Horizontal array laser module and packaging method thereof

Abstract

This invention relates to a horizontal array laser module and its packaging method. The module utilizes L-shaped heat sinks and independent planar insulating sheets for bar packaging, forming a horizontally distributed multi-bar stacked array, increasing the heat dissipation area while ensuring packaging feasibility. A specially designed fixture enables one-time molding and packaging of multiple bars, ensuring consistency. In the welding direction, the bars are kept parallel to the crystal, utilizing the divergent action of the bar's fast axis on the crystal surface to ensure uniformity. The bars are connected in series via L-shaped electrodes, and the laser electrodes are led out to the back side for easy wiring. Finally, a water channel conversion device integrates multiple horizontal arrays into a multi-dimensional pump source, improving pumping efficiency and beam uniformity. This method offers advantages such as simple pump source assembly, good pump uniformity, and strong heat dissipation.

Description

Technical Field

[0001] This invention relates to a horizontal array laser module and its packaging method, belonging to the field of semiconductor laser stacking packaging. Background Technology

[0002] Semiconductor laser arrays can be used for side pumping of Nd:YAG crystals, outputting 1064nm laser light, and are widely used in industrial cleaning and marking fields. As a side pump, it places high demands on the heat dissipation, size, and reliability of the pump source; uneven distribution of the pump source can lead to reduced pumping efficiency. Semiconductor laser arrays are commonly used for pumping solid-state lasers. Currently, commercially available semiconductor lasers for pumping are mainly centimeter-bar packaged array lasers. This structure offers advantages such as small size, high efficiency, and high reliability, and has been widely applied in the pumping of solid-state lasers.

[0003] Side pumping refers to a pump source providing a stable light source around a crystal rod. A common structure has three sides distributed around the crystal rod, which can effectively provide light source pumping for the crystal rod. However, in existing structures, the number of effective sides constituting the side pump is relatively small, often only three sides, and the tilt angle of adjacent sides is large, resulting in uneven distribution of the pump light on the crystal rod, which affects the quality of the output beam at the end.

[0004] In addition, in existing structures, most rely on conductive cooling, using their own heat capacity to absorb the heat generated during operation.

[0005] Chinese invention patent CN201310002609.8 discloses a side-pumping module for a semiconductor laser. This invention achieves the side-pumping module by utilizing protrusions on the crystal rod surface, special coating matching, and structural matching. It covers pump sources with different crystal diameters (Φ4-Φ10) and different numbers of bars (3-7 bar), satisfying pumping needs for crystals of different sizes. Different processes are applied to different structures and bar numbers. In this invention, the bar distribution direction is perpendicular to the crystal direction. For higher power or more bars requiring side pumping, due to the difference in fast-axis and slow-axis divergence angles of the semiconductor laser itself, there is still room for improvement in pump uniformity and integration. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a horizontal array laser module and its packaging method. The invention uses an L-shaped heat sink and independent planar insulating sheets for bar packaging, forming a horizontally distributed multi-bar stacked array, increasing the heat dissipation area while ensuring packaging feasibility. A specially designed fixture enables one-time molding and packaging of multiple bars, ensuring consistency. In the welding direction, the bars are kept parallel to the crystal, utilizing the divergent action of the bar's fast axis on the crystal surface to ensure uniformity. The bars are connected in series using L-shaped electrodes, and the laser electrodes are led out to the back side for easy wiring. Finally, a water channel conversion device integrates multiple horizontal arrays into a multi-dimensional pump source, improving pumping efficiency and beam uniformity. This invention offers advantages such as simple pump source assembly, good pump uniformity, and strong heat dissipation capabilities.

[0007] Terminology Explanation:

[0008] 1. Nd:YAG crystal: aluminum-doped yttrium aluminum garnet, commonly used in solid-state laser crystals. It is usually cylindrical, corresponding to one or more absorption peaks, and outputs laser light of a specific wavelength after being pumped by a pump source.

[0009] 2. Pump source: Usually used in conjunction with a crystal to obtain the ideal output state. In this invention, it refers to a horizontal semiconductor laser array with a wavelength within the absorption band of the crystal.

[0010] 3. Bar: A laser chip used to package horizontal semiconductor laser arrays.

[0011] The technical solution of this invention is as follows:

[0012] A horizontal array laser module includes a plurality of horizontal array lasers, which are evenly arranged in a circular pattern between two water channel conversion devices.

[0013] The horizontal array laser includes several bar units arranged sequentially along the horizontal direction. Adjacent bar units are connected in series with positive and negative poles. Each bar unit includes two planar insulating sheets, two L-shaped heat sinks, and a bar. Each planar insulating sheet has an L-shaped heat sink, and the bar is positioned between the vertical arms of the two L-shaped heat sinks. The fast axis of the bar is parallel to the axis of the crystal, and the fast axis of the bar is perpendicular to the direction of light emission from the bar. The planar insulating sheets are fixed on the water channel, and both ends of the water channel are fixed on the water channel conversion device.

[0014] This invention presents a modular, ring-pumped laser structure, focusing on a horizontal array laser structure. In this laser module, lasers can be assembled in a ring-pump configuration, resulting in a simple structure and simplified packaging and assembly process. Furthermore, the horizontal array structure facilitates the expansion of the number of power bars. Simultaneously, the L-shaped heat sink increases the contact area with the water channel surface, thereby increasing the heat dissipation area of ​​the power bars without altering the overall laser structure.

[0015] According to a preferred embodiment of the present invention, in a horizontal array laser, the bar units located at both ends lead the laser electrodes to the back of the waterway via a first connecting mechanism;

[0016] The first connecting mechanism includes an L-shaped electrode plate A, an L-shaped electrode plate B, and an electrode insulating plate A. The electrode insulating plate A is fixed to the side wall of the water channel. One arm of the L-shaped electrode plate A is welded to the cross arm of the L-shaped heat sink, and the other arm of the L-shaped electrode plate A is welded to one side of the electrode insulating plate A. One arm of the L-shaped electrode plate B is located on the back of the water channel, and the other arm of the L-shaped electrode plate B passes through the water channel and is welded to the other side of the electrode insulating plate A. An electrode insulating plate B is provided between one arm of the L-shaped electrode plate B and the back of the water channel to facilitate subsequent power connection to the horizontal array laser.

[0017] In the bar unit inside the horizontal array laser, adjacent bar units are connected in series through a second connecting mechanism;

[0018] The second connecting mechanism includes an L-shaped electrode plate A, an L-shaped electrode plate B, and an electrode insulating plate A. The electrode insulating plate A is fixed to the side wall of the waterway. One arm of the L-shaped electrode plate A is welded to the cross arm of the L-shaped heat sink, and the other arm of the L-shaped electrode plate A is welded to one side of the electrode insulating plate A. One arm of the L-shaped electrode plate B is welded to the cross arm of the L-shaped heat sink of the adjacent bar unit, and the other arm of the L-shaped electrode plate B is welded to the other side of the electrode insulating plate A.

[0019] According to a preferred embodiment of the present invention, the L-shaped heat sink is made of tungsten copper, and the planar insulating sheet is made of ALN ceramic. The thermal expansion coefficient of the tungsten copper heat sink is comparable to that of the bar, and its thermal conductivity reaches 200 W / m / K. The thermal expansion coefficient is consistent with that of the bar material. While ensuring that the bar can effectively release the encapsulation stress during the AuSn hard solder encapsulation process, the high thermal conductivity can dissipate the generated heat in a timely manner.

[0020] According to a preferred embodiment of the present invention, the water channel conversion device is provided with a crystal mounting hole, a laser main water inlet, and a plurality of branch water outlets. The crystal mounting hole is used to fix both ends of the crystal rod. The laser main water inlet is connected to the branch water outlets. The water channels of the horizontal array laser are fixedly installed on the water channel conversion device through water channel fixing holes, so that the water channel inlet corresponds to the branch water outlet of the water channel conversion device, and a sealing ring is provided between the water channel inlet and the branch water outlets.

[0021] A packaging method for a horizontal array laser module includes the following steps:

[0022] (1) The L-shaped heat sink is soldered onto the planar insulating sheet using AuSn solder to form an insulating heat sink;

[0023] (2) Place the bar and two insulating heat sinks in the encapsulation fixing slot of the encapsulation fixture, so that the bar is welded between the two insulating heat sinks, and the light-emitting surface of the bar is close to the bottom surface of the encapsulation fixing slot, and the back of the flat insulating sheet is facing up. Place the bar units in the encapsulation fixing slot in sequence according to the positive and negative poles connected in series.

[0024] (3) Place the water channel on the back of the flat insulating sheet so that the water channel is fixed together with the bar unit;

[0025] (4) Remove the packaging fixture, connect each bar in the horizontal array laser in series through the first and second connecting mechanisms, and lead the electrodes out to the back of the waterway;

[0026] (5) Several horizontal array lasers are fixedly installed between two water channel conversion devices so that the direction of the bar is parallel to the axis of the crystal rod. The bar irradiates the side of the crystal by the divergence angle in the fast axis direction, thus integrating it into a multi-dimensional side pump source.

[0027] According to a preferred embodiment of the present invention, a plurality of encapsulation grooves are formed on the encapsulation fixture along a straight direction, and the encapsulation grooves are used to fix the bar strip unit; the encapsulation fixture is provided with encapsulation fixing holes to facilitate fixing the bar strip unit fixed in the encapsulation groove onto the waterway.

[0028] According to a preferred embodiment of the present invention, in step (2), an insulating heat sink is first placed in the encapsulation fixing groove with the L-shaped heat sink facing downwards. Then, a bar is placed close to the insulating heat sink, and finally, another insulating heat sink is placed. AuSn solder pads are placed at the contact interfaces between the insulating heat sink and the bar. The insulating heat sink and the bar are encapsulated together by the limiting effect of the encapsulation fixing groove, forming a sandwich structure.

[0029] According to a preferred embodiment of the present invention, in step (3), the water channel is placed on the back of the planar insulating sheet so that the water channel is fixed together with the bar unit; specifically, an AuSn solder sheet is placed on the back of the planar insulating sheet, and then the water channel is placed on the AuSn solder sheet. The water channel is fixed together with the packaging fixture by means of a fixing bolt passing through the water channel fixing hole and the packaging fixing hole on the packaging fixture. The welding interface is pressed by the gravity of the water channel itself, and then welding is performed so that the water channel is welded together with the bar unit.

[0030] According to a preferred embodiment of the present invention, in step (4), SnInAg solder is used to weld the first connection mechanism and the second connection mechanism. SnInAg has a lower melting point than AuSn solder, and has high welding strength and good reliability. Selecting this solder as the secondary packaging solder avoids the melting of AuSn during the secondary welding process.

[0031] The beneficial effects of this invention are as follows:

[0032] 1. This invention patent is a horizontal semiconductor laser array structure. Through the structural design of L-shaped tungsten copper heat sink and horizontal insulating sheet, the contact area with the water channel is increased, thereby improving the heat dissipation capacity.

[0033] 2. During the packaging process, multiple bar strips were molded and packaged in one step using packaging fixtures, ensuring the consistency of horizontal array multi-bar packaging and realizing AuSn hard solder packaging of multiple interfaces.

[0034] 3. In the welding direction, the bar is kept parallel to the direction of the crystal rod. The divergent effect of the bar's fast axis is used on the side of the crystal, and the arrangement ensures the uniformity of the pump.

[0035] 4. By connecting each bar in series through the first and second connecting mechanisms, the electrodes are led out to the back of the water channel, which improves the integration and facilitates the wiring of the entire laser array.

[0036] 5. By integrating multiple horizontal arrays together through a water channel conversion device, multi-dimensional pump integration is achieved, which facilitates the use of side pumping of rod-shaped crystals and improves pump uniformity and integration.

[0037] 6. The laser structure presented in this invention is a combined ring-pumped laser. It focuses on the structure and packaging method of a horizontal array laser. The laser packaged in this way can be assembled into a ring pump by splicing around it. The structure is simple and the packaging and assembly process is simplified. At the same time, the horizontal array structure adopted in this invention facilitates the expansion of the number of bars. Attached Figure Description

[0038] Figure 1 This is a schematic diagram showing the connection between the L-shaped heat sink and the planar insulating sheet.

[0039] Figure 2 A schematic diagram of assembling the bar strip unit for the packaging fixture.

[0040] Figure 3 A cross-sectional schematic diagram of the assembly bar unit for the packaging fixture.

[0041] Figure 4 A schematic diagram of the overall assembly of the packaging fixture.

[0042] Figure 5This is a schematic diagram of the overall structure of a horizontal array laser.

[0043] Figure 6 This is a partial structural diagram of a horizontal array laser.

[0044] Figure 7 This is a schematic diagram of the structure on the back side of the waterway of a horizontal array laser.

[0045] Figure 8 This is a structural diagram of the horizontal array laser module.

[0046] Figure 9 This is a schematic diagram of the waterway conversion device.

[0047] Figure 10 This is a schematic diagram of the cross-section of the crystal irradiated by the pump source.

[0048] 1. L-shaped heat sink; 2. Planar insulating sheet; 3. Bar strip; 4. L-shaped electrode sheet A; 5. Electrode insulating plate A; 6. L-shaped electrode sheet B; 7. Water channel; 8. Water channel inlet; 9. Water channel fixing hole; 10. Electrode insulating plate B; 11. Encapsulation fixture; 12. Fixing bolt; 13. Encapsulation fixing groove; 14. Encapsulation fixing hole; 15. Water channel conversion device; 16. Main water inlet; 17. Crystal mounting hole; 18. Branch outlet; 19. Threaded hole. Detailed Implementation

[0049] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0050] Example 1

[0051] like Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, a horizontal array laser module includes several horizontal array lasers, which are evenly arranged in a circle between two water channel conversion devices 15.

[0052] The horizontal array laser includes several bar units arranged sequentially along the horizontal direction. Adjacent bar units are connected in series with positive and negative poles. Each bar unit includes two planar insulating sheets 2, two L-shaped heat sinks 1, and a bar 3. Each planar insulating sheet 2 is provided with an L-shaped heat sink 1, and the bar 3 is located between the vertical arms of the two L-shaped heat sinks 1. The fast axis direction of the bar 3 is parallel to the axis of the crystal, and the fast axis direction of the bar 3 is perpendicular to the direction of light emission from the bar 3. The planar insulating sheets 2 are fixed on the water channel 7, and the two ends of the water channel 7 are fixed on the water channel conversion device 15.

[0053] In a horizontal array laser, horizontal bars 3 are evenly arranged according to the crystal length.

[0054] This invention presents a modular, ring-pumped laser structure, focusing on a horizontal array laser structure. In this laser module, lasers can be assembled in a ring-pump configuration, resulting in a simple structure and simplified packaging and assembly process. Furthermore, the horizontal array structure facilitates the expansion of the number of heat exchange bars 3. Simultaneously, the L-shaped heat sink 1 increases the contact area with the surface of the water channel 7, thereby increasing the heat dissipation area of ​​the heat exchange bars 3 without altering the overall laser structure.

[0055] The laser provided by this invention is mainly used for crystal rods with a diameter <5mm. However, using a ring semiconductor laser array structure to package crystal rods with a diameter <5mm is relatively complex. In this embodiment, the crystal is an Nd:YAG crystal, which is mounted between two water channel conversion devices 15 through crystal mounting holes 17.

[0056] Example 2

[0057] The difference between the horizontal array laser module provided in Embodiment 1 and the one in Example 1 is:

[0058] In horizontal array lasers, such as Figure 5 and Figure 7 As shown, the bar units located at both ends lead the laser electrodes to the back of the waterway 7 through the first connecting mechanism; in this embodiment, the horizontal array laser includes 10 bar units.

[0059] The first connecting mechanism includes an L-shaped electrode plate A4, an L-shaped electrode plate B6, and an electrode insulating plate A5. The electrode insulating plate A5 is fixed to the side wall of the waterway 7. One arm of the L-shaped electrode plate A4 is welded to the cross arm of the L-shaped heat sink 1, and the other arm of the L-shaped electrode plate A4 is welded to one side of the electrode insulating plate A5. One arm of the L-shaped electrode plate B6 is located on the back of the waterway 7, and the other arm of the L-shaped electrode plate B6 passes through the waterway 7 and is welded to the other side of the electrode insulating plate A5. Figure 7 As shown, an electrode insulating plate B10 is provided between one arm of the L-shaped electrode plate B6 and the back of the water channel 7; this facilitates subsequent power connection to the horizontal array laser.

[0060] In the bar unit inside the horizontal array laser, that is, the other eight bar units excluding the bar units at both ends, the bar units are connected in series through a second connecting mechanism;

[0061] The second connecting mechanism includes an L-shaped electrode plate A4, an L-shaped electrode plate B6, and an electrode insulating plate A5. The electrode insulating plate A5 is fixed to the side wall of the waterway 7. One arm of the L-shaped electrode plate A4 is welded to the cross arm of the L-shaped heat sink 1, and the other arm of the L-shaped electrode plate A4 is welded to one side of the electrode insulating plate A5. One arm of the L-shaped electrode plate B6 is welded to the cross arm of the L-shaped heat sink 1 of the adjacent bar unit, and the other arm of the L-shaped electrode plate B6 is welded to the other side of the electrode insulating plate A5.

[0062] The L-shaped heat sink 1 is made of tungsten copper, and the planar insulating sheet 2 is made of ALN ceramic. The thermal expansion coefficient of the tungsten copper heat sink is comparable to that of the bar 3, and its thermal conductivity reaches 200 W / m / K. The thermal expansion coefficient is consistent with that of the bar 3 material. While ensuring that the bar 3 can effectively release the encapsulation stress during the AuSn hard solder encapsulation process, the high thermal conductivity can dissipate the generated heat in a timely manner.

[0063] Example 3

[0064] The difference between the horizontal array laser module provided in Embodiment 1 and the one in Example 1 is:

[0065] like Figure 8 and Figure 9 As shown, the water channel conversion device 15 is provided with a crystal mounting hole 17, a laser main water inlet 16, and several branch water outlets 18. The crystal mounting hole 17 is used to fix the two ends of the crystal rod. The laser main water inlet 16 is connected to the branch water outlets 18. Threaded holes 19 are also provided on both sides of the branch water outlets 18. The water channels 7 of the horizontal array laser are fixedly installed to the threaded holes 19 of the water channel conversion device 15 through the water channel fixing holes 9 by bolts, so that the water channel inlet 8 corresponds to the branch water outlet 18 of the water channel conversion device 15, and a sealing ring is provided between the water channel inlet 8 and the branch water outlet 18.

[0066] Example 4

[0067] A packaging method for a horizontal array laser module, used to package a horizontal array laser module provided in any one of embodiments 1-3, includes the following steps:

[0068] (1) The L-shaped heat sink 1 is soldered to the planar insulating sheet 2 using AuSn solder to form an insulating heat sink;

[0069] (2) Figure 2 As shown, the bar strip 3 and two insulating heat sinks are placed in the encapsulation fixing groove 13 of the encapsulation fixture 11, so that the bar strip 3 is welded between the two insulating heat sinks, and the light-emitting surface of the bar strip 3 is close to the bottom surface of the encapsulation fixing groove 13, with the back of the flat insulating sheet 2 facing upwards. The bar strip units are placed in the encapsulation fixing groove 13 in the order of positive and negative terminals connected in series. Specifically, an insulating heat sink is first placed in the encapsulation fixing groove 13, with the L-shaped heat sink 1 facing downwards, so that... Figure 1 The insulating heat sink is placed upside down in the encapsulation fixing groove 13 of the encapsulation fixture 11, and then a bar strip 3 is placed close to the insulating heat sink. Finally, another insulating heat sink is placed, and AuSn solder pads are placed at the contact interfaces between the insulating heat sink and the bar strip 3. The insulating heat sink and the bar strip 3 are encapsulated together by the limiting effect of the encapsulation fixing groove 13, forming a sandwich structure.

[0070] (3) Figure 4 As shown, the water channel is placed on the back of the planar insulating sheet 2, so that the water channel 7 is fixed together with the bar unit; specifically, an AuSn solder sheet is placed on the back of the planar insulating sheet 2, and then the water channel 7 is placed on the AuSn solder sheet. The water channel 7 is fixed together with the packaging fixture 11 by passing through the water channel fixing hole 9 opened on the water channel 7 and the packaging fixing hole 14 on the packaging fixture 11 through the fixing bolt 12. The welding interface is pressed by the gravity of the water channel 7 itself, and then welding is performed so that the water channel 7 is welded together with the bar unit.

[0071] (4) Remove the packaging fixture 11, and connect each bar 3 in the horizontal array laser in series through the first and second connecting mechanisms, and lead the electrodes out to the back of the channel 7; use SnInAg solder to weld the first and second connecting mechanisms. SnInAg has a lower melting point than AuSn solder, and has high welding strength and good reliability. Choosing this solder as the secondary packaging solder avoids the melting of AuSn during the secondary welding process.

[0072] (5) Several horizontal array lasers are fixedly installed between two water channel conversion devices 15 so that the direction of bar 3 is parallel to the axis of the crystal rod. Bar 3 irradiates the side of the crystal by means of the divergence angle in the fast axis direction, thus integrating it into a multi-dimensional side pump source.

[0073] After the horizontal array lasers are packaged, multiple horizontal array lasers are integrated through a water channel conversion device 15 and fixed to the water channel conversion device 15 through water channel fixing holes 9. The water channel inlets 8 correspond to the water inlets of the water channel conversion device 15, and sealing rings are placed to prevent water leakage. The integrated horizontal array in five directions ensures that the direction of the bar 3 is parallel to the direction of the crystal rod. The bar 3 irradiates the side of the crystal by relying on the divergence angle in the fast axis direction. The distance between the bar 3 and the crystal surface is calculated based on the divergence angle and distribution. The arrangement ensures the uniformity of the pumping. In this embodiment, five groups of horizontal array lasers surround the crystal rod to form a 360° annular pumping structure. To obtain a uniform pump source, such as... Figure 10 As shown, each pump source needs to irradiate a 72° arc surface of the crystal rod on average. The schematic diagram of the cross-section of the crystal irradiated by the pump source is as follows. The fast axis divergence angle of the pump source bar 3 is θ, the distance of the pump source from the crystal surface is D, and the crystal radius is r. The following relationship exists between a single pump source irradiating the crystal surface:

[0074] I = 2rsin(36°)

[0075] (I / 2) / d1=tan(θ / 2)

[0076] (I / 2) / d2=tan(36°)

[0077] D = d1 + d2 - r

[0078] The above four equations can be used to calculate the relationship between the distance D between the pump source and the crystal and the divergence angle. The distance D can then be calculated based on the divergence angle of the selected pump source.

[0079] The relationship between distance D and divergence angle θ is calculated according to the above calculation method. The water channel conversion device 15 includes a laser main water inlet 16 and a crystal mounting hole 17, which facilitates subsequent laser water supply and crystal installation.

[0080] Example 5

[0081] The packaging method for a horizontal array laser module provided in Embodiment 4 differs in that:

[0082] like Figure 2 and Figure 3 As shown, the packaging fixture 11 has several packaging grooves along the straight direction, which are used to fix the bar strip unit; the packaging fixture 11 has packaging fixing holes 14, which facilitates fixing the bar strip unit fixed in the packaging groove onto the water channel 7.

Claims

1. A horizontal array laser module, characterized in that, It includes several horizontal array lasers, which are evenly arranged in a circle between two waterway conversion devices. The horizontal array laser includes several bar units arranged sequentially along the horizontal direction. Adjacent bar units are connected in series with positive and negative poles. Each bar unit includes two planar insulating sheets, two L-shaped heat sinks, and a bar. Each planar insulating sheet is provided with an L-shaped heat sink, and the bar is located between the vertical arms of the two L-shaped heat sinks. The fast axis of the bar is parallel to the axis of the crystal. The planar insulating sheets are fixed on the water channel, and the two ends of the water channel are fixed on the water channel conversion device. In a horizontal array laser, the bar units at both ends lead the laser electrodes to the back of the channel via a first connecting mechanism; The first connecting mechanism includes an L-shaped electrode plate A, an L-shaped electrode plate B, and an electrode insulating plate A. The electrode insulating plate A is fixed to the side wall of the waterway. One arm of the L-shaped electrode plate A is welded to the cross arm of the L-shaped heat sink, and the other arm of the L-shaped electrode plate A is welded to one side of the electrode insulating plate A. One arm of the L-shaped electrode plate B is located on the back of the waterway, and the other arm of the L-shaped electrode plate B passes through the waterway and is welded to the other side of the electrode insulating plate A. The electrode insulating plate B is provided between one arm of the L-shaped electrode plate B and the back of the waterway. In the bar unit inside the horizontal array laser, adjacent bar units are connected in series through a second connecting mechanism; The second connecting mechanism includes an L-shaped electrode plate A, an L-shaped electrode plate B, and an electrode insulating plate A. The electrode insulating plate A is fixed to the side wall of the waterway. One arm of the L-shaped electrode plate A is welded to the cross arm of the L-shaped heat sink, and the other arm of the L-shaped electrode plate A is welded to one side of the electrode insulating plate A. One arm of the L-shaped electrode plate B is welded to the cross arm of the L-shaped heat sink of the adjacent bar unit, and the other arm of the L-shaped electrode plate B is welded to the other side of the electrode insulating plate A.

2. The horizontal array laser module according to claim 1, characterized in that, The L-shaped heat sink is made of tungsten copper, and the planar insulating sheet is made of ALN ceramic.

3. A horizontal array laser module according to claim 1, characterized in that, The water channel conversion device is equipped with a crystal mounting hole, a laser main water inlet, and several branch water outlets. The crystal mounting hole is used to fix both ends of the crystal rod. The laser main water inlet is connected to the branch water outlets. The water channels of the horizontal array laser are fixedly installed on the water channel conversion device through the water channel fixing hole, so that the water channel inlet corresponds to the branch water outlet of the water channel conversion device, and a sealing ring is provided between the water channel inlet and the branch water outlet.

4. A packaging method for a horizontal array laser module, used to package the horizontal array laser module provided by any one of claims 1-3, characterized in that, The steps include the following: (1) Weld the L-shaped heat sink onto the planar insulating sheet to form an insulating heat sink; (2) Place the bar and two insulating heat sinks in the encapsulation fixing slot of the encapsulation fixture, so that the bar is welded between the two insulating heat sinks, and the light-emitting surface of the bar is close to the bottom surface of the encapsulation fixing slot, and the back of the flat insulating sheet is facing up. Place the bar units in the encapsulation fixing slot in sequence according to the positive and negative poles connected in series. (3) Place the water channel on the back of the flat insulating sheet so that the water channel is fixed together with the bar unit; (4) Remove the packaging fixture, connect each bar in the horizontal array laser in series through the first and second connecting mechanisms, and lead the electrodes out to the back of the waterway; (5) Several horizontal array lasers are fixedly installed between two water channel conversion devices so that the direction of the bar is parallel to the axis of the crystal rod. The bar irradiates the side of the crystal by the divergence angle in the fast axis direction, thus integrating it into a multi-dimensional side pump source.

5. The packaging method for a horizontal array laser module according to claim 4, characterized in that, The packaging fixture has several packaging grooves along a straight line, which are used to fix the bar strip unit; the packaging fixture also has packaging fixing holes to facilitate fixing the bar strip unit fixed in the packaging groove onto the waterway.

6. The packaging method for a horizontal array laser module according to claim 4, characterized in that, In step (2), first place an insulating heat sink in the encapsulation fixing groove, so that the L-shaped heat sink of the insulating heat sink faces downward, then place a bar strip close to the insulating heat sink, and finally place another insulating heat sink, and place AuSn solder pads at the contact interface between the insulating heat sink and the bar strip.

7. The packaging method for a horizontal array laser module according to claim 4, characterized in that, In step (3), the water channel is placed on the back of the planar insulating sheet so that the water channel is fixed together with the bar unit; specifically, AuSn solder sheet is placed on the back of the planar insulating sheet, and then the water channel is placed on the AuSn solder sheet. The water channel is fixed together with the packaging fixture by passing through the water channel fixing hole and the packaging fixing hole on the packaging fixture with the fixing bolt, and then welding is performed so that the water channel is welded together with the bar unit.

8. The packaging method for a horizontal array laser module according to claim 4, characterized in that, In step (4), SnInAg solder is used to weld the first connection mechanism and the second connection mechanism.

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