Control device, recording medium and control method

Abstract

This invention relates to a control device, a recording medium, and a control method. The control device provided by this invention includes: an acquisition unit for acquiring a detected temperature value detected by a detection unit; a determination unit for determining a temperature change trend of a solder processing unit based on historical information of the detected values ​​acquired by the acquisition unit; a setting unit for setting the number of heating pulses applied to a heating unit by correcting a reference value using a correction value; a control unit for controlling the application of the heating pulses to the heating unit based on the setting result of the setting unit for the number of heating pulses; and a storage unit for storing the historical information, wherein the setting unit uses different correction information to set the correction value when the temperature change trend is an upward trend and when the temperature change trend is a downward trend.

Description

Technical Field

[0001] This invention relates to control devices, recording media, and control methods, and particularly to control devices, recording media, and control methods for controlling solder processing devices. Background Technology

[0002] The temperature control device for soldering irons disclosed in the background art is presented in Japanese Patent Publication No. 2001-62562. This temperature control device includes: a heating pulse generating unit that generates heating pulses; a heating unit that receives the heating pulses, heats the tip of the soldering iron, and outputs a sensor signal corresponding to the temperature of the soldering iron tip; and a control unit that controls the temperature of the soldering iron tip by supplying a variable number of heating pulses to the heating unit. The control unit converts the sensor signal from the heating unit into measured temperature data, and determines the variable number of heating pulses using a non-linear relationship based on the temperature difference between the measured temperature data and a set temperature.

[0003] According to the temperature control device disclosed in Japanese Patent Publication No. 2001-62562, when the soldering operation on the workpiece is completed and the temperature of the soldering iron tip is to be restored from a temperature lower than the set temperature to the set temperature, excessive overshoot may occur.

[0004] Figure 1 This is a schematic diagram illustrating the temperature changes of the soldering iron tip and the workpiece during soldering. In this example, the set temperature of the soldering iron tip is 400°C. The soldering iron tip contacts the workpiece for soldering, causing the tip temperature to decrease and the workpiece temperature to rise. As the soldering iron tip moves away from the workpiece to move to the next workpiece, the tip temperature rises and the workpiece temperature decreases. At the point where soldering of the last workpiece ends, the tip temperature is approximately 300°C lower than the set temperature. Therefore, the control unit sets a large value as the variable number of heating pulses based on the temperature difference between the tip and the set temperature. For the last workpiece, since there is no next workpiece, the temperature of the soldering iron tip rises sharply due to an excessive supply of heating pulses. The result is as follows: Figure 1 As shown by the double-dotted line, after the tip temperature exceeds the set temperature of 400°C, the temperature continues to rise for a short period of time, resulting in excessive overshoot.

[0005] On the other hand, although it is also possible to suppress overshoot by setting the overall number of heating pulses to be less, the number of heating pulses used to raise the tip temperature which is reduced due to contact with the workpiece is also reduced, which will lead to a decrease in the performance of the soldering iron.

[0006] Existing technology

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Publication No. 2001-62562 Summary of the Invention

[0009] The purpose of this invention is to provide a control device, recording medium, and control method that can suppress overshoot without degrading the performance of the solder processing apparatus.

[0010] One aspect of the present invention relates to a control device for controlling a solder processing apparatus, the solder processing apparatus comprising a solder processing unit for processing solder, a heating unit for heating the solder processing unit by applying heating pulses, and a detection unit for detecting the temperature of the solder processing unit. The control device includes: an acquisition unit for acquiring a detected value of the temperature detected by the detection unit; a determination unit for determining a temperature change trend of the solder processing unit based on historical information of the detected values ​​acquired by the acquisition unit; a setting unit for setting a reference value using a correction value, thereby setting the number of heating pulses applied to the heating unit; a control unit for controlling the application of heating pulses to the heating unit based on the setting result of the setting unit for the number of heating pulses; and a storage unit for storing the historical information, wherein the setting unit uses different correction information to set the correction value when the temperature change trend is a temperature increase trend and when the temperature change trend is a temperature decrease trend. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the temperature changes of the soldering iron tip and the workpiece during soldering.

[0012] Figure 2 This is a simplified schematic diagram illustrating the structure of the solder processing system according to an embodiment of the present invention.

[0013] Figure 3 It is a simplified schematic diagram representing the structure of a microcomputer.

[0014] Figure 4 This is a schematic diagram illustrating the application control of heating pulses by the control unit.

[0015] Figure 5 This is a schematic diagram representing an example of a reference table.

[0016] Figure 6 This is a schematic diagram illustrating an example of an addition table.

[0017] Figure 7 This is a schematic diagram illustrating an example of a subtraction table.

[0018] Figure 8 This is a flowchart representing the processes performed by the Information Processing Department.

[0019] Figure 9 This is a schematic diagram showing the method for setting the number of heating pulses by the setting unit in the first embodiment.

[0020] Figure 10 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses when the temperature drops.

[0021] Figure 11 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses when the temperature rises.

[0022] Figure 12 This is a schematic diagram showing the method for setting the number of heating pulses by the setting unit in relation to the second embodiment.

[0023] Figure 13 This is a schematic diagram showing the method for setting the number of heating pulses by the setting unit in the third embodiment.

[0024] Figure 14 This is a schematic diagram showing the method for setting the number of heating pulses by the setting unit in the third embodiment.

[0025] Figure 15 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses when the temperature drops.

[0026] Figure 16 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses when the temperature rises. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, elements labeled with the same symbol in different drawings represent the same or corresponding elements.

[0028] Figure 2 This is a simplified schematic diagram illustrating the structure of a solder processing system according to an embodiment of the present invention. The solder processing system includes a solder processing apparatus 11 for processing solder and a control device 12 for controlling the solder processing apparatus 11. In this embodiment, the solder processing apparatus 11 is a soldering iron. However, the solder processing apparatus 11 may also be a solder remover or tweezers, etc.

[0029] The solder processing apparatus 11 includes: a soldering iron tip 21; a soldering iron tip 22 serving as a solder processing unit, which contacts the workpiece for soldering; a temperature sensor 23 for detecting the temperature of the soldering iron tip 22; and a heater 24 for heating the soldering iron tip 22 by applying a heating pulse HP. For example, a thermocouple may be used to construct the temperature sensor 23.

[0030] The control device 12 is configured as a soldering station wired to the solder processing apparatus 11. The control device 12 includes: a microcomputer (hereinafter referred to as "microcomputer") 31; an amplifier 32 that amplifies the temperature detection value of the soldering iron tip 22 detected by the temperature sensor 23 and inputs it into the microcomputer 31; and a switching element 33 controlled by the microcomputer 31. For example, a FET (Field Effect Transistor) can be used to construct the switching element 33. By turning on the switching element 33, a heating pulse HP is applied to the heater 24, thereby heating the soldering iron tip 22. By turning off the switching element 33, the application of the heating pulse HP to the heater 24 is stopped, thereby stopping the heating of the soldering iron tip 22. Furthermore, the control device 12 can be miniaturized and installed within the solder processing apparatus 11.

[0031] Figure 3 This is a simplified schematic diagram illustrating the structure of the microcomputer 31. The microcomputer 31 includes an ADC (Analog-to-Digital Converter) 41 that converts analog signals into digital signals, an information processing unit 42, and a storage unit 43. The information processing unit 42 is constructed using an information processing device such as a CPU (Central Processing Unit). The storage unit 43 is constructed using HDD (Hard Disk Drive), SSD (Solid State Disk), or semiconductor memory.

[0032] The information processing unit 42 includes an acquisition unit 51, a determination unit 52, a setting unit 53, and a control unit 54. It functions as a program read from a computer-readable ROM (Read Only Memory) or similar recording medium by a CPU executing the program. In other words, the program is designed to enable the information processing unit 42, mounted on the control device 12 as an information processing device, to function as the acquisition unit 51 (acquisition unit), the determination unit 52 (determination unit), the setting unit 53 (setting unit), and the control unit 54 (control unit).

[0033] The storage unit 43 stores a lookup table (hereinafter referred to as "LUT" or "Look-Up Table") 61 and resume information 62.

[0034] The acquisition unit 51 acquires the temperature detection value of the soldering iron tip 22 detected by the temperature sensor 23 via the amplifier 32 and ADC 41. The time-series data of the detection values ​​acquired by the acquisition unit 51 is stored in the storage unit 43 as history information 62. The determination unit 52 determines the temperature change trend of the soldering iron tip 22 based on the history information 62. The temperature change trend includes a temperature decrease trend, a temperature increase trend, and a temperature maintenance trend. The setting unit 53 uses a correction value to correct the reference value, thereby setting the number of heating pulses applied to the heater 24 in each control cycle. The reference value is a value representing the reference number of reference pulses that serves as a reference for the number of heating pulses to be applied next. The correction value is a value that corrects the reference value based on the temperature change trend, including an addition value to the reference value and a subtraction value to be subtracted from the reference value. The setting unit 53 sets the number of heating pulses based on the temperature change trend of the soldering iron tip 22, the reference value, the value obtained by adding the reference value to the reference value, or the value obtained by subtracting the subtraction value from the reference value. The setting unit 53 sets correction values ​​using different correction information when the temperature change trend is an upward trend and when the temperature change trend is a downward trend. The correction information includes LUT 61 or formulas, etc. In the following example, LUT 61 is used. LUT 61 includes an addition table representing multiple summed values ​​and a subtraction table representing multiple subtracted values. Based on the setting result of the setting unit 53 for the number of heating pulses, the control unit 54 controls the switching element 33 in each control cycle, thereby controlling the application of heating pulses HP to the heater 24.

[0035] Figure 4 This is a schematic diagram illustrating the application control of the heating pulse HP by the control unit 54. Figure 4 The diagram shows the current control cycle (first control cycle), the previous control cycle (second control cycle), and the control cycle before that (third control cycle). At the measurement timing T0 at the beginning of the first control cycle, the switching element 33 is open, and the temperature sensor 23's detected value S0 is acquired by the acquisition unit 51. At the measurement timing T1 at the beginning of the second control cycle, the switching element 33 is open, and the temperature sensor 23's detected value S1 is acquired by the acquisition unit 51. At the measurement timing T2 at the beginning of the third control cycle, the switching element 33 is open, and the temperature sensor 23's detected value S2 is acquired by the acquisition unit 51.

[0036] In this embodiment, the interval between consecutive measurement times T is, for example, 0.3 seconds, during which a maximum of 37 heating pulses HP can be included. That is, the number of heating pulses applied to the heater 24 in each control cycle can be any set value from a minimum of 0 to a maximum of 37, and is calculated by the setting unit 53. If the calculated number of heating pulses exceeds the maximum value, the setting unit 53 sets the number of heating pulses to the maximum value (37 in this example). Similarly, if the calculated number of heating pulses is less than the minimum value, the setting unit 53 sets the number of heating pulses to the minimum value (0 in this example).

[0037] Furthermore, the application control of the heating pulse HP by the control unit 54 can be activated (effective) not only after the power to the solder processing device 11 is turned on, but also after the temperature of the soldering iron tip 22 first reaches the set temperature.

[0038] (First Implementation)

[0039] In the first embodiment, the reference value is a reference pulse number set based on the difference between the set temperature of the soldering iron tip 22 and the detection value (S0) acquired by the acquisition unit 51. The setting of the reference value includes calculations using a LUT or an arithmetic expression. In the first embodiment, when the temperature change tendency is a temperature maintenance tendency, the setting unit 53 sets a heating pulse number equal to the reference pulse number; when the temperature change tendency is a temperature rising tendency, it sets a heating pulse number less than the reference pulse number by subtracting a correction value from the reference value; and when the temperature change tendency is a temperature falling tendency, it sets a heating pulse number more than the reference pulse number by adding a summation value to the reference value.

[0040] In the first embodiment, the setting unit 53 sets the number of heating pulses to be applied next based on a reference value and the correction value corresponding to the temperature change tendency and the amount of temperature change of the soldering iron tip 22. This allows for a simple and appropriate setting of the number of heating pulses. The setting unit 53 uses different correction information to set correction values ​​when the temperature change tendency is an upward trend and when the temperature change tendency is a downward trend. Furthermore, in the first embodiment, the LUT 61 includes a reference table representing the reference value, an addition table representing the correction value added to the reference value (i.e., the summed value), and a subtraction table representing the correction value subtracted from the reference value (i.e., the subtraction value). The setting unit 53 refers to the subtraction table when the temperature change tendency is an upward trend and refers to the addition table when the temperature change tendency is a downward trend.

[0041] Figure 5 This is a schematic diagram representing an example of a reference table. Figure 6 This is a schematic diagram illustrating an example of an addition table. Figure 7This is a schematic diagram illustrating an example of a subtraction table.

[0042] Reference Figure 5 When the temperature difference between the set temperature and the detected value at the soldering iron tip 22 is, for example, 5°C, 10°C, or 15°C, the number of reference pulses represented by the reference value is 7, 20, or 28, respectively. That is, the smaller the temperature difference between the set temperature and the detected value, the fewer the number of reference pulses is set; the larger the temperature difference between the set temperature and the detected value, the more the number of reference pulses is set.

[0043] Furthermore, multiple reference tables can be set according to the temperature range of the set temperature of the soldering iron tip 22. For example, a reference table for the high-temperature range and a reference table for the low-temperature range can be set separately. By setting multiple reference tables, the reference value when the set temperature belongs to the first range (e.g., the high-temperature range) and the reference value when the set temperature belongs to the second range (e.g., the low-temperature range) are different from each other. Thus, appropriate temperature control can be performed according to the set temperature of the soldering iron tip 22. In addition, three (or four or more) reference tables can be set in conjunction with the three temperature ranges of high temperature, medium temperature, and low temperature. The same applies to the second embodiment described later.

[0044] Reference Figure 6 When the temperature change trend of the soldering iron tip 22 is negative (i.e., the temperature difference between the detection value S0 of the first control cycle and the detection value S1 of the second control cycle is a negative temperature decrease trend), and the absolute value of the difference between the detection value S0 and the detection value S1 is, for example, 5℃, 10℃, and 15℃, the number of summed pulses (correction values) represented by the summed value are 4, 8, and 21, respectively. (Refer to...) Figure 7 When the temperature difference obtained by subtracting the detection value S1 of the second control cycle from the detection value S0 of the first control cycle has a positive temperature rise trend, and the absolute value of the difference between the detection value S0 and the detection value S1 is, for example, 5℃, 10℃, and 15℃, the number of subtraction pulses (correction values) represented by the subtraction value are 3, 5, and 9, respectively.

[0045] Furthermore, multiple summation tables and multiple subtraction tables can be set according to the temperature range of the set temperature of the soldering iron tip 22. For example, summation and subtraction tables for the high-temperature range and summation and subtraction tables for the low-temperature range can be set separately. Thus, appropriate temperature control can be performed according to the set temperature of the soldering iron tip 22. Only one reference table can be set in this case, or multiple reference tables can be set according to the temperature range as described above. The same applies to the second embodiment described later.

[0046] Figure 8 This is a flowchart representing the processing performed by the information processing unit 42.

[0047] First, in step SP01, the acquisition unit 51 acquires the temperature detection value of the soldering iron tip 22 detected by the temperature sensor 23 via the amplifier 32 and the ADC 41. The time series data of the detection value acquired by the acquisition unit 51 is stored in the storage unit 43 as history information 62.

[0048] Next, in step SP02, the determination unit 52 determines the temperature change trend of the soldering iron tip 22 based on the history information 62. The determination unit 52 compares the detected value S0 with the detected value S1. If the detected value S0 is less than the detected value S1, the temperature change trend is determined to be a temperature decrease trend; if the detected value S0 is greater than the detected value S1, the temperature change trend is determined to be a temperature increase trend; and if the detected value S0 is equal to the detected value S1, the temperature change trend is determined to be a temperature maintenance trend. Furthermore, the object compared with the detected value S0 is not limited to the detected value S1; it can be the detected value S2, or the average value between the detected values ​​S1 and S2.

[0049] Next, in step SP03, the setting unit 53 corrects the reference value using a correction value, thereby setting the number of heating pulses applied to the heater 24 in the first control cycle. The setting unit 53 sets the number of heating pulses based on a reference table representing the reference pulse number and an addition or subtraction table corresponding to the temperature change of the soldering iron tip 22.

[0050] Figure 9 This is a schematic diagram showing the method by which the setting unit 53 sets the number of heating pulses P in the first embodiment.

[0051] ΔT is the temperature change obtained by subtracting the measured value S1 from the measured value S0.

[0052] P + It is the number of addition pulses set according to the addition table.

[0053] P - It is the number of subtraction pulses set according to the subtraction table.

[0054] P is the number of heating pulses set for the first control cycle (the number of heating pulses applied next).

[0055] P0 is the number of reference pulses set according to the reference table.

[0056] If the temperature tends to be maintained according to condition 1 (ΔT=0), the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number set according to the reference table.

[0057] When the temperature tends to rise according to condition 1 (ΔT>0), the setting unit 53 sets the heating pulse number P (=P0-P) by subtracting the subtraction pulse number set according to the subtraction table from the reference pulse number set according to the reference table.- That is, when the determination unit 52 determines that there is a tendency for the temperature to rise, the setting unit 53 sets a heating pulse number that is less than the reference pulse number by subtracting a correction value from the reference value. This suppresses the supply of excess power to the heater 24, such as... Figure 1 As shown by the solid line, it can effectively suppress overshoot.

[0058] When the temperature tends to decrease according to condition 1 (ΔT < 0), the setting unit 53 sets the heating pulse number P (=P0 + P) by adding the reference pulse number set according to the summation table to the reference pulse number set according to the reference table. + Therefore, when a load greater than expected is applied, additional power is supplied to heater 24.

[0059] Next, in step SP04, the control unit 54 controls the switching element 33 in each control cycle based on the setting result of the setting unit 53 for the number of heating pulses, thereby controlling the application of the heating pulse HP to the heater 24.

[0060] According to the first embodiment, the setting unit 53 uses different correction information (e.g., an addition table or a subtraction table) to set correction values ​​when the temperature change trend of the soldering iron tip 22 is an upward trend and when the temperature change trend of the soldering iron tip 22 is a downward trend. Therefore, even if the temperature difference between the set temperature and the detected value of the soldering iron tip 22 is the same, different correction values ​​can be used to set different heating pulse numbers when the temperature is downward trending and upward trending, so the heating pulse number can be set to an optimal value according to the characteristics of each trend. As a result, the performance of the solder processing apparatus 11 is not degraded when the temperature is downward trending, and overshoot is suppressed when the temperature is upward trending.

[0061] Figure 10 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses as the temperature decreases. Compared to existing methods that set the number of heating pulses based on the difference between the temperature and the set temperature, the present invention, which uses a reference value and a correction value, tends to set a greater number of heating pulses as the sensor temperature (detected value) decreases as the temperature decreases. Thus, according to the present invention, the performance degradation of the solder processing apparatus 11 as the temperature decreases is effectively avoided.

[0062] Figure 11 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses as the temperature rises. Compared to existing methods, the present invention, which uses a reference value and a correction value, tends to set fewer heating pulses as the sensor temperature rises. Therefore, according to the present invention, overshoot is effectively suppressed as the temperature rises.

[0063] (Second Implementation)

[0064] In the second embodiment, the reference value is a value representing the number of reference pulses set based on the difference between the set temperature of the soldering iron tip 22 and the detection value (S0) acquired by the acquisition unit 51. Setting the reference value includes calculations using a LUT or an arithmetic expression. In the second embodiment, the setting unit 53 sets a correction value based on the difference between a predicted value of the temperature change of the soldering iron tip 22 predicted for a case where the reference pulse number represented by the reference value has been applied, and a measured value of the temperature change of the soldering iron tip 22 calculated based on the detection value detected by the temperature sensor 23.

[0065] Specifically, when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is negative (when the absolute value of the measured temperature change exceeds the absolute value of the predicted temperature change), or when the temperature change trend is a rising trend and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is positive (when the absolute value of the measured temperature change is less than the absolute value of the predicted temperature change), the setting unit 53 sets a heating pulse number that is more than the reference pulse number by adding a correction value to the reference value. Furthermore, when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is positive (when the absolute value of the measured temperature change is less than the absolute value of the predicted temperature change), or when the temperature change trend is a rising trend and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is negative (when the absolute value of the measured temperature change exceeds the absolute value of the predicted temperature change), the setting unit 53 sets a heating pulse number less than the reference pulse number by subtracting a correction value from the reference value. This allows for a simple and appropriate setting of the heating pulse number. Here, the predicted value refers to the predicted amount of temperature change that the temperature sensor 23 will detect when the reference pulse number is applied. In reality, due to factors such as the size of the workpiece and the heat load applied to the soldering iron tip 22, or other main reasons, the detected value after applying the heating pulse will often differ from the predicted value. In this embodiment, a correction value corresponding to the difference between the predicted and measured values ​​is used. Although the setting unit 53 sets different correction values ​​when the temperature change trend is upward and when the temperature change trend is downward, in reality, since a correction value corresponding to the difference between the predicted value and the measured value is used, there is also a situation where the correction value is accidentally the same when the temperature change trend is upward and when the temperature change trend is downward. Furthermore, in the second embodiment, the LUT 61 includes a reference table representing reference values ​​(e.g., ...). Figure 5), representing the summation table of correction values ​​added to the base value, i.e., the sum of the values ​​(e.g. Figure 6 ), and a subtraction table (e.g., representing the correction value, i.e., the subtraction value, compared to the base value) Figure 7 ).

[0066] Reference Figure 6 When the absolute value of the temperature difference obtained by subtracting the measured value from the predicted temperature change at the soldering iron tip 22 is, for example, 5℃, 10℃, or 15℃, the number of added pulses (correction values) represented by the summation value are 4, 8, and 21, respectively. (Refer to...) Figure 7 When the absolute value of the temperature difference obtained by subtracting the measured value from the predicted value of the temperature change at the tip of the soldering iron 22 is, for example, 5℃, 10℃, or 15℃, the number of subtraction pulses (correction values) represented by the subtraction value are 3, 5, and 9, respectively.

[0067] Furthermore, regarding the summation tables, separate summation tables for a decreasing temperature trend (summation table for decreasing temperature) and summation tables for a increasing temperature trend (summation table for increasing temperature) can be set. The decreasing temperature summation table represents a correction value set for the following situation: when the determination unit 52 determines that there is a decreasing temperature trend, and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is negative (the absolute value of the measured temperature change is greater than the absolute value of the predicted temperature change). The increasing temperature summation table represents a correction value set for the following situation: when the determination unit 52 determines that there is a increasing temperature trend, and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is positive (the absolute value of the measured temperature change is less than the absolute value of the predicted temperature change).

[0068] Similarly, regarding the subtraction tables, separate subtraction tables can be set up for a decreasing temperature trend (subtraction table for decreasing temperature) and a increasing temperature trend (subtraction table for increasing temperature). The decreasing temperature subtraction table represents a correction value set for the following situation: when the determination unit 52 determines that there is a decreasing temperature trend, and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is positive (the absolute value of the measured temperature change is less than the absolute value of the predicted temperature change). The increasing temperature subtraction table represents a correction value set for the following situation: when the determination unit 52 determines that there is an increasing temperature trend, and the difference between the absolute value of the predicted temperature change and the absolute value of the measured temperature change is negative (the absolute value of the measured temperature change is greater than the absolute value of the predicted temperature change).

[0069] Detailed temperature control can be achieved by setting separate addition tables for descent, subtraction tables for descent, addition tables for descent, and subtraction tables for descent.

[0070] Furthermore, regarding the subtraction table for temperature drop, all correction values ​​can be set to zero. In this case, even if the measured value of the temperature change is less than the predicted value due to the temperature drop trend, the number of heating pulses will be equal to the reference number of pulses, regardless of the difference between the predicted and measured values ​​of the temperature change. There is no concern about overshoot during a temperature drop trend, meaning that there is no need to perform output reduction corrections. Therefore, performance degradation of the solder processing device 11 during a temperature drop trend can be appropriately prevented.

[0071] The processing performed by the information processing unit 42 in the second embodiment Figure 8 The flowchart is used to represent this. The processing of steps SP01, SP02, and SP04 is the same as in the first embodiment described above.

[0072] In step SP03, the setting unit 53 corrects the reference value using a correction value, thereby setting the number of heating pulses applied to the heater 24 in the first control cycle. The setting unit 53 sets the number of heating pulses based on a reference table representing the reference pulse number and a summation or subtraction table representing the correction value representing the difference between the predicted value and the measured value corresponding to the temperature change of the soldering iron tip 22.

[0073] Figure 12 This is a schematic diagram showing the method for setting the number of heating pulses P by the setting unit 53 in relation to the second embodiment.

[0074] ΔT is the temperature change obtained by subtracting the measured value S1 from the measured value S0.

[0075] ΔTup is the absolute value of the measured temperature change (temperature rise) obtained by subtracting the measured value S1 from the measured value S0 when the temperature tends to rise. The setting unit 53 calculates the measured value of the temperature change based on the history information 62 of the measured values.

[0076] ΔTupP is the absolute value of the predicted temperature change (temperature rise) at measurement time T0 after the detection value S1 when the temperature tends to rise. The setting unit 53 calculates the predicted temperature change based on historical information of the set value of the heating pulse number in past control cycles, the set temperature of the soldering iron tip 22, and the historical information 62 of the detection value. Alternatively, the predicted temperature change can be obtained based on a predetermined prediction table. This prediction table represents the predicted temperature change when a reference pulse number is applied to a specific type of soldering iron tip, and is prepared in advance through experiments or simulations. Different prediction tables can be used depending on whether the temperature tends to rise or fall.

[0077] ΔTdown is the absolute value of the measured temperature change (temperature drop) obtained by subtracting the measured value S1 from the measured value S0 when the temperature tends to drop.

[0078] ΔTdownP is the absolute value of the predicted temperature change (temperature drop) at the measurement time T0, following the detection value S1 when the temperature tends to decrease.

[0079] P + It is the number of addition pulses set according to the addition table.

[0080] P - It is the number of subtraction pulses set according to the subtraction table.

[0081] P is the number of heating pulses set for the first control cycle (the number of pulses applied next).

[0082] P0 is the number of reference pulses set according to the reference table.

[0083] If the temperature tends to be maintained according to condition 1 (ΔT=0), the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number set according to the reference table.

[0084] If the temperature tends to rise according to condition 1 (ΔT > 0), the setting unit 53 calculates ΔTupP - ΔTup. If the calculation result is negative (< 0) according to condition 2, the setting unit 53 determines that the temperature rise is greater than predicted, and sets the heating pulse number P (=P0 - P) by subtracting the subtraction pulse number set according to the subtraction table from the reference pulse number set according to the reference table. - That is, when the determination unit 52 determines that there is a tendency for the temperature to rise, and the absolute value of the measured temperature change is greater than the absolute value of the predicted temperature change, the setting unit 53 sets a heating pulse number that is less than the reference pulse number by subtracting a correction value from the reference value. This suppresses the supply of excess power to the heater 24, such as... Figure 1 As shown by the solid line, overshoot is appropriately suppressed. Furthermore, if the calculation result according to condition 2 is positive (>0), the setting unit 53 determines that the temperature rise is smaller than predicted, and sets the heating pulse number P (=P0+P) by adding the reference pulse number set according to the summation table to the reference pulse number set according to the reference table. + This allows the soldering iron tip 22 to quickly and reliably return to the set temperature. Furthermore, if the calculation result according to condition 2 is zero, the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number set according to the reference table.

[0085] If the temperature tends to decrease according to condition 1 (ΔT < 0), the setting unit 53 calculates ΔTdownP - ΔTdown. If the calculation result is negative (< 0) according to condition 2, the setting unit 53 determines that the temperature decrease is greater than predicted, and sets the heating pulse number P (=P0 + P) by adding the reference pulse number set according to the summation table to the reference pulse number set according to the reference table. + Therefore, when a load larger than expected is applied, additional power is supplied to heater 24. Furthermore, if the calculation result according to condition 2 is positive (>0), the setting unit 53 determines that the temperature drop is smaller than predicted, and sets the heating pulse number P (=P0-P) by subtracting the subtraction pulse number set according to the subtraction table from the reference pulse number set according to the reference table. - Therefore, the supply of heat other than that required to restore the temperature of the soldering iron tip 22 is suppressed, and excess heat is prevented from accumulating on the soldering iron tip 21. In addition, if the calculation result according to condition 2 is zero, the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number set according to the reference table.

[0086] According to the second embodiment, in addition to the effects obtained by the first embodiment, since the setting unit 53 sets a correction value based on the difference between the predicted value and the measured value of the temperature change of the soldering iron tip 22, the appropriate number of heating pulses can be set with high precision.

[0087] (Third Implementation)

[0088] In the third implementation, the reference value is the number of heating pulses in the previous control cycle, i.e., the second control cycle.

[0089] In the third embodiment, the setting unit 53 sets the number of heating pulses for the first control cycle based on a reference value representing the number of heating pulses in the second control cycle and the aforementioned correction value corresponding to the temperature change of the soldering iron tip 22 based on the detection value and the history information of the detection value. This allows for a simple and appropriate setting of the number of heating pulses.

[0090] Specifically, when the temperature change trend of the soldering iron tip 22 tends to be an upward trend, the setting unit 53 sets a heating pulse number less than the reference pulse number by subtracting a correction value from the reference value. Conversely, when the temperature change trend of the soldering iron tip 22 tends to be a downward trend, the setting unit 53 sets a heating pulse number more than the reference pulse number by adding a correction value to the reference value. Furthermore, in the third embodiment, the LUT 61 includes a summation table representing the summed values ​​(e.g., ...). Figure 6 ), and a subtraction table representing the difference (e.g. Figure 7 ).

[0091] The processing performed by the information processing unit 42 in the third embodiment Figure 8 The flowchart is used to represent this. The processing of steps SP01, SP02, and SP04 is the same as in the first embodiment described above.

[0092] In step SP03, the setting unit 53 uses a correction value to correct the reference value, thereby setting the number of heating pulses applied to the heater 24 in the first control cycle. The setting unit 53 sets the number of heating pulses in the first control cycle based on the reference value representing the number of heating pulses in the second control cycle and the aforementioned correction value corresponding to the amount of temperature change of the soldering iron tip 22 based on the detection value and the history information of the detection value.

[0093] Figure 13 and Figure 14 This is a schematic diagram showing the method for setting the number of heating pulses P by the setting unit 53 in relation to the third embodiment.

[0094] Ta is the temperature change obtained by subtracting the detection value S1 of the second control cycle from the detection value S0 of the first control cycle.

[0095] Tb is the temperature change obtained by subtracting the detection value S2 of the third control cycle from the detection value S1 of the second control cycle.

[0096] Tc is the temperature change obtained by subtracting the detection value S2 of the third control cycle from the detection value S0 of the first control cycle.

[0097] Pa + The number of summing pulses is set according to the summing table based on the temperature change Ta.

[0098] Pa - The number of subtraction pulses is set according to the subtraction table based on the temperature change Ta.

[0099] Pb + The number of summing pulses is set according to the summing table based on the temperature change Tb.

[0100] Pb - The number of subtraction pulses is set according to the subtraction table based on the temperature change Tb.

[0101] P is the number of heating pulses set for the first control cycle (the number of pulses applied next).

[0102] P0 is the number of heating pulses (reference pulse number) set for the second control cycle.

[0103] If the temperature tends to be maintained according to condition 1 (Ta = 0), the setting unit 53 sets the heating pulse number P (= P0) in a manner equal to the reference pulse number.

[0104] If, according to condition 1, the temperature tends to rise (Ta > 0), the setting unit 53 determines whether, according to condition 2, Tb is positive (> 0), negative, or 0 (≤ 0). If Tb is positive, it determines whether, according to condition 3, Tc is positive or 0 (≥ 0). If Tc is positive or 0 (i.e., in the case where...),... Figure 14 In the case of the highest-ranking characteristic, setting unit 53, by subtracting Pa from P0 - With Pb - The total value is set to the number of heating pulses P(=P0-(Pa). - +Pb - That is, when the determination unit 52 determines that there is a tendency for the temperature to rise, the setting unit 53 sets a heating pulse number that is less than the reference pulse number by subtracting a correction value from the reference value. This suppresses the supply of excess power to the heater 24 and appropriately suppresses overshoot. When Tb is negative or 0, the setting unit 53 determines whether Tc is positive or 0 (≥0) or negative (<0) according to condition 3. When Tc is positive or 0 (i.e., when...), the setting unit 53 determines whether Tc is positive or 0 (≥0) or negative (<0). Figure 14 In the case of the second characteristic from top to bottom, setting part 53, by subtracting Pa from P0 - Set the number of heating pulses P (=P0-Pa) - Therefore, excess power can be supplied to heater 24, and overshoot can be appropriately suppressed. When Tc is negative (i.e., when...), Figure 14 In the case of the third characteristic from top to bottom, the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number. That is, if the temperature change tendency between the first control cycle and the second control cycle, and the temperature change tendency between the second control cycle and the third control cycle are different from each other, and the temperature change amount between the first control cycle and the second control cycle is less than the temperature change amount between the second control cycle and the third control cycle, the setting unit 53 sets the correction value to zero. As a result, the occurrence of miscontrol caused by noise can be suppressed. Thus, the correction value can be appropriately set based on the degree of temperature rise or temperature fall tendency compared with previous history and multiple cycles, without being affected by the previous detection value.

[0105] If, according to condition 1, the temperature tends to decrease (Ta < 0), the setting unit 53 determines whether, according to condition 2, Tb is negative (< 0) or positive or 0 (≥ 0). If Tb is negative, according to condition 3, Tc is negative or 0 (≤ 0). If Tc is negative or 0 (i.e., in the case where...),... Figure 14 In the case of the fourth characteristic from the top, the setting unit 53 adds Pa to P0. + With Pb + The total value is set to the number of heating pulses P(=P0+(Pa). + +Pb+ Therefore, when a large load is applied, additional power is supplied to heater 24. When Tb is positive or 0, the setting unit 53 determines whether Tc is negative or 0 (≤0) or positive (>0) according to condition 3. When Tc is negative or 0 (i.e., when it is...) Figure 14 In the case of the fifth characteristic from the top, setting part 53, by adding Pa to P0 + Set the heating pulse number P (=P0+Pa) + Therefore, when a load greater than expected is applied, additional power is supplied to heater 24. When Tc is positive (i.e., when...),... Figure 14 In the case of the sixth characteristic from the top, the setting unit 53 sets the heating pulse number P (=P0) in a manner equal to the reference pulse number. As a result, the occurrence of erroneous control caused by noise can be suppressed. Thus, the correction value can be appropriately set based on the degree of temperature rise or temperature drop tendency compared with previous history and multiple cycles, without being affected by the previous detection value.

[0106] According to the third embodiment, similarly to the first embodiment, the performance of the solder processing apparatus 11 can be prevented from decreasing when the temperature tends to decrease, and overshoot can be suppressed when the temperature tends to increase.

[0107] Figure 15 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses as the temperature decreases. Compared to existing methods that set the number of heating pulses based on the difference between the temperature and the set temperature, the present invention, which uses a reference value and a correction value, tends to set a greater number of heating pulses as the sensor temperature (detected value) decreases as the temperature decreases. Thus, according to the present invention, the performance degradation of the solder processing apparatus 11 as the temperature decreases is effectively avoided.

[0108] Figure 16 This is a schematic diagram illustrating an example of the setting result for the number of heating pulses as the temperature rises. Compared to existing methods, the present invention, which uses a reference value and a correction value, tends to set fewer heating pulses as the sensor temperature rises. Therefore, according to the present invention, overshoot is effectively suppressed as the temperature rises.

[0109] Furthermore, when the temperature of the soldering iron tip 22 returns to the set temperature during the control process, the number of heating pulses (reference value) associated with the previous control cycle can also be reset to zero.

[0110] In addition, multiple summation tables and multiple subtraction tables can be set according to the temperature range of the set temperature of the soldering iron tip 22.

[0111] Furthermore, although the setting unit 53 uses the current detection value S0, the previous (previous) detection value S1, and the detection value two steps back (S2) to set the heating pulse number P, it can also use three previous (or even earlier) detection values. It can also use two or four previous detection values ​​instead of the previous and two previous detection values. It can also use the average of multiple detection values.

[0112] One aspect of the present invention relates to a control device for controlling a solder processing apparatus, the solder processing apparatus comprising a solder processing unit for processing solder, a heating unit for heating the solder processing unit by applying heating pulses, and a detection unit for detecting the temperature of the solder processing unit. The control device includes: an acquisition unit for acquiring a detected value of the temperature detected by the detection unit; a determination unit for determining a temperature change trend of the solder processing unit based on historical information of the detected values ​​acquired by the acquisition unit; a setting unit for setting a reference value using a correction value, thereby setting the number of heating pulses applied to the heating unit; a control unit for controlling the application of heating pulses to the heating unit based on the setting result of the setting unit for the number of heating pulses; and a storage unit for storing the historical information, wherein the setting unit uses different correction information to set the correction value when the temperature change trend is a temperature increase trend and when the temperature change trend is a temperature decrease trend.

[0113] According to this configuration, the setting unit uses different correction information to set correction values ​​when the temperature change trend is upward and when the temperature change trend is downward. Therefore, even if the temperature difference between the set temperature and the detected value of the solder processing unit is the same, different correction values ​​can be used to set different heating pulse numbers when the temperature trend is downward and upward. Thus, the heating pulse number can be set to an optimal value based on the characteristics of each trend. As a result, the performance of the solder processing device is not degraded when the temperature trend is downward, and overshoot is suppressed when the temperature trend is upward.

[0114] In the above manner, the correction information may include an addition table representing the sum of the values ​​added to the reference value and a subtraction table representing the subtraction of the reference value, both stored in the storage unit. The correction value is either the sum of the values ​​shown in the addition table or the subtraction of the values ​​shown in the subtraction table. The setting unit sets the number of heating pulses based on the reference value, the value obtained by adding the sum of the values ​​to the reference value, or the value obtained by subtracting the subtraction of the values ​​from the reference value, according to the temperature change trend.

[0115] According to this configuration, the setting unit can set an appropriate number of heating pulses based on the temperature change trend by referring to the addition and subtraction tables stored in the storage unit.

[0116] In the above manner, the addition table and the subtraction table when the set temperature of the solder processing unit belongs to the first region may be different from the addition table and the subtraction table when the set temperature of the solder processing unit belongs to the second region.

[0117] According to this configuration, appropriate temperature control can be performed based on the set temperature of the solder processing unit.

[0118] In the above-described manner, the reference value may be a reference pulse number set based on the difference between the set temperature of the solder processing unit and the detection value acquired by the acquisition unit. The reference value when the set temperature of the solder processing unit belongs to a first region, the reference value when the set temperature of the solder processing unit belongs to a second region (different from the reference value when the set temperature of the solder processing unit belongs to a second region), and the reference value when the set temperature of the solder processing unit belongs to a second region are all different from each other.

[0119] According to this configuration, appropriate temperature control can be performed based on the set temperature of the solder processing unit.

[0120] In the above-described manner, if the temperature change trend is a rising trend, the setting unit may subtract the correction value from the reference value to set a heating pulse number that is less than the reference pulse number represented by the reference value; if the temperature change trend is a falling trend, the setting unit may add the correction value to the reference value to set a heating pulse number that is more than the reference pulse number.

[0121] According to this configuration, the performance of the solder processing device can be prevented from degrading when the temperature tends to decrease, and overshoot can be suppressed when the temperature tends to increase.

[0122] In the above method, the reference value may be a reference pulse number set based on the difference between the set temperature of the solder processing unit and the detection value acquired by the acquisition unit, and the setting unit sets the correction value based on the difference between the predicted value of the temperature change of the solder processing unit predicted for the case where the reference pulse number represented by the reference value is applied and the measured value of the temperature change of the solder processing unit calculated based on the detection value detected by the detection unit.

[0123] Based on this configuration, the appropriate number of heating pulses can be set with high precision.

[0124] In the above-described manner, the setting unit may, when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative, or when the temperature change trend is a increasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive, set the number of heating pulses to be greater than the reference pulse number by adding the correction value to the reference value; or when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive, or when the temperature change trend is a increasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative, set the number of heating pulses to be less than the reference pulse number by subtracting the correction value from the reference value.

[0125] Based on this configuration, the appropriate number of heating pulses can be set with high precision according to the temperature change trend and the magnitude between the predicted and measured values.

[0126] In the above-described manner, the storage unit may store a reference table representing the reference value, and a decreasing summation table, an increasing summation table, a decreasing subtraction table, and an increasing subtraction table as correction information. The decreasing summation table represents the correction value set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative. The increasing summation table represents the correction value set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive. The decreasing subtraction table represents the correction value set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive. The increasing subtraction table represents the correction value set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative.

[0127] According to this configuration, precise temperature control can be achieved by separately setting up a descending summation table, a descending subtraction table, an ascending summation table, and an ascending subtraction table.

[0128] In the above manner, the correction value of the descent subtraction table can be set to zero.

[0129] According to this configuration, the performance of the solder processing device can be appropriately prevented from deteriorating when the temperature tends to drop.

[0130] In the above manner, the setting unit may set the number of heating pulses in the first control cycle based on the reference value representing the number of heating pulses in the second control cycle that precedes the current control cycle (i.e., the first control cycle) and the correction value corresponding to the temperature change of the solder processing unit based on the detection value and the history information of the detection value.

[0131] Based on this configuration, the number of heating pulses can be set simply and appropriately.

[0132] In the above-described manner, if the temperature change trend is a rising trend, the setting unit may subtract the correction value from the reference value to set a heating pulse number that is less than the reference pulse number represented by the reference value; if the temperature change trend is a falling trend, the setting unit may add the correction value to the reference value to set a heating pulse number that is more than the reference pulse number.

[0133] According to this configuration, the performance of the solder processing device can be prevented from degrading when the temperature tends to decrease, and overshoot can be suppressed when the temperature tends to increase.

[0134] In the above manner, the setting unit may set the correction value based on the temperature change between the first control cycle and the second control cycle, and the temperature change between the second control cycle and the earlier third control cycle.

[0135] According to this configuration, the accuracy of temperature control can be improved because the correction value can be set appropriately.

[0136] In the above manner, if the temperature change tendency between the first control cycle and the second control cycle and the temperature change tendency between the second control cycle and the third control cycle are different from each other, and the temperature change between the first control cycle and the second control cycle is less than the temperature change between the second control cycle and the third control cycle, the setting unit sets the correction value to zero.

[0137] According to this configuration, the occurrence of miscontrol caused by noise, etc., can be suppressed.

[0138] Another aspect of the present invention relates to a recording medium for storing a program that enables an information processing device mounted on a control device to function as an acquisition unit, a determination unit, a setting unit, and a control unit. The control device controls a solder processing apparatus, which includes a solder processing section for processing solder, a heating section for heating the solder processing section by applying heating pulses, and a detection section for detecting the temperature of the solder processing section. The acquisition unit acquires a detected value of the temperature detected by the detection section. The determination unit determines the temperature change trend of the solder processing section based on historical information of the detected values ​​acquired by the acquisition unit. The setting unit sets the number of heating pulses applied to the heating section by correcting a reference value using a correction value. The control unit controls the application of heating pulses to the heating section based on the setting result of the setting unit for the number of heating pulses. The setting unit uses different correction information to set the correction value when the temperature change trend is a rising trend and when the temperature change trend is a falling trend.

[0139] According to this configuration, the setting unit uses different correction information to set correction values ​​when the temperature change trend is upward and when the temperature change trend is downward. Therefore, even if the temperature difference between the set temperature and the detected value of the solder processing unit is the same, different correction values ​​can be used to set different heating pulse numbers when the temperature trend is downward and upward. Thus, the heating pulse number can be set to an optimal value based on the characteristics of each trend. As a result, the performance of the solder processing device is not degraded when the temperature trend is downward, and overshoot is suppressed when the temperature trend is upward.

[0140] Another aspect of the present invention relates to a control method for controlling a solder processing apparatus, the solder processing apparatus comprising a solder processing unit for processing solder, a heating unit for heating the solder processing unit by applying heating pulses, and a detection unit for detecting the temperature of the solder processing unit. The control method causes an information processing device to perform the following steps: acquiring a detected value of the temperature detected by the detection unit; determining the temperature change trend of the solder processing unit based on historical information of the acquired detected value; correcting a reference value using a correction value; setting the number of heating pulses applied to the heating unit; and controlling the application of the heating pulses to the heating unit based on the setting result of the number of heating pulses. For setting the number of heating pulses, different correction information is used to set the correction value when the temperature change trend is a temperature increase trend and when the temperature change trend is a temperature decrease trend.

[0141] According to this configuration, different correction information is used to set the number of heating pulses when the temperature change trend is upward and when the temperature change trend is downward. Therefore, even if the temperature difference between the set temperature and the detected value of the solder processing unit is the same, different correction values ​​can be used to set different numbers of heating pulses when the temperature trend is downward and upward. Thus, the number of heating pulses can be set to an optimal value based on the characteristics of each trend. As a result, the performance of the solder processing device is not degraded when the temperature trend is downward, and overshoot is suppressed when the temperature trend is upward.

Claims

1. A control device for controlling a solder processing apparatus, the solder processing apparatus comprising a solder processing section for processing solder, a heating section for heating the solder processing section by applying a heating pulse, and a detection section for detecting the temperature of the solder processing section, the control device being characterized in that it includes: The acquisition unit acquires the temperature value detected by the detection unit; The determining unit determines the temperature change trend of the solder processing unit based on the history information of the detection values ​​acquired by the acquiring unit. The setting unit sets the number of heating pulses applied to the heating unit by correcting the reference value using a correction value; The control unit controls the application of the heating pulses to the heating unit based on the setting result of the setting unit for the number of heating pulses; as well as, The storage unit stores the resume information, wherein, The setting unit uses different correction information to set the correction value when the temperature change trend is an upward trend and when the temperature change trend is a downward trend.

2. The control device according to claim 1, characterized in that: The correction information includes an addition table representing the sum of values ​​added to the reference value and a subtraction table representing the subtraction of values ​​subtracted from the reference value, both stored in the storage unit. The correction value is either the sum value shown in the sum table or the subtraction value shown in the subtraction table. The setting unit sets the number of heating pulses based on the temperature change trend, the reference value, the value obtained by adding the reference value to the reference value, or the value obtained by subtracting the reference value from the reference value.

3. The control device according to claim 2, characterized in that: The addition and subtraction tables for the solder processing unit when the set temperature is in the first region are different from the addition and subtraction tables for the solder processing unit when the set temperature is in the second region.

4. The control device according to claim 1, characterized in that: The reference value is a reference pulse number set based on the difference between the set temperature of the solder processing unit and the detection value acquired by the acquisition unit. The reference value for the set temperature of the solder processing unit when it belongs to the first region and the reference value for the set temperature of the solder processing unit when it belongs to the second region are different from each other.

5. The control device according to claim 1, characterized in that, The setting unit: When the temperature change trend is an upward trend, the heating pulse number is set to be less than the reference pulse number represented by the reference value by subtracting the correction value from the reference value. When the temperature change trend is a decreasing trend, the heating pulse number is set to be greater than the reference pulse number by adding the correction value to the reference value.

6. The control device according to claim 1, characterized in that: The reference value is a reference pulse number set based on the difference between the set temperature of the solder processing unit and the detection value acquired by the acquisition unit. The setting unit sets the correction value based on the difference between a predicted value of the temperature change of the solder processing unit when the reference pulse number represented by the reference value is applied and a measured value of the temperature change of the solder processing unit calculated based on the detection value detected by the detection unit.

7. The control device according to claim 6, characterized in that, The setting unit; When the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative, or when the temperature change trend is an increasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive, the heating pulse number is set to be greater than the reference pulse number by adding the correction value to the reference value. When the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive, or when the temperature change trend is a increasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative, the heating pulse number is set to be less than the reference pulse number by subtracting the correction value from the reference value.

8. The control device according to claim 7, characterized in that: The storage unit stores a reference table representing the reference value and a descending addition table, an ascending addition table, a descending subtraction table, and an ascending subtraction table, which serve as correction information. The decrease is represented by an addition table, and the correction value is set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative. The increase is represented by an addition table, and the correction value is set when the temperature change trend is an upward trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive. The decrease is represented by a subtraction table, and the correction value is set when the temperature change trend is a decreasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is positive. The increase is represented by a subtraction table, and is the correction value set when the temperature change trend is an increasing trend and the difference between the absolute value of the predicted value and the absolute value of the measured value is negative.

9. The control device according to claim 8, characterized in that: The correction value in the subtraction table for the descent is set to zero.

10. The control device according to claim 1, characterized in that: The setting unit sets the number of heating pulses in the first control cycle based on a reference value representing the number of heating pulses in a second control cycle that precedes the current control cycle (i.e., the first control cycle) and a correction value corresponding to the temperature change of the solder processing unit based on the detection value and the history information of the detection value.

11. The control device according to claim 10, characterized in that, The setting unit: When the temperature change trend is an upward trend, the heating pulse number is set to be less than the reference pulse number represented by the reference value by subtracting the correction value from the reference value. When the temperature change trend is a decreasing trend, the heating pulse number is set to be greater than the reference pulse number by adding the correction value to the reference value.

12. The control device according to claim 10, characterized in that: The setting unit sets the correction value based on the temperature change between the first control cycle and the second control cycle, and the temperature change between the second control cycle and the earlier third control cycle.

13. The control device according to claim 12, characterized in that: If the temperature change tendency between the first control cycle and the second control cycle and the temperature change tendency between the second control cycle and the third control cycle are different from each other, and the temperature change between the first control cycle and the second control cycle is less than the temperature change between the second control cycle and the third control cycle, the setting unit sets the correction value to zero.

14. A recording medium, characterized in that, It is a recording medium containing programs that enable the information processing device mounted on the control device to function as an acquisition unit, determination unit, setting unit, and control unit. The control device controls the solder processing apparatus, which includes a solder processing section for processing solder, a heating section for heating the solder processing section due to an applied heating pulse, and a detection section for detecting the temperature of the solder processing section. The acquisition unit acquires the temperature value detected by the detection unit. The determining unit determines the temperature change trend of the solder processing section based on the historical information of the detection values ​​acquired by the acquiring unit. The setting unit sets the number of heating pulses applied to the heating element by correcting the reference value using a correction value. The control unit, based on the setting result of the setting unit for the number of heating pulses, controls the application of the heating pulses to the heating unit, wherein, The setting unit uses different correction information to set the correction value when the temperature change trend is an upward trend and when the temperature change trend is a downward trend.

15. A control method for controlling a solder processing apparatus, the solder processing apparatus comprising a solder processing unit for processing solder, a heating unit for heating the solder processing unit due to an applied heating pulse, and a detection unit for detecting the temperature of the solder processing unit, the control method being characterized in that an information processing device performs the following steps: The temperature value detected by the detection unit is obtained. Based on the historical information of the acquired detection values, the temperature change trend of the solder processing section is determined. The number of heating pulses applied to the heating element is set by correcting the reference value using a correction value. Based on the set result of the heating pulse number, the heating pulse is controlled to be applied to the heating part. Regarding the setting of the heating pulse number, different correction information is used to set the correction value when the temperature change tendency is an upward trend and when the temperature change tendency is a downward trend.

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