placed between the two grounding pads 1004.

[0004] The second conductor layer 1000B and the third conductor layer 1000C each have a through hole 1005B and a through hole 1005C, which overlap with the two cable connection pads 1003 in the stacking direction. This reduces the capacitive coupling between the two cable connection pads 1003 and the second conductor layer 1000B, thereby controlling the reduction of differential impedance in the two cable connection pads 1003. Summary of the Invention

[0005] The inventors of this invention are developing two differential transmission plates electrically connected to each other via a compression connector, the compression connector comprising a plurality of crimping members and a housing holding the plurality of crimping members, wherein each crimping member has a welded portion and a resilient portion. The two differential transmission plates are combined to form a differential transmission plate assembly.

[0006] One objective of this invention is to provide a technique for improving the transmission characteristics of differential transmission board assemblies.

[0007] According to a first aspect of the present invention, a differential transmission board assembly is provided, the differential transmission board assembly being a combination of two differential transmission boards electrically connected to each other via a compression connector, the compression connector comprising four crimping members arranged in a row and a housing holding the four crimping members, each crimping member comprising a welded portion and a resilient portion, wherein the two differential transmission boards comprise a mounting plate and a contact plate, the compression connector being mounted on the mounting plate, the contact plate being configured to contact the compression connector, each of the mounting plate and the contact plate being a multilayer board, the multilayer board having a plurality of conductor layers and a plurality of insulating layers alternately stacked, in each of the mounting plate and the contact plate, the plurality of conductor layers comprising a first A first conductor layer and a second conductor layer are arranged sequentially from the compression connector side in the order of the first conductor layer and the second conductor layer. In each mounting plate and the contact plate, the first conductor layer includes four electrode pads corresponding to the four crimping members. The four electrode pads include: a first signal pad, a second signal pad, a first ground pad, and a second ground pad. The first ground pad, the first signal pad, the second signal pad, and the second ground pad are arranged in the order described in the first direction. In the mounting plate, the solder portions of the four crimping members can be soldered to the first ground pad, the first signal pad, the second signal pad, and the second ground pad, respectively. In the contact plate, the... The elastic portions of the four crimping members can respectively contact the first ground pad, the first signal pad, the second signal pad, and the second ground pad. In each of the mounting plates and the contact plates, the second conductor layer is a ground layer and has a perforation. In each of the mounting plates and the contact plates, the perforation is formed such that, when viewed in the stacking direction, both the first signal pad and the second signal pad are located inside the inner edge of the perforation. In each of the mounting plates and the contact plates, the first ground pad includes an inner region and an outer region. The inner region is closer to the first signal pad than the dividing line that divides the pad area of ​​the first ground pad into two halves along the first direction. The side region is further away from the first signal pad relative to the dividing line. In each of the mounting plates and the contact plates, the second ground pad includes an inner region and an outer region. The inner region is closer to the second signal pad relative to the dividing line that divides the pad region of the second ground pad into two halves along the first direction. The outer region is further away from the region of the second signal pad relative to the dividing line. In the contact plate, when viewed along the stacking direction, the perforation is formed to overlap with the outer region of the first ground pad and the outer region of the second ground pad. In the mounting plate, when viewed along the stacking direction, the perforation is formed to be away from the first ground pad and the second ground pad.

[0008] According to the present invention, the transmission characteristics of the differential transmission board assembly are improved.

[0009] The above and other objects, features and advantages of the present invention will be more fully understood from the detailed description given below and the accompanying drawings, which are given by way of illustration only, and should therefore not be considered as limitations on the invention. Attached Figure Description

[0010] Figure 1 This is an exploded perspective view of the information processing device (first embodiment).

[0011] Figure 2 This is an exploded perspective view of the information processing device (first embodiment) as observed from other angles.

[0012] Figure 3 This is a cross-sectional view of the differential transmission device (first embodiment).

[0013] Figure 4 This is a partial bottom view of the first conductor layer of the contact plate (first embodiment).

[0014] Figure 5 This is a partial bottom view of the second conductor layer of the contact plate (first embodiment).

[0015] Figure 6 This is a partial bottom view of the third conductor layer of the contact plate (first embodiment).

[0016] Figure 7 This is a partial bottom view of the fourth conductor layer of the contact plate (first embodiment).

[0017] Figure 8 This is a partial bottom view of the fifth conductor layer of the contact plate (first embodiment).

[0018] Figure 9 This is a partial bottom view of the sixth conductor layer of the contact plate (first embodiment).

[0019] Figure 10 This is a projection view of the multiple conductor layers of the contact plate (first embodiment).

[0020] Figure 11 This is a partial plan view of the first conductor layer of the mounting plate (first embodiment).

[0021] Figure 12 This is a partial plan view of the second conductor layer of the mounting plate (first embodiment).

[0022] Figure 13 This is a partial plan view of the third conductor layer of the mounting plate (first embodiment).

[0023] Figure 14 This is a partial plan view of the fourth conductor layer of the mounting plate (first embodiment).

[0024] Figure 15 This is a partial plan view of the fifth conductor layer of the mounting plate (first embodiment).

[0025] Figure 16 This is a partial plan view of the sixth conductor layer of the mounting plate (first embodiment).

[0026] Figure 17 This is a projection view of the multiple conductor layers of the mounting plate (first embodiment).

[0027] Figure 18 This is a partial bottom view of the third and fourth conductor layers of the contact plate (first modified example).

[0028] Figure 19 This is a partial plan view of the third and fourth conductor layers of the mounting plate (first variant).

[0029] Figure 20 This is a projection diagram of the multiple conductor layers of the contact plate (first comparative example).

[0030] Figure 21 This is a projection view of the multiple conductor layers of the mounting plate (first comparative example).

[0031] Figure 22 This is a projection diagram of the multiple conductor layers of the contact plate (second comparative example).

[0032] Figure 23 This is a projection diagram of the multiple conductor layers of the mounting plate (second comparative example).

[0033] Figure 24 This is a projection diagram of the multiple conductor layers of the contact plate (third comparative example).

[0034] Figure 25 This is a projection view of the multiple conductor layers of the mounting plate (third comparative example).

[0035] Figure 26 This is a projection diagram of the multiple conductor layers of the contact plate (fourth comparative example).

[0036] Figure 27 This is a projection view of the multiple conductor layers of the mounting plate (fourth comparative example).

[0037] Figure 28 This is a partial bottom view of the second to fourth conductor layers of the contact plate (fifth comparative example).

[0038] Figure 29 This is a partial bottom view of the second to fourth conductor layers of the mounting plate (fifth comparative example).

[0039] Figure 30 This is a graph representing the analysis results of insertion loss.

[0040] Figure 31 This is a graph representing the analysis results of return loss.

[0041] Figure 32 This is a graph representing the analysis results of differential impedance using the TDR method.

[0042] Figure 33 This is a graph representing the analysis results of insertion loss.

[0043] Figure 34 This is a graph representing the analysis results of return loss.

[0044] Figure 35 This is a graph representing the analysis results of differential impedance using the TDR method.

[0045] Figure 36 It is patent document 1 Figure 16 A simplified diagram. Specific Implementation

[0046] (First Embodiment)

[0047] The following is for reference Figures 1 to 17 The first embodiment is described.

[0048] Figure 1 and Figure 2 This is an exploded perspective view of information processing device 1. For example... Figure 1 and Figure 2 As shown, the information processing device 1 includes a differential transmission component 2 (component) and a support plate 3.

[0049] The differential transmission assembly 2 includes a differential transmission board group 4 and a compression connector 5.

[0050] The differential transmission board assembly 4 includes a contact plate 6 and a mounting plate 7. The contact plate 6 and the mounting plate 7 are electrically connected to each other via a compression connector 5. Both the contact plate 6 and the mounting plate 7 are differential transmission boards. The contact plate 6 and the mounting plate 7 are parallel to each other when they are electrically connected via the compression connector 5.

[0051] The contact plate 6 has two bolt fastening holes 6A. Similarly, the mounting plate 7 has two bolt fastening holes 7A.

[0052] The support plate 3 is typically part of a housing that houses the contact plate 6, the compression connector 5, and the mounting plate 7, and is made, for example, of aluminum or an aluminum alloy. The support plate 3 includes a flat plate body 8 and two nuts 9 protruding from the plate body 8.

[0053] The information processing device 1 is assembled as follows. First, the compression connector 5 is installed on the mounting plate 7. Next, the mounting plate 7 with the compression connector 5 installed is installed onto the support plate 3. At this time, the two nuts 9 of the support plate 3 pass through the two bolt fastening holes 7A of the mounting plate 7.

[0054] Then, the contact plate 6 is attached to the support plate 3 in an overlapping manner with the compression connector 5. Specifically, two bolts 10 are fastened to the two nuts 9 of the support plate 3 through the two bolt fastening holes 6A of the contact plate 6, respectively. The contact plate 6 thereby presses against the compression connector 5 and comes into contact with it, thereby electrically connecting the contact plate 6 and the mounting plate 7 to each other through the compression connector 5. Specifically, the compression connector 5 is not mounted on the contact plate 6; the compression connector 5 only comes into contact with the contact plate 6 when the contact plate 6 presses against it.

[0055] Continue to refer to Figure 1 and Figure 2 The compression connector 5 includes a plurality of crimping members 11 and a housing 12 that accommodates the plurality of crimping members 11. The plurality of crimping members 11 form a plurality of contact rows 13. The plurality of contact rows 13 extend parallel to each other.

[0056] The following defines the spacing direction, width direction, and vertical direction. The spacing direction, width direction, and vertical direction are orthogonal to each other. The spacing direction is the arrangement direction of each contact row 13. The width direction is the arrangement direction of the plurality of contact rows 13 extending parallel to each other. The vertical direction is the direction in which the contact plate 6 and the compression connector 5, and the compression connector 5 and the mounting plate 7 are respectively opposite to each other. Therefore, the thickness direction of the contact plate 6 and the thickness direction of the mounting plate 7 correspond to the vertical direction. The direction of the contact plate 6 as viewed from the compression connector 5 is called upward, and the direction of the mounting plate 7 as viewed from the compression connector 5 is called downward. The vertical direction is used for illustrative purposes only and should not be construed as limiting the actual position of the information processing device 1 in use.

[0057] Figure 3 This is a cross-sectional view of the differential transmission component 2. Figure 3 As shown, each crimping member 11 is received within the contact receiving chamber 12A of the housing 12 by crimping. Each crimping member 11 includes a welding portion 20, an elastic portion 21, and a crimping portion 22. The elastic portion 21 has a contact portion 21A that is capable of elastic displacement in the vertical direction. The elastic portion 21 is supported by the crimping portion 22 in a cantilever beam shape, allowing the contact portion 21A to elastically displace in the vertical direction.

[0058] The contact plate 6 is a multilayer substrate composed of alternating layers of conductor layers 6CL and insulator layers 6SL. The conductor layers 6CL, from the compression connector 5 side to the top, sequentially include: a first conductor layer 6CL1, a second conductor layer 6CL2, a third conductor layer 6CL3, a fourth conductor layer 6CL4, a fifth conductor layer 6CL5, and a sixth conductor layer 6CL6. The insulator layers 6SL, from the compression connector 5 side to the top, sequentially include: a first insulator layer 6SL1, a second insulator layer 6SL2, a third insulator layer 6SL3, a fourth insulator layer 6SL4, and a fifth insulator layer 6SL5. Therefore, the first conductor layer 6CL1, the first insulator layer 6SL1, the second conductor layer 6CL2, the second insulator layer 6SL2, the third conductor layer 6CL3, the third insulator layer 6SL3, the fourth conductor layer 6CL4, the fourth insulator layer 6SL4, the fifth conductor layer 6CL5, the fifth insulator layer 6SL5, and the sixth conductor layer 6CL6 are stacked from the compression connector 5 side upwards. The stacking direction of the contact plate 6 corresponds to the vertical direction. The second conductor layer 6CL2 is the conductor layer closest to the first conductor layer 6CL1.

[0059] Each conductor layer 6CL is typically made of highly conductive copper foil. Each insulating layer 6SL is typically made of glass epoxy resin.

[0060] Similarly, the mounting plate 7 is a multilayer substrate formed by alternating layers of conductor layers 7CL and insulator layers 7SL. The conductor layers 7CL, from the compression connector 5 side downwards, sequentially include: a first conductor layer 7CL1, a second conductor layer 7CL2, a third conductor layer 7CL3, a fourth conductor layer 7CL4, a fifth conductor layer 7CL5, and a sixth conductor layer 7CL6. The insulator layers 7SL, from the compression connector 5 side downwards, sequentially include: a first insulator layer 7SL1, a second insulator layer 7SL2, a third insulator layer 7SL3, a fourth insulator layer 7SL4, and a fifth insulator layer 7SL5. Therefore, the first conductor layer 7CL1, the first insulator layer 7SL1, the second conductor layer 7CL2, the second insulator layer 7SL2, the third conductor layer 7CL3, the third insulator layer 7SL3, the fourth conductor layer 7CL4, the fourth insulator layer 7SL4, the fifth conductor layer 7CL5, the fifth insulator layer 7SL5, and the sixth conductor layer 7CL6 are stacked from the compression connector 5 side downwards. The stacking direction of the mounting plate 7 corresponds to the vertical direction. The second conductor layer 7CL2 is the conductor layer closest to the first conductor layer 7CL1.

[0061] Each conductor layer 7CL is typically made of highly conductive copper foil. Each insulating layer 7SL is typically made of glass epoxy resin.

[0062] <Contact Plate 6>

[0063] Figures 4 to 9 This is a partial bottom view of the first conductor layer 6CL1, the second conductor layer 6CL2, the third conductor layer 6CL3, the fourth conductor layer 6CL4, the fifth conductor layer 6CL5, and the sixth conductor layer 6CL6 of the contact plate 6. Figures 4 to 9 In the diagram, the conductor portion is indicated by a shaded line for easier observation.

[0064] First, refer to the following text. Figure 2 and Figure 4 Describe the first conductor layer 6CL1. (As...) Figure 2 and Figure 4 As shown, the first conductor layer 6CL1 includes a plurality of electrode pads 30, each corresponding to one of the plurality of crimping members 11 of the compression connector 5. Specifically, the elastic portion 21 of the corresponding crimping member 11 is capable of contacting each electrode pad 30. The plurality of electrode pads 30 form a plurality of pad rows, just like the plurality of crimping members 11.

[0065] like Figure 4 As shown, in each pad row of electrode pads 30, two ground pads 31 and two signal pads 32 are arranged alternately along the spacing direction. Specifically, ground pad 31, ground pad 31, signal pad 32, signal pad 32, ground pad 31, ground pad 31, signal pad 32, signal pad 32, etc., are arranged along the spacing direction in this described order. In other words, the two signal pads 32 used for differential transmission are disposed between the two ground pads 31. Figure 4 Only four electrode pads 30 are shown. Figure 4 The four electrode pads 30 shown include two ground pads 31 and two signal pads 32 disposed between the two ground pads 31. The two ground pads 31 include a first ground pad 33 and a second ground pad 34. The two signal pads 32 include a first signal pad 35 and a second signal pad 36. The first ground pad 33, the first signal pad 35, the second signal pad 36, and the second ground pad 34 are arranged sequentially along the spacing direction.

[0066] The first signal pad 35 includes an elastic contact portion 35A and a via connection portion 35B. The elastic contact portion 35A and the via connection portion 35B are connected to each other and integrally formed in the width direction. For ease of illustration, the boundary 35C between the elastic contact portion 35A and the via connection portion 35B is indicated by a dashed line. The elastic contact portion 35A includes a base portion 35D and a tapered portion 35E. The base portion 35D is generally square, and the tapered portion 35E extends taperedly from the base portion 35D along the width direction.

[0067] Similarly, the second signal pad 36 includes a resilient contact portion 36A and a via connection portion 36B. The resilient contact portion 36A and the via connection portion 36B are connected to each other and integrally formed in the width direction. For ease of illustration, the boundary 36C between the resilient contact portion 36A and the via connection portion 36B is indicated by a dashed line. The resilient contact portion 36A includes a base portion 36D and a tapered portion 36E. The base portion 36D is generally square, and the tapered portion 36E extends taperedly from the base portion 36D along the width direction.

[0068] The first grounding pad 33 includes: an elastic contact portion 33A, a first through-hole connection portion 33B, and a second through-hole connection portion 33C. The first through-hole connection portion 33B, the elastic contact portion 33A, and the second through-hole connection portion 33C are sequentially arranged in the width direction. The elastic contact portion 33A, the first through-hole connection portion 33B, and the second through-hole connection portion 33C are integrally formed. For ease of explanation, the boundary 33D between the elastic contact portion 33A and the first through-hole connection portion 33B is indicated by a dashed line. Similarly, the boundary 33E between the elastic contact portion 33A and the second through-hole connection portion 33C is indicated by a dashed line. The elastic contact portion 33A includes a base portion 33F and a tapered portion 33G. The base portion 33F is generally square, and the tapered portion 33G extends taperedly from the base portion 33F along the width direction.

[0069] Similarly, the second grounding pad 34 includes: an elastic contact portion 34A, a first through-hole connection portion 34B, and a second through-hole connection portion 34C. These are arranged sequentially in the width direction in the order of the first through-hole connection portion 34B, the elastic contact portion 34A, and the second through-hole connection portion 34C. The elastic contact portion 34A, the first through-hole connection portion 34B, and the second through-hole connection portion 34C are integrally formed. For ease of explanation, the boundary 34D between the elastic contact portion 34A and the first through-hole connection portion 34B is indicated by a dashed line. Similarly, the boundary 34E between the elastic contact portion 34A and the second through-hole connection portion 34C is indicated by a dashed line. The elastic contact portion 34A includes a base portion 34F and a tapered portion 34G. The base portion 34F is generally square, and the tapered portion 34G extends taperedly from the base portion 34F along the width direction.

[0070] like Figure 4 As shown, the first signal pad 35 and the second signal pad 36 have the same shape, and the first ground pad 33 and the second ground pad 34 have the same shape. The elastic contact portion 35A of the first signal pad 35, the elastic contact portion 36A of the second signal pad 36, the elastic contact portion 33A of the first ground pad 33, and the elastic contact portion 34A of the second ground pad 34 have the same shape and are aligned in the spacing direction. The via connection portion 35B of the first signal pad 35, the via connection portion 36B of the second signal pad 36, the first via connection portion 33B of the first ground pad 33, and the first via connection portion 34B of the second ground pad 34 have the same shape and are aligned in the spacing direction.

[0071] Continue to refer to Figure 4 The first grounding pad 33 has an inner region 33P and an outer region 33Q. The inner region 33P is the area closer to the first signal pad 35 relative to a dividing line 33R, which divides the pad area of ​​the first grounding pad 33 in the spacing direction. The outer region 33Q is the area farther away from the first signal pad 35 relative to the dividing line 33R. The first grounding pad 33 has a shape symmetrical with respect to the dividing line 33R in the spacing direction. The dividing line 33R is a straight line extending along the width direction, dividing the pad area of ​​the first grounding pad 33 in the spacing direction into two equal parts. The area of ​​the inner region 33P is equal to the area of ​​the outer region 33Q.

[0072] Similarly, the second grounding pad 34 has an inner region 34P and an outer region 34Q. The inner region 34P is the area closer to the second signal pad 36 relative to the dividing line 34R, which divides the pad area of ​​the second grounding pad 34 in the spacing direction. The outer region 34Q is the area further away from the second signal pad 36 relative to the dividing line 34R. The second grounding pad 34 has a shape symmetrical with respect to the dividing line 34R in the spacing direction. The dividing line 34R is a straight line extending along the width direction, dividing the pad area of ​​the second grounding pad 34 in the spacing direction into two equal parts. The area of ​​the inner region 34P is equal to the area of ​​the outer region 34Q.

[0073] Next reference Figure 9 The sixth conductor layer 6CL6 is described below. Figure 9 As shown, the sixth conductor layer 6CL6 includes: a first ground pad 43, a second ground pad 44, a first signal pad 45, and a second signal pad 46, respectively corresponding to... Figure 4 The first grounding pad 33, the second grounding pad 34, the first signal pad 35, and the second signal pad 36 are shown.

[0074] The first grounding pad 43 includes a first through-hole connection portion 43A and a second through-hole connection portion 43B. Although the first through-hole connection portion 43A and the second through-hole connection portion 43B are separated from each other in the width direction, they can also be integrally formed.

[0075] The second grounding pad 44 includes a first through-hole connection portion 44A and a second through-hole connection portion 44B. Although the first through-hole connection portion 44A and the second through-hole connection portion 44B are separated from each other in the width direction, they can also be integrally formed.

[0076] The first through-hole connection portion 43A of the first grounding pad 43 passes through Figure 5 The via 50A and similar components shown are electrically connected to Figure 4 The first through-hole connection portion 33B of the first grounding pad 33 is shown. Similarly, the second through-hole connection portion 43B of the first grounding pad 43 is connected via... Figure 5 The via 50B and similar components shown are electrically connected to Figure 4 The second through-hole connection portion 33C of the first grounding pad 33 shown.

[0077] The first through-hole connection portion 44A of the second grounding pad 44 passes through Figure 5 The via 51A and similar components shown are electrically connected to Figure 4The first through-hole connection portion 34B of the second grounding pad 34 is shown. Similarly, the second through-hole connection portion 44B of the second grounding pad 44 is connected via... Figure 5 The via 51B and similar components shown are electrically connected to Figure 4 The second through-hole connection portion 34C of the second grounding pad 34 shown.

[0078] The first signal pad 45 passes through Figure 5 The via 52 and similar components shown are electrically connected to Figure 4 The via connection portion 35B of the first signal pad 35 shown.

[0079] The second signal pad 46 passes through Figure 5 The via 53 and similar components shown are electrically connected to Figure 4 The via connection portion 36B of the second signal pad 36 shown.

[0080] The following is combined Figures 5 to 8 The second conductor layer 6CL2 to the fifth conductor layer 6CL5 are described. The second conductor layer 6CL2 to the fifth conductor layer 6CL5 are connected to each other through vias 50A, 50B, 51A and 51B, and each of them serves as a ground layer.

[0081] like Figure 5 As shown, the second conductor layer 6CL2 has a through-hole 55. The through-hole 55 has an inner edge 55A. Figure 5 In this structure, vias 52 and 53 are disposed inside the inner edge 55A of the perforation 55. Vias 50A, 50B, 51A, and 51B are disposed outside the inner edge 55A of the perforation 55. The perforation 55 includes a generally rectangular portion 55B and two extensions 55C extending from the rectangular portion 55B along the spacing direction. One of the two extensions 55C extends between vias 50A and 50B, while the other extends between vias 51A and 51B.

[0082] like Figure 6 As shown, the third conductor layer 6CL3 has a through-hole 56. The through-hole 56 has an inner edge 56A. Figure 6 In this structure, vias 52 and 53 are disposed inside the inner edge 56A of the perforation 56. Vias 50A, 50B, 51A, and 51B are disposed outside the inner edge 56A of the perforation 56. The perforation 56 is generally rectangular.

[0083] like Figure 7As shown, the fourth conductor layer 6CL4 has a through-hole 57. The through-hole 57 has an inner edge 57A. Figure 7 In this structure, vias 52 and 53 are disposed inside the inner edge 57A of the perforation 57. Vias 50A, 50B, 51A, and 51B are disposed outside the inner edge 57A of the perforation 57. The perforation 57 is generally rectangular.

[0084] like Figure 8 As shown, the fifth conductor layer 6CL5 has two through-holes 58. Each through-hole 58 has an inner edge 58A. Figure 8 In this configuration, vias 52 and 53 are respectively disposed on the inner side of the inner edge 58A of the two perforations 58. Vias 50A, 50B, 51A, and 51B are disposed on the outer side of the inner edge 58A of the two perforations 58. Each perforation 58 is approximately circular.

[0085] Figure 10 This is a projection diagram showing the inner edges 55A of the perforation 55, 56A of the perforation 56, and 57A of the perforation 57 projected onto the first conductor layer 6CL1, used to illustrate the positional relationship of the perforations 55, 56, and 57 relative to the first conductor layer 6CL1. The inner edges 55A of the perforations 55, 56A of the perforations 56, and 57A of the perforations 57 are represented by thick lines, and the first ground pad 33, the second ground pad 34, the first signal pad 35, and the second signal pad 36 are represented by double-dotted lines. For ease of explanation, the outer regions 33Q of the first ground pad 33 and 34Q of the second ground pad 34 are represented by shaded lines.

[0086] like Figure 10 As shown, in the contact plate 6, when viewed from the vertical direction, the perforation 55 is formed such that both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 55A of the perforation 55. Specifically, the inner edge 55A of the perforation 55 surrounds the first signal pad 35 and the second signal pad 36. In other words, the first signal pad 35 and the second signal pad 36 overlap with the perforation 55, which is formed continuously.

[0087] Furthermore, when viewed vertically, the perforation 55 is formed to overlap with the outer region 33Q of the first grounding pad 33 and the outer region 34Q of the second grounding pad 34. Specifically, one extension 55C of the perforation 55 extends from the rectangular portion 55B along the spacing direction through the dividing line 33R to overlap with the outer region 33Q of the first grounding pad 33, while the other extension 55C extends from the rectangular portion 55B along the spacing direction through the dividing line 34R to overlap with the outer region 34Q of the second grounding pad 34.

[0088] Specifically, the rectangular portion 55B of the perforation 55 does not overlap with the first through-hole connection portion 33B and the second through-hole connection portion 33C of the first grounding pad 33 and the first through-hole connection portion 34B and the second through-hole connection portion 34C of the second grounding pad 34, but contacts the first through-hole connection portion 33B and the second through-hole connection portion 33C of the first grounding pad 33 and the first through-hole connection portion 34B and the second through-hole connection portion 34C of the second grounding pad 34 in the spacing direction.

[0089] The two extensions 55C of the perforation 55 do not overlap with the first through-hole connection portion 33B and the second through-hole connection portion 33C of the first grounding pad 33 and the first through-hole connection portion 34B and the second through-hole connection portion 34C of the second grounding pad 34, but contact the first through-hole connection portion 33B and the second through-hole connection portion 33C of the first grounding pad 33 and the first through-hole connection portion 34B and the second through-hole connection portion 34C of the second grounding pad 34 in the width direction.

[0090] Therefore, the two dividing lines 55D that divide the two extensions 55C in the inner edge 55A of the perforation 55 in the spacing direction are relatively far apart from the first signal pad 35 and the second signal pad 36 in the spacing direction. This means that the second conductor layer 6CL2 is far away from the first signal pad 35 and the second signal pad 36 in the spacing direction. This allows for control over the reduction of differential impedance in the first signal pad 35 and the second signal pad 36.

[0091] Continue to refer to Figure 10In the contact plate 6, when viewed vertically, the perforations 56 and 57 are formed to completely overlap each other. Specifically, when viewed vertically, the inner edge 56A of the perforation 56 overlaps with the inner edge 57A of the perforation 57. The perforation 56 is formed such that both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 56A of the perforation 56. Specifically, the inner edge 56A of the perforation 56 surrounds the first signal pad 35 and the second signal pad 36. In other words, the first signal pad 35 and the second signal pad 36 overlap with the perforation 56, which is formed in a continuous manner. The same applies to the perforation 57.

[0092] <Mounting Plate 7>

[0093] Figures 11 to 17 This is a partial plan view of the first conductor layer 7CL1, the second conductor layer 7CL2, the third conductor layer 7CL3, the fourth conductor layer 7CL4, the fifth conductor layer 7CL5, and the sixth conductor layer 7CL6 of the mounting plate 7. Figures 11 to 17 In the diagram, the conductor portion is indicated by a shaded line for easier observation.

[0094] First refer to Figure 1 and Figure 11 The first conductor layer 7CL1 is described. (As...) Figure 1 and Figure 11 As shown, the first conductor layer 7CL1 includes a plurality of electrode pads 60, each corresponding to one of the plurality of crimping members 11 of the compression connector 5. Specifically, the solder portion 20 of the corresponding crimping member 11 can be soldered to each electrode pad 60. The plurality of electrode pads 60 form a plurality of pad rows, just like the plurality of crimping members 11.

[0095] like Figure 11 As shown, in each pad row of electrode pads 60, two ground pads 61 and two signal pads 62 are arranged alternately in the spacing direction. Specifically, ground pad 61, ground pad 61, signal pad 62, signal pad 62, ground pad 61, ground pad 61, signal pad 62, signal pad 62, etc., are arranged in this described order along the spacing direction. In other words, the two signal pads 62 used for differential transmission are disposed between the two ground pads 61. Figure 11 Only four electrode pads 60 are shown. Figure 11The four electrode pads 60 shown include two ground pads 61 and two signal pads 62 disposed between the two ground pads 61. The two ground pads 61 include a first ground pad 63 and a second ground pad 64. The two signal pads 62 include a first signal pad 65 and a second signal pad 66. The first ground pad 63, the first signal pad 65, the second signal pad 66, and the second ground pad 64 are arranged sequentially along the spacing direction.

[0096] The first signal pad 65 is generally square. The dimension of the first signal pad 65 in the spacing direction is smaller than... Figure 4 The dimensions of the first signal pad 35 shown are illustrated. Similarly, the dimension of the first signal pad 65 in the width direction is smaller than... Figure 4 The dimensions of the first signal pad 35 shown are illustrated.

[0097] The second signal pad 66 is generally square. The dimension of the second signal pad 66 in the spacing direction is smaller than that of the second signal pad 66. Figure 4 The dimensions of the second signal pad 36 are shown. Similarly, the dimension of the second signal pad 66 in the width direction is smaller than that of the second signal pad 36. Figure 4 The dimensions of the second signal pad 36 shown are illustrated.

[0098] In this manner, the first signal pad 35 and the second signal pad 36 of the contact plate 6 are larger than the first signal pad 65 and the second signal pad 66 of the mounting plate 7, so as to absorb the displacement of the contact plate 6 relative to the compression connector 5 in the pitch direction and the width direction.

[0099] Refer again Figure 11 The first grounding pad 63 and the second grounding pad 64 extend in the width direction.

[0100] like Figure 11 As shown, the first signal pad 65 and the second signal pad 66 have the same shape, and the first ground pad 63 and the second ground pad 64 have the same shape.

[0101] Continue to refer to Figure 11 The first grounding pad 63 has an inner region 63P and an outer region 63Q. The inner region 63P is the region closer to the first signal pad 65 than the dividing line 63R that divides the pad region of the first grounding pad 63 in the spacing direction. The outer region 63Q is the region farther away from the first signal pad 65 than the dividing line 63R. The first grounding pad 63 has a shape that is symmetrical with respect to the dividing line 63R in the spacing direction.

[0102] Similarly, the second grounding pad 64 has an inner region 64P and an outer region 64Q. The inner region 64P is the region closer to the second signal pad 66 than the dividing line 64R that divides the pad region of the second grounding pad 64 into two halves in the spacing direction. The outer region 64Q is the region farther away from the second signal pad 66 than the dividing line 64R. The second grounding pad 64 has a shape that is symmetrical with respect to the dividing line 64R in the spacing direction.

[0103] Next, refer to Figure 16 The sixth conductor layer 7CL6 is described below. Figure 16 As shown, the sixth conductor layer 7CL6 includes: a first ground pad 73, a second ground pad 74, a first signal pad 75, and a second signal pad 76, respectively corresponding to... Figure 11 The first grounding pad 63, the second grounding pad 64, the first signal pad 65, and the second signal pad 66 are shown.

[0104] The first grounding pad 73 includes a first through-hole connection portion 73A and a second through-hole connection portion 73B. Although the first through-hole connection portion 73A and the second through-hole connection portion 73B are separated from each other in the width direction, they can be integrally formed.

[0105] The second grounding pad 74 includes a first through-hole connection portion 74A and a second through-hole connection portion 74B. Although the first through-hole connection portion 74A and the second through-hole connection portion 74B are separated from each other in the width direction, they can be integrally formed.

[0106] The first through-hole connection portion 73A of the first grounding pad 73 is connected through Figure 12 The via 80A and similar components shown are Figure 11 The first grounding pad 63 shown is electrically connected at its end 63A in the width direction. Similarly, the second through-hole connection portion 73B of the first grounding pad 73 is connected via... Figure 12 The via 80B and similar components shown are Figure 11 The first grounding pad 63 shown is electrically connected at its end 63A in the width direction.

[0107] The first through-hole connection portion 74A of the second grounding pad 74 passes through Figure 12 The via 81A and similar components shown are Figure 11 The second grounding pad 64 shown is electrically connected at its end 64A in the width direction. Similarly, the second through-hole connection portion 74B of the second grounding pad 74 is connected via... Figure 12 The via 81B and similar components shown are Figure 11 The second grounding pad 64 shown is electrically connected at its end 64A in the width direction.

[0108] The first signal pad 75 passes through Figure 12 The via 82 and similar components shown are Figure 11 The first signal pad 65 shown is electrically connected.

[0109] The second signal pad 76 passes through Figure 12 The via 83 and similar components shown are Figure 11 The second signal pad 66 shown is electrically connected.

[0110] The second conductor layer 7CL2 to the fifth conductor layer 7CL5 are referred to hereinafter. Figures 12 to 15 The second conductor layer 7CL2 to the fifth conductor layer 7CL5 are interconnected through vias 80A, 80B, 81A, and 81B, and each of them serves as a ground layer.

[0111] like Figure 12 As shown, the second conductor layer 7CL2 has a through-hole 85. The through-hole 85 has an inner edge 85A. Figure 12 In this structure, vias 82 and 83 are disposed inside the inner edge 85A of the perforation 85. Vias 80A, 80B, 81A, and 81B are disposed outside the inner edge 85A of the perforation 85. The perforation 85 is generally rectangular.

[0112] like Figure 13 As shown, the third conductor layer 7CL3 has a through-hole 86. The through-hole 86 has an inner edge 86A. Figure 13 In this structure, vias 82 and 83 are disposed inside the inner edge 86A of the perforation 86. Vias 80A, 80B, 81A, and 81B are disposed outside the inner edge 86A of the perforation 86. The perforation 86 is generally rectangular.

[0113] like Figure 14 As shown, the fourth conductor layer 7CL4 has a through-hole 87. The through-hole 87 has an inner edge 87A. Figure 14 In this structure, vias 82 and 83 are disposed inside the inner edge 87A of the perforation 87. Vias 80A, 80B, 81A, and 81B are disposed outside the inner edge 87A of the perforation 87. The perforation 87 is generally rectangular.

[0114] like Figure 15 As shown, the fifth conductor layer 7CL5 has two through-holes 88. Each through-hole 88 has an inner edge 88A. Figure 15In this configuration, vias 82 and 83 are respectively disposed on the inner side of the inner edge 88A of the two perforations 88. Vias 80A, 80B, 81A, and 81B are disposed on the outer side of the inner edge 88A of the two perforations 88. Each perforation 88 is approximately circular.

[0115] Figure 17 This is a projection diagram showing the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 projected onto the first conductor layer 7CL1. It is used to illustrate the positional relationship of the perforations 85, 86, and 87 relative to the first conductor layer 7CL1. The inner edges 85A of the perforations 85, 86A of the perforations 86, and 87A of the perforations 87 are represented by thick lines, and the first grounding pad 63, the second grounding pad 64, the first signal pad 65, and the second signal pad 66 are represented by double-dotted lines.

[0116] like Figure 17 As shown, in the mounting plate 7, the perforation 85 is formed such that, when viewed in the vertical direction, both the first signal pad 65 and the second signal pad 66 are located inside the inner edge 85A of the perforation 85. Specifically, the inner edge 85A of the perforation 85 surrounds the first signal pad 65 and the second signal pad 66. In other words, the first signal pad 65 and the second signal pad 66 overlap with the perforation 85, which is formed continuously.

[0117] Furthermore, when viewed vertically, the perforation 85 is separated from the first ground pad 63 and the second ground pad 64 in the spacing direction. Specifically, in the inner edge 85A of the perforation 85, one of the two dividing lines 85D that divide the perforation 85 in the spacing direction is located between the first ground pad 63 and the first signal pad 65, and is equidistant from the first ground pad 63 and the first signal pad 65; the other dividing line 85D is located between the second ground pad 64 and the second signal pad 66 in the spacing direction, and is equidistant from the second ground pad 64 and the second signal pad 66.

[0118] The dimensions of the first signal pad 65 and the second signal pad 66 in the spacing direction are smaller than Figure 10 The dimensions of the first signal pad 35 and the second signal pad 36 shown are such that the differential impedance is not significantly reduced due to parasitic capacitance. Therefore, this is to reduce the opening area of ​​the via 85 in the second conductor layer 7CL2 and to prioritize the electromagnetic shielding effect of the second conductor layer 7CL2.

[0119] Continue to refer to Figure 17In the mounting plate 7, when viewed from a vertical direction, the perforations 85, 86, and 87 are formed to completely overlap each other. Specifically, when viewed from a vertical direction, the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 overlap. Therefore, the perforation 86 is formed such that both the first signal pad 65 and the second signal pad 66 are located inside the inner edge 86A of the perforation 86. Specifically, the inner edge 86A of the perforation 86 surrounds the first signal pad 65 and the second signal pad 66. In other words, the first signal pad 65 and the second signal pad 66 overlap with the perforation 86, which is formed in a continuous manner. The same applies to the perforation 87.

[0120] (First variation)

[0121] The following reference Figure 18 and Figure 19 A first variation of the first embodiment is described. Figure 18 and Figure 19 In the diagram, the conductor portion is indicated by a shaded line for easier observation.

[0122] like Figure 18 As shown, in the first modified example, the third conductor layer 6CL3 and the fourth conductor layer 6CL4 have the same... Figure 8 The fifth conductor layer 6CL5 shown has the same structure. Specifically, as... Figure 18 As shown, the third conductor layer 6CL3 and the fourth conductor layer 6CL4 have two through holes 90. Each through hole 90 has an inner edge 90A. Vias 52 and vias 53 are located inside the inner edges 90A of the two through holes 90, respectively. Vias 50A, 50B, 51A, and 51B are located outside the inner edges 90A of the two through holes 90. Each through hole 90 is generally circular.

[0123] In this way, the two vias 90 formed in the third conductor layer 6CL3 and the fourth conductor layer 6CL4 have the minimum necessary dimensions that prevent the third conductor layer 6CL3 and the fourth conductor layer 6CL4 from being continuous with the vias 52 and 53. Therefore, when viewed in the vertical direction, the third conductor layer 6CL3 and the fourth conductor layer 6CL4 are... Figure 18 The first signal pad 35 and the second signal pad 36, as shown by the double-dotted line, overlap. This design prioritizes the electromagnetic shielding effect of the third conductor layer 6CL3 and the fourth conductor layer 6CL4.

[0124] Similarly, as Figure 19 As shown, in the first modified example, the third conductor layer 7CL3 and the fourth conductor layer 7CL4 have the same... Figure 15The fifth conductor layer 7CL5 shown has the same structure. Specifically, as... Figure 19 As shown, the third conductor layer 7CL3 and the fourth conductor layer 7CL4 have two through holes 91. Each through hole 91 has an inner edge 91A. Vias 82 and 83 are located inside the inner edges 91A of the two through holes 91, respectively. Vias 80A, 80B, 81A, and 81B are located outside the inner edges 91A of the two through holes 91. Each through hole 91 is approximately circular.

[0125] In this way, the two vias 91 formed in the third conductor layer 7CL3 and the fourth conductor layer 7CL4 have the minimum necessary dimensions that prevent the third conductor layer 7CL3 and the fourth conductor layer 7CL4 from being continuous with the vias 82 and 83. Therefore, when viewed in the vertical direction, the third conductor layer 7CL3 and the fourth conductor layer 7CL4 are... Figure 19 The first signal pad 65 and the second signal pad 66, indicated by the double-dotted line, overlap. This design prioritizes the electromagnetic shielding effect of the third conductor layer 7CL3 and the fourth conductor layer 7CL4.

[0126] The first variation described above can be directly applied to the first to fourth comparative examples described below.

[0127] (First comparative example)

[0128] The following is for reference. Figure 20 and 21 The first comparative example of the present invention is described below. The differences between this comparative example and the first embodiment described above will be mainly explained below, with repeated descriptions omitted.

[0129] <Contact Plate 6>

[0130] Figure 20 This is a projection diagram showing the inner edges 55A of the perforation 55, 56A of the perforation 56, and 57A of the perforation 57 projected onto the first conductor layer 6CL1, used to illustrate the positional relationship of the perforations 55, 56, and 57 relative to the first conductor layer 6CL1. The inner edges 55A of the perforations 55, 56A of the perforations 56, and 57A of the perforations 57 are represented by thick lines, and the first ground pad 33, the second ground pad 34, the first signal pad 35, and the second signal pad 36 are represented by double-dotted lines. For ease of explanation, the outer regions 33Q of the first ground pad 33 and 34Q of the second ground pad 34 are represented by shaded lines.

[0131] like Figure 20 As shown, the contact plate 6 in this comparative example is the same as the one described above. Figure 10The contact plate 6 in the first embodiment shown has the same structure.

[0132] Specifically, such as Figure 20 As shown, in the contact plate 6, the perforation 55 is formed such that, when viewed in the vertical direction, both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 55A of the perforation 55. Specifically, the inner edge 55A of the perforation 55 surrounds the first signal pad 35 and the second signal pad 36. In other words, the first signal pad 35 and the second signal pad 36 overlap with the perforation 55, which is formed in a continuous manner.

[0133] Furthermore, the perforation 55 is formed to overlap with the outer regions 33Q of the first grounding pad 33 and the second grounding pad 34 when viewed in the vertical direction. Specifically, one extension 55C of the perforation 55 extends from the rectangular portion 55B along the spacing direction through the dividing line 33R to overlap with the outer region 33Q of the first grounding pad 33, while the other extension 55C extends from the rectangular portion 55B along the spacing direction through the dividing line 34R to overlap with the outer region 34Q of the second grounding pad 34.

[0134] Therefore, the two dividing lines 55D that divide the two extensions 55C in the inner edge 55A of the perforation 55 in the spacing direction are relatively far apart from the first signal pad 35 and the second signal pad 36 in the spacing direction. This means that the second conductor layer 6CL2 is far away from the first signal pad 35 and the second signal pad 36 in the spacing direction. This allows for control over the reduction of differential impedance in the first signal pad 35 and the second signal pad 36.

[0135] <Mounting Plate 7>

[0136] Figure 21 This is a projection diagram showing the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 projected onto the first conductor layer 7CL1, used to illustrate the positional relationship of the perforations 85, 86, and 87 relative to the first conductor layer 7CL1. The inner edges 85A of the perforations 85, 86A of the perforations 86, and 87A of the perforations 87 are represented by thick lines, and the first ground pad 63, the second ground pad 64, the first signal pad 65, and the second signal pad 66 are represented by double-dotted lines. For ease of explanation, the outer regions 63Q of the first ground pad 63 and 64Q of the second ground pad 64 are represented by shaded lines.

[0137] like Figure 21As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 85 in the second conductor layer 7CL2, while the other structures are the same as in the first embodiment. Specifically, the perforation 85 in this comparative example is larger in the spacing direction than... Figure 17 The perforation in the first embodiment shown is 85 cm wide.

[0138] Specifically, such as Figure 21 As shown, the through hole 85 has a generally rectangular portion 85B and two extensions 85C extending from the rectangular portion 85B along the spacing direction. One of the two extensions 85C extends between the through hole 80A and the through hole 80B, while the other extends between the through hole 81A and the through hole 81B.

[0139] Furthermore, the perforation 85 is formed to overlap with the outer region 63Q of the first grounding pad 63 and the outer region 64Q of the second grounding pad 64 when viewed in the vertical direction. Specifically, one extension 85C of the perforation 85 extends from the rectangular portion 85B along the spacing direction through the dividing line 63R to overlap with the outer region 63Q of the first grounding pad 63, while the other extension 85C extends from the rectangular portion 85B along the spacing direction through the dividing line 64R to overlap with the outer region 64Q of the second grounding pad 64.

[0140] Therefore, the two dividing lines 85D that divide the two extensions 85C in the inner edge 85A of the perforation 85 in the spacing direction are relatively far apart from the first signal pad 65 and the second signal pad 66 in the spacing direction. This means that the second conductor layer 7CL2 is far away from the first signal pad 65 and the second signal pad 66 in the spacing direction. This allows for control over the reduction of differential impedance in the first signal pad 65 and the second signal pad 66.

[0141] (Second Comparative Example)

[0142] The following is for reference. Figure 22 and Figure 23 The second comparative example of the present invention is described below. The differences between this comparative example and the first embodiment described above will be mainly explained below; repeated details will not be repeated.

[0143] <Contact Plate 6>

[0144] Figure 22This is a projection diagram showing the inner edges 55A of the perforation 55, 56A of the perforation 56, and 57A of the perforation 57 projected onto the first conductor layer 6CL1, used to illustrate the positional relationship of the perforations 55, 56, and 57 relative to the first conductor layer 6CL1. The inner edges 55A of the perforations 55, 56A of the perforations 56, and 57A of the perforations 57 are represented by thick lines, and the first ground pad 33, the second ground pad 34, the first signal pad 35, and the second signal pad 36 are represented by double-dotted lines. For ease of explanation, the outer regions 33Q of the first ground pad 33 and 34Q of the second ground pad 34 are represented by shaded lines.

[0145] like Figure 22 As shown, the contact plate 6 in this comparative example is the same as the one described above. Figure 10 The contact plate 6 in the first embodiment shown has the same structure.

[0146] Specifically, such as Figure 22 As shown, in the contact plate 6, when viewed from the vertical direction, the perforation 55 is formed such that both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 55A of the perforation 55. Specifically, the inner edge 55A of the perforation 55 surrounds the first signal pad 35 and the second signal pad 36. In other words, the first signal pad 35 and the second signal pad 36 overlap with the perforation 55, which is formed continuously.

[0147] Furthermore, the perforation 55 is formed to overlap with the outer regions 33Q of the first grounding pad 33 and the second grounding pad 34 when viewed in the vertical direction. Specifically, one extension 55C of the perforation 55 extends from the rectangular portion 55B along the spacing direction through the dividing line 33R to overlap with the outer region 33Q of the first grounding pad 33, while the other extension 55C extends from the rectangular portion 55B along the spacing direction through the dividing line 34R to overlap with the outer region 34Q of the second grounding pad 34.

[0148] Therefore, the two dividing lines 55D that divide the two extensions 55C in the inner edge 55A of the perforation 55 in the spacing direction are relatively far apart from the first signal pad 35 and the second signal pad 36 in the spacing direction. This means that the second conductor layer 6CL2 is far away from the first signal pad 35 and the second signal pad 36 in the spacing direction. This allows for control over the reduction of differential impedance in the first signal pad 35 and the second signal pad 36.

[0149] <Mounting Plate 7>

[0150] Figure 23This is a projection diagram showing the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 projected onto the first conductor layer 7CL1, used to illustrate the positional relationship of the perforations 85, 86, and 87 relative to the first conductor layer 7CL1. The inner edges 85A of the perforations 85, 86A of the perforations 86, and 87A of the perforations 87 are represented by thick lines, and the first ground pad 63, the second ground pad 64, the first signal pad 65, and the second signal pad 66 are represented by double-dotted lines. For ease of explanation, the inner region 63P and the outer region 63Q of the first ground pad 63, and the inner region 64P and the outer region 64Q of the second ground pad 64 are represented by shaded lines.

[0151] like Figure 23 As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 85 in the second conductor layer 7CL2; the other structures are the same as in the first embodiment. Specifically, the perforation 85 in this comparative example is larger in the spacing direction than... Figure 17 The perforation 85 in the first embodiment shown is also wide.

[0152] Specifically, such as Figure 23 As shown, the perforation 85 is formed so that it does not overlap with the outer region 63Q of the first grounding pad 63 and the outer region 64Q of the second grounding pad 64 when viewed in the vertical direction. Furthermore, the perforation 85 is formed so that it does not overlap with the inner region 63P of the first grounding pad 63 and the inner region 64P of the second grounding pad 64 when viewed in the vertical direction. However, when viewed in the vertical direction, the perforation 85 extends in the spacing direction to contact the inner region 63P of the first grounding pad 63 and the inner region 64P of the second grounding pad 64.

[0153] Specifically, in the inner edge 85A of the perforation 85, one of the two dividing lines 85D that divide the perforation 85 along the spacing direction overlaps with the outline 63S of the first ground pad 63 on the first signal pad 65 side, and the other overlaps with the outline 64S of the second ground pad 64 on the second signal pad 66 side. In this way, the second conductor layer 7CL2 is moved away from the first signal pad 65 and the second signal pad 66 in the spacing direction. The purpose is to control the reduction of differential impedance in the first signal pad 65 and the second signal pad 66, reduce the opening area of ​​the perforation 85 of the second conductor layer 7CL2, and enhance the electromagnetic shielding effect of the second conductor layer 7CL2.

[0154] However, in this comparative example, when viewed in the vertical direction, the perforation 85 can also be formed to overlap with the inner region 63P of the first grounding pad 63 and the inner region 64P of the second grounding pad 64, as long as it does not overlap with the outer region 63Q of the first grounding pad 63 and the outer region 64Q of the second grounding pad 64. Specifically, the perforation 85 can pass through the outline 63S of the first grounding pad 63 in the spacing direction and overlap with the inner region 63P, and can also pass through the outline 64S of the second grounding pad 64 in the spacing direction and overlap with the inner region 64P. In this case, the effects of controlling the reduction of differential impedance in the first signal pad 65 and the second signal pad 66 and the electromagnetic shielding effect of the second conductor layer 7CL2 are simultaneously achieved.

[0155] (Third comparative example)

[0156] The following is for reference. Figure 24 and Figure 25 The third comparative example of the present invention is described below. The differences between this comparative example and the first embodiment described above will be mainly explained below; repeated details will not be repeated.

[0157] <Contact Plate 6>

[0158] Figure 24 This is a projection diagram showing the inner edges 55A of the perforation 55, 56A of the perforation 56, and 57A of the perforation 57 projected onto the first conductor layer 6CL1, used to illustrate the positional relationship of the perforations 55, 56, and 57 relative to the first conductor layer 6CL1. The inner edges 55A of the perforations 55, 56A of the perforations 56, and 57A of the perforations 57 are represented by thick lines, and the first ground pad 33, the second ground pad 34, the first signal pad 35, and the second signal pad 36 are represented by double-dotted lines. For ease of explanation, the inner region 33P and the outer region 33Q of the first ground pad 33, and the inner region 34P and the outer region 34Q of the second ground pad 34 are represented by shaded lines.

[0159] like Figure 24 As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 55 in the first conductor layer 6CL1; the other structures are the same as in the first embodiment. Specifically, the perforation 55 in this comparative example is larger in the spacing direction than... Figure 10 The perforation 55 in the first embodiment shown is narrow. Further, the perforation 55 in this comparative example is generally rectangular.

[0160] Specifically, such as Figure 24As shown, when viewed in the vertical direction, the perforation 55 is formed so as not to overlap with the outer region 33Q of the first ground pad 33 and the outer region 34Q of the second ground pad 34. However, the perforation 55 extends in the spacing direction so as to overlap with the inner region 33P of the first ground pad 33 and the inner region 34P of the second ground pad 34 when viewed in the vertical direction. Specifically, the perforation 55 passes through the outline 33S of the first ground pad 33 on the side of the first signal pad 35 in the spacing direction and overlaps with the inner region 33P, and further passes through the outline 34S of the second ground pad 34 on the side of the second ground pad 34 in the spacing direction and overlaps with the inner region 34P. In this way, the second conductor layer 6CL2 is moved away from the first signal pad 35 and the second signal pad 36 in the spacing direction, the purpose of which is to control the reduction of differential impedance in the first signal pad 35 and the second signal pad, reduce the opening area of ​​the perforation 55 of the second conductor layer 6CL2, and improve the electromagnetic shielding effect of the second conductor layer 6CL2.

[0161] It should be noted that in this comparative example, one of the two dividing lines 55D that divide the perforation 55 along the spacing direction in the inner edge 55A of the perforation 55 can overlap with the outline 33S of the first grounding pad 33, while the other can overlap with the outline 34S of the second grounding pad 34. In other words, the perforation 55 can be formed to contact the inner regions 33P of the first grounding pad 33 and the inner regions 34P of the second grounding pad 34 when viewed in the vertical direction. Similarly, in this case, the effects of reducing the differential impedance in the first signal pad 35 and the second signal pad 36 and the electromagnetic shielding effect of the second conductor layer 6CL2 are simultaneously achieved.

[0162] <Mounting Plate 7>

[0163] Figure 25 This is a projection diagram showing the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 projected onto the first conductor layer 7CL1, used to illustrate the positional relationship of the perforations 85, 86, and 87 relative to the first conductor layer 7CL1. The inner edges 85A of the perforations 85, 86A of the perforations 86, and 87A of the perforations 87 are represented by thick lines, and the first ground pad 63, the second ground pad 64, the first signal pad 65, and the second signal pad 66 are represented by double-dotted lines. For ease of explanation, the outer regions 63Q of the first ground pad 63 and 64Q of the second ground pad 64 are represented by shaded lines.

[0164] like Figure 25As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 85 in the second conductor layer 7CL2; the other structures are the same as in the first embodiment. Specifically, the perforation 85 in this comparative example is larger in the spacing direction than... Figure 17 The perforation 85 in the first embodiment shown is also wide.

[0165] Specifically, such as Figure 25 As shown, the perforation 85 has a generally rectangular portion 85B and two extensions 85C extending from the rectangular portion 85B along the spacing direction. One of the two extensions 85C extends between the via 80A and the via 80B, while the other extends between the via 81A and the via 81B.

[0166] Furthermore, the perforation 85 is formed to overlap with the outer regions 63Q of the first grounding pad 63 and the outer regions 64Q of the second grounding pad 64 when viewed in the vertical direction. Specifically, one extension 85C of the perforation 85 extends from the rectangular portion 85B along the spacing direction through the dividing line 63R to overlap with the outer region 63Q of the first grounding pad 63, while the other extension 85C extends from the rectangular portion 85B along the spacing direction through the dividing line 64R to overlap with the outer region 64Q of the second grounding pad 64.

[0167] Therefore, the two dividing lines 85D that divide the two extensions 85C in the inner edge 85A of the perforation 85 in the spacing direction are relatively far apart from the first signal pad 65 and the second signal pad 66 in the spacing direction. This means that the second conductor layer 7CL2 is far away from the first signal pad 65 and the second signal pad 66 in the spacing direction. This allows for control over the reduction of differential impedance in the first signal pad 65 and the second signal pad 66.

[0168] (Fourth Comparative Example)

[0169] The following is for reference. Figure 26 and Figure 27 The fourth comparative example of the present invention is described below. The differences between this comparative example and the first embodiment described above will be mainly explained below; repeated details will not be repeated.

[0170] <Contact Plate 6>

[0171] Figure 26This is a projection diagram showing the inner edges 55A of the perforation 55, 56A of the perforation 56, and 57A of the perforation 57 projected onto the first conductor layer 6CL1. It is used to illustrate the positional relationship of the perforations 55, 56, and 57 relative to the first conductor layer 6CL1. The inner edges 55A of the perforations 55, 56A of the perforations 56, and 57A of the perforations 57 are represented by thick lines, and the first grounding pad 33, the second grounding pad 34, the first signal pad 35, and the second signal pad 36 are represented by double-dotted lines.

[0172] like Figure 26 As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 55 in the first conductor layer 6CL1; the other structures are the same as in the first embodiment. Specifically, the perforation 55 in this comparative example is larger in the spacing direction than... Figure 10 The perforation 55 in the first embodiment shown is also narrow. Furthermore, the perforation 55 in this comparative example is generally rectangular.

[0173] Specifically, such as Figure 26 As shown, the perforation 55 is formed to be separated from the first ground pad 33 and the second ground pad 34 in the spacing direction when viewed in the vertical direction. Specifically, of the two dividing lines 55D that divide the perforation 55 in the spacing direction, one dividing line 55D is located between and equidistant from the first ground pad 33 and the first signal pad 35 in the spacing direction, and the other dividing line 55D is located between and equidistant from the second ground pad 34 and the second signal pad 36 in the spacing direction. In this way, this design reduces the opening area of ​​the perforation 55 in the second conductor layer 6CL2 and prioritizes the electromagnetic shielding effect of the second conductor layer 6CL2.

[0174] <Mounting Plate 7>

[0175] Figure 27 This is a projection diagram showing the inner edges 85A of the perforation 85, 86A of the perforation 86, and 87A of the perforation 87 projected onto the first conductor layer 7CL1, used to illustrate the positional relationship of the perforations 85, 86, and 87 relative to the first conductor layer 7CL1. The inner edges 85A of the perforations 85, 86A of the perforations 86, and 87A of the perforations 87 are represented by thick lines, and the first ground pad 63, the second ground pad 64, the first signal pad 65, and the second signal pad 66 are represented by double-dotted lines. For ease of explanation, the outer regions 63Q of the first ground pad 63 and 64Q of the second ground pad 64 are represented by shaded lines.

[0176] like Figure 27 As shown, the difference between this comparative example and the first embodiment described above lies in the shape of the perforation 85 in the second conductor layer 7CL2; the other structures are the same as in the first embodiment. Specifically, the perforation 85 in this comparative example is larger in the spacing direction than... Figure 17 The perforation in the first embodiment shown is 85 cm wide.

[0177] Specifically, such as Figure 27 As shown, the perforation 85 has a generally rectangular portion 85B and two extensions 85C extending from the rectangular portion 85B along the spacing direction. One of the two extensions 85C extends between the via 80A and the via 80B, while the other extends between the via 81A and the via 81B.

[0178] Furthermore, the perforation 85 is formed to overlap with the outer regions 63Q of the first grounding pad 63 and the outer regions 64Q of the second grounding pad 64 when viewed in the vertical direction. Specifically, one extension 85C of the perforation 85 extends from the rectangular portion 85B along the spacing direction through the dividing line 63R to overlap with the outer region 63Q of the first grounding pad 63, while the other extension 85C extends from the rectangular portion 85B along the spacing direction through the dividing line 64R to overlap with the outer region 64Q of the second grounding pad 64.

[0179] Therefore, the two dividing lines 85D that divide the two extensions 85C in the inner edge 85A of the perforation 85 in the spacing direction are far apart from the first signal pad 65 and the second signal pad 66 in the spacing direction. This means that the second conductor layer 7CL2 is far away from the first signal pad 65 and the second signal pad 66 in the spacing direction. This allows for control of the reduction in differential impedance in the first signal pad 65 and the second signal pad 66.

[0180] (Fifth Comparative Example)

[0181] The following is for reference. Figure 28 and Figure 29 The fifth comparative example of the present invention is described below. The main differences between this comparative example and the first embodiment described above are explained below, omitting repeated descriptions.

[0182] Figure 28 This is a partial bottom view of the second conductor layer 6CL2, the third conductor layer 6CL3, and the fourth conductor layer 6CL4 of the contact plate 6 in this comparative example. Figure 29 This is a partial bottom view of the second conductor layer 7CL2, the third conductor layer 7CL3, and the fourth conductor layer 7CL4 of the mounting plate 7 in this comparative example. Figure 28 and Figure 29 In the image, the conductor portion is indicated by a shaded line for easier viewing.

[0183] In this comparative example, the shapes of the second conductor layer 6CL2, the third conductor layer 6CL3, and the fourth conductor layer 6CL4 of the contact plate 6 and the second conductor layer 7CL2, the third conductor layer 7CL3, and the fourth conductor layer 7CL4 of the mounting plate 7 are different from those of the first embodiment described above, while the other structures are the same as those of the first embodiment.

[0184] <Contact Plate 6>

[0185] like Figure 28 As shown, the second conductor layer 6CL2 has two through-holes 100 instead of Figure 5 The perforation 55 is shown. Each perforation 100 has an inner edge 100A. Figure 28 In this configuration, vias 52 and 53 are respectively disposed inside the inner edges 100A of the two through holes 100. Vias 50A, 50B, 51A, and 51B are located outside the inner edges 100A of the two through holes 100. Each through hole 100 is approximately circular. The third conductor layer 6CL3 and the fourth conductor layer 6CL4 have the same shape as the second conductor layer 6CL2.

[0186] <Mounting Plate 7>

[0187] like Figure 29 As shown, the second conductor layer 7CL2 has two through-holes 101 instead of Figure 12 The perforation 85 is shown. Each perforation 101 has an inner edge 101A. Figure 29 In this configuration, vias 82 and 83 are respectively disposed inside the inner edges 101A of the two through holes 101. Vias 80A, 80B, 81A, and 81B are disposed outside the inner edges 101A of the two through holes 101. Each through hole 101 is approximately circular. The third conductor layer 7CL3 and the fourth conductor layer 7CL4 have the same shape as the second conductor layer 7CL2.

[0188] (First Transmission Signal Integrity Analysis)

[0189] Integrity analysis was performed on the transmission signals in the differential transmission board group 4 according to the first embodiment and the first to fourth comparative examples described above. The following analysis is based on... Figures 30 to 32 Describe the analysis results.

[0190] Ansys HFSS (registered trademark), manufactured by ANSYS, Inc., was used as the analysis software. The thickness of each of the multiple conductor layers 6CL and 7CL is 18 μm. The thickness of each of the first insulating layer 6SL1, the fifth insulating layer 6SL5, the first insulating layer 7SL1, and the fifth insulating layer 7SL5 is 100 μm. The thickness of each of the second insulating layer 6SL2, the third insulating layer 6SL3, the fourth insulating layer 6SL4, the second insulating layer 7SL2, the third insulating layer 7SL3, and the fourth insulating layer 7SL4 is 200 μm. The spacing between the multiple press-fit elements 11 is 0.7 mm. Furthermore, in... Figure 3 In this structure, the first conductor layer 6CL1 and the first conductor layer 7CL1 are separated by 0.7 mm in the vertical direction. Figures 5 to 8 The diameters of the vias 50A, 50B, 51A, and 51B of the contact plate 6 shown are all 0.12 mm. Figures 12 to 15 The diameters of vias 80A, 80B, 81A, and 81B in the mounting plate 7 shown are all 0.15 mm. The dielectric constants of insulating layers 6SL and 7SL are 3.5.

[0191] Figure 30 This is a graph showing the analysis results of the insertion loss of differential transmission using differential transmission board group 4. Figure 30 In the graph, the horizontal axis represents frequency, and the vertical axis represents insertion loss. Figure 30 In the figure, approximate curves A to E correspond to the first embodiment and the first comparative example to the fourth comparative example, respectively.

[0192] Figure 31 This is a graph showing the return loss analysis results of differential transmission using differential transmission board group 4. Figure 31 In the graph, the horizontal axis represents frequency, and the vertical axis represents return loss. Figure 31 In the figure, approximate curves A to E correspond to the first embodiment and the first comparative example to the fourth comparative example, respectively.

[0193] Figure 32 This is a graph showing the analysis results of time-domain reflectionometry (TDR) of differential transmission using differential transmission substrate group 4. Figure 32 In the curve graph, the horizontal axis represents time, and the vertical axis represents differential impedance. Figure 32 In the diagram, approximate curves A to E correspond to the first embodiment and the first to fourth comparative examples, respectively. For example... Figure 32 As shown, in the TDR analysis, the differential transmission board group 4 is designed with a differential impedance, for example, 85Ω. Figure 32In the figure, the differential impedance at 0.065 nsec on the horizontal axis represents the differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6, and the differential impedance at 0.095 nsec on the horizontal axis represents the differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7.

[0194] Figure 30 The differential transmission board assembly 4 according to the first embodiment and the first to fourth comparative examples shows good transmission characteristics. In particular, the insertion loss in the first embodiment and the first to third comparative examples is significantly lower than the insertion loss in the fourth comparative example.

[0195] Figure 31 The differential transmission board assembly 4 according to the first embodiment and the first to fourth comparative examples demonstrates good transmission characteristics. Specifically, in the first embodiment and the first to third comparative examples, the return loss is significantly lower than that in the fourth comparative example. Furthermore, in the first embodiment, the return loss is significantly lower than that in the first to fourth comparative examples.

[0196] Figure 32 As shown, the differential impedance in the differential transmission board group 4 according to the first embodiment and the first to fourth comparative examples is within a narrow range of 85Ω + / -13Ω, which is a design value.

[0197] exist Figure 32 In the comparison with the fourth comparative example, the differential impedance at 0.065 nsec on the horizontal axis (the differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6) shows that the reduction in differential impedance in the first embodiment and the first to third comparative examples is controlled. This may be because, for example, the second conductor layer 6CL2 (the inner edge 55A of the perforation 55) is sufficiently far away in the spacing direction. Figure 10 The first signal pad 35 and the second signal pad 36 of the contact plate 6 in the first embodiment and the first to third comparative examples shown. Figure 30 The lower insertion loss in the first embodiment and the first to third comparative examples compared to the fourth comparative example is likely due to the effective control of the reduction in differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6. Similarly, Figure 31 The result that the return loss of the first embodiment and the first to third comparative examples is lower than that of the fourth comparative example may be because the reduction of differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6 is effectively controlled.

[0198] Figure 32The differential impedance at 0.095 nsec reference horizontal axis (the differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7) is shown to be further reduced in the first embodiment compared to the first to fourth comparative examples. This may be because the second conductor layer 7CL2 (perforation 85) is narrower in the spacing direction in the first embodiment, such as... Figure 17 As shown. However, the reduction in differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7 will not cause any significant problems. This is because the reduction in differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7 is approximately one-fifth of that in the first signal pad 35 and the second signal pad 36 of the contact plate 6.

[0199] exist Figure 32 In the first embodiment, the increase in differential impedance is smaller compared to the first to fourth comparative examples, with reference to the differential impedance at 0.08 nsec on the horizontal axis (differential impedance in the crimping member 11). This may be because the differential impedance at 0.095 nsec on the horizontal axis (differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7) in the first embodiment is further reduced compared to the first to fourth comparative examples described above. Then, as... Figure 31 As shown, the return loss in the first embodiment is particularly lower than that in the first to fourth comparative examples, possibly because the increase in differential impedance in the crimp member 11 in the first embodiment is reduced, such as... Figure 32 As shown. Specifically, in the first embodiment, return loss is reduced by intentionally minimizing the effect of the reduction in differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7.

[0200] (Second Transmission Signal Integrity Analysis)

[0201] Integrity analysis is performed on the differential transmission board group 4 in the examples of the first embodiment and the first to fourth comparative examples, and the differential transmission board group 4 in the fifth comparative example, with reference to the following. Figures 33 to 35 Describe the analysis results. It should be noted that the example of applying the first variation to the first embodiment is the first variation.

[0202] Ansys HFSS (registered trademark), manufactured by ANSYS, Inc., was used as the analysis software. The thickness of each of the multiple conductor layers 6CL and 7CL is 18 μm. The thickness of each of the first insulating layer 6SL1, the fifth insulating layer 6SL5, the first insulating layer 7SL1, and the fifth insulating layer 7SL5 is 100 μm. The thickness of each of the second insulating layer 6SL2, the third insulating layer 6SL3, the fourth insulating layer 6SL4, the second insulating layer 7SL2, the third insulating layer 7SL3, and the fourth insulating layer 7SL4 is 200 μm. The spacing between the multiple press-fit elements 11 is 0.7 mm. Furthermore, in... Figure 3 In this structure, the first conductor layer 6CL1 and the first conductor layer 7CL1 are separated by 0.7 mm in the vertical direction. Figures 5 to 8 The diameters of the vias 50A, 50B, 51A, and 51B of the contact plate 6 shown are all 0.12 mm. Figures 12 to 15 The diameters of vias 80A, 80B, 81A, and 81B in the mounting plate 7 shown are all 0.15 mm. The dielectric constants of the insulating layers 6SL and 7SL are 3.5.

[0203] Figure 33 This is a graph showing the insertion loss analysis results for differential transmission using differential transmission board group 4. Figure 33 In the graph, the horizontal axis represents frequency, and the vertical axis represents insertion loss. Figure 33 In the figure, approximate curve A corresponds to the first embodiment, approximate curves A' to E' correspond to examples in which the first modified example is applied to the first embodiment and the first to fourth comparative examples respectively, and approximate curve F corresponds to the fifth comparative example.

[0204] Figure 34 This is a graph showing the return loss analysis results of differential transmission using differential transmission board group 4. Figure 34 In the graph, the horizontal axis represents frequency, and the vertical axis represents return loss. Figure 34 In the above, approximate curve A corresponds to the first embodiment, approximate curves A' to E' correspond to examples of the first modified example applied to the first embodiment and the first to fourth comparative examples, respectively, and approximate curve F corresponds to the fifth comparative example.

[0205] Figure 35 This is a graph representing the TDR analysis results of differential transmission using differential transmission substrate group 4. Figure 35 In the curve graph, the horizontal axis represents time, and the vertical axis represents differential impedance. Figure 35In the diagram, approximate curve A corresponds to the first embodiment, approximate curves A' to E' correspond to examples where the first modified example is applied to the first embodiment and the first to fourth comparative examples, respectively, and approximate curve F corresponds to the fifth comparative example. For example... Figure 35 As shown, in the TDR analysis, the differential transmission board group 4 is designed with a differential impedance, for example, 85Ω. Figure 35 In the figure, the differential impedance at 0.065 nsec on the horizontal axis represents the differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6, and the differential impedance at 0.095 nsec on the horizontal axis represents the differential impedance in the first signal pad 65 and the second signal pad 66 of the mounting plate 7.

[0206] Figure 33 The results show that when the first modified example is applied to the first embodiment and the first to fourth comparative examples, although the insertion loss increases slightly, it is still significantly lower than the insertion loss of the fifth comparative example.

[0207] Figure 34 The results show that when the first modified example is applied to the first embodiment and the first to fourth comparative examples, although the return loss increases slightly, it is still significantly lower than the return loss of the fifth comparative example.

[0208] Figure 35 The results show that when the first modified example is applied to the first embodiment and the first to fourth comparative examples, the amount of reduction in differential impedance in the first signal pad 35 and the second signal pad 36 of the contact plate 6 increases slightly, but is still significantly lower than the amount of reduction in the fifth comparative example.

[0209] The first embodiment of the present invention has been described above.

[0210] The first embodiment described above has the following features.

[0211] Specifically, such as Figures 1 to 3 As shown, the differential transmission board assembly 4 includes: a mounting plate 7 on which the compression connector 5 is mounted, and a contact plate 6 for contacting the compression connector 5. The contact plate 6 and the mounting plate 7 are electrically connected to each other via the compression connector 5. The compression connector 5 includes: four crimping members 11 arranged in a row, and a housing 12 holding the four crimping members 11, wherein each crimping member 11 includes a welded portion 20 and an elastic portion 21. Figure 3 As shown, the mounting plate 7 is a multilayer substrate composed of alternating layers of conductor layers 7CL and insulating layers 7SL. The contact plate 6 is a multilayer substrate composed of alternating layers of conductor layers 6CL and insulating layers 6SL.

[0212] In the mounting plate 7, multiple conductor layers 7CL sequentially include a first conductor layer 7CL1 and a second conductor layer 7CL2 starting from the compression connector 5 side. In the contact plate 6, multiple conductor layers 6CL sequentially include a first conductor layer 6CL1 and a second conductor layer 6CL2 starting from the compression connector 5 side. Figure 11 As shown, in the mounting plate 7, the first conductor layer 7CL1 includes four electrode pads 60 corresponding to the four crimping members 11. The four electrode pads 60 include: a first signal pad 65, a second signal pad 66, a first ground pad 63, and a second ground pad 64. They are arranged sequentially in the spacing direction (first direction) in the order of the first ground pad 63, the first signal pad 65, the second signal pad 66, and the second ground pad 64. The welding portions 20 of the four crimping members 11 can be welded to the first ground pad 63, the first signal pad 65, the second signal pad 66, and the second ground pad 64, respectively.

[0213] like Figure 4 As shown, in the contact plate 6, the first conductor layer 6CL1 includes four electrode pads 30 corresponding to the four pressing members 11. The four electrode pads 30 include: a first signal pad 35, a second signal pad 36, a first ground pad 33, and a second ground pad 34. The first ground pad 33, the first signal pad 35, the second signal pad 36, and the second ground pad 34 are arranged in the order described above in the spacing direction (first direction). The elastic portions 21 of the four pressing members 11 contact the first ground pad 33, the first signal pad 35, the second signal pad 36, and the second ground pad 34, respectively.

[0214] like Figure 12 As shown, in the mounting plate 7, the second conductor layer 7CL2 is a ground layer and has the through hole 85. Figure 17 As shown, in the mounting plate 7, when viewed in the vertical direction (stacked direction), the perforation 85 is formed such that both the first signal pad 65 and the second signal pad 66 are located inside the inner edge 85A of the perforation 85.

[0215] like Figure 11As shown, in the mounting plate 7, a dividing line 63R divides the pad region of the first ground pad 63 into two halves in the spacing direction. The first ground pad 63 includes an inner region 63P that is closer to the first signal pad 65 relative to the dividing line 63R and an outer region 63Q that is farther away from the first signal pad 65 relative to the dividing line 63R. In the mounting plate 7, a dividing line 64R divides the pad region of the second ground pad 64 into two halves in the spacing direction. The second ground pad 64 has an inner region 64P that is closer to the second signal pad 66 relative to the dividing line 64R and an outer region 64Q that is farther away from the second signal pad 66 relative to the dividing line 64R.

[0216] like Figure 5 As shown, in the contact plate 6, the second conductor layer 6CL2 is a ground layer and has a through-hole 55. Figure 10 As shown, in the contact plate 6, when viewed from the vertical direction (stacked direction), the perforation 55 is formed such that both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 55A of the perforation 55. Figure 4 As shown, in the contact plate 6, the first grounding pad 33 includes an inner region 33P closer to the first signal pad 35 than the dividing line 33R that divides the pad region of the first grounding pad 33 in the spacing direction, and an outer region 33Q farther away from the first signal pad 35 relative to the dividing line 33R. In the contact plate 6, the second grounding pad 34 includes an inner region 34P closer to the second signal pad 36 than the dividing line 34R that divides the pad region of the second grounding pad 34 in the spacing direction, and an outer region 34Q farther away from the second signal pad 36 relative to the dividing line 34R.

[0217] As in the first embodiment Figure 10 As shown, in the contact plate 6, the perforation 55 is formed to overlap with the outer region 33Q of the first grounding pad 33 and the outer region 34Q of the second grounding pad 34 when viewed in the vertical direction. On the other hand, as in the first embodiment... Figure 17 As shown, in the mounting plate 7, when viewed in the vertical direction, the perforation 85 is formed away from the first grounding pad 63 and the second grounding pad 64.

[0218] In this structure, such as Figure 30 and Figure 31 As shown, a differential transmission board assembly 4 with excellent transmission characteristics was realized. In particular, it achieved superior transmission characteristics compared to the first to fourth comparative examples shown by approximate curves B, C, D, and E.

[0219] The first variation described above has the following characteristics.

[0220] like Figure 19 As shown, in the mounting plate 7, the third conductor layer 7CL3 is a ground layer and overlaps with the first signal pad 65 and the second signal pad 66 in the vertical direction. Furthermore, as... Figure 18 As shown, in the contact plate 6, the third conductor layer 6CL3 is a ground layer and overlaps with the first signal pad 35 and the second signal pad 36 in the vertical direction.

[0221] Similarly, in this structure, such as Figure 33 and Figure 34 As shown, a differential transmission board assembly 4 with excellent transmission characteristics has been realized. Furthermore, the electromagnetic shielding effect in the third conductor layer 7CL3 and the third conductor layer 6CL3 is also expected to be achieved.

[0222] The first embodiment described above has the following features.

[0223] Specifically, such as Figure 13 and Figure 14 As shown, in the mounting plate 7, the third conductor layer 7CL3 and the fourth conductor layer 7CL4 are ground layers, and each has a through-hole 86 and a through-hole 87, respectively. Figure 17 As shown, in the mounting plate 7, the through-hole 86 of the third conductor layer 7CL3, when viewed in the vertical direction, is formed such that both the first signal pad 65 and the second signal pad 66 are located inside the inner edge 86A of the through-hole 86. Similarly, the through-hole 87 of the fourth conductor layer 7CL4, when viewed in the vertical direction, is formed such that both the first signal pad 65 and the second signal pad 66 are located inside the inner edge 87A of the through-hole 87. Figure 15 As shown, in the mounting plate 7, the fifth conductor layer 7CL5 is a ground layer, which overlaps with the first signal pad 65 and the second signal pad 66 in the vertical direction (see...). Figure 19 (This makes it easier to understand).

[0224] Furthermore, such as Figure 6 and Figure 7 As shown, in the contact plate 6, the third conductor layer 6CL3 and the fourth conductor layer 6CL4 are ground layers, and each has a through hole 56 and a through hole 57, respectively. Figure 10 As shown, in the contact plate 6, the through-hole 56 of the third conductor layer 6CL3 is formed such that, when viewed in the vertical direction, both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 56A of the through-hole 56. Similarly, the through-hole 57 of the fourth conductor layer 6CL4 is formed such that, when viewed in the vertical direction, both the first signal pad 35 and the second signal pad 36 are located inside the inner edge 57A of the through-hole 57. Figure 8As shown, in the contact plate 6, the fifth conductor layer 6CL5 is a ground layer, which overlaps with the first signal pad 35 and the second signal pad 36 in the vertical direction (see...). Figure 18 (This makes it easier to understand).

[0225] In this structure, such as Figure 30 and Figure 31 As shown, differential transmission board group 4 with excellent transmission characteristics has been realized.

[0226] In addition, such as Figure 2 As shown, the compression connector 5 includes multiple crimping element groups 11G, each crimping element group 11G including four crimping elements 11 arranged in a row.

[0227] Furthermore, the contact plate 6 comprises multiple conductor layers 6CL, including a first conductor layer 6CL1, a second conductor layer 6CL2, ..., an (N-1)th conductor layer and an Nth conductor layer, arranged in this order from the compression connector 5 side. Here, N is a natural number greater than 4. In the first embodiment, the (N-1)th conductor layer and the Nth conductor layer correspond to the fifth conductor layer 6CL5 and the sixth conductor layer 6CL6, respectively. The sixth conductor layer 6CL6 (the Nth conductor layer) includes a first signal pad 45 and a second signal pad 46, which are electrically connected to the first signal pad 35 and the second signal pad 36 of the first conductor layer 6CL1, respectively. Figure 8 and Figure 9 As shown, the fifth conductor layer 6CL5 (the (N-1)th conductor layer) is a ground layer, overlapping with the first signal pad 45 and the second signal pad 46 of the sixth conductor layer 6CL6 in the stacking direction. In this structure, the electromagnetic shielding effect of the first signal pad 45 and the second signal pad 46 of the sixth conductor layer 6CL6 (the Nth conductor layer) is sufficiently large.

[0228] Similarly, the mounting plate 7 comprises multiple conductor layers 7CL, including a first conductor layer 7CL1, a second conductor layer 7CL2, ..., an (N-1)th conductor layer, and an Nth conductor layer, arranged in this order from the compression connector 5 side. Here, N is a natural number greater than 4. In the first embodiment, the (N-1)th conductor layer and the Nth conductor layer correspond to the fifth conductor layer 7CL5 and the sixth conductor layer 7CL6, respectively. The sixth conductor layer 7CL6 (the Nth conductor layer) includes a first signal pad 75 and a second signal pad 76, which are electrically connected to the first signal pad 65 and the second signal pad 66 of the first conductor layer 7CL1, respectively. Figure 15 and Figure 16As shown, the fifth conductor layer 7CL5 (the (N-1)th conductor layer) is a ground layer, overlapping with the first signal pad 75 and the second signal pad 76 of the sixth conductor layer 7CL6 in the stacking direction. In this structure, the electromagnetic shielding effect of the first signal pad 75 and the second signal pad 76 of the sixth conductor layer 7CL6 (the Nth conductor layer) is sufficiently large.

[0229] It should be noted that both the contact plate 6 and the mounting plate 7 may have the features of the (N-1)th conductor layer described above, and only one of the contact plate 6 and the mounting plate 7 may have the (N-1)th conductor layer described above.

[0230] The first embodiment described above can be modified as follows, for example.

[0231] Specifically, in Figure 5 In this context, either via 50A or via 50B can be omitted. Figure 5 In this context, either via 51A or via 51B can be omitted. Figure 12 In this context, either via 80A or via 80B can be omitted. Figure 12 In this context, either via 81A or via 81B can be omitted.

[0232] In addition, such as Figure 3 As shown, in the first embodiment, the contact plate 6 includes a first to a sixth conductor layer as a plurality of conductor layers 6CL. Alternatively, the contact plate 6 may further include a seventh and an eighth conductor layer as a plurality of conductor layers 6CL. The sixth conductor layer 6CL, the seventh conductor layer, and the eighth conductor layer are arranged sequentially from the compression connector 5 side. In this case, the seventh and eighth conductor layers are typically ground layers. The seventh and eighth conductor layers can have any thickness and shape. This also applies to the mounting plate 7.

[0233] From this disclosure, it will be apparent that embodiments of the invention can be varied in many ways. Such variations should not be considered as departing from the spirit and scope of the invention, and all such modifications that will be apparent to those skilled in the art are intended to be included within the scope of the appended claims.

Claims

1. A differential transmission board assembly, characterized in that: The differential transmission board assembly is a combination of two differential transmission boards electrically connected to each other via a compression connector. The compression connector includes four crimping members arranged in a row and a housing holding the four crimping members. Each crimping member includes a welded portion and an elastic portion, wherein: The two differential transmission boards each include a mounting plate and a contact plate, the compression connector is mounted on the mounting plate, and the contact plate is configured to contact the compression connector. Each of the mounting plates and the contact plates is a multilayer plate, wherein the multilayer plate has multiple conductor layers and multiple insulator layers stacked alternately. In each of the mounting plates and the contact plates, the plurality of conductor layers include a first conductor layer and a second conductor layer, arranged sequentially from the compression connector side in the order of the first conductor layer and the second conductor layer. In each of the mounting plates and the contact plates, the first conductor layer includes four electrode pads corresponding to the four crimping members. The four electrode pads include a first signal pad, a second signal pad, a first ground pad, and a second ground pad, arranged sequentially along a first direction in the order of the first ground pad, the first signal pad, the second signal pad, and the second ground pad. In the mounting plate, the welding portions of the four crimping members can be welded to the first grounding pad, the first signal pad, the second signal pad, and the second grounding pad, respectively. In the contact plate, the elastic portions of the four pressing members can respectively contact the first grounding pad, the first signal pad, the second signal pad, and the second grounding pad. In each of the mounting plates and the contact plates, the second conductor layer is a ground layer and has perforations. In each of the mounting plates and the contact plates, the perforation is formed such that, when viewed in the stacking direction, both the first signal pad and the second signal pad are located inside the inner edge of the perforation. In each of the mounting plates and the contact plates, the first grounding pad includes an inner region and an outer region, the inner region being closer to the first signal pad relative to a boundary line that divides the pad region of the first grounding pad into two halves along the first direction, and the outer region being farther away from the first signal pad relative to the boundary line. In each of the mounting plates and the contact plates, the second grounding pad includes an inner region and an outer region, the inner region being closer to the second signal pad relative to the boundary line that divides the pad region of the second grounding pad into two halves along the first direction, and the outer region being farther away from the second signal pad relative to the boundary line. In the contact plate, when viewed along the stacking direction, the perforation is formed to overlap with the outer regions of the first grounding pad and the second grounding pad, and In the mounting plate, when viewed along the stacking direction, the perforation is formed away from the first grounding pad and the second grounding pad.

2. The differential transmission board assembly as described in claim 1, characterized in that: In each of the mounting plates and the contact plates, the plurality of conductor layers further includes a third conductor layer, wherein the first conductor layer, the second conductor layer, and the third conductor layer are stacked in this order from the compression connector side, and In each of the mounting plates and the contact plates, the third conductor layer is a ground layer and overlaps with the first signal pad and the second signal pad in the stacking direction.

3. The differential transmission board assembly as described in claim 1, characterized in that: In each of the mounting plates and the contact plates, the plurality of conductor layers further include a third conductor layer, a fourth conductor layer, and a fifth conductor layer, and are stacked sequentially from the compression connector side in the order of the first conductor layer, the second conductor layer, the third conductor layer, the fourth conductor layer, and the fifth conductor layer. In each of the mounting plates and contact plates, the third conductor layer and the fourth conductor layer are ground layers and have through holes. In each of the mounting plates and the contact plates, the perforations in each of the third conductor layer and the fourth conductor layer are formed such that, when viewed in the stacking direction, both the first signal pad and the second signal pad are located inside the inner edge of the perforation. In each of the mounting plates and the contact plates, the fifth conductor layer is a ground layer and overlaps with the first signal pad and the second signal pad in the stacking direction.

4. The differential transmission board assembly as described in any one of claims 1 to 3, characterized in that: The differential transmission board assembly is a combination of two differential transmission boards electrically connected to each other via a compression connector. The compression connector has multiple crimping member groups, each crimping member group including four crimping members arranged in a row.

5. The differential transmission board assembly as described in any one of claims 1 to 3, characterized in that: In each of the mounting plates and the contact plates, the plurality of conductor layers, including the first conductor layer, the second conductor layer, ..., the (N-1)th conductor layer and the Nth conductor layer, are arranged in this order from the compression connector side, where N is a natural number greater than 4. The Nth conductor layer includes a first signal pad and a second signal pad, which are electrically connected to the first signal pad and the second signal pad of the first conductor layer, respectively. The (N-1)th conductor layer is a ground layer, which overlaps with the first signal pad and the second signal pad of the Nth conductor layer in the stacking direction.

6. A component, characterized in that... The components include: The differential transmission board assembly as described in any one of claims 1 to 3; and The compression connector.

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