Ceiling glass atmosphere lamp and mounting structure thereof

Abstract

The application discloses a ceiling glass atmosphere lamp and a mounting structure thereof. The ceiling glass atmosphere lamp comprises a lamp shell and a circuit board mounted in the lamp shell. A plurality of LED lamp beads are integrated on the circuit board. An upper surface of the lamp shell is provided with a glass connecting piece. Each LED lamp bead of the circuit board is exposed above the lamp shell. The ceiling glass atmosphere lamp and the mounting structure thereof do not need to reform and process the structure of the ceiling glass, thereby reducing the cost of the ceiling glass. Meanwhile, the light guide element is not needed to guide the light in the intermediate link, thereby greatly improving the optical utilization rate. The ceiling glass atmosphere lamp not only reduces the cost, but also reduces the limitation on the power and quantity of the LED lamp beads. Moreover, only a part of the circuit board is located outside the lamp shell, and the other part is hidden and mounted in the lamp shell, so that the problem of high temperature of the circuit board can be avoided. Furthermore, the ceiling glass can be a dome glass or a skylight glass, and the ceiling glass atmosphere lamp has good versatility.

Description

Technical Field

[0001] This invention relates to the field of automotive interior lighting technology, specifically to a roof glass ambient light and its mounting structure. Background Technology

[0002] With the rapid increase in the intelligence and electrification of automobiles, almost all new or facelifted models have introduced ambient lighting designs. By adding ambient lighting to the interior of a car, the sense of technology and luxury of the car can be greatly enhanced.

[0003] Ambient lighting is typically placed on the dashboard, door panels, air conditioning vents, and armrests. With the increasing popularity of large sunroofs and glass panoramic sunroofs, some OEMs and consumers also want to add ambient lighting or ambient lighting patterns to sunroofs and glass panoramic sunroofs to enhance their aesthetics and technological feel at night.

[0004] Therefore, please refer to Chinese Patent 202320122482.2, which describes a panoramic canopy with ambient lighting, realizing the design of ambient lighting on a glass canopy. However, this involves opening holes or slots in the canopy glass, adding an extra step and increasing costs. Furthermore, because the roughness of the glass's light-gathering surface does not meet requirements after opening holes or slots, a polishing process is required, further increasing costs. Moreover, due to structural design issues, the height of the light-emitting element does not correspond to the height of the glass's light-gathering surface, necessitating a light guide element to guide the light emitted from the light-emitting element into the glass. This not only increases costs but also reduces optical efficiency, which can only be compensated for by increasing the power or number of light-emitting elements, further increasing costs. Additionally, the large surface of the printed circuit board is directly attached to the canopy glass via adhesive, making it highly susceptible to overheating under direct sunlight.

[0005] Solving these problems is now a top priority. Summary of the Invention

[0006] To address the technical problems of existing ambient lights, such as the need to modify the glass, low optical utilization, and the tendency for printed circuit board temperatures to become too high, this invention provides a ceiling glass ambient light and its installation structure.

[0007] The technical solution is as follows:

[0008] A ceiling glass ambient light includes a lamp housing and a circuit board installed in the lamp housing. The circuit board integrates a plurality of LED beads. A glass connector is provided on the upper surface of the lamp housing. Each LED bead of the circuit board is exposed above the lamp housing.

[0009] An installation structure for a ceiling glass ambient light includes a ceiling glass and the aforementioned ceiling glass ambient light. The ceiling glass includes an outer glass layer, a glass film, and an inner glass layer that are sequentially bonded from top to bottom. The glass film has a diffusely reflective illuminated pattern on the surface of the inner glass layer or the inner glass layer has a diffusely reflective illuminated pattern on the surface of the glass film. The lamp housing is fixedly installed on the lower surface of the inner glass layer through a glass connector, and the light-emitting surface of each LED bead faces the outer edge of the inner glass layer.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0011] 1. No structural modifications or processing of the roof glass are required, reducing the cost of the roof glass;

[0012] 2. Since the lamp housing is fixedly installed on the inner glass through glass connectors, and the light-emitting surface of each LED is facing the outer edge of the inner glass, there is no need to use light guide elements for intermediate light guiding, which greatly improves the optical utilization rate, reduces costs, and reduces the restrictions on the power and number of LEDs.

[0013] 3. Only a portion of the circuit board is located outside the lamp housing, while the rest is hidden inside. This not only significantly reduces the area exposed to direct sunlight, but also prevents the roof glass from directly transferring heat to the circuit board through the glass connectors, thus avoiding the problem of the circuit board overheating.

[0014] 4. The ceiling glass can be either a skylight or a skylight, and ambient lighting can be directly installed on the ceiling glass, making it highly versatile. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the installation structure for ceiling glass ambient lighting;

[0016] Figure 2 This is a schematic diagram showing the relationship between the ambient lighting and the ceiling glass.

[0017] Figure 3 This is a structural diagram of a ceiling glass ambient light;

[0018] Figure 4 A diagram showing the ceiling glass ambient light after the top cover and wiring harness have been removed;

[0019] Figure 5 This is a schematic diagram of the shell structure;

[0020] Figure 6 This is a schematic diagram showing the relationship between the LED circuit board and the heat sink. Detailed Implementation

[0021] The present invention will be further described below with reference to the embodiments and accompanying drawings.

[0022] Example 1:

[0023] like Figures 2-6 As shown, a ceiling glass ambient light mainly includes a lamp housing 1 and a circuit board 2 installed in the lamp housing 1. The circuit board 2 integrates a number of LED beads 221. The upper surface of the lamp housing 1 is provided with a glass connector 3. Part of the circuit board 2 is exposed outside the lamp housing 1, so that each LED bead 221 of the circuit board 2 is exposed above the lamp housing 1, so as to cooperate with the ceiling glass 5 and allow the light emitted by each LED bead 221 to enter from the outer edge of the ceiling glass 5.

[0024] In this embodiment, the lamp housing 1 includes a housing 11 with an upper opening and an upper cover 12 that covers the opening of the housing 11. The housing 11 and the upper cover 12 together form a device mounting cavity. The housing 11 and the upper cover 12 are connected by a snap-fit ​​mechanism for easy disassembly and stable and reliable operation. In this embodiment, each side of the housing 11 in the width direction is provided with a snap-fit ​​protrusion 117. The upper cover 12 is integrally formed with buckles 121 that snap-fit ​​with the corresponding snap-fit ​​protrusions 117. The stability of the snap-fit ​​mechanism is ensured by the cooperation of each set of buckles 121 and snap-fit ​​protrusions 117.

[0025] Please see Figure 2 and Figure 3 The glass connector 3 is installed on the outer surface of the upper cover 12 to facilitate connection with the ceiling glass 5 and reduce the possibility of interference. In this embodiment, the glass connector 3 is an adhesive, which is applied to the outer surface of the upper cover 12 as extensively as possible, thereby bonding the upper cover 12 to the ceiling glass 5 through adhesive. This assembly is simple, stable, and reliable. Furthermore, 3M adhesive is preferably used to improve the adhesion strength. Therefore, using the ceiling glass ambient light of this embodiment, it can be directly fixed to the ceiling glass 5 through adhesive, without the need for modification or processing of the ceiling glass 5 structure, thus reducing the cost of the ceiling glass 5.

[0026] Please see Figures 2-6The installation height of each LED bead 221 is higher than the upper surface of the top cover 12. Specifically, the circuit board 2 includes a driver circuit board 21 and an LED circuit board 22 integrating LED beads 221. The driver circuit board 21 is installed in the device mounting cavity. The upper surface of the lamp housing 1 has a circuit board positioning structure adapted to the LED circuit board 22. The LED circuit board 22 extends upward and is installed on the circuit board positioning structure. Each LED bead 221 is installed on the side of the LED circuit board 22 near the glass connector 3. The driver circuit board 21 is electrically connected to the LED circuit board 22 to control the lighting status of each LED bead 221. In this embodiment, the circuit board 2 is divided into two parts, namely the driver circuit board 21 and the LED circuit board 22. Since the heat is mainly generated by the driver circuit board 21, and the driver circuit board 21 is hidden inside the lamp housing 1, the driver circuit board 21 will not contact the ceiling glass 5. Therefore, the ceiling glass will not directly transfer heat to the driver circuit board 21 through the glass connector 3, thereby avoiding the problem of the driver circuit board 21 overheating. Furthermore, the LED circuit board 22 has low operating heat, and the vertical mounting method of the LED circuit board 22 greatly reduces the area exposed to direct sunlight, which can also avoid the problem of the LED circuit board 22 overheating.

[0027] Furthermore, the lamp housing 1 is made of dark-colored light-shielding plastic material, which can further reduce the heat conduction capacity in the device mounting cavity, thereby further avoiding the problem of excessive temperature of the drive circuit board 21.

[0028] Furthermore, in this embodiment, the LED circuit board 22 is made of a flexible circuit board, which is integrally formed with a connector 222 that is compatible with the connector 211 of the driver circuit board 21. By directly inserting the connector 222 into the connector 211, it is not necessary to solder ribbon cables on the LED circuit board 22, which reduces the number of processes and improves production efficiency. Moreover, the connector 222 is not prone to breakage or loosening, which ensures the stability and reliability of the electrical connection between the driver circuit board 21 and the LED circuit board 22.

[0029] Furthermore, a heat sink 4 is attached to the side of the LED circuit board 22 away from the LED beads 221. The LED circuit board 22 is mounted on the circuit board positioning structure through the heat sink 4. By using a dedicated heat sink 4, the installation of the LED circuit board 22, made of flexible circuit board, is facilitated, and the heat dissipation capacity of the LED circuit board 22 is further improved, preventing the LED circuit board 22 from overheating. In this embodiment, the heat sink 4 is preferably made of aluminum, which not only has good heat dissipation capacity but is also cheaper and lighter than copper, reducing the overall weight of the ceiling glass ambient light and thus ensuring the stability and reliability of the adhesive bonding.

[0030] In this embodiment, each LED bead 221 is linearly distributed on the LED circuit board 22 along the length of the LED circuit board 22, which can effectively increase the light flux and improve the lighting effect when the ambient light is lit.

[0031] Please see Figures 4-6 The circuit board positioning structure includes a device mounting groove 111 formed on the upper surface of the lamp housing 1. The side wall of the device mounting groove 111 closest to each LED bead 221 is recessed to form a clearance groove 112 for each LED bead 221. The LED circuit board 22 and the heat sink 4 are mounted in the device mounting groove 111, and each LED bead 221 is exposed in the clearance groove 112. By providing the device mounting groove 111, reliable mounting of the LED circuit board 22 and the heat sink 4 is ensured. Furthermore, by providing the clearance groove 112, clearance is provided for each LED bead 221, preventing obstruction.

[0032] Furthermore, the two sides of the device mounting groove 111 are raised near both ends to form baffles 113. The two sides of the heat sink 4 are supported on the corresponding baffles 113, ensuring the installation reliability and stability of the LED circuit board 22 and the heat sink 4.

[0033] Furthermore, both ends of the device mounting slot 111 are provided with mounting clips 114, and both ends of the heat sink 4 are respectively provided with snap-fit ​​seats 41 that are adapted to the corresponding mounting clips 114. The two snap-fit ​​seats 41 are snapped onto the corresponding mounting clips 114, which further improves the installation reliability and stability of the LED circuit board 22 and the heat sink 4.

[0034] Furthermore, the bottom of the device mounting groove 111 protrudes to form at least one bottom positioning protrusion 115, and the bottom of the heat sink 4 is recessed to form bottom positioning grooves 42 that are adapted to the corresponding bottom positioning protrusions 115. Each bottom positioning protrusion 115 is embedded in the corresponding bottom positioning groove 42, which ensures the installation position accuracy of the LED circuit board 22 and the heat sink 4, ensures that the light emitted by each LED bead 221 can be accurately guided into the ceiling glass 5, and also plays a role in preventing incorrect installation and avoiding the problem of reverse installation.

[0035] Furthermore, at least one heat sink support rib 116 adapted to the heat sink 4 is formed on the side wall of the device mounting groove 111 away from the relief groove 112. The side surface of the heat sink 4 away from the LED circuit board 22 is supported on each heat sink support rib 116, which can avoid the shaking problem and further improve the installation reliability and stability of the LED circuit board 22 and the heat sink 4.

[0036] Example 2:

[0037] Please see Figure 1 and Figure 2 An installation structure for a ceiling glass ambient light includes a ceiling glass 5 and the ceiling glass ambient light of Embodiment 1. The ceiling glass 5 includes an outer glass 51, a glass film 52 and an inner glass 53 that are sequentially attached from top to bottom. A dotted pattern 54 capable of diffuse reflection is formed on the side surface of the glass film 52 near the inner glass 53 or on the side surface of the inner glass 53 near the glass film 52. The lamp housing 1 is fixedly installed on the lower surface of the inner glass 53 through a glass connector 3, and the light-emitting surface of each LED bead 221 is facing the outer edge of the inner glass 53.

[0038] Therefore, the light emitted from the light-emitting surface of each LED bead 221 enters the inner glass 53 directly from the outer edge of the inner glass 53, undergoes total internal reflection between the inner glass 53 and the glass film 52, and when it reaches the position of the illuminated pattern 54, it undergoes diffuse reflection by the illuminated pattern 54, thus achieving the effect of illuminating the pattern 54 bit by bit.

[0039] Since the lamp housing 1 is fixedly mounted on the inner glass 54 via the glass connector 3, and the emitting surface of each LED bead 221 faces the outer edge of the inner glass 53, there is no need to use a light guide element for intermediate light guiding, which greatly improves the optical utilization rate, reduces costs, and reduces restrictions on the power and number of LED beads. Furthermore, the ceiling glass 5 can be either a skylight or a canopy glass, allowing for direct installation of ambient lights, thus offering good versatility.

[0040] In this embodiment, the illuminated pattern 54 is preferably coated with ink on the glass film 52 or the inner glass layer 53, so that the illuminated pattern 54 is not visible to the human eye when it is not lit, thus improving the aesthetics of the ceiling glass 5 when the ambient light is not lit. At the same time, the illuminated pattern 54 can also be a common diffuse reflection structure such as frosted, textured, or optically serrated.

[0041] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention. Those skilled in the art, under the guidance of the present invention, can make various similar representations without departing from the spirit and claims of the present invention, and such modifications all fall within the protection scope of the present invention.

Claims

1. An installation structure for a ceiling glass ambient light, characterized in that: Including ceiling glass and ceiling glass ambient lighting; The roof glass includes an outer glass layer, a glass film, and an inner glass layer that are sequentially bonded from top to bottom. The glass film has a dotted pattern that can diffusely reflect light on the surface of the inner glass layer or the inner glass layer has a dotted pattern that can diffusely reflect light on the surface of the glass film. The ceiling glass ambient light includes a lamp housing and a circuit board installed in the lamp housing. The circuit board includes a driver circuit board and an LED circuit board with a number of LED beads integrated. The driver circuit board is installed in the device mounting cavity of the lamp housing. The driver circuit board is electrically connected to the LED circuit board to control the lighting status of each LED bead. The upper surface of the lamp housing is provided with a glass connector. The lamp housing is fixedly installed on the lower surface of the inner glass through the glass connector. Each LED bead is exposed above the lamp housing, and the light-emitting surface of each LED bead is directly facing the outer edge of the inner glass. This allows the light emitted from the light-emitting surface of each LED bead to directly enter the inner glass from the outer edge of the inner glass and propagate through total internal reflection in the inner glass and the glass film. When it reaches the position of the illuminated pattern, it undergoes diffuse reflection from the illuminated pattern. The LED circuit board is made of a flexible circuit board. The LED circuit board is mounted on the circuit board positioning structure on the upper surface of the lamp housing. Each LED bead is mounted on the side of the LED circuit board close to the glass connector. A heat sink is attached to the side of the LED circuit board away from the LED beads. The LED circuit board is mounted on the circuit board positioning structure through the heat sink. The circuit board positioning structure includes a device mounting groove formed on the upper surface of the lamp housing. The side wall of the device mounting groove near each LED bead is recessed to form a clearance groove for each LED bead. The clearance groove is located on the light emission path of each LED bead toward the outer edge of the inner glass layer. The LED circuit board and the heat sink are installed in the device mounting groove, and each LED bead is exposed in the clearance groove. The two sides of the device mounting slot are raised near both ends to form baffles, and the two sides of the heat sink are respectively supported on the corresponding baffles. Both ends of the device mounting slot are provided with mounting clips, and both ends of the heat sink are respectively provided with snap-fit ​​seats that are adapted to the corresponding mounting clips. The two snap-fit ​​seats are respectively snapped onto the corresponding mounting clips. The bottom of the device mounting slot protrudes to form at least one bottom positioning protrusion, and the bottom of the heat sink is recessed to form bottom positioning grooves that are adapted to the corresponding bottom positioning protrusions. Each bottom positioning protrusion is embedded in the corresponding bottom positioning groove. At least one heat sink support rib adapted to the heat sink is formed on the side wall of the device mounting groove away from the relief groove. The side surface of the heat sink away from the LED circuit board is supported on each heat sink support rib so that each LED on the LED circuit board is kept in the light-incident position facing the outer edge of the inner glass.

2. The installation structure for the ceiling glass ambient light according to claim 1, characterized in that: The lamp housing includes a housing with an upper opening and an upper cover that covers the opening of the housing. The housing and the upper cover together form a device mounting cavity. The glass connector is installed on the outer surface of the upper cover. The mounting height of each LED bead is higher than the upper surface of the upper cover.

3. The installation structure for the ceiling glass ambient light according to claim 1, characterized in that: Each LED bead is linearly distributed on the LED circuit board along its length.

4. The installation structure of the ceiling glass ambient light according to claim 1, characterized in that: The glass connector is made of adhesive, which is applied to the outer surface of the top cover.

5. The installation structure of the ceiling glass ambient light according to claim 1, characterized in that: The illuminated pattern is created by coating the glass film or inner glass with ink.

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