Host cooling device and multimedia host

Abstract

This invention discloses a host computer heat dissipation device, including a thermally conductive bracket, a thermally conductive block, a cooling fan, a heat dissipation fin module, and a heat pipe. The thermally conductive bracket includes a first part and a second part. The heat dissipation fin module has a first heat dissipation channel and is located above the second part in thermal contact. The cooling fan is mounted above the thermally conductive bracket to form a second heat dissipation channel between the cooling fan and the thermally conductive bracket. A first air inlet and a second air inlet are formed above and below the cooling fan, and an air outlet communicating with the first heat dissipation channel is formed on the left side. The thermally conductive block is installed below the first part and in thermal contact with the first part. The thermally conductive block is in thermal contact with the core chip on the circuit board. One end of the heat pipe is installed between the first part and the thermally conductive block, and the other end is installed in the heat dissipation fin module. The host computer heat dissipation device of this invention has high heat dissipation efficiency. This invention also discloses a multimedia host computer.

Description

Technical Field

[0001] This invention relates to a heat dissipation structure for a host computer, and more particularly to the installation of a cooling fan in the heat dissipation structure. Background Technology

[0002] Due to the increasing complexity of vehicle electronics, a single vehicle requires dozens or even hundreds of ECUs for control. Such a large number of ECUs intertwined not only leads to a very complex wiring harness design, but also to a very mixed logic control. Traditional distributed architectures can no longer meet the ever-increasing computing demands.

[0003] With the development of automotive electronics in recent years, especially the use of high-performance MCUs, automotive electronics have mainly formed a functional "domain" architecture. A typical vehicle electronic and electrical architecture is divided into five main domains: powertrain, chassis control, body control, ADAS, and entertainment system. Each domain has a main high-performance ECU (Domain Controller) responsible for handling and forwarding functions within the domain. Low-speed buses are generally used within domains, while high-speed buses or the now more commonly used automotive Ethernet are used for interconnection between domains.

[0004] Compared to traditional controllers, this type of domain controller requires more high-power ICs and interfaces. Furthermore, with the rapid development of intelligent cockpits towards multi-functionality in the automotive industry, the mainstream platform is a high-power platform, demanding higher requirements for host computer heat dissipation performance, better compatibility, and smaller size and weight. Therefore, domain controller host computers typically have heat dissipation devices installed on their heat sink housings.

[0005] Referring to Chinese Patent CN2624399Y, a heat dissipation module structure for an electronic device is disclosed, including a base, an elastic arm, a heat pipe, a heat dissipation fin assembly, and a cooling fan. A heat-conducting block is disposed on the base, contacting the surface of the central processing unit. The elastic arm fixes the base to the motherboard. The base has a mounting opening, and the cooling fan is mounted at the mounting opening. The heat dissipation fins are mounted on the base. One end of the heat pipe is installed between the base and the heat-conducting block, and the other end is installed on the heat dissipation fins. However, this heat dissipation module structure requires fixing the base around the heat-conducting block and around the cooling fan to the circuit board, resulting in too many fixing points. Furthermore, the base mainly serves a supporting function, and the heat generated by the central processing unit is primarily transferred to the heat dissipation fins through the heat pipe, resulting in poor heat dissipation.

[0006] Therefore, there is an urgent need for a heat dissipation module structure that can solve the above problems. Summary of the Invention

[0007] The purpose of this invention is to provide a host heat dissipation device and an in-vehicle multimedia host with high heat dissipation efficiency.

[0008] To achieve the above objectives, the present invention discloses a host heat dissipation device, including a thermally conductive bracket, a thermally conductive block, a cooling fan, a heat dissipation fin module, and a heat pipe. The thermally conductive bracket includes a first part and a second part, the second part being located to the left of the first part. The heat dissipation fin module has a first heat dissipation channel located above the second part and in thermal contact with the second part. The cooling fan is mounted on the thermally conductive bracket and spaced above the first part to form a second heat dissipation channel between the cooling fan and the thermally conductive bracket. A first air inlet is formed above the cooling fan, an air outlet communicating with the first heat dissipation channel is formed on the left side, and a second air inlet communicating with the second heat dissipation channel is formed on the lower side. The thermally conductive block is mounted below the first part and in thermal contact with the first part. The lower side of the thermally conductive block is in thermal contact with the core chip on the circuit board. The heat absorption section of the heat pipe is mounted between the first part and the thermally conductive block and in thermal contact with both the thermally conductive block and the first part. The heat dissipation section of the heat pipe is mounted in the heat dissipation fin module.

[0009] Preferably, the host heat dissipation device further includes a second heat dissipation fan group located on the front or rear side of the heat conduction bracket. The second heat dissipation channel runs through the heat conduction bracket in the front-back direction. The air outlet of the second heat dissipation fan group is arranged in the front-back direction and communicates with the second heat dissipation channel. The second heat dissipation fan group effectively increases the air volume and air speed in the second heat dissipation channel, and allows some heat to be directly output to the outside along the second heat dissipation channel under the influence of the second heat dissipation fan, without passing through the heat dissipation fin module, reducing the burden on the heat dissipation fin module, and still maintaining the heat dissipation capacity at the core chip when the first heat dissipation channel is blocked.

[0010] Preferably, the heat-conducting bracket has supporting bosses protruding on both sides of the first part. The heat-conducting bracket is fixed to the circuit board by the supporting bosses, and an installation area for installing the heat-conducting block is formed between the heat-conducting bracket and the circuit board, so that the heat-conducting block and the core chip can be directly and completely attached.

[0011] Specifically, the host heat dissipation device also includes an elastic mounting component. The support boss is provided with mounting holes. The elastic mounting component passes through the mounting holes and is fixedly connected to the circuit board. It also provides a downward pressing force to the heat-conducting bracket, effectively controlling the squeezing force between the heat-conducting block and the core chip, so that the heat-conducting block can effectively contact the core chip while preventing the pressure on the heat-conducting block from being too high.

[0012] Preferably, a third portion is formed between the first and second portions of the heat-conducting bracket and spaced above the circuit board. Mounting bosses are formed on the first and third portions respectively, so that part of the cooling fan is mounted on the first portion and part is mounted on the third portion. This design allows the cooling fan to not only transport the heat from the core chip through the second heat dissipation channel, but also output the heat generated below the area between the first and second portions, so that the area below the third portion can be used to mount secondary heat-generating components.

[0013] Preferably, the heat-conducting block is recessed with a groove for embedding the heat-absorbing section, and the heat-dissipating section extends through the heat dissipation fin module in the front-to-back direction.

[0014] Preferably, the heat-conducting bracket is block-shaped, which makes the overall stability of the heat-conducting bracket high and can be fixed to the circuit board with only a few mounting points.

[0015] The heat-conducting support is a copper block or an aluminum block, and the heat-conducting block is a copper block.

[0016] The present invention also discloses a multimedia host, including a housing, a circuit board installed in the housing, and the aforementioned host heat dissipation device. The housing has heat dissipation holes corresponding to the first heat dissipation channel and the second heat dissipation channel, respectively. The upper surface of the housing also has an air inlet window corresponding to the first air inlet of the cooling fan.

[0017] Preferably, a third part is formed between the first part and the second part of the heat-conducting bracket. The cooling fan is partially mounted on the first part and partially mounted on the third part. The circuit board includes a main mounting area for mounting the core chip and a secondary mounting area for mounting secondary heat-generating devices. The first part is mounted above the main mounting area, and the third part is mounted above the secondary mounting area. This allows full utilization of the space below the cooling fan on the circuit board, eliminating the need for a dedicated mounting area for the cooling fan on the circuit board. Furthermore, the components mounted below the third part can be cooled by the third part and the cooling fan.

[0018] Specifically, the circuit board also includes a graphics card mounting area for mounting the graphics card. The graphics card mounting area is located on the front and rear sides of the heat conduction bracket, and a second cooling fan group is mounted above the graphics card mounting area. At least one air outlet of the second cooling fan group is located on the front or rear side of the cooling fan and is connected to the second heat dissipation channel. An air inlet window connected to the air inlet of the second cooling fan group is also provided on the upper shell surface of the housing, which effectively increases the air volume in the second heat dissipation channel, further increases the heat dissipation efficiency at the core chip, and makes the heat dissipation of the graphics card and the heat dissipation of the core chip linked.

[0019] Preferably, the multimedia host is a vehicle-mounted multimedia host, and the upper shell surface of the housing is also equipped with a cooling water tank that matches the position of the vehicle air conditioner outlet. A water suction component is installed in the cooling water tank, and one side of the cooling water tank extends to one side of the housing and bends downward to form a water guide plate to guide excess water from the vehicle air conditioner to the outside of the multimedia host. This solution can effectively prevent water from the vehicle air conditioner from leaking too much and flowing into the multimedia host. The water suction component can also retain some cooling water, reducing the temperature of the multimedia host housing and playing a cooling role.

[0020] Compared with existing technologies, in one respect, the host heat dissipation device of this invention uses a thermally conductive bracket instead of a traditional bracket, so that the bracket, after installing the cooling fan and thermally conductive block, also has heat dissipation and heat conduction functions. Simultaneously, this invention mounts the cooling fan above the thermally conductive bracket, forming a second heat dissipation channel between them. This divides the heat into three parts: the first part travels from the thermally conductive block → heat pipe → heat dissipation fin module; the second part travels from the thermally conductive block → thermally conductive bracket → heat dissipation fin module; and the third part travels from the thermally conductive block → thermally conductive bracket → second heat dissipation channel → cooling fan duct → heat dissipation fin module. Finally, the heat from the heat dissipation fin module is uniformly output to the outside of the host through the cooling fan. This adds two additional heat dissipation paths, preventing heat accumulation at core chips (including the host's CPU, CPU, etc.) due to insufficient heat pipe cooling. Furthermore, mounting the cooling fan above the thermally conductive bracket and forming a second heat dissipation channel between them also ensures sufficient airflow on the thermally conductive bracket, especially above the first part, further increasing the heat diffusion rate, preventing heat accumulation, and improving heat dissipation efficiency. On the other hand, the cooling fan spacing of the present invention is mounted (suspended or suspended) on the heat-conducting bracket. Therefore, the position of the heat-conducting bracket for installing the cooling fan does not have a hollow structure to cooperate with the cooling fan. The structure is stable, and the installation position of the heat-conducting bracket and the circuit board does not need to be set around the cooling fan, which can effectively reduce the installation position between the heat-conducting bracket and the circuit board. Attached Figure Description

[0021] Figure 1 This is a perspective view of the multimedia host of the present invention.

[0022] Figure 2 This is an exploded view of the multimedia host of the present invention.

[0023] Figure 3 This is a structural diagram of the host heat dissipation device of the present invention.

[0024] Figure 4 This is a top view of the heat dissipation device of the host computer according to the present invention.

[0025] Figure 5 It is along Figure 4 A cross-sectional view along line AA in the middle.

[0026] Figure 6 This is an exploded view of the host heat dissipation device of the present invention.

[0027] Figure 7 This is a partially exploded view of the heat dissipation device of the host computer of the present invention. Detailed Implementation

[0028] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0029] refer to Figure 1 and Figure 2 This invention discloses a multimedia host 100, including a housing 10, a circuit board 20 installed within the housing 10, and a host heat dissipation device 30. The housing 10 has air inlet windows 11 corresponding to the fans in the host heat dissipation device 30 and heat dissipation holes 12 corresponding to the air outlets of the host heat dissipation device 30. The circuit board 20 includes a core chip 21, which is a high-heat-generating chip, such as a CPU.

[0030] refer to Figures 3 to 6 The host cooling device 30 includes a heat-conducting bracket 31, a heat-conducting block 32, a cooling fan 33, a heat dissipation fin module 34, and a heat pipe 35. The heat-conducting bracket 31 includes a first part 301 and a second part 302, with the second part 302 located to the left of the first part 301. The heat dissipation fin module 34 has a first heat dissipation channel 341 and is located above the second part 302, making thermal contact with it. The cooling fan 33 is mounted on the heat-conducting bracket 31 and spaced above the first part 301 to form a second heat dissipation channel 36 between the cooling fan 33 and the heat-conducting bracket 31. The cooling fan 33 has a first air inlet 331 above it, a first air outlet 341 communicating with the first heat dissipation channel 341 on its left side, and a second air outlet 35 on its lower side. The second air inlet 332 is connected to the heat dissipation channel 36. The heat-conducting block 32 is installed below the first part 301 and in thermal contact with the first part 301. The lower side of the heat-conducting block 32 is in thermal contact with the core chip 21 on the circuit board 20. The heat absorption section of the heat pipe 35 is installed between the first part 301 and the heat-conducting block 32 and in thermal contact with both the heat-conducting block 32 and the first part 301. The heat dissipation section of the heat pipe 35 is installed in the heat dissipation fin module 34. The cooling fan 33 draws air in from the first air inlet 331 and the second air inlet 332 and outputs it from the air outlet 333, so that the air flows through the second heat dissipation channel 36 → the air duct of the cooling fan 33 → the first heat dissipation channel 341, so as to remove the heat from the first part 301 of the heat-conducting bracket 31 and the heat dissipation fin module 34. The airflow direction of the cooling fan 33 is shown by the arrow in the figure.

[0031] In this embodiment, the cooling fan 33 is a vortex fan. In this embodiment, the heat dissipation fin module 34 is directly mounted on the housing 10 via a mounting bracket (located on the left half of the lower side of the heat dissipation fin module 34). The first part 301 of the heat-conducting bracket 31 is located on the right half of the lower side of the heat dissipation fin module 34 and, together with the mounting bracket, supports the heat dissipation fin module 34. The heat dissipation fin module 34 is composed of multiple heat sinks arranged at intervals along the front-to-back direction, so that the first heat dissipation channel 341 is arranged along the left-to-right direction.

[0032] refer to Figure 7 The heat-conducting bracket 31 is block-shaped and does not have a perforated structure at the location of the cooling fan 33. The heat-conducting bracket 31 is fixed to the circuit board 20 only through four mounting points. In this embodiment, the heat-conducting bracket 31 is a copper block, and the heat-conducting block 32 is also a copper block. Of course, the heat-conducting bracket 31 can also be set as a block structure made of aluminum or other materials with high thermal conductivity. The lower surface of the heat-conducting block 32 can directly abut against the upper surface of the core chip 21, or it can be glued together with thermally conductive adhesive, which can be thermally conductive silicone and also serve as a cushioning agent.

[0033] The heat-conducting block 32 has a recessed groove 321 for embedding the heat-absorbing section of the heat pipe 35. The heat-dissipating section of the heat pipe 35 penetrates the heat dissipation fin module 34 in the front-to-back direction to quickly transfer the heat absorbed by the heat-conducting block 32 to the heat dissipation fin module 34. In this embodiment, the heat pipe 35 is elliptical and is a hollow tube filled with heat-conducting fluid.

[0034] refer to Figure 2 The front, rear, and left shell surfaces of the housing 10 have heat dissipation holes 12 corresponding to the first heat dissipation channel 341 and the second heat dissipation channel 36, respectively. The upper shell surface of the housing 10 also has an air inlet window 11 communicating with the first air inlet 331 of the cooling fan 33. The heat dissipation hole 12 on the left shell surface corresponding to the first heat dissipation channel 341 is a square opening. The upper, left, right, and lower shell surfaces of the housing 10 of this invention are all covered with heat dissipation holes 12.

[0035] In this invention, the heat generated by the core chip 21 is output in three parts. The first part 301 goes from the heat-conducting block 32 → heat pipe 35 → heat sink module 34. The second part 302 goes from the heat-conducting block 32 → heat-conducting bracket → heat sink module 34. The third part 303 goes from the heat-conducting block 32 → heat-conducting bracket 31 → second heat dissipation channel 36 → cooling fan 33 air duct → heat sink module 34. Finally, the heat in the heat sink module 34 is output to the outside of the host through the cooling fan 33.

[0036] refer to Figure 3The circuit board 20 also includes a graphics card mounting area for mounting a graphics card. The graphics card mounting area is located on the front or rear side of the heat-conducting bracket 31, and a second cooling fan assembly 37 is mounted above the graphics card mounting area. At least one air outlet of the second cooling fan assembly 37 is located on the front or rear side of the cooling fan 33 and is in communication with the second heat dissipation channel 36. The upper shell surface of the housing 10 is also provided with an air inlet window 11 communicating with the air inlet 371 of the second cooling fan assembly 33. The second heat dissipation channel 36 runs through the heat-conducting bracket in the front-back direction. In this embodiment, the second cooling fan assembly 37 has one air outlet in the front-back direction, and the air inlet and outlet directions of the second cooling fan assembly 37 are shown by arrows.

[0037] refer to Figures 3 to 7 The heat-conducting bracket 31 has supporting bosses 311 protruding on both sides of the first part 301. The heat-conducting bracket 31 is fixed to the circuit board 20 through the supporting bosses 311, and an installation area for installing the heat-conducting block 32 is formed between the heat-conducting bracket 31 and the circuit board 20, so that the heat-conducting block 32 and the core chip 21 can be directly and completely attached.

[0038] refer to Figure 5 and Figure 6 The host heat dissipation device 30 also includes an elastic mounting component 40. The support boss 31 in the middle of the heat conduction bracket 10 is rectangular. The support boss 311 on the right side of the heat conduction bracket 10 includes a boss support arm and a mounting platform 314 extending outward along the boss support arm. The rectangular support boss 31 and the mounting platform 314 are respectively provided with a plurality of mounting holes 313. The elastic mounting component 40 passes through the mounting holes 313 and is fixedly connected to the circuit board 20, and provides a downward pressing force to the heat conduction bracket 31, effectively controlling the squeezing force between the heat conduction block 32 and the core chip 21, so that the heat conduction block 32 can effectively contact the core chip 21 while preventing the pressure of the heat conduction block 32 from being too high.

[0039] refer to Figure 5 and Figure 6 The elastic mounting assembly 40 includes a fixing rod 41 and an elastic element 42. The fixing rod 41 passes through the mounting hole 313 and is fixedly connected to the circuit board 20 via a fixing hole (threaded connection, riveting, etc.). The elastic element 42 is sleeved on the fixing rod 41 and provides a downward pressing force to the mounting platform 314 extending outward from the support boss 311 and the rectangular support boss 31. In this embodiment, the elastic element 42 is a columnar spring.

[0040] refer to Figure 6The heat conduction bracket 31 has a recess 315 at the position of the mounting hole 313 located below the cooling fan 33, through which the head of the fixing rod 41 passes. The mounting hole 313 is located at the bottom of the recess 315.

[0041] refer to Figure 5 and Figure 7 A third part 303 is formed between the first part 301 and the second part 302 of the heat-conducting bracket 31 and is spaced above the circuit board 20. Mounting bosses 312 are formed on the first part 301 and the third part 303 respectively, so that part of the cooling fan 33 is mounted on the first part 301 and part is mounted on the third part 303.

[0042] refer to Figure 6 The circuit board 20 includes a main mounting area 201 for mounting the core chip 21 and a secondary mounting area 202 for mounting secondary heat-generating components 22. The first part 301 is mounted above the main mounting area 201, and the third part 303 is mounted above the secondary mounting area 202. This allows full utilization of the space below the cooling fan 33 on the circuit board 20, eliminating the need for a dedicated mounting area for the cooling fan 33 on the circuit board 20. Furthermore, components mounted below the third part 303 can be cooled using the third part 303 and the cooling fan 33. The chips on the circuit board 20 are rationally arranged according to power consumption and electrical requirements. High-power ICs are concentrated at the corresponding airflow ducts of the cooling fan, while low-power ICs are placed in other locations away from the cooling fan. This ensures uniform heat dissipation across the entire host casing, allowing for rapid heat dissipation and preventing heat transfer between ICs from affecting host performance.

[0043] refer to Figure 1 The multimedia host 100 is a vehicle-mounted multimedia host 100. A cooling water tank 50, which mates with the outlet of the vehicle's air conditioning system, is installed on the upper surface of the housing 10. A water-absorbing component 51 is installed inside the cooling water tank 50, and one side of the cooling water tank 50 extends to one side of the housing 10 and bends downward to form a water guide plate 52 to drain excess water from the vehicle's air conditioning system to the outside of the multimedia host 100. The water guide plate 52 extends to the lower side of the housing 10. In this embodiment, the water-absorbing component 51 is foam. The location mates with the outlet of the vehicle's air conditioning system refers to the area below the outlet where the vehicle's air conditioning system is prone to leaks. The water guide plate 52 extends to the lower side of the housing 10. The cooling water tank 50 and the water guide plate 52 are made of PC and ABS materials.

[0044] This invention greatly increases the heat dissipation effect of the multimedia host 100, enabling it to meet the heat dissipation requirements of the cockpit of an automotive intelligent gaming platform, breaking the traditional cockpit structure design scheme, and facilitating the automotive industry to develop towards high functional integration.

[0045] In this invention, left and right, front and back refer to relative positional relationships, not absolute positional relationships.

[0046] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A host computer heat dissipation device, characterized in that: The device includes a heat-conducting bracket, a heat-conducting block, a cooling fan, a heat dissipation fin module, and heat pipes. The heat-conducting bracket comprises a first part and a second part, with the second part located to the left of the first part. The heat dissipation fin module has a first heat dissipation channel and is located above and in thermal contact with the second part. The cooling fan is mounted on the heat-conducting bracket and spaced above the first part to form a second heat dissipation channel between the cooling fan and the heat-conducting bracket. The cooling fan has a first air inlet above it, an air outlet on its left side communicating with the first heat dissipation channel, and a second air inlet on its lower side communicating with the second heat dissipation channel. The heat-conducting block is mounted on the heat-conducting bracket. The first part is below and in thermal contact with the first part. The lower side of the heat-conducting block is in thermal contact with the core chip on the circuit board. The heat-absorbing section of the heat pipe is installed between the first part and the heat-conducting block and is in thermal contact with the heat-conducting block and the first part respectively. The heat-dissipating section of the heat pipe is installed in the heat dissipation fin module, thereby forming three heat dissipation paths, which include: a first heat dissipation path in which heat is supplied sequentially through the heat-conducting block, the heat pipe, and the heat dissipation fin module; a second heat dissipation path in which heat is supplied sequentially through the heat-conducting block, the heat-conducting bracket, and the heat dissipation fin module; and a third heat dissipation path in which heat is supplied sequentially through the heat-conducting block, the heat-conducting bracket, the second heat dissipation channel, the heat dissipation fan duct, and the heat dissipation fin module.

2. The host heat dissipation device as described in claim 1, characterized in that: It also includes a second cooling fan assembly located on the front or rear side of the heat-conducting bracket, the second heat dissipation channel running through the heat-conducting bracket in the front-back direction, and the air outlet of the second cooling fan assembly being arranged in the front-back direction and communicating with the second heat dissipation channel.

3. The host heat dissipation device as described in claim 1, characterized in that: The heat-conducting bracket has supporting bosses protruding on both sides of the first part. The heat-conducting bracket is fixed to the circuit board by the supporting bosses, and an installation area for installing the heat-conducting block is formed between the heat-conducting bracket and the circuit board.

4. The host heat dissipation device as described in claim 3, characterized in that: It also includes a flexible mounting component, wherein the support boss is provided with a mounting hole, the flexible mounting component passes through the mounting hole and is fixedly connected to the circuit board, and provides a downward elastic force to the heat-conducting bracket.

5. The host heat dissipation device as described in claim 1, characterized in that: A third portion is formed between the first and second portions of the heat-conducting bracket and spaced above the circuit board. Mounting bosses are formed on the first and third portions respectively, so that part of the cooling fan is mounted on the first portion and part is mounted on the third portion.

6. The host heat dissipation device as described in claim 1, characterized in that: The heat-conducting support is in the shape of a block, which is either a copper block or an aluminum block, and the heat-conducting block is a copper block.

7. The host heat dissipation device as described in claim 1, characterized in that: The heat-conducting block has a recessed groove for embedding the heat-absorbing section, and the heat-dissipating section extends through the heat dissipation fin module in the front-to-back direction.

8. A multimedia host, characterized in that: The device includes a housing, a circuit board installed inside the housing, and a host heat dissipation device. The host heat dissipation device is the host heat dissipation device as described in any one of claims 1-7. The housing has heat dissipation holes corresponding to the first heat dissipation channel and the second heat dissipation channel, respectively. The upper surface of the housing also has an air inlet window corresponding to the first air inlet of the cooling fan.

9. The multimedia host as described in claim 8, characterized in that: A third part is formed between the first part and the second part of the heat-conducting bracket. Part of the cooling fan is mounted on the first part and part is mounted on the third part. The circuit board includes a main mounting area for mounting the core chip and a secondary mounting area for mounting secondary heat-generating devices. The first part is mounted above the main mounting area and the third part is mounted above the secondary mounting area.

10. The multimedia host as described in claim 9, characterized in that: The circuit board also includes a graphics card mounting area for mounting a graphics card. The graphics card mounting area is located on the front and rear sides of the heat conduction bracket, and a second cooling fan group is mounted above the graphics card mounting area. At least one air outlet of the second cooling fan group is located on the front or rear side of the cooling fan and is connected to the second heat dissipation channel. An air inlet window connected to the air inlet of the second cooling fan group is also provided on the upper shell surface of the housing.

11. The multimedia host as described in claim 8, characterized in that: The multimedia host is a vehicle-mounted multimedia host. The upper shell of the housing is also equipped with a cooling water tank that matches the position of the vehicle air conditioner outlet. A water suction component is installed in the cooling water tank, and one side of the cooling water tank extends to one side of the housing and bends downward to form a water guide plate to drain excess water from the vehicle air conditioner to the outside of the multimedia host.

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