System chip locking control method, chip heat dissipation device and readable storage medium

Abstract

The application discloses a system chip locking control method, a chip heat dissipation device and a readable storage medium, relates to the locking process technical field, and the system chip locking control method comprises the following steps: acquiring the coupling capacitance value between the metal sheet and the heat dissipation sheet of the heat dissipation device arranged on the system chip in sequence; determining the gap state between the metal sheet and the heat dissipation sheet according to the coupling capacitance value; and adjusting the distance between the heat dissipation sheet and the system chip at each position to be consistent according to the gap state and the locking assembly of the system chip.

Description

Technical Field

[0001] This application relates to the field of latching technology, and in particular to a system chip latching control method, a chip heat dissipation device, and a readable storage medium. Background Technology

[0002] Nowadays, electronic products generate more and more heat as their power increases, with chips being particularly prone to overheating. Therefore, heat dissipation design for chips is crucial, and adding heat sinks to System-on-Chips (SoCs) is a common design approach. Typically, the heat sink covers the SoC, adhering tightly to it, and is secured around its perimeter (usually the four sides) with fastening attachments (such as screws). However, in practical applications, due to manufacturing processes and component dimensional tolerances, even with the same fastening force from each attachment, there can still be some distance difference between the SoC and the heat sink at different locations. This distance difference results in inconsistent heat dissipation from the heat sink at different points on the SoC, reducing the overall heat dissipation efficiency of the SoC. Summary of the Invention

[0003] The main objective of this invention is to provide a system-on-a-chip (SoC) latching control method, a chip heat dissipation device, and a readable storage medium. The aim is to improve the heat dissipation efficiency of the SoC by ensuring uniform bonding gap between the SoC and the heat sink through this SoC latching control method.

[0004] To achieve the above objectives, the present invention provides a system chip latch-up control method, the system chip latch-up control method comprising: Obtain the coupling capacitance value between the metal plates and the heat sink of the heat sink that are sequentially arranged on the system chip; The gap state between the metal sheet and the heat sink is determined based on the coupling capacitance value; Based on the gap state and the locking components of the system chip, the spacing between the heat sink and the system chip at each position is adjusted to be consistent.

[0005] Optionally, the step of obtaining the coupling capacitance value between the metal sheet and the heat sink sequentially arranged on the system chip includes: The conductive components are used to contact the corresponding positions of each metal sheet on the heat sink, and the coupling capacitance value between the corresponding position of each metal sheet on the heat sink and the corresponding metal sheet is read by the touch chip.

[0006] Optionally, the gap state includes a gap difference, and the step of determining the gap state between the metal sheet and the heat sink based on the coupling capacitance value includes: The location of the metal sheet with the largest coupling capacitance value is selected as the reference position, and the coupling capacitance difference between the coupling capacitance values ​​at the locations of other metal sheets and the coupling capacitance value at the reference position is calculated. Based on a preset mapping table between coupling capacitance values ​​and spacing and the differences between the coupling capacitance values, the spacing difference between the spacing at the location of other metal plates and the spacing at the reference location is determined, wherein the spacing is the spacing between each location on the heat sink and the system chip.

[0007] Optionally, before the step of determining the spacing difference between the spacing at the location of other metal sheets and the spacing at the reference location based on a preset mapping table between coupling capacitance values ​​and spacing and the differences in each of the coupling capacitance values, the method further includes: The spacing between the first preset position on the heat sink and the corresponding metal plate on the system chip is adjusted to each preset distance; Detect the coupling capacitance value between the first preset position and the corresponding metal sheet at each preset distance; Based on each preset distance and the corresponding coupling capacitance value, a preset mapping table between the coupling capacitance value and the spacing is generated.

[0008] Optionally, before adjusting the spacing between the heatsink and the system chip at various locations to be consistent based on the gap state and the latching components of the system chip, the method further includes: A preset pulse signal is sent to the drive component in the locking assembly, and the corresponding locking accessory is driven to rotate by the drive component. The control distance corresponding to the preset pulse signal is determined, wherein the locking accessory and the metal plate are arranged in a group.

[0009] Optionally, adjusting the spacing between the heatsink and the system chip at various locations to be consistent based on the gap state and the system chip's latching components includes: The corresponding target pulse signal is determined based on the control distance corresponding to the preset pulse signal and the distance difference between each of the preset pulse signals; Each of the target pulse signals is sent to the driving component, and the driving component drives the lock attachments corresponding to the positions of the other metal pieces to rotate according to each of the target pulse signals, so as to adjust the spacing at the positions of the other metal pieces to be consistent with the spacing at the reference position.

[0010] Furthermore, to achieve the above objectives, the present invention also provides a chip heat dissipation device, which is used to implement the system chip latching control method, and the chip heat dissipation device includes: A radiator, the radiator comprising at least one heat sink fin; A metal sheet, one side of which is disposed opposite to the heat sink and the other side is attached to the system chip; A locking assembly, comprising a driver and a plurality of locking attachments connected to the driver, the locking attachments being used to adjust the spacing between the heat sink and the system chip; The processor is connected to both the metal plate and the drive unit.

[0011] Optionally, the chip heat dissipation device further includes: A conductive component, which is grounded and movably disposed on the side of the heat sink away from the system chip, so as to contact different positions of the heat sink; A touch chip is connected to both the metal plate and the processor. The touch chip is used to collect the coupling capacitance value when the conductive element contacts the heat sink at different positions.

[0012] Optionally, the heat sink and / or the metal sheet is a copper sheet, and the locking attachment is evenly disposed in the peripheral area of ​​the metal sheet.

[0013] In addition, to achieve the above objectives, the present invention also provides an electronic device, the electronic device comprising: a memory, a processor, and a system chip latching control program stored in the memory and executable on the processor, wherein the system chip latching control program, when executed by the processor, implements the steps of the system chip latching control method as described above.

[0014] In addition, to achieve the above objectives, the present invention also provides a computer-readable storage medium storing a system chip latching control program, wherein the system chip latching control program, when executed by a processor, implements the steps of the system chip latching control method as described above.

[0015] This application proposes a system chip latching control method, a chip heat dissipation device, and a readable storage medium. By obtaining the coupling capacitance value between a metal sheet and a heat sink sequentially arranged on the system chip, and then determining the gap state between the metal sheet and the heat sink based on the coupling capacitance value, the spacing between the heat sink and the system chip at each position is adjusted to be consistent based on the gap state and the latching components of the system chip.

[0016] Thus, this embodiment determines the corresponding spacing state by detecting the coupling capacitance value between each position on the heat sink and the corresponding metal plate on the system chip, and adjusts the spacing between the heat sink and the system chip to be consistent, so that the gap between the system chip and the heat sink is evenly distributed, thereby ensuring that the heat dissipation effect of each part is consistent. That is, this embodiment first achieves accurate measurement of the gap, and then further adjusts the spacing according to the measured gap state, eliminating the gap difference, ensuring that the heat sink and the system chip remain parallel and the gap is minimized, effectively improving the heat dissipation efficiency of the system chip. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating the steps of the first embodiment of the system chip latch-up control method of the present invention; Figure 2 This is a flowchart illustrating the steps of the third embodiment of the system chip latch-up control method of the present invention; Figure 3 This is a flowchart illustrating the steps of the fourth embodiment of the system chip latching control method of the present invention; Figure 4 This is a schematic diagram of the chip heat dissipation device of the present invention; Figure 5 This is a schematic diagram showing the distribution of the first preset positions of each metal sheet and the second preset positions of each locking accessory in the chip heat dissipation device of the present invention. The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0018] Explanation of icon numbers: Detailed Implementation It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0019] Reference Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the system chip latch-up control method of the present invention. In the first embodiment of the system chip latch-up control method of the present invention, the method includes: Step S10: Obtain the coupling capacitance value between the metal sheet and the heat sink of the heat sink that are sequentially set on the system chip; In this embodiment, the heat sink covers the system chip (SoC) for heat dissipation. The SoC can be mounted on a PCB (Printed Circuit Board). Multiple independent metal plates are attached to the SoC, either together or integrated into the SoC design. Each metal plate is positioned between the SoC and the heat sink. Because the heat sink and SoC are fixed and attached by locking devices, a certain gap exists. Therefore, each metal plate and the heat sink form a coupling capacitance. The coupling capacitance value between each metal plate and the heat sink can be used to characterize the distance between them.

[0020] It should be noted that in the system chip locking control method, each metal sheet is evenly distributed on the system chip. In one feasible embodiment, the number of metal sheets and locking elements can be four each, and they are arranged in pairs, distributed at the four corners of the rectangular system chip. The coupling capacitance value between the metal sheet and the heat sink can be used to determine the distance between the system chip and the heat sink at the positions of the four metal sheets.

[0021] Step S20: Determine the gap state between the metal sheet and the heat sink based on the coupling capacitance value; In this embodiment, due to the influence of the manufacturing process and component dimensional tolerances in the production line, the spacing between each metal sheet and the heat sink may be different, resulting in different coupling capacitance values. Furthermore, a larger coupling capacitance value corresponds to a smaller spacing. Therefore, this embodiment uses the coupling capacitance value to characterize the gap state between the metal sheet and the heat sink. This gap state can be the spacing itself, or the difference in spacing between each metal sheet and the heat sink. This difference in spacing can be used as a reference when adjusting the spacing between the system chip and the heat sink, facilitating the adjustment of the spacing between the heat sink and the system chip at various locations to be consistent.

[0022] Step S30: Based on the gap state and the locking components of the system chip, adjust the spacing between the heat sink and the system chip at each position to be consistent.

[0023] In this embodiment, the locking assembly includes a driving component and locking attachments. A helical stepper motor can be used as the driving component to control the rotation of the locking attachments. The locking attachments can be screws. Each locking attachment is mounted on the system chip and the heat sink, and can be used to tighten or widen the gap between the system chip and the heat sink. Specifically, the position of each locking attachment corresponds one-to-one with the position of each metal piece, and is located on the periphery of each metal piece's position. When each locking attachment is driven to rotate, it affects the gap at the corresponding metal piece position, thereby adjusting the gap at each position. After adjusting the gap between the heat sink and the system chip at each position to be consistent, the heat sink and the system chip are on two parallel planes, and the gap at each position is evenly distributed. This effectively improves the heat dissipation efficiency of the system chip.

[0024] In this embodiment of the application, the system chip latching control method obtains the coupling capacitance value between the metal sheet and the heat sink of the heat sink sequentially arranged on the system chip, determines the gap state between the metal sheet and the heat sink based on the coupling capacitance value, and then adjusts the spacing between the heat sink and the system chip at each position to be consistent based on the gap state and the latching component of the system chip.

[0025] Thus, this embodiment determines the corresponding spacing state by detecting the coupling capacitance value between each position on the heat sink and the corresponding metal plate on the system chip, and adjusts the spacing between the heat sink and the system chip to be consistent, so that the gap between the system chip and the heat sink is evenly distributed, thereby ensuring that the heat dissipation effect of each part is consistent. That is, this embodiment first achieves accurate measurement of the gap, and then further adjusts the spacing according to the measured gap state, eliminating the gap difference, ensuring that the heat sink and the system chip remain parallel and the gap is minimized, effectively improving the heat dissipation efficiency of the system chip.

[0026] Furthermore, based on the first embodiment of the system chip latch-up control method of the present invention described above, a second embodiment of the system chip latch-up control method of the present invention is proposed.

[0027] In this embodiment of the application, the step of obtaining the coupling capacitance value between the metal sheet and the heat sink sequentially disposed on the system chip includes: Step S11: The conductive component contacts the corresponding positions of each metal sheet on the heat sink, and the touch chip reads the coupling capacitance value between the corresponding position of each metal sheet on the heat sink and the corresponding metal sheet.

[0028] In this embodiment, the principle of self-capacitance touch sensing is utilized. Self-capacitance touch sensing detects the presence and position of an object by measuring the change in capacitance between the object and a capacitor plate. When an object approaches the capacitor plate, it changes the electric field distribution of the capacitor plate, thereby changing the capacitance. Therefore, this principle can be used in reverse to detect gaps. The conductive component can be conductive silicone. Specifically, in this embodiment, the heat sink is one capacitor plate, and the metal plate is the other. When it is necessary to detect the coupling capacitance value between a metal plate and the heat sink, a grounded movable conductive silicone is brought into contact with the corresponding position of the metal plate on the heat sink. The analog value of the coupling capacitance is then obtained by a touch chip (IC, Integrated Circuit Chip) connected to the metal plate. The movable conductive silicone can move freely on the heat sink to detect the coupling capacitance value at different positions. The touch chip then processes the analog value to obtain the corresponding AD (Analog-to-Digital) value, i.e., the coupling capacitance value.

[0029] In this embodiment, the overconducting components contact the corresponding positions of each metal sheet on the heat sink, and the coupling capacitance value between the corresponding position of each metal sheet on the heat sink and the corresponding metal sheet is read by the touch chip.

[0030] In this technical field, the gap between the heatsink and the system chip can be measured using an infrared scanner. However, this method is affected by the thickness of the components themselves, resulting in poor gap recognition accuracy. Therefore, this embodiment utilizes the self-capacitance touch sensing principle to achieve accurate measurement of the gap between the heatsink and the system chip, providing a reference for subsequent gap adjustment.

[0031] Furthermore, based on the first embodiment of the system chip latch-up control method of the present invention described above, a third embodiment of the system chip latch-up control method of the present invention is proposed.

[0032] Reference Figure 2 Based on the first embodiment, the gap state includes a gap difference, and the step of determining the gap state between the metal sheet and the heat sink according to the coupling capacitance value includes: Step S21: Select the location of the metal sheet with the largest coupling capacitance value as the reference position, and calculate the coupling capacitance difference between the coupling capacitance values ​​at the locations of other metal sheets and the coupling capacitance value at the reference position. This embodiment selects the location of the metal plate with the largest coupling capacitance value as the reference position, i.e., the location of the metal plate with the smallest gap distance, as the reference position. This serves as a reference for adjusting the distance of other metal plates, thereby achieving the technical effect that the gap distance between the heat sink and the system chip is equal and minimal at all positions. Furthermore, the difference in coupling capacitance between the locations of other metal plates and the reference position can be used to determine the difference between the spacing of the other metal plates and the spacing of the reference position, thus determining the amount of distance adjustment required for the other metal plates.

[0033] It should be noted that if the spacing at the reference position is not 0mm, there is no need to further reduce the gap distance. This is because there may be some errors in the chip manufacturing process, such as accidental protrusions on the chip surface or other factors that prevent the heatsink from adhering tightly to the system chip. If the locking device is further adjusted to reduce the gap, it may cause damage to the heatsink or the system chip.

[0034] Step S22: Based on the preset mapping table between coupling capacitor values ​​and spacing and the difference between each coupling capacitor value, determine the spacing difference between the spacing at the location of other metal sheets and the spacing at the reference location, wherein the spacing is the spacing between each location on the heat sink and the system chip.

[0035] In this embodiment, it should be noted that the preset mapping table is a pre-set two-dimensional table used to characterize the mapping relationship between coupling capacitance values ​​and gap distances. The preset mapping table can be obtained by measuring the gap at a certain location beforehand using an industrial CT (Computed Tomography) scanner, adjusting the gap to various preset values, and simultaneously detecting the coupling capacitance values ​​corresponding to each preset value. The preset mapping table shows the coupling capacitance values ​​corresponding to different gaps, and it can also be used to obtain the gap differences when the differences in coupling capacitance values ​​are different. For example, the corresponding gap difference can be obtained by directly querying the preset mapping table based on the difference in coupling capacitance values.

[0036] In this embodiment, the location of the metal sheet with the largest coupling capacitance value is selected as the reference position, and the coupling capacitance difference between the coupling capacitance values ​​at other metal sheet locations and the coupling capacitance value at the reference position is calculated. Then, according to the preset mapping table between coupling capacitance value and spacing and the difference of each coupling capacitance value, the spacing difference between the spacing at other metal sheet locations and the spacing at the reference position is determined. The spacing is the spacing between each position on the heat sink and the system chip.

[0037] Thus, by selecting the spacing difference as the gap state, this embodiment of the application can easily determine how much the position spacing of each metal sheet needs to be adjusted, and select the position of the metal sheet with the largest coupling capacitance value (smallest spacing) as the reference position. This ensures that the heat sink and the system chip remain parallel while minimizing the gap distance, further improving the heat dissipation efficiency of the system chip.

[0038] Furthermore, based on the third embodiment of the system chip latch-up control method of the present invention described above, a fourth embodiment of the system chip latch-up control method of the present invention is proposed.

[0039] Reference Figure 3 Before the step of determining the spacing difference between the spacing at the location of other metal sheets and the spacing at the reference location based on a preset mapping table between coupling capacitance values ​​and spacing and the differences in each coupling capacitance value, the method further includes: Step A10: Adjust the spacing between the first preset position on the heat sink and the corresponding metal plate on the system chip to each preset distance; Step A20: Detect the coupling capacitance value between the first preset position and the corresponding metal sheet at each of the preset distances; Step A30: Generate a preset mapping table between coupling capacitance value and spacing based on each preset distance and the corresponding coupling capacitance value.

[0040] It should be noted that, in this embodiment, a method for generating a preset mapping table is provided. Specifically, the coupling capacitance values ​​at each preset distance are measured in advance to obtain the mapping relationship between the coupling capacitance values ​​and the gap distance. This provides a reference when performing the locking control work for installing heat sinks on system chips, so that the corresponding gap distance and gap distance difference can be determined by the difference between the coupling capacitance values. In the application of steps A10 to A30, for system chips, heat sinks, and locking accessories of the same specification, only one execution is required. That is, the preset mapping table can be applied as a reference in the locking control process corresponding to each system chip, heat sink, and locking accessory of the same specification.

[0041] The first preset position can be any one of the first preset positions. When adjusting the gap distance between the first preset position on the heat sink and the corresponding metal plate on the system chip, it can be adjusted by adjusting the locking attachments at each of the second preset positions. In addition, the preset distance can be determined by an industrial CT scanner (with an accuracy to 4 decimal places). The coupling capacitance value detection process in step A20 can refer to the steps in the second embodiment, and will not be repeated here.

[0042] As one feasible embodiment, a set of preset distances may include: 0mm, 0.05mm, 0.1mm, 0.15mm, and 0.2mm. Of course, more preset distances can also be set according to specific working conditions to allow for more precise lookup of the gap distance based on the coupling capacitance value.

[0043] In this embodiment, the gap distance between the first preset position on the heat sink and the corresponding metal sheet on the system chip is adjusted to various preset distances; the coupling capacitance value between the first preset position and the corresponding metal sheet on the system chip is detected at each preset distance; and a preset mapping table between the coupling capacitance value and the gap distance is generated based on each preset distance and the coupling capacitance value corresponding to each preset distance.

[0044] Thus, in this embodiment of the application, a corresponding preset mapping table is generated by detecting the coupling capacitance value corresponding to each preset distance before the locking control method. The preset mapping table can be used as a reference in the locking control process to determine the corresponding gap distance based on the detected coupling capacitance value, thereby achieving rapid and accurate detection of the gap distance.

[0045] Furthermore, based on the third embodiment of the system chip latch-up control method of the present invention described above, a fifth embodiment of the system chip latch-up control method of the present invention is proposed.

[0046] Before adjusting the spacing between the heatsink and the system chip at various locations to be consistent based on the gap state and the system chip's latching assembly, the method further includes: Step B10: Send a preset pulse signal to the drive component in the locking assembly, drive the corresponding lock attachment to rotate through the drive component, and determine the control distance corresponding to the preset pulse signal, wherein the lock attachment and the metal plate are arranged in a group.

[0047] In this embodiment of the application, a calibration method is provided between a preset pulse signal and the control distance of the lock attachment before adjusting the gap distance between the positions of each metal by controlling the rotation of the lock attachment, so as to set the corresponding target pulse signal for the gap difference to be adjusted as needed.

[0048] Furthermore, in one feasible embodiment, adjusting the spacing between the heatsink and the system chip at various locations to be consistent based on the gap state and the latching components of the system chip includes: Step S31: Determine the corresponding target pulse signal based on the control distance corresponding to the preset pulse signal and the distance difference between each of the preset pulse signals; Step S32: Send each of the target pulse signals to the driving component, and drive the lock attachments corresponding to the positions of the other metal pieces to rotate according to each of the target pulse signals, so as to adjust the spacing at the positions of the other metal pieces to be consistent with the spacing at the reference position.

[0049] It should be noted that this embodiment provides a method for setting a target pulse signal to adjust the spacing of the positions of the metal pieces based on the control distance of the lock attachment corresponding to the preset pulse signal and the determined spacing differences, based on step B10. The target pulse signal can be a PWM (Pulse Width Modulation) pulse, used to adjust the motor speed and duration of the stepper motor. The stepper motor can be a helical stepper motor. For each input pulse signal, the rotor of the helical stepper motor rotates by an angle or moves forward one step. The component used to generate a target pulse signal based on the control distance corresponding to the preset pulse signal and the spacing difference of each metal piece is a processor. One end of the processor is connected to the touch chip, which receives the coupling capacitance value emitted by the touch chip and determines the corresponding spacing based on the coupling capacitance value. It also selects a reference position and calculates the spacing difference based on the coupling capacitance value of each metal piece. The other end of the processor is connected to each spiral stepper motor, and each spiral stepper motor is connected to a corresponding locking accessory (screw). The processor sends the set target pulse signal to each spiral stepper motor so that each spiral stepper motor drives the locking accessory to rotate, thereby adjusting the spacing of each metal piece.

[0050] For example, the preset pulse signal can be a pulse signal with a duration of 1 second and a duty cycle of 50%. After the pulse signal is sent, the distance moved by the lock accessory after the rotation ends is 0.01 mm. If the distance difference that needs to be adjusted for the position of a certain metal piece is 0.03 mm, the target pulse signal can be set to a pulse signal with a duration of 3 seconds and a duty cycle of 50%, or it can be set to a pulse signal with a duration of 2 seconds and a duty cycle of 75%.

[0051] In this embodiment, the system chip locking control method of the present invention sends a preset pulse signal to the driving component in the locking assembly, drives the corresponding locking attachment to rotate through the driving component, determines the control distance corresponding to the preset pulse signal, and then determines the corresponding target pulse signal based on the control distance corresponding to the preset pulse signal and the distance difference between each of the distances. Then, each of the target pulse signals is sent to the driving component, and the driving component drives the locking attachments corresponding to the positions of other metal pieces to rotate according to each of the target pulse signals, so as to adjust the distance at the positions of other metal pieces to be consistent with the distance at the reference position.

[0052] Thus, in this embodiment, the target pulse signal is set according to the required adjustment of the spacing difference and the pre-calibrated control distance, and the target pulse signal is sent to the stepper motor to control the rotation of the lock attachment, thereby achieving precise control of the lock attachment to meet the adjustment of the spacing of each metal piece.

[0053] In addition, this application also provides a chip heat dissipation device, which is applied to electronic devices.

[0054] Please refer to Figure 4 , Figure 4 This is a schematic diagram of one embodiment of the chip heat dissipation device of the present invention, as shown below. Figure 4 As shown, the chip heat dissipation device of the present invention includes: A radiator, the radiator comprising at least one heat sink 101; A metal sheet 102 is disposed opposite to the heat sink 101 on one side and attached to a system chip (not shown in the figure) on the other side. A locking assembly, comprising a drive member 103 and a plurality of locking attachments 104 connected to the drive member 103, wherein the locking attachments 104 are used to adjust the spacing between the heat sink 101 and the system chip; The processor 105 is connected to the metal plate 102 and the drive unit 103 respectively.

[0055] In this embodiment, the heat sink 101 is used to dissipate heat from the system chip. The number of metal plates 102 is not limited to one; it comprises multiple independent metal plates evenly distributed on the system chip. The metal plates 102 can form a coupling capacitor with the heat sink 101. The driving component 103 is used to receive a driving signal sent by the processor 105 and drive the locking attachment 104 to rotate according to the driving signal, thereby adjusting the distance between the heat sink 101 and the system chip. Each locking attachment 104 is distributed on the edge region of the system chip surrounding the location of each metal plate 102. Each locking attachment 104 is used to fix the heat sink 101 on the system chip and adjust the gap distance at each of the first preset positions.

[0056] In addition, the processor 105 is used to receive the coupling capacitance value of the coupling capacitor formed by the metal sheet 102 and the heat sink 101, and determine the corresponding spacing according to the coupling capacitance value. It also selects a reference position and calculates the spacing difference according to the coupling capacitance value of each metal sheet position. The processor 105 is also used to send the set target pulse signal to each driving component 103 so that each driving component 103 drives the lock accessory 104 to rotate, thereby realizing the spacing adjustment of the position of each metal sheet.

[0057] Optionally, the chip heat dissipation device of the present invention further includes: Conductive component 106 is grounded and movably disposed on the side of the heat sink 101 away from the system chip, so as to contact different positions of the heat sink 101; Touch chip 107 is connected to the metal sheet 102 and the processor 105 respectively. Touch chip 107 is used to collect the coupling capacitance value when the conductive element 106 contacts the heat sink 101 at different positions.

[0058] In this embodiment, the touch chip 104 is used to collect the analog value of the coupling capacitance of the coupling capacitor formed by the metal sheet 102 and the heat sink 101, and convert the collected analog value into a corresponding digital value and transmit it to the processor 105.

[0059] The conductive element 106 can be conductive silicone and is connected to the ground via a copper strip to form a self-capacitive touch sensor. The conductive element 106 can move between the positions corresponding to different metal plates on the heat sink 101 to detect the coupling capacitance value of the coupling capacitor formed by different metal plates 102 and the heat sink 101.

[0060] Optionally, the heat sink 101 and / or each of the metal sheets 102 are copper sheets, and the locking attachments 104 are evenly distributed in the peripheral area of ​​the metal sheets.

[0061] Reference Figure 5 , Figure 5 This is a top view, where the dashed circles represent metal sheets 102 covered by heat sink 101. The system chip can be rectangular. The number of metal sheets 102 and locking attachments 104 are both four and arranged in pairs. The distribution positions of the metal sheets 102 include a, b, c, and d, and the distribution positions of the locking attachments 104 include A, B, C, and D. Each position is located at one of the four corners of the system chip, wherein each locking attachment 104 is located outside the distribution position of each metal sheet.

[0062] In this embodiment, the heat sink and metal sheet made of copper have excellent electrical conductivity and low price, so copper sheet is selected. For the rectangular system chip, the locking attachments distributed at the four corners can stably fix the heat sink to the system chip, making the adhesion between the two more secure.

[0063] The specific embodiments of each component of the chip heat dissipation device of the present invention during operation are basically the same as the embodiments of the system chip latching control method of the present invention described above, and will not be repeated here.

[0064] The present invention also provides a computer storage medium storing a system chip latching control program, wherein when the system chip latching control program is executed by a processor, the system chip latching control program implements the steps of the system chip latching control program method as described in any of the above embodiments.

[0065] The specific embodiments of the computer storage medium of the present invention are basically the same as the embodiments of the system chip latching control program method of the present invention described above, and will not be repeated here.

[0066] The present invention also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the system chip latching control method of the present invention as described in any of the above embodiments, which will not be elaborated here.

[0067] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0068] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0069] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause an electronic device (such as TWS earphones) to execute the methods described in the various embodiments of the present invention.

[0070] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A system chip latch-up control method, characterized in that, The system chip latch-up control method includes: The coupling capacitance value between the metal plates and the heat sink of the heat sink arranged sequentially on the system chip is obtained, wherein the heat sink covers the system chip and is used to dissipate heat from the system chip; The gap state between the metal sheet and the heat sink is determined based on the coupling capacitance value; Based on the gap state and the system chip's mounting components, the spacing between the heat sink and the system chip at each position is adjusted to be consistent.

2. The system chip latch-up control method as described in claim 1, characterized in that, The step of obtaining the coupling capacitance value between the metal plates and the heat sink of the heat sink sequentially arranged on the system chip includes: The conductive components are used to contact the corresponding positions of each metal sheet on the heat sink, and the coupling capacitance value between the corresponding position of each metal sheet on the heat sink and the corresponding metal sheet is read by the touch chip.

3. The system chip latch-up control method as described in claim 1, characterized in that, The gap state includes the gap difference, and the step of determining the gap state between the metal sheet and the heat sink based on the coupling capacitance value includes: The location of the metal sheet with the largest coupling capacitance value is selected as the reference position, and the coupling capacitance difference between the coupling capacitance values ​​at the locations of other metal sheets and the coupling capacitance value at the reference position is calculated. Based on a preset mapping table between coupling capacitance values ​​and spacing and the differences between the coupling capacitance values, the spacing difference between the spacing at the location of other metal plates and the spacing at the reference location is determined, wherein the spacing is the spacing between each location on the heat sink and the system chip.

4. The system chip latch-up control method as described in claim 3, characterized in that, Before the step of determining the spacing difference between the spacing at the location of other metal sheets and the spacing at the reference location based on a preset mapping table between coupling capacitance values ​​and spacing and the differences in each coupling capacitance value, the method further includes: The spacing between the first preset position on the heat sink and the corresponding metal plate on the system chip is adjusted to each preset distance; Detect the coupling capacitance value between the first preset position and the corresponding metal sheet at each preset distance; Based on each preset distance and the corresponding coupling capacitance value, a preset mapping table between the coupling capacitance value and the spacing is generated.

5. The system chip latch-up control method as described in claim 3, characterized in that, Before adjusting the spacing between the heatsink and the system chip at various locations to be consistent based on the gap state and the system chip's latching assembly, the method further includes: A preset pulse signal is sent to the drive component in the locking assembly, and the corresponding locking accessory is driven to rotate by the drive component. The control distance corresponding to the preset pulse signal is determined, wherein the locking accessory and the metal plate are arranged in a group.

6. The system chip latch-up control method as described in claim 5, characterized in that, Adjusting the spacing between the heatsink and the system chip at various locations to be consistent, based on the gap state and the system chip's mounting components, includes: The corresponding target pulse signal is determined based on the control distance corresponding to the preset pulse signal and the distance difference between each of the preset pulse signals; Each of the target pulse signals is sent to the driving component, and the driving component drives the lock attachments corresponding to the positions of the other metal pieces to rotate according to each of the target pulse signals, so as to adjust the spacing at the positions of the other metal pieces to be consistent with the spacing at the reference position.

7. A chip heat dissipation device, characterized in that, The chip heat dissipation device is used to implement the system chip latching control method according to any one of claims 1 to 6, and the chip heat dissipation device comprises: A radiator, the radiator comprising at least one heat sink fin; A metal sheet, one side of which is disposed opposite to the heat sink and the other side is attached to the system chip; A locking assembly, comprising a driver and a plurality of locking attachments connected to the driver, the locking attachments being used to adjust the spacing between the heat sink and the system chip; The processor is connected to both the metal plate and the drive unit.

8. The chip heat dissipation device as described in claim 7, characterized in that, The chip heat dissipation device also includes: A conductive component, which is grounded and movably disposed on the side of the heat sink away from the system chip, so as to contact different positions of the heat sink; A touch chip is connected to both the metal plate and the processor. The touch chip is used to collect the coupling capacitance value when the conductive element contacts the heat sink at different positions.

9. The chip heat dissipation device as described in claim 7, characterized in that, The heat sink and / or the metal sheet is a copper sheet, and the locking accessories are evenly arranged in the peripheral area of ​​the metal sheet.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a program for implementing a system-on-a-chip latch-up control method, the program for implementing the system-on-a-chip latch-up control method being executed by a processor to implement the steps of the system-on-a-chip latch-up control method as claimed in any one of claims 1 to 6.

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