Cutting components and hair removal devices

Abstract

This invention relates to a cutting element comprising a substrate having at least one hole, the at least one hole including a cutting edge along at least a portion of the inner periphery of the hole, wherein the cutting edge has an asymmetrical cross-sectional shape with a first face, a second face opposite to the first face, and a cutting edge at the intersection of the first and second faces. Furthermore, this invention relates to a hair removal device including such a cutting element.

Description

[0001] This invention relates to a cutting element comprising a substrate having at least one hole, the at least one hole including a cutting edge along at least a portion of the inner periphery of the hole, wherein the cutting edge has an asymmetrical cross-sectional shape with a first face, a second face opposite to the first face, and a cutting edge at the intersection of the first and second faces. Furthermore, this invention relates to a hair removal device including such a cutting element.

[0002] A conventional razor contains multiple straight cutting blades aligned parallel to each other, and these blades move across the user's skin in a direction perpendicular to the cutting blades to cut body hair. Typically, the handle is attached to the multiple cutting blades at this vertical angle to facilitate easy handling. However, this limits the razor to use only in that single vertical direction. Shaving in any other direction requires the user to change the orientation of their hand and arm holding the razor or to change the grip of the handle within the hand. Therefore, it is possible to shave back and forth across the body surface, but still limited to the direction perpendicular to the blades. Shaving laterally, as well as shaving in any other type of movement (such as circular or "8" shapes), is very difficult.

[0003] It is also known that moving a conventional straight cutting edge parallel to the skin results in a slicing motion that severely cuts the skin, because the skin protrudes into the gap between the cutting edges and thus extends along the entire length of the cutting edge as it moves parallel to the protrusion (like cutting a tomato with a knife).

[0004] This can be overcome by providing a cutting element comprising cutting blades that are short and surrounded by a solid material on all sides to create cutting edges located on the inner periphery of the holes. Such an array of holes containing cutting blades provides better support to the skin during shaving, flattens the skin, and reduces skin protrusion into the holes, resulting in a safer cutting element.

[0005] Furthermore, the cutting edge located on the inner periphery of the hole presents only a very short portion of the cutting edge parallel to any direction of movement, thus significantly reducing the risk of slicing action and cutting the user's skin.

[0006] Therefore, there is a need for cutting elements and hair removal devices that can be used anywhere on the skin surface of the body in any form of motion, such as back and forth, sideways, circular, "8" shape, or any other movement. For example, removing hair from under the arms with a circular motion is easier and more natural. It is also easier to shave up and down in some hard-to-reach and hard-to-see areas of the body without being restricted.

[0007] To enable multi-directional shaving, hair removal devices have previously been proposed consisting of a sheet of material containing circular or other shaped holes with cutting blades arranged along the inner periphery of these holes. However, manufacturing these devices from sheets of material such as metal requires the cutting blades to protrude from the plane of the sheet material and thus point towards the user's skin (US 2004 / 0187644 A1, WO2001 / 08856 A1, EP 0 917 934 A1, US5,293,768 B1). This leads to serious safety issues with these shaving devices, which is why there are currently no such devices on the market.

[0008] To improve safety and prevent the cutting edge from cutting the skin, it has been proposed to create a hole with a cutting edge along the inner periphery by etching a hole with a beveled edge along the inner periphery into, for example, a silicon wafer (US 7,124,511 B1, JP 2004 / 141360 A1, EP 1 173 311 A1, DE 35 26 951 A1).

[0009] It has been found that even with hard coatings such as DLC, all silicon cutting blades are too brittle to provide a durable shaving device, which is why there are currently no such devices available on the market.

[0010] Therefore, there is a need for a cutting element and hair removal device that can be safely used in multiple directions without too many skin protrusions, and has a cutting blade that effectively removes hair without cutting into the skin. This requires a cutting blade along the inner periphery of an array of holes located in an array plane, with the cutting blade having a bevel of less than 20°, which is durable enough to withstand frequent use.

[0011] Therefore, the present invention addresses this problem to overcome the aforementioned issues and provides a cutting element that effectively and safely handles multi-directional shaving, i.e., cutting hair without cutting the skin.

[0012] This problem is solved by a cutting element and hair removal device according to some embodiments of this application. Further embodiments define preferred embodiments of such shaving devices.

[0013] The term "comprising" in the claims and description of this application is not intended to exclude other components. Within the scope of this invention, the term "consisting of" should be understood as the preferred embodiment of the term "comprising". If a group is defined as "comprising" at least a specific number of components, this should also be understood as the disclosed group preferably "consisting of" those components.

[0014] In the following text, the term cross-sectional view refers to a view through a slice of the cutting element that is perpendicular to the cutting edge (if the cutting edge is straight) or perpendicular to the tangent of the cutting edge (if the cutting edge is curved) and perpendicular to the surface of the substrate of the cutting element.

[0015] The term "intersection line" must be understood with respect to perspective (e.g., ...). Figure 3 The intersection points between different inclined planes (according to, for example) Figure 4 The linear extension of a section view. For example, if two straight slopes are adjacent, the intersection in the section view extends to the line of intersection in the perspective view.

[0016] According to the present invention, a cutting element is provided, the cutting element comprising a substrate having at least one hole, the at least one hole comprising a cutting edge along at least a portion of the inner periphery of the hole, wherein the cutting edge has an asymmetrical cross-sectional shape with a first face, a second face opposite to the first face, and a cutting edge at the intersection of the first face and the second face.

[0017] The first face includes the first surface.

[0018] The second face includes a primary inclined plane, a secondary inclined plane, and a third inclined plane, among which...

[0019] ●The main bevel extends from the cutting edge to the secondary bevel.

[0020] ●The secondary slope extends from the primary slope to the third slope.

[0021] ●The first intersection line connects the primary and secondary inclined planes, and

[0022] ●The second intersection line connects the secondary inclined plane and the third inclined plane.

[0023] ●A first wedge angle θ1 exists between the first surface and the main inclined plane, and

[0024] ●A second wedge angle θ2 exists between the first surface and the secondary inclined plane, and

[0025] ● There is a third wedge angle θ3 between the first surface and the third inclined plane.

[0026] Surprisingly, it was found that when the wedge angle meets the following conditions, a cutting element with a very stable cutting edge and excellent cutting performance can be provided:

[0027] θ1≥θ2 and / or θ2≤θ3.

[0028] The cutting element according to the invention has low cutting force due to its thin, sub-beveled surface with a small wedge angle.

[0029] The cutting element according to the invention is strengthened by adding a primary bevel with a primary wedge angle greater than the secondary wedge angle. Therefore, the primary bevel with a first wedge angle θ1 has the function of mechanically stabilizing the cutting edge to prevent damage caused by the cutting operation, which allows for the formation of an elongated element body in the region of the secondary bevel without affecting the element's cutting performance.

[0030] Preferably, the substrate has a plurality of pores, for example more than 5, more preferably more than 10, more preferably more than 20, and even more preferably more than 50 pores.

[0031] According to a preferred embodiment, the cutting edge is formed along the inner periphery of the hole, thereby producing a circular cutting edge. However, according to another preferred embodiment, the cutting edge is formed only in a portion of the inner periphery of the hole.

[0032] The thickness of the substrate of the shaving device of the present invention is preferably 20µm to 1000µm, more preferably 30µm to 500µm, and even more preferably 50µm to 300µm.

[0033] According to a preferred embodiment of the shaving device, the substrate comprises a first material, more preferably consisting substantially of or composed of the first material.

[0034] According to another preferred embodiment, the substrate comprises a first material and a second material disposed adjacent to the first material. More preferably, the substrate is substantially composed of the first material and the second material, or composed of both. The second material may be deposited as a coating at least in the region of the first material; that is, the second material may be an encapsulating coating of the first material or a coating deposited on the first material on the first surface.

[0035] The material of the first material is generally not limited to any specific material, as long as it can be beveled. Preferably, the first material is different from the second material; more preferably, the second material has a higher hardness and / or a higher elastic modulus and / or a higher fracture stress than the first material.

[0036] However, according to an alternative embodiment, the blade body comprises only the first material or consists solely of the first material, i.e., the uncoated first material. In this case, the first material is preferably a material with an isotropic structure, i.e., having the same property values ​​in all directions. Such isotropic materials are generally more suitable for forming, regardless of the forming technology.

[0037] The first material preferably comprises or consists of a material selected from the group consisting of:

[0038] ● Metals, preferably titanium, nickel, chromium, niobium, tungsten, tantalum, molybdenum, vanadium, platinum, germanium, iron and their alloys, especially steel.

[0039] ●Ceramics comprising at least one element selected from the group consisting of: carbon, nitrogen, boron, oxygen, or combinations thereof, preferably silicon carbide, zirconium oxide, aluminum oxide, silicon nitride, boron nitride, tantalum nitride, AlTiN, TiCN, TiAlSiN, TiN, and / or TiB2.

[0040] ● Glass ceramics; preferably aluminum-containing glass ceramics.

[0041] ● Composite materials made of ceramic materials in a metal matrix (cermet).

[0042] ● Hard metals, preferably sintered carbide hard metals, such as tungsten carbide or titanium carbide bonded to cobalt or nickel.

[0043] ● Silicon or germanium, preferably having a crystal plane parallel to the second face, wafer orientation <100> , <110> , <111> or <211> ,

[0044] ●Single crystal materials,

[0045] ● Glass or sapphire

[0046] ● Polycrystalline or amorphous silicon or germanium

[0047] ● Single-crystal diamond or polycrystalline diamond, nanocrystalline and / or ultra-nanocrystalline diamond-like carbon (DLC), adamantane carbon, and

[0048] ● Their combination.

[0049] The steel used for the first material is preferably selected from the group consisting of: 1095, 12C27, 14C28N, 154CM, 3Cr13MoV, 4034, 40X10C2M, 4116, 420, 440A, 440B, 440C, 5160, 5Cr15MoV, 8Cr13MoV, 95X18, 9Cr18MoV, Acuto+, ATS-34, AUS-4, AUS-6 (=6A), AUS-8 (=8A), C75, CPM-10V, CPM-3V, CPM-D2, CPM-M4, CPM-S-30V, CPM-S-35VN, CPM-S-60V, CPM-154, Cronidur-30, CTS 204P, CTS 20CP, CTS 40CP, CTS B52, CTS B75P, CTS BD-1, CTS BD-30P, CTS XHP, D2, Elmax, GIN-1, H1, N690, N695, Niolox (1.4153), Nitro-B, S70, SGPS, SK-5, Sleipner, T6MoV, VG-10, VG-2, X-15T.N., X50CrMoV15, ZDP-189.

[0050] Preferably, the second material comprises or is composed of materials selected from the group consisting of said materials.

[0051] ●Oxides, nitrides, carbides, borides, preferably aluminum nitride, chromium nitride, titanium nitride, titanium carbon nitride, titanium aluminum nitride, and cubic boron nitride.

[0052] ●Boron, aluminum, magnesium

[0053] ● Carbon, preferably diamond, polycrystalline diamond, nanodiamond, diamond-like carbon (DLC), and

[0054] ● Their combination.

[0055] The second material can preferably be selected from the group consisting of: TiB2, AlTiN, TiAlN, TiAlSiN, TiSiN, CrAl, CrAlN, AlCrN, CrN, TiN, TiCN and combinations thereof.

[0056] In addition, all materials referenced in VDI Guide 2840 can be selected as secondary materials.

[0057] Particularly preferred are the use of nanodiamonds as a second material and / or multilayers of nanodiamonds and polycrystalline diamonds as the second material. It has been shown that the production of nanodiamonds can be accomplished more easily and economically compared to the production of single-crystal diamonds. Furthermore, nanodiamond layers are more uniform in particle size distribution than polycrystalline diamond layers, and the materials also exhibit lower intrinsic stress. Therefore, macroscopic deformation of the cutting edge is less likely to occur.

[0058] Preferably, the thickness of the second material is 0.15µm to 20µm, more preferably 2µm to 15µm, and even more preferably 3µm to 12µm.

[0059] Preferably, the elastic modulus (Young's modulus) of the second material is less than 1200 GPa, more preferably less than 900 GPa, more preferably less than 750 GPa, and even more preferably less than 500 GPa. Due to the low elastic modulus, the hard coating becomes more flexible and elastic. The Young's modulus is determined according to the method disclosed in Markus Mohr et al., “Young's modulus, fracture strength, and Poisson's ratio of nanocrystalline diamond films,” J. Appl. Phys. 116, 124308 (2014), particularly under paragraph III.B. Static measurement of Young's modulus.

[0060] The transverse fracture stress σ0 of the second material is preferably at least 1 GPa, more preferably at least 2.5 GPa, and even more preferably at least 5 GPa.

[0061] For the definition of transverse fracture stress σ0, please refer to the following references:

[0062] ●R. Morrell et al., Int. Journal of Refractory Metals & Hard Materials, 28(2010), pp. 508-515;

[0063] ●R. Danzer et al., in: "Technische keramische Werkstoffe" published by J. Kriegesmann, HvB Press, Ellerau, ISBN 978-3-938595-00-8, Chapter 6.2.3.1 "Der4-Kugelversuch zur Ermittlung der biaxialen Biegefestigkeit spröderWerkstoffe".

[0064] Therefore, the transverse fracture stress σ0 is determined through statistical evaluation of fracture tests, such as the B3B load test based on the details of the aforementioned literature. Thus, it is defined as the fracture stress with a fracture probability of 63%.

[0065] Due to the extremely high transverse fracture stress of the second material, the separation of individual microcrystals from the hard coating (especially from the cutting edge) is almost completely suppressed. Therefore, the cutting blade retains its original sharpness even after long-term use.

[0066] The second material is preferably at least 20 GPa. The hardness was determined by nanoindentation (Yeon-Gil Jung et al., J. Mater. Res., Vol. 19, No. 10, p. 3076).

[0067] The surface roughness R of the second material RMS Preferably less than 100 nm, more preferably less than 50 nm, and even more preferably less than 20 nm, the surface roughness is calculated according to the following formula:

[0068]

[0069] A = Assessment Area

[0070] Z(x,y) = Local roughness distribution

[0071] Surface roughness R RMS It was measured according to DIN EN ISO 25178. The aforementioned surface roughness makes additional mechanical polishing of the grown second material unnecessary.

[0072] In a preferred embodiment, the average grain size d of the nanocrystalline diamond in the second material is... 50 The average grain size is 1 nm to 100 nm, preferably 5 nm to 90 nm, more preferably 7 nm to 30 nm, and even more preferably 10 nm to 20 nm. 50 It is the diameter when 50% of the second material consists of smaller particles. Average particle size d 50X-ray diffraction or transmission electron microscopy and grain counting can be used to determine this.

[0073] According to a preferred embodiment, the first material and / or the second material are coated with a low-friction material in at least a region, the low-friction material preferably being selected from the group consisting of fluoropolymer materials such as PTFE, parylene, polyvinylpyrrolidone, polyethylene, polypropylene, polymethyl methacrylate, graphite, diamond-like carbon (DLC), and combinations thereof.

[0074] The first intersection line connecting the main inclined plane and the secondary inclined plane is preferably formed within the second material.

[0075] More preferably, the second intersection line between the secondary and third inclined planes is arranged at the boundary surface of the first and second materials, which makes the manufacturing process easier to handle and therefore more economical. For example, it can be based on... Figure 9 The process of manufacturing blades.

[0076] Furthermore, the hole preferably has a shape selected from the group consisting of: circle, ellipse, square, triangle, rectangle, trapezoid, hexagon, octagon or a combination thereof.

[0077] The area of ​​a hole is defined as the area of ​​the opening surrounded by its inner perimeter. The preferred range for the hole area is 0.2 mm. 2 Up to 25mm 2 More preferably 1mm 2 Up to 15mm 2 And even more preferably 2mm 2 Up to 12mm 2 .

[0078] According to the first preferred embodiment, the first wedge angle The range of 1 is 5° to 75°, preferably 10° to 60°, more preferably 15° to 46°, and even more preferably 20° to 45°, and / or the second wedge angle. The range of 2 is -10° to 40°, preferably 0° to 30°, more preferably 10° to 25°, and / or a third wedge angle. The range of 3 is from 1° to 60°, preferably from 10° to 55°, more preferably from 19° to 46°, and even more preferably from 20° to 45°.

[0079] According to another preferred embodiment, the main bevel has a length d1, which is the dimension projected onto the first surface from the portion intercepted by the cutting edge to the first intersection line, and this dimension is from 0.1µm to 7µm, preferably from 0.5µm to 5µm, and more preferably from 1µm to 3µm. A length d1 < 0.1µm is difficult to manufacture because a cutting edge of this length is too brittle and cannot be used stably with the cutting element. It has been surprisingly found that the main bevel, together with the secondary and third bevels, stabilizes the element body, allowing for slender elements in the secondary bevel region, which provide low cutting forces. On the other hand, as long as the length d1 is not greater than 7µm, the main bevel does not affect the cutting performance.

[0080] Preferably, the length d2 is the dimension projected from the portion cut off from the cutting edge to the second intersection line onto the first surface and / or the imaginary extension of the first surface, and this length ranges from 5µm to 150µm, preferably from 10µm to 100µm, and more preferably from 20µm to 80µm. The length d2 corresponds to the penetration depth of the cutting element in the object to be cut. Typically, d2 corresponds to at least 30% of the diameter of the object to be cut, i.e., when the object is human hair with a diameter typically about 100µm, the length d2 is at least 30µm. Therefore, the cutting element according to the invention has a low second wedge angle. The thin, sub-sloping surface of 2 results in low cutting force.

[0081] The micro-geometry of the cutting edge ideally has a circular configuration, which improves the stability of the component. The tip radius of the cutting edge is preferably less than 200 nm, more preferably less than 100 nm, and even more preferably less than 50 nm.

[0082] Preferably, the end radius r is related to the average grain size d of the hard coating. 50 Coordination. Therefore, especially if the end radius r of the second material at the cutting edge and the average grain size d of the nanocrystalline diamond hard coating are... 50 The ratio between r / d 50 It is advantageous for the value to be 0.03 to 20, preferably 0.05 to 15, and particularly preferably 0.5 to 10.

[0083] According to another preferred embodiment, the first face includes a fourth inclined face, wherein

[0084] ●The third intersection line connects the fourth inclined plane and the first surface.

[0085] ●The fourth bevel extends from the cutting edge to the third intersection line.

[0086] ●A fourth wedge angle θ4 exists between the imaginary extension of the first surface and the fourth inclined surface.

[0087] The cutting element according to the invention can be used in the field of hair or skin removal, such as shaving, exfoliation, and callus removal, but can also be used in other fields where the cutting element is used, such as as a kitchen knife, vegetable peeler, slicer, wooden razor, scalpel, and composite fiber material cutter.

[0088] According to the present invention, a hair removal device is also provided, which includes at least one cutting element as described above.

[0089] The following figures further illustrate the invention, showing specific embodiments according to the invention. However, these specific embodiments should not be construed as limiting the invention in any way with respect to the claims and the general part of the specification.

[0090] Figure 1a This is a perspective view of the cutting element according to the present invention.

[0091] Figure 1b This is a top view of the second surface of the cutting element according to the invention.

[0092] Figure 1c This is a perspective view of the first face of the cutting element according to the present invention.

[0093] Figure 2 This is a top view of the second surface of the cutting element according to the invention.

[0094] Figure 3 This is a perspective view of the cutting element according to the present invention.

[0095] Figure 4 This is a top view of the second surface of the cutting element according to the invention.

[0096] Figure 5 This is a cross-sectional view of the cutting element according to the present invention.

[0097] Figure 6 This is a cross-sectional view of another cutting element according to the invention.

[0098] Figure 7 This is a cross-sectional view of another cutting element according to the invention.

[0099] Figure 8 This is a cross-sectional view of another cutting element according to the invention.

[0100] Figure 9 This is a cross-sectional view of another cutting element according to the invention, wherein an additional bevel is present on the first surface.

[0101] Figure 10 This is a flowchart of the process used to manufacture cut components.

[0102] Figure 11This is a schematic cross-sectional view of the micro-geometry of the cutting edge, showing the determination of the end radius.

[0103] Figure 12 It is based on Figure 7 Microscopic SEM images of the cutting blade of the cutting element.

[0104] The following reference numerals are used in the accompanying drawings of this application.

[0105] List of reference numerals

[0106] 1 Cutting element

[0107] 2 First page

[0108] 3 Second page

[0109] 4, 4', 4'', 4''' Cutting edge

[0110] 5 main bevels

[0111] 6 bevels

[0112] 7 Third inclined plane

[0113] 8 Fourth inclined plane

[0114] 9 First Surface

[0115] 9' Imaginary extension of the first surface

[0116] 10 First intersection line

[0117] 11 Second intersection line

[0118] 12 Third intersection line

[0119] 15-component body

[0120] 16 Cutting wedges

[0121] 18 First Material

[0122] 19 Second Material

[0123] 20 Boundary Surfaces

[0124] 22 base

[0125] 60-degree end bisection

[0126] 61 vertical lines

[0127] 62 circles

[0128] 65 construction points

[0129] 66 construction points

[0130] 67 construction points

[0131] Straight sections of holes 70 and 71

[0132] 72-hole curved section

[0133] 73 Part 1

[0134] 74 Part Two

[0135] 75 linear cutting edge extension

[0136] 76 and the tangent to the cutting edge

[0137] 77 section line

[0138] 78 section line

[0139] 260 bisectors

[0140] 430 holes

[0141] Inner periphery of hole 431

[0142] 432 hole area

[0143] Figure 1a The cutting element of the present invention is shown in perspective. The cutting element having a first surface 2 and a second surface 3 includes a substrate 22 of a first material 18 having a hole 430. At the first surface 2, the substrate 22 has its first surface 9 having an inner periphery 431 with the hole 430. In this embodiment, the cutting edge 4 is formed along the inner periphery 431 to produce a circular cutting edge 4.

[0144] Figure 1b This is a top view of the second side 3 of the cutting element. The substrate 22 has a hole 430 with an inner periphery 431 and a hole area 432. The substrate comprises a first material 18 and a second material 19 (partially visible in this perspective view), wherein the cutting edge is formed along the inner periphery 431 and in the second material 19.

[0145] Figure 1c This is a perspective view on the first face 2 of the cut element, which shows the second material 19 having a hole with an inner periphery 431.

[0146] Figure 2 This is a top view of the second side 3 of the cutting element of the present invention. The cutting element having a first side 2 (not visible in this perspective view) and a second side 3 includes a base 22 of a first material 18 with an octagonal hole 430. At the first side 2 (not visible in this perspective view), the base 22 has its first surface 9 with an inner periphery 431 having the hole 430. In this embodiment, the cutting blades 4, 4', 4'', 4''' are formed only in a portion of the inner periphery 431, i.e., each second side of the octagon has a cutting blade.

[0147] Figure 3 This is a perspective view of a cutting element according to the present invention. The cutting element 1 has an element body 15, which includes a first surface 2 and a second surface 3 opposite to the first surface 2. A cutting blade 4 is positioned at the intersection of the first surface 2 and the second surface 3. The cutting blade 4 has a curved portion. The first surface 2 includes a flat first surface 9, while the second surface 3 is segmented into different bevels. The second surface 3 includes a main bevel 5, a secondary bevel 6, and a third bevel 7. The main bevel 5 is connected to the secondary bevel 6 via a first intersection line 10, and the secondary bevel is connected to the third bevel 7 at the other end via a second intersection line 11.

[0148] Figure 4 This is a top view of the second surface of the cutting element, illustrating the meaning of the cross-section within the scope of the invention. The substrate 22 has a hole 430 shaped to have a cutting edge 16 having two straight portions 70 and 71 and a curved portion 72 at which the cutting edge is formed. In the first portion 74 of the straight portion 71, the slice passes through the substrate 22 perpendicular to a linear cutting edge extension 75 corresponding to the section line 78. In the second portion 73 of the curved portion 72, the slice passes through the substrate 22 perpendicular to a tangent of the cutting edge 76 corresponding to the section line 77.

[0149] exist Figure 5 In, it is shown Figure 3 A cross-sectional view of the cutting blade.

[0150] exist Figure 6 The image shows a cross-sectional view of another cutting element of the present invention, which largely corresponds to... Figure 5 The only difference between the cross-sectional views is that the wedge angle θ1 of the main inclined plane 5 is equal to the wedge angle θ2 of the secondary inclined plane 6, resulting in the main inclined plane 5 and the secondary inclined plane 6 having the same gradient.

[0151] exist Figure 7The image shows a further cross-sectional view of a cutting blade according to the invention. This cutting blade 1 has a blade body 15 comprising a first face 2 and a second face 3 opposite to the first face 2. A cutting edge 4 is positioned at the intersection of the first face 2 and the second face 3. The first face 2 comprises a planar first surface 9, while the second face 3 is segmented into different bevels. The second face 3 of the cutting blade 1 has a primary bevel 5 having a first wedge angle θ1 between the first surface 9 and the primary bevel 5. A secondary bevel 6 has a second wedge angle θ2 between the first surface 9 and the secondary bevel 6, the secondary bevel having a bisecting line 260° of the second wedge angle θ2. θ2 is less than θ1. A third bevel 7 has a third wedge angle θ3 greater than θ2. The primary bevel 5 has a length d1, which is the dimension projected onto the first surface 9 and is in the range of 0.1 µm to 7 µm. The main inclined plane 5 and the secondary inclined plane 6 together have a length d2, which is the dimension projected onto the first surface 9, and is in the range of 5µm to 150µm, preferably 10µm to 100µm, and more preferably 20µm to 80µm.

[0152] exist Figure 8 The image shows another cross-sectional view of the cutting blade of the present invention, wherein the blade body 15 comprises a first material 18 (e.g., silicon) and a second material 19, such as a diamond layer on the first material 18 at a first face 2. A primary bevel 5 and a secondary bevel 6 are located in the second material 19, while a third bevel 7 is located in the first material 18. The first material 18 and the second material 19 are bonded along a boundary surface 20.

[0153] Figure 9 A further cross-sectional view of another embodiment of a cutting blade 1 having a first surface 2 and a second surface 3 according to the present invention is shown. The second surface 3 has a primary bevel 5, a secondary bevel 6, and a third bevel 7. A fourth bevel 8 is positioned on the first surface 2 between the surface 9 and the cutting edge 4. The angle between the fourth bevel 8 and the imaginary extension 9' of the first surface is θ4. The wedge angle θ2 between the primary bevel 5 and the surface 9 is smaller than the wedge angle θ1 between the secondary bevel 6 and the surface 9. Furthermore, the wedge angle θ3 between the third bevel 7 and the surface 9 is greater than θ2.

[0154] exist Figure 10The diagram shows a flowchart of the process of the present invention. In the first step 1, a silicon wafer 101 is coated with a silicon nitride (Si3N4) layer 102 as a protective layer for silicon by PE-CVD or thermal processing (low-pressure CVD). The layer thickness and deposition process must be carefully selected to ensure sufficient chemical stability to withstand subsequent etching steps. In the second step, a photoresist 103 is deposited on the Si3N4-coated substrate and then patterned by photolithography. Then, using the patterned photoresist as a mask, the (Si3N4) layer is constructed by, for example, plasma reactive ion etching (RIE) with CF4. After patterning, the photoresist 103 is stripped by an organic solvent in the third step. The remaining patterned Si3N4 layer 102 is used as a mask for the subsequent pre-structuring step 4 of the silicon wafer 101, for example by anisotropic wet chemical etching in KOH. The etching process ends when the structure on the second surface 3 has reached a predetermined depth and the continuous silicon first surface 2 is retained. Alternatively, other wet and dry chemical processes may be suitable, such as isotropic wet chemical etching in HF / HNO3 solution or the application of fluorine-containing plasma. In the next step 5, the remaining Si3N4 is removed by treatment with, for example, hydrofluoric acid (HF) or fluorine plasma. In step 6, the prestructured Si substrate is coated with a thin diamond layer 104 of approximately 10 µm, such as nanodiamond. The diamond layer 104 may be deposited on the prestructured second surface 3 and the continuous first surface 2 of the silicon wafer 101 (as shown in step 6), or only on the continuous first surface 2 of the silicon wafer (not shown here). In the case of double-sided coating, the diamond layer 104 on the structured second surface 3 must be removed in another step 7 before the subsequent blade forming steps 9 to 11 of the dicing blade. Selective removal of the diamond layer 104 is performed, for example, by using Ar / O2 plasma (e.g., RIE or ICP mode), which demonstrates high selectivity to the silicon substrate. In step 8, the silicon wafer 101 is thinned so that the diamond layer 104 is partially self-supporting without substrate material, and the desired substrate thickness is achieved in the remaining region. This step can be performed by wet chemical etching in KOH or HF / HNO3 etchant, or preferably by plasma etching in a plasma containing CF4, SF6, or CHF3 in RIE or ICP mode. Adding O2 to the plasma process will produce the dicing edge formation of the diamond film (as shown in step 9). Process details are disclosed, for example, in DE 198 59 905 A1.

[0155] exist Figure 11The diagram illustrates how the end radius can be determined. The end radius is determined by first drawing a bisecting line 60 that divides the cross-sectional image of the first bevel of the cutting edge 1 in two. A point 65 is drawn where the end bisecting line 60 bisects the first bevel. A second line 61 is drawn perpendicular to the end bisecting line 60 at a distance of 100 nm from point 65. Two more points 66 and 67 are drawn where line 61 bisects the first bevel. A circle 62 is then constructed based on points 65, 66, and 67. The radius of circle 62 is the end radius of the coated cutting element.

Claims

1. A cutting element comprising a substrate (22) having at least one hole (430), the at least one hole comprising a cutting edge (4) along at least a portion of an inner periphery (431) of the hole (430), wherein the cutting edge has an asymmetrical cross-sectional shape formed by the cutting edge (4) at the intersection of a first face (2), a second face (3) opposite to the first face (2), and the first face (2) and the second face (3), wherein ●The first surface (2) includes the first surface (9), and ●The second surface (3) includes a main inclined surface (5), a secondary inclined surface (6), and a third inclined surface (7), wherein ●The main bevel (5) extends from the cutting edge (4) to the secondary bevel (6). ●The secondary inclined plane (6) extends from the primary inclined plane (5) to the third inclined plane (7). ●The first intersection line (10) connects the main inclined plane (5) and the secondary inclined plane (6), and ●The second intersection line (11) connects the secondary inclined plane (6) and the third inclined plane (7). ●A first wedge angle θ1 is formed between the first surface (9) and the main inclined surface (5). ●A second wedge angle θ2 exists between the first surface (9) and the secondary inclined surface (6), and ●A third wedge angle θ3 is present between the first surface (9) and the third inclined surface (7). Where θ1≥θ2 and / or θ2≤θ3.

2. The cutting element according to claim 1, Its features are, The thickness of the substrate (22) is 20µm to 1000µm.

3. The cutting element according to claim 1, Its features are, The thickness of the substrate (22) is 30µm to 500µm.

4. The cutting element according to claim 1, Its features are, The thickness of the substrate (22) is 50µm to 300µm.

5. The cutting element according to claim 1, Its features are, The substrate (22) comprises or is composed of a first material (18), or the substrate comprises or is composed of a first material (18) and a second material (19) adjacent to the first material (18).

6. The cutting element according to claim 5, Its features are, The first material (18) comprises or consists of the following items: ●Metal, ● Ceramics containing at least one element selected from the group consisting of: carbon, nitrogen, boron, oxygen, and combinations thereof. ●Glass and ceramics, ● Composite materials made of ceramic materials within a metal matrix ●Silicon, ●Single crystal materials, ● Glass, ● Polycrystalline or amorphous silicon or germanium ● Polycrystalline diamond, diamond-like carbon and ● Their combination.

7. The cutting element according to claim 6, Its features are, The metal is titanium, nickel, chromium, niobium, tungsten, tantalum, molybdenum, vanadium, platinum, germanium, iron, or alloys thereof.

8. The cutting element according to claim 6, Its features are, The metal is steel.

9. The cutting element according to claim 6, Its features are, The ceramic comprises silicon carbide, zirconium oxide, aluminum oxide, silicon nitride, boron nitride, tantalum nitride, TiAlN, TiCN and / or TiB2.

10. The cutting element according to claim 6, Its features are, The glass-ceramic is an alumina-containing glass-ceramic.

11. The cutting element according to claim 6, Its features are, The metal is a hard metal, and the hard metal is a sintered carbide hard metal.

12. The cutting element according to claim 6, Its features are, The metal is a hard metal, which is tungsten carbide or titanium carbide bonded with cobalt or nickel.

13. The cutting element according to claim 6, Its features are, The silicon or germanium has a crystal plane parallel to the second surface (3), and the wafer orientation is... <100> , <110> , <111> or <211> .

14. The cutting element according to claim 5 or 6, Its features are, The second material (19) comprises or consists of materials selected from the group consisting of: ●Oxides, nitrides, carbides, borides, ●Boron, aluminum, magnesium, ●Carbon, and ● Their combination.

15. The cutting element according to claim 14, Its features are, The nitride is aluminum nitride, chromium nitride, titanium nitride, titanium nitride carbon, titanium nitride aluminum, or cubic boron nitride.

16. The cutting element according to claim 14, Its features are, The carbon is diamond, nanocrystalline diamond, diamond-like carbon, or tetrahedral amorphous carbon.

17. The cutting element according to claim 5 or 6, Its features are, The second material (19) satisfies at least one of the following properties: ●Thickness ranges from 0.15µm to 20µm. ● Elastic modulus less than 1200 GPa, ● The transverse fracture stress σ0 is at least 1 GPa. ● The hardness is at least 20 GPa.

18. The cutting element according to claim 17, Its features are, The thickness is 2µm to 15µm.

19. The cutting element according to claim 17, Its features are, The thickness is 3µm to 12µm.

20. The cutting element according to claim 17, Its features are, The elastic modulus is less than 900 GPa.

21. The cutting element according to claim 17, Its features are, The elastic modulus is less than 750 GPa.

22. The cutting element according to claim 17, Its features are, The elastic modulus is 500 GPa.

23. The cutting element according to claim 17, Its features are, The transverse fracture stress σ0 is at least 2.5 GPa.

24. The cutting element according to claim 17, Its features are, The transverse fracture stress σ0 is at least 5 GPa.

25. The cutting element according to claim 5 or 6, Its features are, The second material (19) is made of nanodiamond and satisfies at least one of the following properties: ●Average surface roughness R RMS Less than 100nm ●The average grain size d of the nanodiamond 50 The range is from 1nm to 100nm.

26. The cutting element according to claim 25, Its features are, The average surface roughness R RMS Less than 50nm.

27. The cutting element according to claim 25, Its features are, The average surface roughness R RMS Less than 20nm.

28. The cutting element according to claim 25, Its features are, The average grain size d of the nanodiamond 50 The range is from 5nm to 90nm.

29. The cutting element according to claim 25, Its features are, The average grain size d of the nanodiamond 50 The range is from 7nm to 30nm.

30. The cutting element according to claim 25, Its features are, The average grain size d of the nanodiamond 50 The range is from 10nm to 20nm.

31. The cutting element according to claim 5 or 6, Its features are, The first material (18) and / or the second material (19) are coated with a low-friction material in at least some areas.

32. The cutting element according to claim 31, Its features are, The low-friction material is selected from the group consisting of: fluoropolymer materials, parylene, polyvinylpyrrolidone, polyethylene, polypropylene, polymethyl methacrylate, graphite, diamond-like carbon, and combinations thereof.

33. The cutting element according to claim 5 or 6, Its features are, The first intersection line (10) is formed in the second material (19), and / or the second intersection line (11) is arranged at the boundary surface (20) of the first material (18) and the second material (19).

34. The cutting element according to any one of claims 1 to 6, Its features are, The at least one hole (430) has a shape selected from the group consisting of: circular, elliptical, square, triangular, rectangular, trapezoidal, hexagonal, octagonal, or combinations thereof, wherein the at least one hole (430) has a diameter in the range of 0.2 mm. 2 Up to 25mm 2 The area of ​​the hole is (432).

35. The cutting element according to claim 34, Its features are, The at least one hole (430) has a range of 1 mm. 2 Up to 15mm 2 The area of ​​the hole is (432).

36. The cutting element according to claim 34, Its features are, The at least one hole (430) has a range of 2 mm. 2 Up to 12mm 2 The area of ​​the hole is (432).

37. The cutting element according to any one of claims 1 to 6, Its features are, First wedge angle The range of 1 is from 5° to 75°, and / or the second wedge angle. 2 ranges from -10° to 40°, and / or the third wedge angle. The range of 3 is from 1° to 60°.

38. The cutting element according to claim 37, Its features are, First wedge angle The range of 1 is from 10° to 60°.

39. The cutting element according to claim 37, Its features are, First wedge angle The range of 1 is from 15° to 46°.

40. The cutting element according to claim 37, Its features are, First wedge angle The range of 1 is from 20° to 45°.

41. The cutting element according to claim 37, Its features are, Second wedge angle The range of 2 is from 0° to 30°.

42. The cutting element according to claim 37, Its features are, Second wedge angle The range of 2 is from 10° to 25°.

43. The cutting element according to claim 37, Its features are, The third wedge angle The range of 3 is from 10° to 55°.

44. The cutting element according to claim 37, Its features are, The third wedge angle The range of 3 is from 19° to 46°.

45. The cutting element according to claim 37, Its features are, The third wedge angle The range of 3 is from 20° to 45°.

46. ​​The cutting element according to any one of claims 1 to 6, Its features are, The main inclined plane (5) has a length d1, which is the dimension of the portion of the cutting edge (4) to the first intersection line (10) projected onto the first surface (9) and / or the imaginary extension (9') of the first surface, and the length is from 0.1µm to 7µm.

47. The cutting element according to claim 46, Its features are, The length is 0.5µm to 5µm.

48. The cutting element according to claim 46, Its features are, The length is 1µm to 3µm.

49. The cutting element according to any one of claims 1 to 6, Its features are, The portion cut from the cutting edge (4) to the second intersection line (11) projected onto the first surface (9) and / or the imaginary extension (9') of the first surface has a length d2, the length ranging from 5µm to 150µm.

50. The cutting element according to claim 49, Its features are, The length ranges from 10µm to 100µm.

51. The cutting element according to claim 49, Its features are, The length ranges from 20µm to 80µm.

52. The cutting element according to any one of claims 1 to 6, Its features are, The end radius of the cutting blade (4) is less than 200 nm.

53. The cutting element according to any one of claims 1 to 6, Its features are, The end radius of the cutting blade (4) is less than 100 nm.

54. The cutting element according to any one of claims 1 to 6, Its features are, The end radius of the cutting blade (4) is less than 50 nm.

55. The cutting element according to any one of claims 1 to 6, Its features are, The first surface includes a fourth inclined surface (8), wherein ●The third intersection line (12) connects the fourth inclined plane (8) and the first surface (9). ●The fourth inclined plane (8) extends from the cutting edge (4) to the third intersection line (12), and ●A fourth wedge angle θ4 exists between the imaginary extension (9') of the first surface and the fourth inclined surface (8).

56. A hair removal apparatus comprising a cutting element according to any one of claims 1 to 55.

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