Power module assembly, motor controller, and vehicle
By using an insulated phase change heat exchanger to exchange heat with the chip, combined with a double-sided heat dissipation method and epoxy resin encapsulation, the problem of reduced heat absorption effect of phase change materials is solved, improving the reliability and heat dissipation efficiency of power module components and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BYD CO LTD
- Filing Date
- 2022-05-31
- Publication Date
- 2026-06-12
Smart Images
Figure CN117219625B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductors, and in particular to a power module assembly, a motor controller, and a vehicle. Background Technology
[0002] In related technologies, vehicles are equipped with power processing modules. These modules contain chips, and to prevent chip overheating and failure, they are equipped with cooling structures. In existing technologies, power module components utilize phase change materials (PCMs) for heat absorption. PCMs have high latent heat, making them suitable for short-term heating. However, once the phase change process is complete, the heat absorption capacity of the PCM decreases significantly, leading to poor heat absorption and posing a significant risk to the use of the power module components. Summary of the Invention
[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a power module assembly. The power module assembly designed according to this invention can achieve reliable insulation while maximizing the area of the first and second phase conversion heat exchange elements, resulting in good heat dissipation and high reliability.
[0004] The present invention also proposes a motor controller having the above-mentioned power module components.
[0005] The present invention also proposes a vehicle having the above-mentioned motor controller.
[0006] The power module assembly according to the present invention includes: a chip layer, the chip layer including a substrate and a first chip and a second chip disposed on the substrate; a first phase change heat exchanger and a second phase change heat exchanger, wherein both the first phase change heat exchanger and the second phase change heat exchanger contain a phase change medium and absorb heat from the chip layer through a phase change; the first phase change heat exchanger exchanges heat with the first chip; the second phase change heat exchanger exchanges heat with the second chip; and the first phase change heat exchanger and the second phase change heat exchanger are insulated from each other.
[0007] In the power module assembly of the present invention, the first phase-changing heat exchanger exchanges heat with the first chip, and the second phase-changing heat exchanger exchanges heat with the second chip. The first and second phase-changing heat exchangers are insulated from each other to achieve insulation between the positive and negative poles. This can ensure that the area of the first and second phase-changing heat exchangers is maximized while achieving reliable insulation effect, resulting in good heat dissipation and high reliability of the power module assembly.
[0008] According to some embodiments of the present invention, the power module assembly further includes: a heat dissipation section, which contacts the chip layer and absorbs the temperature of the chip layer, and the side of the heat dissipation section opposite to the chip layer is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer.
[0009] According to some embodiments of the present invention, the power module assembly further includes: a support member disposed between the chip layer and the first phase change heat sink and / or the chip layer and the second phase change heat sink, the support member having a conductive surface adapted to be bonded to the first chip and / or the second chip, and the support member having a thermally conductive surface adapted to be bonded to the first phase change heat sink and / or the second phase change heat sink.
[0010] According to some embodiments of the present invention, the support member includes: a body portion having the heat-conducting surface formed thereon; a chip heat-transfer portion disposed on the body portion and extending toward the first chip and / or the second chip, the free end of the chip heat-transfer portion having the conductive surface formed thereon; and a support foot disposed on the body portion and extending toward the substrate, the free end of the support foot having a support surface in contact with the surface of the substrate.
[0011] According to some embodiments of the present invention, the support member is constructed as a plurality of supports and includes a first support member and a second support member. The first support member is supported between the substrate and the first phase change heat transfer element, and the second support member is supported between the substrate and the second phase change heat transfer element. At least one of the support members has multiple support feet, and the chip heat transfer part is disposed between two adjacent support feet.
[0012] According to some embodiments of the present invention, each of the support members is provided with a plurality of chip heat transfer parts, and each support member is provided corresponding to a plurality of first chips or a plurality of second chips.
[0013] According to some embodiments of the present invention, a wire harness channel is formed between the chip heat transfer section and the support foot at an interval.
[0014] According to some embodiments of the present invention, both the first phase change heat exchanger and the second phase change heat exchanger include: a phase change housing, wherein a phase change material receiving cavity for receiving the phase change material is formed in the phase change housing, and the phase change housing is in direct and / or indirect contact with the support member.
[0015] According to some embodiments of the present invention, an insulating plate is provided between two adjacent phase change housings, and the two phase change housings are respectively fixedly connected to the insulating plate.
[0016] According to some embodiments of the present invention, a heat-conducting part is provided inside the phase change material receiving cavity, the heat-conducting part is disposed on the inner wall of the phase change material receiving cavity and protrudes towards the interior of the phase change material receiving cavity.
[0017] According to some embodiments of the present invention, the heat-conducting part is configured as a heat-conducting needle, and the heat-conducting needle is configured as a plurality of needles extending from the side of the phase change material receiving cavity near the chip layer to away from the chip layer; and / or the heat-conducting part is configured as a heat-conducting plate formed inside the phase change material receiving cavity, the heat-conducting plate being disposed inside the phase change material receiving cavity and spaced apart from each other to form a heat dissipation channel.
[0018] According to some embodiments of the present invention, the heat dissipation part includes: a heat dissipation base plate, which exchanges heat with the chip layer; and heat dissipation fins, which are disposed on the heat dissipation base plate and extend in a direction away from the chip layer, and are adapted to contact with an external heat dissipation medium for heat exchange.
[0019] According to some embodiments of the present invention, the power module assembly further includes: a heat dissipation channel, the heat dissipation channel being fitted to the heat dissipation base plate and having a medium channel inside suitable for the flow of heat dissipation medium, the heat dissipation fins being housed within the medium channel.
[0020] According to some embodiments of the present invention, the power module assembly further includes: a molding compound layer covering the first phase change heat exchanger and the second phase change heat exchanger.
[0021] According to some embodiments of the present invention, the phase change medium is constructed as a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material.
[0022] The motor controller according to another embodiment of the present invention is briefly described below.
[0023] The motor controller according to the present invention includes the power module component described in any of the above embodiments. Since the motor controller according to the present invention is provided with the power module component described in the above embodiments, the motor controller integrates heat absorption by phase change material on one side and liquid cooling on the other side to perform double-sided heat dissipation of the chip layer, and the two heat dissipation methods do not affect each other.
[0024] The vehicle according to another embodiment of the present invention is briefly described below.
[0025] The vehicle according to the present invention includes the motor controller described in the above embodiments. Since the vehicle according to the present invention is equipped with the motor controller described in the above embodiments, the vehicle can meet the cooling requirements under normal operating conditions and solves the problem of the power module components heating up too quickly during short-term current surges, thereby improving vehicle safety.
[0026] In summary, the power module assembly of this invention integrates heat absorption by phase change material on one side and liquid cooling on the other side for double-sided heat dissipation of the chip layer. These two heat dissipation methods do not interfere with each other and work together to dissipate heat on both sides of the chip layer, greatly improving the heat dissipation effect of the power module assembly. The first phase-changing heat exchanger is connected to the first chip via a first support member, and the second phase-changing heat exchanger is connected to the second chip via a second support member. The support members enable circuit connection, and an insulating plate provides electrical isolation between the first and second phase-changing heat exchangers. This maximizes the area of the first and second phase-changing heat exchangers while achieving reliable insulation, improving the reliability of the power module assembly. The power module assembly is encapsulated using thermosetting plastics such as epoxy resin, reducing thermal resistance, achieving overall insulation of the power module assembly, and lowering production costs. The support members provide wiring harness channels to reserve wiring space, resulting in a simple structure and facilitating the rationalization of electrical circuitry.
[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0029] Figure 1 This is an external view of a power module assembly according to an embodiment of the present invention.
[0030] Figure 2 This is an internal structural diagram of a power module assembly according to an embodiment of the present invention.
[0031] Figure 3 This is a structural diagram of a phase change material according to an embodiment of the present invention.
[0032] Figure label:
[0033] Power module assembly 1; high voltage terminal 2; plastic encapsulation layer 3; low voltage terminal 4; heat dissipation fins 5; first chip 10; second chip 20; wire harness channel 44; heat dissipation base plate 51; first support member 61; second support member 62; upper metal layer 71; ceramic layer 72; lower metal layer 73; phase change housing 81; phase change material 82; insulating plate 83; first phase change heat exchanger 84; second phase change heat exchanger 85; sealing cover 86. Detailed Implementation
[0034] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0039] In related technologies, vehicles are equipped with power processing modules. These power module components contain chips, and to prevent chip overheating and failure, a cooling structure is incorporated. In existing technologies, power module components utilize phase change materials (PCMs) for heat absorption. PCMs have high latent heat, making them suitable for short-term heating. However, once the phase change process is complete, the heat absorption effect of the PCM decreases significantly, resulting in poor heat absorption. Furthermore, there is a short-circuit risk between the PCM and the chip, posing a significant risk to the use of the power module components.
[0040] The following is for reference. Figures 1-3 A power module component 1 according to an embodiment of the present invention is described.
[0041] like Figure 2 As shown, the power module assembly 1 according to the present invention includes: a chip layer, a first phase-change heat exchanger 84, and a second phase-change heat exchanger 85. The chip layer includes a substrate and a first chip 10 and a second chip 20 disposed on the substrate; both the first phase-change heat exchanger 84 and the second phase-change heat exchanger 85 are provided with a phase-change medium and absorb heat from the chip layer through phase change. The first phase-change heat exchanger 84 exchanges heat with the first chip 10, and the second phase-change heat exchanger 85 exchanges heat with the second chip 20. The first phase-change heat exchanger 84 and the second phase-change heat exchanger 85 are insulated from each other. Specifically, the first phase-change heat exchanger 84 can exchange heat with the first chip 10, and the second phase-change heat exchanger 85 can exchange heat with the second chip 20. The first phase-change heat exchanger 84 and the second phase-change heat exchanger 85 absorb heat from the chip layer through the phase change of the phase-change medium to reduce the temperature of the chip layer. When the first chip 10 and the second chip 20 are directly connected to the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85, since the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85 are conductive materials, there is a possibility that the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85 could be electrically connected, causing a short circuit between the positive and negative terminals of the first chip 10 and the second chip 20. To avoid this danger, the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85 are insulated to ensure the safe use of the power module assembly 1.
[0042] In the power module assembly 1 of the present invention, the first phase-conversion heat exchanger 84 exchanges heat with the first chip 10, and the second phase-conversion heat exchanger 85 exchanges heat with the second chip 20. The first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85 are insulated from each other to achieve insulation between the positive and negative poles. This can ensure that the area of the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85 is maximized while achieving a reliable insulation effect. The heat dissipation effect is good and the reliability of the power module assembly 1 is high.
[0043] According to some embodiments of the present invention, such as Figure 2As shown, the power module assembly 1 also includes a heat sink. The heat sink contacts the chip layer and absorbs the temperature of the chip layer. The side of the heat sink away from the chip layer is suitable for heat exchange with an external heat dissipation medium to reduce the temperature of the chip layer. Specifically, the heat sink reduces the temperature of the chip layer by exchanging heat with an external heat dissipation medium. The heat sink, together with the first phase-conversion heat sink 84 and the second phase-conversion heat sink 85, works together to cool the chip layer, thereby preventing the power module assembly 1 from malfunctioning due to high temperature. The cooling is rapid and effective, and it solves the problem of excessive temperature rise of the power module during short-term current surges. It is suitable for applications such as electric vehicle motor control.
[0044] According to some embodiments of the present invention, such as Figure 2 As shown, the power module assembly 1 also includes a support member. The support member is disposed between the chip layer and the first phase-change heat exchanger 84 and / or the chip layer and the second phase-change heat exchanger 85. The support member has conductive surfaces suitable for contact with the first chip 10 and / or the second chip 20, and thermally conductive surfaces suitable for contact with the first phase-change heat exchanger 84 and / or the second phase-change heat exchanger 85. Specifically, the support member can separate the chip layer from the first phase-change heat exchanger 84 and / or the second phase-change heat exchanger 85, wherein the conductive surfaces of the support member are in contact with the surfaces of the first chip 10 and / or the second chip 20, and the support member can transfer heat from the first chip 10 and / or the second chip 20 to the first phase-change heat exchanger 84 and / or the second phase-change heat exchanger 85 for chip cooling.
[0045] According to some embodiments of the present invention, such as Figure 2 As shown, the support member includes a body, a chip heat transfer section, and support feet. A heat-conducting surface is formed on the body; the chip heat transfer section is disposed on the body and extends toward the first chip 10 and / or the second chip 20, with a conductive surface formed at its free end; the support feet are disposed on the body and extend toward the substrate, with a support surface forming at their free end that contacts the substrate surface. Specifically, the heat-conducting surface of the body abuts against the first phase-change heat transfer element 84 and / or the second phase-change heat transfer element 85, and the support surface of the support feet contacts the substrate. The body and support feet can support the support member between the first phase-change heat transfer element 84 and the substrate, and / or between the second phase-change heat transfer element 85 and the substrate. The conductive surface of the chip heat transfer section contacts the chip to conduct heat from the first chip 10 to the first insulating plate 83 and / or heat from the second chip 20 to the second insulating plate 83, thereby achieving heat dissipation of the chip layer.
[0046] According to some embodiments of the present invention, such as Figure 2As shown, the support structure comprises multiple components, including a first support 61 and a second support 62. The first support 61 is supported between the substrate and the first phase-change heat exchanger 84, and the second support 62 is supported between the substrate and the second phase-change heat exchanger 85. At least one support component has multiple support feet, and a chip heat transfer portion is disposed between two adjacent support feet. Specifically, the first support 61 is supported between the substrate and the first phase-change heat exchanger 84 to separate the first chip 10 from the first phase-change heat exchanger 84 and conduct heat. The second support 62 is supported between the substrate and the second phase-change heat exchanger 85 to separate the second chip 20 from the second phase-change heat exchanger 85 and conduct heat. The support components have multiple support feet to define the mounting positions of the first chip 10 or the second chip 20, and the chip heat transfer portion is disposed between two adjacent support feet to contact and conduct heat with the first chip 10 or the second chip 20.
[0047] According to some embodiments of the present invention, such as Figure 2 As shown, each support member is provided with multiple chip heat transfer sections, and each support member is correspondingly arranged with multiple first chips 10 or multiple second chips 20. Specifically, the multiple support members respectively contact their respective first chips 10 or second chips 20 to transfer heat to the first phase change heat transfer element 84 or the second phase change heat transfer element 85, thereby achieving efficient cooling of the power module component 1 that experiences short-term temperature rise.
[0048] According to some embodiments of the present invention, such as Figure 2 As shown, a wiring harness channel 44 is formed between the chip heat transfer section and the support foot. Specifically, the wiring harness channel 44 is suitable for passing wires, and the wiring harness channel 44 formed between the chip heat transfer section and the support foot facilitates the arrangement of the wiring of the power module assembly 1.
[0049] According to some embodiments of the present invention, such as Figure 2 As shown, both the first phase change heat exchanger 84 and the second phase change heat exchanger 85 include a phase change housing 81. A phase change material receiving cavity is formed within the phase change housing 81 for accommodating the phase change material 82, and the phase change housing 81 is in direct and / or indirect contact with the support member. Specifically, the phase change material 82 is housed within the phase change material receiving cavity of the phase change housing 81. The phase change housing 81 is in direct and / or indirect contact with the support member to conduct heat from the first chip 10 and the second chip 20 to the phase change housing 81. The support member has high thermal conductivity, resulting in better heat dissipation of the first phase change heat exchanger 84 and the second phase change heat exchanger 85.
[0050] According to some embodiments of the present invention, such as Figure 2As shown, an insulating plate 83 is provided between two adjacent phase change housings 81, and the two phase change housings 81 are fixedly connected to the insulating plate 83 respectively. Specifically, the first phase change heat sink 84, the second phase change heat sink 85, and the heat dissipation part dissipate heat from the chip layer. By placing the insulating plate 83 between two adjacent phase change housings 81, insulation can be achieved between the first phase change heat sink 84 and the second phase change heat sink 85.
[0051] According to some embodiments of the present invention, such as Figure 2 As shown, a heat-conducting part is provided inside the phase change material receiving cavity. The heat-conducting part is disposed on the inner wall of the phase change material receiving cavity and protrudes towards the interior of the phase change material receiving cavity. Specifically, the heat-conducting part can guide the heat transferred by the phase change shell 81 to the phase change material 82, and the first phase change heat transfer element 84 and the second phase change heat transfer element 85 have better heat absorption efficiency.
[0052] According to some embodiments of the present invention, such as Figure 2 As shown, the heat-conducting part is constructed as a heat-conducting needle, and multiple heat-conducting needles are constructed extending from the side of the phase change material receiving cavity near the chip layer to the side away from the chip layer; and / or the heat-conducting part is constructed as a heat-conducting plate formed inside the phase change material receiving cavity, the heat-conducting plates being disposed inside the phase change material receiving cavity and spaced apart from each other to form heat dissipation channels. Specifically, the heat-conducting part is constructed as a heat-conducting needle and / or a heat-conducting plate, which can introduce heat into the interior of the phase change material 82, facilitating heat conduction within the phase change material 82. When the heat-conducting part is constructed as a heat-conducting plate, the heat dissipation channels between the heat-conducting plates are suitable for heat dissipation to avoid heat accumulation. In some embodiments, the heat-conducting plate can be constructed as a corrugated shape or other shape that facilitates heat conduction, which can enhance the heat conduction effect while increasing the heat dissipation channels, thereby improving the heat conduction and heat absorption efficiency of the phase change material 82.
[0053] According to some embodiments of the present invention, such as Figure 2 As shown, the heat dissipation unit includes a heat dissipation base plate 51 and heat dissipation fins 5. The heat dissipation base plate 51 exchanges heat with the chip layer; the heat dissipation fins 5 are disposed on the heat dissipation base plate 51 and extend in a direction away from the chip layer, and the heat dissipation fins 5 are adapted to contact with the external heat dissipation medium for heat exchange. Specifically, the heat dissipation base plate 51 and the heat dissipation fins 5 are connected, and the heat dissipation fins 5 contact the external heat dissipation medium for heat dissipation. The heat dissipation fins 5 can expand the heat conduction surface, promote heat dissipation, and increase heat transfer efficiency.
[0054] According to some embodiments of the present invention, such as Figure 2 As shown, the power module assembly 1 also includes a heat dissipation channel. The heat dissipation channel is attached to the heat dissipation base plate 51 and has a medium channel inside suitable for the flow of heat dissipation medium. The heat dissipation fins 5 are housed in the medium channel. Specifically, the medium channel is designed with heat dissipation channels, the heat dissipation fins 5 are embedded in the heat dissipation channels, and the heat dissipation base plate 51 is attached to the upper surface of the medium channel. The heat dissipation channel structure is simple, feasible, and easy to implement.
[0055] According to some embodiments of the present invention, such as Figure 2 As shown, the power module assembly 1 also includes a molding compound 3. The molding compound 3 covers the first phase change heat exchanger 84 and the second phase change heat exchanger 85. Specifically, the injection-molded molding compound 3 can completely encapsulate the first phase change heat exchanger 84 and the second phase change heat exchanger 85, reducing thermal resistance and the number of processes, thereby improving production efficiency.
[0056] According to some embodiments of the present invention, such as Figure 3 As shown, the phase change medium is constructed of solid-solid phase change material, solid-liquid phase change material, and / or gas-liquid phase change material. Specifically, the first phase change heat exchanger 84 and the second phase change heat exchanger 85 are composed of a phase change housing 81 and a heat-conducting part. The phase change medium inside the phase change housing 81 can be a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material. The phase change housing 81 can avoid leakage problems and improve the reliability of the power module assembly 1.
[0057] The motor controller according to another embodiment of the present invention is briefly described below.
[0058] The motor controller according to the present invention includes the power module component 1 described in any of the above embodiments. Since the motor controller according to the present invention is provided with the power module component 1 of the above embodiments, the motor controller integrates the heat absorption of one side of the phase change material 82 and the heat dissipation of the other side to perform double-sided heat dissipation of the chip layer, and the two heat dissipation methods do not affect each other.
[0059] The vehicle according to another embodiment of the present invention is briefly described below.
[0060] The vehicle according to the present invention includes the motor controller described in the above embodiments. Since the vehicle according to the present invention is equipped with the motor controller described in the above embodiments, the vehicle can meet the cooling requirements under normal operating conditions and solves the problem of the power module component 1 heating up too quickly during short-term current surges, thereby improving vehicle safety.
[0061] In some embodiments of the present invention, the power module assembly 1 includes a molding compound 3, a first phase-conversion heat sink 84, a second phase-conversion heat sink 85, a heat sink, a chip layer, a support member, a high-voltage terminal 2, a low-voltage terminal 4, a heat dissipation channel, and the molding compound 3. The molding compound 3 encapsulates the entire power module assembly 1. The molding compound 3 is mainly made of thermosetting materials such as epoxy resin, which can achieve insulation and integration. The glass transition temperature of epoxy resin is higher than that of materials such as silicone, which improves the temperature range of the power module assembly 1, reduces processing steps, and lowers labor costs. The substrate is soldered to the heat dissipation base plate 51, the chip, the high-voltage terminal 2, and the low-voltage terminal 4 are soldered to the upper metal layer 71 of the substrate, the support member is soldered to the chip, and the first phase-conversion heat sink 84 and the second phase-conversion heat sink 85 are soldered to the support member. The molding compound 3 is made of thermosetting materials such as epoxy resin, and the entire power module assembly 1 is encapsulated by the molding compound 3.
[0062] The chip layer includes a first chip 10, a second chip 20, and a substrate. The first chip 10 and the second chip 20 can be fixed to the substrate by sintering or reflow soldering. The chip is the core of the power module component 1, mainly made of materials such as IGBT or SiC, and is the core component for energy conversion and transmission. The chip layer also has bonding wires, which are mainly used for electrical wiring connections and are generally made of copper or aluminum.
[0063] The substrate is a DBC substrate, which is soldered onto a heat sink base plate 51. The DBC substrate consists of an upper metal layer 71, a ceramic layer 72, and a lower metal layer 73. The materials for the metal layers are generally copper, aluminum, or other metals. A first chip 10 and a second chip 20 are soldered onto the upper metal layer 71. By designing the arrangement of the metal on the upper metal layer 71 and the mounting positions of the first chip 10 and the second chip 20, electrical pathways can be established. The ceramic layer 72, made of materials such as silicon nitride, insulates the upper metal layer 71. The ceramic layer 72 has good insulation and thermal conductivity, allowing heat to be conducted from the upper metal layer 71 to the lower metal layer 72, and also providing insulation between the chip's electrical circuitry and the heat sink below. The lower metal layer 73 primarily functions to conduct heat to the heat sink. On the DBC substrate, through a high-temperature melting and diffusion process, the metal cladding layer is tightly and firmly attached to the ceramic. Such a DBC substrate has high thermal conductivity, high heat resistance, and strong heat dissipation capability, resulting in better heat dissipation for the chip.
[0064] The heat dissipation unit is composed of a heat dissipation base plate 51 and heat dissipation fins 5, which are integrally cast. The heat dissipation fins 5 are composed of small cylinders that are inserted into the water channels of the motor controller. This increases water resistance, expands the heat dissipation area, and improves the chip's heat dissipation efficiency, thereby reducing the chip's temperature. The heat dissipation unit is the primary heat dissipation pathway. The heat dissipation fins 5 can be designed with different cylindrical combinations according to actual usage requirements and operating conditions. The length and diameter of the cylinders can also be modified to change the water resistance. The heat dissipation base plate 51 and heat dissipation fins 5 in the heat dissipation unit can be made of metals such as copper and aluminum, which offer good heat dissipation.
[0065] The first phase change heat exchanger 84 and the second phase change heat exchanger 85 are upper and lower half-bridge phase change layers, respectively corresponding to the first support 61 and the second support 62. The first phase change heat exchanger 84 and the second phase change heat exchanger 85 are electrically isolated by an insulating plate 83. The first phase change heat exchanger 84 and the second phase change heat exchanger 85 are each composed of a phase change housing 81 and a phase change material 82. The two phase change housings 81 are welded to the insulating plate 83, achieving insulation between them, thus ensuring that the first phase change heat exchanger 84 and the second phase change heat exchanger 85 do not affect the circuitry of the first chip 10 and the second chip 20. The phase change housing 81 can be made of materials such as copper or aluminum, which have good heat transfer properties. The phase change material 82 can be selected from solid-solid phase change, solid-liquid phase change, and gas-liquid phase change materials. Figure 3 The diagram shows the structure of the phase change material 82. The phase change material 82 is externally composed of a phase change shell 81 and a sealing cap 86, and internally filled with the phase change material 82. The sealing cap 86 is connected to the phase change shell 81 via a sealing ring and bolts or by welding to achieve a seal on the phase change material 82.
[0066] The support component includes a body, a chip heat transfer section, and support feet. The heat-conducting surface of the body abuts against the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85, and the support surface of the support feet contacts the substrate. The conductive surface of the chip heat transfer section abuts against the first chip 10 and the second chip 20 respectively to achieve electrical connection. The support component consists of a first support member 61 and a second support member 62, which are respectively connected to the upper and lower half-bridge chips in the power module assembly 1 to achieve electrical connection of the chips. The support component is generally made of metals such as copper and aluminum, which can achieve functions such as electrical conductivity and heat conduction. The support component is designed in M-shaped and N-shaped forms, which can reduce the supporting force on the chips while supporting the first phase-conversion heat exchanger 84 and the second phase-conversion heat exchanger 85, thus avoiding chip damage. The support component can also leave space for the arrangement and processing of low-voltage binding wires. The support component provides installation space, i.e., wire harness channel 44, for copper binding wires, aluminum binding wires, etc., to avoid interference of binding wires with the circuit.
[0067] The peripheral terminals mainly consist of high-voltage terminals 2 and low-voltage terminals 4. High-voltage terminals 2 connect to the capacitors and motor in the motor controller to achieve high-current transmission, while low-voltage terminals 4 connect to the drive board to achieve electrical control. The peripheral module's encapsulation layer 3 is mainly encapsulated using thermosetting materials such as epoxy resin, which achieves insulation and integration. The glass transition temperature of epoxy resin is higher than that of materials such as silicone, improving the temperature range of the power module component 1. Compared with the traditional method of adding silicone to the power module component 1 and encapsulating it in a shell, this method greatly reduces processing steps and lowers labor costs.
[0068] The first support member 61 and the second support member 62 are respectively connected to the first phase-changing heat exchanger 84 and the second phase-changing heat exchanger 85. Together with the circuit design on the overlay metal layer 71 and the high-voltage terminal 2, they realize the high-voltage line connection between the first phase-changing heat exchanger 84 and the second phase-changing heat exchanger 85. Since the first support member 61 and the second support member 62 respectively realize the high-voltage lines of the first chip 10 and the second chip 20, insulation is required between them. If the first support member 61 and the second support member 62 are directly connected to the first phase-changing heat exchanger 84 and the second phase-changing heat exchanger 85, due to the conductivity of the first phase-changing heat exchanger 84 and the second phase-changing heat exchanger 85, it will directly cause the first support member 61 and the second support member 62 to connect, resulting in a short circuit in the chip. To avoid this danger, an insulating plate 83 is added between the first phase-changing heat exchanger 84 and the second phase-changing heat exchanger 85 to achieve insulation between the two circuits. Since the first phase change heat exchanger 84 and the second phase change heat exchanger 85 are respectively connected to the support, the phase change material 82 is also in the high-voltage circuit. To avoid affecting the external electrical circuit of the module, the phase change material 82 is encapsulated in epoxy resin for insulation. This design allows the phase change material 82 to connect directly to the support without passing through other layers, reducing thermal resistance during chip heat transfer and shortening the heat transfer path from the chip to the phase change material 82, thus improving heat dissipation efficiency. Furthermore, reducing the number of layers between the phase change material 82 and the support reduces the module's height.
[0069] In the power module assembly 1 of this application, the first phase conversion heat exchanger 84 and the second phase conversion heat exchanger 85 are insulated from each other, which can achieve reliable insulation effect while maximizing the area of the first phase conversion heat exchanger 84 and the second phase conversion heat exchanger 85, resulting in good heat dissipation and high reliability of the power module assembly 1.
[0070] In summary, the power module assembly 1 of the present invention integrates heat absorption by phase change material 82 on one side and liquid cooling heat dissipation on the other side for double-sided heat dissipation of the chip layer. The two heat dissipation methods do not interfere with each other and work together to dissipate heat on both sides of the chip layer, greatly improving the heat dissipation effect of the power module assembly 1. The first phase change heat element 84 is connected to the first chip 10 through the first support member 61, and the second phase change heat element 85 is connected to the second chip 20 through the second support member 62. The support members realize the circuit connection, and the first phase change heat element 84 and the second phase change heat element 85 are electrically isolated by an insulating plate 83, ensuring that the area of the first phase change heat element 84 and the second phase change heat element 85 is maximized while achieving a reliable insulation effect, thus improving the reliability of the power module assembly 1. The power module assembly 1 is encapsulated with thermosetting plastics such as epoxy resin, which reduces thermal resistance, achieves overall insulation of the power module assembly 1, and reduces production costs. The support members are spaced out with wire harness channels 44 to reserve wiring space, which is simple in structure and makes it easier to realize the rationality of electrical circuits.
[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0072] Although embodiments of the present invention have been shown and described above, variations, modifications, substitutions and alterations can be made to the above embodiments.
Claims
1. A power module assembly, characterized in that, include: The chip layer includes a substrate and a first chip (10) and a second chip (20) disposed on the substrate. The first phase change heat exchanger (84) and the second phase change heat exchanger (85) are provided with phase change media and absorb the heat of the chip layer through phase change. The first phase change heat exchanger (84) exchanges heat with the first chip (10) and the second phase change heat exchanger (85) exchanges heat with the second chip (20). The first phase change heat exchanger (84) and the second phase change heat exchanger (85) are insulated from each other. The support members are two in number and are respectively disposed between the chip layer and the first phase change heat exchanger (84) and between the chip layer and the second phase change heat exchanger (85). Each support member has a conductive surface suitable for contacting the first chip (10) or the second chip (20), and the corresponding support member has a thermally conductive surface suitable for contacting the first phase change heat exchanger (84) or the second phase change heat exchanger (85). A wire harness channel is formed on the support member.
2. The power module assembly according to claim 1, characterized in that, Also includes: The heat dissipation section contacts the chip layer and absorbs the temperature of the chip layer. The side of the heat dissipation section away from the chip layer is adapted to exchange heat with an external heat dissipation medium to reduce the temperature of the chip layer.
3. The power module assembly according to claim 1, characterized in that, The support member includes: The body portion has the heat-conducting surface formed thereon; the chip heat transfer portion is disposed on the body portion and extends toward the first chip (10) and / or the second chip (20), and the free end of the chip heat transfer portion has the conductive surface formed thereon; A support foot is provided on the body portion and extends toward the substrate, and the free end of the support foot forms a support surface that contacts the surface of the substrate.
4. The power module assembly according to claim 3, characterized in that, The support member is constructed in multiple ways and includes a first support member (61) and a second support member (62). The first support member (61) is supported between the substrate and the first phase change heat transfer element (84), and the second support member (62) is supported between the substrate and the second phase change heat transfer element (85). At least one of the support members has multiple support feet, and the chip heat transfer part is disposed between two adjacent support feet.
5. The power module assembly according to claim 4, characterized in that, Each of the support members is provided with a plurality of chip heat transfer parts, and each support member is provided corresponding to a plurality of first chips (10) or a plurality of second chips (20).
6. The power module assembly according to claim 5, characterized in that, The chip heat transfer section and the support foot are spaced apart to form a wire harness channel (44).
7. The power module assembly according to claim 1, characterized in that, Both the first phase change heat exchanger (84) and the second phase change heat exchanger (85) include: A phase change housing (81) is formed inside the phase change housing (81) for accommodating the phase change material (82), and the phase change housing (81) is in direct or indirect contact with the support member.
8. The power module assembly according to claim 7, characterized in that, An insulating plate (83) is provided between two adjacent phase change housings (81), and the two phase change housings (81) are respectively fixedly connected to the insulating plate (83).
9. The power module assembly according to claim 8, characterized in that, A heat-conducting part is provided inside the cavity of the phase change material (82). The heat-conducting part is disposed on the inner wall of the cavity of the phase change material (82) and protrudes towards the inside of the cavity of the phase change material (82).
10. The power module assembly according to claim 9, characterized in that, The thermally conductive portion is constructed as a thermally conductive pin, and the thermally conductive pin is constructed in multiple forms and extends from the side of the phase change material (82) receiving cavity near the chip layer to the side away from the chip layer; and / or The heat-conducting part is constructed as a heat-conducting plate formed inside the cavity of the phase change material (82). The heat-conducting plates are disposed inside the cavity of the phase change material (82) and spaced apart from each other to form a heat dissipation channel.
11. The power module assembly according to claim 2, characterized in that, The heat dissipation unit includes: Heat dissipation base plate (51), which exchanges heat with the chip layer; Heat dissipation fins (5) are disposed on the heat dissipation base plate (51) and extend in a direction away from the chip layer. The heat dissipation fins (5) are adapted to contact the external heat dissipation medium for heat exchange.
12. The power module assembly according to claim 11, characterized in that, Also includes: The heat dissipation channel is attached to the heat dissipation base plate (51) and has a medium channel inside that is suitable for the flow of heat dissipation medium. The heat dissipation fins (5) are housed in the medium channel.
13. The power module assembly according to claim 1, characterized in that, Also includes: A molding layer (3) is applied to the first phase change heat exchanger (84) and the second phase change heat exchanger (85).
14. The power module assembly according to any one of claims 1-13, characterized in that, The phase change medium is constructed as a solid-solid phase change material, a solid-liquid phase change material, and / or a gas-liquid phase change material.
15. A motor controller, characterized in that, Includes the power module assembly as described in any one of claims 1-14.
16. A vehicle, characterized in that, Includes the motor controller described in claim 15.