Sensors and electronics

Abstract

The embodiment of the present application provides a sensor and electronic products. The sensor comprises a shell, a substrate, a waterproof structure and a sensor chip, the waterproof structure comprises a waterproof film and a supporting substrate, a containing cavity is formed between the supporting substrate and the substrate, the waterproof film is fixed in the containing cavity through a supporting structure, the waterproof film and the supporting structure are provided with a through channel, the channel is filled with a reinforcing structure, and the hardness of the reinforcing structure is greater than the hardness of the supporting structure, so that the structural strength of the waterproof structure is ensured.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically, to a sensor and electronic product. Background Technology

[0002] Environmental sensors typically require vents within their enclosure to connect with the outside environment and enable sensing. However, these vents prevent the sensors from being waterproof, limiting their usability. Therefore, current technologies often address this issue by incorporating waterproof structures.

[0003] However, existing waterproof structures rely on support structures to support the waterproof membrane. The support structure is made of relatively soft material with low strength, which can easily reduce the overall strength of the waterproof structure and make it less reliable.

[0004] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] One objective of this invention is to provide a new technical solution for sensors and electronic products.

[0006] According to a first aspect of the present invention, a sensor is provided, wherein the sensor comprises:

[0007] shell;

[0008] A substrate, wherein the substrate and the outer shell form an inner cavity, and the substrate is provided with a first vent hole;

[0009] A waterproof structure is provided in the inner cavity. The waterproof structure includes a waterproof membrane and a supporting substrate. The supporting substrate is provided with a second vent hole. A receiving cavity is formed between the supporting substrate and the substrate. The waterproof membrane is fixed to the receiving cavity by the supporting structure.

[0010] A sensor chip is disposed on the side of the support substrate away from the substrate, and the sensor chip is disposed relative to the second vent hole;

[0011] The waterproof membrane can divide the receiving cavity into a first chamber communicating with a first vent and a second chamber communicating with a second vent;

[0012] The waterproof membrane and the supporting structure have a through channel, which is filled with a reinforcing structure, and the hardness of the reinforcing structure is greater than that of the supporting structure.

[0013] Optionally, the supporting substrate is disposed on the substrate;

[0014] The upper surface of the reinforcing structure abuts against the lower surface of the supporting substrate to suspend the waterproof membrane on the substrate.

[0015] Optionally, the upper surface of the reinforcing structure abuts against the lower surface of the supporting substrate, and the lower surface of the reinforcing structure abuts against the upper surface of the substrate, so that the reinforcing structure can support the supporting substrate.

[0016] Optionally, the substrate has a groove on the side facing the inner cavity, and the supporting substrate is placed on the groove and electrically connected to the substrate;

[0017] The reinforcing structure is disposed within the groove.

[0018] Optionally, the reinforcing structure is a thermosetting adhesive.

[0019] Optionally, the reinforcing structure is a conductive gel.

[0020] Optionally, the sensor chip is a MEMS chip.

[0021] Optionally, it also includes an ASIC chip, which is disposed on the side of the support substrate away from the substrate.

[0022] Optionally, the waterproof membrane is a waterproof and breathable membrane.

[0023] According to a second aspect of the present invention, an electronic product is provided, the electronic product comprising the sensor described in the first aspect.

[0024] According to an embodiment of the present invention, a sensor has a through channel formed in the waterproof membrane and the supporting structure. The channel is filled with a reinforcing structure, the hardness of which is greater than that of the supporting structure. Thus, after the reinforcing structure is filled, it can form an integral structure with the waterproof membrane and the supporting structure. Since the supporting structure is made of a softer material with lower hardness, it will not damage the waterproof membrane. The reinforcing structure, being harder than the supporting structure, can significantly improve the strength of the waterproof structure. Compared with the prior art where the waterproof membrane is supported only by the supporting structure, the waterproof structure of the present application embodiment has higher structural strength, better reliability, and longer service life.

[0025] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0027] Figure 1 This is a schematic diagram of the sensor structure in one embodiment of the present invention.

[0028] Figure 2 yes Figure 1 A bottom view.

[0029] Figure 3 This is a schematic diagram of the sensor structure in another embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the sensor structure in another embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Substrate; 2. First vent; 3. Second vent; 4. ASIC chip; 5. MEMS chip; 6. Inner chamber; 7. Outer shell; 8. Waterproof structure; 81. Waterproof membrane; 82. Support structure; 83. Supporting substrate; 84. Reinforcing structure; 9. Receiving cavity; 91. First chamber; 92. Second chamber; 10. Channel. Detailed Implementation

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0034] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0036] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] According to one embodiment of this application, a sensor is provided. (Refer to...) Figures 1 to 4 The sensor includes a housing 7, a substrate 1, a waterproof structure 8, and a sensor chip. The substrate 1 and the housing 7 form an inner cavity 6, and the substrate 1 is provided with a first vent 2. The waterproof structure 8 is disposed in the inner cavity 6, and the waterproof structure 8 includes a waterproof membrane 81 and a supporting substrate 83. The supporting substrate 83 is provided with a second vent 3, and a receiving cavity 9 is formed between the supporting substrate 83 and the substrate 1. The waterproof membrane 81 is fixed to the receiving cavity 9 by a supporting structure 82. The sensor chip is disposed on the side of the supporting substrate 83 away from the substrate 1, and the sensor chip is disposed opposite to the second vent 3. The waterproof membrane 81 can divide the receiving cavity 9 into a first cavity 91 communicating with the first vent 2 and a second cavity 92 communicating with the second vent 3. The waterproof membrane 81 and the supporting structure 82 have a through channel 10, and the channel 10 is filled with a reinforcing structure 84. The hardness of the reinforcing structure 84 is greater than that of the supporting structure 82.

[0040] Specifically, such as Figure 1 , Figure 2As shown, the outer shell 7 covers the substrate 1, allowing the substrate 1 and the outer shell 7 to form an inner cavity 6. The waterproof structure 8 is disposed in the inner cavity 6. The substrate 1 has a first vent 2, and the waterproof structure 8 can cover the first vent 2 to block liquids, dust, and other external environmental impurities from entering through the first vent 2. The supporting substrate 83 of the waterproof structure 8 and the substrate 1 enclose a receiving cavity 9. The waterproof membrane 81 can be fixed to the receiving cavity 9 by the supporting structure 82, and the receiving cavity 9 is divided into a first chamber 91 communicating with the first vent 2 and a second chamber 92 communicating with a second vent 3. The second vent 3 is located on the supporting substrate 83 and is positioned relative to the sensor chip.

[0041] Compared to existing environmental sensors where a waterproof structure 8 is located beneath the substrate 1, the waterproof membrane 81 in this embodiment, situated within the receiving cavity 9, better blocks external environmental impurities such as liquids and dust entering through the first vent 2, resulting in superior waterproof and dustproof performance. Furthermore, since the waterproof structure 8 is integrally integrated into the sensor's internal cavity 6, it significantly reduces the sensor's size and production cost. Moreover, because the waterproof structure 8, especially the waterproof membrane 81, affects the measurement results of the sensor chip, writing the calibration parameters into the sensor chip before product calibration after the waterproof structure 8 is encapsulated can eliminate the impact of variations in the waterproof structure 8 on product performance fluctuations, thereby achieving higher product performance consistency.

[0042] Furthermore, the sensor described in this embodiment also has a through channel 10 formed in the waterproof membrane 81 and the support structure 82. The channel 10 is filled with a reinforcing structure 84, the hardness of which is greater than that of the support structure 82. Thus, after the reinforcing structure 84 is filled, it forms an integral structure with the waterproof membrane 81 and the support structure 82. Because the support structure 82 is made of a softer material with lower hardness, it will not damage the waterproof membrane 81. The reinforcing structure 84, with its higher hardness than the support structure 82, significantly improves the strength of the waterproof structure. Compared to the prior art where the waterproof membrane 81 is supported only by the support structure 82, the waterproof structure 8 described in this embodiment has higher structural strength, better reliability, and a longer service life.

[0043] The sensor described in this application embodiment may be an acoustic sensor, a pressure sensor, a combined sensor, or other sensor that requires a medium to achieve its sensing function.

[0044] Furthermore, during the sensor encapsulation process, the waterproof structure 8 described in this application can be assembled separately or simultaneously with the sensor. Those skilled in the art can choose according to actual needs, and this application does not impose any specific restrictions here.

[0045] It should be noted that, in the embodiments of this application, "above" refers to the direction in which the substrate 1 faces the outer shell 7, and "below" refers to the direction in which the substrate 1 is away from the outer shell 7.

[0046] In one embodiment, the support substrate 83 is disposed on the substrate 1; wherein the upper surface of the reinforcing structure 84 abuts against the lower surface of the support substrate 83 to suspend the waterproof membrane 81 on the substrate 1.

[0047] Specifically, such as Figure 3 As shown, the support substrate 83 is covered on the substrate 1 and directly connected to the substrate 1, so that the support substrate 83 can directly form a receiving cavity 9 between the support substrate 83 and the substrate 1.

[0048] The upper surface of the reinforcing structure 84 abuts against the lower surface of the supporting substrate 83. That is, the upper surface of the integral structure formed by the reinforcing structure 84, the waterproof membrane 81, and the supporting structure 82 is connected to the lower surface of the supporting substrate 83, and there is a gap between the lower surface of the integral structure and the upper surface of the substrate 1, so that the waterproof membrane 81 can be suspended on the substrate 1.

[0049] In this way, after receiving water pressure from the first vent 2, the waterproof membrane 81 can directly transmit the force generated by the water pressure to the supporting substrate 83, and then the supporting substrate 83 transmits it to the substrate 1.

[0050] Therefore, since the force generated by the water pressure impact on the waterproof membrane 81 is compressive stress, by suspending the waterproof membrane 81 on the substrate 1, the reliability of the adhesion between the waterproof membrane 81 and the support structure 82 can be effectively guaranteed, the connection strength of the support structure 82 after experiencing water pressure impact can be guaranteed, and the waterproof membrane 81 can be prevented from falling off the support structure 82 due to insufficient strength of the support structure 82, thus making it unusable. This significantly extends the service life of the waterproof structure 8.

[0051] Furthermore, the supporting substrate 83 can be connected to the substrate 1 by bonding or welding. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions here.

[0052] In one embodiment, the upper surface of the reinforcing structure 84 abuts against the lower surface of the supporting substrate 83, and the lower surface of the reinforcing structure 84 abuts against the upper surface of the substrate 1, so that the reinforcing structure 84 can support the supporting substrate 83.

[0053] Specifically, such as Figure 1 , Figure 2 As shown, the upper surface of the reinforcing structure 84 abuts against the lower surface of the supporting substrate 83, and the lower surface of the reinforcing structure 84 abuts against the upper surface of the substrate 1. That is, the upper surface of the integral structure formed by the reinforcing structure 84, the waterproof membrane 81, and the supporting structure 82 is connected to the lower surface of the supporting substrate 83, and the lower surface of the integral structure formed by the reinforcing structure 84, the waterproof membrane 81, and the supporting structure 82 is connected to the upper surface of the substrate 1, thereby forming a receiving cavity 9 between the supporting substrate 83, the integral structure, and the substrate 1. The integral structure can support the supporting substrate 83.

[0054] In this way, the waterproof membrane 81 can obtain a larger effective area in a given sensor packaging structure, which can better reduce the impact of external environmental impurities such as liquid and dust entering through the first vent 2 on the sensor, and effectively improve the stability and reliability of the sensor.

[0055] Furthermore, the supporting substrate 83 and the integrated structure, and the integrated structure and the substrate 1, can be connected together by adhesive or welding. Those skilled in the art can choose according to actual needs, and this application does not impose specific limitations here.

[0056] In one embodiment, the substrate 1 has a groove on the side facing the inner cavity 6, the supporting substrate 83 is placed on the groove and electrically connected to the substrate 1; wherein, the reinforcing structure 84 is disposed in the groove.

[0057] Specifically, such as Figure 4 As shown, a groove is formed on the substrate 1, and the groove communicates with the inner cavity 6. The supporting substrate 83 can be placed on the groove and can achieve electrical connection with the substrate 1. The supporting substrate 83 and the substrate 1 can form a receiving cavity 9, that is, the groove forms the receiving cavity 9. The reinforcing structure 84, the waterproof membrane 81, and the supporting structure 82 form an integral structure located within the groove.

[0058] In this way, while achieving electrical connection between the support substrate 83 and the substrate 1 and having a smaller waterproof structural volume, it is also possible to achieve an integral connection between the support substrate 83 and the substrate 1 formed by the reinforcing structure 84, the waterproof membrane 81, and the support structure 82. That is, while achieving a smaller waterproof structural volume for the sensor, it is possible to further ensure that the sensor has a larger effective area of ​​the waterproof membrane 81 and a higher strength waterproof structure 8, thereby making the service life of the sensor longer.

[0059] In one embodiment, the reinforcing structure 84 is a thermosetting adhesive.

[0060] Specifically, because the thermosetting adhesive has the advantages of rapid bonding, curing within seconds, suitability for continuous, automated high-speed operation, low cost, no solution content, harmlessness to the human body, no pollution to the environment, no risk of poisoning or fire, and no deformation, displacement, or shrinkage of the bonded object caused by solvents, the integrated structure formed by the thermosetting adhesive, the waterproof membrane 81, and the support structure 82 has higher stability and reliability, further extending the service life of the waterproof structure 8.

[0061] Of course, the reinforcing structure 84 described in this application can also be made of epoxy resin, silicone, or other materials, as long as the hardness of the selected material is greater than that of the supporting structure. Those skilled in the art can make the selection according to actual needs, and this application does not impose any specific restrictions here.

[0062] In one embodiment, the reinforcing structure 84 is a conductive gel.

[0063] Specifically, such as Figure 1 As shown, since the supporting substrate 83 and the substrate 1 are connected by the reinforcing structure 84 to the waterproof membrane 81 and the supporting structure 82 in an integral structure, and the supporting structure 82 is made of a non-conductive material, when an electrical connection is required between the supporting substrate 83 and the substrate 1, by setting the reinforcing structure 84 to a conductive material, such as conductive gel, the electrical connection between the supporting substrate 83 and the substrate 1 can be better achieved.

[0064] The hardness of the conductive material needs to be greater than the hardness of the support structure 82.

[0065] Therefore, the reinforcing structure 84 described in this application embodiment not only makes the waterproof structure 8 stronger, more reliable, and longer in service life, but also enables the electrical connection between the supporting substrate 83 and the substrate 1, thereby greatly simplifying the internal wiring connection of the sensor and reducing the production cost of the sensor.

[0066] In addition, such as Figure 4 As shown, by setting the reinforcing structure 84 to a conductive material, such as conductive gel, the conductive area between the supporting substrate 83 and the substrate 1 can be further increased. That is, on the basis of the supporting substrate 83 being placed on the groove and electrically connected to the substrate 1, the reinforcing structure 84 can also achieve electrical connection between the supporting substrate 83 and the substrate 1. This allows the sensor chip located on the supporting substrate 83 to be directly electrically connected to the substrate 1 through the supporting substrate 83, eliminating the need for gold wires to connect the sensor chip and the substrate 1. This further reduces the overall structure of the sensor and saves production costs.

[0067] In one embodiment, the sensor chip is a MEMS chip 5.

[0068] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, the MEMS chip 5 can sense external environmental pressure or acoustic signals through media such as air, thereby better realizing the sensing function of the sensor.

[0069] The MEMS chip 5 can be a single pressure MEMS chip, an acoustic MEMS chip, or two or more MEMS chips 5 including pressure and acoustic MEMS chips. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions.

[0070] In one embodiment, the sensor further includes an ASIC chip 4, which is disposed on the side of the support substrate 83 away from the substrate 1.

[0071] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, the ASIC chip 4 can read the environmental signals sensed by the MEMS chip 5 and convert them into electrical signals so as to better output the information from the sensor.

[0072] In one example, the waterproof membrane 81 is a waterproof and breathable membrane.

[0073] Specifically, such as Figures 1 to 4 As shown, the waterproof and breathable membrane can vibrate freely within the space provided by the support structure 82, and through the air permeability of the waterproof and breathable membrane itself, it can better realize the medium communication between the sensor chip and the external environment, thereby better realizing the sensing function of the sensor.

[0074] According to another embodiment of this application, an electronic product is provided that includes the sensor described in the embodiments of this application. The sensor is disposed in the body of the electronic product to give the electronic product higher structural strength and reliability.

[0075] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0076] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A sensor, characterized in that, include: Outer shell (7); The substrate (1) and the outer shell (7) form an inner cavity (6), and the substrate (1) is provided with a first vent hole (2). Waterproof structure (8), the waterproof structure (8) is disposed in the inner cavity (6), the waterproof structure (8) includes a waterproof membrane (81) and a supporting substrate (83), the supporting substrate (83) is provided with a second vent hole (3), a receiving cavity (9) is formed between the supporting substrate (83) and the substrate (1), and the waterproof membrane (81) is fixed to the receiving cavity (9) by the supporting structure (82). A sensor chip is disposed on the side of the support substrate (83) away from the substrate (1), and the sensor chip is disposed relative to the second vent (3). The waterproof membrane (81) can divide the receiving cavity (9) into a first chamber (91) communicating with the first vent (2) and a second chamber (92) communicating with the second vent (3). The waterproof membrane (81) and the supporting structure (82) are provided with a through channel (10), the channel (10) is filled with a reinforcing structure (84), the hardness of the reinforcing structure (84) is greater than the hardness of the supporting structure (82); the reinforcing structure (84) can form an integral structure with the waterproof membrane (81) and the supporting structure (82).

2. The sensor according to claim 1, characterized in that, The supporting substrate (83) is disposed on the substrate (1); The upper surface of the reinforcing structure (84) abuts against the lower surface of the supporting substrate (83) to suspend the waterproof membrane (81) on the substrate (1).

3. The sensor according to claim 1, characterized in that, The upper surface of the reinforcing structure (84) abuts against the lower surface of the supporting substrate (83), and the lower surface of the reinforcing structure (84) abuts against the upper surface of the substrate (1), so that the reinforcing structure (84) can support the supporting substrate (83).

4. The sensor according to any one of claims 2 or 3, characterized in that, The substrate (1) has a groove on the side facing the inner cavity (6), and the supporting substrate (83) is placed on the groove and electrically connected to the substrate (1). The reinforcing structure (84) is disposed within the groove.

5. The sensor according to claim 1, characterized in that, The reinforcing structure (84) is a thermosetting adhesive.

6. The sensor according to claim 1, characterized in that, The reinforcing structure (84) is a conductive gel.

7. The sensor according to claim 1, characterized in that, The sensor chip is a MEMS chip (5).

8. The sensor according to claim 1, characterized in that, It also includes an ASIC chip (4), which is disposed on the side of the support substrate (83) away from the substrate (1).

9. The sensor according to claim 1, characterized in that, The waterproof membrane (81) is a waterproof and breathable membrane.

10. An electronic product, characterized in that, Includes the sensor described in any one of claims 1-9.

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