一种电子封装用低温焊料及其制备方法
By adding Ti, Ag, and Ga elements to Sn-Bi alloys and employing specific preparation processes, the problems of poor wettability and high brittleness of Sn-Bi solders have been solved. This has enabled reliable brazing and high yield of materials such as SiO2 and Al2O3, meeting the low-temperature welding requirements of electronic packaging and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING INST OF NONFERROUS METALS & RARE EARTH
- Filing Date
- 2023-10-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing Sn-Bi alloy solders have poor wettability and high brittleness, making them difficult to process and unable to meet the high reliability and low temperature welding requirements of electronic packaging. In particular, the yield is low during the brazing of materials such as SiO2 and Al2O3, and traditional preparation methods are difficult to process into coils and strips.
By adding appropriate amounts of Ti, Ag, and Ga elements, and combining pre-alloying treatment, secondary alloying, rapid solidification strip making, and online heat treatment processes, a low-temperature solder with Sn content of 45-50 wt%, Ag content of 1.0-2.0 wt%, Ti content of 1.5-2.5 wt%, Ir content of 0.05-0.1 wt%, and Ga content of 0-0.5 wt% was prepared. This improved wettability and fluidity, refined grains, and enhanced plasticity and impact resistance.
It has achieved reliable brazing of materials such as SiO2 and Al2O3, reduced welding temperature, reduced weld warping, improved the mechanical properties and yield of the solder joints, simplified the packaging process, and reduced production costs.
Smart Images
Figure CN117260060B_ABST