Radiator and air conditioner outdoor unit with same
Patent Information
- Application Number
- CN202210657203.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-10
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2042-06-10
AI Technical Summary
[0005]本发明的一个目的在于,解决现有散热器因其基板导热能力差,而导致其散热能力较差的问题
[0018] Based on the foregoing description, those skilled in the art will understand that in the aforementioned technical solution of the present invention, by defining a liquid storage chamber, an evaporation channel, a condensation chamber, and a reflux channel that are sequentially fluidly connected within the heat dissipation component, and by making the minimum flow area of the reflux channel smaller than that of the evaporation channel, the phase change medium within the heat dissipation component can circulate in the order of the liquid storage chamber, the evaporation channel, the condensation chamber, and the reflux channel. This allows the heat received by the heat dissipation component to be quickly and evenly distributed throughout the entire heat dissipation component via the phase change medium flowing within it, thereby improving the heat dissipation capacity of the radiator. Furthermore, when the radiator is fixed to the object to be cooled via the mounting base, by thermally connecting the heat dissipation component to the object, the heat dissipation component can quickly absorb the heat from the object and rapidly achieve temperature uniformity through the phase change medium flowing within it.
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Figure CN117249497B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of heat dissipation technology, and specifically provides a radiator and an outdoor air conditioning unit having the same. Background Technology
[0002] The inverter power module is a crucial component of inverter air conditioners. Because it integrates multiple power chips, it generates a high heat flux and significant heat during operation. Furthermore, the greater the cooling capacity of the air conditioner and the higher the ambient temperature, the greater the heat generated by the inverter power module. To ensure the inverter power module operates normally and safely, the compressor frequency must be reduced by approximately 50%, which results in "the hotter the weather, the less effective the air conditioner's cooling."
[0003] Multi-split inverter air conditioners (outdoor units) mostly adopt a top-outlet air structure. The control box contains the control board and radiator. The radiator fins extend out of the control box and are cooled by airflow under the suction of the top axial fan.
[0004] Current radiators are generally made of extruded aluminum. However, their thermal conductivity is limited by the material's inherent properties. For small-sized inverter power modules with concentrated heat generation, the heat cannot be effectively and evenly distributed across the aluminum extruded radiator's substrate. This prevents the substrate from achieving uniform heat transfer, resulting in "hot spots" and excessive heat flux density, hindering efficient heat dissipation. Consequently, aluminum extruded radiators are insufficient for cooling inverter power modules under high-temperature conditions, leading to significant frequency throttling in air conditioners and poor cooling performance in hot weather. Summary of the Invention
[0005] One objective of this invention is to solve the problem that existing heat sinks have poor heat dissipation capacity due to the poor thermal conductivity of their substrates.
[0006] A further objective of this invention is to enable the phase change medium inside the radiator to circulate unidirectionally by means of the heat pump effect, thereby allowing the radiator to be heated and dissipated evenly.
[0007] Another objective of this invention is to solve the problem of poor cooling performance of existing inverter air conditioners in high-temperature weather conditions.
[0008] To achieve the above objectives, the present invention provides a radiator in a first aspect, comprising a mounting base and a heat dissipation component connected to the mounting base, the radiator being fixed to an object to be cooled via the mounting base, thereby thermally connecting the heat dissipation component to the object to be cooled; the heat dissipation component defines a liquid storage chamber, an evaporation channel, a condensation chamber, and a reflux channel that are fluidly connected end-to-end in sequence; one end of the evaporation channel communicating with the condensation chamber is located above the liquid storage chamber, and the minimum flow area of the reflux channel is smaller than the minimum flow area of the evaporation channel, so that the phase change medium within the heat dissipation component circulates in the order of the liquid storage chamber, the evaporation channel, the condensation chamber, and the reflux channel.
[0009] Optionally, the radiator further includes a heat-conducting member mounted on the mounting base, one side of the heat-conducting member abutting against the heat-dissipating member, and the other side of the heat-conducting member abutting against the object to be cooled; and / or, the mounting base is made of a lightweight material.
[0010] Optionally, the mounting base is provided with a clearance hole extending through it, and the heat-conducting member is installed in the clearance hole; and / or, the projection of the heat-conducting member on the heat dissipation member covers at least a portion of the liquid storage cavity and / or at least a portion of the evaporation channel.
[0011] Optionally, the mounting base is provided with a recess around the clearance hole, and the heat-conducting member is provided with a fixing wing, which is embedded in the recess and fixed together with the mounting base.
[0012] Optionally, the heat dissipation component is a blown plate or a stamped component made of stamped sheet metal; and / or, the radiator further includes a plurality of heat dissipation fins, which are thermally connected to the heat dissipation component.
[0013] Optionally, the evaporation channel includes a main channel and multiple branch channels. The main channel is connected to the liquid storage chamber, one end of each branch channel is connected to the main channel, and the other end of each branch channel is connected to the condensation chamber.
[0014] Optionally, a portion of the plurality of branch channels is distributed on one side of the main channel, and another portion of the plurality of branch channels is distributed on the other side of the main channel; the heat dissipation component defines two condensation chambers, one of the two condensation chambers is distributed on one side of the main channel and communicates with the portion of the branch channel, and the other of the two condensation chambers is distributed on the other side of the main channel and communicates with the other portion of the branch channel.
[0015] Optionally, each of the branch channels is inclined upward at an angle of not less than 15°; and / or, each of the branch channels is provided with a liquid storage tank at a position close to the main channel, the liquid storage tank being used to store liquid phase change medium.
[0016] Optionally, one end of the reflux channel is connected to the bottom of the condensation chamber, and the other end of the reflux channel is connected to the bottom of the liquid storage chamber.
[0017] The present invention provides an outdoor unit for an air conditioner in a second aspect, comprising the radiator described in any one of the first aspects.
[0018] Based on the foregoing description, those skilled in the art will understand that in the aforementioned technical solution of the present invention, by defining a liquid storage chamber, an evaporation channel, a condensation chamber, and a reflux channel that are sequentially fluidly connected within the heat dissipation component, and by making the minimum flow area of the reflux channel smaller than that of the evaporation channel, the phase change medium within the heat dissipation component can circulate in the order of the liquid storage chamber, the evaporation channel, the condensation chamber, and the reflux channel. This allows the heat received by the heat dissipation component to be quickly and evenly distributed throughout the entire heat dissipation component via the phase change medium flowing within it, thereby improving the heat dissipation capacity of the radiator. Furthermore, when the radiator is fixed to the object to be cooled via the mounting base, by thermally connecting the heat dissipation component to the object, the heat dissipation component can quickly absorb the heat from the object and rapidly achieve temperature uniformity through the phase change medium flowing within it.
[0019] Furthermore, by having one side of the heat-conducting component abut against the heat-dissipating component, and the other side of the heat-conducting component abut against the object to be cooled, the heat from the object can be transferred to the heat-dissipating component through the heat-conducting component, reducing thermal resistance. Simultaneously, the design of the heat-conducting component also allows the heat-dissipating component to be configured in more diverse shapes.
[0020] Furthermore, by setting up a liquid storage tank near the main channel in each branch channel and using the storage tank to store liquid phase change medium, the insufficient distribution of phase change medium in the branch channel is avoided, thereby preventing the branch channel from dry burning.
[0021] Furthermore, by connecting one end of the reflux channel to the bottom of the condensation chamber and the other end of the reflux channel to the bottom of the liquid storage chamber, the liquid phase change medium in the condensation chamber can flow back to the liquid storage chamber under the combined effects of the heat pump effect and its own gravity.
[0022] Furthermore, when the radiator of this invention is applied to an outdoor unit of an air conditioner, it can effectively overcome the problem of poor cooling performance of existing inverter air conditioners in high-temperature weather conditions. Moreover, the radiator of this invention can be installed on the side of the heat source (such as the electrical control box or inverter power module) inside the outdoor unit of the air conditioner, avoiding situations where there is insufficient installation space above the heat source inside the outdoor unit, resulting in a radiator with low heat dissipation power that cannot effectively dissipate heat from the heat source inside the outdoor unit.
[0023] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description
[0024] To more clearly illustrate the technical solution of the present invention, some embodiments of the present invention will be described below with reference to the accompanying drawings. Those skilled in the art should understand that the same reference numerals may indicate the same or similar parts or components in different drawings; the drawings of the present invention are not necessarily drawn to scale.
[0025] In the attached image:
[0026] Figure 1 These are exploded views of the heat sink structure in some embodiments of the present invention;
[0027] Figure 2 This is a front upper isometric view of the heat sink in some embodiments of the present invention;
[0028] Figure 3 This is a rear upper isometric view of the heat sink in some embodiments of the present invention;
[0029] Figure 4 These are plan views of heat dissipation components in some embodiments of the present invention;
[0030] Figure 5 These are projection diagrams of the heat-conducting components on the heat-dissipating components in some embodiments of the present invention;
[0031] Figure 6 This is a rear upper isometric view of the mounting base in some embodiments of the present invention;
[0032] Figure 7 This is a front upper isometric view (showing mounting holes) of the heat-conducting component in some embodiments of the present invention;
[0033] Figure 8 This is a rear upper isometric view of the heat-conducting component in some embodiments of the present invention (mounting holes are not shown);
[0034] Figure 9 This is a plan view of the heat dissipation component in some other embodiments of the present invention;
[0035] Figure 10 This is a schematic diagram of the structure of an outdoor air conditioner unit in some embodiments of the present invention. Detailed Implementation
[0036] Those skilled in the art should understand that the embodiments described below are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. These partial embodiments are intended to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by those skilled in the art without creative effort should still fall within the scope of protection of the present invention.
[0037] It should be noted that in the description of this invention, terms such as "center," "upper," "lower," "top," "bottom," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0038] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can also refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0039] Furthermore, it should be noted that in the description of this invention, the terms "coldness" and "heat" are two descriptions of the same physical state. That is, the higher the "coldness" of a target object (e.g., evaporator, air, condenser, etc.), the lower its "heat," and vice versa. A target object absorbs "coldness" while releasing "heat," and releases "coldness" while absorbing "heat." A target object retains "coldness" or "heat" to maintain its current temperature. "Refrigeration" and "heat absorption" are two descriptions of the same physical phenomenon; that is, a target object (e.g., evaporator) absorbs heat while refrigerating.
[0040] like Figures 1 to 3As shown, in some embodiments of the present invention, the radiator 100 includes a heat dissipation component 110, heat dissipation fins 120, a mounting base 130, and a heat-conducting component 140. The heat dissipation component 110 is fixedly connected to the heat dissipation fins 120, and this fixed connection can be any feasible connection method such as welding, snap-fitting, or plugging. The heat dissipation component 110 is mounted on the mounting base 130 via its side away from the heat dissipation fins 120. Preferably, the heat dissipation component 110 is mounted on the mounting base 130 by screws or bolts. Furthermore, those skilled in the art can also fix the heat dissipation component 110 and the mounting base 130 together using other connection methods as needed, such as bonding or snap-fitting. The heat-conducting component 140 is mounted on the mounting base 130. Preferably, the heat-conducting component 140 is disposed between the heat dissipation component 110 and the mounting base 130, and one side of the heat-conducting component 140 abuts against the heat dissipation component 110.
[0041] Furthermore, in some embodiments of the present invention, the heat sink 100 is fixed to the object to be cooled by the mounting base 130, thereby causing the side of the heat-conducting member 140 away from the heat dissipation member 110 to abut against the object to be cooled, thus thermally connecting the heat dissipation member 110 and the object to be cooled. In this case, the heat on the object to be cooled is first transferred to the heat-conducting member 140, then to the heat dissipation member 110, then to the heat dissipation fins 120, and finally dissipated into the environment via the heat dissipation fins 120.
[0042] Optionally, when the radiator 100 is fixed to the object to be cooled via the mounting base 130, the side of the heat-conducting member 140 away from the heat-dissipating member 110 can be made to abut against the main heat-generating part of the object to be cooled, thereby reducing the overall volume and weight of the radiator 100. Furthermore, the mounting base 130 can be made to abut against and be fixed together with other parts of the object to be cooled.
[0043] Furthermore, in other embodiments of the present invention, those skilled in the art can omit the heat-conducting member 140 as needed, and allow the heat dissipation member 110 to be directly thermally connected to the object to be cooled, for example, by having the heat dissipation member 110 abut against the object to be cooled. Further, those skilled in the art can omit the mounting base 130 as needed, and allow the heat dissipation member 110 to be directly fixed to the object to be cooled, for example, by fixing it to the object to be cooled with screws. Still further, those skilled in the art can omit the heat dissipation fins 120 as needed, especially for objects that generate little heat.
[0044] It should be noted that, in this invention, the object to be cooled can be any feasible component, such as an electrical control box, circuit board, chip, etc.
[0045] like Figure 4As shown, in some embodiments of the present invention, the heat dissipation component 110 defines a liquid storage chamber 111, an evaporation channel 112, a condensation chamber 113, and a return channel 114. The heat dissipation component 110 is preferably a blown plate, to form the liquid storage chamber 111, evaporation channel 112, condensation chamber 113, and return channel 114 through a blown plate process. Furthermore, those skilled in the art can, as needed, configure the heat dissipation component 110 as any other feasible component, such as a cast component, a stamped component made of stamped sheet metal, a welded sheet metal component, etc.
[0046] Continue reading Figure 4 In some embodiments of the present invention, the liquid storage chamber 111, the evaporation channel 112, the condensation chamber 113 and the reflux channel 114 are connected end to end in sequence so that the phase change medium (the phase change medium is a gas-liquid phase change medium) filled in the heat dissipation component 110 can circulate along the following path: liquid storage chamber 111 → evaporation channel 112 → condensation chamber 113 → reflux channel 114 → liquid storage chamber 111.
[0047] Furthermore, to ensure that the phase change medium can circulate along the following path: liquid storage chamber 111 → evaporation channel 112 → condensation chamber 113 → reflux channel 114 → liquid storage chamber 111, the minimum flow area of the reflux channel 114 is smaller than the minimum flow area of the evaporation channel 112. As an example, the cross-section (diameter) of the reflux channel 114 is smaller than the cross-section (diameter) of the evaporation channel 112. As an example, a throttling member is provided within the reflux channel 114 to ensure that the minimum flow area of the reflux channel 114 is smaller than the minimum flow area of the evaporation channel 112.
[0048] Continue reading Figure 4 In some embodiments of the present invention, the evaporation channel 112 includes a main channel 1121 and a plurality of branch channels 1122. The main channel 1121 is connected to the liquid storage chamber 111, one end of each branch channel 1122 is connected to the main channel 1121, and the other end of each branch channel 1122 is connected to the condensation chamber 113.
[0049] Furthermore, such as Figure 4 As shown, a portion of the multiple branch channels 1122 are distributed on one side of the main channel 1121, and another portion of the multiple branch channels 1122 are distributed on the other side of the main channel 1121, thereby forming a tree-like structure in the evaporation channel 112.
[0050] Continue reading Figure 4In some embodiments of the present invention, the heat dissipation member 110 defines two condensation chambers 113. One of the two condensation chambers 113 is located on one side of the main channel 1121 and communicates with the aforementioned branch channel 1122. The other of the two condensation chambers 113 is located on the other side of the main channel 1121 and communicates with the aforementioned branch channel 1122.
[0051] It should be noted that, Figure 4 The condensation chamber 113 on the left side shown in the diagram can be Figure 4 The portion above the midpoint line can be less or more than that portion.
[0052] Furthermore, it should be noted that, Figure 4 The two condensing cavities 113 shown have significantly different shapes in order to reduce the size of the heat dissipation component 110. Alternatively, those skilled in the art can, as needed, set the two condensing cavities 113 to have similar shapes.
[0053] like Figure 4 As shown, in some embodiments of the present invention, the evaporation channel 112 further includes an optional bypass channel 1123, one end of which is connected to the liquid storage chamber 111 and the other end of which is connected to the condensation chamber 113.
[0054] Furthermore, in other embodiments of the present invention, those skilled in the art may omit the branch channel 1122 and the condensation chamber 113 on one side of the main channel 1121 as needed. Alternatively, those skilled in the art may omit the main channel 1121 as needed, and make the end of each branch channel 1122 away from the condensation chamber 113 connected to the liquid storage chamber 111 respectively.
[0055] like Figure 4 As shown, in some embodiments of the present invention, each branch channel 1122 is provided with a liquid storage tank 11221 at a position near the main channel 1121. The liquid storage tank 11221 is used to store liquid phase change medium. The liquid phase change medium includes liquid phase change medium that flows from the main channel 1121 into the liquid storage tank 11221 along with gaseous phase change medium, and liquid phase change medium that condenses from gaseous phase change medium in the branch channel 1122 and flows back into the liquid tank 11221.
[0056] from Figure 4 As can be seen, in some embodiments of the present invention, the evaporation channel 112 is located above the liquid storage chamber 111, and each branch channel 1122 slopes upward from one end near the main channel 1121 to the other end. Preferably, the upward slope angle of each branch channel 1122 is not less than 15°, for example, 15°, 20°, 30°, 45°, etc.
[0057] from Figure 4 It can also be seen that, in some embodiments of the present invention, one end of the reflux channel 114 is connected to the bottom end of the condensation cavity 113, and the other end of the reflux channel 114 is connected to the bottom of the liquid storage cavity 111 (preferably connected to the bottom end of the liquid storage cavity 111), so that the liquid phase change medium in the condensation cavity 113 flows back to the liquid storage cavity 111 under the action of its own gravity and the action of the heat pump effect.
[0058] like Figure 5 As shown, in some embodiments of the present invention, when the radiator 100 is assembled, the projection of the heat-conducting member 130 on the heat dissipation member 110 covers at least a portion of the liquid storage cavity 111 and / or at least a portion of the evaporation channel 112, so that the at least portion of the liquid storage cavity 111 and the evaporation channel 112 can be heated by the heat dissipation member 110.
[0059] In some embodiments of the present invention, preferably, the phase change medium within the heat dissipation component 110 at least completely fills the liquid storage cavity 111. More preferably, Figure 5 The height of the phase change medium level in the storage chamber 111 or evaporation channel 112 is Figure 5 The height of the medium-temperature conductive component is 50% to 70%.
[0060] The following reference Figure 4 and Figure 5 This will explain the flow principle of the phase change medium inside the heat dissipation component 110.
[0061] like Figure 4 and Figure 5 As shown, when the liquid storage chamber 111 and the evaporation channel 112 are heated by the heat-conducting component 140, the liquid phase change medium in the liquid storage chamber 111 and the evaporation channel 112 is heated and turns into a gaseous phase change medium, causing the pressure in the liquid storage chamber 111 and the evaporation channel 112 to increase. Since the flow area of the evaporation channel 112 is larger than that of the return channel 114, the resistance of the evaporation channel 112 is smaller than that of the return channel 114. The phase change medium in the liquid storage chamber 111 and the evaporation channel 112 tends to flow towards the evaporation channel 112, so the gaseous phase change medium flows to the condensation chamber 113 through the evaporation channel 112. In the condensation chamber 113, the gaseous phase change medium transfers heat to the part of the heat dissipation component 110 corresponding to the condensation chamber 113, and thus cools down into a liquid state. The liquid phase change medium in the condensation chamber 113 flows back to the storage chamber 111 along the reflux channel 114 under its own gravity and the pressure difference between the liquid level and the liquid phase change medium.
[0062] During this process, due to the vertical distribution relationship described above between the liquid storage chamber 111, the evaporation channel 112, the condensation chamber 113, and the return channel 114, the gaseous phase change medium has a tendency to move from the liquid storage chamber 111 to the condensation chamber 113. Furthermore, since the flow area of the evaporation channel 112 is larger than that of the return channel 114, the phase change medium in the heat dissipation component 110 can generate a heat pump effect when heated, and is forced to circulate sequentially along the liquid storage chamber 111, the evaporation channel 112, the condensation chamber 113, and the return channel 114.
[0063] Optionally, in order to enhance the heat pump effect of the phase change medium within the heat dissipation component 110, the heat dissipation component 110 is further configured to satisfy the condition that, during the heating and flow of the phase change medium within the heat dissipation component 110, the phase change medium... Figure 5 The liquid level of the phase change medium in the storage chamber 111 or the evaporation channel 112 shall not be higher than the liquid level of the liquid phase change medium in the condensation chamber 113, so that the liquid phase change medium in the condensation chamber 113 may flow back to the storage chamber 111 along the reflux channel 114 under the action of the communicating vessel principle.
[0064] like Figures 1 to 3 As shown, there are multiple heat dissipation fins 120, and they can be any feasible fin. For example, a protruding structure to enhance heat transfer can be provided on the heat dissipation fins 120, and the heat dissipation fins 120 can be configured as folded fins, toothed fins, corrugated fins, or open fins.
[0065] like Figure 6 As shown, in some embodiments of the present invention, the mounting base 130 is provided with a limiting groove 131, a clearance hole 132, and a recess 133. The limiting groove 131 matches the heat dissipation member 110 so that the heat dissipation member 110 is embedded in the limiting groove 131 and fixed together with the mounting base 130. The clearance hole 132 and the recess 133 are disposed within the limiting groove 131, and the recess 133 is disposed around the clearance hole 132. The clearance hole 132 and the recess 133 are used to install the heat-conducting member 140.
[0066] In some embodiments of the present invention, the mounting base 130 is made of a lightweight material to reduce the weight of the radiator 100. This lightweight material may be plastic, wood, or the like.
[0067] like Figure 7 and Figure 8 As shown, a fixing wing 141 is provided on the heat-conducting component 140. The heat-conducting component 140 is installed in and passes through the clearance hole 132 so that the side of the heat-conducting component 140 away from the heat dissipation component 110 can abut against the object to be cooled. Furthermore, the fixing wing 141 is embedded in the recess 133 and fixed together with the mounting base 130.
[0068] Preferably, the heat-conducting component 140 is made of a metallic material so that the heat-conducting component 140 has good thermal conductivity.
[0069] Based on the foregoing description, those skilled in the art will understand that, in some embodiments of the present invention, by defining a liquid storage chamber 111, an evaporation channel 112, a condensation chamber 113, and a return channel 114 that are sequentially fluidly connected within the heat dissipation component 110, and by making the minimum flow area of the return channel 114 smaller than the minimum flow area of the evaporation channel 112, the phase change medium within the heat dissipation component 110 can circulate in the order of the liquid storage chamber 111, the evaporation channel 112, the condensation chamber 113, and the return channel 114. This allows the heat received by the heat dissipation component 110 to be quickly and evenly distributed throughout the entire heat dissipation component 110 by means of the phase change medium flowing within it, thereby improving the heat dissipation capacity of the radiator 100. In particular, after the heat sink 100 is installed on the object to be cooled, the heat dissipation component 110 can absorb the heat of the object through the heat conduction component 140, and the heat can be evenly distributed throughout the heat dissipation component 110 through the phase change medium in the heat dissipation component 110, thereby evenly transferring the heat to each heat dissipation fin 120, so as to achieve rapid heat dissipation of the heat sink 100.
[0070] Those skilled in the art will understand that, while ensuring that the heat sink 100 achieves the technical objectives described above, they may also make appropriate adjustments to the structure of the heat dissipation component 110 as needed. For example, Figure 9 Other embodiments are shown.
[0071] like Figure 9 As shown, in some other embodiments, unlike some embodiments described above, multiple connecting structures are respectively provided in the liquid storage chamber 111 and the condensation chamber 113, so that the two opposite sidewalls of the heat dissipation component 110 abut together through the connecting structures, thereby increasing the heat exchange area between the phase change medium in the liquid storage chamber 111 and the condensation chamber 113 and the sidewalls of the heat dissipation component 110. At the same time, when the pressure in the liquid storage chamber 111 and the condensation chamber 113 is high, the connecting structure can also act as a reinforcing rib to ensure the structural strength of the heat dissipation component 110.
[0072] Furthermore, in Figure 9 In other embodiments shown, the heat dissipation component 110 further includes a filling port 115 communicating with the condensation chamber 113, through which a phase change medium is filled into the heat dissipation component 110. Furthermore, those skilled in the art may, as needed, position the filling port 115 at other locations on the heat dissipation component 110, such as locations communicating with the liquid storage chamber 111, the evaporation channel 112, or the reflux channel 114.
[0073] Furthermore, the present invention also provides an outdoor unit 200 for an air conditioner.
[0074] like Figure 10 As shown, in some embodiments of the present invention, the outdoor unit 200 of the air conditioner includes an electrical control box 210 and a radiator 100 as described in any of the preceding embodiments. The electrical control box 210 houses a variable frequency power module (not shown), and the radiator 100 is thermally connected to the variable frequency power module. For example, the radiator 100 is mounted to the variable frequency power module via its mounting base 130, with the heat-conducting member 140 abutting against the variable frequency power module, and at least a portion of the heat dissipation fins 120 exposed on the outside of the electrical control box 210. Alternatively, those skilled in the art may, as needed, mount the radiator 100 to the electrical control box 210 via its mounting base 130, with the heat-conducting member 140 abutting against the electrical control box 210.
[0075] Those skilled in the art will understand that the heat sink 100 of the present invention can, in addition to being able to... Figure 2 and Figure 3 The unit is installed vertically outside the air conditioner outdoor unit 200 as shown in the diagram, but it can also be installed horizontally on the air conditioner outdoor unit 200.
[0076] The technical solutions of the present invention have been described in conjunction with several embodiments above. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Without departing from the technical principles of the present invention, those skilled in the art can disassemble and combine the technical solutions in the above embodiments, and can also make equivalent changes or substitutions to related technical features. Any changes, equivalent substitutions, improvements, etc., made within the technical concept and / or technical principles of the present invention will fall within the scope of protection of the present invention.
Claims
1. A heat sink, comprising a mounting base, a heat dissipation component connected to the mounting base, and a heat-conducting component mounted on the mounting base. The heat sink is fixed to the object to be cooled by the mounting base, thereby making the heat dissipation component thermally connected to the object to be cooled; The heat dissipation component is defined by a liquid storage chamber, an evaporation channel, a condensation chamber, and a return channel that are connected end to end in sequence. One end of the evaporation channel that connects to the condensation chamber is located above the liquid storage chamber. The minimum flow area of the reflux channel is smaller than that of the evaporation channel, so that the phase change medium in the heat dissipation component circulates in the order of the liquid storage chamber, the evaporation channel, the condensation chamber and the reflux channel; The evaporation channel includes a main channel and multiple branch channels. The main channel is connected to the liquid storage chamber, and the main channel extends upward from the liquid storage chamber; One end of each of the branch channels is connected to the main channel, and the other end of each of the branch channels is connected to the condensation chamber. Each of the branch channels extends obliquely upward from the main channel to the condensation chamber. Each of the branch channels is provided with a liquid storage tank at a position close to the main channel, and the liquid storage tank is used to store liquid phase change medium; One side of the heat-conducting component abuts against the heat dissipation component, and the other side of the heat-conducting component abuts against the object to be dissipated and is used to heat the phase change medium in the liquid storage chamber, the main channel and the branch channel. The projection of the liquid storage tank on the heat-conducting component is located inside the circumferential contour of the heat-conducting component.
2. The radiator according to claim 1, wherein, The mounting base is made of lightweight material.
3. The radiator according to claim 2, wherein, The mounting base is provided with a through-hole, and the heat-conducting component is installed in the through-hole; and / or, The projection of the heat-conducting component onto the heat dissipation component covers at least a portion of the liquid storage cavity and at least a portion of the evaporation channel.
4. The radiator according to claim 3, wherein, The mounting base has a recessed groove around the clearance hole, and the heat-conducting component has a fixing wing that is embedded in the recessed groove and fixed together with the mounting base.
5. The radiator according to any one of claims 1 to 4, wherein, The heat dissipation component is an inflatable plate or a stamped component made of stamped sheet metal.
6. The radiator according to any one of claims 1 to 4, wherein, The radiator also includes multiple heat dissipation fins, which are thermally connected to the heat dissipation component.
7. The radiator according to claim 1, wherein, A portion of the multiple branch channels is distributed on one side of the main channel, and another portion of the multiple branch channels is distributed on the other side of the main channel; The heat dissipation component defines two condensation chambers. One of the two condensation chambers is located on one side of the main channel and communicates with the branch channel of the portion thereof. The other of the two condensation chambers is located on the other side of the main channel and communicates with the branch channel of the other portion thereof.
8. The radiator according to claim 1, wherein, Each of the aforementioned branch channels is tilted upwards at an angle of not less than 15°.
9. The radiator according to any one of claims 1 to 4, wherein, One end of the reflux channel is connected to the bottom of the condensation chamber, and the other end of the reflux channel is connected to the bottom of the liquid storage chamber.
10. An outdoor unit for an air conditioner, comprising the radiator according to any one of claims 1 to 9.
Citation Information
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