A leveling and correcting device for micro-nano pasting / assembly / machining

Abstract

The application relates to the technical field of micron chip, and particularly discloses a leveling and deviation rectifying device for micro-nano pasting / assembly / machining, which comprises a device main body, multiple lifting assemblies and multiple centering assemblies. The device main body comprises a base and a first platform. The multiple centering assemblies are connected with the multiple lifting assemblies. The multiple lifting assemblies are circumferentially arranged on the base. The centering assembly comprises a ball, an upper supporting block, a lower supporting block and two supporting columns. The two supporting columns are arranged at the output end of the lifting assembly in a spaced mode. The lower supporting block is flexibly connected with the two supporting columns. The upper supporting block and the lower supporting block enclose a sliding cavity. The ball is slidably arranged in the sliding cavity. The first platform is fixedly connected with the upper supporting block in each centering assembly. In the scheme, the first platform can be driven to rotate around the X axis or the Y axis with high precision through the lifting assembly and the centering assembly, so that the micro-nano position compensation and deviation rectification of the components with micron and nanometer scales on the first platform can be realized, and the micro-nano pasting / assembly operation can be realized.

Description

Technical Field

[0001] This application relates to the field of manufacturing and processing technology at the micron and nanoscale, and in particular to a leveling and correction device for micro-nano bonding / assembly / processing. Background Technology

[0002] Micro-nano technology refers to the fabrication of functional devices and systems with dimensions in the micrometer range or even smaller by controlling and organizing the atoms, molecules, or microstructures of materials. These devices often require precise bonding, assembly, and operation because their assembly dimensions and characteristics are critical to their performance.

[0003] Micro / nano bonding / assembly / manipulation technologies have a wide range of applications in the micro / nano field. They are used to manufacture micro / nanoelectronic devices, sensors, biochips, micro / nanomechanical systems, and more. For example, in microelectronics, these devices can be used for molecular-level chip assembly and connection, as well as the assembly and packaging of micro / nano devices; in biomedicine, these devices can be used to assemble and manipulate micro-samples to achieve precise biological reactions and analyses; and in nanofabrication, these devices can be used to manufacture nanostructures and nanotemplates, achieving nanoscale bonding and assembly.

[0004] During the micro / nano bonding / assembly / operation process, there may be a certain degree of offset, tilting and misalignment between the micro / nano structures that need to be bonded / assembled / operated, which will lead to bonding / assembly / operation failure and directly affect the performance of the product. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a leveling and correction device for micro-nano bonding / assembly / processing, which can solve the problem of certain degree of offset, tilting and misalignment between the bonding / assembly / processing device and the material, substrate or display panel circuit connected below it during bonding / assembly / processing at the micron and nano scales.

[0006] To achieve the above technical objectives, this application provides a leveling and correction device for micro / nano bonding / assembly / processing, comprising: a device body, multiple lifting components and multiple centering components;

[0007] The main body of the device includes: a base and a first platform;

[0008] The centering components are connected one-to-one with the lifting components;

[0009] Multiple lifting components are evenly distributed in a circular pattern on the base to drive the centering component to rise and fall.

[0010] The centering component includes: a sphere, an upper support block, a lower support block, and two support columns;

[0011] The two support columns are spaced apart on the output end of the lifting assembly;

[0012] The lower support block is disposed between the two support columns and is suspended in the air, with both ends flexibly connected to the two support columns respectively;

[0013] The upper support block is positioned above the lower support block and forms a sliding cavity with the lower support block;

[0014] The sphere is slidably disposed within the sliding cavity in the horizontal direction;

[0015] The upper support block contacts the lower support block through the sphere;

[0016] The first platform is fixedly connected to the upper support block in each of the centering components.

[0017] Furthermore, the bottom of the upper support block is provided with an upper V-shaped groove that opens downwards;

[0018] The top of the lower support block is provided with an upward-opening lower V-shaped groove;

[0019] The lower V-groove and the upper V-groove together form the sliding cavity.

[0020] Furthermore, the lifting assembly includes: a voice coil motor and a pusher block;

[0021] The voice coil motor is mounted on the base and connected to the support column via the push block.

[0022] Furthermore, the lifting assembly also includes: a vertical push block;

[0023] The pusher block is slidably mounted on the base in the horizontal direction;

[0024] The voice coil motor is used to push the push block horizontally;

[0025] The vertical push block is slidably disposed on the base in the vertical direction and engages with the push block wedge.

[0026] The support column is mounted on the vertical push block.

[0027] Furthermore, the base is provided with multiple flexible leaf springs;

[0028] The first platform is connected to the base via multiple flexible leaf springs.

[0029] Furthermore, it also includes turntables;

[0030] The main body of the device also includes: a second platform;

[0031] The turntable is mounted on the base;

[0032] The second platform is mounted on the turntable;

[0033] The turntable is used to drive the second platform to rotate;

[0034] The multiple lifting components are evenly distributed in a circle around the turntable.

[0035] Furthermore, it also includes multiple micro-rotation components;

[0036] Multiple micro-rotation components are disposed on the second platform and are evenly distributed around the rotation center circumference of the second platform;

[0037] The micro-motion rotation assembly includes: a driver, an isosceles trapezoidal rotation mechanism, and a parallel hybrid amplification mechanism;

[0038] In the isosceles trapezoidal rotation mechanism, the intersection of the extensions of the legs of the two isosceles trapezoids is located at the rotation center of the second platform;

[0039] The driver is connected to the parallel hybrid amplification mechanism;

[0040] The parallel hybrid amplification mechanism is connected to the isosceles trapezoidal rotating mechanism.

[0041] The driver is used to drive the deformation of the parallel hybrid amplification mechanism, so that the parallel hybrid amplification mechanism drives the isosceles trapezoidal rotating mechanism to rotate.

[0042] Furthermore, the isosceles trapezoidal rotating mechanism includes two waist chains and a bottom chain;

[0043] One end of each of the two waist chains is hinged to the second platform, and the other end is hinged to one end of the bottom chain;

[0044] The other end of the bottom chain is hinged to the output end of the parallel hybrid amplification mechanism.

[0045] Furthermore, the parallel hybrid amplification mechanism includes: an output chain, two amplification chains, and multiple parallel chains;

[0046] The two amplification chains are spaced apart, and one end is hinged to the second platform;

[0047] One end of the output chain is hinged to the other end of the bottom chain;

[0048] The other end of the output chain is located between the two amplification chains;

[0049] The multiple parallel chains are respectively disposed on both sides of the other end of the output chain, and the multiple parallel chains located on the same side are arranged in parallel with each other;

[0050] One end of the parallel chain is hinged to the other end of the output chain, and the other end is hinged to the other end of the amplification chain;

[0051] The driver is positioned between the two amplification chains to drive the amplification chains to rotate.

[0052] Furthermore, the waist chain is hinged to the second platform and the bottom chain via a semi-circular notch hinge;

[0053] The bottom chain is hinged to the output end of the parallel hybrid amplification mechanism via a semi-circular notch hinge.

[0054] As can be seen from the above technical solutions, this application provides a leveling and correction device for micro / nano bonding / assembly / processing, comprising: a device body, multiple lifting components, and multiple centering components; the device body includes: a base and a first platform; the multiple centering components are connected one-to-one with the multiple lifting components; the multiple lifting components are evenly distributed circumferentially on the base for driving the centering components to rise and fall; the centering component includes: a sphere, an upper support block, a lower support block, and two support columns; the two support columns are spaced apart on the output end of the lifting component; the lower support block is disposed between the two support columns and is suspended, with its two ends flexibly connected to the two support columns respectively; the upper support block is disposed above the lower support block and forms a sliding cavity with the lower support block; the sphere is slidably disposed in the sliding cavity in the horizontal direction; the upper support block contacts the lower support block through the sphere; the first platform is fixedly connected to the upper support block of each of the centering components.

[0055] In this solution, the lifting component can drive the first platform to move along the Z-axis; through the cooperation of the lifting component and the centering component, the first platform can be driven to rotate around the X-axis or Y-axis with high precision, thereby realizing high-precision position compensation and correction of the display panel circuit or chip on the first platform, avoiding the problems of offset, tilt and misalignment between the chip and the display panel circuit. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 A schematic diagram of the overall structure of a leveling and correction device for micro / nano bonding / assembly / processing provided in this application embodiment;

[0058] Figure 2A schematic diagram showing the removal of the first and second platforms of a leveling and correction device for micro / nano bonding / assembly / processing, provided in an embodiment of this application;

[0059] Figure 3 A side view of a centering component in a leveling and correction device for micro / nano bonding / assembly / processing provided in an embodiment of this application;

[0060] Figure 4 A schematic diagram of a lifting component and a centering component in a leveling and correction device for micro / nano bonding / assembly / processing provided in an embodiment of this application;

[0061] Figure 5 A schematic diagram of an assembly micro-motion rotation component in a leveling and correction device for micro-nano bonding / assembly / processing provided in an embodiment of this application;

[0062] Figure 6 A plan view of a micro-motion rotating component in a leveling and correction device for micro / nano bonding / assembly / processing provided in an embodiment of this application;

[0063] Figure 7 Another plan view of the micro-motion rotating component in a leveling and correction device for micro-nano bonding / assembly / processing provided in an embodiment of this application. Detailed Implementation

[0064] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0065] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0066] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0067] Please see Figure 1 and Figure 2 The embodiment of this application provides a leveling and correction device for micro-nano bonding / assembly / processing, comprising: a device body 100, multiple lifting components 200 and multiple centering components 300.

[0068] The main body 100 of the device includes a base 101 and a first platform 102. Multiple centering components 300 are connected one-to-one with multiple lifting components 200; the multiple lifting components 200 are evenly distributed circumferentially on the base 101 and are used to drive the centering components 300 to rise and fall. The first platform 102 is mounted on the centering components 300, thereby controlling the centering components 300 at multiple positions to rise and fall to different heights through the multiple lifting components 200. This allows control of the first platform 102 to yaw, that is, to control the first platform 102 to rotate around the X-axis or Y-axis, achieving compensation and correction of the first platform 102. Both the lifting components 200 and the centering components 300 may each include three.

[0069] In this embodiment, please refer to Figure 3 and Figure 4 The centering component 300 includes: a sphere 301, an upper support block 302, a lower support block 303, and two support columns 304; the two support columns 304 are spaced apart on the output end of the lifting component 200; the lower support block 303 is disposed between the two support columns 304 and is suspended, with its two ends flexibly connected to the two support columns 304 respectively; the upper support block 302 is disposed above the lower support block 303 and forms a sliding cavity 305 with the lower support block 303; the sphere 301 is slidably disposed in the sliding cavity 305 in the horizontal direction; the upper support block 302 contacts the lower support block 303 through the sphere 301; the first platform 102 is fixedly connected to the upper support block 302 in each centering component 300; wherein, the first platform 102 can be horizontally disposed in the initial state. After the lifting assembly 200 transmits the driving force to the support column 304, the support column 304 then transmits it to the lower support block 303, and the lower support block 303 transmits it to the ball 301 and the upper support block 302, ultimately driving the first platform 102 to partially lift.

[0070] For issues such as misalignment and displacement that occur during micro / nano bonding / assembly / processing, existing correction devices generally employ high-precision alignment platforms with multiple degrees of freedom for adjustment. However, existing platforms often use three-point or multi-point leveling for leveling. Three-point leveling mechanisms are accompanied by coupling effects between points, while multi-point leveling (three or more points) can reduce coupling between points, but it is accompanied by difficulty in controlling accuracy.

[0071] In the leveling and correction device for micro / nano bonding / assembly / processing provided in this embodiment, the centering component 300 features high precision, large load capacity, and ease of control. Specifically, in this embodiment, the first platform 102 can be circular or annular; the length direction of the sliding cavity 305 can intersect with the center of the first platform 102, and multiple centering components 300 are evenly distributed circumferentially around the center of the first platform 102. Taking three centering components 300 as an example, from a geometric and kinematic perspective, when the three spheres 301 are placed arbitrarily but the sliding direction of each sphere 301 intersects with the center of the first platform 102, the sliding direction of each sphere 301 intersects with the instantaneous rotation center formed by the other two spheres 301. This means that rotation around this center (i.e., the center of the first platform 102) will not produce a displacement perpendicular to the sliding direction of the spheres 301. Therefore, in this scheme, the three centering components 300 are on a horizontal plane in a two-dimensional state. No matter where the rotation or translation occurs within the three spheres 301 with a fixed relative distance, the three spheres 301 cannot move relative to the same instantaneous center (there is always one sphere 301 whose displacement direction is perpendicular to the sliding direction of the sphere 301 and thus its displacement is restricted). Therefore, the three centering components of this scheme are extremely stable on the horizontal plane.

[0072] Meanwhile, in this solution, the upper support block 302 connected to the first platform 102 is used to press the sphere 301, providing a force constraint in the direction of gravity for the sphere 301 and preventing the sphere 301 from sliding in a non-sliding direction. Furthermore, the lower support block 303 is flexibly connected to the support column 304, which can increase the flexibility of the sphere 301 and avoid excessive coupling of the entire centering assembly 300 caused by completely limiting the position of the sphere 301.

[0073] In a further improved embodiment, the bottom of the upper support block 302 is provided with an upper V-shaped groove that opens downwards; the top of the lower support block 303 is provided with a lower V-shaped groove that opens upwards; the lower V-shaped groove and the upper V-shaped groove form a sliding cavity 305.

[0074] Specifically, in this embodiment, the upper V-groove and the lower V-groove refer to sliding grooves with a V-shaped cross-section; the upper support block 302 and the lower support block 303 both form a concave force limiting structure by setting V-shaped sliding grooves, forming a symmetrical combination of two V-shaped sliders that are inclined inward in a certain direction, so that pressure can be applied to the ball 301 from the upper and lower directions. This allows the upper support block 302 and the lower support block 303, which are locked by the force of the flexible hinge and pressed down by the gravity of the first platform 102, to position the ball 301, preventing it from sliding accidentally, while allowing the ball 301 to have a degree of freedom to slide in the length direction of the sliding cavity 305, so that the entire centering assembly 300 has a certain decoupling performance leveling capability in a high-precision state within a certain range.

[0075] It should be noted that due to errors in assembly or the components themselves, in practical applications, the multiple centering assemblies 300 may lock up within the plane of the first platform 102, resulting in multi-point strong coupling. The root cause is that the centering assembly 300 is a type of self-aligning shaft connector, which inherently does not allow for much yaw motion within a plane. Therefore, in this design, the lower support block 303 and the support column 304 can be hinged via a flexible hybrid mechanism, such as a hybrid four-leaf spring parallel mechanism. This flexible hybrid mechanism has the ability to perform horizontal micro-motion in one direction within space, which can effectively mitigate the aforementioned locking phenomenon. This satisfies the high stiffness characteristics of the centering assembly 300 in directions of non-permissible movement while maintaining the basic limiting function of the centering assembly 300.

[0076] In one embodiment, the lifting assembly 200 includes a voice coil motor 201 and a pusher block 202; the voice coil motor 201 is disposed on the base 101 and is connected to the support column 304 through the pusher block 202.

[0077] In this embodiment, the voice coil motor 201 drives the support column 304 to move vertically.

[0078] Furthermore, the lifting assembly 200 also includes: a vertical push block 203; a push block 202 slidably mounted on the base 101 in the horizontal direction; a voice coil motor 201 for pushing the push block 202 in the horizontal direction; a vertical push block 203 slidably mounted on the base 101 in the vertical direction and wedge-fitting with the push block 202; and a support column 304 mounted on the vertical push block 203. The base 101 may be provided with a vertical guide bar 204 to guide the sliding of the vertical push block 203.

[0079] Specifically, both push block 202 and vertical push block 203 are provided with inclined surfaces, thus forming a wedge engagement mechanism. Addressing the unavoidable issue of low motion accuracy in existing lifting components 200, this embodiment employs a macro-motion precision compensation drive strategy for the voice coil motor 201 to simultaneously meet the requirements of large stroke and high precision, while further regulating the motion accuracy output of the voice coil motor 201.

[0080] In one embodiment, a plurality of flexible leaf springs 103 are provided on the base 101; the first platform 102 is connected to the base 101 through the plurality of flexible leaf springs 103.

[0081] The flexible leaf springs 103 may include six; the flexible leaf springs 103 can increase the stability of the first platform 102.

[0082] In another embodiment, a turntable 400 is also included; the main body 100 of the device further includes a second platform 104; the turntable 400 is disposed on the base 101; the second platform 104 is disposed on the turntable 400; the turntable 400 is used to drive the second platform 104 to rotate; and multiple lifting components 200 are evenly distributed around the turntable 400 in a circle.

[0083] The base 101 may be provided with a sleeve 401; the turntable 400 is disposed inside the sleeve 401. The first platform 102 may be disposed on the outer periphery of the second platform 104, and the first platform 102 may be used to protect the display panel circuit; the second platform 104 may be used to place the chip.

[0084] In other embodiments, please refer to Figures 5 to 7 This embodiment also includes multiple micro-rotation components 500; all of the multiple micro-rotation components 500 are disposed on the second platform 104 and are evenly distributed around the rotation center circumference of the second platform 104; each micro-rotation component 500 includes: a driver 510, an isosceles trapezoidal rotation mechanism 520, and a parallel hybrid amplification mechanism 530; in the isosceles trapezoidal rotation mechanism 520, the intersection point of the extension lines of the two isosceles trapezoids is located at the rotation center of the second platform 104; the driver 510 is connected to the parallel hybrid amplification mechanism 530; the parallel hybrid amplification mechanism 530 is connected to the isosceles trapezoidal rotation mechanism 520, and the driver 510 is used to drive the parallel hybrid amplification mechanism 530 to deform, so that the parallel hybrid amplification mechanism 530 drives the isosceles trapezoidal rotation mechanism 520 to rotate. The micro-rotation component 500 may include three components.

[0085] Specifically, the driver 510 can drive the parallel hybrid amplification mechanism 530 to deform in the horizontal direction, thereby driving the isosceles trapezoidal rotating mechanism 520 to rotate around the rotation center of the second platform 104, thus achieving precise control of micro-rotation.

[0086] In this embodiment, the parallel hybrid amplification mechanism 530, as a hybrid amplification mechanism, can inherit the advantages of a general bridge mechanism, and also give full play to the advantages of a more compact design. It can even make the range of amplification ratio larger to facilitate the selection of values ​​in subsequent designs.

[0087] In a more specific embodiment, the isosceles trapezoidal rotation mechanism 520 includes two waist chains 521 and a bottom chain 522; one end of each waist chain 521 is hinged to the second platform 104, and the other end is hinged to one end of the bottom chain 522; the other end of the bottom chain 522 is hinged to the output end of the parallel hybrid amplification mechanism 530. The cooperation of multiple micro-motion rotation components 500 can reduce the occurrence of excessive force at a single point, average out the load, and achieve high-precision rotation around the Z-axis.

[0088] The entire isosceles trapezoidal rotating mechanism 520 has parallel upper and lower parts, and equal lengths on both sides. The entire mechanism has a perfectly symmetrical design with the center line bisecting the left and right sides. In terms of mechanism, the isosceles trapezoidal rotating mechanism 520 is a mechanism with a definite and unique instantaneous rotation center, which is located at the intersection of the extensions of the two sides. This ensures the accuracy of the rotation of the isosceles trapezoidal rotating mechanism 520.

[0089] Furthermore, the parallel hybrid amplification mechanism 530 includes: an output chain 531, two amplification chains 532, and multiple parallel chains 533; the two amplification chains 532 are spaced apart and one end is hinged to the second platform 104; one end of the output chain 531 is hinged to the other end of the bottom chain 522; the other end of the output chain 531 is located between the two amplification chains 532; multiple parallel chains 533 are respectively arranged on both sides of the other end of the output chain 531, and the multiple parallel chains 533 located on the same side are arranged parallel to each other; one end of the parallel chain 533 is hinged to the other end of the output chain 531, and the other end is hinged to the other end of the amplification chain 532; a driver 510 is arranged between the two amplification chains 532 for driving the amplification chains 532 to rotate.

[0090] Specifically, in this embodiment, the parallel chain 533 and the adjacent parallel chain 533 form a parallel quadrilateral parallel guide mechanism. Because its guiding function is still limited by its constraint end, it will produce corresponding parasitic motion error. However, by symmetrically arranging multiple parallel chains 533 at both ends of the output chain 531, the flexibility of both sides can be superimposed and the "pull back" motion generated by each other can cancel out the parasitic motion and achieve the function of precise guidance.

[0091] Furthermore, the waist chain 521 is hinged to the second platform 104 and the bottom chain 522 via a semi-circular notch hinge; the bottom chain 522 is hinged to the output end of the parallel hybrid amplification mechanism 530 via a semi-circular notch hinge.

[0092] Hinges used for connection generally include notched and spring types. Spring types have poor self-holding performance and may overturn or crush when the entire mechanism is subjected to a large Z-axis load. For notched types, the combined use of semi-circular hinges can provide greater Z-axis stiffness support to the mechanism. Moreover, semi-circular hinges are designed for rotation, and their axial drift and parasitic motion can be minimized when subjected to torsional torque, reducing the error generated in the final output of the mechanism. Therefore, in this solution, semi-circular notched hinges are selected as the connecting parts to reduce rotational errors.

[0093] The leveling and correction device for micro / nano bonding / assembly / processing provided in this application embodiment has Z-axis translational motion, deflection motion around X and Y, and multiple degrees of freedom of rotation around Z, which can achieve correction function with high rotational accuracy and large rotational stroke.

[0094] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although this application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A leveling and alignment device for micro / nano bonding / assembly / processing, characterized in that, include: The device consists of a main body (100), multiple lifting components (200), multiple centering components (300), a turntable (400), and multiple micro-rotation components (500). The main body (100) of the device includes: a base (101), a first platform (102) and a second platform (104); The centering components (300) are connected one-to-one with the lifting components (200); Multiple lifting components (200) are evenly distributed in a circle on the base (101) to drive the centering component (300) to rise and fall; The centering component (300) includes: a sphere (301), an upper support block (302), a lower support block (303), and two support columns (304). The two support columns (304) are spaced apart on the output end of the lifting assembly (200); The lower support block (303) is disposed between the two support columns (304), and the lower support block (303) is suspended in the air, with its two ends flexibly connected to the two support columns (304). The upper support block (302) is disposed above the lower support block (303) and forms a sliding cavity (305) between the upper support block (303). The sphere (301) is slidably disposed in the sliding cavity (305) in the horizontal direction; The upper support block (302) contacts the lower support block (303) through the sphere (301); The first platform (102) is fixedly connected to the upper support block (302) in each of the centering components (300); The turntable (400) is mounted on the base (101); The second platform (104) is disposed on the turntable (400); The turntable (400) is used to drive the second platform (104) to rotate; The plurality of lifting components (200) are evenly distributed in a circle around the turntable (400); Multiple micro-motion rotation components (500) are disposed on the second platform (104) and are evenly distributed around the rotation center circumference of the second platform (104); The micro-motion rotation assembly (500) includes: a driver (510), an isosceles trapezoidal rotation mechanism (520), and a parallel hybrid amplification mechanism (530). In the isosceles trapezoidal rotation mechanism (520), the intersection of the extensions of the legs of the two isosceles trapezoids is located at the rotation center of the second platform (104); The driver (510) is connected to the parallel hybrid amplifier mechanism (530); The parallel hybrid amplification mechanism (530) is connected to the isosceles trapezoidal rotating mechanism (520). The driver (510) is used to drive the parallel hybrid amplification mechanism (530) to deform, so that the parallel hybrid amplification mechanism (530) drives the isosceles trapezoidal rotating mechanism (520) to rotate.

2. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 1, characterized in that, The bottom of the upper support block (302) is provided with an upper V-shaped groove that opens downwards; The top of the lower support block (303) is provided with an upward-opening lower V-shaped groove; The lower V-groove and the upper V-groove together form the sliding cavity (305).

3. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 1, characterized in that, The lifting assembly (200) includes: a voice coil motor (201) and a pusher block (202); The voice coil motor (201) is mounted on the base (101) and connected to the support column (304) via the push block (202).

4. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 3, characterized in that, The lifting assembly (200) also includes: a vertical push block (203); The push block (202) is slidably disposed on the base (101) in the horizontal direction; The voice coil motor (201) is used to push the push block (202) in the horizontal direction; The vertical push block (203) is slidably disposed on the base (101) in the vertical direction and is wedge-fitted with the push block (202); The support column (304) is disposed on the vertical push block (203).

5. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 1, characterized in that, The base (101) is provided with a plurality of flexible leaf springs (103). The first platform (102) is connected to the base (101) via a plurality of the flexible leaf springs (103).

6. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 1, characterized in that, The isosceles trapezoidal rotating mechanism (520) includes two waist chains (521) and a bottom chain (522). One end of each of the two waist chains (521) is hinged to the second platform (104), and the other end is hinged to one end of the bottom chain (522); The other end of the bottom chain (522) is hinged to the output end of the parallel hybrid amplification mechanism (530).

7. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 6, characterized in that, The parallel hybrid amplification mechanism (530) includes: an output chain (531), two amplification chains (532) and multiple parallel chains (533). The two amplification chains (532) are spaced apart, and one end is hinged to the second platform (104). One end of the output chain (531) is hinged to the other end of the bottom chain (522); The other end of the output chain (531) is located between the two amplification chains (532); Multiple parallel chains (533) are respectively disposed on both sides of the other end of the output chain (531), and the multiple parallel chains (533) located on the same side are arranged parallel to each other; One end of the parallel chain (533) is hinged to the other end of the output chain (531), and the other end is hinged to the other end of the amplification chain (532); The driver (510) is disposed between the two amplifying chains (532) and is used to drive the amplifying chains (532) to rotate.

8. The leveling and alignment device for micro / nano bonding / assembly / processing according to claim 6, characterized in that, The waist chain (521) is hinged to the second platform (104) and the bottom chain (522) via a semi-circular notch hinge. The bottom chain (522) is hinged to the output end of the parallel hybrid amplification mechanism (530) via a semi-circular notch hinge.

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