Component supply device and component supply method

Abstract

A component supply device supplies components by using air force to feed interconnected components along a horizontally extending transport path towards a supply position, wherein the supply position is lower than the transport path. A component supply method supplies components by using air force to feed components with terminals towards a supply position, performing a transport step and a positioning step to supply components with terminals positioned in the positioning step one by one. The transport step involves transporting components with terminals in an interconnected state towards the supply position by bringing the terminals into contact with the transport surface of the transport path, and the positioning step involves positioning the terminals of the components with terminals transported in the transport step at the supply position.

Description

Technical Field

[0001] The present invention relates to a component supply device, etc., which uses air force to feed interconnected components toward a supply position to supply components. Background Technology

[0002] The following patent document describes a component supply device that uses air force to feed a component toward a supply position to supply the component.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 9-57545 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The objective of this invention is to supply an element appropriately at the supply position in an apparatus that uses air force to feed the element toward the supply position.

[0008] Technical solutions for solving the problem

[0009] To address the aforementioned issues, this specification discloses a component supply device that uses air force to feed interconnected components along a horizontally extending transport path toward a supply position, wherein the supply position is lower than the transport path.

[0010] Furthermore, in order to solve the above-mentioned problems, this specification discloses a method for supplying components, which uses air force to feed components with terminals toward a supply position. The method includes the following steps to supply components with terminals that were positioned in the positioning step one by one: a transport step in which the terminals are brought into contact with the transport surface of the transport path and the components with terminals are transported toward the supply position while connected to each other; and a positioning step in which the terminals of the components with terminals that were transported in the transport step are positioned at the supply position.

[0011] Invention Effects

[0012] In this specification, the component supply position is lower than the component transport path. Furthermore, in this specification, components with terminals are positioned at the supply position and supplied one by one. Therefore, components can be supplied appropriately at the supply position. Attached Figure Description

[0013] Figure 1 It is a three-dimensional diagram showing the component mounting device.

[0014] Figure 2 It is a three-dimensional diagram showing the component assembly.

[0015] Figure 3 This is a three-dimensional diagram representing a bowl feeder.

[0016] Figure 4 This is a side view of a bowl feeder.

[0017] Figure 5 This is a top view of a bowl feeder.

[0018] Figure 6 It is a schematic diagram showing the conveying channel, supply block, and air ejection device.

[0019] Figure 7 This is a top view showing the transport channels and supply blocks.

[0020] Figure 8 It is an enlarged sectional view showing the transport channel and supply block.

[0021] Figure 9 This is a block diagram representing the control device.

[0022] Figure 10 It is an enlarged sectional view showing the transport channel and supply block.

[0023] Figure 11 It is an enlarged sectional view showing the transport channel and supply block.

[0024] Figure 12 It is an enlarged sectional view showing the transport channel and supply block.

[0025] Figure 13 It is an enlarged sectional view showing the transport channel and supply block.

[0026] Figure 14 It is an enlarged sectional view showing the transport channel and supply block.

[0027] Figure 15 It is an enlarged sectional view showing the transport channel and supply block. Detailed Implementation

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, as examples of implementing the present invention.

[0029] Figure 1 The component mounting apparatus 10 is shown. The component mounting apparatus 10 is a device for performing the mounting operation of components relative to a circuit substrate 12. The component mounting apparatus 10 includes a main body 20, a substrate handling and holding device 22, a component assembly device 24, imaging devices 26 and 28, a bulk component supply device 30, a component supply device 32, and a control device (see reference). Figure 936. In addition, as a circuit substrate 12, examples include circuit boards, three-dimensional substrates, etc., and as a circuit board, examples include printed wiring boards, printed circuit boards, etc.

[0030] The main body 20 of the device consists of a frame 40 and beams 42 mounted on the frame 40. A substrate handling and holding device 22 is disposed at the center of the frame 40 in the front-rear direction, and includes a handling device 50 and a clamping device 52. The handling device 50 is used to handle the circuit substrate 12, and the clamping device 52 is used to hold the circuit substrate 12. Thus, the substrate handling and holding device 22 handles the circuit substrate 12 and holds it fixedly in a predetermined position. Furthermore, in the following description, the handling direction of the circuit substrate 12 is referred to as the X-direction, the horizontal direction perpendicular to this direction is referred to as the Y-direction, and the vertical direction is referred to as the Z-direction. That is, the width direction of the component mounting device 10 is the X-direction, and the front-rear direction is the Y-direction.

[0031] The component assembly device 24 is mounted on beam 42 and has two working heads 60 and 62 and a working head moving device 64. For example... Figure 2 As shown, suction nozzles 66 are detachably provided on the lower end face of each working head 60, 62, and the components are held by the suction nozzles 66. Furthermore, the working head moving device 64 includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Both working heads 60, 62 can be moved integrally to any position on the frame 40 via the X-direction moving device 68 and the Y-direction moving device 70. Moreover, the operator can detachably position and assemble each working head 60, 62 onto the sliding members 74, 76 with a single touch without using tools, and the Z-direction moving device 72 allows the sliding members 74, 76 to move independently in the vertical direction. That is, the working heads 60, 62 can move independently in the vertical direction via the Z-direction moving device 72.

[0032] The imaging device 26 is mounted on the slider 74 with its vertical axis pointing downwards, and moves together with the working head 60 in the X, Y, and Z directions. Thus, the imaging device 26 can capture images of any position on the frame 40. Figure 1 As shown, the imaging device 28 is positioned on the frame 40 between the substrate handling and holding device 22 and the component supply device 32, with the substrate facing upwards along the vertical axis. Thus, the imaging device 28 images the components held by the suction nozzles 66 of the working heads 60 and 62. Furthermore, the imaging devices 26 and 28 are two-dimensional cameras, capturing two-dimensional images.

[0033] The bulk component supply device 30 is disposed at one end of the frame 40 in the front-rear direction. The bulk component supply device 30 is a device that arranges multiple components that are scattered in a neat manner and supplies components in a neatly arranged state. That is, it is a device that arranges multiple components in arbitrary positions into a predetermined position and supplies components in the predetermined position.

[0034] The component supply device 32 is disposed at the other end of the frame 40 in the front-rear direction. The component supply device 32 includes a tray-type component supply device 78 and a feeder-type component supply device 80. The tray-type component supply device 78 is a device for supplying components that are placed on a tray. The feeder-type component supply device 80 is a device for supplying components by means of a bowl feeder 82, a device for supplying components by means of a belt feeder, etc. The structure of the bowl feeder 82 will be described below.

[0035] The operator uses multiple slots from all the slots provided on the feeder holding table 86, which is fixedly located at the other end of the frame 40, to detachably position and assemble the bowl feeder 82. The bowl feeder 82 is a feeding device that transports multiple electronic components housed in a bowl-shaped bowl in a row and in contact with each other, i.e., in a connected state, to the feeding position and feeds them one by one at the feeding position.

[0036] like Figures 3-5 As shown, the bowl feeder 82 includes a feeder body 100, a component hopper 102, a bowl 104, a conveying channel 106, and an air ejection device (see reference). Figure 6 108. Supply block 110. Separation device (refer to) Figure 8 )111. Furthermore, in the following description, the direction from the component hopper 102 toward the supply block 110 will be described as forward, and the direction from the supply block 110 toward the component hopper 102 will be described as rearward. Additionally, Figure 3 This is a perspective view of the bowl feeder 82 from an obliquely upward viewpoint. Figure 4 This is a side view of the bowl feeder 82 from a side perspective. Figure 5 This is a top view of the bowl feeder 82 from an upward perspective.

[0037] A bowl feeder 82 is mounted in the feeder body 100 within a feeder holding platform 86. A component hopper 102, a bowl 104, a transport channel 106, and a supply block 110 are disposed on the upper surface of the feeder body 100. The component hopper 102 is generally cylindrical and is located at the rear end of the upper surface of the feeder body 100. A bowl-shaped recess exists on the upper surface of the component hopper 102; this recess is the component input portion 112. Furthermore, a protrusion 114 protruding forward is formed at the front end of the upper edge of the component hopper 102. A groove 116 is formed on the upper surface of this protrusion 114, extending in a front-rear direction. This groove 116 opens towards the front end of the protrusion 114 at its front end and towards the component input portion 112 at its rear end. Additionally, the width of the groove 116 is slightly larger than the width of the electronic component.

[0038] Furthermore, a spiral-shaped transport path 118 is formed on the inner wall surface of the component input section 112. This transport path 118 extends from the bottom surface of the component input section 112, wraps around the inner wall surface of the component input section 112, and reaches the opening at the rear end of the slot 116. Additionally, the component hopper 102 is held on the upper surface of the feeder body 100 to vibrate in both the front-back and left-right directions, via an electromagnetic motor (see reference...). Figure 9 The operation of the electromagnetic motor 120 causes it to torsion and vibrate in the front-back and left-right directions. In addition, the operation of the electromagnetic motor 120 causes the component hopper 102 to vibrate at a high frequency with a very small amplitude, thereby causing the components fed into the component feeding section 112 to move upward along the transport path 118.

[0039] Furthermore, the bowl 104 is also generally cylindrical and is disposed on the upper surface of the feeder body 100 in front of the component hopper 102. Additionally, the height of the bowl 104 is smaller than the height of the component hopper 102, and the bowl 104 is disposed in front of the component hopper 102 with its upper surface located below the front end of the protrusion 114 that protrudes forward from the upper end of the component hopper 102. Furthermore, the upper surface of the bowl 104 also forms a recessed portion in the shape of a bowl, which functions as a component receiving portion 122.

[0040] A spiral-shaped transport path 124 is also formed on the inner wall of the component receiving section 122. This transport path 124 extends from the bottom surface of the component receiving section 122, encircling the inner wall of the component receiving section 122, and opens laterally at the upper edge of the bowl 104. Furthermore, the bowl 104 is also held on the upper surface of the feeder body 100 to vibrate in both the front-back and left-right directions, via an electromagnetic motor (see reference). Figure 9The operation of the electromagnetic motor 128 causes the bowl 104 to vibrate in both the front-back and left-right directions. In addition, the operation of the electromagnetic motor 128 causes the bowl 104 to vibrate at a very small amplitude at a high frequency, thereby causing the components inserted into the component receiving section 122 to move upward along the transport path 124.

[0041] Furthermore, the transport channel 106 is generally rod-shaped and is supported by two support legs 130, 131, extending horizontally and longitudinally on the upper surface of the feeder body 100. Additionally, the rear end of the transport channel 106 extends toward the transport path 124, which opens to the side of the upper edge of the bowl 104. Furthermore, a transport groove 132 is formed on the upper surface of the transport channel 106, extending longitudinally. The transport groove 132 opens toward the front end of the transport channel 106 at its front end and toward the rear end of the transport channel 106 at its rear end. Moreover, the transport groove 132 opens on the upper surface of the transport channel 106, but... Figure 6 As shown, the opening is covered by a cover member 134. Therefore, the transport groove 132 becomes a tunnel shape that extends through the transport channel 106 in the front-to-back direction. However, the cover member 134 does not cover the front end of the transport groove 132; the upper surface of the transport channel 106 only opens at the front end of the transport groove 132. Furthermore, the dimension between the bottom surface of the transport groove 132 and the lower surface of the cover member 134, i.e., the vertical dimension of the tunnel-shaped transport groove 132, is slightly larger than the height dimension of the electronic component. Additionally, the width dimension of the transport groove 132 is slightly larger than the width dimension of the electronic component.

[0042] The rear end of the transport channel 132 faces the transport path 124, which opens to the side of the upper edge of the bowl 104, with a small gap between them. That is, the rear end of the transport path 106, which opens to the rear end of the transport channel 132, faces the side of the upper edge of the bowl 104, where the transport path 124 opens, with a small gap between them. Furthermore, the transport path 106 is held by support legs 130 and 131 to be able to vibrate in the front-to-back direction, via an electromagnetic motor (see reference...). Figure 9 The operation of the electromagnetic motor 136 causes the transport channel 106 to vibrate in the front-to-back direction. Similarly, the operation of the electromagnetic motor 136 causes the transport channel 106 to vibrate at a high frequency with a very small amplitude, thereby moving the elements arranged along the transport groove 132 of the transport channel 106 forward.

[0043] Incidentally, the gap between the rear end of the transport channel 106 and the side portion of the upper edge of the bowl 104 is larger than the sum of the amplitudes of the transport channel 106 and the bowl 104. Therefore, when the bowl 104 and the transport channel 106 vibrate, the bowl 104 does not come into contact with the transport channel 106. Furthermore, as will be explained in detail later, electronic components are transported from the transport path 124 of the bowl 104 to the transport groove 132 of the transport channel 106, but the gap between the rear end of the transport channel 106 and the side portion of the upper edge of the bowl 104 is smaller than the external dimensions of the electronic component. Therefore, when transporting electronic components from the transport path 124 of the bowl 104 to the transport groove 132 of the transport channel 106, the electronic components are prevented from falling off.

[0044] In addition, such as Figure 6 As shown, the air ejection device 108 includes a piping 140 and an air pump 142. An airflow path 146 is formed in the transport channel 106, extending from the lower surface of the transport channel 106 to the bottom surface of the transport trough 132. The airflow path 146 extends obliquely upwards and forwards from the bottom surface of the transport channel 106, and opens at the bottom surface of the transport trough 132. Furthermore, seven airflow paths 146 are formed at approximately seven equal intervals along the front-back direction of the transport channel 106. The piping 140 branches into seven branches at one end, and one end of the seven-branched piping 140 is connected to the openings of the seven airflow paths 146 facing the lower surface of the transport channel 106. The other end of the piping 140 is connected to the air pump 142. With this configuration, the air pump 142 operates, causing air to flow into the airflow paths 146 via the piping 140, and the air is ejected into the interior of the transport trough 132. Furthermore, the airflow path 146 extends diagonally upwards and forwards from the bottom surface of the transport channel 106, so the air ejected into the interior of the transport groove 132 flows from rear to front within the transport groove. As a result, the components arranged along the transport groove 132 of the transport channel 106 move forward.

[0045] In addition, such as Figure 3 As shown, the supply block 110 is supported by a support leg 150 at a position on the upper surface of the feeder body 100 facing the front end of the transport channel 106. Furthermore, the upper surface of the supply block 110 is at approximately the same height as the upper surface of the transport channel 106. And, as... Figure 7 As shown, a component receiving port 152 is formed on the upper surface of the supply block 110. The component receiving port 152 opens on both the upper surface and the rear end face of the supply block 110. The opening of the component receiving port 152 facing the rear end face of the supply block 110 faces the opening at the front end of the transport groove 132 of the transport channel 106 through a small gap. Furthermore, as... Figure 8As shown, the bottom surface of the component receiving port 152 is at the same height as the bottom surface of the transport groove 132 of the transport channel 106. Furthermore, the gap between the rear end face of the supply block 110 and the front end of the transport channel 106 is larger than the amplitude of the transport channel 106. Therefore, when the transport channel 106 vibrates, the supply block 110 does not come into contact with the transport channel 106. Moreover, as will be explained in detail later, electronic components are transported from the transport groove 132 of the transport channel 106 to the component receiving port 152 of the supply block 110, but the gap between the rear end face of the supply block 110 and the front end of the transport channel 106 is smaller than the external dimensions of the electronic component. Therefore, when transporting electronic components from the transport groove 132 of the transport channel 106 to the component receiving port 152 of the supply block 110, the electronic components are prevented from falling out.

[0046] Furthermore, the electronic component 160 comprises a generally block-shaped component body 162 and two terminals 164 disposed on the lower surface of the component body 162. The terminals 164 are short cylindrical in shape and extend downwards from their lower surfaces. Additionally, the width of the component receiving opening 152 is slightly larger than the width of the component body 162 of the electronic component 160, and the length of the component receiving opening 152 is slightly larger than the length of the component body 162 of the electronic component 160. Therefore, an electronic component 160 is received in the component receiving opening 152. Furthermore, a recess 168 is formed in the supply block 110, opening into the bottom surface of the component receiving opening 152. The opening of the recess 168 is smaller than the overall bottom surface of the component body 162 of the electronic component 160, but larger than the portion of the component body 162 where the two terminals 164 are fixed. Furthermore, the depth of the recess 168 is greater than the length of the terminals 164. Therefore, with the two terminals 164 of the electronic component 160 housed in the component receiving port 152 inserted into the recess 168, the lower surface of the component body 162 is supported by the bottom surface of the component receiving port 152.

[0047] In addition, such as Figure 7As shown, a transmissive cylindrical detection sensor 180 is provided in the supply block 110. This sensor 180 consists of a light-projecting part 182 and a light-receiving part 184. The light-projecting part 182 and the light-receiving part 184 are arranged facing each other, sandwiching the component receiving port 152. The light-projecting part 182 and the light-receiving part 184 are embedded in the supply block 110. Light irradiated from the light-projecting part 182 is received by the light-receiving part 184 through the component receiving port 152. Therefore, when an electronic component 160 is present in the component receiving port 152 between the light-projecting part 182 and the light-receiving part 184, the light irradiated from the light-projecting part 182 is blocked by the electronic component 160, and thus the light-receiving part 184 does not receive the light irradiated by the light-projecting part 182. On the other hand, when the electronic component 160 is not present in the component receiving port 152 between the light-projecting part 182 and the light-receiving part 184, the light-receiving part 184 receives the light irradiated from the light-projecting part 182. Therefore, the detection sensor 180 detects the presence or absence of the electronic component 160 in the element receiving port 152 based on whether the light receiving part 184 receives light.

[0048] In addition, such as Figure 8 As shown, the separation device 111 has a pusher 190 and a cylinder (see reference). Figure 9 192. The pusher 190 is generally block-shaped and is disposed above the front end of the transport channel 106. As described above, no cover member 134 is provided at the front end of the transport channel 106, therefore, the transport groove 132 is open. Furthermore, the pusher 190 is held in place by the cylinder 192 so that it can be raised and lowered. The pusher 190 is lowered by the extension of the cylinder 192 and raised by the retraction of the cylinder 192. When the pusher 190 is lowered, the lower end of the pusher 190 enters the interior of the transport groove 132. When the pusher 190 rises, it exits from the transport groove 132 and moves upwards. In addition, a conical surface 196 is formed on the rear edge of the lower end face of the pusher 190.

[0049] In addition, such as Figure 9As shown, the control device 36 includes a controller 200, multiple drive circuits 202, and an image processing device 206. The multiple drive circuits 202 are connected to the aforementioned conveying device 50, clamping device 52, working heads 60 and 62, X-direction moving device 68, Y-direction moving device 70, Z-direction moving device 72, tray-type component supply device 78, electromagnetic motors 120, 128, and 136, air pump 142, cylinder 192, and bulk component supply device 30. The controller 200 includes a CPU, ROM, RAM, etc., and is essentially a computer, and is connected to the multiple drive circuits 202. Thus, the operation of the substrate conveying and holding device 22, component assembly device 24, etc., is controlled by the controller 200. Furthermore, the controller 200 is also connected to the image processing device 206. The image processing device 206 processes the image data obtained by the imaging devices 26 and 28, and the controller 200 obtains various information from the image data. Additionally, the controller 200 is also connected to the detection sensor 180 of the bowl feeder 82. Therefore, the controller 200 acquires the detection results based on the detection sensor 180.

[0050] The component mounting device 10, using the aforementioned structure, performs component assembly operations on the circuit substrate 12 held by the substrate transport and holding device 22. Specifically, the circuit substrate 12 is transported to the working position, where it is fixedly held by the clamping device 52. Next, the imaging device 26 moves upward toward the circuit substrate 12 and images the circuit substrate 12. This provides information related to the error in the holding position of the circuit substrate 12. Furthermore, the bulk component supply device 30 or the component supply device 32 supplies components at a predetermined supply position. The component supply by the bowl feeder 82 of the component supply device 30 will be described in detail later. Then, either the working heads 60 or 62 moves upward toward the component supply position and holds the component via the suction nozzle 66. Next, the working heads 60 or 62 holding the component move upward toward the imaging device 28, where the imaging device 28 images the component held by the suction nozzle 66. This provides information related to the error in the holding position of the component. Furthermore, the working heads 60 and 62 holding the components move upwards towards the circuit substrate 12 to correct errors in the holding position of the circuit substrate 12 and the holding position of the components, and then assemble the held components onto the circuit substrate 12.

[0051] In addition, in the bowl feeder 82, the operator puts electronic components into the component feeding section 112 of the component hopper 102. The put-in electronic components are transported to the component receiving port 152 of the supply block 110 by the high-frequency vibration of the component hopper 102, the bowl 104, the transport channel 106 and the air ejection of the air ejection device 108, and the electronic components are supplied at the component receiving port 152.

[0052] In detail, the operator feeds multiple electronic components 160 into the component feeding section 112 of the component hopper 102. The electronic components 160 fed into the component feeding section 112 are then spirally propelled along the transport path 118 formed in the component feeding section 112 by the operation of the electromagnetic motor 120. Specifically, the electromagnetic motor 120 causes the component hopper 102 to torsionally vibrate at a high frequency in both the front-back and left-right directions, as described above. That is, the component hopper 102 vibrates repeatedly at a high frequency in the torsional direction. At this time, the centrifugal force generated by the repeated vibration of the component hopper 102 in the torsional direction exerts a force on the electronic components 160 fed into the component feeding section 112 towards the inner wall of the component feeding section 112. As a result, the electronic components fed into the component feeding section 112 spirally propelled along the transport path 118 on the inner wall of the component feeding section 112. The electronic components rising along the transport path 118 reach the groove 116 formed in the protrusion 114 of the component hopper 102. The electronic components fall from the opening at the front end of the groove 116 and are received in the component receiving section 122 of the bowl 104. Next, the electronic components received in the component receiving section 122 of the bowl 104 are spirally raised along the transport path 124 formed in the component receiving section 122 by the operation of the electromagnetic motor 128 of the bowl 104.

[0053] Specifically, through the operation of the electromagnetic motor 128, the bowl 104, as described above, undergoes high-frequency torsional vibration in both the front-to-back and left-to-right directions. That is, the bowl 104 repeatedly vibrates at a high frequency in the torsional direction. At this time, the centrifugal force generated by the repeated vibration of the bowl 104 in the torsional direction exerts force on the electronic component 160 housed in the component housing 122 towards the inner wall surface of the component housing 122. As a result, the electronic component 160 housed in the component housing 122 rises spirally along the transport path 124 towards the inner wall surface of the component housing 122. Furthermore, the transport path 124 formed on the inner wall surface of the component housing 122 is shaped to allow the terminals 164 of the electronic component 160 to engage. Therefore, the electronic component 160 rises spirally along the inner wall surface of the component housing 122 with its terminals 164 engaged in the transport path 124. That is, the electronic component 160 rises spirally along the transport path 124 with its terminals 164 facing the inner wall surface of the component housing 122.

[0054] Furthermore, the electronic component 160, rising along the transport path 124, reaches the upper end of the transport path 124 and enters the transport groove 132 of the transport channel 106 facing the upper end of the transport path 124. That is, the electronic component 160, rising along the transport path 124, is fed from the upper end of the transport path 124 into the transport groove 132 of the transport channel 106. At this time, the electronic component 160 is fed from the transport path 124 into the transport groove 132 of the transport channel 106 with its terminals 164 engaged with the bowl 104. Therefore, the electronic component 160 is fed into the transport groove 132 of the transport channel 106 with its terminals 164 facing downwards. That is, the electronic component 160 is fed in with the lower end of its terminals 164 contacting the bottom surface of the transport groove 132. Furthermore, the width of the tunnel-shaped transport trough 132 is slightly larger than the width of the electronic component 160, and the height of the tunnel-shaped transport trough 132 is slightly larger than the height of the electronic component 160. Therefore, the electronic component 160 enters the transport trough 132 with its width direction aligned with the width direction of the transport trough 132. That is, the electronic component 160 enters the transport trough 132 with its length direction as the extension direction of the transport trough 132 and its width direction as the width direction of the transport trough 132. In addition, with the operation of the electromagnetic motor 128 of the bowl 104, the electronic components 160 sequentially enter the transport trough 132 of the transport channel 106 from the transport path 124 of the bowl 104. Therefore, in the transport trough 132, multiple electronic components 160 are arranged in a row in the aforementioned predetermined posture. At this time, the electronic components 160 entering the transport groove 132 are pressed by the electronic components 160 newly entering the transport channel 106 from the transport path 124 of the bowl 104, so that adjacent electronic components 160 come into contact. That is, multiple electronic components 160 enter the transport groove 132 of the transport channel 106 in a connected state.

[0055] Thus, through the operation of the electromagnetic motor 136 in the transport channel 106 and the ejection of air from the air ejection device 108, multiple electronic components 160, which are connected to each other in a predetermined posture, are transported toward the front end of the transport channel 106. Specifically, through the operation of the electromagnetic motor 136, the transport channel 106 vibrates repeatedly in the front-rear direction at a high frequency, as described above. At this time, the vibration frequency of the electromagnetic motor 136 is adjusted so that the electronic components entering the transport channel 132 float slightly forward. Therefore, the transport channel 106 vibrates repeatedly in the front-rear direction at a high frequency, causing the electronic components entering the transport channel 132 to move slightly forward.

[0056] Furthermore, as described above, the transport tank 132 has seven airflow paths 146 formed at approximately seven equal intervals in the front-to-back direction. Air is ejected into the transport tank 132 via these seven airflow paths 146 by the operation of the air pump 142 of the air ejection device 108. The airflow paths 146 extend obliquely upwards and forwards from the bottom surface of the transport channel 106 and open into the bottom surface of the transport tank 132. Therefore, the air ejected into the transport tank 132 flows from rear to front within the transport tank. This causes the electronic components entering the transport tank 132 to move forward. Thus, through the operation of the electromagnetic motor 136 and the ejection of air by the air ejection device 108, as... Figure 10 As shown, multiple electronic components 160, which have entered the transport tank 132, are transported to the front end of the transport channel 106 in a connected state by contacting the lower end of the terminal 164 with the bottom surface of the transport tank 132. Furthermore, while the electronic components 160 are being transported by the transport tank 132, the pusher 190 is raised by the operation of the separation device 111 in a manner that does not obstruct the transport of the electronic components 160 by the transport tank 132. Thus, when the electronic components 160 are being transported by the transport tank 132, the cylinder 192 of the separation device 111 retracts, and the pusher 190 rises. That is, when no component is supplied to the supply position, the cylinder 192 of the separation device 111 retracts, and the pusher 190 rises.

[0057] Furthermore, multiple electronic components 160 are transported in the transport groove 132 in a connected state, so that the electronic components 160 transported up to the front end of the transport groove 132 enter the component receiving port 152 of the supply block 110. That is, the electronic components 160 transported up to the front end of the transport groove 132 are fed into the component receiving port 152 of the supply block 110 from the front end of the transport groove 132. In addition, the width dimension of the component receiving port 152 is slightly larger than the width dimension of the electronic component 160, and the length dimension of the component receiving port 152 is slightly larger than the length dimension of the electronic component 160. Therefore, one electronic component 160 enters the component receiving port 152 from the transport groove 132 of the transport channel 106 in a predetermined posture. As described above, a recess 168 is formed in the component receiving port 152, so that, Figure 8As shown, with the two terminals 164 of the electronic component 160 inserted into the recess 168 in the component receiving port 152, the lower surface of the component body 162 is supported by the bottom surface of the component receiving port 152. Thus, with the two terminals 164 of the electronic component 160 inserted into the recess 168, the lower surface of the component body 162 is supported by the bottom surface of the component receiving port 152, thereby positioning one electronic component 160 in the component receiving port 152. Furthermore, one electronic component 160 is supplied in the position of being positioned in the component receiving port 152. That is, in the bowl feeder 82, the component receiving port 152 functions as a supply position, and the electronic components 160 positioned in the component receiving port 152 are supplied one by one in a predetermined posture.

[0058] However, in the transport slot 132 of the transport channel 106, multiple electronic components 160 are transported in a connected manner, and the first electronic component (hereinafter referred to as the "first component") 160a of the multiple electronic components 160 enters the component receiving port 152 and is positioned. Therefore, as Figure 8 As shown, the electronic component (hereinafter referred to as "contact element") 160b located behind the headstock element 160a comes into contact with the headstock element 160a, and the headstock element 160a is clamped by the wall 210 of the dividing element receiving opening 152 and the contact element 160b. Thus, with the headstock element 160a clamped, it is impossible to properly hold the headstock element 160a by the suction nozzle 66. Therefore, the headstock element 160a and the contact element 160b are separated due to the operation of the separation device 111.

[0059] In detail, if the header element 160a is housed in the element receiving port 152, the operation of the electromagnetic motor 136 of the transport channel 106 and the air pump 142 of the air ejection device 108 stops. Furthermore, if an electronic component is housed in the element receiving port 152, the electronic component is detected by the detection sensor 180 as described above. Therefore, when the detection sensor 180 detects an electronic component, the controller 200 stops the operation of the electromagnetic motor 136 of the transport channel 106 and the air pump 142 of the air ejection device 108. Thus, the transport of the electronic component in the transport channel 106 stops.

[0060] Furthermore, when the controller 200 stops the operation of the electromagnetic motor 136 of the transport channel 106 and the air pump 142 of the air ejection device 108, it extends the cylinder 192 of the separation device 111. The pusher 190 of the separation device 111, as described above, is positioned above the front end of the transport channel 106 and is held vertically by the cylinder 192. As the cylinder 192 extends, the pusher 190 descends, and its lower end contacts the upper surface of the element body 162 of the contact element 160b. A conical surface 196 is formed on the rear edge of the lower end face of the pusher 190, and the outer edge of the upper surface of the element body 162 is chamfered. Therefore, as the pusher 190 descends, the conical surface 196 of the pusher 190 contacts the chamfered outer edge of the upper surface of the element body 162. Furthermore, the pusher 190 descends further, thereby applying a force obliquely rearward to the chamfered outer edge of the upper surface of the element body 162 through the conical surface 196 of the pusher 190. Therefore, as... Figure 11 As shown, the contact element 160b moves rearward, and the head element 160a separates from the contact element 160b. This releases the clamping of the head element 160a by the wall 210 of the element receiving opening 152 and the contact element 160b.

[0061] Furthermore, at the end of the extension of cylinder 192, controller 200 outputs a component holding command to working heads 60, 62 and working head moving device 64. Thus, an electronic component 160 positioned in component receiving port 152 is properly held by suction nozzle 66. In this way, in the bowl feeder 82, a recess 168 is formed in component receiving port 152, i.e., the component supply position, making the component supply position lower than the transport groove 132 of transport channel 106, thereby positioning the electronic component 160 in this recess 168. That is, the recess 168 formed in the component supply position is lower than the bottom surface of the transport groove 132 of transport channel 106, and in the component supply position, the terminal 164 of electronic component 160 is embedded in the recess 168, so that the height of electronic component 160 at this supply position is lower than the height of electronic component 160 in transport groove 132. In this way, the height of the electronic component 160 at the supply position is lower than the height of the electronic component 160 in the transport tank 132, thereby positioning the electronic component 160 at the supply position. In addition, the height of the electronic component 160 at the supply position and in the transport tank 132 is the vertical position of a predetermined portion of the electronic component 160 in the supply position and in the transport tank 132. The predetermined portion can be any part of the electronic component 160, such as the upper surface, lower surface, or upper end of the terminal of the component body 162.

[0062] However, at the supply position, i.e., at the component receiving port 152, the terminals 164 of the electronic component 160 may not be embedded in the recess 168 and are not positioned. Specifically, when multiple electronic components 160 are transported in a connected manner in the transport groove 132 of the transport channel 106, air is ejected forward inside the transport groove 132, and the electronic components are transported forward by this air ejection. At this time, as... Figure 12 As shown, the air ejected forward inside the transport channel 132 (arrow 220) encounters the wall 210 of the supply block 110 and changes direction diagonally upward towards the forward side. That is, the air ejected forward inside the transport channel 132 (arrow 220) becomes an upward airflow diagonally upward towards the forward side in the component receiving port 152 (arrow 222). Furthermore, the air ejected forward inside the transport channel 132 (arrow 220) enters the recess 168 of the supply block 110 from near the bottom surface of the transport channel 132, where it changes direction and becomes an upward airflow (arrow 224).

[0063] Therefore, when the first electronic component 160a among the multiple electronic components 160 being transported in the transport tank 132 is transported to the component receiving port 152, as... Figure 13 As shown, sometimes the front end of the extruder element 160a floats up due to updrafts (arrows 222, 224). In such cases, the front end of the extruder element 160a may hook onto the wall 210 of the supply block 110, causing the extruder element 160a to tilt at the element receiving port 152, i.e., at the element supply position. Furthermore, there is also a risk that the extruder element 160a may fly out of the element receiving port 152. Thus, if the extruder element 160a tilts in the element receiving port 152 or flies out of the element receiving port 152, the extruder element 160a cannot be supplied. Furthermore, as... Figure 13 As shown, even if the front end of the header element 160a is not hooked onto the wall 210 of the supply block 110, the terminal 164 of the header element 160a may not be embedded in the recess 168. Thus, if the terminal 164 is not embedded in the recess 168 at the component receiving port 152, the electronic component 160 is not positioned, and therefore, the electronic component 160 cannot be properly supplied.

[0064] Given this situation, such as Figure 14As shown, the supply block 110 has a first vent 230 penetrating the wall 210 in the front-rear direction and a second vent 232 on the inner wall surface facing the front side of the forward-penetrating recess 168. Thus, by forming the first vent 230, the air ejected forward inside the transport groove 132 (arrow 220) flows in the direction of passing through the first vent 230 (arrow 250), therefore, a large upward airflow is not generated. Furthermore, by forming the second vent 232, even if the air ejected forward inside the transport groove 132 (arrow 220) enters the recess 168 of the supply block 110 from near the bottom surface of the transport groove 132, it flows in the direction of passing through the second vent 232 (arrow 252), therefore, a large upward airflow is not generated. Therefore, when the leading electronic component 160a of the plurality of electronic components 160 transported in the transport groove 132 is transported to the component receiving port 152, as... Figure 15 As shown, the terminal 164 of the header element 160a is inserted into the recess 168, thereby the header element 160a is properly positioned in the element receiving opening 152.

[0065] Specifically, when the head element 160a is transported to the element receiving port 152, the air ejected forward inside the transport groove 132 (arrow 220) flows along the upper surface of the element body 162 of the head element 160a in the direction of passing through the first vent 230 (arrow 250). At this time, the air flowing along the upper surface of the element body 162 of the head element 160a acts as downward pressure, pressing the head element 160a toward the recess 168. Furthermore, when the head element 160a is transported to the element receiving port 152, the air ejected forward inside the transport groove 132 (arrow 220) enters the recess 168 from the bottom surface of the transport groove 132 and flows through the recess 168 in the direction of passing through the second vent 232 (arrow 252). At this time, the air entering the recess 168 from the bottom surface of the transport groove 132 and acting as downward pressure through the recess 168 draws the head element 160a toward the recess 168. Thus, the air ejected forward inside the transport groove 132 (arrow 220) acts as downward pressure on the head element 160a at the element receiving port 152, thereby properly embedding the terminal 164 of the head element 160a into the recess 168 and properly positioning the head element 160a in the element receiving port 152.

[0066] Additionally, the bowl feeder 82 is an example of a component supply device. The transport trough 132 is an example of a transport path. The bottom surface of the transport trough 132 is an example of a transport surface. The electronic component 160 is an example of a component. The terminal 164 is an example of a terminal.

[0067] Furthermore, the present invention is not limited to the above embodiments and can be implemented in various ways with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiments, a bowl feeder 82 is used as the device for supplying elements, but various devices can be used as long as it is a device for supplying elements that are connected to each other by using air force to feed elements toward the supply position. Specifically, for example, a bulk feeder that feeds scattered elements into a connected state and a rod feeder that feeds neatly arranged elements into a connected state can be used.

[0068] Furthermore, in the above embodiments, the bowl feeder 82 can be detachably positioned and assembled using the multiple slots provided on the feeder holding platform 86. However, as long as it can be positioned, the bowl feeder and other component supply devices can also be installed on the component mounting device 10 using support legs, fixing devices, locking mechanisms, etc. In this way, by using support legs, fixing devices, locking mechanisms, etc., even large component supply devices can be properly installed on the component mounting device in an appropriately positioned state.

[0069] Furthermore, in the above embodiment, multiple electronic components are transported in a connected state along the tunnel-shaped transport groove 132 in the transport channel 106. However, multiple electronic components can also be transported in a connected state along transport paths of various shapes. For example, transport paths guided by guides such as groove-shaped transport paths, walls, or guide rails can be used. In addition, the transport groove 132 is a transport path extending in a straight shape, but a curved transport path can also be used. Furthermore, the transport channel 106 with the transport groove 132 is configured to extend in a horizontal direction, but it can also be configured in an inclined state.

[0070] Furthermore, in the above embodiment, the electronic component is moved toward the supply position using air force and the vibration of the transport channel 106. However, if air force is used, features other than the vibration of the transport channel 106 can also be used to move the electronic component toward the supply position. Features other than the vibration of the transport channel 106 can be, for example, magnetic force, gravity (the component's own weight), etc. Alternatively, the electronic component can be moved toward the supply position using only air force. Furthermore, in the above embodiment, the electronic component is moved toward the supply position using the force of air ejection. However, the electronic component can also be moved toward the supply position using the attractive force of air.

[0071] Furthermore, in the above embodiment, the terminal 164 of the electronic component 160 is positioned by embedding into the recess 168, but it can also be positioned by embedding a portion of the component body 162, such as the front end of the component body 162, into the recess. Additionally, the entire electronic component 160 can also be positioned by embedding into the recess. Furthermore, it is not limited to recesses; terminals, etc., can also be embedded between multiple protrusions.

[0072] Furthermore, in the above embodiment, a short cylindrical terminal 164 is used, but terminals of various shapes such as pin-shaped, ball-shaped, and lead-shaped can be used. Moreover, this application is applied to a component supply apparatus for supplying electronic components having terminals, but it can also be applied to a component supply apparatus for supplying electronic components without terminals. Furthermore, it is not limited to electronic components; this application can also be applied to component supply apparatuses for supplying various components.

[0073] Furthermore, in the above embodiment, the electronic component 160 is positioned at a supply position lower than the transport path, but the electronic component 160 may also be positioned at a supply position at the same height as the transport path. Additionally, the component may be positioned by embedding itself entirely or partially into a recess, or by holding or even grasping the component during positioning.

[0074] Furthermore, in the above embodiments, electronic components are supplied from the bowl feeder 82 to the working heads 60, 62 of the component mounting device, but components may also be supplied to various robots, such as multi-joint robots used for assembling or arranging components, regardless of the electronic components.

[0075] Explanation of reference numerals in the attached figures

[0076] 82: Bowl feeder (component supply device) 132: Transport chute (transport path) 160: Electronic component (component) 164: Terminal

Claims

1. A component supply device that supplies components, which are connected to each other, along a horizontally extending transport path toward a supply position by means of air force, wherein... The supply location is lower than the transport path. A wall in the feed direction of the element and a recess with an opening on the bottom surface are formed at the supply position. A first vent is formed in the wall to allow air for feeding the element along the transport path to flow along the upper surface of the element being transported to the supply position. A second vent is formed inside the recess to allow air used to feed the element along the transport path to flow in a direction that draws the element being transported to the supply position downwards.

2. The component supply device according to claim 1, wherein, The element is supplied by positioning it at the supply location.

3. The component supply device according to claim 1 or 2, wherein, The height of the component at the supply location is lower than the height of the component in the transport path.

4. A method for supplying a component, wherein a component having terminals is fed towards a supply position using air force, wherein... The following steps are performed to supply components, each equipped with the terminals positioned in the positioning step, one by one: The transport process involves bringing the terminals into contact with the transport surface of the transport path, thereby transporting the components equipped with the terminals toward the supply position while they are connected to each other. The positioning process involves positioning the terminals of the component equipped with the terminals, which were transported in the transport process, at the supply position. A wall is formed at the supply position in the feed direction of the element, and a recess with an opening on the bottom surface is formed therein. A first vent is formed in the wall, and a second vent is formed inside the recess. In the positioning process, the first vent is used to allow air fed to the element along the transport path to flow along the upper surface of the element being transported to the supply position, and the second vent is used to allow air fed to the element along the transport path to flow in a direction that draws the element being transported to the supply position downwards.

Images