A device shaping and processing apparatus and method

Abstract

This invention discloses a device shaping and processing apparatus, belonging to the technical field of electronic component processing. It includes: a base, a frame, a reciprocating pushing mechanism, a transport fixture, and an actuating mechanism. The frame is mounted on the base; the reciprocating pushing mechanism is disposed between the frame and the base; the transport fixture is mounted on the reciprocating pushing mechanism; and the actuating mechanism is disposed within the frame. The reciprocating pushing mechanism drives the transport fixture to move closer to or away from the actuating mechanism. When the reciprocating pushing mechanism moves closer to or away from the actuating mechanism, the actuating mechanism can perform shaping processing on the material placed on the transport fixture, thereby utilizing the same actuator to achieve multiple processing steps such as device cutting and shaping. Therefore, this device shaping and processing apparatus solves the technical problem of how to improve the efficiency of electronic component shaping and processing.

Description

Technical Field

[0001] This invention relates to the technical field of electronic component processing equipment, and in particular to a component shaping processing apparatus and a component shaping processing method using the apparatus. Background Technology

[0002] In the production process of electronic product circuit boards, many electronic components have specific height requirements relative to the circuit board. This necessitates that the factory reshape the pins of the electronic components before circuit board assembly to ensure that the actual height of the electronic components when inserted into the circuit board meets the design requirements.

[0003] Currently, this shaping process is done manually by workers. Manual operation introduces several problems, such as: 1. Inaccurate determination of electronic component pin lengths leads to inconsistent circuit board component heights, hindering subsequent assembly and inspection and reducing the overall circuit board yield. 2. Inconsistent pin spacing during manual shaping results in mismatches between the actual pins and the hole spacing on the circuit board, making subsequent component insertion difficult. 3. Both of these problems lead to low assembly efficiency, making it unsuitable for mass production of circuit boards. Therefore, developing a suitable shaping device to ensure consistent pin spacing and shaping height after shaping is a pressing issue in current circuit board manufacturing practices.

[0004] Based on this, Chinese Patent CN109304411B discloses a shaping fixture for electronic components, which includes a shaping fixture body. Two bases are provided below the shaping fixture body, and a common substrate is welded to the top of the two bases. The bottom of the shaping fixture body is welded to the top of the substrate. A sliding groove is formed at the bottom of the base, and a sliding plate is slidably installed within the groove. Connecting holes are formed on the inner walls of the two sliding grooves on their adjacent sides. A common connecting plate is welded to the top of the two sliding plates on their adjacent sides. A common base plate is welded to the bottom of the two bases, and a mounting groove is formed at the top of the base plate. A telescopic motor is installed within the mounting groove, and the output shaft of the telescopic motor is welded to the bottom of the connecting plate. Two vertical plates are welded to the top of the connecting plate. This electronic component shaping fixture has the advantages of simple structure and ease of use.

[0005] However, to further improve the shaping efficiency of devices, the shaping fixtures disclosed in the existing technology can be improved. Specifically, in the production practice of electronic components, in addition to shaping the device leads, it is also necessary to trim the device leads. Currently, trimming and shaping are often separated into two different processes, which has a certain impact on the processing and production rhythm of devices. Summary of the Invention

[0006] Therefore, it is necessary to provide a device shaping and processing apparatus to address the technical problem of how to improve the efficiency of electronic device shaping and processing.

[0007] A device shaping and processing apparatus includes: a base, a frame, a reciprocating pushing mechanism, a transport fixture, and an actuating mechanism; the frame is disposed on the base; the reciprocating pushing mechanism is disposed between the frame and the base; the transport fixture is disposed on the reciprocating pushing mechanism; and the actuating mechanism is disposed within the frame; the reciprocating pushing mechanism drives the transport fixture to move closer to or away from the actuating mechanism. The transport fixture has a transport platform, a limiting and shaping part, and a lower part of a cutting structure; the limiting and shaping part is disposed at one end of the transport platform, and the lower part of the cutting structure is disposed at the other end of the transport platform. The limiting and shaping part has a plurality of limiting placement cavities and a lower part of the shaping structure; the plurality of limiting placement cavities are evenly disposed within the limiting and shaping part; the lower part of the shaping structure is disposed on the side of the limiting and shaping part. The actuation mechanism includes a vertical drive mechanism, an adjustment connection part, an upper shaping structure, and an upper cutting structure; the vertical drive mechanism is connected to the frame and is drivenly connected to the adjustment connection part; the upper shaping structure is located below the adjustment connection part; and the upper cutting structure is located on the side of the upper shaping structure.

[0008] Furthermore, the reciprocating drive mechanism includes a reciprocating drive cylinder, a reciprocating telescopic rod, a reciprocating moving block, and a reciprocating moving guide rail.

[0009] Furthermore, the reciprocating drive cylinder is fixedly connected to the end of the base, and the reciprocating drive cylinder is drivenly connected to the reciprocating telescopic rod.

[0010] Furthermore, the reciprocating moving block is connected to the reciprocating telescopic rod, the reciprocating moving block is connected to the bottom of the transport platform, and the reciprocating moving block is movably connected to the reciprocating moving guide rail.

[0011] Furthermore, the reciprocating guide rail is fixedly connected to the base.

[0012] Furthermore, the adjusting connection includes an L-shaped connecting block, a buffer connecting block, and a spring.

[0013] Furthermore, the L-shaped connecting block is connected to the vertical drive mechanism.

[0014] Furthermore, several springs are connected between the two buffer connecting blocks, and one of the buffer connecting blocks is connected to the bottom of the L-shaped connecting block.

[0015] Furthermore, a stop portion is provided on the base, and the stop portion is disposed adjacent to the transport fixture.

[0016] Furthermore, a method using the aforementioned device shaping and processing apparatus is characterized by comprising the following steps:

[0017] S1: The material to be processed is placed on the transport fixture in advance, and the reciprocating push mechanism moves the material to be processed to the first processing position;

[0018] S2: The action mechanism cuts the material at the first processing position to obtain a semi-finished material; then, the reciprocating push mechanism drives the transport fixture to transfer the semi-finished material to the second processing position.

[0019] S3: The motion mechanism then moves the material to the second processing position to perform shaping processing to obtain the finished material;

[0020] S4: The reciprocating drive mechanism re-drives the transport fixture to reset the finished product material.

[0021] In summary, the device shaping and processing apparatus of the present invention comprises a base, a frame, a reciprocating pushing mechanism, a transport fixture, and an actuating mechanism. The frame is mounted on the base; the reciprocating pushing mechanism is positioned between the frame and the base; the transport fixture is mounted on the reciprocating pushing mechanism; and the actuating mechanism is located within the frame. The reciprocating pushing mechanism drives the transport fixture to move closer to or away from the actuating mechanism. When the reciprocating pushing mechanism moves closer to or away from the actuating mechanism, the actuating mechanism can perform shaping and processing on the material placed on the transport fixture, thereby achieving multiple processing steps such as cutting and shaping of the device using the same actuator. Therefore, the device shaping and processing apparatus of the present invention solves the technical problem of how to improve the efficiency of electronic device shaping and processing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a device shaping and processing apparatus according to the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of a device shaping and processing apparatus according to the present invention from another direction;

[0024] Figure 3 This is a schematic diagram of another aspect of the structure of the device shaping and processing apparatus of the present invention. Detailed Implementation

[0025] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0031] Please refer to the following: Figures 1 to 3 The present invention discloses a device shaping and processing apparatus comprising: a base 1, a frame 2, a reciprocating pushing mechanism 3, a transport fixture 4, and an actuating mechanism 5; the frame 2 is disposed on the base 1; the reciprocating pushing mechanism 3 is disposed between the frame 2 and the base 1; the transport fixture 4 is disposed on the reciprocating pushing mechanism 3; and the actuating mechanism 5 is disposed within the frame 2; the reciprocating pushing mechanism 3 drives the transport fixture 4 to move closer to or away from the actuating mechanism 5. The transport fixture 4 has a transport platform 401, a limiting and shaping part 402, and a lower part of a cutting structure 403; the limiting and shaping part 402 is disposed at one end of the transport platform 401, and the lower part of the cutting structure 403 is disposed at the other end of the transport platform 401. The limiting and shaping part 402 has a plurality of limiting placement cavities 402a and a lower shaping structure 402b; the plurality of limiting placement cavities 402a are evenly arranged in the limiting and shaping part 402; the lower shaping structure 402b is disposed on the side of the limiting and shaping part 402. The actuating mechanism 5 has a vertical drive mechanism 501, an adjustment connecting part 502, an upper shaping structure 503 and an upper cutting structure 504; the vertical drive mechanism 501 is connected to the frame 2, and the vertical drive mechanism 501 is drivenly connected to the adjustment connecting part 502; the upper shaping structure 503 is disposed below the adjustment connecting part 502; the upper cutting structure 504 is disposed on the side of the upper shaping structure 503.

[0032] Specifically, when the device shaping and processing apparatus of the present invention is in operation, the electronic device to be shaped and processed is pre-placed in the limiting placement cavity 402a; then, the reciprocating pushing mechanism 3 pushes the transport fixture 4 forward until the lower part 403 of the cutting structure is aligned with the upper part 504 of the cutting structure. At this time, the vertical driving mechanism 501 drives the adjusting connecting part 502 to drive the upper part 504 of the cutting structure downward until the upper part 504 of the cutting structure and the lower part 402b of the cutting structure cooperate to cut off the excessively long pins of the electronic device pre-placed in the limiting placement cavity 402a. Then, the vertical driving mechanism 501 drives the upper part 504 of the cutting structure upward; then, the reciprocating pushing mechanism 3 drives the transport fixture 4 backward to a position below where the lower part 402b of the shaping structure is aligned with the upper part 503 of the shaping structure. Then, the vertical drive mechanism 501 drives the adjustment connection part 502 again to drive the upper part 503 of the shaping structure downward; until the upper part 503 of the shaping structure cooperates with the lower part 402b of the shaping structure to shape the device after the lead-cutting operation, so that the lead shape of the device meets the design requirements. In the cutting and shaping process, the limiting placement cavity 402a can effectively limit the device to ensure that the device remains stable during the cutting or shaping process. After the cutting and shaping are completed, the reciprocating push mechanism 3 continues to drive the transport fixture 4 to reset, and at the same time, the vertical drive mechanism 501 also drives the upper part 503 of the shaping structure and the upper part 504 of the cutting structure to reset. Thus, the device shaping processing device of the present invention completes a single shaping processing flow. It can be seen that the present invention can combine cutting, shaping and turnover of materials, thereby effectively improving the efficiency of device shaping processing.

[0033] Furthermore, the reciprocating pushing mechanism 3 includes a reciprocating drive cylinder 301, a reciprocating telescopic rod 302, a reciprocating moving block 303, and a reciprocating moving guide rail 304. The reciprocating drive cylinder 301 is fixedly connected to the end of the base 1, and the reciprocating drive cylinder 301 is drivenly connected to the reciprocating telescopic rod 302. The reciprocating moving block 303 is connected to the reciprocating telescopic rod 302, connected to the bottom of the transport platform 401, and movably connected to the reciprocating moving guide rail 304. The reciprocating moving guide rail 304 is fixedly connected to the base 1. Specifically, the reciprocating drive cylinder 301 controls the extension or shortening of the reciprocating telescopic rod 302, thereby controlling the reciprocating moving block 303 to reciprocate along the reciprocating moving guide rail 304, thus enabling the transport platform 401 to perform material turnover operations according to a preset trajectory.

[0034] Furthermore, the vertical drive mechanism 501 includes a vertical drive cylinder 501a, a vertical telescopic rod 501b, a vertical moving block 501c, and a vertical moving guide rail 501d. The vertical drive cylinder 501a is connected to the frame 2, and the vertical drive cylinder 501a is drivenly connected to the vertical telescopic rod 501b. The vertical moving block 501c is connected to the vertical telescopic rod 501b, and the vertical moving block 501c is connected to the adjusting connection part 502. The vertical moving block 501c is movably connected to the vertical moving guide rail 501d. The vertical moving guide rail 501d is fixedly connected to the frame 2. Specifically, the vertical drive cylinder 501a can drive the vertical telescopic rod 501b to extend and retract, thereby controlling the vertical moving block 501c to drive the adjusting connection part 502 to reciprocate along the vertical moving guide rail 501d.

[0035] Furthermore, the adjusting connection 502 includes an L-shaped connecting block 502a, a buffer connecting block 502b, and springs 502c; the L-shaped connecting block 502a is connected to the vertical drive mechanism 501; a plurality of springs 502c are connected between the two buffer connecting blocks 502b; the upper buffer connecting block 502b is connected to the bottom of the L-shaped connecting block 502a. Specifically, the L-shaped connecting block 502a can connect the vertical drive mechanism 501 and the adjusting connection 502 respectively, and the adjusting connection 502 is provided with a structure for mitigating impact, namely a structure composed of the two buffer connecting blocks 502b and a plurality of springs 502c. The upper part of this structure is connected to the L-shaped connecting block 502a, and the lower part is connected to the upper part 503 of the shaping structure. Therefore, when the upper part 503 of the shaping structure and the lower part 402b of the shaping structure come into contact with each other to perform the shaping process, this impact-reducing structure can buffer and adjust the force output during shaping.

[0036] Furthermore, a stop part 101 is provided on the base 1; the stop part 101 is disposed adjacent to the transport fixture 4. Specifically, the stop part 101 can issue a prompt when the transport platform 401 moves to the initial position, thereby reminding the user to remove the device that has completed the shaping process.

[0037] Furthermore, a method for using the device shaping and processing apparatus of the present invention includes the following steps:

[0038] S1: The material to be processed is placed on the transport fixture 4 in advance, and the reciprocating push mechanism 3 transfers the material to be processed to the first processing position;

[0039] S2: The action mechanism 5 cuts the material that has been moved to the first processing position to obtain a semi-finished material; then, the reciprocating push mechanism 3 drives the transport fixture 4 to transfer the semi-finished material to the second processing position.

[0040] S3: The motion mechanism 5 then moves the material to the second processing position to perform shaping processing to obtain the finished material;

[0041] S4: The reciprocating drive mechanism 3 drives the transport fixture 4 to reset the finished product material.

[0042] Specifically, by continuing to repeat the steps of the above processing method, the process flow for batch shaping of devices can be achieved.

[0043] In summary, the device shaping and processing apparatus of the present invention comprises a base 1, a frame 2, a reciprocating pushing mechanism 3, a transport fixture 4, and an actuating mechanism 5. The frame 2 is mounted on the base 1. The reciprocating pushing mechanism 3 is positioned between the frame 2 and the base 1. The transport fixture 4 is mounted on the reciprocating pushing mechanism 3, and the actuating mechanism 5 is located within the frame 2. The reciprocating pushing mechanism 3 drives the transport fixture 4 to move closer to or away from the actuating mechanism 5. When the reciprocating pushing mechanism 3 moves closer to or away from the actuating mechanism 5, the actuating mechanism 5 can perform shaping and processing on the material placed on the transport fixture 4, thereby achieving multiple processing steps such as cutting and shaping of the device using the same actuator. Therefore, the device shaping and processing apparatus of the present invention solves the technical problem of how to improve the efficiency of electronic device shaping and processing.

[0044] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method of applying a device shaping apparatus, characterized by, The device shaping and processing device includes: a base, a frame, a reciprocating push mechanism, a transport fixture, and an actuation mechanism; The frame is mounted on the base; The reciprocating push mechanism is provided between the frame and the base, the transport fixture is provided on the reciprocating push mechanism, and the actuation mechanism is provided in the frame; The reciprocating push mechanism drives the transport fixture to move closer to or away from the action mechanism; The transport fixture has a transport platform, a limiting and shaping part, and a lower part of the cutting structure; The limiting and shaping part is provided at one end of the transport platform, and the lower part of the cutter structure is provided at the other end of the transport platform; The limiting and shaping part has several limiting placement cavities and a lower shaping structure; the several limiting placement cavities are all disposed in the limiting and shaping part; the lower shaping structure is disposed on the side of the limiting and shaping part; The actuation mechanism includes a vertical drive mechanism, an adjustment connection part, an upper shaping structure, and an upper cutting structure; The vertical drive mechanism is connected to the frame, and the vertical drive mechanism is drivenly connected to the adjustment connection part; The upper part of the shaping structure is located below the adjusting connection part; The upper part of the cutting structure is disposed on the side of the upper part of the shaping structure; The adjusting connection part has an L-shaped connecting block, two buffer connecting blocks, and a spring; the L-shaped connecting block is connected to the vertical drive mechanism; several springs are connected between the two buffer connecting blocks; the upper buffer connecting block is connected to the bottom of the L-shaped connecting block; the upper part of the shaping structure is located below the lower buffer connecting block. The method of the application device shaping and processing apparatus includes the following steps: S1: The electronic device to be processed is placed in the limiting placement cavity of the transport fixture in advance, and the transport fixture is moved to the first processing position by the reciprocating push mechanism so that the lower part of the cutter structure is aligned with the upper part of the cutter structure. S2: The vertical drive mechanism drives the adjustment connection part to move the upper part of the cutter structure downward, and cooperates with the lower part of the cutter structure to cut off the excessively long pins of electronic devices; S3: The reciprocating push mechanism drives the transport fixture to retreat to the second processing position, so that the lower part of the shaping structure is aligned with the lower part of the upper part of the shaping structure; S4: The vertical drive mechanism drives the adjustment connection part to move the upper part of the shaping structure downward. Through the buffering effect of the spring between the two buffer connection blocks, it cooperates with the lower part of the shaping structure to complete the pin shaping of the cut electronic device. S5: The reciprocating drive mechanism drives the transport fixture to reset.

2. The method of claim 1, wherein: The reciprocating push mechanism includes a reciprocating drive cylinder, a reciprocating telescopic rod, a reciprocating moving block, and a reciprocating moving guide rail; the reciprocating drive cylinder is fixedly connected to the end of the base, and the reciprocating drive cylinder is drivenly connected to the reciprocating telescopic rod; the reciprocating moving block is connected to the reciprocating telescopic rod, the reciprocating moving block is connected to the bottom of the transport platform, and the reciprocating moving block is movably connected to the reciprocating moving guide rail; the reciprocating moving guide rail is fixedly connected to the base.

3. The method of claim 1, wherein: A stop portion is provided on the base, and the stop portion is arranged adjacent to the transport fixture.

4. The method of claim 1, wherein: The vertical drive mechanism includes a vertical drive cylinder, a vertical telescopic rod, a vertical moving block, and a vertical moving guide rail; the vertical drive cylinder is connected to the frame and is driven by the vertical telescopic rod; the vertical moving block is connected to the vertical telescopic rod and is connected to the adjustment connection part; the vertical moving block is movably connected to the vertical moving guide rail; the vertical moving guide rail is fixedly connected to the frame.

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