Wafer carrying scheduling method and device, electronic equipment and storage medium

Abstract

The application relates to the technical field of semiconductor processes, and provides a wafer carrying scheduling method and device, electronic equipment and a storage medium. The method first determines a plurality of wafers in a wafer cassette that need to be subjected to annealing process treatment, and controls a first carrying component to sequentially transport a preset number of wafers from the wafer cassette to an alignment module of a laser annealing device in order, and then transports the wafers to different chambers of the laser annealing device for annealing process treatment after alignment treatment by the alignment module. Then, for any wafer remaining in the plurality of wafers, the first carrying component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment treatment, and after the second carrying component is controlled to take out the wafer in an idle chamber that has completed the annealing process treatment, the first carrying component is controlled to transport the wafer that has completed the alignment treatment to the idle chamber for annealing process treatment, and the second carrying component is controlled to transport the taken-out wafer to a cooling module of the laser annealing device for cooling treatment.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process technology, and in particular to a wafer handling and scheduling method, apparatus, electronic device, and storage medium. Background Technology

[0002] Laser annealing equipment, as a device for annealing wafers, generally involves the following steps in the annealing process of a wafer in a wafer cassette: 1) Using a robotic arm, the wafer is removed from the wafer cassette and placed into an alignment module; 2) Using the alignment module, the wafer is aligned to a specified angle; 3) Using a robotic arm, the wafer is removed from the alignment module and placed into a cavity for annealing; 4) After annealing, the wafer is removed from the cavity by a robotic arm and placed onto a cooling module for cooling; 5) After cooling, the wafer is removed by a robotic arm and returned to its corresponding position in the wafer cassette.

[0003] In the above process, the wafer passes through functional modules such as the robotic arm, alignment module, chamber, and cooling module in sequence, with all handling actions performed by the robotic arm. Although the processing of a single wafer is serial, for laser annealing equipment, if wafers are processed sequentially, only one functional module of the laser annealing equipment will be working at any given time, while the other functional modules will be idle, which will significantly affect the yield. Summary of the Invention

[0004] This invention provides a wafer handling and scheduling method, apparatus, electronic device, and storage medium to address the deficiencies in the prior art.

[0005] This invention provides a wafer handling scheduling method, comprising:

[0006] The system identifies multiple wafers in the wafer cassette that require annealing and controls the first transport component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing.

[0007] For any remaining wafer among the multiple wafers, the first transport component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment processing. After the second transport component removes the wafer from the empty chamber where the annealing process has been completed, the first transport component is controlled to transport the aligned wafer to the empty chamber for annealing processing. The second transport component is then controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing.

[0008] According to a wafer handling and scheduling method provided by the present invention, the first handling component controls a preset number of wafers to be transported sequentially from the wafer cassette to the alignment module of a laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing processing. The method includes:

[0009] Construct a stack list of transport tasks for the multiple wafers; the stack list includes an initial transport task that transports each wafer from the wafer cassette to the alignment module based on the first transport component;

[0010] The transport task stack list is activated, and the initial transport task of each wafer is executed sequentially. After the initial transport task of the current wafer is completed and the current wafer is aligned, a series of transport tasks are created and executed by the first transport component to transport the current wafer from the alignment module to the fabless chamber in the different chambers.

[0011] According to a wafer handling scheduling method provided by the present invention, the series of handling tasks sequentially include a first task of the first handling component taking a wafer from the alignment module, a second task of the first handling component aligning with the fabless chamber, a third task of the first handling component extending into the fabless chamber, and a fourth task of the first handling component retracting.

[0012] The process of creating and executing a series of transport tasks by the first transport component to move the current wafer from the alignment module to the fabless chamber includes:

[0013] Create the first task, push the first task onto the transport task stack list, activate the transport task stack list, and execute the first task;

[0014] For any one of the second, third, and fourth tasks, after the previous task of any one task is completed, the task is created, pushed onto the transport task stack list, the transport task stack list is activated, and the task is executed.

[0015] According to a wafer handling and scheduling method provided by the present invention, after controlling a second handling component to remove a wafer from an empty cavity that has completed the annealing process, controlling a first handling component to transport any one of the aligned wafers to the empty cavity for annealing processing includes:

[0016] Create a fifth task for the second transport component to align with the empty chamber, push the fifth task into the transport task stack list, and create a first task for the first transport component to pick up the wafer from the alignment module, push the first task into the transport task stack list, activate the transport task stack list in sequence, and execute the first task and the fifth task.

[0017] After the fifth task is completed and the empty chamber is opened, the sixth task of the second transport component extending into the empty chamber, the seventh task of the second transport component retracting, the eighth task of the first transport component extending into the empty chamber, and the fourth task of the first transport component retracting are created and executed in sequence.

[0018] According to a wafer handling scheduling method provided by the present invention, the handling tasks in the handling task stack list have priorities, and the priorities of the sixth and seventh tasks, as well as the priorities of the third, fourth and eighth tasks, are all higher than the priorities of other handling tasks in the handling task stack list.

[0019] According to a wafer handling and scheduling method provided by the present invention, the method of controlling the second handling component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling includes:

[0020] The occupancy status of the first and second transport components is collected in real time.

[0021] If both the first and second transport components are unoccupied, then based on the position information of the wafer that has completed the cooling process in the wafer cassette, the first transport component is controlled to place the wafer that has completed the cooling process back into the wafer cassette.

[0022] According to a wafer handling and scheduling method provided by the present invention, the step of controlling the first handling component to return the cooled wafer to the wafer cassette based on the position information of the wafer in the cassette after cooling treatment includes:

[0023] After the cooling module completes the cooling process, it creates the first transport component to place the cooled wafer back into the wafer cassette as the ninth task, and pushes the ninth task into the transport task stack list.

[0024] If both the first and second transport components are unoccupied, the transport task stack list is activated, and the ninth task is executed.

[0025] The wafer handling scheduling method provided by the present invention further includes:

[0026] If an alarm signal of a preset level is received from any chamber, the state of that chamber is changed to unavailable, and annealing process is performed based on the remaining chambers of the laser annealing equipment.

[0027] The present invention also provides a wafer handling and scheduling device, comprising:

[0028] The first scheduling module is used to determine the multiple wafers in the wafer cassette that need to undergo annealing process, and control the first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing process.

[0029] The second scheduling module is used to control the first transport component to transport any remaining wafer from the wafer cassette to the alignment module for alignment processing, and after controlling the second transport component to remove the wafer from the idle chamber that has completed the annealing process, control the first transport component to transport the aligned wafer to the idle chamber for annealing processing, and control the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing.

[0030] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the wafer handling scheduling method as described above.

[0031] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the wafer handling scheduling method as described above.

[0032] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the wafer handling scheduling method as described above.

[0033] The present invention provides a wafer handling scheduling method, apparatus, electronic device, and storage medium. The method first determines multiple wafers in a wafer cassette that require annealing. A first handling component is then controlled to transport a predetermined number of wafers sequentially from the wafer cassette to the alignment module of a laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing. Then, for any remaining wafer among the multiple wafers, the first handling component is controlled to transport that wafer from the wafer cassette to the alignment module for alignment. After a second handling component removes a wafer from an empty chamber that has undergone annealing, the first handling component transports the aligned wafer to an empty chamber for annealing. Finally, the second handling component transports the removed wafer to the cooling module of the laser annealing equipment for cooling. This method prioritizes sequentially feeding a preset number of wafers into different chambers of a laser annealing equipment for annealing. While waiting for the annealing process to complete, the first transport component continues to transport any remaining wafer. When an idle chamber exists, the combined transport actions of the first and second transport components allow any wafer to enter the idle chamber for annealing. This enables multiple wafers to be processed in parallel, fully utilizing the functional modules of the laser annealing equipment, improving the utilization rate of each module, and reducing idle time. This not only increases the yield of the laser annealing equipment but also saves resources, achieving efficient resource utilization. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on the drawings described below without creative effort.

[0035] Figure 1 This is a schematic flowchart of the wafer handling and scheduling method provided by the present invention;

[0036] Figure 2 This is a top view of the composition of the laser annealing equipment in the wafer handling and scheduling method provided by the present invention;

[0037] Figure 3 This is a timing diagram of the wafer handling scheduling method provided by the present invention;

[0038] Figure 4 This is a schematic diagram of the wafer handling and scheduling device provided by the present invention;

[0039] Figure 5 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0041] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of the invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0042] Because existing laser annealing equipment processes wafers sequentially during handling, only one functional module is active at any given time, while others remain idle. This significantly impacts the yield of the laser annealing equipment, wastes resources, and fails to maximize resource utilization. Therefore, this invention provides a wafer handling scheduling method.

[0043] Figure 1 This is a flowchart illustrating a wafer handling scheduling method provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the method includes:

[0044] S1, determine the multiple wafers in the wafer cassette that need to undergo annealing process, and control the first transport component to transport the preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing process.

[0045] S2, for any remaining wafer among the multiple wafers, control the first transport component to transport the wafer from the wafer cassette to the alignment module for alignment processing, and after controlling the second transport component to remove the wafer from the empty chamber that has completed the annealing process, control the first transport component to transport the aligned wafer to the empty chamber for annealing processing, and control the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing.

[0046] Specifically, the wafer handling scheduling method provided in this embodiment of the invention is executed by a computer, which can be a local computer or a cloud computer. The local computer can be a computer, tablet, etc., and is not specifically limited here. The computer can be configured with a computer program for controlling the first handling component and the second handling component.

[0047] This crystal handling and scheduling method can be applied to laser annealing equipment, which can have multiple chambers, i.e., two or more. In other words, this crystal handling and scheduling method is applicable to both dual-chamber laser annealing equipment and laser annealing equipment with three or more chambers. Since laser annealing equipment is a front-end process equipment, it can also be called front-end laser annealing equipment.

[0048] Under normal circumstances, the annealing process of a laser annealing equipment for a wafer is as follows: A transport device removes the wafer from the wafer cassette and places it on the alignment module. After alignment, the transport device removes the wafer and aligns it with the cavity, waiting for the cavity to prepare to receive the wafer. Once the aligned cavity is ready, the door opens, the transport device extends into the cavity, places the wafer inside, and then retracts. The cavity begins the annealing process. After annealing, the transport device aligns with the cavity to remove the wafer. The cavity door opens, the transport device extends into the cavity, grasps the wafer, and retracts. The transport device places the wafer into the cooling module for cooling. After cooling, the transport device returns the wafer to its corresponding position in the wafer cassette. Wherein:

[0049] 1) A wafer cassette is a device for storing wafers. In this embodiment of the invention, the laser annealing equipment may include one or more wafer cassettes, each of which can store 25 wafers.

[0050] 2) A transport device is a device used for transporting wafers. This transport device may include a first transport component and a second transport component. The first and second transport components may be fixed on the same vertical axis, one above and one below, and may rotate around the vertical axis. The first and second transport components may be located below and above the vertical axis, respectively. Due to the different structures and materials of the first and second transport components, their requirements for transporting wafers are also different, necessitating the coordinated operation of the first and second transport components.

[0051] The first transport component can be used for transporting wafers from the wafer cassette, transporting wafers from the wafer cassette to the alignment module, and transporting wafers to the chamber for annealing processes. It can also be used to transport wafers from the cooling module back to the wafer cassette, that is, to put the wafers that have completed the cooling process back into the wafer cassette.

[0052] The second transport component can be used to remove the wafers that have completed the annealing process from the chamber and transport them to the cooling module for cooling.

[0053] Both the first and second transport components can perform five actions: picking up the wafer, placing the wafer, rotating, extending, and retracting.

[0054] Here, the handling device can be a robotic arm, and the first handling component and the second handling component can be the two hands of the robotic arm, respectively. The first handling component can be the lower hand, and the second handling component can be the upper hand.

[0055] 3) The alignment module is used to attract the wafer placed on it and rotate the wafer by a specified angle so that the wafer orientation coincides with the target direction. For example, the notch on the edge of the wafer can be aligned with the target direction to complete the alignment operation. After the alignment operation is completed, the wafer can be removed from the alignment module.

[0056] 4) Multiple chambers may be included. These chambers function identically and independently, all used for annealing the wafers within them. Each chamber is a closed structure, its closure controlled by a chamber door; opening the chamber door is required to remove or place wafers.

[0057] 5) The cooling module is used to cool the wafers removed from the annealing process module by the first transport component for a fixed period of time. After cooling, the wafers can be removed by the first transport component and placed back into the wafer cassette. The cooling module can have eight slots, which can hold eight wafers at the same time.

[0058] like Figure 2 The image shown is a top view of the components of a dual-chamber laser annealing device. Figure 2 In this system, the dual-chamber laser annealing equipment has two chambers: chamber 1 and chamber 2. The equipment can accommodate two wafer cassettes, wafer cassette 1 and wafer cassette 2, and the handling device is a robotic arm with two hands, an upper hand and a lower hand.

[0059] To achieve wafer handling and scheduling in laser annealing equipment, the computer program maintains relevant status records for the wafer cassette, first handling component, second handling component, alignment module, chamber, and cooling module. These records include wafer presence status, wafer cassette ID, wafer location information, and wafer processing status. Wafer presence status indicates whether a wafer is present; wafer cassette ID is the wafer cassette identifier; wafer location information identifies the wafer's position within the cassette; and wafer processing status can include starting processing, processing in progress, and processing completed.

[0060] The computer first executes step S1 to identify the multiple wafers in a wafer cassette that require annealing. This wafer cassette can be any of the wafer cassettes in the laser annealing equipment, and the multiple wafers can be any wafer in any wafer cassette that requires annealing.

[0061] Each wafer in the wafer cassette has a corresponding position, from which a preset number of wafers can be selected. The first transport component is controlled to sequentially transport the preset number of wafers through the following process: the wafers are taken out of the wafer cassette and transported to the alignment module. After the wafers are aligned by the alignment module, the first transport component can take them out of the alignment module and transport them to different chambers of the laser annealing equipment for annealing.

[0062] The preset number is the same as the number of chambers in the laser annealing equipment, which means that the wafers selected from the wafer cassette can correspond one-to-one with each chamber of the laser annealing equipment, so that the preset number of wafers can be annealed in different chambers in sequence.

[0063] The alignment module takes about 3 seconds to align, and the annealing process in the chamber takes about 5 minutes. Since the annealing process for each wafer takes a long time, while waiting for the chamber to complete the annealing process for that wafer, the first transport component can be used to transport the next wafer to the next chamber for annealing, thereby improving the utilization rate of the first transport component and reducing its idle time.

[0064] The computer then executes step S2. After step S1 is completed, both the alignment module and the first transport component are in an idle state. Therefore, for any remaining wafer p among the multiple wafers—that is, any wafer other than the preset number of wafers already selected—the first transport component can be controlled to transport any wafer p from the wafer cassette to the alignment module for alignment processing. Any wafer p that has completed alignment processing can remain on the alignment module. Afterward, it waits for a certain chamber to complete the annealing process. The chamber that has completed the annealing process can be defined as an idle chamber, which contains the wafers that have completed the annealing process.

[0065] After the alignment module completes the alignment process, it can sequentially determine whether each chamber of the laser annealing equipment is an empty chamber. If an empty chamber is determined, a relevant task can be created for subsequent processing. If none of the chambers are empty, no relevant task will be created.

[0066] Subsequently, the computer can control the first transport component to remove any aligned wafer p from the alignment module, awaiting transport. Before transport, since there are still wafers in the empty chamber, the computer can control the second transport component to remove the wafers from the empty chamber that have undergone the annealing process. During this process, the second transport component can first align with the empty chamber, wait for the empty chamber door to open, and then extend into the empty chamber after the door opens, remove the wafer, and retract.

[0067] At this point, the idle chamber becomes a fabless chamber, and the first transport component can be controlled to transport any wafer p that has completed the alignment process to the idle chamber for annealing. Since the idle chamber is not closed after the second transport component retracts, the first transport component can directly extend into the idle chamber, place any wafer p that has completed the alignment process into the idle chamber, and then retract.

[0068] Subsequently, since the second transport component still carries wafers removed from the empty chamber, it can be controlled to transport the removed wafers to the cooling module of the laser annealing equipment for cooling. The cooling process takes approximately 2 minutes.

[0069] It is understandable that the cooling module can perform cooling treatment after receiving each wafer. After each wafer has completed the cooling treatment, the first transport component can be immediately controlled to transport the cooled wafer to the corresponding position in the wafer cassette. Alternatively, the cooled wafer can be transported to the corresponding position in the wafer cassette when the first transport component is idle. No specific limitation is made here.

[0070] The wafer handling and scheduling method provided in this embodiment of the invention first determines multiple wafers in the wafer cassette that need to undergo annealing, and controls a first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing. Then, for any remaining wafer among the multiple wafers, the first handling component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment. After the second handling component removes the wafer from the empty chamber where the annealing process has been completed, the first handling component is controlled to transport the wafer that has completed the alignment process to the empty chamber for annealing. Finally, the second handling component is controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling. This method prioritizes sequentially feeding a preset number of wafers into different chambers of a laser annealing equipment for annealing. While waiting for the annealing process to complete, the first transport component continues to transport any remaining wafer. When an idle chamber exists, the combined transport actions of the first and second transport components allow any wafer to enter the idle chamber for annealing. This enables multiple wafers to be processed in parallel, fully utilizing the functional modules of the laser annealing equipment, improving the utilization rate of each module, and reducing idle time. This not only increases the yield of the laser annealing equipment but also saves resources, achieving efficient resource utilization.

[0071] Based on the above embodiments, the wafer handling and scheduling method provided in this embodiment of the invention, wherein the first handling component is controlled to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment, and after alignment processing by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing processing, including:

[0072] Construct a stack list of transport tasks for the multiple wafers; the stack list includes an initial transport task that transports each wafer from the wafer cassette to the alignment module based on the first transport component;

[0073] The transport task stack list is activated, and the initial transport task of each wafer is executed sequentially. After the initial transport task of the current wafer is completed and the current wafer is aligned, a series of transport tasks are created and executed by the first transport component to transport the current wafer from the alignment module to the fabless chamber in the different chambers.

[0074] Specifically, when the first transport component transports a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment, and after alignment by the alignment module, transports them to different chambers of the laser annealing equipment for annealing, the process of transporting wafers by the transport device can be divided into independent tasks, and the first transport component and the second transport component perform these transport tasks in a harmonious and orderly manner.

[0075] Therefore, a multi-wafer transport task stack list is first constructed. This transport task stack list includes initial transport tasks based on the first transport component, which transports each wafer from the wafer cassette to the alignment module. Each wafer corresponds to one initial transport task, namely, "the first transport component removes the wafer from the wafer cassette and places it on the alignment module." All initial transport tasks are pushed into the transport task stack list.

[0076] This wafer handling task stack can also be used to store the next task in the wafer handling schedule, such as actions like picking up and placing wafers, rotating, extending, and retracting by the first and second handling components. In this embodiment of the invention, considering the "last-in, first-out" characteristic of the stack list, it can respond quickly and promptly to the next task after the current task is completed. For example, if the current task is to remove a wafer from the wafer cassette, and after removal, a task to "place the wafer on the alignment module" is pushed onto the stack list, then the next task in the wafer handling schedule is to execute the just-pushed "place the wafer on the alignment module" task and place the wafer on the alignment module.

[0077] If a transport task in the transport task stack list is to be executed, the transport task stack list needs to be activated first. Then, the initial transport task of each wafer can be executed sequentially. After the initial transport task of the current wafer is completed and the current wafer has completed the alignment process, a series of transport tasks are created and executed by the first transport component to transport the current wafer from the alignment module to the fabless chamber in different chambers.

[0078] Here, upon completion of the initial wafer transport task, the alignment module receives the current wafer and performs alignment processing. Because the alignment process is relatively quick, and to ensure full utilization of other functional modules within the laser annealing equipment, the initial transport task for the next wafer is not executed immediately after the current wafer's initial transport task is completed. Instead, the alignment process is completed after the current wafer's initial transport task is finished. Once the alignment process is complete, a series of transport tasks is created and executed, involving the first transport component moving the current wafer from the alignment module to a fabless chamber within a different chamber. The initial transport task for the next wafer is only executed after the first transport component has moved the current wafer to the fabless chamber.

[0079] The aforementioned series of transport tasks can sequentially include a first task where the first transport component picks up the wafer from the alignment module, a second task where the first transport component aligns with the fabless chamber, a third task where the first transport component extends into the fabless chamber, and a fourth task where the first transport component retracts. In the second task, the first transport component can align with the fabless chamber by rotation.

[0080] Here, the "last-in, first-out" characteristic of the transport task stack list can be utilized to create and write each task in the above series of transport tasks into the transport task stack list in sequence. After each task is written into the transport task stack list, the transport task stack list is immediately activated to execute the transport task.

[0081] After each transport task is completed, it is removed from the transport task stack list. Then, the transport task stack list is reactivated, the next task is retrieved, and its feasibility is checked. If feasibility is achieved, the task is popped from the stack and executed; otherwise, no action is taken, and the task request is ignored. For example, after placing a wafer into the alignment module, the next task, "Retrieve another wafer from the wafer cassette and place it into the alignment module," is activated. At this point, the feasibility of this task must be checked. Since there is already a wafer on the alignment module, this task is not feasible and is ignored until the transport task stack list is reactivated.

[0082] In this embodiment of the invention, the transport tasks within the stack are executed by means of a stack list, and the transport tasks can be "last in first out", which facilitates the creation and execution of tasks.

[0083] Based on the above embodiments, the wafer handling scheduling method provided in this embodiment of the invention includes a series of handling tasks in sequence, namely, a first task of the first handling component taking a wafer from the alignment module, a second task of the first handling component aligning with the fabless chamber, a third task of the first handling component extending into the fabless chamber, and a fourth task of the first handling component retracting.

[0084] The process of creating and executing a series of transport tasks by the first transport component to move the current wafer from the alignment module to the fabless chamber includes:

[0085] Create the first task, push the first task onto the transport task stack list, activate the transport task stack list, and execute the first task;

[0086] For any one of the second, third, and fourth tasks, after the previous task of any one task is completed, the task is created, pushed onto the transport task stack list, the transport task stack list is activated, and the task is executed.

[0087] Specifically, after activating the transport task stack list and completing the initial transport task for the current wafer, when creating and executing the aforementioned series of transport tasks, the first task can be created first, namely "the first transport component picks up the wafer from the alignment module". The first task is pushed onto the transport task stack list, the transport task stack list is activated, and the first task is executed. The execution condition for this first task is the existence of a waferless chamber or an empty chamber.

[0088] After the first task is completed, the second task will be created, namely "aligning the first transport component with the fabless cavity". The second task will be pushed into the transport task stack list and activated to execute the second task.

[0089] After the second task is completed, the third task will be created, namely "the first transport component extends into the fabless cavity". The third task will be pushed into the transport task stack list and activated to execute the third task.

[0090] After the third task is completed, the fourth task, "retracting the first transport component", will be created and pushed into the transport task stack list. The transport task stack list will then be activated to execute the fourth task.

[0091] After the fourth task is completed, no new task will be created. You can directly reactivate the transport task stack list and execute the next task in the transport task stack list.

[0092] In this embodiment of the invention, by creating and pushing transport tasks into the transport task stack list in real time, and executing the transport tasks after activating the transport task stack list, the caching requirements of transport tasks can be reduced and the utilization rate of memory resources can be improved.

[0093] Based on the above embodiments, the wafer handling and scheduling method provided in this embodiment of the invention, wherein after controlling the second handling component to remove the wafer from the empty cavity that has completed the annealing process, the first handling component is controlled to transport any one of the aligned wafers to the empty cavity for annealing process, includes:

[0094] Create a fifth task for the second transport component to align with the empty chamber, push the fifth task into the transport task stack list, and create a first task for the first transport component to pick up the wafer from the alignment module, push the first task into the transport task stack list, activate the transport task stack list in sequence, and execute the first task and the fifth task.

[0095] After the fifth task is completed and the empty chamber is opened, the sixth task of the second transport component extending into the empty chamber, the seventh task of the second transport component retracting, the eighth task of the first transport component extending into the empty chamber, and the fourth task of the first transport component retracting are created and executed in sequence.

[0096] Specifically, after the second transport component removes the wafer from the empty chamber where the annealing process has been completed, the first transport component transports any wafer p that has completed the alignment process to the empty chamber for the annealing process. At this time, the first transport component has already transported any wafer p from the wafer cassette to the alignment module for alignment. At this time, any wafer p is still on the alignment module.

[0097] Since the wafers in the empty chambers that have completed the annealing process have not yet been removed, taking into account the "last-in, first-out" characteristic of the transport task stack list, it is necessary to first create the fifth task of aligning the second transport component with the empty chambers, push the fifth task into the transport task stack list, then create the first task of the first transport component to pick up the wafers from the alignment module, push the first task into the transport task stack list, and then activate the transport task stack list in sequence, executing the first task and the fifth task in turn. That is, the first transport component first picks up any wafer p from the alignment module, and then the second transport component aligns with the empty chambers.

[0098] After the fifth task is completed, the idle chamber will be notified to open. After the chamber opens, a sixth task will be created, with the second transport component extending into the idle chamber. The sixth task will be pushed into the transport task stack list, and then the transport task stack list will be activated to execute the sixth task.

[0099] After the sixth task is completed, the idle chamber places any wafer p onto the second transport component. After the action is completed, a seventh task is created to retract the second transport component, and the seventh task is pushed into the transport task stack list. Then the transport task stack list is activated to execute the seventh task.

[0100] After the seventh task is completed, create the eighth task by having the first transport component extend into the empty chamber, push the eighth task into the transport task stack list, and then activate the transport task stack list to execute the eighth task.

[0101] After the eighth task is completed, the idle chamber receives any wafer p. After the action is completed, the fourth task is created by retracting the first transport component and pushed into the transport task stack list. Then the transport task stack list is activated and the fourth task is executed.

[0102] After the fourth task is completed, the wafers taken out by the second transport component have not yet been transported. Therefore, a cooling transport task can be created to transport the wafers taken out by the second transport component to an idle position on the cooling module. This cooling transport task is then pushed into the transport task stack list, the transport task stack list is activated, and the previously pushed cooling transport task is executed, so that the cooling module can cool the wafers that have just been transported to it.

[0103] Once the cooling-off transport task is completed, no new task will be created. The transport task stack list will be reactivated immediately, and the next task in the transport task stack list will be executed.

[0104] In this embodiment of the invention, a wafer handling schedule with an empty cavity is provided. First, the second handling component retrieves the wafer from the empty cavity, and then the first handling component transports the aligned wafer to the empty cavity for annealing. The first and second handling components work together to further save the time required for wafer handling and improve wafer handling efficiency.

[0105] Based on the above embodiments, the wafer handling scheduling method provided in this embodiment of the invention has handling tasks in the handling task stack list having priorities, and the priorities of the sixth task and the seventh task, as well as the priorities of the third task, the fourth task and the eighth task, are all higher than the other handling tasks in the handling task stack list.

[0106] Specifically, since the various handling tasks in the handling task stack list may be created simultaneously after several loops, it is necessary to set the priority of the handling tasks pushed into the handling task stack list. When selecting the next handling task, tasks related to picking up and placing wafers in the chamber should be given priority, while tasks that return wafers to the wafer cassette can be performed when the handling device is idle. This can maximize the utilization of the time when the wafers are annealed in the chamber.

[0107] Based on the above embodiments, the wafer handling and scheduling method provided in this embodiment of the invention, wherein controlling the second handling component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling treatment includes:

[0108] The occupancy status of the first and second transport components is collected in real time.

[0109] If both the first and second transport components are unoccupied, then based on the position information of the wafer that has completed the cooling process in the wafer cassette, the first transport component is controlled to place the wafer that has completed the cooling process back into the wafer cassette.

[0110] Specifically, in this embodiment of the invention, when controlling the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling, the occupancy status of the first transport component and the second transport component can be collected in real time. The occupancy status of the first transport component and the second transport component refers to whether they are performing the transport task of transporting the wafer.

[0111] If both the first and second transport components are in an unoccupied state, meaning neither is transporting wafers, then the position information of the cooled wafers in the wafer cassette can be used to control the first transport component to return the cooled wafers to their corresponding positions in the wafer cassette.

[0112] In this embodiment of the invention, by simultaneously determining whether the first transport component and the second transport component are occupied, the occupied state of the second transport component can be prevented from affecting the transport of the wafer by the first transport component, so that the wafer can be quickly returned to the corresponding position in the wafer cassette.

[0113] Based on the above embodiments, the wafer handling and scheduling method provided in this embodiment of the invention, wherein the first handling component is controlled to return the cooled wafer to the wafer cassette based on the position information of the wafer in the cassette after cooling treatment, includes:

[0114] After the cooling module completes the cooling process, it creates the first transport component to place the cooled wafer back into the wafer cassette as the ninth task, and pushes the ninth task into the transport task stack list.

[0115] If both the first and second transport components are unoccupied, the transport task stack list is activated, and the ninth task is executed.

[0116] Specifically, after the cooling module completes the cooling process, a ninth task can be created by the first transport component to place the cooled wafer back into the wafer cassette, and this ninth task is pushed into the transport task stack list. This ninth task has the lowest priority and will only be executed if both the first and second transport components are unoccupied; that is, the transport task stack list will be activated and the ninth task will be executed only at this time.

[0117] Once the computer determines that all wafers requiring annealing have been returned from the wafer cassette, the laser annealing equipment completes its current processing task. At this point, all handling tasks in the handling task stack list are complete, and the handling task stack list is cleared.

[0118] For multi-chamber laser annealing equipment, when a problem occurs in one chamber, stopping the annealing process and triggering an alarm, the entire laser annealing equipment is usually shut down in a safety mode and cannot perform annealing again. However, since the chambers are independent of each other, if a problem occurs in only one chamber, causing other chambers to stop working as well, this will inevitably waste resources and damage the wafers in the chambers that are normally performing the annealing process, further causing adverse effects.

[0119] Based on the above embodiments, the wafer handling scheduling method provided in this embodiment of the invention further includes:

[0120] If an alarm signal of a preset level is received from any chamber, the state of that chamber is changed to unavailable, and annealing process is performed based on the remaining chambers of the laser annealing equipment.

[0121] Specifically, if any chamber of the laser annealing equipment alarms, it will send an alarm signal to the computer. The computer can determine whether the alarm signal sent by any chamber reaches the preset level. If it does not reach the preset level, it means that the alarm can be ignored and any chamber can work normally. If it reaches the preset level, it means that the alarm cannot be ignored and any chamber cannot work normally, but it will not affect the working status of the remaining chambers. That is, the remaining chambers can still work normally. Therefore, the laser annealing equipment does not need to be shut down and put into safe mode.

[0122] Furthermore, when the computer receives an alarm signal of a preset level from any chamber, it can modify the state of that chamber to unavailable, prevent the creation of any handling task related to that chamber, and utilize the remaining chambers of the laser annealing equipment for annealing process.

[0123] In this embodiment of the invention, after receiving an alarm signal of a preset level from any chamber in the laser annealing equipment, its status is directly changed to unavailable, and the remaining chambers are used for annealing. This can further maximize the utilization of resources, avoid damage to the wafers in the chambers that are normally undergoing annealing, and reduce the impact on equipment yield.

[0124] Based on the above embodiments, such as Figure 3 The diagram shown is a timing diagram of the wafer handling scheduling method provided in an embodiment of the present invention, taking the handling process of 5 wafers in a dual-chamber laser annealing equipment as an example. Figure 3 The process only continues until the first wafer is returned to the wafer cassette; the handling of the remaining wafers is basically similar.

[0125] The execution process of the wafer handling scheduling method provided in the embodiments of the present invention will be described in detail below with reference to timing diagrams.

[0126] After the on-site operator creates a laser annealing task for five wafers, the computer creates an initial handling task for the five wafers, pushes it into the handling task stack list, and activates the handling task stack list to start executing the initial handling task for the first wafer.

[0127] 1) Execute the first task in the transport task stack list, namely the task "First transport component removes the first wafer from the wafer cassette and places it on the alignment module". The alignment module performs alignment processing on the first wafer. After the alignment processing is completed, create the task "First transport component retrieves wafer from the alignment module" and add it to the transport task stack list.

[0128] 2) Execute the next task in the transport task stack list, namely task "First transport component picks up wafer from alignment module". After the task is completed, create and execute the task "First transport component aligns with chamber 1". After the task is completed, notify chamber 1 to open. After chamber 1 opens, create and execute the task "First transport component extends into chamber 1". After the task is completed, chamber 1 receives the first wafer, and creates and executes the task "First transport component retracts", then manually removes it from chamber 1. After the task is completed, chamber 1 closes and begins the annealing process for the first wafer.

[0129] 3) Execute the next task in the transport task stack list, namely the task "The first transport component removes the second wafer from the wafer cassette and places it on the alignment module". The alignment module performs alignment processing on the second wafer. After the alignment processing is completed, create the task "The first transport component retrieves the wafer from the alignment module" and add it to the transport task stack list.

[0130] 4) Execute the next task in the transport task stack list, namely task "First transport component picks up wafer from alignment module". After the task is completed, create and execute the task "First transport component aligns with chamber 2". After the task is completed, notify chamber 2 to open. After chamber 2 opens, create and execute the task "First transport component extends into chamber 2". After the task is completed, chamber 2 receives the second wafer, and creates and executes the task "First transport component withdraws from chamber 2". After the task is completed, chamber 2 closes and begins the annealing process for the second wafer.

[0131] 5) Execute the next task in the transport task stack list, namely the task "The first transport component removes the third wafer from the wafer cassette and places it on the alignment module". The alignment module performs alignment processing on the third wafer.

[0132] 6) At this time, there are wafers in the alignment module, chamber 1 and chamber 2, and there is no next task that can be executed in the transport task stack list (none of them meet the execution conditions). The first transport component and the second transport component are both idle.

[0133] 7) After the annealing process is completed in chamber 1, the task "First transport component picks up wafer from alignment module" is created. After the first transport component completes its task, the task "Second transport component aligns with chamber 1" is created and executed. After the task is completed, chamber 1 opens. After the door opens, the task "Second transport component extends into chamber 1" is created and executed. After the task is completed, chamber 1 places the first wafer onto the second transport component, and the task "Second transport component withdraws from chamber 1" is created and executed. After the task is completed, the task "First transport component aligns with chamber 1" is created and executed. After the task is completed, the task "First transport component extends into chamber 1" is created and executed. After the task is completed, chamber 1 receives the third wafer, and the task "First transport component withdraws from chamber 1" is created and executed. After the task is completed, chamber 1 closes and begins the annealing process for the third wafer. At the same time, the task "Second transport component places the first wafer into the idle position of the cooling module" is created and executed.

[0134] 8) Execute the next task in the transport task stack list, namely the task "The first transport component removes the fourth wafer from the wafer cassette and places it on the alignment module", and perform alignment processing on the fourth wafer.

[0135] 9) At this time, the alignment module, chamber 1, chamber 2 and cooling module all have wafers, and there is no next task that can be executed in the transport task stack list (none of them meet the execution conditions). The first transport component and the second transport component are both idle.

[0136] 10) After the annealing process is completed in chamber 2, the task "First transport component picks up wafer from alignment module" is created. After the first transport component completes its task, the task "Second transport component aligns with chamber 2" is created and executed. After the task is completed, chamber 2 opens. After the door opens, the task "Second transport component extends into chamber 2" is created and executed. After the task is completed, chamber 2 places the second wafer on the second transport component, and the task "Second transport component withdraws from chamber 2" is created and executed. After the task is completed, the task "First transport component aligns with chamber 2" is created and executed. After the task is completed, the task "First transport component extends into chamber 2" is created and executed. After the task is completed, chamber 2 receives the fourth wafer, and the task "First transport component withdraws from chamber 2" is created and executed. After the task is completed, the chamber closes and begins the annealing process for the fourth wafer. At the same time, the task "Second transport component places the second wafer into the idle position of the cooling module" is created and executed. At this time, there are two wafers on the cooling module performing cooling tasks.

[0137] 11) Execute the next task in the transport task stack list, namely the task "The first transport component removes the fifth wafer from the wafer cassette and places it on the alignment module", and perform alignment processing on the fifth wafer.

[0138] 12) At this point, the alignment module, chamber 1, chamber 2, and cooling module all contain wafers, with the cooling module containing two wafers. If the first wafer has already been cooled, the task "The first transport component takes the wafer from the cooling module and puts it back into the corresponding position in the wafer cassette" will appear in the transport task stack list.

[0139] 13) Execute the next task in the handling task stack list, namely the task "The first handling component takes the first wafer from the cooling module and puts it back into the corresponding position in the wafer cassette". After the task is completed, the first handling component is idle.

[0140] 14) After the annealing process of the third wafer is completed in chamber 1, step 7) is repeated. At this time, the fifth wafer will be placed in chamber 1 for annealing, and the third wafer will be placed in the cooling module for cooling.

[0141] 15) After the fourth wafer is removed from the chamber 2, the second half of step 10) will be repeated to remove the fourth wafer and place it into the cooling module.

[0142] 16) At this point, the second and third wafers in the cooling module have been cooled. The second and third wafers will be taken out of the cooling module and put back into their corresponding positions in the wafer cassette.

[0143] 17) After the fifth wafer is removed from the chamber 1, repeat step 7) to remove the fifth wafer and place it into the cooling module.

[0144] 18) At this point, there are only two wafers on the cooling module. After the two wafers have cooled down, the task "The first transport component takes the wafers from the cooling module and puts them back into the corresponding positions in the wafer cassette" will be executed in sequence.

[0145] The above process describes in detail the handling and scheduling process of laser annealing equipment for processing five wafers. This process is quite representative. For other wafer handling and scheduling processes that are not for five wafers, it is simply a matter of reducing some steps or adding some repetitive steps based on this process.

[0146] In summary, the wafer handling scheduling method provided in this embodiment of the invention utilizes a computer program to automatically select the optimal handling task based on the task status in the handling task list in real time, maximizing the utilization of laser annealing equipment resources. Among these, the chamber process handling task is the most important and time-consuming, and therefore has the highest priority and is executed first. Other tasks can be executed opportunistically during the wafer processing. This method enables the laser annealing equipment to handle as many wafers as possible, significantly improving its throughput.

[0147] like Figure 4 As shown, based on the above embodiments, this embodiment of the invention provides a wafer handling and scheduling device, including:

[0148] The first scheduling module 41 is used to determine the multiple wafers in the wafer cassette that need to undergo annealing process, and control the first transport component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing process.

[0149] The second scheduling module 42 is used to control the first transport component to transport any remaining wafer from the wafer cassette to the alignment module for alignment processing, and after controlling the second transport component to remove the wafer from the empty chamber that has completed the annealing process, control the first transport component to transport the aligned wafer to the empty chamber for annealing processing, and control the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing.

[0150] Based on the above embodiments, the wafer handling and scheduling device provided in this embodiment of the invention, wherein the first scheduling module is specifically used for:

[0151] Construct a stack list of transport tasks for the multiple wafers; the stack list includes an initial transport task that transports each wafer from the wafer cassette to the alignment module based on the first transport component;

[0152] The transport task stack list is activated, and the initial transport task of each wafer is executed sequentially. After the initial transport task of the current wafer is completed and the current wafer is aligned, a series of transport tasks are created and executed by the first transport component to transport the current wafer from the alignment module to the fabless chamber in the different chambers.

[0153] Based on the above embodiments, the wafer handling scheduling device provided in this embodiment of the invention includes a series of handling tasks in sequence, namely, a first task of the first handling component taking a wafer from the alignment module, a second task of the first handling component aligning with the fabless chamber, a third task of the first handling component extending into the fabless chamber, and a fourth task of the first handling component retracting.

[0154] The first scheduling module is specifically used for:

[0155] Create the first task, push the first task onto the transport task stack list, activate the transport task stack list, and execute the first task;

[0156] For any one of the second, third, and fourth tasks, after the previous task of any one task is completed, the task is created, pushed onto the transport task stack list, the transport task stack list is activated, and the task is executed.

[0157] Based on the above embodiments, the wafer handling and scheduling device provided in this embodiment of the invention, wherein the second scheduling module is specifically used for:

[0158] Create a fifth task for the second transport component to align with the empty chamber, push the fifth task into the transport task stack list, and create a first task for the first transport component to pick up the wafer from the alignment module, push the first task into the transport task stack list, activate the transport task stack list in sequence, and execute the first task and the fifth task.

[0159] After the fifth task is completed and the empty chamber is opened, the sixth task of the second transport component extending into the empty chamber, the seventh task of the second transport component retracting, the eighth task of the first transport component extending into the empty chamber, and the fourth task of the first transport component retracting are created and executed in sequence.

[0160] Based on the above embodiments, in the wafer handling scheduling device provided in this embodiment of the invention, the handling tasks in the handling task stack list have priorities, and the priorities of the sixth task and the seventh task, as well as the priorities of the third task, the fourth task and the eighth task, are all higher than the priorities of other handling tasks in the handling task stack list.

[0161] Based on the above embodiments, the wafer handling and scheduling device provided in this embodiment of the invention, wherein the second scheduling module is specifically used for:

[0162] The occupancy status of the first and second transport components is collected in real time.

[0163] If both the first and second transport components are unoccupied, then based on the position information of the wafer that has completed the cooling process in the wafer cassette, the first transport component is controlled to place the wafer that has completed the cooling process back into the wafer cassette.

[0164] Based on the above embodiments, the wafer handling and scheduling device provided in this embodiment of the invention, wherein the second scheduling module is specifically used for:

[0165] After the cooling module completes the cooling process, it creates the first transport component to place the cooled wafer back into the wafer cassette as the ninth task, and pushes the ninth task into the transport task stack list.

[0166] If both the first and second transport components are unoccupied, the transport task stack list is activated, and the ninth task is executed.

[0167] Based on the above embodiments, the wafer handling and scheduling device provided in this embodiment of the invention further includes a state modification module, used for:

[0168] If an alarm signal of a preset level is received from any chamber, the state of that chamber is changed to unavailable, and annealing process is performed based on the remaining chambers of the laser annealing equipment.

[0169] Specifically, the functions of each module in the wafer handling and scheduling device provided in this embodiment of the invention correspond one-to-one with the operation flow of each step in the above method-like embodiments, and the achieved effects are also the same. For details, please refer to the above embodiments, and this will not be repeated in this embodiment of the invention.

[0170] Figure 5 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 5 As shown, the electronic device may include: a processor 510, a communication interface 520, a memory 530, and a communication bus 540, wherein the processor 510, the communication interface 520, and the memory 530 communicate with each other through the communication bus 540. The processor 510 can call logic instructions in the memory 530 to execute the wafer handling scheduling method provided in the above embodiments. The method includes: determining multiple wafers in the wafer cassette that need to undergo annealing, and controlling a first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing. For any remaining wafer among the multiple wafers, the first handling component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment. After the second handling component removes the wafer from the empty chamber where the annealing process has been completed, the first handling component is controlled to transport the aligned wafer to the empty chamber for annealing. The second handling component is then controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling.

[0171] Furthermore, the logical instructions in the aforementioned memory 530 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0172] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the wafer handling scheduling method provided in the above embodiments. The method includes: determining multiple wafers in a wafer cassette that need to undergo annealing, and controlling a first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of a laser annealing equipment. After alignment processing by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing. For any remaining wafer among the multiple wafers, the first handling component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment processing. After controlling a second handling component to remove the wafer from an empty chamber that has undergone annealing, the first handling component is controlled to transport the aligned wafer to the empty chamber for annealing. The second handling component is then controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling.

[0173] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon. When executed by a processor, the computer program is implemented to perform the wafer handling scheduling method provided in the above embodiments. The method includes: determining multiple wafers in a wafer cassette that need to undergo annealing processing, and controlling a first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of a laser annealing equipment. After alignment processing by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing processing. For any remaining wafer among the multiple wafers, the first handling component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment processing. After controlling a second handling component to remove a wafer from an empty chamber that has undergone annealing processing, the first handling component is controlled to transport the aligned wafer to the empty chamber for annealing processing. The second handling component is then controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing.

[0174] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0175] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0176] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer handling and scheduling method, characterized in that, include: The system identifies multiple wafers in the wafer cassette that require annealing and controls the first transport component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing. For any remaining wafer among the multiple wafers, the first transport component is controlled to transport the wafer from the wafer cassette to the alignment module for alignment processing. After the second transport component removes the wafer from the empty chamber that has completed the annealing process, the first transport component is controlled to transport the aligned wafer to the empty chamber for annealing processing. The second transport component is controlled to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing. The control of the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling includes: The occupancy status of the first and second transport components is collected in real time. If both the first and second transport components are unoccupied, then based on the position information of the wafer that has completed the cooling process in the wafer cassette, the first transport component is controlled to place the wafer that has completed the cooling process back into the wafer cassette.

2. The wafer handling and scheduling method according to claim 1, characterized in that, The first transport component controls the sequential transport of a preset number of wafers from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing processing, including: Construct a stack list of transport tasks for the multiple wafers; the stack list includes an initial transport task that transports each wafer from the wafer cassette to the alignment module based on the first transport component; The transport task stack list is activated, and the initial transport task of each wafer is executed sequentially. After the initial transport task of the current wafer is completed and the current wafer is aligned, a series of transport tasks are created and executed by the first transport component to transport the current wafer from the alignment module to the fabless chamber in the different chambers.

3. The wafer handling and scheduling method according to claim 2, characterized in that, The series of handling tasks sequentially includes a first task where the first handling component picks up a wafer from the alignment module, a second task where the first handling component aligns with the fabless chamber, a third task where the first handling component extends into the fabless chamber, and a fourth task where the first handling component retracts. The process of creating and executing a series of transport tasks by the first transport component to move the current wafer from the alignment module to the fabless chamber includes: Create the first task, push the first task onto the transport task stack list, activate the transport task stack list, and execute the first task; For any one of the second, third, and fourth tasks, after the previous task of any one task is completed, the task is created, pushed onto the transport task stack list, the transport task stack list is activated, and the task is executed.

4. The wafer handling and scheduling method according to claim 2, characterized in that, After the second transport component removes the wafer from the empty chamber where the annealing process has been completed, the first transport component transports any one of the aligned wafers to the empty chamber for annealing, including: Create a fifth task for the second transport component to align with the empty chamber, push the fifth task into the transport task stack list, and create a first task for the first transport component to pick up the wafer from the alignment module, push the first task into the transport task stack list, activate the transport task stack list in sequence, and execute the first task and the fifth task. After the fifth task is completed and the empty chamber is opened, the sixth task of the second transport component extending into the empty chamber, the seventh task of the second transport component retracting, the eighth task of the first transport component extending into the empty chamber, and the fourth task of the first transport component retracting are created and executed in sequence.

5. The wafer handling and scheduling method according to claim 4, characterized in that, The transport tasks in the transport task stack list have priorities, and the priorities of the sixth and seventh tasks, as well as the priorities of the fourth and eighth tasks, are all higher than the priorities of other transport tasks in the transport task stack list.

6. The wafer handling and scheduling method according to claim 1, characterized in that, The step of controlling the first transport component to return the cooled wafer to the wafer cassette based on the wafer's position information within the cassette includes: After the cooling module completes the cooling process, it creates the first transport component to place the cooled wafer back into the wafer cassette as the ninth task, and pushes the ninth task into the transport task stack list. If both the first and second transport components are unoccupied, the transport task stack list is activated, and the ninth task is executed.

7. The wafer handling and scheduling method according to any one of claims 1-6, characterized in that, Also includes: If an alarm signal of a preset level is received from any chamber, the state of that chamber is changed to unavailable, and annealing process is performed based on the remaining chambers of the laser annealing equipment.

8. A wafer handling and scheduling device, characterized in that, include: The first scheduling module is used to determine the multiple wafers in the wafer cassette that need to undergo annealing process, and control the first handling component to transport a preset number of wafers sequentially from the wafer cassette to the alignment module of the laser annealing equipment. After alignment by the alignment module, the wafers are transported to different chambers of the laser annealing equipment for annealing process. The second scheduling module is used to control the first transport component to transport any remaining wafer from the wafer cassette to the alignment module for alignment processing, and after controlling the second transport component to remove the wafer from the empty chamber that has completed the annealing process, control the first transport component to transport the aligned wafer to the empty chamber for annealing processing, and control the second transport component to transport the removed wafer to the cooling module of the laser annealing equipment for cooling processing. The second scheduling module is specifically used for: The occupancy status of the first and second transport components is collected in real time. If both the first and second transport components are unoccupied, then based on the position information of the wafer that has completed the cooling process in the wafer cassette, the first transport component is controlled to place the wafer that has completed the cooling process back into the wafer cassette.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the wafer handling scheduling method as described in any one of claims 1-7.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the wafer handling scheduling method as described in any one of claims 1-7.

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