Sheet connecting device, sheet connecting method, and sheet replacing system

Abstract

The present invention provides a sheet joining device, a sheet joining method, and a sheet replacement system capable of reliably joining multiple adhesive sheets; the sheet joining device (1) joins an upstream first adhesive sheet (S1) with a downstream second adhesive sheet (S2), and includes an upstream adhesive roller (10, 10), a connecting portion (20) and a cutting portion (30) disposed on the downstream side, and a conveying roller (40, 40) located downstream of these; the cutting portion (30) is capable of cutting the second adhesive sheet (S2) in the width direction to form a joined end (SE2), and the adhesive roller (10, 10)... 10) By conveying the connecting end (SE1) of the first adhesive sheet (S1) towards the downstream side while being held by the adhesive rollers (10, 10), the first adhesive sheet (S1) is separated into an adhesive sheet (SA) and a release sheet (SP) to form a separation part (50); the conveying rollers (40, 40) convey the second adhesive sheet (S2) towards the connecting end (SE1), thereby inserting the end to be connected (SE2) into the separation part (50), and the connecting part (20) connects the connecting end (SE1) and the end to be connected (SE2) by bonding or welding.

Description

Technical Field

[0001] This invention relates to sheet bonding apparatus, sheet bonding method, and sheet replacement system. More specifically, this invention relates to sheet bonding apparatus and sheet bonding method for bonding adhesive sheets, such as protective sheets, attached to semiconductor wafers, to other adhesive sheets. Additionally, this invention relates to a sheet replacement system for replacing one adhesive sheet with another. Background Technology

[0002] Currently, semiconductor wafers are thinned by forming circuit patterns on the surface and then grinding the back side. Furthermore, during the grinding of the back side of the semiconductor wafer, a protective film (also called a B / G tape) is attached to the surface side of the wafer to protect the circuit patterns. Additionally, during the chip fabrication of the semiconductor wafer, slicing tape is attached to both the slicing holder and the semiconductor wafer. Furthermore, during the formation of the semiconductor chip, dry film resist is sometimes also attached to the back side of the semiconductor wafer. Various sheet bonding devices are used when attaching the aforementioned protective films, slicing tapes, and dry film resists.

[0003] However, in the aforementioned sheet bonding apparatus, the protective sheet, slicing tape, and dry film resist are supplied in, for example, roll form. Therefore, after the sheet is used up, the operator needs to remove the old roll and replace it with a new one. This replacement requires re-threading the new bonding sheet through the sheet bonding apparatus, resulting in a time-consuming process. Furthermore, semiconductor wafer production needs to be stopped during the replacement process, incurring costs. Additionally, the replacement time varies depending on whether the operator is skilled or inexperienced, leading to variations in replacement time due to operator skill.

[0004] Here, it is believed that when replacing protective sheets, cutting tapes, dry film resists, etc., as described above, connecting the new roll of raw material to the rear end of the used sheet can reduce the workload of passing through the device during the replacement operation. Therefore, as a device for connecting sheets, an adhesive tape connecting device for connecting adhesive tape is known (for example, Patent Document 1).

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2002-96952 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] However, in the adhesive tape connecting device described in Patent Document 1, when connecting release paper (equivalent to release sheet), an adhesive adhesive component is used, and the increased cost caused by the adhesive component supply mechanism and the adhesive component becoming a consumable becomes a problem.

[0010] Furthermore, in devices such as those for attaching protective films to semiconductor wafers, sheets wider than the outer diameter of the semiconductor wafer are used. Therefore, a large pulling force is required to pull the sheets from the roll of raw materials. That is, if the sheets are not reliably connected to each other, there is a possibility that the connected sheets may detach and break midway. This problem has become particularly pronounced recently with the development of larger diameter semiconductor wafers (e.g., diameters of 300 mm and above).

[0011] However, in the adhesive tape connecting device described in Patent Document 1, as the bandwidth increases, the bandwidth of the adhesive component also needs to increase. Therefore, there is a problem of increased cost of the adhesive component. In particular, to apply it to adhesive sheets requiring tensile strength as described above, the bandwidth of the adhesive component needs to be expanded, resulting in a significant increase in cost. Furthermore, if the adhesive tapes are not reliably connected, the connected sheets may become warped and unusable, or the connected adhesive tapes may detach and break due to the aforementioned tensile force.

[0012] Therefore, the object of the present invention is to provide a sheet connecting device and a sheet connecting method capable of reliably connecting multiple adhesive sheets. Furthermore, the object of the present invention is to provide a sheet replacement system that allows for the replacement of one adhesive sheet with another by connecting one adhesive sheet to another.

[0013] Technical solutions for solving the problem

[0014] (1) A sheet joining device provided to solve the above-mentioned technical problem connects a first adhesive sheet and a second adhesive sheet along a supply direction. The first adhesive sheet is formed by overlapping a release sheet on at least the adhesive surface side of an adhesive sheet and is disposed on the upstream side of the supply direction. The second adhesive sheet is disposed on the downstream side of the supply direction relative to the first adhesive sheet. The sheet joining device is characterized by comprising: a pair of adhesive rollers disposed on the upstream side of the supply direction in a manner that allows them to approach or separate from each other through the adhesive sheets, and capable of clamping the adhesive sheets by approaching each other; a connecting portion and a cutting portion disposed along the supply path of the adhesive sheets; and a pair of conveying rollers disposed on the downstream side of the supply direction relative to the connecting portion and the cutting portion in a manner that allows them to approach or separate from each other through the adhesive sheets, and capable of clamping the adhesive sheets by approaching each other. The adhesive sheet is brought close together and clamped. The cutting portion is capable of forming a connected end by cutting the second adhesive sheet in a width direction intersecting the supply direction. The surfaces of the pair of adhesive rollers are respectively adhesive. Furthermore, by using the pair of adhesive rollers to clamp the connected end of the first adhesive sheet while conveying the first adhesive sheet from the upstream side to the downstream side, the first adhesive sheet can be separated into the adhesive sheet and the release sheet at the connected end to form a separation portion. The conveying roller can insert the connected end into the separation portion by conveying the second adhesive sheet towards the connected end while clamping the second adhesive sheet. The connecting portion connects the connecting end to the connected end by bonding or welding while the connected end is inserted into the connecting end.

[0015] The aforementioned sheet joining device uses an adhesive roller to separate the connecting end of the first adhesive sheet into an adhesive sheet and a release sheet to form a separating portion, and inserts the joined end of the second adhesive sheet into this separating portion. Thus, the adhesive surface (back side) of the adhesive sheet in the first adhesive sheet adheres to the non-adhesive surface (surface) of the adhesive sheet in the second adhesive sheet. Therefore, according to the aforementioned sheet joining device, the first and second adhesive sheets can be temporarily joined by adhesive force. Furthermore, the aforementioned sheet joining device can, while the second adhesive sheet is temporarily joined and held within the first adhesive sheet, fuse the connecting end of the first adhesive sheet and the joined end of the second adhesive sheet by heating to achieve a connection. The aforementioned sheet joining device can connect the connecting end and the joined end with such high precision and reliability. Additionally, the aforementioned sheet joining device can connect by bonding the joined end of the second adhesive sheet with an adhesive. The aforementioned sheet joining device can connect the connecting end and the joined end with such high precision and reliability.

[0016] Furthermore, since there is no need to prepare additional adhesive components for connection, the connection allowance can be reduced, thus lowering costs. Therefore, a sheet connection device particularly suitable for situations such as replacing adhesive pads can be provided. Additionally, since the connecting end and the connected end are reliably connected by heat fusion, it is possible to prevent the first and second adhesive pads from detaching midway during supply. Furthermore, it is possible to prevent the connected sheet from becoming warped and resulting in unusable waste.

[0017] (2) In the sheet connecting device of the present invention described above, it is preferable that the connecting part is connected by heating to melt the release sheet in the connecting end and the release sheet in the connected end respectively.

[0018] According to this configuration, the release tabs at the connecting end and the connected end can be reliably connected respectively. Therefore, it is possible to prevent the first and second adhesive tabs from detaching midway during supply after connection. In addition, since no additional adhesive components are needed for connection, cost increases can be prevented.

[0019] (3) In the sheet connecting device of the present invention described above, it is preferable that the connecting part is connected by applying an adhesive to bond the release sheet in the connecting end and the release sheet in the connected end respectively.

[0020] According to this configuration, the release tabs at the connecting end and the connected end can be reliably connected respectively. Therefore, it is possible to prevent the first and second adhesive tabs from detaching midway during supply after connection.

[0021] (4) In the sheet joining device of the present invention described above, it is preferable that a pair of adhesive rollers can press the joining ends into which the joining ends are inserted by conveying the first adhesive sheet and the second adhesive sheet from the downstream side to the upstream side in the supply direction.

[0022] According to this configuration, a reliable temporary connection between the connecting end and the connected end can be achieved. That is, a reliable temporary connection can be achieved between the adhesive surface of the adhesive sheet at the connecting end of the first adhesive sheet and the non-adhesive surface of the adhesive sheet at the connected end of the second adhesive sheet. Thus, even with a narrow connection allowance, the connecting end and the connected end can be heat-fused while the connected end is reliably held at the connecting end.

[0023] (5) In the sheet joining device of the present invention described above, the cutting part preferably has: a cutter disposed on the release sheet side; and an adsorbent disposed on the adhesive sheet side and disposed opposite to the cutter, the adsorbent being capable of adsorbing and holding the second adhesive sheet in the width direction, and having a groove in the width direction at a position opposite to the cutter.

[0024] According to this configuration, the second adhesive sheet can be cut along its width while it is held in place by the adsorbent. Therefore, the connected end formed at the end of the second adhesive sheet can be formed with high precision, and the connection with the connected end can be performed with high precision. Therefore, it is expected that the effect of suppressing the detachment of the connected end from the connected end after connection can be achieved.

[0025] (6) In the sheet bonding device of the present invention described above, the adhesive sheet is preferably a protective sheet for protecting the surface of a semiconductor wafer, a slicing tape used in slicing semiconductor wafers, or a dry film adhesive.

[0026] According to this configuration, a sheet bonding device suitable for connecting and protecting the surface of a semiconductor wafer (also known as a protective tape or BG tape), slicing tape used in slicing conductor wafers, or dry film resist can be provided.

[0027] (7) In the sheet joining device of the present invention described above, it is preferable to roll the convex roller on the surface of the first adhesive sheet so as to easily separate it into an adhesive sheet and a release sheet.

[0028] Based on this configuration, the adhesive sheet and the release sheet can be separated more reliably.

[0029] (8) The sheet joining method of the present invention is a method of joining a first adhesive sheet and a second adhesive sheet along the supply direction. The first adhesive sheet is an adhesive sheet formed by overlapping a release sheet on at least the adhesive surface side of an adhesive sheet and is disposed on the upstream side of the supply direction. The second adhesive sheet is disposed on the downstream side of the supply direction relative to the first adhesive sheet. The sheet joining method is characterized by performing the following steps: a second adhesive sheet cutting step, in which the second adhesive sheet is cut along the width direction to be divided into two parts: a raw material roll side and a downstream side of the supply direction, and a joined end is formed at one end side of the downstream side of the supply direction; and a first adhesive sheet supply step, in which the first adhesive sheet is supplied from the upstream side of the second adhesive sheet. The separation section forming process involves conveying the connecting end of the first adhesive sheet from the upstream side to the downstream side in the supply direction while being held by a pair of adhesive rollers, thereby separating the connecting end into the adhesive sheet and the release sheet to form a separation section; the sheet insertion process involves conveying the second adhesive sheet from the downstream side to the upstream side in the supply direction, thereby inserting the connected end toward the separation section; and the sheet joining process involves conveying the first adhesive sheet and the second adhesive sheet from the downstream side to the upstream side in the supply direction while the connected end and the connected end are held by a pair of adhesive rollers with the connected end inserted into the separation section.

[0030] According to the above-described sheet joining method, the second adhesive sheet can be divided into two parts by a second adhesive sheet cutting process, and a joined end can be formed at one end on the downstream side in the supply direction. Therefore, it is not necessary for the operator to directly cut the second adhesive sheet, and a high-precision joined end can be formed regardless of the operator's skill level. Furthermore, according to the above-described sheet joining method, a separation portion can be formed at the joining end of the first adhesive sheet by a first adhesive sheet feeding process and a separation portion forming process. Therefore, the first adhesive sheet can be supplied to the sheet joining process described later by easily feeding the joining end at the front end of the first adhesive sheet towards the space between a pair of adhesive rollers.

[0031] Furthermore, the sheet joining method described above allows the joined end of the second adhesive sheet to be inserted into the separation portion formed on the joining end of the first adhesive sheet during the sheet insertion process. As a result, the adhesive surface of the release liner in the separation portion adheres to the non-adhesive surface of the release liner in the joined end of the second adhesive sheet. That is, the joining end and the joined end are temporarily connected. In addition, in the sheet joining method described above, during the sheet joining process, the temporarily connected joining end and the joined end are clamped by a pair of adhesive rollers. As a result, the joined end is reliably held at the joining end. Furthermore, since there is no need to prepare additional adhesive components for joining, the joining allowance can be reduced, thus lowering costs. Therefore, the sheet joining method described above is particularly suitable for situations such as replacing adhesive sheets.

[0032] (9) In the sheet joining method of the present invention described above, it is preferable to perform a heating and pressing step after performing the sheet joining step. In the heating and pressing step, with the adhesive roller released from its clamping state, the joining end and the joined end are heated and pressed together by a connecting portion arranged along the supply path of the adhesive sheet.

[0033] According to this configuration, the connecting end and the connected end can be reliably connected by heat pressing. Therefore, it is possible to prevent the first and second adhesive pads from detaching midway during supply after connection. In addition, since there is no need to prepare additional adhesive components for connection, cost increases can be prevented.

[0034] (10) In the sheet joining method of the present invention described above, it is preferable to perform an adhesive application step before performing the sheet joining step, wherein the adhesive is applied using an adhesive application section disposed along the supply path of the adhesive sheet.

[0035] According to this configuration, the connecting end and the connected end can be reliably connected by an adhesive. Therefore, it is possible to prevent the first and second adhesive pieces from detaching midway during supply after connection.

[0036] (11) The sheet replacement system of the present invention is characterized in that, by using the sheet connecting device, the end of the first adhesive sheet is connected to the end of the second adhesive sheet, thereby replacing the adhesive sheet supplied to the supply destination.

[0037] According to this configuration, for example, the used second adhesive sheet and the unused first adhesive sheet can be easily replaced. Specifically, the above-described sheet replacement system can connect the rear end (connected end) of the second adhesive sheet, whose remaining quantity has decreased due to use, to the front end (connecting end) of the new first adhesive sheet. Therefore, adhesive sheet replacement can be performed regardless of the operator's skill level. Consequently, the time spent replacing adhesive sheets can be significantly reduced, thus lowering costs.

[0038] (12) In the sheet replacement system of the present invention described above, the adhesive sheet is preferably a protective sheet for protecting the surface of a semiconductor wafer, a slicing tape used in slicing semiconductor wafers, or a dry film resist agent.

[0039] Based on this configuration, a sheet replacement system can be provided that allows for the replacement of even wide adhesive sheets, such as protective sheets for protecting the surface of semiconductor wafers, slicing tapes used in slicing semiconductor wafers, or dry film resists, without increasing costs. Furthermore, even when pulling out the protective sheet requires force, it is expected to prevent the connected sheets from detaching from each other after replacement.

[0040] (Invention Effects)

[0041] According to the present invention, a sheet connecting device and a sheet connecting method capable of reliably connecting multiple adhesive sheets can be provided. Furthermore, according to the present invention, a sheet replacement system capable of replacing one adhesive sheet with another by connecting one adhesive sheet to another can be provided. Attached Figure Description

[0042] Figure 1 This is a schematic diagram illustrating a protective sheet pasting device that utilizes the sheet bonding device of the present invention.

[0043] Figure 2 This is a partially omitted perspective view showing one embodiment of the sheet connecting device of the present invention.

[0044] Figure 3 This is a schematic cross-sectional view from the front of one embodiment of the sheet joining device of the present invention.

[0045] Figure 4 This is a partially enlarged perspective view of the cutting portion in the sheet connecting device of the present invention.

[0046] Figure 5(a) and (b) are operation diagrams of the sheet connecting device of the present invention.

[0047] Figure 6 (c) and (d) are operation diagrams of the sheet connecting device of the present invention.

[0048] Figure 7 (e) is an operational illustration of the sheet connecting device of the present invention.

[0049] Figure 8 (f) is an operational illustration of the sheet connecting device of the present invention.

[0050] Figure 9 (g) and (h) in the figure are operation diagrams of the sheet connecting device of the present invention.

[0051] Figure 10 (i) is an operational illustration of the sheet connecting device of the present invention.

[0052] Figure 11 (a) is a top view of the semiconductor wafer with a protective sheet attached, and (b) is a cross-sectional view of the semiconductor wafer along the aa direction.

[0053] Figure 12 (a) to (c) are explanatory diagrams of the peeling triggering action related to the sheet joining device of the present invention.

[0054] (Symbol Explanation)

[0055] S: Adhesive sheet (protective sheet)

[0056] A: Adhesive layer

[0057] S1: First adhesive patch

[0058] S2: Second adhesive patch

[0059] SE1: Connecting end,

[0060] SE2: The end being connected

[0061] SA: Adhesive sheet

[0062] SP: Release film

[0063] W: Semiconductor chip (wafer)

[0064] 1: Sheet connecting device

[0065] 2: Protective film pasting device

[0066] 10: Adhesive roller

[0067] 20: Connecting Part

[0068] 21: Heater

[0069] 22: Support component

[0070] 30: Cut-off section

[0071] 35: Adsorbent

[0072] 36: Tool Groove

[0073] 37: Adsorption pores

[0074] 31: Cutting knife

[0075] 40: Conveyor Roller

[0076] 50: Separation section Detailed Implementation

[0077] Reference Figures 1 to 12 An embodiment of the sheet bonding device 1 according to the present invention will be described in detail. Furthermore, it should be noted that in the figures, the adhesive sheet S, the first adhesive sheet S1, and the second adhesive sheet S2 are depicted with exaggerated thickness. Additionally, it should be noted that in… Figure 2 and Figure 4 In the figures other than those shown, the shape and size of the connecting part 20 and the cutting part 30 are depicted in a simplified manner for ease of explanation.

[0078] Figure 1 This is a schematic diagram illustrating a protective sheet bonding device 2 that incorporates the sheet bonding device 1 of the present invention. The protective sheet bonding device 2 is, for example, used in... Figure 11 The apparatus shown in (a) and (b) is for attaching a protective sheet S (also called a bonding sheet S) to a semiconductor wafer W (also called wafer W). The outer periphery of the wafer W has a notch N indicating crystal orientation, and a circuit pattern is formed on its surface. Further details regarding the attachment of the protective sheet S in the protective sheet bonding apparatus 2 are omitted from the illustrations.

[0079] like Figure 1 As shown, a raw material roll 3 containing a protective sheet S is disposed upstream of the sheet connecting device 1. The raw material roll 3 is rotatably supported on a support frame (not shown) (a rotation drive mechanism and a stop may also be appropriately provided). The adhesive sheet S fed from the raw material roll 3 is supplied to the sheet connecting device 1 under the guidance of a suitable guide roller 4. In addition, a protective sheet adhesive device 2 is disposed downstream of the sheet connecting device 1 and supplies the protective sheet S via the sheet connecting device 1. Furthermore, in this embodiment, the protective sheet adhesive device 2 is connected to the sheet connecting device 1, but the sheet connecting device 1 may also be assembled onto the protective sheet adhesive device 2 and formed integrally.

[0080] Figure 2 This is a partially omitted perspective view of the sheet connecting device 1, viewed from the top side and rear. Figure 3This is a schematic cross-sectional view of the sheet connecting device 1 viewed from the front. Additionally, Figure 4 It is Figure 2 A magnified 3D view of the main parts. Furthermore, it should be noted that... Figure 2 and Figure 4 In the drawing, the pasted piece S and the connecting part 20 are omitted. For example... Figure 3 As shown, the sheet bonding device 1 includes a pair of bonding rollers 10, 10; a connecting part 20 and a cutting part 30 arranged along the supply path of the bonded sheet S; and a pair of conveying rollers 40, 40, etc. In addition, the sheet bonding device 1 includes a drive unit 60 that supports the connecting part 20 and the cutting part 30.

[0081] Furthermore, the adhesive sheet S passes through the sheet connecting device 1. Here, we will define the adhesive sheet S that is not yet installed and is not yet in use as the first adhesive sheet S1, and the adhesive sheet S that has passed through the sheet connecting device 1 and is in use as the second adhesive sheet S2. In this embodiment, we will describe the situation with the premise that a new first adhesive sheet S1 is connected to the second adhesive sheet S2. In addition, we will describe the situation with the first adhesive sheet S1 disposed on the upstream side of the supply direction and the second adhesive sheet S2 disposed on the downstream side relative to the first adhesive sheet S1.

[0082] The protective sheet S used as the adhesive sheet S in this embodiment is, for example, a protective sheet that is attached to the circuit pattern surface formed on the wafer W during back-side grinding of the wafer W. The protective sheet S includes, for example, an adhesive sheet SA that is attached to the circuit pattern surface and a release sheet SP that overlaps with the adhesive layer A in the adhesive sheet SA. The protective sheet S is, for example, formed by laminating the adhesive layer A on a substrate such as EVA (ethylene-vinyl acetate copolymer) or PET (polyethylene terephthalate). Before attachment, the release sheet SP is peeled off, and the adhesive side (adhesive layer A side) of the adhesive sheet SA is attached to the wafer W. Furthermore, the protective sheet S can be attached to the circuit pattern surface of the wafer W by pre-cutting it into the shape of the wafer W before attachment, or by cutting it into the shape of the semiconductor wafer W after attachment to the semiconductor wafer W.

[0083] like Figure 1 and Figure 3 As shown, the adhesive rollers 10, 10 are positioned upstream of the feed direction in the sheet bonding device 1. Figure 2 and Figure 4 As shown, adhesive rollers 10, 10 are arranged along the width direction of the adhesive sheet S and are formed to be wider than the adhesive sheet S. In addition, the two ends of adhesive rollers 10, 10 are rotatably supported on support frames 5, 5.

[0084] like Figure 3As shown, the adhesive rollers 10, 10 are configured to approach or separate from each other across the adhesive sheet S via a suitable drive source (not shown) such as a cylinder. The adhesive rollers 10, 10 only need to be able to approach or separate from each other through relative movement; either the two adhesive rollers 10, 10 can be moved in a manner that allows them to approach or separate from each other, or only one adhesive roller 10 can approach or separate relative to the other adhesive roller 10. In this embodiment, the adhesive rollers 10, 10 are configured to move towards or away from each other.

[0085] The adhesive rollers 10, 10 can clamp the adhesive sheet S passing between them by bringing them close together. The adhesive rollers 10, 10 can supply the adhesive sheet S from the upstream side to the downstream side by rotating in the supply direction while clamping it. Alternatively, the adhesive rollers 10, 10 can also rewind and supply the adhesive sheet S from the downstream side to the upstream side by rotating in the opposite direction. Furthermore, the surface of the adhesive rollers 10, 10 is formed of an adhesive material. The adhesive rollers 10, 10 can be formed by coating the surface with adhesive or by winding an adhesive sheet around the surface.

[0086] Adhesive rollers 10, 10 clamp the connecting end SE1 on one end side of the first adhesive sheet S1 (adhesive sheet S) (see reference). Figure 6 Simultaneously with (c) of the above, the first adhesive sheet S1 is conveyed from the upstream side to the downstream side, and the first adhesive sheet S1 can be separated into an adhesive sheet SA1 and a release sheet SP1 in the connecting end SE1 to form a separation part 50 (see reference). Figure 6 (d) in the section on sheet joining methods will be explained in detail later.

[0087] The drive unit 60 supports the heater 21 and the cutter 31, which will be described later. Behind the drive unit 60, a support frame 6 is formed horizontally along the width direction of the adhesive sheet S (see reference). Figure 2 and Figure 4 The drive unit 60 is supported by a guide shaft 6A arranged along the width direction of the support frame 6 via a guide member 61. Thus, the drive unit 60 is allowed to move in the width direction relative to the adhesive sheet S. Furthermore, the drive unit 60 can move freely in the width direction via a suitable drive source (automatic or manual).

[0088] The drive unit 60 has a track 62 laid on the upper end side (upstream side) facing the forming surface of the adhesive sheet S. In addition, the drive unit 60 has a track 63 laid on the lower end side (downstream side) at intervals parallel to the track 62.

[0089] The connecting portion 20 is disposed downstream of the adhesive rollers 10, 10 in the supply direction. The connecting portion 20 is formed by a heater 21 and a support member 22. The heater 21 is formed with a sharp tip, like a soldering iron, and the support member 22 is disposed across the adhesive sheet S. The heater 21 can be heated to an adjustable temperature by appropriate current control. Furthermore, the heater 21 is supported by a drive unit 60 and movably supported by a track 62 via a guide member 23. Thus, the heater 21 is allowed to move forward and backward toward the forming surface of the adhesive sheet S. The forward and backward movement of the heater 21 is performed by a suitable drive source (not shown). The support member 22 is fixed to a suitable support frame (not shown) and can support the adhesive sheet S from the back side.

[0090] The heater 21 is movable toward the support 22 and along the guide shaft 6A in the width direction. This allows for the heating and pressing of the connecting end SE1 of the first adhesive piece S1 and the connecting end SE2 of the second adhesive piece S2 in the width direction (see reference). Figure 9 (h) will be described in detail later. At this time, the release piece SP1 in the connecting end SE1 and the release piece SP2 in the connected end SE2 are thermally fused together. The heating temperature of the heater 21 only needs to be set to a temperature that can thermally fuse the release piece SP. The heating temperature of the heater 21 can be appropriately changed according to the composition of the release piece SP. In addition, the heater 21 can also be formed to be longer in the width direction so that the adhesive sheet S can be integrally pressed in the width direction. In this case, the movement of the heater 21 in the width direction can be eliminated.

[0091] The cutting section 30 is positioned downstream in the supply direction compared to the connecting section 20. The cutting section 30 has a cutter 31 and an adsorbent 35. The cutter 31 is supported on the drive unit 60 and is positioned on the release sheet SP side, while the adsorbent 35 is positioned on the adhesive sheet SA side and is arranged opposite to the cutter 31.

[0092] The cutter 31 is movably supported on the track 63 in the drive unit 60 via the guide 32. Thus, the cutter 31 is allowed to move forward and backward toward the forming surface of the adhesive sheet S. This forward and backward movement of the cutter 31 is performed by a suitable drive source (not shown). Furthermore, the cutter 31 can move toward the absorbent 35 and along the guide axis 6A in the width direction. Therefore, the adhesive sheet S can be cut in the width direction intersecting the supply direction.

[0093] The absorbent 35 is arranged to extend along the width direction of the adhesive sheet S (see reference). Figure 1 and Figure 4 Furthermore, the adsorbent 35 has a groove 36 formed approximately at its center in the vertical direction along its width. The groove 36 is formed opposite to the cutter 31, allowing the tip of the cutter 31 to enter. This prevents damage to the tip of the cutter 31. Additionally, it reliably cuts the adhesive sheet S.

[0094] In addition, the adsorbent 35 has a plurality of adsorption pores 37 along the width direction (see reference). Figure 1 and Figure 4 The adsorption holes 37 are disposed on the upstream and downstream sides, separated by the cutting groove 36. The adsorption holes 37 are connected to a suitable vacuum pump (not shown) and are capable of adsorbing and holding the adhesive sheet S (second adhesive sheet S2) along its width direction. Therefore, while the adhesive sheet S is adsorbed and held by the adsorption body 35, it is possible to cut the adhesive sheet S along its width direction. This allows for high-precision and linear cutting of the adhesive sheet S.

[0095] The conveyor rollers 40, 40 are disposed downstream of the connecting portion 20 and the cutting portion 30 in the supply direction. Furthermore, the conveyor rollers 40, 40 can approach or separate from each other across the adhesive sheet S via a suitable drive source (not shown), and can clamp the adhesive sheet S by approaching each other. Additionally, by rotating in the supply direction, the conveyor rollers 40, 40 can convey the clamped adhesive sheet S from the upstream side to the downstream side. Furthermore, by rotating in the opposite direction to the supply direction, the conveyor rollers 40, 40 can also convey the clamped adhesive sheet S from the downstream side to the upstream side.

[0096] The above describes the structure of the sheet connecting device 1 according to the present invention. Next, reference will be made to... Figures 5 to 10 , Figure 12 The sheet connection method and sheet replacement system in the sheet connection device 1 are described in detail.

[0097] like Figure 5 As shown in (a), in the initial state, the second adhesive sheet S2 is in use and passes through. In this state, by generating an adsorption force through the adsorption holes 37 of the adsorption body 35, the non-adhesive side of the adhesive sheet SA holding the second adhesive sheet S2 is adsorbed and held. Next, the cutter 31 is moved toward the cutter groove 36, and the drive unit 60 is moved in the width direction. As a result, the second adhesive sheet S2 is divided into two parts: a raw material roll side on the upstream side of the supply direction and a downstream side of the supply direction, and a connected end SE2 (second adhesive sheet cutting process) is formed at one end on the downstream side of the supply direction. Furthermore, when the second adhesive sheet cutting process is completed, the adsorption of the adsorption body 35 is released.

[0098] As described above, in the second adhesive sheet cutting process, the second adhesive sheet S2 can be cut while it is held in place by the adsorption body 35. Therefore, the joined end SE2 can be formed with high precision at the end of the second adhesive sheet S2, and in the sheet joining process described later, it can be joined with high precision to the joining end SE1. Therefore, it is expected that the joining end SE1 and the joined end SE2 can be prevented from detaching after joining. Furthermore, the second adhesive sheet S2 does not need to be cut directly by an operator, and the joined end SE2 can be formed with high precision regardless of the operator's skill level.

[0099] Next, as Figure 5 As shown in (b), the cutter 31 retracts, and the raw material roll side of the second adhesive sheet S2 is wound onto the raw material roll 3 and recycled. Furthermore, unwanted raw material rolls 3 can be removed or replaced manually or automatically by a robot or the like.

[0100] Next, as Figure 6 As shown in (c), the first adhesive sheet S1 is supplied from the upstream side of the second adhesive sheet S2 (first adhesive sheet supply process). The supply of the first adhesive sheet S1 can be appropriately performed by changing the material roll 3 and passing the connecting end SE1 at one end between the adhesive rollers 10, 10. Furthermore, the operation of changing the material roll 3 and passing it between the adhesive rollers 10, 10 can be performed manually or automatically by a conveying mechanism, robot, etc. If multiple material rolls 3 can be equipped, the supply operation of the adhesive sheet S can continue, and the replacement operation of the material roll 3 can be postponed and the material roll 3 can be replaced at the same time. In addition, when the first adhesive sheet S1 passes between the adhesive rollers 10, 10, the adhesive rollers 10, 10 approach each other and clamp the connecting end SE1. At this time, the conveying rollers 40, 40 clamp the area near the connected end SE2 of the second adhesive sheet S2. In this way, the first adhesive sheet S1 can be supplied to the sheet bonding process described later by easily supplying the connecting end SE1 on the front end side of the first adhesive sheet S1 toward a pair of adhesive rollers 10, 10.

[0101] Next, as Figure 6As shown in (d), by rotating the adhesive rollers 10, 10 toward the supply direction, the connecting end SE1 of the first adhesive sheet S1 is conveyed from the upstream side to the downstream side of the supply direction while being held by a pair of adhesive rollers 10, 10. Thus, the connecting end SE1 is separated into an adhesive sheet SA and a release sheet SP to form a separation section 50 (separation section forming process). Furthermore, the adhesive force of the adhesive rollers 10, 10 can be appropriately varied according to the composition of the adhesive sheet S to be peeled off. In forming the separation section 50, a mechanism other than the adhesive rollers 10 can be provided. For example, the separation section 50 can also be formed using a peeling trigger mechanism 70 of the convex roller 71 (needle roller 71) (see reference). Figure 12 Furthermore, the formation of the separation portion 50 by means of the peeling trigger mechanism 70 will be explained in detail in the modified examples described later.

[0102] Next, as Figure 7 As shown in (e), by rotating the adhesive rollers 10, 10 and the conveying rollers 40, 40 in the direction of the arrows shown, the second adhesive sheet S2 is conveyed from the downstream side to the upstream side in the supply direction. As a result, the joined end SE2 is inserted toward the separating part 50 (sheet insertion process).

[0103] Next, as Figure 8 As shown in (f), by rotating the adhesive rollers 10, 10 and the conveying rollers 40, 40 in the direction of the arrows, the first adhesive sheet S1 and the second adhesive sheet S2 are conveyed from the downstream side to the upstream side in the supply direction with the joined end SE2 inserted into the separating part 50. Thus, the connecting end SE1 and the joined end SE2 are clamped by a pair of adhesive rollers 10, 10, and are pressed together to form a sheet joining process. At this time, the adhesive surface (back side) of the adhesive sheet SA1 in the connecting end SE1 is pressed against the non-adhesive surface (surface) of the adhesive sheet SA2 in the joined end SE2, and is thus temporarily joined. Therefore, the temporarily joined connecting end SE1 and the joined end SE2 are clamped by a pair of adhesive rollers 10, 10. Thus, the joined end SE2 is reliably held in the connecting end SE1. Furthermore, since there is no need to prepare additional adhesive components for joining, the joining allowance can be reduced, thereby reducing costs. Therefore, a sheet joining device 1 particularly suitable for situations such as replacing adhesive sheets S can be provided.

[0104] Next, as Figure 9 As shown in (g), the connected ends SE1 and SE2 are conveyed by rotating the adhesive rollers 10, 10 and the conveying rollers 40, 40 in the direction of the arrow in the figure, so that they pass through the adhesive rollers 10, 10 and are located upstream of the supply direction of the adhesive rollers 10, 10.

[0105] Then, as Figure 9 As shown in (h), by rotating the conveying rollers 40 and 40 with the clamping of the adhesive rollers 10 and 10 released, the connecting ends SE1 and SE2 to be connected are conveyed from the upstream side to the downstream side, so that they are facing the heater 21. At this time, since the clamping of the adhesive rollers 10 and 10 is released, the sheet S is not pulled by the adhesive rollers 10 and 10. Therefore, the connection between the connecting ends SE1 and SE2 will not detach. Next, by moving the heater 21 toward the support member 22, the connecting ends SE1 and SE2 are heated and pressed together (heat pressing process). As a result, the release sheets SP1 and SP2 of the connecting ends SE1 and SE2 are heat-fused together. In addition, the adhesive sheet SA1 in the connecting end SE1 is pressed onto the surface of the adhesive sheet SA2 in the connecting end SE2. Furthermore, the bonding of the adhesive sheet SA1 in the connecting end SE1 and the adhesive sheet SA2 in the connecting end SE2 can be performed by either or both of heat fusion and bonding of the adhesive layer A.

[0106] By performing the heating and pressing process as described above, the connecting end SE1 and the connected end SE2 can be reliably connected. Therefore, it is possible to prevent the first adhesive sheet S1 and the second adhesive sheet S2 from separating midway during supply. Furthermore, since there is no need to prepare additional adhesive components for connection, cost increases can be prevented. Additionally, because the connecting end SE1 and the connected end SE2 are automatically and precisely connected, it is possible to prevent the connected sheet from warping and becoming unusable.

[0107] Next, as Figure 10 As shown in (i), the clamped adhesive sheet S (the first adhesive sheet S1 in this embodiment) is fed downstream in the supply direction by the rotation of the conveying rollers 40, 40. Thus, the adhesive sheet S is supplied to the protective sheet adhesive device 2, for example.

[0108] As described above, an adhesive sheet replacement system can be provided, in which the end (connecting end SE1) of the first adhesive sheet S1 is connected to the end (connected end SE2) of the second adhesive sheet S2 using the sheet connecting device 1 of the present invention, thereby enabling the replacement of the adhesive sheet S supplied to the supply destination.

[0109] According to the above-described adhesive strip replacement system, for example, the used second adhesive strip S2 and the unused first adhesive strip S1 can be easily replaced. Specifically, the above-described strip replacement system can connect the rear end (connected end SE2) of the second adhesive strip S2, whose remaining quantity has decreased due to use, to the front end (connected end SE1) of the new first adhesive strip S1. Therefore, the adhesive strip S can be replaced regardless of the skill level of the replacement operation. Thus, the time spent replacing the adhesive strip S can be significantly reduced, and costs can be reduced. Therefore, if the above-described adhesive strip replacement system is used in the protective strip bonding device 2 for bonding protective strips to semiconductor wafers W, it is expected that the production cost of semiconductor wafers W can be reduced. Furthermore, according to the sheet bonding device 1, the above-described sheet bonding method, and the above-described adhesive strip replacement system, even if a wide protective strip S (adhesive strip S) is used on the semiconductor wafer W and requires pulling force for removal, it is expected that the effect of preventing the bonded sheets from detaching from each other after replacement can be suppressed. Therefore, the sheet bonding device 1, sheet bonding method, and sheet replacement system of the present invention can be well applied to various bonding devices for protective films S, slicing tapes, dry film resists, etc., bonded to semiconductor wafers W. Figure 6 In the separation section 50 shown in (d), the first adhesive sheet S1 is separated into an adhesive sheet SA1 and a release sheet SP1 at the connecting end SE1. However, if sufficient reproducibility cannot be obtained solely by the adhesive rollers 10, 10, then... Figure 12 As shown, a stripping trigger mechanism 70 can be added.

[0110] The following describes in detail a modified example of the sheet connecting device 1 equipped with the peeling trigger mechanism 70. It should be noted that descriptions of components identical to those in the above embodiment are omitted. Furthermore, it should be noted that the same reference numerals are used for components identical to those in the above embodiment. Additionally, it should be noted that... Figure 12 The description is simplified by omitting some components to facilitate understanding.

[0111] Variations

[0112] like Figure 12 As shown, the peeling trigger mechanism 70 mounted on the sheet joining device 1 according to the modified example includes a convex-concave roller 71 and a support portion 72, etc., and the support portion 72 rotatably supports the convex-concave roller 71. Furthermore, in Figure 12 In (a) to (c), the right side of each figure is described as the raw material roll side (upstream side).

[0113] In this modified example, the convex roller 71 is, for example, a roller with multiple protrusions (e.g., needles) formed on its surface (hereinafter, the convex roller 71 will also be referred to as the needle roller 71). The convex roller 71 is rotatably supported on the support portion 72. The convex roller 71 can abut against the surface of the release sheet SP1 in the first adhesive sheet S1 under the drive of the support portion 72.

[0114] The support portion 72 rotatably supports the convex and concave rollers 71. In addition, the support portion 72 is connected to a suitable drive source (not shown) and can move in the width direction of the sheet S and in the vertical direction.

[0115] The peel trigger mechanism 70 is configured as described above. Next, the details of peel triggering on the first adhesive sheet S1 by means of the peel trigger mechanism 70 will be explained.

[0116] like Figure 12 As shown in (a) and (b), firstly, the second adhesive sheet S2 in use is cut in the width direction by the cutter 31. The raw material roll side (right side of the figure) of the cut second adhesive sheet S2 is wound into the raw material roll 3 and recycled. Although the figure is omitted, when the raw material roll side of the second adhesive sheet S2 is wound, the raw material roll 3 is replaced with the raw material roll 3 of the first adhesive sheet S1 before use, and the first adhesive sheet S1 is supplied from the raw material roll side.

[0117] Next, as Figure 12 As shown in (c), on the raw material roll side of the first adhesive sheet S1 held at the front end by adhesive rollers 10, 10, the convex roller 71 abuts against the release sheet SP1 side (lower side of the figure) of the first adhesive sheet S1. Driven by the support 72, the convex roller 71 rolls along the width direction of the first adhesive sheet S1 while abutting against the release sheet SP1 side. As a result, air intrudes between the adhesive sheet SA1 and the release sheet SP1, weakening the adhesion between them, thereby forming a peel triggering area 73. Furthermore, in this modified example, the peel triggering mechanism 70 forms the peel triggering area 73 via the needle roller 71, but it is not limited to this; various peel triggering forming components can be used in the peel triggering mechanism 70. Additionally, depending on the conditions, the convex roller 71 can roll while abutting against the non-adhesive surface side of the adhesive sheet SA1, instead of abutting against the release sheet SP1 side of the first adhesive sheet S1. Furthermore, in Figure 12 In the modified example shown, the cutter 31 is disposed on the adhesive sheet SA side, but it can also be disposed on the release sheet SP side.

[0118] The above describes the sheet joining method and sheet replacement system using the sheet joining device 1 of the present invention. However, the sheet joining device 1, sheet joining method, and sheet replacement system of the present invention are not limited to the above embodiments and can be modified in various ways.

[0119] In this embodiment, the connecting portion 20 is connected by heating and welding, but the connection of the connecting portion 20 is not limited to this; it can also be connected by bonding with a welding agent, or by using paste or adhesive. When applying adhesive, an adhesive application process can be performed before the sheet bonding process, using an adhesive application section (not shown) arranged along the supply path of the adhesive sheet S to apply adhesive. Alternatively, a welding agent or paste can be used instead of adhesive depending on the material of the release sheet SP. Furthermore, the adhesive application site can be either the connecting end SE1 or the joined end SE2, and the position of the adhesive application section can be determined based on the application site.

[0120] In this embodiment, the adhesive sheet S uses an adhesive sheet with a release liner SP formed on one side. However, the adhesive sheet S is not limited to this, and adhesive sheets formed from various layers can also be used. For example, the adhesive sheet S can be an adhesive sheet with release liners SP on both the front and back sides, or an adhesive sheet with adhesive layers A formed on both sides of the adhesive sheet SA, and other types of adhesive sheet S. In addition, the adhesive sheet S can be formed not only of two layers (adhesive sheet SA and release liner SP) as described in this embodiment, but it can also be composed of two or more layers. In addition, in this embodiment, the adhesive sheet S is described as a protective sheet S used on a semiconductor wafer W, but it is not limited to protective sheets S. Various adhesive sheets S such as slicing tape or dry film resist can also be used. In addition, the adhesive sheet S can be not only a wide adhesive sheet, but also adhesive sheets of various widths. In addition, in this embodiment, the case of connecting the second adhesive sheet S2 and the first adhesive sheet S1 is illustrated. However, it can also be used in situations where, for example, the adhesive sheet S is cut and broken in the middle, the same adhesive sheet S can be reconnected.

[0121] In this embodiment, the surface of the adhesive roller 10 is illustrated as being formed from an adhesive raw material. However, the adhesive roller 10 can be any type of adhesive roller, such as one where the raw material itself is adhesive or one where an adhesive sheet is wound around the surface portion. The adhesiveness of the adhesive roller 10 can be appropriately varied depending on the raw material of the adhesive sheet S. Furthermore, a pair of adhesive rollers 10 can be used depending on the raw material of the adhesive sheet S, for example, adhesive rollers with the same adhesiveness or adhesive rollers with different adhesiveness. Additionally, a separation section 50 can be formed by providing a separate mechanism based on or replacing the adhesive roller 10.

[0122] In this embodiment, the adhesive roller 10, connecting portion 20, cutting portion 30, and conveying roller 40 are arranged sequentially from upstream to downstream in the supply direction. However, the arrangement of these components can be appropriately changed according to the conveying direction of the adhesive sheet S. Furthermore, in this embodiment, a heater 21 with a sharp tip, similar to a soldering iron, is exemplified as the connecting portion 20. However, various components can be used as long as the connecting portion 20 can thermally fuse the connecting end SE1 and the connected end SE2 by heating. For example, not only components that heat in a point-like manner like a soldering iron can be used, but also heating components of various shapes and sizes, such as heaters formed throughout the entire width direction of the adhesive sheet S or heaters formed in a concave-convex shape along the width direction. The heating temperature in the connecting portion 20 can be appropriately changed according to the raw material of the adhesive sheet S.

[0123] In this embodiment, the connecting end SE1 and the connected end SE2 are thermally fused together along the width direction of the adhesive sheet S. However, it is not only possible to thermally fuse them together along the width direction, but also to thermally fuse only a portion of them, such as by point-like thermal fusion. In this case, it is preferable to thermally fuse the connecting end SE1 and the connected end SE2 at multiple locations along the width direction of the adhesive sheet S.

[0124] In this embodiment, the cutting portion 30 is formed by a cutter 31, which moves along the width of the adhesive sheet S to cut it. However, the shape and size of the cutter 31 can be appropriately changed. For example, the cutter 31 may be formed throughout the entire width of the adhesive sheet S. In this case, the adhesive sheet S can be cut by pressing the cutter 31 against it.

[0125] In addition, the size and degree of separation of the formed separation section 50 can be appropriately changed according to the thickness of the adhesive sheet S (including the thickness of the adhesive sheet SA and the release sheet SP) and the material of the adhesive sheet S.

[0126] In this embodiment, by conveying the first adhesive sheet S1 and the second adhesive sheet S2 from the downstream side to the upstream side in the supply direction, the connecting end SE1, into which the connected end SE2 is inserted, is crimped. However, if the connected end SE2 can be held in the connecting end SE1, the crimping can be canceled.

[0127] In this embodiment, the cutting section 30 has an adsorption body 35 disposed opposite to the cutter 31, but it can also be replaced by a non-adsorption cutter holder. Furthermore, the adsorption body 35 can be used not only through the adsorption holes 37, but also various other components such as an adsorption body with low surface adhesion, or an adsorption body with a certain adhesion force through close contact. Additionally, in this embodiment, a cutting groove 36 is provided on the adsorption body 35, but the shape and presence of the cutting groove 36 can be appropriately changed depending on the cutting component used.

[0128] In this embodiment, during the second adhesive sheet cutting process, the second adhesive sheet S2 is cut along its width direction to form a connected end SE2 at one end on the downstream side of the supply direction. However, if the second adhesive sheet S2 is divided into two parts beforehand, this second adhesive sheet cutting process can be omitted. Furthermore, the sheet insertion process can be performed using various methods, such as automatic or manual methods, as long as the second adhesive sheet S2 can be conveyed towards the separation section 50 from the downstream side to the upstream side of the supply direction.

[0129] The above are embodiments and variations of the sheet connecting device, sheet connecting method and sheet replacement system of the present invention. However, the present invention is not limited to the contents illustrated in the above embodiments and variations. Other embodiments can be obtained in accordance with the teachings and spirit of the claims without departing from the scope of the claims. This is readily understood by those skilled in the art.

[0130] (Industrial applicability)

[0131] The sheet bonding apparatus, sheet bonding method, and sheet replacement system of the present invention can be used to bond various adhesive sheets, such as adhesive sheets. Furthermore, the sheet bonding apparatus, sheet bonding method, and sheet replacement system of the present invention can be effectively used to bond various adhesive sheets such as protective films, slicing tapes, and dry film resists bonded to semiconductor wafers.

Claims

1. A sheet joining device for joining a first adhesive sheet and a second adhesive sheet along a supply direction, wherein the first adhesive sheet is formed by overlapping a release liner on at least the adhesive surface side of an adhesive sheet and is disposed upstream in the supply direction, and the second adhesive sheet is disposed downstream in the supply direction relative to the first adhesive sheet. The sheet connecting device is characterized by having: A pair of adhesive rollers are arranged on the upstream side of the supply direction in such a way that they can approach or separate each other with respect to the adhesive sheet, and can clamp the adhesive sheet by approaching each other; The connecting portion and the cutting portion are arranged along the supply path of the adhesive sheet; and A pair of conveying rollers are arranged downstream in the supply direction relative to the connecting portion and the cutting portion in a manner that allows them to approach or separate from each other with respect to the adhesive sheet, and are able to clamp the adhesive sheet by approaching each other. The cutting portion can be formed by cutting the second adhesive piece in a width direction that intersects the supply direction to form the connected end. The surfaces of the pair of adhesive rollers are respectively adhesive, and by clamping the connecting end of the first adhesive sheet with the pair of adhesive rollers while conveying the first adhesive sheet from the upstream side to the downstream side, the first adhesive sheet can be separated into the adhesive sheet and the release sheet at the connecting end to form a separation portion. The conveying roller can insert the joined end into the separating portion by simultaneously clamping and conveying the second adhesive piece toward the connecting end. The connecting part inserts the end to be connected into the connecting end, and connects the connecting end to the end to be connected by adhesive or fusion.

2. The sheet joining device according to claim 1, characterized in that, The connecting part is connected by heating to fuse the release piece in the connecting end and the release piece in the connected end.

3. The sheet joining device according to claim 1, characterized in that, The connecting part is connected by applying adhesive to bond the release sheet in the connecting end and the release sheet in the connected end respectively.

4. The sheet joining device according to any one of claims 1 to 3, characterized in that, A pair of adhesive rollers can press the connecting ends into which the connecting ends are inserted by conveying the first adhesive sheet and the second adhesive sheet from the downstream side to the upstream side in the supply direction.

5. The sheet joining device according to claim 4, characterized in that, The cutting portion has: A cutter, which is disposed on the side of the release sheet; and An adsorbent is disposed on the side of the adhesive sheet and is positioned opposite the cutter. The absorbent is capable of adsorbing and holding the second adhesive piece along its width, and has a groove along its width at a position opposite to the cutter.

6. The sheet joining device according to claim 5, characterized in that, The adhesive sheet is a protective sheet that protects the surface of a semiconductor wafer, a slicing tape used in slicing semiconductor wafers, or a dry film resist.

7. The sheet joining device according to claim 5, characterized in that, The convex roller is rolled on the surface of the first adhesive sheet, thereby making it easy to separate into an adhesive sheet and a release sheet.

8. A method for joining sheets, comprising joining a first adhesive sheet and a second adhesive sheet along a supply direction, wherein the first adhesive sheet is formed by overlapping a release liner on at least the adhesive side of an adhesive sheet and is disposed on an upstream side of the supply direction, and the second adhesive sheet is disposed on a downstream side of the supply direction relative to the first adhesive sheet. The sheet joining method is characterized by performing the following steps: In the second adhesive sheet cutting process, the second adhesive sheet is cut along the width direction to be divided into two parts: the raw material roll side and the downstream side in the supply direction, and a connected end is formed on one end side of the downstream side in the supply direction. In the first adhesive sheet supply process, the first adhesive sheet is supplied from the upstream side of the second adhesive sheet; In the separation part forming process, the connecting end of the first adhesive sheet is conveyed from the upstream side to the downstream side of the supply direction while being held by a pair of adhesive rollers, so that the connecting end is separated into the adhesive sheet and the release sheet to form a separation part. In the sheet insertion process, the second adhesive sheet is conveyed from the downstream side to the upstream side in the supply direction, thereby inserting the connected end toward the separation part; as well as In the sheet joining process, with the joined ends inserted into the separating part, the first adhesive sheet and the second adhesive sheet are conveyed from the downstream side to the upstream side in the supply direction, while the joining end and the joined end are clamped by a pair of adhesive rollers.

9. The sheet joining method according to claim 8, characterized in that, After the sheet joining process is performed, a heat pressing process is performed. In the heat pressing process, with the adhesive roller released from its clamping state, the joining end and the joined end are heat-pressed together by a connecting part arranged along the supply path of the adhesive sheet.

10. The sheet joining method according to claim 8, characterized in that, Before performing the sheet bonding process, an adhesive application process is performed, in which adhesive is applied using an adhesive application section arranged along the supply path of the adhesive sheet.

11. A sheet replacement system, characterized in that, Using the sheet connecting device according to any one of claims 1 to 3 By connecting the end of the first adhesive patch to the end of the second adhesive patch, the adhesive patch supplied to the supply destination is replaced.

12. The sheet replacement system according to claim 11, characterized in that, The adhesive sheet is a protective sheet that protects the surface of a semiconductor wafer, a slicing tape used in slicing semiconductor wafers, or a dry film resist.

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