A test device and a test method

Abstract

The application provides a test device and a test method. The test device comprises a first probe, a second probe, a test circuit and a light-emitting unit. The first probe is used for contacting a first pad in a to-be-tested array layer, and the first pad is electrically connected with a data line in the to-be-tested array layer. The second probe is used for contacting a second pad in the to-be-tested array layer, and the second pad is electrically connected with a scanning circuit in the to-be-tested array layer. The test circuit is electrically connected with the first probe and the second probe, and the test circuit inputs a scanning signal to the to-be-tested array layer through the second probe. The light-emitting unit is electrically connected with the first probe and the test circuit, and the light-emitting unit comprises a first light-emitting device and a second light-emitting device in parallel, wherein the conduction directions of the first light-emitting device and the second light-emitting device are different. Through the parallel connection and the different conduction directions of the first light-emitting device and the second light-emitting device, the accuracy of current testing can be improved.

Description

Technical Field

[0001] This invention belongs to the field of display technology, specifically relating to a testing device and a testing method. Background Technology

[0002] Currently, in the testing process of the array layer, current-type electrical testing can be used for some array layers. Specifically, current-type electrical testing technology can be used to test local pixel circuits or all pixel circuits in the array layer.

[0003] However, the accuracy of current testing is currently limited. At different testing stages, the current in the array layer is sometimes in the nA range and sometimes only in the pA range. Many types of leakage defects in thin film transistors (TFTs) cannot be detected by current current testing equipment, resulting in defects being detected during testing. The specific cause of the detected defects cannot be determined, the false detection rate is high, and the reliability of the detected defects is low, which cannot truly reflect the actual defect situation in the array factory production line.

[0004] Therefore, there is an urgent need to use testing devices with high detection accuracy to improve the accuracy of detection. Summary of the Invention

[0005] This invention provides a testing device and a testing method that can improve the accuracy of current testing.

[0006] To solve the above-mentioned technical problems, the present invention provides a testing device comprising a first probe, a second probe, a testing circuit, and a light-emitting unit. The first probe contacts a first pad in the array layer under test (DUT), and the first pad is electrically connected to a data line in the DUT. The second probe contacts a second pad in the DUT, and the second pad is electrically connected to a scanning circuit in the DUT. The testing circuit is electrically connected to the first probe and the second probe, and inputs a scanning signal to the DUT through the second probe. The light-emitting unit is electrically connected to the first probe and the testing circuit, and the light-emitting unit comprises a first light-emitting device and a second light-emitting device connected in parallel, wherein the first light-emitting device and the second light-emitting device have different conduction directions.

[0007] In one embodiment, the testing apparatus further includes a camera and a processor, wherein the camera is used to capture images of the light-emitting unit to obtain a target image; the processor is electrically connected to the camera and is used to analyze the target image to determine the light emission status of the target pixel, wherein the data line electrically connected to the first pad and the scanning circuit electrically connected to the second pad are simultaneously electrically connected.

[0008] In one embodiment, there are multiple first probes, multiple second probes, and multiple light-emitting units. The multiple first probes correspond one-to-one with the multiple light-emitting units. The light-emitting units are electrically connected to the corresponding first probes and the test circuit. The multiple first probes are used to contact different first pads in the same array layer under test, and the multiple second probes are used to contact different second pads in the same array layer under test.

[0009] In one embodiment, there are multiple first probes, multiple second probes, and multiple light-emitting units. Each of the multiple first probes corresponds to one of the multiple light-emitting units, and the light-emitting units are electrically connected to the corresponding first probes and the test circuit. The multiple first probes form multiple first probe groups, the multiple second probes form multiple second probe groups, and the multiple light-emitting units form multiple light-emitting groups. The first probes in the same first probe group, the second probes in the same second probe group, and the light-emitting units in the same light-emitting group are all electrically connected to the same array layer under test. The first probes in different first probe groups, the second probes in different second probe groups, and the light-emitting units in different light-emitting groups are all electrically connected to different array layers under test. The multiple first probe groups, the multiple second probe groups, and the multiple light-emitting units are all corresponding to one of the multiple first probe groups, the multiple second probe groups, and the multiple light-emitting units, and the corresponding first probe groups, the multiple second probe groups, and the multiple light-emitting units are all electrically connected to the same array layer under test.

[0010] In one embodiment, the testing apparatus further includes a first carrier substrate and a pin card, wherein the testing circuit is formed on the first carrier substrate; the pin card is disposed on the first carrier substrate, and there are multiple pin cards, multiple first probe groups, and multiple second probe groups corresponding one-to-one, with the first probe in the first probe group and the second probe in the second probe group all mounted on the corresponding pin card.

[0011] In one embodiment, the light-emitting units in the light-emitting group corresponding to the first probe group are all integrated on the pin card corresponding to the first probe group.

[0012] In one embodiment, the testing apparatus further includes a second carrier substrate, on which all light-emitting units in the light-emitting groups are formed.

[0013] In one embodiment, the first light-emitting device comprises a first electrode layer, a first light-emitting material layer, and a second electrode layer stacked sequentially; the second light-emitting device comprises a third electrode layer, a second light-emitting material layer, and a fourth electrode layer stacked sequentially; wherein the first electrode layer and the third electrode layer are electrically connected and also electrically connected to the first probe, and the second electrode layer and the fourth electrode layer are insulated and electrically connected to the test circuit respectively.

[0014] Another technical solution adopted by the present invention is to provide a testing method, which is applied to the testing device in any one of the above embodiments. The testing method includes: contacting a first probe with a first pad in the array layer under test; contacting a second probe with a second pad in the array layer under test; determining the light emission status of a target pixel based on the light emission status of the light-emitting unit, wherein the data line electrically connected to the first pad and the scanning circuit electrically connected to the second pad are simultaneously electrically connected.

[0015] In one embodiment, the step of determining the luminous status of a target pixel based on the luminous status of the luminous unit includes: taking a picture of the luminous unit with a camera to obtain a target image; and analyzing the target image to determine the luminous status of the target pixel.

[0016] The beneficial effects of this invention are as follows: This invention sets a first probe to contact a first pad in the array layer under test, and a second probe to contact a second pad in the array layer under test, thereby allowing selection of the pixel being tested. Simultaneously, the testing device includes a light-emitting unit, enabling the testing device to detect minute currents flowing through the pixel, thereby improving testing accuracy. Furthermore, the light-emitting unit includes a first light-emitting device and a second light-emitting device connected in parallel, with the first and second light-emitting devices having different conduction directions. This ensures that when current flows from the testing circuit to the array layer under test, one of the first and second light-emitting devices emits light; when current flows from the array layer under test to the testing circuit, the other light-emitting device emits light. This allows for accurate determination of the current flow direction in the array layer under test, improving detection accuracy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0018] Figure 1 This is a schematic diagram of the structure of one embodiment of the testing device in operation according to the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of one embodiment of the first probe operation in this invention;

[0020] Figure 3 This is a schematic diagram of an embodiment of the arrangement of light-emitting units in this invention;

[0021] Figure 4 This is a schematic diagram of another embodiment of the arrangement of light-emitting units in this invention;

[0022] Figure 5 This is a schematic diagram of the structure of an embodiment of the light-emitting unit in this invention;

[0023] Figure 6 This is a circuit diagram of one embodiment of the pixel circuit to be tested;

[0024] Figure 7 This is a circuit diagram of one embodiment of the current flow in the pixel circuit under test;

[0025] Figure 8 This is a circuit diagram of another embodiment of the current flow in the pixel circuit under test;

[0026] Figure 9 This is a flowchart illustrating an embodiment of the testing method in this invention;

[0027] Figure 10 yes Figure 9 A flowchart of an embodiment corresponding to step S3;

[0028] Explanation of reference numerals in the attached figures: 1. Test circuit; 11. First probe; 13. Light-emitting unit; 14. First light-emitting device; 15. Second light-emitting device; 16. Camera; 17. First carrier substrate; 18. Pin card; 19. Second carrier substrate; 2. Array layer; 21. First pad; 22. Second pad; 23. Data line; 24. Scan line; 31. First electrode layer; 32. First light-emitting material layer; 33. Second electrode layer; 34. Third electrode layer; 35. Second light-emitting material layer; 36. Fourth electrode layer. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1 and Figure 2The present invention provides a testing device comprising a first probe 11, a second probe, a testing circuit 1, and a light-emitting unit 13. The first probe 11 contacts a first pad 21 in the array layer under test (DUT), and the first pad 21 is electrically connected to a data line 23 in the DUT. The second probe contacts a second pad 22 in the DUT, and the second pad 22 is electrically connected to a scanning circuit in the DUT. The testing circuit 1 is electrically connected to the first probe 11 and the second probe, and inputs a scanning signal to the DUT through the second probe. The light-emitting unit 13 is electrically connected to the first probe 11 and the testing circuit 1. The light-emitting unit 13 includes a first light-emitting device 14 and a second light-emitting device 15 connected in parallel, wherein the first light-emitting device 14 and the second light-emitting device 15 have different conduction directions.

[0031] Specifically, the first probe 11 is made of a conductive material, and the first pad 21 in the array layer under test 2 is also made of a conductive material. When the first probe 11 and the first pad 21 come into contact, signal conduction between them can be achieved. Simultaneously, the first pad 21 is electrically connected to the data line 23 in the array layer under test 2. That is, the testing device can obtain the electrical signal transmitted by the data line 23 in the array layer under test 2 by contacting the first probe 11 with the first pad 21.

[0032] Similarly, the second probe is made of a conductive material, and the second pad 22 in the array layer 2 under test is also made of a conductive material. When the second probe and the second pad 22 come into contact, signal conduction between them can be achieved. Simultaneously, the second pad 22 is electrically connected to the scanning circuit in the array layer 2 under test; that is, the testing device can obtain the electrical signal transmitted by the scanning circuit in the array layer 2 under test by contacting the second pad 22 with the second probe. Specifically, the scanning circuit includes multiple scan lines 24.

[0033] Meanwhile, since the test circuit 1 contacts the second pad 22 through the second probe, the test circuit 1 can obtain the scanning signal generated by the scanning circuit through the second probe. During the test, the pixel circuit units in the array layer 2 under test can be scanned sequentially, thereby selecting the pixel to be tested. Thus, the test device can test the light emission of the selected pixel.

[0034] Meanwhile, in the light-emitting unit 13, the first light-emitting device 14 and the second light-emitting device 15 have different conduction directions. Assuming that when current flows from the test circuit 1 to the light-emitting unit 13, the first light-emitting device 14 conducts and emits light, then when current flows from the light-emitting unit 13 to the test circuit 1, the second light-emitting device 15 conducts and emits light. Therefore, the direction of current flow in the array layer 2 under test can be determined from the emission status of the first light-emitting device 14 and the second light-emitting device 15. Furthermore, it can be understood that when neither the first light-emitting device 14 nor the second light-emitting device 15 emits light, it can be determined that no current flows through the selected pixel being tested.

[0035] As can be seen from the above, the present invention sets the first probe 11 to contact the first pad 21 in the array layer 2 under test, and the second probe to contact the second pad 22 in the array layer 2 under test, thereby selecting the pixel to be tested. Simultaneously, the testing device includes a light-emitting unit 13, enabling the testing device to detect the minute current flowing through the pixel, thereby improving the accuracy of the test. Furthermore, the light-emitting unit 13 includes a first light-emitting device 14 and a second light-emitting device 15 connected in parallel, with the first light-emitting device 14 and the second light-emitting device 15 having different conduction directions. This ensures that when current flows from the test circuit 1 to the array layer 2 under test, one of the first light-emitting device 14 and the second light-emitting device 15 emits light, and when current flows from the array layer 2 under test to the test circuit 1, the other of the first light-emitting device 14 and the second light-emitting device 15 emits light, thereby accurately determining the current flow direction in the array layer 2 under test and improving the detection accuracy.

[0036] The same array layer 2 under test includes multiple pixel circuit units arranged in a matrix. Pixel circuit units in the same column are connected to the same data line 23. All pixel circuit units in the array layer 2 under test are connected to the same number of scanning circuits. Multiple first probes 11 are used to contact different first pads 21 in the same array layer 2 under test. The first pads 21 are connected to data signals from the same column of pixel circuit units. Multiple second probes are used to contact different second pads 22 in the same array layer 2 under test. The second pads 22 are electrically connected to the scanning circuits.

[0037] In this system, different first probes 11 are connected to all first pads 21 in the same array layer 2, and second probes are connected to all second pads 22 in the same array layer 2. When the test device transmits a scanning signal to the array layer 2 under test through the second pads 22, the scanning circuit scans the pixel circuit units in the array layer 2 under test row by row. At the same time, the first probes 11 are connected to the first pads 21 that are electrically connected to the data signals in the same column of pixel circuit units. In actual operation, the scanning circuit scans the pixel circuit units in the array layer 2 under test row by row, and scans each row. When the scanning circuit scans the pixel circuit units in the first row and first column, the first probes 11 are connected to the data lines 23 through the first pads 21 corresponding to the first column, so that the first probes 11 collect the information of the data lines 23 in the corresponding pixel circuit units and transmit the information to the test circuit 1, so that the corresponding light-emitting units 13 can be lit.

[0038] Please continue reading. Figure 1 The testing device further includes a camera 16 and a processor (not shown). The camera 16 is used to capture images of the light-emitting unit 13 to obtain a target image. The processor is electrically connected to the camera 16 and is used to analyze the target image to determine the brightness of the light emitted by the light-emitting unit 13. Based on the brightness information, the light emission status of the target pixel is determined. The data line 23, which is electrically connected to the first pad 21, and the scanning circuit, which is electrically connected to the second pad 22, are also electrically connected.

[0039] Specifically, the target pixel is the currently selected pixel to be tested. Considering the potential errors in human visual observation, to accurately determine the luminescence of the target pixel, such as its luminous intensity, a target image is obtained by capturing an image of the luminous unit 13 using camera 16. By performing image analysis on the target image, the luminescence of the target pixel can be accurately determined, for example, its luminous intensity, and further, the current flowing through the target pixel can be determined. It is understandable that analyzing the target image to determine the luminescence of the target pixel avoids the subjectivity of human visual observation, thereby ensuring the accuracy of the test results.

[0040] In another embodiment, the camera 16 may integrate a processor, enabling the camera 16 to independently obtain the illumination status of the target pixels based on the captured target image.

[0041] In other embodiments, the camera 16 and processor may not be included. In this case, the light emission of the target pixel can be determined directly by human eye observation, and the current of the target pixel can also be determined.

[0042] Please continue reading. Figure 1There are multiple first probes 11, multiple second probes and multiple light-emitting units 13. Multiple first probes 11 correspond one-to-one with multiple light-emitting units 13. The light-emitting unit 13 is electrically connected to the corresponding first probe 11 and the test circuit 1. Multiple first probes 11 are used to contact different first pads 21 in the same array layer 2 under test. Multiple second probes are used to contact different second pads 22 in the same array layer 2 under test.

[0043] Specifically, the testing device includes multiple first probes 11, multiple second probes, and multiple light-emitting units 13. By using multiple first probes 11, multiple second probes, and multiple light-emitting units 13 to test the array layer 2 under test, the testing device can simultaneously test multiple selected pixels, thereby improving testing efficiency.

[0044] In one embodiment, there are multiple first probes 11, multiple second probes, and multiple light-emitting units 13. Each of the multiple first probes 11 corresponds to one of the multiple light-emitting units 13. The light-emitting unit 13 is electrically connected to the corresponding first probe 11 and the test circuit 1. The multiple first probes 11 form multiple first probe groups, the multiple second probes form multiple second probe groups, and the multiple light-emitting units 13 form multiple light-emitting groups. The first probes 11 in the same first probe group, the second probes in the same second probe group, and the light-emitting units 13 in the same light-emitting group are all electrically connected to the same array layer 2 under test. The first probes 11 in different first probe groups, the second probes in different second probe groups, and the light-emitting units 13 in different light-emitting groups are all electrically connected to different array layers 2 under test. The multiple first probe groups, multiple second probe groups, and multiple light-emitting units 13 correspond to one of the multiple first probe groups, multiple second probe groups, and multiple light-emitting units 13. The corresponding first probe groups, multiple second probe groups, and multiple light-emitting units 13 are all electrically connected to the same array layer 2 under test.

[0045] The above settings enable the testing device to test multiple array layers 2 under test simultaneously. For example, the testing device can perform current tests on 8 or 10 array layers 2 under test at the same time.

[0046] Specifically, when the testing device tests multiple array layers 2 under test simultaneously, the first pad 21 of the same array layer 2 under test is connected to the first probe 11 in the same first probe group, and the second pad 22 of the same array layer 2 under test is connected to the second probe in the same second probe group. The first pad 21 of different array layers 2 under test is connected to the first probe 11 in different first probe groups, the second pad 22 of different array layers 2 under test is connected to the second probe in different second probe groups, and the light-emitting units 13 in different light-emitting groups are correspondingly set with the first probe 11 of different array layers 2 under test.

[0047] Please see Figure 3 and Figure 4The testing device further includes a first carrier substrate 17 and a pin card 18, wherein the testing circuit 1 is formed on the first carrier substrate 17; the pin card 18 is disposed on the first carrier substrate 17, and there are multiple pin cards 18, multiple first probe groups, and multiple second probe groups corresponding one to one, wherein the first probe 11 in the first probe group and the second probe in the second probe group are all mounted on the corresponding pin card 18.

[0048] Specifically, the test circuit 1 is disposed on the first carrier substrate 17, and multiple pin cards 18 are also disposed on the first carrier substrate 17, or multiple pin cards 18 can be disposed on the first carrier substrate 17. Each pin card 18 can correspond one-to-one with a first probe group and a second probe group, allowing each pin card 18 to correspond one-to-one with the array layer 2 under test. When there are eight pin cards 18 on the same first carrier substrate 17, the test device can simultaneously test eight array layers 2 under test arranged in the same row. Furthermore, the first probe 11 in the same first probe group and the second probe in the same second probe group are both mounted on their corresponding pin cards 18.

[0049] In one embodiment, the light-emitting units 13 in the light-emitting group corresponding to the first probe group are all integrated on the pin card 18 corresponding to the first probe group. Specifically, since the first probe group is in contact with different first pads 21 in the same array layer 2 under test, and the light-emitting units 13 in the light-emitting group correspond one-to-one with the first probes 11 of the first probe group, and the light-emitting units 13 can be lit according to the electrical signals transmitted by the first probes 11, in order to obtain the circuit continuity and current magnitude of the pixel circuit unit in the corresponding array layer 2 under test in a timely manner, the light-emitting units 13 in the light-emitting group corresponding to the first probe group can be integrated on the pin card 18 corresponding to the first probe group. Based on the light emission of the light-emitting units 13 on the pin card 18, information such as the circuit continuity or current magnitude of the pixel circuit unit in the corresponding test array layer 2 can be obtained.

[0050] Please continue reading. Figure 4 The testing apparatus further includes a second carrier substrate 19, on which the light-emitting units 13 of all light-emitting groups are formed. By integrating the light-emitting units 13 of all light-emitting groups on the second carrier substrate 19, the test results of all test array layers 2 under test simultaneously can be analyzed by fixing the camera 16 above the second carrier substrate 19.

[0051] Please see Figure 5The first light-emitting device 14 includes a first electrode layer 31, a first light-emitting material layer 32, and a second electrode layer 33 stacked sequentially; the second light-emitting device 15 includes a third electrode layer 34, a second light-emitting material layer 35, and a fourth electrode layer 36 stacked sequentially; wherein the first electrode layer 31 and the third electrode layer 34 are electrically connected and also electrically connected to the first probe 11, and the second electrode layer 33 and the fourth electrode layer 36 are insulated and are respectively electrically connected to the test circuit 1.

[0052] Specifically, the first light-emitting device 14 and the second light-emitting device 15 have similar structures, both including two electrode layers and one light-emitting material layer. The first electrode layer 31 and the third electrode layer 34 are electrically connected, which makes the first electrode layer 31 and the third electrode layer 34 continuous, thereby improving the fabrication efficiency.

[0053] In one application scenario, when the voltage in the data line 23 of the pixel circuit is higher than the voltage of the test circuit 1, the first light-emitting device 14 is lit, and the second light-emitting device 15 does not emit light. If the first light-emitting device 14 is not lit or the second light-emitting device 15 emits light, it can be determined that the pixel current is abnormal. When the voltage of the pin card 18 is higher than the measured voltage at the end of the data line 23 in the pixel circuit, the second light-emitting device 15 is lit, and the first light-emitting device 14 does not emit light. If the second light-emitting device 15 is not lit or the first light-emitting device 14 emits light, it can be determined that the pixel current is abnormal.

[0054] Please continue reading. Figure 5 Both the first and second light-emitting material layers include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron transport layer (ETL), and an electron injection layer (EIL). Along the same direction, the arrangement order of the hole injection layer (HIL), the hole transport layer (HTL), the light-emitting layer, the electron transport layer (ETL), and the electron injection layer (EIL) in the first light-emitting material layer is reversed compared to the arrangement order in the second light-emitting material layer, thereby making the conduction directions of the first and second light-emitting devices different.

[0055] In one embodiment, the first light-emitting device 14 and the second light-emitting device 15 are light-emitting diodes, and the intensity of light emission is related to the magnitude of the current flowing through the light-emitting diode.

[0056] Please see Figure 6 , Figure 7 and Figure 8 The array layer 2 under test contains multiple pixel circuit units. Figure 6The diagram shows a 7T1C pixel circuit, which contains 7 transistors and 1 capacitor. The fourth transistor M4 and the sixth transistor M6 are dual-gate transistors, as are the seventh transistor M7 and the eighth transistor M8. When the test device tests the array layer 2 under test, the pathways between the test device and each pixel circuit unit in the array layer 2 under test are sequentially connected for testing. Probes other than the first probe 11 and the second probe can be used to contact the signals in the pixel circuit units. Therefore, the test device in this invention can use array test full contact technology to test the array layer 2 under test, and can accurately apply the corresponding signals. Figure 6 The pixel circuit shown is merely an example for illustrative purposes. The testing apparatus of this invention can be applied to a variety of different pixel circuits.

[0057] In one embodiment, when the testing apparatus tests the pixel circuit, please refer to... Figure 7 In the first stage, R1 charges the capacitor. Specifically, the test device applies a voltage value to the pixel circuit unit at the reference voltage (Vref) terminal. The voltage enters the pixel circuit unit from the Vref terminal, passes through the seventh transistor M7 and the eighth transistor M8, and reaches the capacitor C1 to charge the capacitor C1.

[0058] Please see Figure 7 In the second stage, when the capacitor is discharging, R2 passes through the fourth transistor M4, the sixth transistor M6, the third transistor M3 and the first transistor M1 to reach the data terminal (Vdata) position, realizing the reading of Vdata. At this time, after the first probe 11 is connected to the data line 23, the path in the test device and the pixel circuit is turned on. If there is no abnormality in the transistors and connecting lines in R2, the corresponding light-emitting unit 13 will be lit.

[0059] Please see Figure 8 In the third stage, R3 inputs an electrical signal to the high power supply voltage line VDD in the test device, causing the signal to reach the Vdata terminal through the second transistor M2 and the first transistor M1. Specifically, before the third stage, a step of charging the capacitor can also be performed, such as... Figure 7 In the middle R1, the test device applies a voltage value to the pixel circuit unit at the reference voltage (Vref) terminal. The voltage enters the pixel circuit unit from the Vref terminal, passes through the seventh transistor M7 and the eighth transistor M8, and reaches the capacitor C1 to charge it. After the capacitor is charged, in the third stage, when the capacitor C1 is fully charged, the third transistor M3 is driven to turn on by the Vref voltage.

[0060] Please see Figure 8In the fourth stage, R4 inputs an electrical signal to the Vref terminal in the testing device, thus connecting Vref, the ninth transistor M9, the fifth transistor M5, the third transistor M3, the first transistor M1, and Vdata, enabling the reading of Vdata. Specifically, the ninth transistor M9 is turned on by the second scan signal Scan2, the fifth transistor M5 is turned on by the light-emitting signal line EM, the third transistor M3 is turned on by capacitor C1, and the first transistor M1 is turned on by the second scan signal Scan2.

[0061] In one embodiment, the third and fourth stages of testing can also be combined, allowing the testing device to simultaneously input electrical signals to the high power supply voltage lines VDD and Vref. After being connected to the data line 23 via the first probe 11, the path in the testing device and the pixel circuit is made conductive, and the testing device can determine whether this part of the pixel circuit is conductive. Additionally, the pixel circuit also includes a first scan signal Scan1 and a light-emitting device OLED.

[0062] Please see Figure 9 The present invention also provides a testing method, which can be applied to the testing apparatus described in the above embodiments, and the testing method includes:

[0063] S1: Make the first probe 11 contact with the first pad 21 in the array layer 2 under test.

[0064] The first probe 11 is used to contact the first pad 21 in the array layer 2 under test. The first pad 21 is electrically connected to the data line 23 in the array layer 2 under test. The data signal in the first pad 21 can be exported to the test device through the first probe 11.

[0065] S2: Make contact between the second probe and the second pad 22 in the array layer 2 under test.

[0066] The second probe is used to contact the second pad 22 in the array layer 2 under test. The second pad 22 is electrically connected to the scanning circuit in the array layer 2 under test. The test device can obtain the electrical signal transmitted by the scanning circuit in the array layer 2 under test by contacting the second pad 22 with the second probe.

[0067] In one embodiment, the steps of contacting the first probe 11 with the first pad 21 in the array layer 2 under test and contacting the second probe with the second pad 22 in the array layer 2 under test can be performed simultaneously. When the test device tests the array layer 2 under test, the first probe 11 and the second probe in the test device can contact the array layer 2 under test simultaneously.

[0068] S3: Determine the light emission status of the target pixel based on the light emission status of the light emission unit 13, wherein the data line 23 electrically connected to the first pad 21 and the scanning circuit electrically connected to the second pad 22 are simultaneously electrically connected.

[0069] The scanning circuit, connected via data line 23 (electrically connected to the target pixel and the first pad 21) and the second pad 22 (electrically connected to the second pad), is simultaneously electrically connected. This causes a portion of the circuitry in the pixel circuit unit corresponding to the target pixel in the array layer 2 under test to be turned on, thereby allowing current to flow through the light-emitting unit 13 and illuminating it. By observing the illumination of the light-emitting unit 13, it can be determined whether current exists in the array layer 2 under test.

[0070] Furthermore, by observing the emission patterns of the light-emitting units, it's possible to determine whether there are defects in the corresponding pixel circuit units within the array layer under test. If defective pixel circuit units are found, they can be located using data lines and a scanning circuit. Specifically, the array layer under test is considered a matrix, with the extension direction of the data lines defined as the column direction and the direction perpendicular to the column direction defined as the row direction. The pixel circuit units are arranged along both the row and column directions, allowing their coordinates to be determined based on their arrangement. The column coordinates of the pixel circuit units can be determined using the data lines, while the horizontal coordinates can be determined using the scanning timing sequence in the scanning circuit.

[0071] Please see Figure 10 Specifically, step S3 includes:

[0072] S31: The target image is obtained by taking a picture of the light-emitting unit 13 using the camera 16.

[0073] The camera 16 can accurately capture the light emission status of the light-emitting unit 13, and the camera 16 obtains the target image by taking a picture of the light-emitting unit 13.

[0074] S32: Analyze the target image to determine the luminescence of the target pixels.

[0075] By analyzing the target image, the brightness of the light emitted by the light-emitting unit 13 can be determined, and the light emission status of the target pixel can be determined based on the brightness information.

[0076] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A testing device, characterized in that, include: The first probe is used to contact the first pad in the array layer under test that is electrically connected to the data line; The second probe is used to contact the second pad in the array layer under test that is electrically connected to the scanning circuit; The test circuit is electrically connected to the first probe and the second probe, and the test circuit inputs a scan signal to the array layer under test through the second probe. The light-emitting unit is electrically connected to the first probe and the test circuit. The light-emitting unit includes a first light-emitting device and a second light-emitting device connected in parallel, wherein the first light-emitting device and the second light-emitting device have different conduction directions. A camera is used to capture images of the light-emitting unit to obtain a target image; The processor, electrically connected to the camera, is used to analyze the target image to determine the brightness information of the light emitted by the light-emitting unit, and to determine the light emission status of the target pixel based on the brightness information, thereby determining the current flowing through the target pixel, and judging whether there is a defect in the corresponding pixel circuit in the array layer under test. The data line electrically connected to the first pad and the scanning circuit electrically connected to the second pad are simultaneously electrically connected to the target pixel. The light emission status includes the light emission intensity.

2. The testing apparatus according to claim 1, characterized in that, The number of first probes, second probes, and light-emitting units are all multiple, with each of the multiple first probes corresponding to one of the multiple light-emitting units. Each light-emitting unit is electrically connected to its corresponding first probe and the test circuit. Multiple first probes are used to contact different first pads in the same array under test layer, and multiple second probes are used to contact different second pads in the same array under test layer.

3. The testing apparatus according to claim 1, characterized in that, The number of the first probe, the second probe, and the light-emitting unit are all multiple, with each of the multiple first probes corresponding to one of the multiple light-emitting units, and each light-emitting unit is electrically connected to the corresponding first probe and the test circuit. Multiple first probes form multiple first probe groups, multiple second probes form multiple second probe groups, and multiple light-emitting units form multiple light-emitting groups; The first probe in the same first probe group, the second probe in the same second probe group, and the light-emitting unit in the same light-emitting group are all electrically connected to the same array layer under test. The first probe in different first probe groups, the second probe in different second probe groups, and the light-emitting unit in different light-emitting groups are all electrically connected to different array layers under test. Multiple first probe groups, multiple second probe groups, and multiple light-emitting units correspond one-to-one, and the corresponding first probe groups, second probe groups, and light-emitting units are all electrically connected to the same array layer under test.

4. The testing apparatus according to claim 3, characterized in that, The testing apparatus further includes: A first carrier substrate, on which the test circuit is formed; A pin card is disposed on the first carrier substrate. There are multiple pin cards, and the multiple pin cards, multiple first probe groups, and multiple second probe groups correspond one-to-one. The first probe in the first probe group and the second probe in the second probe group are all mounted on the corresponding pin card.

5. The testing apparatus according to claim 4, characterized in that, The light-emitting units in the light-emitting group corresponding to the first probe group are all integrated on the pin card corresponding to the first probe group.

6. The testing apparatus according to claim 4, characterized in that, The testing apparatus further includes: The second carrier substrate, on which all the light-emitting units in the light-emitting groups are formed.

7. The testing apparatus according to claim 1, characterized in that, The first light-emitting device comprises a first electrode layer, a first light-emitting material layer, and a second electrode layer stacked sequentially; the second light-emitting device comprises a third electrode layer, a second light-emitting material layer, and a fourth electrode layer stacked sequentially. The first electrode layer and the third electrode layer are electrically connected to the first probe, while the second electrode layer and the fourth electrode layer are insulated from each other and are electrically connected to the test circuit.

8. A testing method, characterized in that, Applied to the testing apparatus as described in any one of claims 1 to 7, the method comprises: The first probe is brought into contact with the first pad in the array layer under test; The second probe is brought into contact with the second pad in the array layer under test; Based on the light emission status of the light-emitting unit, the light emission status of the target pixel is determined, wherein the data line electrically connected to the first pad and the scanning circuit electrically connected to the second pad are simultaneously electrically connected to the target pixel.

9. The test method according to claim 8, characterized in that, The step of determining the light emission status of the target pixel based on the light emission status of the light-emitting unit includes: A target image is obtained by taking a picture of the light-emitting unit using a camera; The target image is analyzed to determine the luminescence of the target pixels.

Images