Lens module and electronic device
By driving the photosensitive chip to move in the XY-axis plane using the memory metal wire assembly in the lens module, the problem of image quality degradation caused by shaking in portable mobile terminals is solved, the camera module structure is simplified, and the imaging effect is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TRIPLE WIN TECH JIN CHENG CO LTD
- Filing Date
- 2022-05-27
- Publication Date
- 2026-07-21
AI Technical Summary
Existing camera modules in portable mobile terminals experience shaking due to physiological tremors of the human body or external vibrations, which affects image quality. Furthermore, existing image sensor chip structures that move along the X and Y axes are complex.
The lens module design includes a first circuit board, a second circuit board, a photosensitive chip, an electrical connection component, and a memory metal wire assembly. The photosensitive chip is driven to move in the XY-axis plane through the memory metal wire assembly to compensate for lens shake and simplify the structure.
It effectively compensates for lens shake, improves image quality, and simplifies the structure of the camera module, making it easier to assemble.
Smart Images
Figure CN117201917B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of lens technology, and more particularly to a lens module and electronic device. Background Technology
[0002] Due to physiological tremors of the human body or external vibrations interfering with portable mobile terminals, the camera module will shake when taking photos or videos, affecting image quality.
[0003] Existing camera modules can use image sensor chips that can move along the X and Y axes to achieve image stabilization and improve image quality when taking photos or videos. However, this also requires the addition of a drive component to move the image sensor chip along the X and Y axes, making the overall camera module structure more complex. Summary of the Invention
[0004] In view of this, this application provides a lens module to solve the above problems.
[0005] This application provides a lens module, including a first circuit board, a lens, a second circuit board, a photosensitive chip, an electrical connection component, and a memory metal wire assembly.
[0006] The first circuit board has a through groove, which has a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall connected in sequence. A lens is mounted on the first circuit board. A second circuit board is disposed within the through groove with a gap between it and the inner wall of the groove. The second circuit board includes a first side surface, a second side surface, a third side surface, and a fourth side surface. The second and fourth side surfaces are spaced apart and connected between the first and third side surfaces. The first side surface faces the first inner wall, the second side surface faces the second inner wall, the third side surface faces the third inner wall, and the fourth side surface faces the fourth inner wall.
[0007] A photosensitive chip is disposed on a second circuit board. A plane formed by a first and a second direction, which are perpendicular to each other, is defined and parallel to the plane on which the photosensitive chip is located. An electrical connection assembly is disposed within the gap and is electrically connected to both the first and second circuit boards. The electrical connection assembly includes two sets of first connectors and two sets of second connectors. One set of first connectors has its two ends connected to a first inner wall and a second side, respectively. The other set of first connectors has its two ends connected to a third inner wall and a fourth side, respectively. Similarly, one set of second connectors has its two ends connected to a second inner wall and a third side, respectively. The other set of second connectors has its two ends connected to a fourth side wall and a first side, respectively. A memory metal wire assembly is disposed on and electrically connected to the first circuit board. The memory metal wire assembly is also connected to the second circuit board and is used to drive the photosensitive chip to move within its plane via the electrical connection assembly.
[0008] In some embodiments, the two sets of first connectors are centrally symmetrical about the center of the two sets of second connectors, and the two sets of second connectors are centrally symmetrical about the center of the two sets of first connectors.
[0009] In some embodiments, the second side and the fourth side are spaced apart along a first direction, and the third side and the first side are spaced apart along a second direction. The first connector includes multiple metal strips, each metal strip including a first bent portion, a first movable portion, a second bent portion, a second movable portion, and a third bent portion connected in sequence. The first bent portion is connected to the first inner wall or the third inner wall. The first movable portion is arranged along the first direction. The second bent portion is connected between the first movable portion and the second movable portion. The second movable portion is arranged along the second direction. The third bent portion is connected to the second side or the fourth side.
[0010] In some embodiments, the first inner wall has a connecting section, which is the area of the first inner wall near the fourth inner wall, and the first bend is connected to the first inner wall through the connecting section.
[0011] In some implementations, a third direction is defined to be perpendicular to the first and second directions; in a cross-section perpendicular to the second direction, the length of the metal strip in the third direction is greater than the length of the metal strip in the second direction.
[0012] In some embodiments, the lens module further includes a drive component electrically connected to and disposed on a second circuit board, and the drive component is electrically connected to a memory metal wire assembly.
[0013] In some embodiments, the transmission component includes a support ring fixed to a second circuit board. The support ring has a first end and a second end disposed opposite to each other, with the first end and the second end located above the first circuit board. The memory metal wire assembly includes four memory metal wires and two sets of fixing clips. The two sets of fixing clips are fixed diagonally to the first circuit board about the support ring. One end of each memory metal wire is fixed to the fixing clip, and the other end is fixed to either the first end or the second end. The four memory metal wires, the two sets of fixing clips, the first end, and the second end form a square.
[0014] In some embodiments, the transmission component further includes a retaining ring disposed within the support ring, the retaining ring being fixed to the second circuit board.
[0015] In some implementations, the lens module also includes a reinforcing plate disposed on the side of the second circuit board away from the photosensitive chip.
[0016] An electronic device including a lens module.
[0017] In this application, when the lens module is working, if the lens shakes, the memory metal wire assembly simultaneously drives the photosensitive chip and the electrical connection assembly to move within the plane formed by the first and second directions, so that the central axis of the photosensitive chip is aligned with the optical axis of the lens, thereby compensating for lens shake. The structure provided in this application is simple and easy to assemble. In this application, the arrangement of two sets of first connectors and two sets of second connectors can improve the stability of the photosensitive chip when moving within the plane formed by the first and second directions, preventing the photosensitive chip from tilting or shifting. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of a lens module provided in an embodiment of this application.
[0019] Figure 2 for Figure 1 An exploded view of the lens module in one embodiment is shown.
[0020] Figure 3 for Figure 2 The diagram shows the structure of the first circuit board and the second circuit board in one embodiment.
[0021] Figure 4 for Figure 3 The diagram shows a schematic representation of the electrical connection assembly in one embodiment.
[0022] Figure 5 for Figure 3 A schematic cross-sectional view of the electrical connection assembly along VV in one embodiment is shown.
[0023] Figure 6 for Figure 2 The diagram shows a schematic of the connection between the transmission component and the first circuit board in one embodiment.
[0024] Figure 7 for Figure 6 An exploded view of the connection between the transmission component and the first circuit board in one embodiment is shown.
[0025] Figure 8 for Figure 1 The image shows a cross-sectional view of the lens module along line VIII-VIII in one embodiment.
[0026] Figure 9 This is a schematic diagram of the structure of the application lens module provided in the embodiments of this application.
[0027] Explanation of main component symbols
[0028] Lens Module 100
[0029] First circuit board 10
[0030] Through slot 11
[0031] First inner wall 111
[0032] Connector segment 1111
[0033] Second inner wall 112
[0034] Third inner wall 113
[0035] Fourth inner wall 114
[0036] Gap 12
[0037] Second circuit board 20
[0038] First side view 21
[0039] Second side 22
[0040] Third side 23
[0041] Fourth side 24
[0042] Extension block 25
[0043] Image sensor 30
[0044] Electrical connection assembly 40
[0045] First connector 41
[0046] Metal strip 411
[0047] First bend 4111
[0048] First Activities Department 4112
[0049] Second bend 4113
[0050] Second Activities Department 4114
[0051] Third bend 4115
[0052] Second connector 42
[0053] Memory metal wire assembly 50
[0054] Memory metal wire 51
[0055] Fixing clip 52
[0056] Transmission component 60
[0057] Support ring 61
[0058] First end 611
[0059] Second end 612
[0060] retaining ring 62
[0061] 621 protrusions
[0062] Thermistor 71
[0063] Reinforcing plate 72
[0064] Limit block 73
[0065] Limiting groove 731
[0066] 74 Ball Bearing
[0067] First protection plate 75
[0068] Through hole 751
[0069] Second protection plate 76
[0070] Mounting bracket 81
[0071] Mounting slot 811
[0072] Filter 82
[0073] Voice coil motor 83
[0074] Lens 84
[0075] Electronic devices 200
[0076] First direction X
[0077] Second direction Y
[0078] Third direction Z
[0079] The following detailed implementation methods will be combined with the above appendix. Figure 1-9 Further explanation of this application. Detailed Implementation
[0080] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0081] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.
[0082] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0083] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and embodiments.
[0084] Please see Figure 1 and Figure 2 This application provides a lens module 100. The lens module 100 includes a first circuit board 10, a second circuit board 20, a photosensitive chip 30, an electrical connection assembly 40, a memory metal wire assembly 50, and a lens 84. The first circuit board 10 has a through groove 11. The second circuit board 20 is disposed in the through groove 11, and a gap 12 is left between it and the inner wall of the through groove 11. The photosensitive chip 30 is disposed on the second circuit board 20 and electrically connected to the second circuit board 20. The electrical connection assembly 40 is disposed in the gap 12 and electrically connected between the first circuit board 10 and the second circuit board 20. The memory metal wire assembly 50 is disposed on the first circuit board 10 and electrically connected to the first circuit board 10. The lens 84 is fixed on the first circuit board 10, and the central axis of the through groove 11 is collinear with the optical axis of the lens 84. The memory metal wire assembly 50 is disposed around the through groove 11. The memory metal wire assembly 50 is also electrically connected to the second circuit board 20 (see...). Figure 6 This is used to drive the second circuit board 20 and the electrical connection assembly 40 to move simultaneously in a plane perpendicular to the third direction Z. The direction from the second circuit board 20 to the photosensitive chip 30 is defined as the third direction Z.
[0085] When the lens module 100 is working, if the first circuit board 10 causes the lens 84 to shake, the memory metal wire assembly 50 drives the second circuit board 20 to move the photosensitive chip 30 in a plane perpendicular to the third direction Z, so that the moving direction of the photosensitive chip 30 is consistent with the shaking direction of the lens 84, and the optical axis of the lens 84 is collinear with the central axis of the photosensitive chip 30, thereby compensating for the shaking of the lens 84 and improving the image quality.
[0086] See Figure 3 and Figure 4The second circuit board 20 is generally square and includes a first side 21, a second side 22, a third side 23, and a fourth side 24. The second side 22 and the fourth side 24 are both connected between the first side 21 and the third side 23. The second side 22 is parallel to the fourth side 24, and the first side 21 is parallel to the third side 23. The direction from the second side 22 to the fourth side 24 is defined as the first direction X, and the direction from the third side 23 to the first side 21 is defined as the second direction Y. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. The plane containing the photosensitive chip 30 is parallel to the plane formed by the first direction X and the second direction Y. In this embodiment, the first direction X is perpendicular to the second direction Y; in other embodiments, the first direction X and the second direction Y may form other angles.
[0087] See Figure 2 , Figure 3 and Figure 4 The electrical connection assembly 40 includes two sets of centrally symmetrically arranged first connectors 41 and two sets of centrally symmetrically arranged second connectors 42. The two sets of first connectors 41 are respectively connected to the second side 22 and the fourth side 24 of the second circuit board 20, and the two sets of second connectors 42 are respectively connected to the first side 21 and the third side 23 of the second circuit board 20. The electrical connection assembly 40 is electrically connected to the photosensitive chip 30 through the second circuit board 20.
[0088] When the memory metal wire assembly 50 drives the second circuit board 20 to move along the first direction X or the second direction Y, the arrangement of the two sets of first connectors 41 and the two sets of second connectors 42 improves the smoothness of the movement of the second circuit board 20 and avoids tilting or deflection when the second circuit board 20 moves.
[0089] See Figure 3 and Figure 4 Both the first connector 41 and the second connector 42 have at least three bends. When the photosensitive chip 30 moves in the first direction X or the second direction Y, the multiple bends make it easier for both the first connector 41 and the second connector 42 to undergo elastic deformation. This makes it easier for the memory metal wire assembly 50 to drive the photosensitive chip 30, reduces the resistance when the memory metal wire assembly 50 drives the second circuit board 20, and improves the flexibility of the memory metal wire assembly 50 in driving the photosensitive chip 30.
[0090] Specifically, the first connector 41 includes a plurality of spaced-apart metal strips 411. Each metal strip 411 includes a first bent portion 4111, a first movable portion 4112, a second bent portion 4113, a second movable portion 4114, and a third bent portion 4115 connected in sequence. The first bent portion 4111 is connected to the inner wall of the through groove 11 of the first circuit board 10, the first movable portion 4112 is arranged along the first direction X, the second bent portion 4113 is connected between the first movable portion 4112 and the second movable portion 4114, the second movable portion 4114 is arranged along the second direction Y, and the third bent portion 4115 is connected to the second side surface 22 of the second circuit board 20.
[0091] Please continue reading. Figure 2 , Figure 3 and Figure 4 When the lens module 100 is working, when the lens 84 vibrates along the first direction X, the first circuit board 10 controls the memory metal wire assembly 50 to drive the second circuit board 20 to move along the first direction X, and causes the second movable parts 4114 (such as square dashed frames) of multiple metal strips 411 to undergo elastic deformation in the first direction X, so that the central axis of the photosensitive chip 30 is aligned with the optical axis of the lens 84, thereby compensating for the optical shake of the lens 84 in the first direction X. When the lens 84 vibrates along the second direction Y, the first circuit board 10 controls the memory metal wire assembly 50 to work, and the memory metal wire assembly 50 drives the second circuit board 20 to move along the second direction Y, and causes the first movable parts 4112 (such as elliptical dashed frames) of multiple metal strips 411 to undergo elastic deformation in the second direction Y, so that the central axis of the photosensitive chip 30 is aligned with the optical axis of the lens 84, thereby compensating for the optical shake of the lens 84 in the second direction Y.
[0092] During the above process, since the first movable part 4112 and the second movable part 4114 are set at a 90° angle, when the metal strip 411 moves in the first direction X or the second direction Y, it only causes the corresponding second movable part 4114 or the first movable part 4112 to undergo elastic deformation, and does not generate a large reaction force on the second circuit board 20, thereby improving the flexibility of the memory metal wire assembly 50 in driving the second circuit board 20 to move. At the same time, when the second circuit board 20 moves along the first direction X or the second direction Y, the first bending part 4111 and the third bending part 4115 are used to buffer the connection between the metal strip 411 and the second circuit board 20 and the connection between the metal strip 411 and the first circuit board 10, respectively, to prevent tearing.
[0093] Please see Figure 3 and Figure 4, in some embodiments, the two groups of first connectors 41 are centrosymmetric about the center of the two groups of second connectors 42, and the two groups of second connectors 42 are centrosymmetric about the center of the two groups of first connectors 41. In this embodiment, the structure of the second connector 42 can be the same as that of the first connector 41, and the two groups of first connectors 41 and the two groups of second connectors 42 form a rotationally symmetric structure formed by rotating 90° around the center of the second circuit board 20. The two groups of first connectors 41 and the two groups of second connectors 42 form a substantially "卐" - shaped structure, which can further improve the stability of the movement of the second circuit board 20 and the photosensitive chip 30 when the shape memory alloy wire assembly 50 drives the second circuit board 20 to move.
[0094] Under the drive of the shape memory alloy wire assembly 50, when the second circuit board 20 moves along the first direction X, all the second movable parts 4114 in the first connectors 41 and the second connectors 42 undergo elastic deformation (such as the square dotted line frame). When the second circuit board 20 moves along the second direction Y, all the first movable parts 4112 in the first connectors 41 and the second connectors 42 undergo elastic deformation (such as the oval dotted line frame). In some embodiments, the structure of the electrical connection component 40 can also be set as a "卍" - shaped structure.
[0095] Refer to Figure 4 and Figure 5 , the through - slot 11 of the first circuit board 10 is also substantially square, and the second circuit board 20 is located at the center of the through - slot 11. The through - slot 11 has a first inner wall 111, a second inner wall 112, a third inner wall 113, and a fourth inner wall 114 that are connected end to end. The first side 21 faces the first inner wall 111. The second side 22 faces the second inner wall 112. The third side 23 faces the third inner wall 113. The fourth side 24 faces the fourth inner wall 114. The second inner wall 112 to the fourth inner wall 114 are arranged along the first direction X, and the first inner wall 111 to the third inner wall 113 are arranged along the second direction Y. The first bent portion 4111 of the metal strip 411 is connected to the first inner wall 111, and the third bent portion 4115 is connected to the second side 22. Compared with the structure in which the third bent portion 4115 is directly connected to the first side 21, in the structure of the electrical connection component 40 of the present application, connecting the third bent portion 4115 to the second side 22 can not only reduce the size of the gap 12 or increase the movement space of the electrical connection component 40, but also reduce the force on the second bent portion 4113 during movement, and further reduce the force of the shape memory alloy wire assembly 50 on the second circuit board 20.
[0096] Meanwhile, compared to the structure where the metal strip 411 is connected to the bottom of the second circuit board 20, in this embodiment, the third bend 4115 of the metal strip 411 is connected to each side of the second circuit board 20. This not only reduces the length of the metal strip 411, but also shortens the height of the second circuit board 20 and the photosensitive chip 30 in the third direction Z, which is beneficial to the thinning and lightening of the lens module 100.
[0097] See Figure 4 In some embodiments, the first inner wall 111 has a connecting section 1111, which is a portion of the first inner wall 111 near the fourth inner wall 114. The first bend 4111 is connected to the first inner wall 111 via the connecting section 1111, thus increasing the length of the first movable part 4112. When the second circuit board 20 moves along the second direction Y, the flexibility of the second movable part 4114 is increased, the tearing of the first bend 4111 is reduced, and the force exerted by the shape memory metal wire assembly 50 on the second circuit board 20 is further reduced.
[0098] See Figure 4 and Figure 5 In some embodiments, on a cross-section perpendicular to the second direction Y, the length L1 of the metal strip 411 in the third direction Z is greater than the length L2 of the metal strip 411 in the second direction Y. When the memory metal wire assembly 50 drives the second circuit board 20 and the electrical connection assembly 40 to move simultaneously, since L1 is greater than L2, the movement of the metal strip 411 in the third direction Z can be suppressed, preventing the metal strip 411 from tilting up in the third direction Z and affecting the stability of the movement of the second circuit board 20. In this embodiment, the cross-section of the metal strip 411 is square; in other embodiments, it can also be trapezoidal, hexagonal, or other regular polygons.
[0099] In some embodiments, the metal strip 411 may be made of copper, silver, gold, aluminum, or alloys thereof. For economic reasons, copper is preferred. In this application, the metal strip 411 may be manufactured by etching.
[0100] See Figure 6 and Figure 7 In some embodiments, the lens module 100 further includes a transmission member 60, which is fixed to the second circuit board 20 and electrically connected to the second circuit board 20 and the memory metal wire assembly 50. The memory metal wire assembly 50 drives the second circuit board 20 to move via the transmission member 60.
[0101] See Figure 6 and Figure 7In some embodiments, the transmission member 60 includes a support ring 61 having a first end 611 and a second end 612 disposed opposite to each other. The support ring 61 is generally elliptical in shape, and the distance between the first end 611 and the second end 612 is the maximum length of the support ring 61. The first end 611 and the second end 612 are located above the first circuit board 10, ensuring that the second circuit board 20 can move within the plane formed by the first direction X and the second direction Y when the second circuit board 20 moves.
[0102] See Figure 6 and Figure 7 The memory metal wire assembly 50 includes four memory metal wires 51 and two sets of fixing clips 52. The two sets of fixing clips 52 are diagonally fixed to the first circuit board 10 about the support ring 61 and are electrically connected to the first circuit board 10. One end of each memory metal wire 51 is fixed to the fixing clip 52, and the other end is fixed to either the first end 611 or the second end 612, so that the four memory metal wires 51, the two sets of fixing clips 52, the first end 611, and the second end 612 form a square. All four memory metal wires 51 are positioned close to the edge of the through slot 11. Two parallel memory metal wires 51 extend along the first direction X, and the other two parallel memory metal wires 51 extend along the second direction Y. All four memory metal wires 51 are connected to an external circuit (not shown). After being energized, the resistance is increased, causing the memory metal wires 51 to deform due to heat, thereby undergoing elastic deformation in the first direction X or the second direction Y, and driving the second circuit board 20 to move via the support ring 61. The first circuit board 10, the fixing clip 52, the memory metal wire 51, the transmission component 60, the second circuit board 20, and the electrical connection assembly 40 form a closed circuit loop.
[0103] In some embodiments, the end of the memory metal wire 51 is connected to the first end 611 or the second end 612 by means of winding, clamping or threading, so as to increase the contact area between the memory metal wire 51 and the first end 611 or the second end 612 and improve the support for the memory metal wire 51.
[0104] See Figure 6 and Figure 7 In some embodiments, the first circuit board 10 is also provided with a thermistor 71. The thermistor 71 is electrically connected to the first circuit board 10 and is located near the side of the memory metal line 51. The thermistor 71 is used to monitor the temperature of the memory metal line 51 so that the temperature change of the memory metal line 51 can be fed back to the first circuit board 10 in a timely manner so that the first circuit board 10 can accurately control the movement of the second circuit board 20 through the memory metal line 51.
[0105] See Figure 6 and Figure 7In some embodiments, the transmission member 60 further includes a fixing ring 62 disposed within the support ring 61. The fixing ring 62 is concentrically disposed with the support ring 61. The surface of the fixing ring 62 facing the second circuit board 20 has multiple protrusions 621. The second circuit board 20 has extension blocks 25 at positions corresponding to the protrusions 621. The fixing ring 62 is fixed to the extension blocks 25 via the protrusions 621, and the photosensitive chip 30 is located within the fixing ring 62. The arrangement of the support ring 61 and the fixing ring 62 improves the structural strength of the transmission member 60 in supporting the memory metal wire 51. In this embodiment, all four extension blocks 25 are disposed at the corners of the second circuit board 20, which not only ensures the smoothness of the movement of the second circuit board 20 driven by the transmission member 60 but also avoids interference with the movement of the electrical connection assembly 40.
[0106] In this embodiment, conductive adhesive (not shown) is provided between the protrusion 621 and the extension block 25, as well as between the fixing clip 52 and the first circuit board 10.
[0107] See Figure 7 and Figure 8 In some embodiments, the lens module 100 further includes a reinforcing plate 72, which is disposed on the side of the second circuit board 20 away from the photosensitive chip 30 to improve the structural strength of the second circuit board 20.
[0108] See Figure 2 and Figure 8 In some embodiments, a first protective plate 75 and a second protective plate 76 are provided on both sides of the second circuit board 20. The first protective plate 75 also has a through hole 751, the size of which corresponds to the size of the fixing ring 62. In this embodiment, the through hole 751 is approximately square. The edges of the first protective plate 75 and the second protective plate 76 are fixed to the first circuit board 10 to protect the electrical connection assembly 40 and the memory metal wire assembly 50 from external interference.
[0109] Meanwhile, in this application, the heat generated by the photosensitive chip 30 after working for a period of time can be transferred to multiple metal strips 411 and reinforcing plate 72 via the second circuit board 20 to improve the heat dissipation efficiency of the photosensitive chip 30.
[0110] See Figure 2 and Figure 7In some embodiments, the lens module 100 further includes multiple limiting blocks 73 and multiple ball bearings 74. The limiting blocks 73 are fixed to the surface of the reinforcing plate 72 facing away from the second circuit board 20. The limiting block 73 has a limiting groove 731, and the ball bearings 74 are rotatably connected within the limiting groove 731. In this embodiment, four ball bearings 74 are used as an example. The four ball bearings 74 are slidably disposed on the second protective plate 76, which not only provides support for the reinforcing plate 72 but also improves the flexibility of the second circuit board 20 in moving along the first direction X or the second direction Y. In this embodiment, the surfaces of the first protective plate 75 and the second protective plate 76 facing the first circuit board 10 are coated with an insulating layer.
[0111] See Figure 2 and Figure 8 In some embodiments, the lens module 100 further includes a mounting bracket 81, a filter 82, and a voice coil motor 83. The mounting bracket 81 has a mounting groove 811, the filter 82 is fixedly disposed in the mounting groove 811, and the mounting bracket 81 is bonded to the second circuit board 20. The voice coil motor 83 is mounted on the first protective plate 75, and the lens 84 is mounted on the voice coil motor 83. The voice coil motor 83 drives the lens 84 to move along a third direction Z to achieve focusing of the lens 84.
[0112] See Figure 9 This application also provides an electronic device 200, wherein the lens module 100 can be applied to various electronic devices 200 with camera modules, such as mobile phones, wearable devices, vehicles, cameras, or monitoring devices. In this embodiment, the lens module 100 is applied to a mobile phone.
[0113] In this application, when the lens module 100 is working, if the lens 84 shakes, the memory metal wire assembly 50 simultaneously drives the photosensitive chip 30 and the electrical connection assembly 40 to move within the plane formed by the first direction X and the second direction Y, so that the central axis of the photosensitive chip 30 is aligned with the optical axis of the lens 84, thereby compensating for the shake of the lens 84. The structure provided in this application is simple and easy to assemble. In this application, the arrangement of two sets of first connectors 41 and two sets of second connectors 42 can improve the stability of the photosensitive chip 30 when moving in the first direction X or the second direction Y, and prevent the photosensitive chip 30 from tilting or shifting.
[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.
Claims
1. A lens module, characterized in that, include: The first circuit board has a through groove, and the through groove has a first inner wall, a second inner wall, a third inner wall and a fourth inner wall connected in sequence. The lens is mounted on the first circuit board; A second circuit board is disposed within the through groove and has a gap between it and the inner wall of the through groove. The second circuit board includes a first side, a second side, a third side, and a fourth side. The second side and the fourth side are spaced apart between the first side and the third side. The second side and the fourth side are spaced apart along the first direction, and the third side and the first side are spaced apart along the second direction. The first side faces the first inner wall, the second side faces the second inner wall, the third side faces the third inner wall, and the fourth side faces the fourth inner wall. A photosensitive chip is disposed on the second circuit board, and a plane formed by a first direction and a second direction that are perpendicular to each other is defined to be parallel to the plane on which the photosensitive chip is located; An electrical connection assembly is disposed within the gap. The electrical connection assembly is electrically connected to the first circuit board and the second circuit board respectively. The electrical connection assembly includes two sets of first connectors and two sets of second connectors. The two ends of one set of first connectors are respectively connected to the first inner wall and the second side, and the two ends of the other set of first connectors are respectively connected to the third inner wall and the fourth side. The two ends of one set of second connectors are respectively connected to the second inner wall and the third side, and the two ends of the other set of second connectors are respectively connected to the fourth side wall and the first side. The first connector includes multiple metal strips. Each metal strip includes a first bent portion, a first movable portion, a second bent portion, a second movable portion, and a third bent portion connected in sequence. The first bent portion is connected to the first inner wall or the third inner wall. The first movable portion is arranged along the first direction. The second bent portion is connected between the first movable portion and the second movable portion. The second movable portion is arranged along the second direction. The third bent portion is connected to the second side or the fourth side. A memory metal wire assembly is disposed on and electrically connected to the first circuit board. The memory metal wire assembly is also connected to the second circuit board and is used to drive the photosensitive chip to move in the plane through the electrical connection assembly.
2. The lens module as described in claim 1, characterized in that, The two sets of first connectors are centrally symmetrical about the center of the two sets of second connectors, and the two sets of second connectors are centrally symmetrical about the center of the two sets of first connectors.
3. The lens module as described in claim 1, characterized in that, The first inner wall has a connecting section, which is the area of the first inner wall near the fourth inner wall, and the first bent portion is connected to the first inner wall through the connecting section.
4. The lens module as described in claim 1, characterized in that, A third direction is defined to be perpendicular to the first direction and the second direction; in a cross-section perpendicular to the second direction, the length of the metal strip in the third direction is greater than the length of the metal strip in the second direction.
5. The lens module as described in claim 1, characterized in that, The lens module also includes a transmission component, which is electrically connected to and disposed on the second circuit board, and is electrically connected to the memory metal wire assembly.
6. The lens module as described in claim 5, characterized in that, The transmission component includes a support ring fixed to the second circuit board. The support ring has a first end and a second end that are oppositely disposed, with the first end and the second end located above the first circuit board. The memory metal wire assembly includes four memory metal wires and two sets of fixing clips. The two sets of fixing clips are fixed diagonally to the first circuit board about the support ring. One end of each memory metal wire is fixed to the fixing clip, and the other end is fixed to either the first end or the second end. The four memory metal wires, the two sets of fixing clips, the first end, and the second end form a square.
7. The lens module as described in claim 6, characterized in that, The transmission component also includes a fixing ring disposed within the support ring, and the fixing ring is fixed to the second circuit board.
8. The lens module as described in claim 1, characterized in that, The lens module also includes a reinforcing plate, which is disposed on the side of the second circuit board away from the photosensitive chip.
9. An electronic device, characterized in that, Includes the lens module as described in any one of claims 1 to 8.