Looped two-phase flow heat sink

Abstract

The application discloses a loop type two-phase flow radiator, which comprises a heat dissipation base, a capillary evaporation assembly assembled on the heat dissipation base and in contact with a heat source, and a return flow cavity, a capillary evaporation cavity and a buffer cavity in communication. The capillary evaporation cavity is provided with a capillary structure. The pipeline comprises a cooling pipeline and a return flow pipeline, and the diameters of the connecting positions of the cooling pipeline and the return flow pipeline are different. The application is provided with a gas-liquid two-phase flow medium in the pipeline. The liquid at the capillary structure absorbs the heat of the heat source by using latent heat, so that the bottom surface is uniformly heated. The liquid medium is evaporated in the capillary structure. The generated steam flows into the cooling pipeline from the buffer cavity and releases latent heat to form liquid medium. The liquid medium flows into the return flow pipeline and the return flow cavity under the action of capillary pressure and the thrust of the steam. The radiator has better heat dissipation effect. The circulation of the liquid medium is completed by the capillary force generated by the capillary structure and the thrust of the gaseous steam, and no additional driving force is needed. The radiator has high heat dissipation efficiency and good effect.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically to a loop-type two-phase flow heat sink. Background Technology

[0002] Due to the rapid development and application of communication equipment, the requirements for heat dissipation have become increasingly stringent. Traditional finned heat sinks are no longer sufficient to meet heat dissipation needs in limited spaces. Solutions to these heat dissipation problems often involve forced convection with fans, water cooling, or heat pipe-assisted heat transfer. In this method, the evaporation section of the heat pipe is heated, and the working fluid inside the pipe evaporates, carrying away heat (the latent heat of vaporization). The vapor flows from the central channel to the condensation section of the heat pipe, condenses into liquid, and releases latent heat. Under capillary action, the liquid flows back to the evaporation section, completing a closed loop and transferring a large amount of heat from the heating section to the cooling section. However, forced convection with fans requires ample space for fan installation and consumes electricity. While water cooling offers better performance, it requires significant space for cooling equipment and is costly. Heat pipes, due to their linear temperature distribution, have a limited area of ​​application and poor temperature uniformity. For small heat sources with limited space, heat pipe temperature uniformity is less than ideal. As products increasingly move towards higher power and integration, heat pipes are no longer sufficient to meet the demands. Summary of the Invention

[0003] In view of this, the present invention provides a loop-type two-phase flow heat sink.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a loop-type two-phase flow heat sink, comprising: Heat dissipation base; The capillary evaporation assembly is mounted on a heat dissipation base and is in contact with a heat source. The capillary evaporation assembly has a connected reflux chamber, a capillary evaporation chamber and a buffer chamber. The pipe has one end connected to the return chamber and the other end connected to the buffer chamber to form a loop. The capillary evaporation chamber is provided with a capillary structure; The pipe is pre-embedded in the heat dissipation base to conduct heat to the heat dissipation base. The pipe includes a cooling pipe and a return pipe. The diameters of the cooling pipe and the return pipe are different at the connection to generate capillary pressure to drive the flow of the medium. The pipeline contains a pre-set gas-liquid two-phase flow medium. The liquid in the capillary structure absorbs heat from the heat source using latent heat, resulting in a uniform temperature at the bottom surface. The liquid medium evaporates within the capillary structure, and the generated vapor flows from the buffer chamber into the cooling pipe. Through the heat dissipation effect of the cooling pipe, the latent heat is released to form a liquid medium. Under the action of capillary pressure and the thrust of the vapor, the liquid medium flows into the return pipe and then into the return chamber. The gas-liquid two-phase flow medium circulates within the pipeline and the capillary evaporation assembly, uniformly distributing the heat from the heat source to the heat dissipation base.

[0005] In a preferred embodiment of the present invention, the reflux chamber is connected to the capillary evaporation chamber, and the reflux pipe is connected to the reflux chamber; The buffer chamber is connected to the capillary evaporation chamber, and the cooling pipe is connected to the buffer chamber.

[0006] In a preferred embodiment of the present invention, the reflux chamber and the capillary evaporation chamber are connected through a first reflux hole, which is located at a low position; the buffer chamber and the capillary evaporation chamber are connected through a second reflux hole, which is located at a high position. The second return orifice is larger than the first return orifice.

[0007] In a preferred embodiment of the present invention, the diameter of the return pipe is smaller than the diameter of the cooling pipe.

[0008] As a preferred embodiment of the present invention, a capillary structure is sintered inside the capillary evaporation chamber.

[0009] In a preferred embodiment of the present invention, the capillary evaporation assembly is connected to the heat source region.

[0010] In a preferred embodiment of the present invention, the first side of the heat dissipation base is provided with a mounting groove, the mounting groove having an open side, and the capillary evaporation component and the pipe are installed in the mounting groove. The second side of the heat dissipation base is provided with heat dissipation fins.

[0011] In a preferred embodiment of the present invention, the capillary evaporation assembly is connected to a pipe; at least one set of capillary evaporation assemblies and pipes are distributed on the heat dissipation base.

[0012] As a preferred embodiment of the present invention, the capillary evaporation assembly includes: a base and a top cover, which are assembled together. The bottom is constructed with the aforementioned reflux chamber, capillary evaporation chamber and buffer chamber, which are arranged sequentially.

[0013] As a preferred embodiment of the present invention, the base is provided with a partition step, the partition step including: a first partition step provided between the reflux chamber and the capillary evaporation chamber, the first partition step extending from the inner bottom wall of the base to the inner bottom wall of the upper cover, and a first reflux hole provided on the first partition step; A second partition step is provided between the capillary evaporation chamber and the buffer chamber. The second partition step extends from the inner bottom wall of the base towards the upper cover, forming a second reflux hole between the inner bottom wall of the upper cover and the top wall of the second partition step.

[0014] As can be seen from the above technical solution, compared with the prior art, the present invention has the following beneficial technical effects: 1. This invention installs a capillary evaporation component and pipes within a heat dissipation base. A gas-liquid two-phase flow medium circulates within the capillary evaporation component and pipes, absorbing and releasing heat through latent heat. This distributes the heat from the heat source evenly across the heat dissipation base, achieving a uniform surface temperature. The heat source cools down rapidly. The heat dissipation base has a toothed structure or is formed by aluminum extrusion, resulting in a large contact area with the airflow. As the airflow passes through the heat dissipation base, it can quickly carry away the heat from the base, resulting in good heat dissipation and high efficiency.

[0015] 2. This invention utilizes the characteristic of liquid media boiling within a capillary structure when heated. The gas-liquid media boil and mix, forming a two-phase flow. The gaseous media in the cooling pipe, aided by the heat dissipation base, rapidly releases heat and liquefies. The gaseous media releases heat while flowing, becoming a gas-liquid mixture. At the heat source, the liquid media continuously absorbs heat using latent heat, resulting in a uniform temperature on the bottom surface. This is surface-area temperature uniformity, which is more effective. The circulation of the liquid media is accomplished by the capillary force generated by the capillary structure and the driving force of the gas vapor, without the need for additional external driving force, resulting in high heat dissipation efficiency and good effect. 3. In gas-liquid two-phase flow, evaporative cooling utilizes the process of liquid (liquid phase) substances transforming into vapor (gas phase) at the same temperature, absorbing heat to cool the surface of the heat source. In the evaporative heat dissipation process, heat is transferred from the hot wall to the liquid substance in contact with it. The liquid medium continuously generates vapor, and the vapor carries away heat, keeping the temperature of the liquid substance constant. Even if the heat increases, it only increases the vapor production, while the temperature of the liquid substance remains unchanged. The heat dissipation base transfers heat to the surrounding air through convection heat exchange with the air. The medium also changes from a gaseous state to a liquid state, releasing heat. Under the action of capillary force and the driving force of the gas-liquid mixture, it returns to the heat source, thus completing the cycle. When the gas-liquid mixed medium releases heat and becomes liquid during the convection heat exchange between the heat dissipation fins and the air, it returns to the heat source side through the return tube. The whole process is a comprehensive utilization of the latent heat of vaporization and the principle of convection heat exchange, with a heat exchange capacity that is higher than traditional cooling methods and even higher than general convection heat exchange. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the first embodiment of the loop-type two-phase flow radiator of the present invention; Figure 2 This is a side view of the first embodiment of the loop-type two-phase flow radiator of the present invention; Figure 3 This is an exploded view of the first embodiment of the loop-type two-phase flow radiator of the present invention. Figure 4 This is an exploded view of the capillary evaporation assembly of the loop-type two-phase flow radiator of the present invention; Figure 5 This is a schematic diagram of a second embodiment of the loop-type two-phase flow radiator of the present invention; Figure 6 This is a side view of a second embodiment of the loop-type two-phase flow radiator of the present invention; Figure 7 This is the first method of installing the pipe on the heat dissipation base in this invention; Figure 8 This is the second method of installing the pipe on the heat dissipation base in this invention.

[0018] Explanation of reference numerals in the attached figures: Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0020] For loop-type two-phase flow radiators, please refer to [link / reference]. Figure 1-3 As shown, it includes: a heat dissipation base 100, a capillary evaporation assembly 200, and a pipe 300.

[0021] The heat dissipation base 100 can be made of a high-quality heat-absorbing material, such as a heat dissipation aluminum block commonly used in the prior art. The heat dissipation base 100 has a first surface 101.

[0022] The capillary evaporation assembly 200 is mounted on the first surface of the heat dissipation base 100. The capillary evaporation assembly 200 needs to be exposed on the heat dissipation base 100 so as to contact the heat source 400. Here, the heat source 400 refers to different structures depending on the field in which the present invention is applied. The capillary evaporation assembly 200 has a reflux chamber 210, a capillary evaporation chamber 220 and a buffer chamber 230 that are connected. In this embodiment, the reflux chamber 210, the capillary evaporation chamber 220 and the buffer chamber 230 are linearly distributed. A capillary structure 221 is provided in the capillary evaporation chamber 220. The capillary structure 221 can be made of copper material by sintering. The capillary structure 221 has many micropores and absorbs the liquid medium in the reflux chamber 210 through capillary action.

[0023] The first end of the pipe 300 is connected to the return chamber 210, and the second end is connected to the buffer chamber 230 to form a loop. The pipe 300 includes a cooling pipe 310 and a return pipe 320. The diameters of the connection between the cooling pipe 310 and the return pipe 320 are different, and the diameter of the return pipe 320 is smaller than the diameter of the cooling pipe 310 to generate capillary pressure to drive the medium to flow.

[0024] Before use, a gas-liquid two-phase flow medium is injected into the capillary evaporation assembly 200 through an injection tube. After injection, the injection tube is removed and the injection hole of the capillary evaporation assembly 200 is sealed. This sealing can be injection molding to maintain the mass of the gas-liquid two-phase flow medium in the entire loop-type two-phase flow radiator.

[0025] The liquid at the capillary structure 221 absorbs heat from the heat source 400 using latent heat, making the bottom surface uniformly heated. The liquid medium evaporates in the capillary structure 221, and the generated steam flows from the buffer chamber 230 into the cooling pipe 310 and releases latent heat through the heat dissipation effect of the cooling pipe 310 to form a liquid medium. Under the action of capillary pressure and the thrust of steam, the liquid medium flows into the return pipe 320 and into the return chamber 210.

[0026] Traditional heat dissipation methods involve mounting the heat source 400 on the heat dissipation base 100 or having it in direct contact with the heat dissipation base 100, relying on the heat dissipation base 100 itself for heat dissipation. This results in a situation where the temperature at the contact point between the heat dissipation base 100 and the heat source 400 is high, while the surrounding temperature is low, leading to poor heat dissipation efficiency. In this embodiment, the capillary evaporation component 200 is mounted on the heat dissipation base 100 and is in contact with the heat source 400. The liquid medium at the capillary structure 221 continuously absorbs heat from the heat source 400 through latent heat, generating steam. The steam carries away heat, keeping the temperature of the liquid constant. Even if the heat increases, it only increases the steam production while the temperature of the liquid remains unchanged. The steam enters the buffer chamber 230 and then from the buffer chamber 230 into the cooling pipe 310. During its flow in the cooling pipe 310, it cools and exchanges heat, releasing heat and converting into liquid. The heat dissipation base 100 absorbs the heat. Steam changes from a gaseous state to a liquid state in cooling pipe 310. A gas-liquid two-phase flow medium exists within cooling pipe 310. At the junction of cooling pipe 310 and return pipe 320, under the action of capillary force and the driving force of the gas-liquid two-phase flow medium, the liquid medium is propelled into return pipe 320 and then back to return chamber 210, thus circulating. Through the circulation of the gas-liquid two-phase flow medium within pipe 300, heat is transferred to heat dissipation base 100, achieving rapid and effective heat dissipation.

[0027] In one embodiment, the reflux chamber 210 is connected to the capillary evaporation chamber 220, and the reflux pipe 320 is connected to the reflux chamber 210; the buffer chamber 230 is connected to the capillary evaporation chamber 220, and the cooling pipe 310 is connected to the buffer chamber 230.

[0028] like Figure 1 In this embodiment, a circulation path is provided on the heat dissipation base 100, and the diameter at the connection between the cooling pipe 310 and the return pipe 320 is gradually reduced, which helps to promote the unidirectional flow of the liquid medium by capillary force. At the same time, the gradually reduced diameter at the connection is also to prevent the sudden change in pipe diameter from causing a reverse impact force that would interfere with the flow of the liquid medium.

[0029] In one embodiment, the reflux chamber 210 is connected to the capillary evaporation chamber 220 through a first reflux hole 211, which is located at a low position; the buffer chamber 230 is connected to the capillary evaporation chamber 220 through a second reflux hole 231, which is located at a high position; the second reflux hole 231 is larger than the first reflux hole 211. After the liquid medium flows back to the return cavity 210, the capillary structure 221 absorbs the liquid medium in the return cavity 210 through capillary force. At the same time, the liquid medium absorbs heat in the capillary structure 221 through latent heat to form steam. The liquid medium moves in the capillary structure 221 in a roughly upward path. During the movement, it absorbs heat through latent heat to form steam. Therefore, the first return hole 211 needs to be distributed at a low position. At the same time, the pore size of the first return hole 211 is smaller than that of the second return hole 231. The liquid medium slowly seeps into the capillary structure 221 through the principle of capillary permeation and absorbs heat through latent heat, thus fully converting the liquid medium into a gaseous medium.

[0030] Since the liquid medium absorbs heat and converts into steam, i.e. gas, the gaseous medium rises and flows. Therefore, the second return hole 231 is located at a high position, flows into the buffer chamber 230 and then into the cooling pipe 310.

[0031] In one embodiment, the heat dissipation base 100 has a toothed structure or is manufactured using an aluminum extrusion process, which has good thermal conductivity. Furthermore, the heat dissipation base 100 has a large contact area with the airflow as air flows over it, thus achieving rapid heat dissipation.

[0032] The heat dissipation base 100 has a mounting groove 110 on its first side, with an open side, where the capillary evaporation assembly 200 and the pipe 300 are installed; the heat dissipation base 100 has heat dissipation fins 120 on its second side.

[0033] Specifically, such as Figure 3 As shown, the cooling pipe 310 and the return pipe 320 can be made of copper pipe, which has good thermal conductivity. As explained above, since the capillary evaporation component 200 needs to be connected to the heat source 400, the capillary evaporation component 200 is installed in the mounting groove 110 and exposed to the outside. The pipe 300 can be embedded in the heat dissipation base 100 or exposed in the heat dissipation base 100. Here, the preferred method is to install it in the mounting groove 110 and expose it in the heat dissipation base 100.

[0034] Pipe 300 is installed in mounting groove 110 in two ways, such as... Figure 7 As shown, the first type is a pre-set mounting groove 110 on the heat dissipation base 100. The mounting groove 110 is flat. The pipe 300 is flattened and tightly installed in the mounting groove 110, and then glued and soldered to fix it. like Figure 8 As shown, in the second method, the pipe 300 is a round pipe and the mounting groove 110 is a round hole. After the pipe 300 is installed in the mounting groove 110, it is directly filled with glue and soldered to fix it.

[0035] The second side of the heat dissipation base 100 is assisted by heat dissipation fins 120. In this embodiment, the heat dissipation fins 120 are distributed perpendicular to the second side of the heat dissipation base 100.

[0036] In one embodiment, the capillary evaporation assembly 200 is connected to a pipe 300, and at least one set of capillary evaporation assemblies 200 and pipes 300 are distributed on the heat dissipation base 100.

[0037] Specifically, such as Figure 4 As shown, the capillary evaporation assembly 200 includes: a base 201 and a top cover 202, which are assembled together and the interior is sealed after assembly; the base 201 and the top cover 202 can be made of thermally conductive metal, such as copper. The base 201 is constructed with the aforementioned reflux chamber 210, capillary evaporation chamber 220 and buffer chamber 230, which are arranged sequentially. The base 201 is provided with a partition step, which includes a first partition step 203 disposed between the reflux chamber 210 and the capillary evaporation chamber 220. The first partition step 203 extends from the inner bottom wall of the base 201 to the inner bottom wall of the upper cover 202. A first reflux hole 211 is provided on the first partition step 203. A second partition step 204 is formed between the capillary evaporation chamber 220 and the buffer chamber 230. The second partition step 204 extends from the inner bottom wall of the base 201 towards the upper cover 202, forming a second reflux hole 231 between the inner bottom wall of the upper cover 202 and the top wall of the second partition step 204.

[0038] Alternatively, an upwardly protruding partition step can be directly provided on the base 201, with the partition step directly connected to the inner bottom wall of the upper cover 202, and the first return hole 211 and the second return hole 231 can be opened at the two partition steps respectively.

[0039] like Figure 1 As shown, in one embodiment, a set of capillary evaporation components 200 and pipes 300 are provided on the heat dissipation base 100. The gas-liquid two-phase flow medium circulates in the capillary evaporation components 200 and pipes 300, absorbs heat from the heat source 400 through latent heat, releases latent heat in the cooling pipes 310 and transforms into liquid, and dissipates heat through the heat dissipation base 100, resulting in high heat dissipation efficiency. In one embodiment, two sets of capillary evaporation components 200 and pipes 300 may be provided on the heat dissipation base 100, such as... Figure 5-6 As shown, each group of capillary evaporation components 200 is connected to a heat source 400 to achieve rapid heat dissipation. Therefore, the number of capillary evaporation components 200 and pipes 300 can be improved according to the number of heat sources 400.

[0040] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A loop-type two-phase flow radiator, characterized in that: include: Heat dissipation base; The capillary evaporation assembly is mounted on a heat dissipation base and is in contact with a heat source. The capillary evaporation assembly has a connected reflux chamber, a capillary evaporation chamber and a buffer chamber. The pipe has one end connected to the return chamber and the other end connected to the buffer chamber to form a loop. The capillary evaporation chamber is provided with a capillary structure; The pipe is pre-embedded in the heat dissipation base to conduct heat to the heat dissipation base. The pipe includes a cooling pipe and a return pipe. The diameters of the cooling pipe and the return pipe are different at the connection. The diameter of the return pipe is smaller than that of the cooling pipe, so as to generate capillary pressure to drive the medium to flow. The pipeline is pre-filled with a gas-liquid two-phase flow medium. The liquid in the capillary structure absorbs heat from the heat source using latent heat, making the bottom surface uniformly heated. The liquid medium evaporates in the capillary structure, and the generated steam flows from the buffer chamber into the cooling pipe. Through the heat dissipation effect of the cooling pipe, the latent heat is released to form a liquid medium. Under the action of capillary pressure and the thrust of steam, the liquid medium flows into the return pipe and then into the return chamber. The gas-liquid two-phase flow medium circulates in the pipeline and the capillary evaporation assembly, so that the heat from the heat source is evenly distributed to the heat dissipation base. The capillary evaporation assembly includes: a base and a top cover, which are assembled together. The bottom has the aforementioned reflux chamber, capillary evaporation chamber and buffer chamber, which are arranged sequentially. The base is provided with a partition step, which includes: a first partition step provided between the reflux chamber and the capillary evaporation chamber, the first partition step extending from the inner bottom wall of the base to the inner bottom wall of the upper cover, and a first reflux hole provided on the first partition step, the first reflux hole being distributed at a low position; A second partition step is provided between the capillary evaporation chamber and the buffer chamber. The second partition step extends from the inner bottom wall of the base towards the upper cover, forming a second reflux hole between the inner bottom wall of the upper cover and the top wall of the second partition step. The second reflux hole is located at a high position.

2. The loop-type two-phase flow radiator according to claim 1, characterized in that: The reflux chamber is connected to the capillary evaporation chamber, and the reflux pipe is connected to the reflux chamber; The buffer chamber is connected to the capillary evaporation chamber, and the cooling pipe is connected to the buffer chamber.

3. The loop-type two-phase flow radiator according to claim 2, characterized in that: The reflux chamber is connected to the capillary evaporation chamber through a first reflux hole, which is located at a low position. The buffer chamber is connected to the capillary evaporation chamber through a second reflux hole, which is located at a high position. The second return orifice is larger than the first return orifice.

4. The loop-type two-phase flow radiator according to claim 1 or 3, characterized in that: The diameter of the return pipe is smaller than the diameter of the cooling pipe.

5. The loop-type two-phase flow radiator according to claim 1, characterized in that: The capillary evaporation chamber is sintered with capillary structures.

6. The loop-type two-phase flow radiator according to claim 4, characterized in that: The capillary evaporation assembly is connected to the heat source area.

7. The loop-type two-phase flow radiator according to claim 1, characterized in that: The heat dissipation base has a mounting groove on its first side, and the mounting groove has an open side. The capillary evaporation component and the pipe are installed in the mounting groove. The second side of the heat dissipation base is provided with heat dissipation fins.

8. The loop-type two-phase flow radiator according to claim 1, characterized in that: The capillary evaporation component is connected to a pipe; at least one set of capillary evaporation components and pipes are distributed on the heat dissipation base.

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