A cabinet type power amplifier capable of fast heat dissipation

Abstract

The application relates to the technical field of power amplifiers, in particular to a cabinet type power amplifier capable of fast heat dissipation, which comprises a frame mechanism, a heat dissipation mechanism installed in the frame mechanism, a power amplifier body and a cooling liquid tank. The power amplifier body is placed in the frame mechanism, the heat dissipation mechanism is used for circulating and fast heat dissipation of the power amplifier body in the frame mechanism, and the air in the internal space of the frame mechanism is circulated along the circulating air groove through the separation fins and the heat dissipation circulating pipe after the starting of the circulating fan. The cooling liquid in the cooling liquid tank is introduced into one end of the heat dissipation circulating pipe and discharged from the other end into the cooling liquid tank through the starting of the circulating pump. The circulating air groove is cooled by the heat dissipation circulating pipe, and the passing air is cooled.

Description

Technical Field

[0001] This invention relates to the field of power amplifier technology, and more specifically to a chassis-type power amplifier capable of rapid heat dissipation. Background Technology

[0002] Power amplifiers are a crucial component of microwave equipment. A malfunction in the amplifier can cause single-channel circuit interruption, affecting the reliability of microwave communication. High-power amplifiers, due to their high power consumption, require extremely efficient heat dissipation. Microwave circuit failures are often caused by overheating, damaging integrated circuits and leading to signal interruption. A Chinese patent (authorization announcement number CN218072278U) discloses a microwave power amplifier, including a heat sink with a hollow interior filled with a heat dissipation medium. A groove is located at the bottom of the heat sink, and a condenser box is installed thereon. The microwave power amplifier body is mounted on the inner periphery of the groove. The upper left and lower right ends of the condenser box have a water inlet and an outlet, respectively. A water pump is located at the outlet. A heat-conducting medium is filled between the groove and the top of the microwave power amplifier body. A heat dissipation plate is installed at the top of the heat sink, and a heat dissipation cavity is located inside the heat dissipation plate. The heat sink communicates with the heat dissipation cavity through a through-hole. Inside the condenser chamber, the flow of water carries heat from the periphery of the microwave power amplifier to the heat sink. The heated water evaporates and then comes into contact with the heat dissipation cavity through perforations. A temperature difference exists between the heat dissipation cavity and the water vapor; as the water vapor condenses, it releases heat. A fan then cools the heat sink plate, removing the heat and improving heat dissipation efficiency. This solves the problem of heat loss leading to damage to electrical components. This patented technology addresses the issue that traditional power amplifiers often rely on single-mode air cooling, which primarily cools the external surface of the device. This results in low heat dissipation efficiency during use, failing to effectively dissipate heat from the inside of the power amplifier and thus easily damaging electrical components.

[0003] However, the heat dissipation efficiency in the existing technology is low. When the microwave power amplifier is operating at high power or in high ambient temperature conditions, the heat from the internal air is not effectively dissipated to the heat-generating electronic components on the inner wall of the power amplifier, which can easily lead to aging and damage.

[0004] The problem of rapid heat dissipation for power amplifiers during long-term operation needs to be solved.

[0005] Therefore, those skilled in the art have provided a chassis-type power amplifier that can quickly dissipate heat to solve the problems mentioned in the background art. Summary of the Invention

[0006] To solve the above-mentioned technical problems, the present invention provides: A chassis-type power amplifier capable of rapid heat dissipation includes: a chassis mechanism; a heat dissipation mechanism installed within the chassis mechanism; a power amplifier body; the power amplifier body is placed inside the chassis mechanism; the heat dissipation mechanism provides rapid cooling of the power amplifier body within the chassis mechanism. Preferably, the frame mechanism includes an organic frame, and an inner placement frame is installed on the inner side of the frame. A side guard frame is detachably and snap-fitted onto the outer side of the inner placement frame, and a plurality of heat dissipation holes are provided through the inner wall of the side guard frame.

[0007] Preferably, the heat dissipation mechanism includes a circulating air duct formed on the inner wall of the frame, a circulating fan is installed on the inner side of one end of the circulating air duct, and a desiccant filter plate is detachably placed on the inner side of the other end of the circulating air duct.

[0008] Preferably, a plurality of partition fins are installed on the inner side of the circulating air duct, and a heat dissipation circulation pipe is provided on the inner side of the partition fins. The heat dissipation circulation pipe is located inside the circulating air duct, and one end of the heat dissipation circulation pipe passes through the bottom of the circulating air duct and is connected to a coolant tank.

[0009] Preferably, the other end of the heat dissipation circulation pipe passes through the circulation air duct and is connected to a circulation pump, with the pump's water intake end connected inside the coolant tank.

[0010] Preferably, a semiconductor cooler is installed inside the side wall of the coolant tank, with the cooling end of the semiconductor cooler located inside the coolant tank and the heat dissipation end of the semiconductor cooler located outside the coolant tank, and a cooling fan is installed thereon.

[0011] Preferably, a condensate hopper is provided below the heat dissipation circulation pipe, and a vertical condensation fin is provided at the center of the condensate hopper. A bottom shell is installed below the condensate hopper, the vertical condensation fin is installed inside the protective shell, and a semiconductor cooler is installed on the bottom side wall of the vertical condensation fin.

[0012] Preferably, the second semiconductor cooler has a cooling end that contacts a vertical condensation fin, and a heat dissipation end that is equipped with a heat dissipation fin. A second cooling fan is provided outside the heat dissipation fin, and a protective shell is installed outside the second semiconductor cooler. The second cooling fan is mounted outside the protective shell.

[0013] Preferably, the bottom shell has a through-connected inclined water channel on its side wall, and a water collection tank is through-connected to the side wall of the inclined water channel. A base is fixedly provided at the bottom of the water collection tank.

[0014] The technical effects and advantages of this invention are as follows: In this invention, after the circulating fan is started, the air inside the frame is drawn along the circulating air channel, through the partition fins, and through the heat dissipation circulation pipe. The heat dissipation circulation pipe is activated by the circulation pump, which draws coolant from the coolant tank into the coolant tank at one end and discharges it into the coolant tank at the other end. The circulating air is cooled by absorbing heat and cooling the air inside the circulating air channel through the heat dissipation circulation pipe.

[0015] In this invention, the second activation of the semiconductor cooler lowers the temperature of the vertical condenser fins. The air passing through these fins condenses, and the condensate drips down the fins into the inclined channels of the bottom casing. This water then drains into a collection tank for storage, thus dehumidifying the environment in which the power amplifier is placed. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a chassis-type power amplifier with rapid heat dissipation provided in an embodiment of this application; Figure 2 This is a schematic diagram of the heat dissipation holes in a chassis-type power amplifier that can dissipate heat quickly, according to an embodiment of this application. Figure 3 This is a schematic diagram of the circulating air duct in a chassis-type power amplifier that can quickly dissipate heat, according to an embodiment of this application. Figure 4 This is a schematic diagram of the condensate tank structure in a chassis-type power amplifier that can quickly dissipate heat, according to an embodiment of this application. Figure 5 This is a schematic diagram of the structure of a cooling fan 2 in a chassis-type power amplifier that can quickly dissipate heat, according to an embodiment of this application. Figure 6 This is a schematic diagram of point A in a chassis-type power amplifier with rapid heat dissipation provided in an embodiment of this application; Figure 7 This is a schematic diagram of point B in a chassis-type power amplifier that can quickly dissipate heat, as provided in an embodiment of this application.

[0017] In the picture: 1. Frame mechanism; 101. Frame; 102. Internal mounting rack; 103. Side guard frame; 104. Heat dissipation holes; 2. Heat dissipation mechanism; 201. Circulating air duct; 202. Circulating fan; 203. Desiccant filter plate; 204. Separating fins; 205. Heat dissipation circulation pipe; 206. Circulating pump; 207. Coolant tank; 208. Condensate hopper; 209. Bottom shell; 210. Inclined water channel; 211. Semiconductor cooler one; 212. Vertical condensation fins; 213. Heat dissipation fins; 214. Protective shell; 215. Cooling fan one; 216. Water collection tank; 217. Semiconductor cooler two; 218. Cooling fan two; 219. Base; 3. Power amplifier housing. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0019] Example: Please see Figures 1-7This embodiment provides a chassis-type power amplifier capable of rapid heat dissipation, comprising: a chassis mechanism 1; a heat dissipation mechanism 2 installed inside the chassis mechanism 1; a power amplifier body 3; the power amplifier body 3 is placed inside the chassis mechanism 1; the heat dissipation mechanism 2 provides rapid heat dissipation for the power amplifier body 3 within the chassis mechanism 1; the chassis mechanism 1 includes an organic frame 101, and an inner mounting frame 102 is installed inside the organic frame 101, with a side guard frame 103 detachably mounted on the outer side of the inner mounting frame 102, and a plurality of heat dissipation holes 104 penetrating the inner wall of the side guard frame 103; the heat dissipation mechanism 2 includes... A circulating air duct 201 is formed on the inner wall of the frame 101. A circulating fan 202 is installed on the inner side of one end of the circulating air duct 201, and a desiccant filter plate 203 is detachably placed on the inner side of the other end of the circulating air duct 201. Several partition fins 204 are installed on the inner side of the circulating air duct 201. A heat dissipation circulation pipe 205 is provided on the inner side of the partition fins 204, and the heat dissipation circulation pipe 205 is located inside the circulating air duct 201. One end of the heat dissipation circulation pipe 205 passes through the bottom of the circulating air duct 201 and is connected to a coolant tank 207. The other end of the heat dissipation circulation pipe 205 passes through the circulating air duct 201 and is connected to a circulating pump 20. 6. The pump 206's suction end is connected to the inside of the coolant tank 207; a thermoelectric cooler 211 is installed inside the side wall of the coolant tank 207, with the cooling end of the thermoelectric cooler 211 located inside the coolant tank 207 and the heat dissipation end located outside the coolant tank 207, and a cooling fan 215 is installed thereon; a condensate hopper 208 is provided below the heat dissipation circulation pipe 205, and vertical condensation fins 212 are provided at the center of the condensate hopper 208; a bottom shell 209 is installed below the condensate hopper 208, and the vertical condensation fins 212 are installed inside the protective shell 214. A second semiconductor cooler 217 is installed on the bottom side wall of the vertical condensing fin 212; the cooling end of the second semiconductor cooler 217 contacts the vertical condensing fin 212, and the heat dissipation end of the second semiconductor cooler 217 is equipped with heat dissipation fins 213. A second cooling fan 218 is provided outside the heat dissipation fins 213. A protective shell 214 is installed outside the second semiconductor cooler 217, and the second cooling fan 218 is installed outside the protective shell 214; a diagonal water channel 210 is connected through the side wall of the bottom shell 209, and a water collection tank 216 is connected through the side wall of the diagonal water channel 210; a base 219 is fixedly provided at the bottom of the water collection tank 216. Working principle: The frame mechanism 1 is positioned and placed in conjunction with the power amplifier body 3; The side guard frame 103 of the frame mechanism 1 can be slidably locked on both sides of the inner placement frame 102, and is connected to the power amplifier body 3 through the heat dissipation hole 104. When the power amplifier body 3 is rapidly cooled, the circulating fan 202 is started. After the circulating fan 202 is started, the air inside the frame 101 is drawn along the circulating air channel 201, through the partition fins 204, and through the heat dissipation circulation pipe 205. The heat dissipation circulation pipe 205 is activated by the circulation pump 206, which draws the coolant inside the coolant tank 207 into one end of the heat dissipation circulation pipe 205 and discharges it into the coolant tank 207 from the other end. The air passing through the heat dissipation circulation pipe 205 absorbs heat and cools the air inside the circulating air channel 201. The semiconductor cooler 211 is activated to cool the coolant inside the coolant tank 207, and the cooling fan 215 provides heat dissipation for the heat dissipation end of the semiconductor cooler 211. When the semiconductor cooler 217 is activated, it lowers the temperature of the vertical condenser fins 212. The air passing through the vertical condenser fins 212 will generate condensation. The condensation drips through the vertical condenser fins 212 into the inclined channel 210 of the bottom shell 209. The condensation is then discharged into the water collection tank 216 for storage, thus dehumidifying the environment in which the power amplifier body 3 is placed.

[0020] In this invention, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements or an interaction between two elements. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A chassis-type power amplifier capable of rapid heat dissipation, characterized in that, include: A frame mechanism (1); a heat dissipation mechanism (2) is installed inside the frame mechanism (1); and a power amplifier body (3). The power amplifier housing (3) is placed inside the frame mechanism (1); the heat dissipation mechanism (2) is for the power amplifier housing (3) to circulate and rapidly dissipate heat inside the frame mechanism (1); the heat dissipation mechanism (2) includes a circulation duct (201), a plurality of partition fins (204) are installed inside the circulation duct (201), a heat dissipation circulation pipe (205) is provided inside the partition fins (204), and the heat dissipation circulation pipe (205) is located inside the circulation duct (201), one end of the heat dissipation circulation pipe (205) passes through the bottom of the circulation duct (201) and is connected to a coolant tank (207); the circulation duct (201) one A circulating fan (202) is installed on the inner side of the end. A condensate hopper (208) is provided below the heat dissipation circulation pipe (205). A vertical condensation fin (212) is provided at the center of the condensate hopper (208). A bottom shell (209) is installed below the condensate hopper (208). The vertical condensation fin (212) is installed inside the protective shell (214). A semiconductor cooler (217) is installed on the bottom side wall of the vertical condensation fin (212). The circulating fan (202) is used to transport the air inside the frame mechanism (1) along the circulating air channel (201) through the partition fin (204) and the heat dissipation circulation pipe (205) for cooling.

2. The chassis-type power amplifier with rapid heat dissipation according to claim 1, characterized in that, The frame mechanism (1) includes an organic frame (101), and an inner placement frame (102) is installed on the inner side of the frame (101). A side guard frame (103) is detachably attached to the outer side of the inner placement frame (102). A number of heat dissipation holes (104) are provided through the inner wall of the side guard frame (103).

3. A chassis-type power amplifier with rapid heat dissipation according to claim 1, characterized in that, The heat dissipation mechanism (2) includes a circulating air duct (201) opened on the inner wall of the frame (101), and a desiccant filter plate (203) is detachably placed on the inner side of the other end of the circulating air duct (201).

4. A chassis-type power amplifier with rapid heat dissipation according to claim 1, characterized in that, The other end of the heat dissipation circulation pipe (205) is connected to the circulation air duct (201) and is connected to the circulation pump (206). The pumping end of the circulation pump (206) is connected to the inside of the coolant tank (207).

5. A chassis-type power amplifier with rapid heat dissipation according to claim 4, characterized in that, A semiconductor cooler (211) is installed inside the side wall of the coolant tank (207), with the cooling end of the semiconductor cooler (211) located inside the coolant tank (207) and the heat dissipation end of the semiconductor cooler (211) located outside the coolant tank (207), and a cooling fan (215) is installed thereon.

6. A chassis-type power amplifier with rapid heat dissipation according to claim 5, characterized in that, The second semiconductor cooler (217) has a cooling end that contacts a vertical condensing fin (212), and a heat dissipation fin (213) is mounted on the heat dissipation end of the second semiconductor cooler (217). A second cooling fan (218) is provided outside the heat dissipation fin (213), and a protective shell (214) is installed outside the second semiconductor cooler (217). The second cooling fan (218) is mounted outside the protective shell (214).

7. A chassis-type power amplifier with rapid heat dissipation according to claim 6, characterized in that, The bottom shell (209) has a through-connected inclined water channel (210) on its side wall, and a water collection tank (216) is through-connected to the side wall of the inclined water channel (210). A base (219) is fixedly provided at the bottom of the water collection tank (216).

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