Micro-prism processing method and micro-prism

Abstract

The application relates to the technical field of optical elements, and discloses a micro-prism processing method and a micro-prism. The method comprises the following steps: manufacturing a prism wafer, wherein one side of the prism wafer is a plane, the other side is a structure plane provided with a plurality of grooves arranged along a first direction, the plurality of grooves penetrate the prism wafer along a second direction to form a prism protruding structure between any two grooves, the first direction is perpendicular to the second direction, and the height of the prism protruding structure is smaller than the height of the prism wafer; fixing the structure plane of the prism wafer to a support; grinding the plane of the prism wafer until the height of the prism wafer is smaller than or equal to the height of the prism protruding structure, so that a plurality of prism long strips are obtained; and cutting the plurality of prism long strips to obtain a plurality of micro-prisms. Through the above method, batch processing of the micro-prism is realized, and the processing efficiency of the micro-prism is improved.

Description

Technical Field

[0001] This application relates to the field of optical element technology, specifically to a microprism fabrication method and a microprism. Background Technology

[0002] The use of microprisms began in medical endoscopes and has expanded to the optical communication industry and current mobile phone prisms, with demand increasing year by year. Through precise design and manufacturing, the surface and angle of a microprism can meet the requirements for accurate optical path deflection. Furthermore, the high reflectivity of the microprism surface effectively reduces optical signal loss. Additionally, the small size of microprisms allows devices using them to maintain accurate polarization while keeping the overall device size relatively compact.

[0003] Currently, cold working is used to grind individual prism strips to obtain microprisms. However, in existing technologies, grinding cuboid-shaped prism strips requires the support of a support body. In order to ensure the accuracy of microprisms and the feasibility of the processing technology, a relatively large support body is generally used, and the prism strip and the support body are ground together during the processing until the prism strip is ground into a right-angled microprism strip. This results in low processing efficiency of microprisms, thus limiting the production volume of microprisms. Summary of the Invention

[0004] In view of the above problems, this application provides a microprism processing method and a microprism, which can realize the batch processing of microprisms and improve the processing efficiency of microprisms.

[0005] According to one aspect of the embodiments of this application, a method for fabricating microprisms is provided. The method includes: fabricating a prism wafer, wherein one side of the prism wafer is a plane, and the other side is a structural surface having a plurality of grooves arranged along a first direction, the plurality of grooves penetrating the prism wafer along a second direction to form a prism protrusion structure between any two grooves, the first direction and the second direction being perpendicular to each other, and the height of the prism protrusion structure being less than the height of the prism wafer; fixing the structural surface of the prism wafer to a support member; grinding the plane of the prism wafer until the height of the prism wafer is less than or equal to the height of the prism protrusion structure to obtain a plurality of prism strips; and cutting the plurality of prism strips to obtain a plurality of microprisms.

[0006] In one alternative approach, the groove has an inverted triangular cross-section, and the prism protrusion has a triangular cross-section.

[0007] In one alternative approach, the groove has an inverted trapezoidal cross-section, and the prism protrusion has a trapezoidal cross-section.

[0008] In one alternative embodiment, an optical support plate structure is provided at both ends of the prism wafer along a first direction, wherein the height of the optical support plate structure is equal to the height of the prism wafer, and the optical support plate structure includes a first surface located on the same side as the plane and a second surface located on the same side as the structural surface; fixing the structural surface of the prism wafer to a support member includes: fixing the structural surface of the prism wafer and the second surfaces of the optical support plate structures at both ends of the prism wafer together to the support member; grinding the plane of the prism wafer includes: grinding the plane of the prism wafer and the first surface of the optical support plate structure.

[0009] In one alternative approach, after fabricating the prism wafer, the method further includes: attaching the structural facet of the prism wafer to a glass plate using an adhesive; and fixing the structural facet of the prism wafer to a support, including: fixing the side of the glass plate opposite to the structural facet of the prism wafer to the support.

[0010] In an alternative approach, after the structural facets of the prism wafer are attached to a glass plate using an adhesive, the method further includes filling multiple grooves with low-temperature wax.

[0011] In one alternative approach, multiple prism strips are cut to obtain multiple microprisms, including: setting the microprism width, and a first and second cutter distance of the cutting machine; placing the multiple prism strips on the cutting machine, and positioning the cutting machine blade at the starting end of the multiple prism strips, parallel to the gap between any two prism strips; starting the cutting machine to cut the multiple prism strips and the glass plate along a first direction at the first cutter distance; controlling the cutting machine blade to move the microprism width in the opposite direction of the first direction, or controlling the cutting machine blade to return to the starting end and then move the microprism width, starting the cutting machine to cut the multiple prism strips and the glass plate at the first cutter distance; rotating the cutting machine blade to make the cutting machine blade perpendicular to the cut multiple prism strips; starting the cutting machine to cut the multiple prism strips and the glass plate at the second cutter distance, separating the cut prism strips and the glass plate to obtain multiple microprisms. In one alternative approach, after moving the blade of the cutting machine to the width of the microprism and starting the cutting machine to cut the prism strips and glass plates at a first cutter distance, the method further includes: repeatedly executing the steps of controlling the blade of the cutting machine to move the width of the microprism in the opposite direction of the first direction, or controlling the blade of the cutting machine to return to the starting end and then moving the width of the microprism, and starting the cutting machine to cut multiple prism strips and glass plates at the first cutter distance.

[0012] In one alternative approach, if the cross-section of the groove is an inverted triangle and the cross-section of the prism protrusion is a triangle, the first jump cutter distance is equal to l1, where l1 is the length of the base of the triangle; if the cross-section of the groove is an inverted trapezoid and the cross-section of the prism protrusion is a trapezoid, the first jump cutter distance is equal to l2 + l3, where l2 is the length of the long base of the trapezoid and l3 is the length of the short base of the inverted trapezoid.

[0013] According to another aspect of the embodiments of this application, a microprism is provided, which is processed using the microprism processing method provided in the above embodiments.

[0014] This application embodiment involves fabricating a prism wafer with one side being a flat surface and the other side having a structure with multiple grooves and microprism protrusions formed between any two grooves. The structure is then fixed to a support, and the flat surface of the prism wafer is ground until the height of the prism wafer equals the height of the prism protrusions, resulting in multiple prism strips. Finally, these strips are cut to obtain multiple microprisms. This method allows for the processing of multiple microprisms from just one side of the prism wafer, shortening the processing flow, improving the processing efficiency of microprisms, and enabling batch processing, thus significantly increasing the yield of microprisms.

[0015] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0016] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0017] Figure 1 This is a schematic diagram of the existing microprism strip processing.

[0018] Figure 2 A schematic flowchart illustrating the microprism fabrication method provided in this application embodiment;

[0019] Figure 3 This is a schematic diagram of the structure of the prism wafer provided in an embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the structure of the prism wafer provided in an embodiment of this application;

[0021] Figure 5 This is a schematic diagram of the structure of the prism wafer fixed to the support member according to an embodiment of this application;

[0022] Figure 6 This is a schematic diagram of the structure of the prism wafer provided in an embodiment of this application;

[0023] Figure 7 This is a schematic diagram of the structure of the prism wafer fixed to the support member according to an embodiment of this application;

[0024] Figure 8 A schematic flowchart illustrating the microprism fabrication method provided in this application embodiment;

[0025] Figure 9 This is a schematic diagram of the structure of the prism wafer provided in an embodiment of this application;

[0026] Figure 10 A flowchart illustrating the sub-steps of step 140 provided in an embodiment of this application;

[0027] Figure 11 This is a schematic diagram of the structure of the prism wafer provided in an embodiment of this application.

[0028] The reference numerals in the detailed embodiments are as follows:

[0029] 10. Prism strip; 20. Support body;

[0030] 200. Prism wafer; 210. Plane; 220. Structural plane; 221. Groove; 222. Prism protrusion structure; 230. Optical support plate structure; 231. First surface; 232. Second surface;

[0031] 300. Support components;

[0032] 400. Glass plate. Detailed Implementation

[0033] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein.

[0034] The use of microprisms began in medical endoscopes and has expanded to the optical communication industry and current mobile phone prisms, with demand increasing year by year. Through precise design and manufacturing, the surface and angle of a microprism can meet the requirements for accurate optical path deflection. Furthermore, the high reflectivity of the microprism surface effectively reduces optical signal loss. Additionally, the small size of microprisms allows devices using them to maintain accurate polarization while keeping the overall device size relatively compact.

[0035] Because microprisms are very small, manual operation is relatively inconvenient. Furthermore, manually wiping a single microprism is extremely inefficient and prone to breakage when wiping long microprism strips. Therefore, in existing technologies, cold working methods are used to process individual prism strips to obtain microprism strips. Cold working refers to the process of changing the shape and surface condition of glass products through mechanical methods without heating, typically including grinding, polishing, cutting, machining, drilling, sandblasting, and other techniques.

[0036] Please refer to the details. Figure 1 , Figure 1 A schematic diagram of the existing microprism strip processing is shown. As shown in the figure, one side of the cuboid-shaped prism strip 10 is glued to the inclined surface of the support body 20 using optical adhesive, so that the prism strip 10 leans against the inclined surface of the support body 20. Then, the two right angles facing upwards on the prism strip 10 are ground off. Next, the support body 20 is rotated 90° counterclockwise so that the other two right angles of the prism strip 10 face upwards, and these two right angles are ground off, finally obtaining the microprism strip. In this process, in order to ensure the accuracy of the microprism and the feasibility of the processing technology, a relatively large support body is generally used, and the prism strip 10 and the support body 20 are ground together during the processing until the prism strip 10 is ground into a right-angled microprism strip. This results in low processing efficiency of the microprism, thus limiting the output of microprisms.

[0037] Based on this, this application provides a method for fabricating microprisms. By fabricating a prism wafer with one flat side and another side having multiple grooves, and by grinding the flat side of the prism wafer and controlling its height, multiple prism strips can be fabricated. Finally, multiple microprisms are obtained by cutting the prism strips. In this way, multiple microprisms can be obtained by processing only one side of the prism wafer, which not only shortens the processing flow and improves the processing efficiency of microprisms, but also enables batch processing of microprisms, significantly increasing the yield of microprisms.

[0038] Figure 2 This paper illustrates a flowchart of the microprism fabrication method provided in an embodiment of this application. Figure 3 and Figure 4 The diagram illustrates the structure of a prism wafer provided in two embodiments of this application. In the diagram, "·" indicates that the y-axis direction is perpendicular to the paper and outwards. As shown in the figure, the microprism fabrication method includes the following steps:

[0039] Step 110: Fabricate a prism wafer 200, wherein one side of the prism wafer 200 is a plane 210, and the other side is a structural plane 220 having a plurality of grooves 221 arranged along a first direction x. The plurality of grooves 221 penetrate the prism wafer 200 along a second direction y so that a prism protrusion structure 222 is formed between any two grooves 221. The first direction x and the second direction y are perpendicular to each other, and the height of the prism protrusion structure 222 is less than the height of the prism wafer 200.

[0040] The plane 210 can be a polished surface or a rough surface, and each of the multiple grooves 221 has the same shape. When the multiple grooves 221 are arranged alternately along the first direction x, and each groove 221 penetrates the prism wafer 200 along the second direction y, a prism protrusion structure 222 is formed between any two grooves 221, thereby forming the structural surface 220 of the prism wafer 200.

[0041] The cross-section of the groove 221 and the cross-section of the prism protrusion 222 can have the same shape or different shapes, preferably the same shape, such as a triangle, trapezoid, etc., wherein the triangle is preferably a right triangle. Specifically, the cross-section of the groove 221 can be as follows: Figure 3 The inverted triangle shown, the cross-section of the prism protrusion structure 222 is as follows: Figure 3 The triangle shown, wherein the inverted triangle and the triangle have the same side length and angle; the cross-section of the groove 221 can also be as shown. Figure 4 The inverted trapezoidal prism protrusion 222 shown has a cross-section as follows: Figure 4 The trapezoid shown has the same side length and angle as the inverted trapezoid and the regular trapezoid.

[0042] In prism wafer 200, the height h of prism protrusion structure 222 is its dimension along the third direction z, that is, the height from the vertex of the cross-section of prism protrusion structure 222 to the bottom edge of the cross-section. The height H of prism wafer 200 is its dimension along the third direction z, that is, the height from the vertex of the cross-section of prism protrusion structure 222 to the plane 210 of prism wafer 200, and H > h. Figure 3 and Figure 4 It can be seen that the structure formed by the difference (Hh) between the height of the prism wafer 200 and the height of the prism protrusion structure 222 is the solid part of the prism wafer 200. After the prism wafer 200 is manufactured, the solid part of the prism wafer 200 is ground away, which can break the connection between the prism protrusion structures 222.

[0043] Step 120: Fix the structural surface 220 of the prism wafer 200 to a support 300.

[0044] Please refer to the details. Figure 5 , Figure 5 A schematic diagram of the structure of the prism wafer fixed to the support member according to an embodiment of this application is shown. As shown in the figure, before grinding the solid part of the prism wafer 200, the structural surface 220 of the prism wafer 200 needs to be fixed to a support member 300, for example, fixed to the bonding plate of the grinding machine, i.e., the optical pad, so as to fix the prism wafer 200 when the grinding machine grinds the solid part of the prism wafer 200. Specifically, taking the cross-section of the prism protrusion structure 222 as a triangle as an example, the top edge where the vertex of the cross-section of each prism protrusion structure 222 is located can be glued and fixed to the support member 300 by adhesive. Taking the cross-section of the prism protrusion structure 222 as a trapezoid as an example, the top surface where the short base edge of the cross-section of each prism protrusion structure 222 is located can be glued and fixed to the support member 300 by adhesive. Among them, cold glue is preferred.

[0045] Step 130: Grind the plane 210 of the prism wafer 200 until the height H of the prism wafer 200 is less than or equal to the height h of the prism protrusion structure 222, to obtain multiple prism strips.

[0046] Specifically, the plane 210 of the prism wafer 200 is ground until the height H of the prism wafer 200 is less than or equal to the height h of the prism protrusion structure 222, that is, all the solid part of the prism wafer 200 is ground away, so that the connection between each prism protrusion structure 222 is broken, resulting in multiple independent prism protrusion structures 222, i.e. multiple prism strips.

[0047] Step 140: Cut the multiple prism strips to obtain multiple microprisms.

[0048] After grinding to obtain multiple prism strips, each prism strip can be cut along the second direction y to its length, or all microprism strips can be cut along the second direction y simultaneously to obtain multiple microprisms. When the cross-section of the prism protrusion structure 222 is triangular / right-angled triangular, cutting the multiple prism strips can yield multiple triangular / right-angled microprisms. When the cross-section of the prism protrusion structure 222 is trapezoidal, cutting the multiple prism strips can yield multiple trapezoidal microprisms.

[0049] In this embodiment of the invention, a prism wafer 200 is fabricated with one side being a flat surface 210 and the other side having a structural surface 220 containing multiple grooves 221 and microprism protrusions 222 formed between any two grooves 221. The structural surface 220 is then fixed to a support member 300, and the flat surface 210 of the prism wafer 200 is ground until the height H of the prism wafer 200 is equal to the height h of the prism protrusions 222, resulting in multiple prism strips. Finally, multiple microprisms are obtained by cutting these multiple prism strips. In this way, multiple microprisms can be obtained by processing only one side of the prism wafer 200, which not only shortens the processing flow and improves the processing efficiency of microprisms, but also enables batch processing of microprisms, significantly increasing the production volume of microprisms.

[0050] According to some embodiments of this application, optionally, the cross-section of the groove 221 is an inverted triangle, and the cross-section of the prism protrusion structure 222 is a triangle.

[0051] According to some embodiments of this application, optionally, the cross-section of the groove 221 is an inverted trapezoid, and the cross-section of the prism protrusion structure 222 is a trapezoid.

[0052] The specific implementation process and beneficial effects of the above embodiments can be found in the foregoing. Figures 2 to 5 The embodiments shown are not described in detail here.

[0053] To improve the processing accuracy of microprisms, according to some embodiments of this application, optionally, please refer to the following for details. Figure 6 and Figure 7 , Figure 6 A schematic diagram of the structure of the prism wafer provided in an embodiment of this application is shown. Figure 7 A schematic diagram of the structure of a prism wafer fixed to a support member according to an embodiment of this application is shown. As shown in the figure, optical support plate structures 230 are provided at both ends of the prism wafer 200 along the first direction x. The height of the optical support plate structure 230 is equal to the height of the prism wafer 200. The optical support plate structure 230 includes a first surface 231 located on the same side as the plane 210 and a second surface 232 located on the same side as the structural surface 220. Step 120 includes fixing the structural surface 220 of the prism wafer 200 and the second surfaces 232 of the optical support plate structures 230 at both ends to the support member 300. Step 130 includes grinding the plane 210 of the prism wafer 200 and the first surface 231 of the optical support plate structure 230.

[0054] The optical support plate structure 230 extending from both ends of the prism wafer 200 along the first direction x means that the optical support plate structure 230 is an integral structure with the prism wafer 200 during the fabrication of the prism wafer 200. The optical support plate structure 230 can use the same material as the prism wafer 200 or a different material, such as hard glass, colorless optical glass or quartz.

[0055] Since the height of the optical support plate structure 230 is equal to the height H of the prism wafer 200, when the plane 210 of the prism wafer 200 is placed on a horizontal plane, both the plane 210 of the prism wafer 200 and the first surface 231 of the optical support plate structure 230 can be in close contact with the horizontal plane simultaneously. When the structural surface 220 of the prism wafer 200 is placed on a horizontal plane, taking the cross-section of the prism protrusion 222 as a triangle as an example, the top edge where the vertex of the cross-section of the prism protrusion 222 is located and the second surface 232 of the optical support plate structure 230 can be in close contact with the horizontal plane simultaneously. In this case, when the structural surface 220 of the prism wafer 200 and the second surface 232 of the optical support plate structure 230 are both fixed to the support member 300, the optical support plate structure 230 can support the entire prism wafer 200, effectively reducing the probability of deformation of the prism protrusion 222 during grinding of the plane 210 of the prism wafer 200.

[0056] Furthermore, after fixing the structural surface 220 of the prism wafer 200 and the second surface 232 of the optical support plate structure 230 together to the support member 300, when grinding the plane 210 of the prism wafer 200 and grinding the first surface 231 of the optical support plate structure 230 together, the optical support plate structure 230 can serve as a parallelism reference. It provides a plane reference when grinding the plane 210 of the prism wafer 200, avoiding changes in the angle between the grinding surface and the inclined surface of the prism protrusion structure 222, ensuring the consistency of each microprism strip, and thus achieving control over the angular accuracy of each microprism.

[0057] To improve the cutting efficiency of microprism strips, according to some embodiments of this application, optionally, please refer to... Figure 8 and Figure 9 , Figure 8 This paper illustrates a flowchart of the microprism fabrication method provided in an embodiment of this application. Figure 9 A schematic diagram of the structure of the prism wafer provided in an embodiment of this application is shown. As shown in the figure, after step 110 above, the following is included:

[0058] Step 111: Use adhesive to attach the structural surface 220 of the prism wafer 200 to a glass plate 400.

[0059] Step 120a: Fix the side of the glass plate 400 away from the structural surface 220 of the prism wafer 200 to the support 300.

[0060] The adhesive can be a cold adhesive that does not require heating, has excellent bonding effect and is easy to use, and will not damage the structure of the prism wafer 200.

[0061] The structural surface 220 of the prism wafer 200 is attached to the glass plate 400 using an adhesive. Taking the cross-section of the prism protrusion 222 as a triangle as an example, the top edge of the vertex of the cross-section of each prism protrusion 222 is attached to one side of the glass plate 400 so that each prism protrusion 222 is bonded and fixed to the glass plate 400.

[0062] Next, the other side of the glass plate 400, that is, the side facing away from the structural surface 220 of the prism wafer 200, is fixed to the support member 300. For example, the side of the glass plate 400 facing away from the structural surface 220 of the prism wafer 200 is glued to the surface of the bonding plate of the grinding machine, that is, the optical pad.

[0063] In this way, even after the connection between the prism protrusions 222 and the prism wafer 200 is broken during grinding, the prism protrusions 222 can still be glued and fixed to the glass plate 400 with adhesive, resulting in multiple prism strips arranged neatly on the glass plate 400. This allows for the simultaneous cutting of the width and length of multiple prism strips, improving the cutting efficiency of the prism strips and thus improving the processing efficiency of microprisms.

[0064] To enhance the fixation between the structural surface 220 of the prism wafer 200 and the glass plate 400, according to some embodiments of this application, optionally, please continue to refer to Figure 8 The above step 111 is followed by step 112: filling the multiple grooves 221 with low-temperature wax.

[0065] The low-temperature wax can be polyolefin wax, microcrystalline wax, protective wax, or resin, etc. Because the area where each prism protrusion 222 is bonded to the glass plate 400 by adhesive is small, resulting in weak adhesion between the prism protrusion 222 and the glass plate 400, filling each groove 221 with low-temperature wax as support ensures that the prism strip will not detach from the glass plate 400 after the connection between the prism protrusions 222 is ground off, thus ensuring the cutting efficiency of the prism strip.

[0066] Furthermore, filling each groove 221 with low-temperature wax as a support can prevent angular deformation of each prism protrusion 222 when it is ground on the plane 210 of the prism wafer 200, ensuring the consistency of each prism strip and thus guaranteeing the precision of a single microprism.

[0067] To improve the processing efficiency of microprisms, according to some embodiments of this application, optionally, please refer to... Figure 10 , Figure 10 A flowchart illustrating the sub-steps of step 140 provided for embodiments of this application is shown in the figure. Step 140 includes the following steps:

[0068] Step 141: Set the width of the microprism, as well as the first and second cutter distances of the cutting machine.

[0069] Step 142: Place multiple prism strips on the cutting machine, and place the blade of the cutting machine at the starting end of the multiple prism strips, parallel to the gap between any two prism strips.

[0070] Step 143: Start the cutting machine to cut multiple prism strips and glass plate 400 along the first direction x at the first cutter distance.

[0071] Step 144: Control the blade of the cutting machine to move the width of the microprism in the opposite direction of the first direction x, or control the blade of the cutting machine to return to the starting end and then move the width of the microprism, start the cutting machine to cut multiple prism strips and glass plate 400 at the first jump blade distance.

[0072] Step 145: Rotate the cutter blade so that it is perpendicular to the cut prism strips.

[0073] Step 146: Start the cutting machine to cut multiple prism strips and glass plate 400 at the second cutter distance, and separate the cut prism strips and glass plate 400 to obtain multiple microprisms.

[0074] After grinding the prism wafer 200 to obtain multiple prism strips that are attached to the glass plate 400, in order to improve the cutting efficiency of the prism strips, the microprism width (i.e., the x-direction dimension), the first cutter distance and the second cutter distance of the cutting machine are set so that the cutting machine cuts multiple microprism strips sequentially at the first cutter distance and the second cutter distance, resulting in multiple microprisms with a width equal to the microprism width, thereby improving the processing efficiency of the microprisms.

[0075] First, in order to cut prism strips with different structures to obtain different microprisms, it is necessary to set different microprism widths and first cutter distances according to different prism protrusion structures 222, and cut each prism strip with the width (i.e., the x-direction dimension). Please refer to the following for details. Figure 2 and Figure 3 As shown in the figure, when the cross-section of the groove 221 is an inverted triangle and the cross-section of the prism protrusion 222 is a triangle, the width of the microprism is set to W1, and the first cutter distance L1 is set to the length of the base of the triangle l1. After cutting, a triangular microprism can be obtained. For example, when the triangle is a right triangle, a right-angled microprism can be obtained after cutting. When the cross-section of the groove 221 is an inverted trapezoid and the cross-section of the prism protrusion 222 is a trapezoid, the width of the microprism is set to W2, and the first cutter distance L2 is set to the sum of the length of the long base of the trapezoid l2 and the length of the short base of the inverted trapezoid l3 (l2+l3). After cutting, a trapezoidal microprism can be obtained. Then, according to the structural requirements of different microprisms, different second cutter distances are set to cut the length (i.e., the y-direction dimension) of each prism strip after width cutting, resulting in microprisms with different structures. It should be noted that for the microprism strips cut in the same operation, the width of each microprism obtained is the same.

[0076] Next, the multiple prism strips adhered to the glass plate 400 are placed on a cutting machine, and the cutting machine blade is positioned at the starting end of the multiple prism strips, for example, on the left slope of the first prism protrusion 222 counted along the first direction x on the prism wafer 200 (e.g., position A in the figure), so that the cutting machine blade is parallel to the gap between any two microprism strips. Then, the cutting machine is started to cut the multiple prism strips and the glass plate 400 along the first direction x at a first cutter distance L1 or L2 until the first round of prism strip cutting is completed.

[0077] Then, the cutting machine blade is moved along the opposite direction of the first direction x to the right slope of the prism protrusion 222 (e.g., the position shown at point B in the figure), and then the cutting machine is restarted to cut multiple prism strips and glass plate 400 along the opposite direction of the first direction x at a first jump distance L1 or L2, until the second round of prism strip cutting is completed. Alternatively, the cutting machine blade is controlled to return to the starting end of the multiple prism strips, and then the prism width W1 or W2 is moved to the right slope of the prism protrusion 222 (e.g., the position shown at point B in the figure), and then the cutting machine is restarted to cut multiple prism strips and glass plate 400 along the first direction x at a first jump distance L1 or L2, until the second round of prism strip cutting is completed. Through the above method, after the second round of cutting, multiple independent glass plates and multiple prism strips with a width of microprism width W1 or W2 can be obtained.

[0078] Next, the blade of the cutting machine is rotated so that the multiple prism strips and multiple glass plates obtained after cutting are perpendicular to the blade of the cutting machine. The cutting machine is then restarted to cut the multiple prism strips and multiple glass plates at the second jump blade distance, resulting in multiple prism strip segments and glass plates attached to each prism strip segment. Finally, after separating each prism strip segment and the glass plate attached to it, multiple microprisms with a width of microprism width W1 or W2 can be obtained.

[0079] By setting the width of the microprism and the first cutter distance of the cutting machine, the cutting machine can cut multiple prism strips pasted on the glass plate 400 to the desired width, thus obtaining multiple microprism strips of the preset width. This effectively improves the cutting efficiency of the microprism strips. Furthermore, by setting the second cutter distance of the cutting machine, the cutting machine can simultaneously cut the length of multiple prism strips to obtain multiple microprisms, significantly improving the processing efficiency of the microprisms.

[0080] In order to meet the needs of microprisms of different widths, according to some embodiments of this application, optionally, step 144 above is followed by repeating step 144 above.

[0081] Please refer to the details. Figure 11 , Figure 11A schematic diagram of the prism wafer structure provided in this application embodiment is shown. As shown in the figure, the width of the microprism is set to W3, and the first cutter distance is L2. Then, the cutting machine is started from the position shown at point A and cuts multiple prism strips and glass plate 400 along the first direction x with the first cutter distance L2 until the first round of prism strip cutting is completed. After that, the cutting machine blade is controlled to move the microprism width W3 in the opposite direction of the first direction x, or the cutting machine blade is controlled to return to the starting end of the multiple prism strips and then move the prism width W3. Then the cutting machine is started again from the position shown at point B and cuts multiple prism strips and glass plate 400 along the first direction x or in the opposite direction of the first direction x with the first cutter distance L2 to complete the second round of prism strip cutting, and so on. In this way, prism wafers with prism protrusion structures 222 of different sizes can be repeatedly cut to obtain multiple microprism strips with a width of microprism width W3 to meet the needs of microprisms of different widths. For example, after the cutting machine completes the first, second, third, and fourth rounds of cutting prism strips sequentially from points A, B, C, and D, each prism strip with a width of l2 can be cut into two microprism strips with a width of W3 and a rectangular microprism strip with a width of W3. After cutting the multiple prism strips by length (i.e., the y-direction dimension), multiple triangular microprisms with a width of W3 are finally obtained.

[0082] According to some embodiments of this application, optionally, if the cross-section of the groove 221 is an inverted triangle and the cross-section of the prism protrusion structure 222 is a triangle, the first jump cutter distance is equal to l1, where l1 is the length of the base of the triangle. If the cross-section of the groove 221 is an inverted trapezoid and the cross-section of the prism protrusion structure 222 is a trapezoid, the first jump cutter distance is equal to l2 + l3, where l2 is the length of the longer base of the trapezoid and l3 is the length of the shorter base of the inverted trapezoid.

[0083] According to another aspect of the embodiments of this application, a microprism is provided, which is processed using the microprism processing method provided in the above embodiments.

[0084] The specific implementation process and beneficial effects of the above embodiments can be referred to the foregoing embodiments, and will not be repeated here.

Claims

1. A method for fabricating microprisms, characterized in that, The method includes: A prism wafer is fabricated, wherein one side of the prism wafer is a plane and the other side is a structural surface with a plurality of grooves arranged along a first direction. The plurality of grooves penetrate the prism wafer along a second direction so that a prism protrusion structure is formed between any two grooves. The first direction and the second direction are perpendicular to each other, and the height of the prism protrusion structure is less than the height of the prism wafer. The structural surface of the prism wafer is fixed to a support member; Grind the plane of the prism wafer until the height of the prism wafer is less than or equal to the height of the prism protrusion structure to obtain multiple prism strips; Multiple microprisms are obtained by cutting the prism strips.

2. The method according to claim 1, characterized in that, The groove has an inverted triangular cross-section, and the prism protrusion has a triangular cross-section.

3. The method according to claim 1, characterized in that, The groove has an inverted trapezoidal cross-section, and the prism protrusion has a trapezoidal cross-section.

4. The method according to claim 1, characterized in that, The prism wafer is provided with optical support plate structures extending from both ends along the first direction, wherein the height of the optical support plate structure is equal to the height of the prism wafer, and the optical support plate structure includes a first surface located on the same side as the plane and a second surface located on the same side as the structural surface. The step of fixing the structural surface of the prism wafer to a support member includes: fixing the structural surface of the prism wafer and the second surface of the optical support plate structure at both ends of the prism wafer together to the support member; The grinding of the plane of the prism wafer includes grinding the plane of the prism wafer and the first surface of the optical support plate structure.

5. The method according to claim 1, characterized in that, After fabricating the prism wafer, the method further includes: using an adhesive to attach the structural surface of the prism wafer to a glass plate; The step of fixing the structural surface of the prism wafer to a support member includes: fixing the side of the glass plate away from the structural surface of the prism wafer to the support member.

6. The method according to claim 5, characterized in that, After attaching the structural surface of the prism wafer to a glass plate using an adhesive, the method further includes filling the plurality of grooves with low-temperature wax.

7. The method according to claim 5, characterized in that, The process of cutting multiple prism strips to obtain multiple microprisms includes: Set the width of the microprism, as well as the first and second cutter distances of the cutting machine; Place multiple prism strips on a cutting machine, and place the blade of the cutting machine at the starting end of the multiple prism strips, parallel to the gap between any two prism strips; The cutting machine is started to cut the multiple prism strips and the glass plate along the first direction at the first cutter distance; The blade of the cutting machine is controlled to move the width of the microprism in the opposite direction of the first direction, or the blade of the cutting machine is controlled to return to the starting end and then move the width of the microprism, and the cutting machine is started to cut multiple prism strips and the glass plate at the first jump blade distance; Rotate the blade of the cutting machine so that the blade is perpendicular to the multiple prism strips after cutting; The cutting machine is started to cut multiple prism strips and the glass plate at the second cutter distance, and the cut prism strips and the glass plate are separated to obtain multiple microprisms.

8. The method according to claim 7, characterized in that, After moving the blade of the cutting machine by the width of the microprism and starting the cutting machine to cut the prism strip and the glass plate at the first cutter distance, the method further includes: Repeat the steps of controlling the blade of the cutting machine to move the width of the microprism in the opposite direction of the first direction, or controlling the blade of the cutting machine to return to the starting end and then move the width of the microprism, and starting the cutting machine to cut multiple prism strips and the glass plate at the first jump blade distance.

9. The method according to claim 7, characterized in that, If the cross-section of the groove is an inverted triangle and the cross-section of the prism protrusion is a triangle, the first jump cutter distance is equal to... ,in, Let be the length of the base of the triangle; If the cross-section of the groove is an inverted trapezoid, and the cross-section of the prism protrusion is a trapezoid, then the first jump cutter distance is equal to... ,in The length of the longer base of the trapezoid is... Let be the length of the shorter base of the inverted trapezoid.

Images