Electronic device with cable interface and method of manufacturing the same

Abstract

An electronic device with a cable interface and a method of manufacturing the same. An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module, and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector. The compensation module can be used to compensate or reduce a first common mode interference accumulated at the connector, and the choke module can be used to compensate or reduce a second common mode interference accumulated at the integrated circuit.

Description

Technical Field

[0001] This disclosure relates to an electronic device having a cable interface, and more particularly to an electronic device capable of reducing common-mode interference on the cable interface. Background Technology

[0002] For electronic products with communication functions, digital electronic products often include antenna circuits and high-speed connector interfaces, such as Universal Serial Bus (USB), High Definition Multimedia Interface (HDMI) interfaces, or display connection interfaces.

[0003] Designers of electronic products need to avoid potential radio frequency interference (RFI) and / or electromagnetic interference (EMI) issues between antenna circuits and high-speed connector interfaces. Modern electronic product designs typically trend towards miniaturization. Therefore, in some cases, antenna circuits and high-speed connector interfaces are forced to be placed in close proximity, making it more difficult to reduce RFI or EMI between them. Summary of the Invention

[0004] One embodiment of this disclosure discloses an electronic device comprising a printed circuit board, an integrated circuit, a connector, a choke module, and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

[0005] In one embodiment, the connector is used to connect to a cable for carrying a pair of differential signals.

[0006] In one embodiment, the integrated circuit is used to generate the pair of differential signals, which are transmitted by the integrated circuit through the choke module, the compensation module, and the cable.

[0007] In one embodiment, the integrated circuit is used to receive the pair of differential signals via the choke module, the compensation module, and the cable.

[0008] In one embodiment, the compensation module is used to compensate for or reduce a first common-mode interference on the connector, the first common-mode interference being caused by a differential-to-common-mode conversion of the pair of differential signals.

[0009] In one embodiment, the choke module is used to compensate for or reduce a second common-mode interference caused by an imbalance between a positive input / output terminal and a negative input / output terminal of the integrated circuit.

[0010] In one embodiment, the printed circuit board includes a first layout line and a second layout line, the first layout line being used to transmit a positive signal of the pair of differential signals between the integrated circuit and a cable, and the second layout line being used to transmit a negative signal of the pair of differential signals between the integrated circuit and the cable.

[0011] In one embodiment, the compensation module includes a first passive element and a second passive element. The first passive element is coupled in series with the first layout circuit. The second passive element is coupled in series with the second layout circuit.

[0012] In one embodiment, the compensation module includes a first passive element and a second passive element. A first terminal of the first passive element is coupled to the first layout line, and a second terminal of the first passive element is grounded. A first terminal of the second passive element is coupled to the second layout line, and a second terminal of the second passive element is grounded.

[0013] In one embodiment, the compensation module includes a first passive element, a second passive element, a third passive element, and a fourth passive element. The first passive element is connected in series with the first layout circuit. The second passive element is connected in series with the second layout circuit. A first terminal of the third passive element is coupled to the first layout circuit, and a second terminal of the third passive element is grounded. A first terminal of the fourth passive element is coupled to the second layout circuit, and a second terminal of the fourth passive element is grounded.

[0014] In one embodiment, the compensation module includes a first passive element, a second passive element, a third passive element, a fourth passive element, a fifth passive element, and a sixth passive element. The first passive element is connected in series with the first layout circuit. The second passive element is connected in series with the second layout circuit. A first terminal of the third passive element is coupled to the first layout circuit, and a second terminal of the third passive element is grounded. A first terminal of the fourth passive element is coupled to the second layout circuit, and a second terminal of the fourth passive element is grounded. A first terminal of the fifth passive element is coupled to the first layout circuit, and a second terminal of the fifth passive element is grounded, wherein the third and fifth passive elements are coupled to different terminals of the first passive element. A first terminal of the sixth passive element is coupled to the second layout circuit, and a second terminal of the sixth passive element is grounded, wherein the fourth and sixth passive elements are coupled to different terminals of the second passive element.

[0015] Another embodiment of this disclosure discloses a manufacturing method for manufacturing an electronic device. The manufacturing method includes: providing a printed circuit board (PCB) including a first layout line and a second layout line; attaching an integrated circuit (IC) to the PCB and connecting the IC to the first layout line and the second layout line; attaching a connector to the PCB and connecting the connector to the first layout line and the second layout line; attaching a choke module to the PCB between the IC and the connector and connecting the choke module to the first layout line and the second layout line; and attaching a compensation module to the PCB between the choke module and the connector and connecting the compensation module to the first layout line and the second layout line.

[0016] In one embodiment, the connector is used to connect to a cable for carrying a pair of differential signals.

[0017] In one embodiment, an integrated circuit is used to generate the pair of differential signals, which are transmitted by the integrated circuit through the choke module, the compensation module, and the cable.

[0018] In one embodiment, the integrated circuit is used to receive the pair of differential signals via the choke module, the compensation module, and the cable.

[0019] In one embodiment, a compensation module is used to compensate for or reduce a first common-mode interference on the connector, the first common-mode interference being caused by a differential-to-common-mode conversion of the pair of differential signals.

[0020] In one embodiment, the choke module is used to compensate for or reduce a second common-mode interference caused by an imbalance between a positive input / output terminal and a negative input / output terminal of the integrated circuit.

[0021] In one embodiment, a first layout line is used to transmit a positive signal of the pair of differential signals between the integrated circuit and a cable, and a second layout line is used to transmit a negative signal of the pair of differential signals between the integrated circuit and the cable.

[0022] In one embodiment, the compensation module includes at least one first passive element and at least one second passive element. The at least one first passive element is coupled to the first layout circuitry. The at least one second passive element is coupled to the second layout circuitry.

[0023] In one embodiment, at least one first passive element and at least one second passive element include a resistor, an inductor, or a capacitor.

[0024] In summary, the compensation module can be used to compensate for or reduce the first common-mode interference accumulated in the connector, and the choke module can be used to compensate for or reduce the second common-mode interference accumulated in the integrated circuit, thereby avoiding the current induced by the above common-mode interference and avoiding the interference of the induced current on other components.

[0025] It should be noted that the above description and the following detailed description are illustrative of this case by way of embodiments, and are used to assist in the explanation and understanding of the invention content claimed in this case. Attached Figure Description

[0026] To make the above and other objects, features and embodiments of this disclosure more apparent and understandable, the accompanying drawings are described below:

[0027] Figure 1 This diagram shows a top view of an electronic device according to some embodiments of the present disclosure;

[0028] Figure 2 The following are illustrated according to some embodiments. Figure 1 A schematic cross-sectional view of the electronic device shown along section line XX;

[0029] Figures 3A to 3E Schematic diagrams are shown of various compensation modules with different configurations according to some embodiments;

[0030] Figure 4 This diagram illustrates the connection interface definitions of the compensation module, connectors, and cables during S-parameter measurement; and

[0031] Figure 5 A schematic flowchart of a manufacturing method according to some embodiments of this disclosure is shown.

[0032] Symbol explanation:

[0033] 100: Electronic devices

[0034] 110: Printed Circuit Board

[0035] 120: Integrated Circuits

[0036] 140: Choke coil module

[0037] 160: Compensation Module

[0038] 160a, 160b, 160c, 160d, 160e: Compensation Modules

[0039] 180: Connector

[0040] 200: Cable

[0041] 210: First end

[0042] 220: Second end

[0043] 500: Manufacturing Method

[0044] W1: First layout line

[0045] W2: Second layout line

[0046] XX: Profile line

[0047] DIF: Differential signal

[0048] DIF+: Positive signal

[0049] DIF-: Negative signal

[0050] PORT1, PORT2, PORT3, PORT4: Connection interfaces

[0051] P1: Part 1

[0052] P2: Part Two

[0053] CMN1: First Common-Mode Interference

[0054] CMN2: Second common-mode interference

[0055] IOp: Positive input / output terminal

[0056] IOn: Negative input / output terminal

[0057] mPORT1, mPORT2: Connection interfaces

[0058] PC1: First passive component

[0059] PC2: Second passive component

[0060] PC3: Third passive component

[0061] PC4: Fourth Passive Component

[0062] PC5: The Fifth Passive Component

[0063] PC6: Sixth Passive Component

[0064] S510, S520, S530, S540, S550: Steps Detailed Implementation

[0065] The following disclosure provides numerous different embodiments or examples for implementing various features of this disclosure. Elements and configurations in the specific examples are used in the following discussion to simplify this disclosure. Any examples discussed are for illustrative purposes only and do not in any way limit the scope or meaning of this disclosure or its examples. Where appropriate, the same reference numerals are used between the drawings and in the corresponding text description to represent the same or similar elements.

[0066] Please see Figure 1 This illustrates a top view of an electronic device 100 according to some embodiments of the present disclosure. For example... Figure 1 As shown, the electronic device 100 includes a printed circuit board 110, an integrated circuit (IC) 120, a choke module 140, a compensation module 160, and a connector 180. The integrated circuit 120, the choke module 140, the compensation module 160, and the connector 180 are respectively disposed on the surface of the printed circuit board 110.

[0067] In some embodiments, connector 180 is used to connect to a first end 210 of cable 200. Cable 200 is used to carry a pair of differential signals DIF. Connector 180 connected to cable 200 is used to receive differential signals DIF from cable 200, or connector 180 is used to transmit differential signals DIF generated by electronic device 100 to cable 200.

[0068] In one example, connector 180 is a Universal Serial Bus (USB) connector; cable 200 is a USB cable for connecting to the USB connector; and the differential signal DIF contains digital data (such as files, documents, commands, instructions, or packets) suitable for transmission via the USB cable. In another example, connector 180 is a High Definition Multimedia Interface (HDMI) connector; cable 200 is an HDMI cable for connecting to the HDMI connector; and the differential signal DIF contains display information (such as photos, videos, frames, or streaming data).

[0069] like Figure 1 As shown, the printed circuit board 110 includes a first layout line W1 and a second layout line W2, which are respectively coupled between the integrated circuit 120 and the connector 180. The first layout line W1 and the second layout line W2 are used to transmit a differential signal DIF between the integrated circuit 120 and the connector 180 (and further transmitted by the connector 180 to the cable 200).

[0070] In some embodiments, the first layout line W1 is used to transmit the positive signal DIF+ of the differential signal DIF between the integrated circuit 120 and the cable 200. In some embodiments, the second layout line W2 is used to transmit the negative signal DIF- of the differential signal DIF between the integrated circuit 120 and the cable 200.

[0071] In some embodiments, the differential signal DIF is a signal in the input direction that is transmitted by cable 200 to integrated circuit 120 on electronic device 100. In this case, integrated circuit 120 is used to receive differential signal DIF via cable 200 through choke module 140, compensation module 160 and connector 180.

[0072] In some embodiments, the differential signal DIF, which is the output direction signal, is generated by the electronic device 100 and transmitted to the cable 200. In this case, the integrated circuit 120 generates the differential signal DIF and sends it to the cable 200 via the choke module 140, the compensation module 160, and the connector 180. In some embodiments, the differential signal DIF generated by the integrated circuit 120 can be transmitted via the cable 200 to an external device (e.g., a computer, screen, television, etc., not shown in the figure), which is connected to the second end 220 of the cable 200.

[0073] Please refer to further information. Figure 2 It is shown according to some embodiments Figure 1 The electronic device 100 shown is a cross-sectional schematic diagram along section line XX.

[0074] like Figure 1 as well as Figure 2 As shown, when the differential signal DIF is transmitted along cable 200 and connector 180, the differential signal DIF transmitted via cable 200 will induce a first common-mode interference (CMN1) that accumulates on multiple connection pins of connector 180. This is because the multiple connection pins of connector 180 connected to cable 200 may have mismatched impedances and / or inconsistent ground reference levels. In other words, the first common-mode interference (CMN1) is caused by the differential-mode to common-mode conversion of the differential signal DIF. This first common-mode interference (CMN1) may interfere with other components (e.g., antennas, RF circuits, etc., not shown in the figure) located on the printed circuit board and near connector 180.

[0075] In some practical examples, the first common-mode interference CMN1 accumulated between multiple connection pins of connector 180 may induce a current. This induced current may flow through the shielding surfaces of the connector and cable, causing interference waves to other components (such as antennas, RF circuits, etc., not shown in the figure), where such interference waves cannot be ignored. For example, when electronic device 100 (such as a mobile device or laptop) is connected to a USB cable, the interference waves induced by this USB cable may interfere with a wireless mouse communicating with electronic device 100, or reduce the bandwidth throughput of the wireless network on electronic device 100. Similar interference issues can also occur when electronic device 100 is connected to other signal cables, such as Peripheral Component Interconnect Express (PCIE) cables, Serial Advanced Technology Attachment (SATA) cables, High Definition Multimedia Interface (HDMI) cables, DisplayPort (DP) cables, Digital Visual Interface (DVI) cables, or Video Graphics Array (VGA) cables.

[0076] In some examples, such as Figure 1 and Figure 2 As shown, an imbalance may exist between the positive input / output terminal IOp and the negative input / output terminal ION of integrated circuit 120. In one example, the drive power of the positive signal drive circuit (not shown) of integrated circuit 120 differs from the drive power of the negative signal drive circuit (not shown), and this difference leads to an imbalance and consequently generates a second common-mode interference CMN2. In another example, the impedance of the first layout line W1 may differ from the impedance of the second layout line W2. When integrated circuit 120 generates (or receives) the differential signal DIF, the second common-mode interference CMN2 will accumulate on the positive input / output terminal IOp and the negative input / output terminal ION of integrated circuit 120.

[0077] like Figure 1 as well as Figure 2As shown, the choke module 140 is disposed on the printed circuit board 110 and coupled between the integrated circuit 120 and the connector 180. More precisely, in some embodiments, the choke module 140 is coupled between the integrated circuit 120 and the compensation module 160. In some embodiments, the choke module 140 is connected to a first layout line W1 and a second layout line W2 and is disposed adjacent to the integrated circuit 120. In some embodiments, the choke module 140 includes a common mode choke coil, which can be used to compensate for or reduce the second common mode interference CMN2 accumulated on the positive input / output terminal IOp and the negative input / output terminal ION of the integrated circuit 120.

[0078] In some embodiments, the common-mode choke coil (i.e., choke module 140) is disposed adjacent to the integrated circuit 120 and can be designed as an interference filter to compensate for or reduce interference. Figure 1 The second common-mode interference CMN2 is shown on the second portion P2 (including integrated circuit 120 and choke module 140). In some embodiments, choke module 140 is typically not used to compensate for or reduce common-mode interference. Figure 1 The first common-mode interference CMN1 on the first part P1 shown (including compensation module 160, connector 180 and cable 200) is due to the relatively large distance between choke module 140 and connector 180, and the influence of cable 200 is not considered in the design of choke module 140.

[0079] like Figure 1 and Figure 2 As shown, the compensation module 160 is disposed on the printed circuit board 110 and coupled between the choke module 140 and the connector 180. In some embodiments, the compensation module 160 is used to compensate for or reduce the first common-mode interference CMN1 on the connector 180 in the first portion P1. In some embodiments, the compensation module 160 is used to reduce the scattering parameter (also known as the S-parameter) of the differential-to-common-mode conversion (SCD21) in the first portion P1 (including the compensation module 160, the connector 180, and the cable 200). The detailed implementation of how the compensation module 160 reduces the S-parameter in the differential-to-common-mode conversion (SCD21) will be further explained in subsequent paragraphs.

[0080] Please refer to the following: Figures 3A to 3E The diagram illustrates various compensation modules 160a-160e with different configurations according to some embodiments. Each of the compensation modules 160a-160e can be used to implement... Figure 1 and Figure 2The compensation module 160 shown is shown.

[0081] like Figure 3A As shown, the compensation module 160a includes a first passive element PC1 and a second passive element PC2. The first passive element PC1 is connected in series with the first layout line W1 and is located between the choke module 140 and the connector 180. The second passive element PC2 is connected in series with the second layout line W2 and is located between the choke module 140 and the connector 180. The first passive element PC1 and the second passive element PC2 each include at least one of a resistor (R), an inductor (L), and a capacitor (C).

[0082] like Figure 3B As shown, the compensation module 160b includes a first passive element PC1 and a second passive element PC2. The first terminal of the first passive element PC1 is coupled to a first layout line W1, with the coupling position located between the choke module 140 and the connector 180, and the second terminal of the first passive element PC1 is grounded. The first terminal of the second passive element PC2 is coupled to a second layout line W2, with the coupling position located between the choke module 140 and the connector 180, and the second terminal of the second passive element PC2 is grounded. Each of the first passive element PC1 and the second passive element PC2 includes at least one of a resistor (R), an inductor (L), and a capacitor (C).

[0083] like Figure 3C As shown, the compensation module 160c includes a first passive element PC1, a second passive element PC2, a third passive element PC3, and a fourth passive element PC4. The first passive element PC1 is connected in series with the first layout line W1 and is located between the choke module 140 and the connector 180. The second passive element PC2 is connected in series with the second layout line W2 and is located between the choke module 140 and the connector 180. The first end of the third passive element PC3 is coupled to the first layout line W1, with the coupling position located between the choke module 140 and the first passive element PC1; the second end of the third passive element PC3 is grounded. The first end of the fourth passive element PC4 is coupled to the second layout line W2, with the coupling position located between the choke module 140 and the second passive element PC2; the second end of the fourth passive element PC4 is grounded. The first passive element PC1, the second passive element PC2, the third passive element PC3 and the fourth passive element PC4 each include at least one of a resistor (R), an inductor (L) and a capacitor (C).

[0084] like Figure 3D As shown, the compensation module 160d includes a first passive component PC1, a second passive component PC2, a third passive component PC3, and a fourth passive component PC4. Compared to Figure 3C , Figure 3DIn the embodiment shown, the first end of the third passive element PC3 is coupled to the first layout line W1 and the coupling position is located between the first passive element PC1 and the connector 180, and the first end of the fourth passive element PC4 is coupled to the second layout line W2 and the coupling position is located between the second passive element PC2 and the connector 180. Figure 3D Other structural features of the compensation module 160d shown are similar to Figure 3C It is similar to the compensation module 160c shown.

[0085] like Figure 3E As shown, the compensation module 160e includes a first passive component PC1, a second passive component PC2, a third passive component PC3, a fourth passive component PC4, a fifth passive component PC5, and a sixth passive component PC6. Compared to Figure 3C , Figure 3E In the illustrated embodiment, a fifth passive component PC5 and a sixth passive component PC6 are added. The first end of the fifth passive component PC5 is coupled to the first layout line W1 and the coupling position is located between the first passive component PC1 and the connector 180. The first end of the sixth passive component PC6 is coupled to the second layout line W2 and the coupling position is located between the second passive component PC2 and the connector 180.

[0086] The third passive element PC3 and the fifth passive element PC5 are coupled to different ends of the first passive element PC1.

[0087] The fourth passive element PC4 and the sixth passive element PC6 are coupled to different ends of the second passive element PC2. Figure 3E Other structural features of the compensation module 160e shown are similar to Figure 3C It is similar to the compensation module 160c shown.

[0088] It is important to note that Figures 3A to 3E One of the multiple compensation modules 160a-160e shown can be selected as... Figure 1 and Figure 2 The compensation module 160 in the embodiment. The selection of various configurations of the compensation modules 160a to 160e and the setting of the resistance, inductance, or capacitance values ​​of the multiple passive components therein are based on Figure 2 The result depends on the S-parameter measurement of the first part, P1.

[0089] Please refer to the following: Figure 4 It shows a schematic diagram of the connection interface definition of the compensation module 160, connector 180 and cable 200 in S-parameter measurement.

[0090] like Figure 1 as well as Figure 4As shown, connection interface PORT1 is defined on cable 200 and corresponds to the positive signal DIF+ and the first layout line W1. Another connection interface PORT3 is defined on cable 200 and corresponds to the negative signal DIF- and the second layout line W2. Connection interface PORT2 is defined on compensation module 160 and coupled to the first layout line W1 (towards choke module 140) and corresponds to the positive signal DIF+. Connection interface PORT4 is defined on compensation module 160 and coupled to the second layout line W2 (towards choke module 140) and corresponds to the negative signal DIF-.

[0091] The four connection interfaces PORT1 to PORT4 can be connected to a network analyzer to perform scattering parameter (S-parameter) analysis in a four-interface single-ended model. The result of this S-parameter analysis will produce a single-ended S-parameter matrix as shown below:

[0092]

[0093] In this one-sided S-parameter matrix, the S-parameters S XY This represents the response level measured at the PORTY interface when a trigger signal is input at the PORTX interface. For example, the S-parameter S... 12 This represents the response at connection interface PORT1 when an excitation signal is input at connection interface PORT2; S-parameter S 23 This represents the response at connection interface PORT2 when an excitation signal is input from connection interface PORT3; S-parameter S 11 This represents the response at the PORT1 interface when an excitation signal is input from the PORT1 position. If a pair of transmission lines is driven by two signals at one end, the matrix of these single-ended S-parameters is typically used to analyze the pair of transmission lines to obtain the crosstalk between the two transmission lines, or to analyze the reflected power and incident power of the differential signal passing through the pair of transmission lines.

[0094] In some examples, such as Figure 4 As shown, the two connection interfaces PORT1 and PORT3 can be jointly defined as the logical connection interface mPORT1, and the two connection interfaces PORT2 and PORT4 can be jointly defined as the logical connection interface mPORT2. Therefore, the matrix of single-ended S-parameters can be converted into a mixed-mode S-parameter matrix, as shown below:

[0095]

[0096] In the S-parameter matrix of the mixing mode, the S-parameter SCD 21 The S-parameter SCD represents the common-mode response at the connection interface mPORT2 when a differential-mode excitation signal is input at the connection interface mPORT1. In other words, it represents the common-mode response at the connection interface mPORT2. 21This represents the differential-to-common mode conversion when the differential signal DIF is transmitted via cable 200 to connection interface mPORT2 (i.e., connection interfaces PORT2 and PORT4 on the compensation module).

[0097] In some embodiments, the S-parameters SCD in the mixed mode S-parameter matrix can be calculated from the known S-parameters in the one-ended S-parameter matrix. 21 The calculation method is as follows:

[0098] S CD21 =(S 21 +S 41 -S 23 -S 43 ) / 2

[0099] Similarly, the other S-parameters in the mixed-mode S-parameter matrix can also be calculated from the S-parameters already measured in the single-ended S-parameter matrix.

[0100] In some embodiments, after the S-parameter analysis based on the four connection interfaces PORT1 to PORT4 is completed, S-parameter SCD can be performed. 21 Monitoring and measurement. The compensation module 160 is adjusted (by selecting...). Figures 3A to 3E Different configurations, or changes to the resistance, inductance, or capacitance values ​​of passive components, can reduce or minimize the S-parameter SCD in the aforementioned mixed-mode S-parameter matrix. 21 The numerical value.

[0101] After selecting the optimal configuration of the compensation module 160, the compensation module 160 can improve the S-parameter SCD measured in the entire first part P1 (including the compensation module 160, connector 180, and cable 200). 21 Reduce or minimize it. In this example, compensation module 160 can be used to reduce the first common-mode interference CMN1 on connector 180.

[0102] Please refer to the following: Figure 5 This document illustrates a schematic flowchart of a manufacturing method 500 according to some embodiments of the present disclosure. Manufacturing method 500 is used to produce the aforementioned... Figure 1 and Figure 2 The electronic device 100 in the illustrated embodiment. For example... Figure 1 , Figure 2 as well as Figure 5As shown, step S510 is performed to provide a printed circuit board 110, which includes a first layout line W1 and a second layout line W2. Step S520 is performed by an adhesive machine and / or a soldering machine to attach an integrated circuit 120 to the printed circuit board 110 and connect the integrated circuit 120 to the first layout line W1 and the second layout line W2. Step S530 is performed by an adhesive machine and / or a soldering machine to attach a connector 180 to the printed circuit board 110 and connect the connector 180 to the first layout line W1 and the second layout line W2. Step S540 is performed by an adhesive machine and / or a soldering machine to attach a choke coil module 140 to the printed circuit board 110 and position it between the integrated circuit 120 and the connector 180, and connect the choke coil module 140 to the first layout line W1 and the second layout line W2.

[0103] Step S550 is performed by an adhesive bonding machine and / or a soldering machine to attach the compensation module 160 to the printed circuit board 110 and position it between the choke coil module 140 and the connector 180, and to connect the compensation module 160 to the first layout line W1 and the second layout line W2. The compensation module 160 configured in step S550 can be... Figures 3A to 3E The compensation module 160a to 160e discussed in the embodiments are as follows. The configuration of the compensation module 160 and the values ​​of the resistance, inductance or capacitance of the passive components in the compensation module 160 can be determined by the S-parameter analysis discussed in the above embodiments, and will not be repeated here.

[0104] It should be noted that the order of steps S520 to S550 is not based on... Figure 5 The order shown is limited. In some other embodiments, steps S520 to S550 may also be different. Figure 5 Different sequences of implementation were performed.

[0105] While the above embodiments have disclosed specific details of this disclosure, other implementation methods are also possible. The meaning and scope of the claims in this disclosure are not limited to the text of the above embodiments.

[0106] Those skilled in the art may make various substitutions and improvements to the above-described architecture without departing from the principles and spirit of this disclosure. Furthermore, the scope of protection of this disclosure is determined by the appended claims and covers various modifications and variations to the practices and architecture referred to in the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: A printed circuit board; An integrated circuit is disposed on the printed circuit board; A connector is disposed on the printed circuit board; A choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The choke module is used to compensate for or reduce a second common-mode interference caused by an imbalance between a positive input / output terminal and a negative input / output terminal of the integrated circuit. This imbalance is caused by a difference in driving power between a positive signal driving circuit and a negative signal driving circuit of the integrated circuit, or by a difference in impedance between a first layout line and a second layout line of the printed circuit board. A compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

2. The electronic device of claim 1, wherein the connector is configured to connect to a cable for carrying a pair of differential signals.

3. The electronic device of claim 2, wherein the integrated circuit is used to generate the pair of differential signals, the pair of differential signals being transmitted by the integrated circuit through the choke module, the compensation module to the cable.

4. The electronic device of claim 2, wherein the integrated circuit is used to receive the pair of differential signals via the choke module, the compensation module and the cable.

5. The electronic device of claim 2, wherein the compensation module is used to compensate for or reduce a first common-mode interference on the connector, the first common-mode interference being caused by a differential-to-common-mode conversion of the pair of differential signals.

6. The electronic device of claim 2, wherein the printed circuit board comprises: The first layout circuitry is used to transmit a positive signal of the differential signal pair between the integrated circuit and the cable; and The second layout circuit is used to transmit a negative signal of the differential signal between the integrated circuit and the cable.

7. The electronic device of claim 6, wherein the compensation module comprises: A first passive component is connected in series with the first layout circuitry; and A second passive component is connected in series with the second layout circuit.

8. The electronic device of claim 6, wherein the compensation module comprises: A first passive element, a first terminal of which is coupled to the first layout line, and a second terminal of which is grounded; and A second passive element, a first terminal of which is coupled to the second layout line, and a second terminal of which is grounded.

9. The electronic device of claim 6, wherein the compensation module comprises: A first passive component is connected in series with the first layout circuit; A second passive component is connected in series with the second layout circuit; A third passive component, wherein a first terminal of the third passive component is coupled to the first layout line, and a second terminal of the third passive component is grounded; and A fourth passive element, a first terminal of which is coupled to the second layout line, and a second terminal of which is grounded.

10. The electronic device of claim 6, wherein the compensation module comprises: A first passive component is connected in series with the first layout circuit; A second passive component is connected in series with the second layout circuit; A third passive component, a first terminal of which is coupled to the first layout line, and a second terminal of which is grounded; A fourth passive component, a first terminal of which is coupled to the second layout circuit, and a second terminal of which is grounded; A fifth passive element, a first terminal of which is coupled to the first layout circuit, a second terminal of which is grounded, wherein the third passive element and the fifth passive element are coupled to different terminals of the first passive element; and A sixth passive element, a first terminal of which is coupled to the second layout line, and a second terminal of which is grounded, wherein the fourth passive element and the sixth passive element are coupled to different terminals of the second passive element.

11. A method for manufacturing an electronic device, characterized in that... The manufacturing method includes: A printed circuit board is provided, the printed circuit board including a first layout circuit and a second layout circuit; An integrated circuit is attached to the printed circuit board and the integrated circuit is connected to the first layout line and the second layout line; Attach a connector to the printed circuit board and connect the connector to the first layout line and the second layout line; A choke module is attached to the printed circuit board between the integrated circuit and the connector, and the choke module is connected to the first layout line and the second layout line. The choke module is used to compensate for or reduce a second common-mode interference caused by an imbalance between a positive input / output terminal and a negative input / output terminal of the integrated circuit. This imbalance is caused by a difference in drive power between a positive signal drive circuit and a negative signal drive circuit of the integrated circuit, or by a difference in impedance between a first layout line and a second layout line of the printed circuit board. A compensation module is attached to the printed circuit board between the choke module and the connector, and the compensation module is connected to the first layout line and the second layout line.

12. The manufacturing method of claim 11, wherein the connector is configured to connect to a cable for carrying a pair of differential signals.

13. The manufacturing method of claim 12, wherein the integrated circuit is used to generate the pair of differential signals, the pair of differential signals being transmitted by the integrated circuit through the choke module, the compensation module to the cable.

14. The manufacturing method of claim 12, wherein the integrated circuit is used to receive the pair of differential signals via the choke module, the compensation module and the cable.

15. The manufacturing method of claim 12, wherein the compensation module is used to compensate for or reduce a first common-mode interference on the connector, the first common-mode interference being caused by a differential-to-common-mode conversion of the pair of differential signals.

16. The manufacturing method of claim 12, wherein the first layout circuitry is used to transmit a positive signal of the pair of differential signals between the integrated circuit and the cable, and the second layout circuitry is used to transmit a negative signal of the pair of differential signals between the integrated circuit and the cable.

17. The manufacturing method of claim 11, wherein the compensation module comprises: At least one first passive component is coupled to the first layout circuitry; and At least one second passive component is coupled to the second layout circuitry.

18. The manufacturing method of claim 17, wherein the at least one first passive element and the at least one second passive element comprise a resistor, an inductor, or a capacitor.

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