Photonic integrated circuit package with alignment features

Abstract

An optoelectronic assembly includes a substrate having a plurality of first optical waveguides, a cradle, and a first cover encapsulating at least portions of the first optical waveguides and the cradle. The cradle is bonded to the substrate and defines a pocket having an opening therein. The pocket is configured to receive an optical ferrule through the opening and align the optical ferrule with the first optical waveguides. The first cover includes an aperture that exposes the opening of the pocket such that, when the optical ferrule is received in the pocket through the opening and secured therein and a plurality of second optical waveguides are attached to the optical ferrule, the optoelectronic assembly is configured to transmit light between the plurality of first optical waveguides and the plurality of second optical waveguides.

Description

Summary of the Invention

[0001] In some aspects of this specification, an optoelectronic assembly is provided, comprising: a substrate having a plurality of first optical waveguides; a bracket; and a first cover encapsulating at least a portion of the first optical waveguides and the bracket. The bracket is bonded to the substrate and defines a recess therein. The recess has an opening and is configured to receive an optical sleeve through the opening and align the optical sleeve with the first optical waveguides. The first cover includes an aperture exposing the opening of the recess such that when the optical sleeve is received in the recess through the opening and secured therein, and the plurality of second optical waveguides are attached to the optical sleeve, the optoelectronic assembly is configured to transmit light between the plurality of first optical waveguides and the plurality of second optical waveguides.

[0002] In some aspects of this specification, an optoelectronic assembly is provided, comprising: a substrate having conductive traces; a bracket bonded to the substrate and defining a cavity therein; and an overmold covering at least a portion of the substrate and the bracket. The overmold defines an opening therein that at least partially exposes the cavity for receiving an optical sleeve therein, enabling light to propagate between an optical element and an optical waveguide attached to the optical sleeve. The optical element is at least partially encapsulated by the overmold.

[0003] In some aspects of this specification, a method for optically connecting an optical sleeve to an optical component is provided. The optical component has a substrate having a plurality of first optical waveguides. The method includes the steps of: aligning an optical bracket with the plurality of first optical waveguides, the optical bracket including a recess for receiving the optical sleeve and the recess having an opening; enclosing at least a portion of the first optical waveguides and the bracket with a first cover, but not enclosing the opening; and inserting the optical sleeve into the recess through the opening. Attached Figure Description

[0004] Figure 1 This is an exploded perspective view of the optoelectronic component according to the embodiment of this specification;

[0005] Figure 2 This is a perspective assembly diagram of the optoelectronic components according to the embodiment of this specification;

[0006] Figure 3 This is a perspective cross-sectional view of an optoelectronic component according to an embodiment of this specification, showing the internal details of the component;

[0007] Figure 4 This is a perspective cross-sectional view of an optoelectronic component according to an embodiment of this specification, showing an alternative view of the component and the optical path through the component;

[0008] Figures 5A to 5C An alternative cross-sectional view of an optoelectronic component according to an embodiment of this specification is shown;

[0009] Figures 6A to 6B A perspective view of the lead frame and bracket of the optoelectronic assembly according to an embodiment of this specification is shown;

[0010] Figure 7 This is a perspective view of an optoelectronic component with an alternative chassis configuration according to an embodiment of this specification; and

[0011] Figure 8 This is a flowchart illustrating the steps of a method for optically connecting optical components between an optical sleeve and a substrate according to an embodiment of this specification. Detailed Implementation

[0012] Reference is made in the following description to the accompanying drawings, which form part of the invention and illustrate various embodiments by way of example. The drawings are not necessarily drawn to scale. It should be understood that other embodiments may be conceived and practiced without departing from the scope or spirit of this specification. Therefore, the following detailed description should not be considered limiting.

[0013] As data rates in computers continue to rise, copper conductors are becoming increasingly inadequate for transmitting high-speed data between components at the speeds customers demand. The use of silicon photonics helps alleviate this bottleneck by enabling data transmission via fiber optics instead of copper traces. One challenge in providing fiber optic connectivity to silicon photonic packages lies in enabling light to enter and exit the protective package surrounding the integrated circuit chip. The ability to accurately and efficiently align external fiber optic cables with internal silicon photonic waveguides will be a robust approach to supporting high data rates and enhancing the performance of hyperscale data centers.

[0014] According to some aspects of this specification, an optoelectronic assembly includes: a substrate having a plurality of first optical waveguides; a bracket; and a first cover encapsulating at least a portion of the first optical waveguides and the bracket. In some embodiments, the bracket may be bonded to the substrate and may define a recess therein. In some embodiments, the recess may have an opening and may be configured to receive an optical sleeve through the opening and align the optical sleeve with the first optical waveguides. In some embodiments, the opening is the top of the opening of the recess (i.e., the side of the bracket opposite to the bracket side bonded to the substrate, such that the optical sleeve descends into the recess in a direction substantially orthogonal to the plane of the substrate). In other embodiments, the opening is the opening side of the recess (i.e., the side of the bracket adjacent to the bracket side bonded to the substrate, such that the optical sleeve slides into the recess in a direction substantially parallel to the plane of the substrate). In some embodiments, the recess of the bracket may include at least one mechanical alignment feature configured to align the optical sleeve with at least one of the plurality of first optical waveguides.

[0015] In some embodiments, the first cover may include an aperture that exposes the opening of the recess. In some embodiments, the optoelectronic assembly may be configured to transmit light between a plurality of first optical waveguides and a plurality of second optical waveguides when the optical sleeve is received in the recess through the opening and secured therein, and a plurality of second optical waveguides (e.g., optical fibers) are attached to the optical sleeve. In some embodiments, the first cover may provide a seal for at least a portion of the first optical waveguide and the bracket, except for the opening therein. In some embodiments, the optoelectronic assembly may further include an adhesive that at least partially fills the space between the first cover and the substrate. In some embodiments, the first cover may be an encapsulation mold.

[0016] In some embodiments, the optoelectronic assembly may also include an outer cover. In some embodiments, the outer cover may cover the opening and secure the optical sleeve in a recess (e.g., to prevent the optical sleeve from being removed or detached). In some embodiments, the outer cover may provide strain relief to at least some of a plurality of second optical waveguides (e.g., to provide support to the optical waveguides where they protrude from the optical sleeve, and / or to hold the optical waveguides in place). In some embodiments, the optoelectronic assembly may also include an adhesive for securing the outer cover to the optoelectronic assembly.

[0017] In some embodiments, the bracket of the optoelectronic component may include an integrated optical lens disposed between a plurality of first optical waveguides and a plurality of second optical waveguides, in the optical path between the two sets of waveguides. In some embodiments, the light transmitted between the plurality of first optical waveguides and the plurality of second optical waveguides is substantially collimated for at least a portion of the optical path (e.g., in the gap between the optical sleeve and the bracket). In some embodiments, the substantially collimated light and the integrated optical lens enable extended beam optical connections between the plurality of first optical waveguides and the plurality of second optical waveguides.

[0018] According to some aspects of this specification, an optoelectronic assembly includes: a substrate having conductive traces; a bracket bonded to the substrate and defining a cavity therein; and an encapsulation mold covering at least a portion of the substrate and the bracket. In some embodiments, the encapsulation mold defines an opening therein that at least partially exposes the cavity for receiving an optical sleeve therein, such that light can be transmitted between an optical element disposed on the substrate (e.g., an optical waveguide on the substrate, or an optical transmitter or receiver connected to an optical waveguide on the substrate) and an optical waveguide (e.g., an optical fiber) attached to the optical sleeve. In some embodiments, the optical element is at least partially encapsulated by the encapsulation mold.

[0019] In some embodiments, the opening in the overlay mold is the top of the opening of the recess. In other embodiments, the opening is the side of the opening of the recess. In some embodiments, the recess of the bracket includes at least one mechanical alignment feature configured to align the optical sleeve with an optical element disposed on the substrate.

[0020] In some embodiments, the encapsulation mold encapsulates at least a portion of the conductive trace. In some embodiments, the encapsulation mold encapsulates at least a portion of the optical element. In some embodiments, the encapsulation mold provides a seal around an opening (e.g., a seal around at least a portion of the substrate and the bracket but allowing access to the opening). In some embodiments, the optical sleeve is removably received in a recess when the encapsulation mold is in place (i.e., the optical sleeve can be placed in the recess and removed through the opening even when the encapsulation mold is in place). In some embodiments, the optoelectronic assembly may include a second cover. In some embodiments, the second cover may cover the opening and help secure the optical sleeve in the recess of the bracket. In some embodiments, an adhesive may be applied to the second cover (e.g., to fill at least a portion of the space between the second cover and the optical sleeve or the encapsulation mold, and to help secure the optical sleeve in the recess of the bracket).

[0021] According to some aspects of this specification, a method for optically connecting an optical sleeve to an optical component having a substrate having a plurality of first optical waveguides, the method comprising the steps of: aligning an optical bracket with the plurality of first optical waveguides, the optical bracket including a recess for receiving the optical sleeve and the recess having an opening; enclosing at least a portion of the first optical waveguides and the bracket with a first cover, but not enclosing the opening; and inserting the optical sleeve into the recess through the opening. In some embodiments, the above method steps can be performed in a specified order.

[0022] In some embodiments, the first cover may be an overmolding, and the method may further include the step of overmolding at least a portion of the first optical waveguide and bracket, but not the opening. In other embodiments, the first cover may be a single piece (e.g., an injection-molded cover), and the method may further include the step of filling at least some of the space between the first cover and the substrate with an adhesive. In some embodiments, the first cover may provide a seal for at least a portion of the first optical waveguide and bracket, except for the opening therein (i.e., the first cover may provide a seal around but not over the opening). In some embodiments, the method may further include the steps of covering the opening with a second cover and securing the optical sleeve in the recess.

[0023] In some embodiments, the bracket of the optoelectronic component may include an integrated optical lens disposed between the optical element and an optical waveguide attached to the optical sleeve, in the optical path between the waveguide and the optical element. In some embodiments, the light transmitted between the optical element and the optical waveguide attached to the optical sleeve is substantially collimated for at least a portion of the optical path (e.g., in the gap between the waveguide and the optical element). In some embodiments, the substantially collimated light and the integrated optical lens achieve extended beam optical connection between the optical element and the optical waveguide attached to the optical sleeve.

[0024] Now let's look at the attached diagram. Figure 1 This is an exploded perspective view of an optoelectronic assembly 300 according to embodiments described herein. In some embodiments, the optoelectronic assembly 300 may include a substrate 10 attached to a mechanical lead frame 12, an optical bracket (or simply bracket) 30, and an optical sleeve (or simply sleeve) 40. In some embodiments, the bracket 30 may be bonded to the substrate 10 and aligned with one or more optical waveguides 20 (e.g., a plurality of first optical waveguides 20) in the substrate 10. In some embodiments, the optical waveguides 20 may also be optically aligned with optical elements 25 (e.g., photonic circuits, such as optical transmitters or receivers, which in some embodiments may be attached to the optical waveguides 20 on the substrate 10).

[0025] The bracket 30 may define a recess 31 having an opening 32 (see, for example, see...). Figure 5A The bracket 30 can be configured to receive the sleeve 40 into the recess 31 through the opening 32. In some embodiments, the bracket 30 may have one or more mechanical alignment features disposed within the recess 31, which are configured to align the sleeve 40 with at least one of the optical waveguides 20. That is, when the sleeve 40 is fully received within the recess 31 of the bracket 30, the sleeve 40 is aligned with at least one of the optical waveguides 20, and in some embodiments, this alignment may be assisted by one or more mechanical alignment features within the recess 31 of the bracket 30. In this way, proper alignment between the optical sleeve 40 and the plurality of first optical waveguides 20 is ensured, while allowing easy connection and removal of the sleeve 40.

[0026] In some embodiments, a plurality of second optical waveguides 60 may be attached to the optical sleeve 40 such that when the optical sleeve 40 is located in the bracket 30, light can be transmitted between the plurality of first optical waveguides 20 and the plurality of second optical waveguides 60. (An example of this transmission is...) Figure 4 (As shown in the text and will be discussed elsewhere in this article).

[0027] In some embodiments, the first cover 50 may enclose or otherwise cover at least a portion of the plurality of first optical waveguides and brackets. In some embodiments, the optical element 25 may also be at least partially enclosed by the first cover 50. In some embodiments, the first cover 50 may include an aperture 51 that, when the first cover 50 is in place, exposes the opening 32 of the recess 31. (For details regarding the opening 32 and the recess 31, please refer again to, for example...) Figure 5A When the first cover 50 is in place, the optical sleeve 40 can be removably received (i.e., allowing insertion and removal) in the bracket 30 through the aperture 51 and opening 32. In some embodiments, a second cover 80 may be used to cover the aperture 51 and help hold the optical sleeve 40 in its mating position within the bracket 30. In some embodiments, the second cover 80 may be adhered to the first cover 50 with an adhesive or snap-fitted into a corresponding feature structure (not shown) on the first cover 50. In some embodiments, the first cover 50 may be a separate component (e.g., a molded or tooled part). In other embodiments, the first cover 50 may be a wrap-around mold.

[0028] Figure 2 It is in the assembly view Figure 1 A perspective view of the optoelectronic component 300. The first cover 50 is in place, substantially covering the substrate 10 and the optical waveguide 20. Figure 2 Not shown in the image, see [link / reference]. Figure 1The appropriate portion of the lead frame 12 (e.g., lead pins or other electrical connection features) is appropriately exposed from the first cover 50. In other embodiments, other mounting formats may be used, including, for example, surface mount or ball grid array.

[0029] The second cover 80 is positioned to cover the mating combination of the optical sleeve and the bracket, but allows multiple second optical waveguides 60 to be exposed from the second cover 80 for proper connection with other devices or systems.

[0030] Figure 3 and Figure 4 Provided Figure 1 A perspective cross-sectional view of the optoelectronic component 300, showing the internal details of the component. Figure 3 The cross-sectional view shows the component 300 cut across the component along a direction substantially orthogonal to the plurality of second optical waveguides 60, while Figure 4 The component 300 is shown cut across the component in a direction substantially parallel to the plurality of second optical waveguides 60.

[0031] First look Figure 3 As can be seen, the first cover 50 basically encloses the characteristic structure of the optoelectronic component 300, including the substrate 10 (and the optical waveguide 20), part of the lead frame 12 and part of the optical bracket 30, except for the opening 32. Figure 3 Position the cutting line of the sectional view so that the "front" side (the side facing the left side of the page in the drawing, see...) is aligned with the viewer's perspective. Figure 4 Feature structure 36) is removed, thereby revealing the sleeve 40 located within the bracket 30. In some embodiments, an optical lens 34 may be positioned within the bracket 30 such that the optical lens is located in the optical path between the optical sleeve 40 and the plurality of first optical waveguides 20 in the substrate 10. In some embodiments, such as when the first cover 50 is an overmolding, the inner portion 55 may be at least partially filled with an overmolding material (i.e., at least partially filled as part of an overmolding process to encapsulate feature structures such as the substrate 10). In other embodiments, when the first cover 50 is a single piece (not an overmolding), or when there is a gap between the overmolding and feature structures such as the substrate 10, the inner portion 55 may be a material (such as an adhesive) that fills or partially fills any open space.

[0032] Looking at it now Figure 4 We can see that the cutting line is basically orthogonal to Figure 3 An alternative sectional view of the cut lines (now showing the "front" wall 36 of the bracket 30, which is in...) Figure 3 (removed from the middle). Figure 4In the view, the optical path 70 is shown as a plurality of first optical waveguides 20 on the substrate 10 and a plurality of second optical waveguides 60 attached to the sleeve 40. In some embodiments, the optical path 70 can move in both directions (i.e., the light can travel bidirectionally). For example, light traveling through the second optical waveguides 60 can enter the optical sleeve 40, be redirected by the light redirection surface 44 (i.e., reflected from the light redirection surface), exit the exit surface of the optical sleeve 40, pass through the integrated lens 34, and enter the first optical waveguides 20 on the substrate 10. In some embodiments, the light can be substantially collimated for at least a portion of the optical path between the integrated lens 34 and the redirection surface 44, thereby achieving extended beam optical connection.

[0033] Figures 5A to 5C A further cross-sectional view of the optoelectronic component 300 shown in the previous figure provides additional details. Figure 5A A side cross-sectional view of component 300 in an unfitted configuration is shown to highlight details of bracket 30. For example, in some embodiments, bracket 30 includes a recess 31 with an opening 32 on the “top” side of bracket 30. Optical sleeve 40 is shown (having an optical redirection surface 44 and a plurality of second optical waveguides 60) above bracket 30 and removed from bracket before fitting.

[0034] exist Figure 5B and Figure 5C In the image, for clarity, the optical bracket 30 is shown removed from the optoelectronic assembly 300, thus revealing details of the first cover 50 and the optical sleeve 40. For example, Figure 5B and Figure 5C All figures provide a view of the aperture 51 in the first cover 50. These figures show details of the arrangement of elements such as the substrate 10, the first optical waveguide 20, and the lead frame 12. Figure 5C Another view is provided of the optical path 70 as it passes down from the second optical waveguide 60 through the optical sleeve 40 (where the optical path is redirected) into the optical bracket 30 (as previously described, the optical bracket is omitted for clarity, but it will be disposed within the first cover 50), and into the first optical waveguide 20 (as previously described, the optical path 70 may be bidirectional).

[0035] Figures 6A to 6B Optoelectronic components (such as) are shown Figure 1 A perspective view of the lead frame and bracket of the optoelectronic component 300. Figure 6A and Figure 6B An optical sleeve 40 and its plurality of second optical waveguides 60 are shown relative to a plurality of first optical waveguides 20 embedded in or disposed on the substrate 10. Figure 6A and Figure 6BIn the text, the first cover element 50 has been omitted (see, for example, see...). Figure 1 The first cover 50) shows details of the substrate 10 and the lead frame 12. Figure 6B The bracket 30 was also omitted to allow a clearer view of the first optical waveguide 20 relative to the sleeve 40. Figure 6A and Figure 6B This is to illustrate the physical relationship between the first optical waveguide 20 (on the substrate 10) and the second optical waveguide 60 (attached to the sleeve 40). Specifically, the bottom surface (the surface facing the substrate) of the optical sleeve 40 is designed to align with the end of the first optical waveguide 20. It is the bonding of the optical bracket 30 to the end of the first optical waveguide 20 (and the alignment provided by the recess 31 and its corresponding opening 32) that ensures the optical alignment of the first optical waveguide 20 with the second optical waveguide 60. Optical coupling of light entering and leaving the waveguide 20 can be achieved by any suitable means, such as grating coupling, prism coupling, end coupling, or ephemeris coupling. In some embodiments, the optical waveguide 20 may also be optically aligned with an optical element 25 (e.g., a photonic circuit, such as an optical transmitter or receiver, which in some embodiments may be attached to the optical waveguide 20 on the substrate 10).

[0036] Figure 7 A perspective view of the optoelectronic component 300a with an alternative chassis configuration is provided. Elsewhere in this document (e.g., see references...),... Figure 5B In the other figures discussed, the optical bracket 30 is configured such that the opening 32 is on the "top" side of the bracket 30, and the mating direction of the optical sleeve 40 is downward toward the plane of the substrate 10 (see, for example, see...). Figure 5A (The mating direction is shown). In contrast, the optical bracket 30a includes an opening 32a on its side surface, such that the mating direction of the optical sleeve 40a is substantially parallel to the plane of the substrate 10. Figure 7 In some embodiments, the first cover 50, the aperture 51, and the second cover 80 may be substantially the same as those in other embodiments described elsewhere herein. However, in some embodiments, the optical bracket 30a may have an alternative configuration, including a side opening 32a. Additionally, since the opening 32a is located on the side of the bracket 30a, a portion of the optical bracket 30a may extend above the surface of the first cover 50, such as... Figure 7 As shown, this allows opening 32a to be exposed outside the first cover 50. In other embodiments, aperture 51 may be provided on a side surface (such as side surface 53) of the first cover 50 to expose side opening 32a through the first cover 50. In such embodiments, the second cover 80 may need to be reconfigured to extend on side surface 53 to secure optical sleeve 40a in side opening 32a.

[0037] at last, Figure 8This is a flowchart illustrating the steps of a method for optically connecting optical components between an optical sleeve and a substrate, according to an embodiment of this specification. In some embodiments, Figure 8 The steps described herein can be performed in a specified order. In step 100, the optical bracket is aligned with the optical waveguide on the substrate. This can be achieved such that any optical components within the bracket (such as integrated optical lenses, optical apertures, etc.) are fixed in aligned positions relative to the optical waveguide. The bracket may be configured to receive mating optical components, such as optical sleeves, within open recesses in the bracket. In some embodiments, optical alignment can be actively performed by inserting an optical sleeve into the optical bracket and aligning the bracket-sleeve assembly to maximize optical throughput from the sleeve waveguide to the substrate waveguide.

[0038] In step 110, at least a portion of the optical waveguide and at least a portion of the optical bracket are encapsulated by a first cover, while the openings of the bracket's recesses are substantially uncovered (e.g., to allow insertion of the sleeve during mating). In some embodiments, the first cover may be an overmolding that covers the appropriate components after an overmolding process has been performed. In step 120, at least some of the open spaces or gaps between the first cover and the substrate may be filled using an adhesive or similar material. In some embodiments, the lead frame may be attached to the substrate in step 130.

[0039] In step 140, the optical sleeve is inserted into the opening recess of the optical bracket. In some embodiments, the optical bracket may have additional mechanical alignment features within the recess to guide the sleeve into place and ensure proper alignment with the optical waveguide on the substrate.

[0040] In some embodiments, step 150 may be performed, wherein the second cover is placed in the appropriate position on the mating optical sleeve to help secure the optical sleeve within the recess of the optical bracket and / or provide an environmental seal. In some embodiments, the second cover may be bonded to the optoelectronic assembly using an adhesive or attached via a mechanical latching feature (e.g., a snap-fit ​​feature integral with the second cover, the first cover, and / or the optical bracket).

[0041] Terms such as “about” will be understood in the context in which they are used and described by those skilled in the art. If it is unclear to those skilled in the art in the context of their use and description of “about” to express quantities of characteristic size, quantity, and physical properties, then “about” will be understood to mean within 10% of a specified value. A quantity given a specified value as “about” can be precisely the specified value. For example, if it is unclear to those skilled in the art in the context of their use and description of this specification, a quantity having a value of about 1 means that the quantity has a value between 0.9 and 1.1, and that the value can be 1.

[0042] The term "substantially" will be understood by those skilled in the art in the context of its use and description herein. If the use of "substantially equal" is unclear to those skilled in the art in the context of its use and description herein, "substantially equal" will refer to approximately as described above. If the use of "substantially parallel" is unclear to those skilled in the art in the context of its use and description herein, "substantially parallel" will refer to being within 30 degrees of parallelism. In some embodiments, directions or surfaces described as substantially parallel to each other may be within 20 degrees or 10 degrees of parallelism, or may be parallel or nominally parallel. If the use of "substantially aligned" is unclear to those skilled in the art in the context of its use and description herein, "substantially aligned" will refer to alignment within 20% of the width of the aligned objects. In some embodiments, objects described as substantially aligned may be aligned within 10% or 5% of the width of the aligned objects.

[0043] All cited references, patents, and patent applications are incorporated herein by reference in their entirety in a consistent manner. In the event of any inconsistency or contradiction between the incorporated references and this application, the information in the foregoing description shall prevail.

[0044] Unless otherwise indicated, the description of elements in the accompanying drawings should be understood to apply equally to corresponding elements in the other drawings. While specific embodiments have been illustrated and described herein, those skilled in the art will recognize that various alternative and / or equivalent embodiments may be used instead of the illustrated and described embodiments without departing from the scope of this disclosure. This application is intended to cover any modifications or variations of the specific embodiments discussed herein. Therefore, this disclosure is intended to be limited only by the claims and their equivalents.

Claims

1. An optoelectronic component, the optoelectronic component comprising: The substrate includes a plurality of first optical waveguides; A bracket, the bracket being bonded to the substrate and defining a recess therein having an opening, the recess being configured to receive an optical sleeve through the opening and align the optical sleeve with the plurality of first optical waveguides; and A first cover encloses at least a portion of the plurality of first optical waveguides and the bracket, the first cover including an aperture exposing the opening of the recess, such that when the optical sleeve is received in the recess through the opening and secured therein and the plurality of second optical waveguides are attached to the optical sleeve, the optoelectronic component is configured to transmit light between the plurality of first optical waveguides and the plurality of second optical waveguides; When the first cover is in the appropriate position, the optical sleeve is received removably in the recess.

2. The optoelectronic assembly of claim 1, wherein the opening includes the top of the opening of the recess.

3. The optoelectronic assembly according to claim 1, wherein the opening includes the opening side of the recess.

4. The optoelectronic assembly of claim 1, wherein the recess of the bracket includes at least one mechanical alignment feature structure configured to align the optical sleeve with at least one of the plurality of first optical waveguides.

5. The optoelectronic assembly of claim 1, wherein the first cover provides a seal for at least a portion of the plurality of first optical waveguides and the bracket, except for the opening therein.

6. The optoelectronic assembly according to claim 1, further comprising an outer cover covering the opening and fixing the optical sleeve in the recess.

7. The optoelectronic assembly of claim 6, wherein the outer cover provides strain relief to at least some of the plurality of second optical waveguides.

8. The optoelectronic assembly of claim 6, further comprising an adhesive for securing the outer cover to the optoelectronic assembly.

9. The optoelectronic component according to claim 1, wherein the first cover is a covering mold.

10. The optoelectronic assembly of claim 1, further comprising an adhesive that at least partially fills the space between the first cover and the substrate.

11. The optoelectronic assembly of claim 1, wherein the bracket includes an integrated optical lens disposed between the plurality of first optical waveguides and the plurality of second optical waveguides.

12. The optoelectronic component of claim 11, wherein the light transmitted between the plurality of first optical waveguides and the plurality of second optical waveguides is substantially collimated with respect to at least a portion of the optical path between the plurality of first optical waveguides and the plurality of second optical waveguides.

13. The optoelectronic component according to claim 12, further comprising an extended beam optical connection between the plurality of first optical waveguides and the plurality of second optical waveguides.

14. An optoelectronic component, the optoelectronic component comprising: A substrate, the substrate including conductive traces; A bracket, the bracket being bonded to the substrate and defining a recess therein; and An encapsulation mold covering at least a portion of the substrate and the bracket, the encapsulation mold defining an opening therein that at least partially exposes the recess for receiving an optical sleeve therein, such that light can be transmitted between an optical element disposed on the substrate and an optical waveguide attached to the optical sleeve, wherein the optical element is at least partially encapsulated by the encapsulation mold; When the covering mold is in the appropriate position, the optical sleeve is received in the recess in a removable manner.

15. The optoelectronic assembly of claim 14, wherein the opening includes the top of the opening of the recess.

16. The optoelectronic assembly of claim 14, wherein the opening includes the opening side of the recess.

17. The optoelectronic assembly of claim 14, wherein the recess of the bracket includes at least one mechanical alignment feature configured to align the optical sleeve with the optical element.

18. The optoelectronic assembly of claim 14, wherein the overlay encapsulates at least a portion of the conductive trace.

19. The optoelectronic assembly of claim 14, wherein the encapsulation mold provides a seal for at least the portion of the substrate and the bracket, except for the opening therein.

20. The optoelectronic assembly of claim 14, further comprising a second cover covering the opening and securing the optical sleeve in the recess.

21. The optoelectronic assembly of claim 14, wherein the optical element disposed on the substrate is an optical transmitter or a receiver.

22. The optoelectronic assembly of claim 14, wherein the bracket includes an integrated optical lens disposed between the optical element and the optical waveguide attached to the optical sleeve.

23. The optoelectronic assembly of claim 22, wherein the light transmitted between the optical element and the optical waveguide attached to the optical sleeve is substantially collimated with respect to at least a portion of the optical path between the optical waveguide and the optical element.

24. The optoelectronic assembly of claim 23, further comprising an extended beam optical connection between the optical element and the optical waveguide attached to the optical sleeve.

25. A method for optically connecting an optical sleeve and an optical component, the optical component comprising a substrate, the substrate comprising a plurality of first optical waveguides, the method comprising the following steps: Align the optical bracket with the plurality of first optical waveguides, the optical bracket including a recess for receiving the optical sleeve, the recess including an opening; The first cover encloses at least a portion of the plurality of first optical waveguides and the optical bracket, but does not enclose the opening, so as to keep the opening accessible; as well as After the encapsulation step, the optical sleeve is removably inserted into the recess through the opening.

26. The method of claim 25, wherein the steps are performed in the order described in claim 25.

27. The method of claim 25, further comprising filling the space between the first cover and the substrate with an adhesive.

28. The method of claim 25, further comprising attaching a lead frame to the substrate.

29. The method according to claim 25, further comprising: The opening is covered with a second cover, and the optical sleeve is secured in the recess.

30. The method of claim 25, wherein the first cover provides a seal for at least a portion of the plurality of first optical waveguides and the optical bracket, except for the opening therein.

31. The method of claim 25, wherein the first cover is a covering mold.

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