A heat dissipation structure and a diode module

Abstract

The application discloses a heat dissipation structure, which comprises a heat dissipation seat and a heat conduction sheet. The heat conduction sheet comprises a supporting part and a heat conduction sheet body. The heat conduction sheet body is installed on the heat dissipation seat. The supporting part is protruded upward from the heat conduction sheet body. A circuit unit to be cooled is installed on the supporting part. A heat dissipation cavity is formed between the heat conduction sheet body and the circuit unit. A heat exchange opening is arranged on the heat dissipation seat. The heat exchange opening is adapted to communicate with the outside and the heat dissipation cavity. The heat generated by the circuit unit is adapted to be transmitted to the heat conduction sheet body through the supporting part. The circuit unit and the heat conduction sheet body can be cooled through the heat dissipation cavity. The application aims to provide a heat dissipation structure with good heat dissipation performance, small size and low manufacturing cost. The application also aims to provide a diode module with good heat dissipation performance, small size and low manufacturing cost.

Description

Technical Field

[0001] This application relates to the field of electronic components, and in particular to a heat dissipation structure and a diode module. Background Technology

[0002] With the development of technologies such as large silicon wafers in the photovoltaic module industry, module power is constantly increasing, which places higher demands on the current carrying capacity of circuit units (diode units in the photovoltaic field). Under high current, to ensure that the circuit units (diode units in the photovoltaic field) operate normally without burning out, it is necessary to improve the heat dissipation capacity of the package.

[0003] However, existing diode modules have poor heat dissipation performance, and their heat dissipation mechanisms are bulky, have poor heat dissipation performance, and are costly to manufacture, which are problems that those skilled in the art need to solve. Summary of the Invention

[0004] One objective of this application is to provide a heat dissipation structure with good heat dissipation performance, small size, and low manufacturing cost.

[0005] Another objective of this application is to provide a diode module with good heat dissipation performance, small size, and low manufacturing cost.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] A heat dissipation structure includes a heat sink base and a heat-conducting plate. The heat-conducting plate includes a support portion and a plate body. The plate body is mounted on the heat sink base. The support portion protrudes upward from the plate body. A circuit unit to be dissipated is mounted on the support portion. A heat dissipation cavity is formed between the plate body and the circuit unit. The heat sink base has a heat exchange port adapted to connect to the outside environment and the heat dissipation cavity. The heat generated by the circuit unit is adapted to be transferred to the plate body through the support portion. Both the circuit unit and the plate body can dissipate heat through the heat dissipation cavity. Notably, the heat-conducting plate, used for heat conduction, can be made of a metal sheet with good thermal conductivity, such as copper. Furthermore, the support portion and the plate body can be integrally formed by bending and stamping processes, or welded together by welding, thereby achieving heat transfer through thermal conduction. It is easy to understand that the fact that both the circuit unit and the heat-conducting plate body can dissipate heat through the heat dissipation cavity means that the heat generated by the circuit unit can be exchanged with the heat dissipation cavity through thermal radiation, the heat on the heat-conducting plate body can be exchanged with the heat dissipation cavity through thermal radiation, and the heat generated by the circuit unit can be transferred to the heat-conducting plate body through the support through thermal conduction.

[0008] Further research revealed that existing heat dissipation structures are unsuitable for diode modules. This is primarily due to the small size of diode modules, which cannot accommodate numerous heat dissipation components (such as heat sinks). Furthermore, cost considerations preclude the use of complex heat dissipation structures (such as water cooling or air cooling for accelerated cooling). Further investigation also found that these circuit units tend to generate significant heat at the chip mounting points. If this heat is not dissipated promptly, it can accumulate, leading to chip overheating and negatively impacting the performance and durability of the circuit units.

[0009] Accordingly, the inventors of this application have developed a heat dissipation structure. This structure uses a support portion on a heat-conducting plate to abut and support a circuit unit, thereby forming a heat dissipation cavity between the circuit unit and the heat-conducting plate body. This helps the circuit unit dissipate heat. The heat generated by the circuit unit can be directly exchanged with the heat dissipation cavity through thermal radiation, or it can be transferred to the support portion through thermal conduction, and then exchanged with the heat dissipation cavity through thermal radiation from the support portion. The combination of the support portion and the heat-conducting plate body distributes the heat concentrated on the circuit unit onto the heat-conducting plate body through thermal conduction, thereby increasing the heat dissipation effect by increasing the heat dissipation area. Furthermore, the structure of this application is simple, effective, and cost-efficient.

[0010] A diode module includes a housing, a diode unit, and a heat dissipation structure. The housing defines a receiving cavity, the heat dissipation structure is installed at the bottom of the receiving cavity, and the diode unit is installed at the top of the heat dissipation structure. The bottom of the housing is provided with a flow port communicating with the heat exchange port, and the heat dissipation cavity is connected to the outside through the heat exchange port and the flow port.

[0011] The housing effectively protects the diode unit from corrosion and deformation caused by changes in the external environment, preventing functional failure or malfunction of the circuit unit. Furthermore, the presence of a flow port on the housing, connecting to the heat exchange port, allows for sufficient heat exchange within the heat dissipation cavity, reducing its temperature and improving its cooling efficiency. This ultimately enhances the heat dissipation efficiency of the heat dissipation structure for the diode unit, meeting the requirements of the certification structure temperature test, enabling the passage of a larger rated current, and reducing the manufacturing cost of the diode module in this application.

[0012] Further preferably, the lower end face of the circuit unit includes a first temperature zone and a second temperature zone, the temperature of the first temperature zone is higher than that of the second temperature zone, the support portion is adapted to abut against the first temperature zone, the first temperature zone is adapted to dissipate heat through the heat-conducting sheet, and the second temperature zone is adapted to dissipate heat through the heat dissipation cavity.

[0013] Further preferably, the heat sink is made of insulating material, and the thermal conductivity of the heat sink is worse than that of the heat-conducting sheet. The heat sink includes an upper heat sink and a lower heat sink. The upper heat sink is installed on the upper part of the heat-conducting sheet body and covers the upper surface of the heat-conducting sheet body. The upper surface of the upper heat sink is lower than the support portion. The upper heat sink is provided with a first heat conduction port, and the heat-conducting sheet body is adapted to exchange heat with the heat dissipation cavity through the first heat conduction port. The lower heat sink is installed on the lower part of the heat-conducting sheet body and covers the lower surface of the heat-conducting sheet body. The heat-conducting sheet is adapted to be installed in the housing through the lower heat sink.

[0014] Further preferably, the lower heat sink is provided with a second heat conduction port, the lower part of the heat conduction plate body is adapted to exchange heat through the second heat conduction port, and the axes of the first heat conduction port and the second heat conduction port are coaxially arranged.

[0015] More preferably, the support portion is a sheet, and the upper end surface of the support portion abuts against the lower end surface of the circuit unit, and the support portion is elastically connected to the heat-conducting sheet body.

[0016] Further preferably, the lower part of the heat sink has an upwardly protruding mounting portion, the mounting portion having four sets arranged circumferentially, a limiting space defining the mounting portions, the package of the circuit unit being installed within the limiting space, and the sidewall of the mounting portion abutting against the package, the lower part of the heat sink having a vertically opened heat exchange port, the heat exchange port having two sets arranged on the left and right sides of the heat sink, and the heat exchange port communicating with the limiting space, while the limiting space communicating with the heat dissipation cavity.

[0017] More preferably, the heat-conducting sheet has two sets and is respectively disposed on the left and right sides of the heat sink. The heat-conducting sheet on the left and right sides extends in opposite directions to form an extension portion. The upper and lower end faces of the extension portion are respectively covered by the heat sink. The heat sink is made of insulating material. The thermal conductivity of the heat sink is worse than that of the heat-conducting sheet.

[0018] Further preferably, the heat-conducting sheet has two sets and is respectively disposed on the left and right sides of the heat sink. The heat-conducting sheets on the left and right sides are folded in opposite directions to form folded portions. The upper and lower end faces of the folded portions are respectively covered by the heat sink. The heat sink is made of insulating material. The thermal conductivity of the heat sink is worse than that of the heat-conducting sheet.

[0019] More preferably, the heat-conducting sheet has two sets and is respectively disposed on the left and right sides of the heat sink. The heat-conducting sheet on the left and right sides extends in opposite directions to form an extension portion, and the extension portion penetrates into the heat exchange port. The lower end face of the extension portion is separated from the heat sink and exchanges heat through the heat exchange port.

[0020] Compared with the prior art, the beneficial effects of this application are as follows:

[0021] (1) The inventors of this application have developed a heat dissipation structure in which a support portion on a heat-conducting plate abuts against and supports a circuit unit, thereby forming a heat dissipation cavity between the circuit unit and the heat-conducting plate body. This helps the circuit unit dissipate heat. The heat generated by the circuit unit can be directly exchanged with the heat dissipation cavity through thermal radiation, or it can be transferred to the support portion through thermal conduction, and then exchanged with the heat dissipation cavity through thermal radiation via the support portion. The combination of the support portion and the heat-conducting plate body can distribute the heat concentrated on the circuit unit onto the heat-conducting plate body through thermal conduction, thereby increasing the heat dissipation effect by increasing the heat dissipation area. Furthermore, the configuration of this application is simple in structure, effective, and low in cost.

[0022] (2) The housing can effectively protect the diode unit and prevent corrosion, deformation and other problems caused by changes in the external environment, which may lead to the failure or malfunction of the circuit unit. In addition, the flow port connected to the heat exchange port is installed on the housing to fully exchange heat with the heat dissipation cavity, thereby reducing the temperature of the heat dissipation cavity and improving the cooling efficiency of the heat dissipation cavity. Ultimately, this improves the heat dissipation efficiency of the heat dissipation structure for the diode unit, thereby meeting the purpose of the certification structure temperature test, enabling the passage of a larger rated current, and reducing the manufacturing cost of the diode module of this application. Attached Figure Description

[0023] Figure 1 The diagram shows a variety of different housings for the diode module of this application;

[0024] Figure 2 An exploded view of one embodiment of the diode module of this application shows the heat sink and the heat-conducting plate;

[0025] Figure 3 This is a cross-sectional view of one embodiment of the diode module of this application, showing the heat exchange port and the flow port;

[0026] Figure 4 This is one embodiment of the diode module of this application. Figure 3 A magnified view of the area at position A shows the upper and lower heat sinks;

[0027] Figure 5 This is a schematic diagram of one embodiment of the diode module of this application, showing a first heat-conducting port;

[0028] Figure 6 This is a cross-sectional view of one embodiment of the diode module of this application, showing the support portion and the heat-conducting sheet body;

[0029] Figure 7 This is a schematic diagram of a circuit unit of an embodiment of the diode module of this application, showing a first temperature zone and a second temperature zone;

[0030] Figure 8 This is a schematic diagram of a heat sink for one embodiment of the diode module of this application, showing the second heat conduction port;

[0031] Figure 9a An exploded view of Embodiment 4 of the heat dissipation structure of this application, showing the extension portion;

[0032] Figure 9b This is a cross-sectional view of Embodiment 4 of the heat dissipation structure of this application;

[0033] Figure 10a This is an exploded view of one embodiment of the heat dissipation structure of this application;

[0034] Figure 10b This is a cross-sectional view of a first embodiment of the heat dissipation structure of this application;

[0035] Figure 11a An exploded view of a second embodiment of the heat dissipation structure of this application, showing the extension portion;

[0036] Figure 11b This is a cross-sectional view of Embodiment 2 of the heat dissipation structure of this application;

[0037] Figure 12a An exploded view of Embodiment 3 of the heat dissipation structure of this application shows the folded portion;

[0038] Figure 12b This is a cross-sectional view of Embodiment 3 of the heat dissipation structure of this application;

[0039] Figure 13 This is a schematic diagram of the housing of one embodiment of the diode module of this application, showing the flow port.

[0040] In the figure: 1. Heat sink; 11. Upper heat sink; 111. First heat conduction port; 12. Lower heat sink; 121. Second heat conduction port; 122. Snap-fit ​​part; 13. Heat exchange port; 14. Mounting part; 15. Limiting space; 2. Heat conduction sheet; 21. Heat conduction sheet body; 22. Support part; 23. Extension part; 24. Folding part; 3. Heat dissipation cavity; 4. Housing; 41. Receiving cavity; 42. Flow port; 100. Heat dissipation structure; 200. Circuit unit; 201. First temperature zone; 202. Second temperature zone; 203. Diode unit; 204. Package. Detailed Implementation

[0041] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0042] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0043] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0044] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0045] Further investigation revealed that the existing heat dissipation structure 100 is unsuitable for diode modules. This is primarily due to the small size of diode modules, which cannot accommodate a large number of heat dissipation components (such as heat sinks). Furthermore, cost considerations preclude the use of complex heat dissipation structures (such as water cooling or air cooling for accelerated cooling). Further research also found that these circuit units 200 tend to generate significant heat at the chip mounting points. If this heat is not dissipated promptly, it can accumulate, leading to chip overheating and negatively impacting the performance and durability of the circuit unit 200.

[0046] Therefore, the inventors of this application have developed a heat dissipation structure 100, such as... Figures 1 to 13As shown, the device includes a heat sink 1 and a heat-conducting plate 2. The heat-conducting plate 2 includes a support portion 22 and a heat-conducting plate body 21. The heat-conducting plate body 21 is mounted on the heat sink 1. The support portion 22 protrudes upward from the heat-conducting plate body 21, and a circuit unit 200 to be cooled is mounted on the support portion 22. A heat dissipation cavity 3 is formed between the heat-conducting plate body 21 and the circuit unit 200. The heat sink 1 is provided with a heat exchange port 13, which is suitable for connecting the outside world to the heat dissipation cavity 3. The heat generated by the circuit unit 200 is suitable for being transferred to the heat-conducting plate body 21 through the support portion 22. Both the circuit unit 200 and the heat-conducting plate body 21 can dissipate heat through the heat dissipation cavity 3. It is worth mentioning that the heat-conducting plate 2 is used to conduct heat and can be a metal sheet with good thermal conductivity, such as a copper sheet. In addition, the support portion 22 and the heat-conducting plate body 21 can be integrally formed by bending and stamping processes, or they can be welded together by welding or other methods, thereby achieving heat transfer through thermal conduction. It is easy to understand that the fact that both the circuit unit 200 and the heat-conducting plate body 21 can dissipate heat through the heat dissipation cavity 3 means that the heat generated by the circuit unit 200 can be exchanged with the heat dissipation cavity 3 through thermal radiation, the heat on the heat-conducting plate body 21 can be exchanged with the heat dissipation cavity 3 through thermal radiation, and the heat generated by the circuit unit 200 can be transferred to the heat-conducting plate body 21 through the support part 22 through thermal conduction.

[0047] The inventors of this application have developed a heat dissipation structure 100, which uses a support portion 22 on a heat-conducting plate 2 to abut and support a circuit unit 200, thereby forming a heat dissipation cavity 3 between the circuit unit 200 and the heat-conducting plate body 21. This helps the circuit unit 200 dissipate heat. The heat generated by the circuit unit 200 can be directly exchanged with the heat dissipation cavity 3 through thermal radiation, or it can be transferred to the support portion 22 through thermal conduction, and then exchanged with the heat dissipation cavity 3 through the support portion 22 using thermal radiation. By setting the support portion 22 and the heat-conducting plate body 21, the heat generated concentrated on the circuit unit 200 can be distributed on the heat-conducting plate body 21 through thermal conduction, thereby increasing the heat dissipation effect by increasing the heat dissipation area. Furthermore, the arrangement of this application is simple in structure, effective, and lower in cost.

[0048] A diode module, such as Figure 3 , Figure 4 and Figure 13 As shown, the device includes a housing 4, a diode unit 203, and a heat dissipation structure 100. The housing 4 defines a receiving cavity 41. The heat dissipation structure 100 is installed at the bottom of the receiving cavity 41, and the diode unit 203 is installed at the top of the heat dissipation structure 100. The bottom of the housing 4 is provided with a flow port 42 that connects to the heat exchange port 13. The heat dissipation cavity 3 is connected to the outside through the heat exchange port 13 and the flow port 42.

[0049] In another preferred embodiment, such as Figure 8 As shown, the lower part of the heat sink 1 has a protruding latch 122. The latch 122 and the side wall of the flow port 42 can be fastened together, thereby realizing the detachable connection between the heat sink 1 and the housing 4, which facilitates the replacement of the heat sink 1.

[0050] The housing 4 effectively protects the diode unit 203 from corrosion, deformation, and other problems caused by changes in the external environment, which could lead to malfunction or failure of the circuit unit 200. Furthermore, the housing 4 has a flow port 42 connecting to the heat exchange port 13, which allows for sufficient heat exchange with the heat dissipation cavity 3, thereby reducing its temperature and improving its cooling efficiency. This ultimately enhances the heat dissipation efficiency of the heat dissipation structure 100 on the diode unit 203, meeting the requirements of the certification structure temperature test, enabling the passage of a larger rated current, and reducing the manufacturing cost of the diode module in this application.

[0051] Further optimization, such as Figure 7 As shown, the lower end face of the circuit unit 200 includes a first temperature zone 201 and a second temperature zone 202. The temperature of the first temperature zone 201 is higher than that of the second temperature zone 202. The support portion 22 is adapted to abut against the first temperature zone 201. The first temperature zone 201 is adapted to dissipate heat through the heat-conducting sheet 2, and the second temperature zone 202 is adapted to dissipate heat through the heat dissipation cavity 3.

[0052] For the entire circuit unit 200, the heat generation at different locations is different, so the heat dissipation capacity required for different areas is significantly different. However, due to the limited size of the diode module, it is impossible to accommodate many heat dissipation components. Therefore, by setting a first temperature zone 201 and a second temperature zone 202 on the lower end face of the circuit unit 200, the support portion 22 is made to contact the first temperature zone 201 with a higher temperature, thereby strengthening the heat dissipation capacity of the first temperature zone 201 and reducing its temperature, thus increasing the overall heat dissipation of the entire circuit unit 200. Since the heat generation at different locations of the circuit unit 200 (in this specific embodiment, it refers to the diode unit 203) is different, setting heat dissipation units at each location would increase the volume of the heat dissipation structure 100 and increase manufacturing costs. However, the heat dissipation structure 100 of this application, by setting the support portion 22 and forming a heat dissipation cavity 3, not only enhances the heat dissipation of the first temperature zone 201 with a higher temperature on the circuit unit 200 through heat conduction, but also dissipates heat from the second temperature zone 202 through the heat dissipation cavity 3, thereby further increasing the heat dissipation capacity of the heat dissipation structure 100 of this application.

[0053] Further optimization, such as Figure 4As shown, the heat sink 1 is made of insulating material, and the thermal conductivity of the heat sink 1 is worse than that of the heat-conducting sheet 2. The heat sink 1 includes an upper heat sink 11 and a lower heat sink 12. The upper heat sink 11 is installed on the upper part of the heat-conducting sheet body 21 and covers the upper surface of the heat-conducting sheet body 21. The upper surface of the upper heat sink 11 is lower than the support part 22. The upper heat sink 11 is provided with a first heat conduction port 111. The heat-conducting sheet body 21 is adapted to exchange heat with the heat dissipation cavity 3 through the first heat conduction port 111. The lower heat sink 12 is installed on the lower part of the heat-conducting sheet body 21 and covers the lower surface of the heat-conducting sheet body 21. The heat-conducting sheet 2 is adapted to be installed in the housing 4 through the lower heat sink 12. It is worth mentioning that the heat sink 1 is made of insulating material, and the thermal conductivity of the heat sink 1 is worse than that of the heat-conducting sheet 2. In this specific embodiment, the heat sink 1 can be made of plastic material, the heat-conducting sheet 2 can be made of copper sheet, and the upper heat sink 11, the lower heat sink 12, and the heat-conducting sheet 2 can be produced by injection molding insert process (i.e., insert molding process). It is also worth mentioning that setting the upper surface of the upper heat sink 11 lower than the support part 22 makes it easier to form a heat dissipation cavity 3 between the heat-conducting sheet body 21 and the circuit unit 200.

[0054] The arrangement of an upper heat sink 11 and a lower heat sink 12, with the upper heat sink 11 covering the upper surface of the heat-conducting plate 2 and the lower heat sink 12 covering the lower surface of the heat-conducting plate 2, offers three advantages: First, by using heat sinks 1 made of insulating material, with the upper heat sink 11 covering the upper surface of the heat-conducting plate 2 and the lower heat sink 12 covering the lower surface of the heat-conducting plate 2, the insulation performance between the circuit unit 200 and the heat-conducting plate 2 is increased, preventing leakage and improving creepage performance detection. Second, the arrangement of the upper heat sink 11 and the lower heat sink 12 facilitates modular production; the same heat sink 1 can be used for different diode modules, eliminating the need for assembly of the heat-conducting plate 2 and the housing 4. The installation process is simple: only the heat sink 1 and the housing 4 need to be installed. Thirdly, it limits the heat dissipation of the heat-conducting plate 2. Without limiting the heat-conducting plate 2, its good thermal conductivity would cause direct heat exchange between all parts of it and the heat dissipation cavity 3, leading to excessively high temperatures in the entire heat dissipation cavity 3, which would be detrimental to the overall heat dissipation of the circuit unit 200. By covering the heat-conducting plate 2 with the upper heat sink 11 and providing heat exchange ports 13 on the upper heat sink 11, the heat-conducting plate body 21 can only exchange heat with the heat dissipation cavity 3 through the heat exchange ports 13. This prevents excessive heat accumulation in the heat dissipation cavity 3 due to the good heat dissipation effect of the heat-conducting plate body 21, which would affect the heat dissipation of other parts of the circuit unit 200. In this specific embodiment, since the housing 4 cannot directly increase the heat dissipation between the heat dissipation cavity 3 and the outside environment through flowing air, it is necessary to control the temperature of the heat dissipation cavity 3 to prevent excessively high temperatures from causing the circuit unit 200 to be unable to dissipate heat through the heat dissipation cavity 3. (In this specific embodiment, although a flow port 42 is provided to dissipate heat between the heat dissipation cavity 3 and the outside, the air flow speed inside is relatively slow, which cannot achieve rapid heat dissipation of the heat dissipation cavity 3. Furthermore, if the air flows through rapidly, it may cause dust accumulation, affecting the stability and durability of the circuit unit 200.)

[0055] Further optimization, such as Figure 4 As shown, a second heat conduction port 121 is provided on the lower heat sink 12. The lower part of the heat conduction plate body 21 is adapted to exchange heat through the second heat conduction port 121, and the axes of the first heat conduction port 111 and the second heat conduction port 121 are coaxially arranged.

[0056] The coaxial arrangement of the first heat-conducting port 111 and the second heat-conducting port 121 facilitates the production of injection-molded inserts (i.e., the insert molding process). This allows for the use of fixing devices on the mold to secure the heat-conducting sheet 2 within the mold via the first and second heat-conducting ports 111 and 121, thus enabling the injection-molded insert process. Furthermore, the second heat-conducting port 121 increases heat conduction into the heat-conducting sheet body 21, further reducing its temperature. Since the second heat-conducting port 121 is not connected to the heat dissipation cavity 3, it does not increase the temperature of the heat dissipation cavity 3, preventing overheating and heat accumulation that could lead to a rapid decline in the heat dissipation performance of the circuit unit 200 after a period of use.

[0057] Further optimization, such as Figure 5 As shown, the support portion 22 is a sheet, and its upper end face abuts against the lower end face of the circuit unit 200. The support portion 22 is elastically connected to the heat-conducting sheet body 21. In this specific embodiment, the heat-conducting sheet 2 is made of copper, which has good thermal conductivity. The support portion 22 is a sheet, and the support portion 22 and the heat-conducting sheet body 21 can be integrally formed by bending and stamping processes, thereby achieving an elastic connection between the support portion 22 and the heat-conducting sheet body 21. By setting the circuit unit 200 and the housing 4 to be detachably connected by bolts, the relative position of the circuit unit 200 and the housing 4 in the vertical direction is fixed. In addition, since the upper part of the support portion 22 abuts against the circuit unit 200, the degree of elastic deformation between the support portion 22 and the heat-conducting sheet body 21 can be changed by changing the bolt tightening force, thereby changing the size of the heat dissipation cavity 3 and the magnitude of the contact force between the support portion 22 and the circuit unit 200, and achieving control of different heat dissipation performance.

[0058] Further optimization, such as Figures 10a to 12b As shown, the lower part of the heat sink 1 has an upwardly protruding mounting part 14. The mounting part 14 has four sets arranged around the perimeter. A limiting space 15 is defined between the mounting parts 14. The package 204 of the circuit unit 200 is installed in the limiting space 15, and the side wall of the mounting part 14 abuts against the package 204. The lower part of the heat sink 1 has a heat exchange port 13 in the vertical direction. The heat exchange port 13 has two sets arranged on the left and right sides of the heat sink 1, and the heat exchange port 13 is connected to the limiting space 15. At the same time, the limiting space 15 is connected to the heat dissipation cavity 3.

[0059] Since the chip is housed within the package 204, it is prone to generating significant heat. Providing heat exchange ports 13, with two sets positioned on the left and right sides of the heat sink 1 and connected to the limiting space 15, increases the heat dissipation performance within the limiting space 15. The mounting portion 14 restricts the displacement of the package 204, ensuring it remains completely fixed relative to the heat sink 1, thereby increasing the connection strength of the package 204.

[0060] First embodiment: as follows Figure 10a and Figure 10b As shown, the heat-conducting sheet 2 has two sets, respectively disposed on the left and right sides of the heat sink 1. The heat sink 1 encloses the heat-conducting sheet 2, and the heat sink 1 is provided with a first heat-conducting port 111 and a second heat-conducting port 121 for heat dissipation. The heat sink 1 is made of insulating material, and its thermal conductivity is inferior to that of the heat-conducting sheet 2. In this specific embodiment, the heat sink 1 is made of plastic material, and the heat-conducting sheet 2 is made of copper sheet. By setting the heat-conducting sheet 2 to have two sets, respectively disposed on the functional sides of the heat sink 1, the effective area of ​​the heat-conducting sheet body 21 for heat dissipation can be kept unchanged while reducing the overall volume of the heat-conducting sheet body 21 (compared to a one-piece molded heat-conducting sheet 2), thereby saving costs.

[0061] Second embodiment: as follows Figure 11a and Figure 11b As shown, the heat-conducting plates 2 are arranged in two sets on the left and right sides of the heat sink 1, respectively. The heat-conducting plates 2 on the left and right sides extend in opposite directions to form extensions 23. The upper and lower end faces of the extensions 23 respectively cover the heat sink 1, and the heat sink 1 is made of insulating material. The thermal conductivity of the heat sink 1 is inferior to that of the heat-conducting plates 2. In this specific embodiment, the heat sink 1 is made of plastic material, and the heat-conducting plates 2 are made of copper sheets. The extensions 23 increase the connection strength between the heat-conducting plates 2 and the heat sink 1, thus making the connection between them tighter.

[0062] Third embodiment: as follows Figure 12a and Figure 12b As shown, the heat-conducting sheet 2 has two sets, respectively disposed on the left and right sides of the heat sink 1. The heat-conducting sheets 2 on the left and right sides are folded in opposite directions to form folded portions 24. The upper and lower end faces of the folded portions 24 respectively cover the heat sink 1, and the heat sink 1 is made of insulating material. The thermal conductivity of the heat sink 1 is worse than that of the heat-conducting sheet 2. In this specific embodiment, the heat sink 1 is made of plastic material, and the heat-conducting sheet 2 is made of copper sheet. The folded portions 24 can further increase the connection strength between the heat-conducting sheet 2 and the heat sink 1, and the fact that the upper and lower end faces of the folded portions 24 respectively cover the heat sink 1 can further increase the connection strength.

[0063] Fourth embodiment: as Figure 9a and Figure 9b As shown, the heat-conducting plates 2 have two sets and are respectively disposed on the left and right sides of the heat sink 1. The heat-conducting plates 2 on the left and right sides extend in opposite directions to form extensions 23, and the extensions 23 penetrate into the heat exchange port 13. The lower end face of the extensions 23 is separated from the heat sink 1 and heat exchange occurs through the heat exchange port 13. In this specific embodiment, the heat sink 1 is made of plastic material, and the heat-conducting plates 2 are made of copper sheets. Figure 9b As shown, by inserting the extension portion 23 into the heat exchange port 13 and allowing the extension portion 23 to dissipate heat through the heat exchange port 13, the heat dissipation efficiency of the heat-conducting plate 2 is further improved, and the heat of the heat-conducting plate 2 is prevented from being directly released into the heat dissipation cavity 3, but instead exchanged with the outside through the heat exchange port 13.

[0064] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure, characterized in that: The device includes a heat sink and a heat-conducting plate. The heat-conducting plate includes a support portion and a heat-conducting plate body. The heat-conducting plate body is mounted on the heat sink. The support portion protrudes upward from the heat-conducting plate body. A circuit unit to be cooled is mounted on the support portion. A heat dissipation cavity is formed between the heat-conducting plate body and the circuit unit. The heat sink is provided with a heat exchange port, which is adapted to connect the outside to the heat dissipation cavity. The heat generated by the circuit unit is adapted to be transferred to the heat-conducting plate body through the support portion. Both the circuit unit and the heat-conducting plate body can dissipate heat through the heat dissipation cavity. The lower end face of the circuit unit includes a first temperature zone and a second temperature zone. The temperature of the first temperature zone is higher than that of the second temperature zone. The support portion is adapted to abut against the first temperature zone. The first temperature zone is adapted to dissipate heat through the heat-conducting sheet, and the second temperature zone is adapted to dissipate heat through the heat dissipation cavity. The heat sink is made of insulating material, and the thermal conductivity of the heat sink is worse than that of the heat-conducting sheet. The heat sink includes an upper heat sink and a lower heat sink. The upper heat sink is installed on the upper part of the heat-conducting sheet body and covers the upper surface of the heat-conducting sheet body. The upper surface of the upper heat sink is lower than the support part. The upper heat sink is provided with a first heat conduction port. The heat-conducting sheet body is adapted to exchange heat with the heat dissipation cavity through the first heat conduction port. The lower heat sink is installed at the lower part of the heat-conducting plate body and covers the lower surface of the heat-conducting plate body. The heat-conducting plate is adapted to be installed in the housing through the lower heat sink.

2. The heat dissipation structure as described in claim 1, characterized in that: The lower heat sink is provided with a second heat conduction port, and the lower part of the heat conduction plate body is adapted to exchange heat through the second heat conduction port, and the axes of the first heat conduction port and the second heat conduction port are coaxially arranged.

3. The heat dissipation structure as described in claim 1, characterized in that: The support portion is a sheet, and the upper end face of the support portion abuts against the lower end face of the circuit unit. The support portion is elastically connected to the heat-conducting sheet body.

4. The heat dissipation structure as described in claim 1, characterized in that: The lower part of the heat sink has an upwardly protruding mounting portion. The mounting portion has four sets arranged around the perimeter, and a limiting space is defined between the mounting portions. The package is installed in the limiting space, and the side wall of the mounting portion abuts against the package in the circuit unit. The lower part of the heat sink has a vertically opened heat exchange port. The heat exchange port has two sets arranged on the left and right sides of the heat sink, and the heat exchange port communicates with the limiting space. At the same time, the limiting space communicates with the heat dissipation cavity.

5. A heat dissipation structure as described in claim 4, characterized in that: The heat-conducting sheet has two sets and is respectively disposed on the left and right sides of the heat sink. The heat-conducting sheet on the left and right sides extends in opposite directions to form an extension. The upper and lower end faces of the extension are respectively covered by the heat sink. The heat sink is made of insulating material. The thermal conductivity of the heat sink is worse than that of the heat-conducting sheet.

6. A heat dissipation structure as described in claim 4, characterized in that: The heat-conducting sheet has two sets and is respectively disposed on the left and right sides of the heat sink. The heat-conducting sheet on the left and right sides is folded in opposite directions to form a folded part. The upper and lower end faces of the folded part are respectively covered by the heat sink. The heat sink is made of insulating material. The thermal conductivity of the heat sink is worse than that of the heat-conducting sheet.

7. A heat dissipation structure as described in claim 4, characterized in that: The heat-conducting plates are in two sets and are respectively disposed on the left and right sides of the heat sink. The heat-conducting plates on the left and right sides extend in opposite directions to form extensions, and the extensions penetrate into the heat exchange port. The lower end face of the extensions is separated from the heat sink and heat exchange is performed through the heat exchange port.

8. A diode module, characterized in that: The device includes a housing, a diode unit, and a heat dissipation structure as described in any one of claims 1 to 7. The housing defines a receiving cavity, the heat dissipation structure is installed at the bottom of the receiving cavity, and the diode unit is installed at the top of the heat dissipation structure. The bottom of the housing is provided with a flow port communicating with a heat exchange port, and the heat dissipation cavity is connected to the outside through the heat exchange port and the flow port.

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