一种基板传输装置和基板磨削装备
By using a loading head design that combines rigid and flexible suction cups in the substrate transfer device, the problems of vacuum suction cup adsorption failure and substrate drop are solved, achieving reliability and stability in substrate transfer, expanding the scope of application, and reducing the risk of substrate scratches.
CN117260428BActive Publication Date: 2026-07-17HWATSING (BEIJING) TECH CO LTD +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HWATSING (BEIJING) TECH CO LTD
- Filing Date
- 2023-09-08
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing substrate transfer devices, vacuum chucks face the risk of adsorption failure and substrate drop when interacting with porous ceramic disks, which affects production efficiency.
Method used
The design employs a loading head, combining a rigid first suction cup and a flexible second suction cup, and achieves multi-point adhesion through connecting components, adapting to uneven substrate surfaces and enhancing adsorption reliability.
Benefits of technology
It improves the reliability of substrate transport, avoids wafer drop, expands the application range of substrate transport devices, and reduces the risk of substrate scratches.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN117260428B_ABST
Abstract
本发明公开了一种基板传输装置和基板磨削装备，所述基板传输装置包括固定座、摆臂和装载头，所述装载头设置于摆臂的端部并绕固定座摆动；所述装载头包括连接组件、刚性的第一吸盘和柔性的第二吸盘，所述连接组件的一端设置于摆臂，其另一端滑动连接有第一吸盘；所述连接组件包括导向件、支撑件和连接件，所述导向件竖向设置于支撑件的上方，所述连接件垂直设置于支撑件的下方；所述连接件竖向连接于第一吸盘的竖向孔，所述第二吸盘设置于连接件的底部；基板装载时，利用第一吸盘和第二吸盘组合而装载基板。
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