A mold structure for press point gate encapsulation

Abstract

The application discloses a mold structure for a press point gate package, comprising an upper mold assembly, a lower mold assembly and a middle plate assembly; the upper mold assembly comprises an upper mold frame, an upper mold top plate, an upper mold support column, an upper mold needle plate and an upper mold cavity strip, an upper mold frame ejector pin, an upper mold product ejector pin and an upper mold reset rod are arranged on the upper mold needle plate, the middle plate assembly comprises a middle plate, middle plate locks are arranged on both sides of the middle plate, and the upper mold assembly and the middle plate assembly and the lower mold assembly and the middle plate assembly are locked; the lower mold assembly comprises a lower mold cavity strip base, a lower mold top plate and a lower mold needle plate, a lower mold frame ejector pin, a lower mold runner ejector pin and a lower mold reset rod are arranged on the lower mold needle plate, and a lower mold support column, a lower mold cavity strip and a barrel mounting base are arranged on the lower mold cavity strip base. The application greatly reduces product development and production costs, greatly improves product arrangement density, improves production efficiency, saves lead frame material and has no runner glue residue.

Description

Technical Field

[0001] This invention belongs to the field of packaging mold technology, specifically relating to a mold structure that can perform point gate packaging on the lower surface of a semiconductor using a common press. Background Technology

[0002] Currently, in the semiconductor manufacturing process, when the surface is sealed with adhesive, the method used is to use a special press machine for semiconductor packaging, along with a customized mold frame and mold, to inject adhesive from the top surface of the product.

[0003] The disadvantages of this glue injection method are as follows:

[0004] 1. Press equipment is specialized equipment that requires special customization. It cannot meet the needs of most semiconductor packaging products for side-mounting of adhesive, and it is expensive.

[0005] 2. Specialized mold frames and molds are more expensive than those commonly found on the market.

[0006] 3. The market share of specialized presses and mold frames is small, and their maintenance costs are high and their structures are complex. Summary of the Invention

[0007] The purpose of this invention is to provide a mold structure for sealing the gate of a press, so as to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a mold structure for sealing the gate of a press, comprising an upper mold assembly and a lower mold assembly, and further comprising an intermediate plate assembly located between the upper mold assembly and the lower mold assembly;

[0009] The upper mold assembly includes an upper mold frame, an upper mold top plate, an upper mold support column, an upper mold pin plate, and an upper mold cavity strip. The upper mold pin plate is equipped with an upper mold frame ejector pin, an upper mold product ejector pin, and an upper mold reset rod. The upper mold pin plate is fixedly connected to the upper mold top plate. A limit ring is fitted on the upper mold reset rod. The upper mold support column and the upper mold cavity strip are mounted on the upper mold cavity strip base. The upper mold frame ejector pin, the upper mold product ejector pin, and the upper mold reset rod pass through the upper mold cavity strip and the upper mold cavity strip base. The upper mold reset rod rests against an intermediate plate for demolding and reset. The upper mold support column passes through the upper mold pin plate and the upper mold top plate, and is supported on the upper mold frame. Simultaneously, the grooves on both sides of the upper mold frame clamp the upper mold cavity strip base.

[0010] The intermediate plate assembly includes an intermediate plate, and intermediate plate latches are installed on both sides of the intermediate plate to lock the upper mold assembly and the intermediate plate assembly, and the lower mold assembly and the intermediate plate assembly, through the intermediate plate latches.

[0011] The lower mold assembly includes a lower mold cavity strip base, a lower mold top plate, and a lower mold pin plate. A lower mold frame ejector pin, a lower mold runner ejector pin, and a lower mold reset rod are mounted on the lower mold pin plate. A lower mold support column, a lower mold cavity strip, and a barrel mounting seat are mounted on the lower mold cavity strip base. A barrel is mounted on the barrel mounting seat. The barrel passes through the lower mold cavity strip base, the lower mold pin plate, and the lower mold top plate, and slides in cooperation with the injection head assembly. The lower mold frame ejector pin, the lower mold runner ejector pin, and the lower mold reset rod pass through the lower mold cavity strip and the lower mold cavity strip base. The lower mold reset rod passes through the intermediate plate and rests on the upper mold cavity strip for demolding and auxiliary reset. The lower mold support column is mounted on the lower mold cavity strip base and passes through the lower mold pin plate and the lower mold top plate, supporting the lower mold frame. Simultaneously, the grooves on both sides of the lower mold frame clamp the lower mold cavity strip base.

[0012] Preferably, rotatable upper mold claws and lower mold claws are respectively installed on both sides of the upper mold frame and the lower mold frame.

[0013] Preferably, the upper mold assembly, the middle assembly, and the lower mold assembly are engaged and locked together by the upper mold claw, the middle plate latch, and the lower mold claw.

[0014] The technical effects and advantages of this invention are as follows:

[0015] 1. This mold structure can be used with common MGP presses and mold frames on the market, eliminating the need to purchase new dedicated presses and mold frames or modify existing presses and mold frames, thus significantly reducing the cost of new product development and mass production.

[0016] 2. By adopting this device, automatic production can also be achieved by simply adding a pneumatic or electric locking mechanism to the mold frame of the automatic packaging equipment.

[0017] 3. This solution addresses the problem that existing methods can only inject adhesive from the top surface of the product, which can lead to issues such as air bubbles and bent gold wires when injecting adhesive from the top surface of some special structural products. This structure injects adhesive from the bottom surface of the product, thus supplementing the existing adhesive injection methods.

[0018] 4. There is no need to reserve space for flow channels on the lead frame, which greatly increases the density of product layout, improves production efficiency and saves lead frame materials;

[0019] 5. The mold automatically disconnects the gate when it opens, so there is no need to add a special desizing process in the subsequent process. Also, since the runner and the frame do not come into contact, there will be no problem of glue residue on the frame from the runner. Attached Figure Description

[0020] Figure 1 This is an initial state diagram of the present invention;

[0021] Figure 2This is a diagram showing the mold opening state (upper hook claw) of the present invention;

[0022] Figure 3 This is a diagram showing the placement frame of the present invention;

[0023] Figure 4 This is a diagram showing the mold closing state of the present invention;

[0024] Figure 5 This is a diagram showing the switching claw state of the present invention;

[0025] Figure 6 This is a diagram showing the mold opening state (lower hook claw) of the present invention;

[0026] Figure 7 This is a diagram showing the state of the resin placed according to the present invention;

[0027] Figure 8 This is a diagram showing the mold-closed state after the resin has been placed according to the present invention.

[0028] Figure 9 This is a diagram showing the state at which the adhesive is being applied during the initial injection process of this invention.

[0029] Figure 10 This is a diagram showing the state of the invention after the glue injection is completed;

[0030] Figure 11 This is a diagram showing the mold opening state after the glue injection is completed according to the present invention;

[0031] Figure 12 This is a diagram showing the flow channel ejection state of the present invention;

[0032] Figure 13 This is a diagram showing the flow channel removal state of the present invention;

[0033] Figure 14 This is a diagram showing the state of the cleaned mold surface according to the present invention;

[0034] Figure 15-16 This is a diagram of the mold closing process of the present invention;

[0035] Figure 17 This is a schematic diagram of the switching hook claw of the present invention;

[0036] Figure 18 This is a diagram showing the mold opening state (upper hook claw) of the present invention;

[0037] Figure 19 This is a schematic diagram of the top of the framework of the present invention;

[0038] Figure 20 This is a schematic diagram of the framework of the present invention.

[0039] Figure 21 This is a diagram showing the state of the cleaned mold surface according to the present invention;

[0040] Figure 22This is a diagram showing the state of the present invention before use.

[0041] In the diagram: 1 Upper mold frame, 2 Upper mold top plate, 3 Upper mold frame ejector pin, 4 Upper mold product ejector pin, 5 Upper mold support column, 6 Upper mold pin plate, 7 Upper mold cavity strip, 8 Intermediate plate, 9 Upper mold cavity strip base, 10 Limiting ring, 11 Upper mold reset rod, 12 Intermediate plate latch, 13 Upper mold hook, 14 Lower mold hook, 15 Lower mold cavity strip base, 16 Lower mold frame, 17 Lower mold reset rod, 18 Lower mold top plate, 19 Lower mold support column, 20 Lower mold pin plate, 21 Barrel, 22 Injection head assembly, 23 Barrel mounting base, 24 Lower mold cavity strip, 25 Lower mold frame ejector pin, 26 Lower mold runner ejector pin. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] like Figure 1-22 This invention illustrates a specific embodiment of a mold structure for sealing press gates: it includes an upper mold assembly and a lower mold assembly, and also includes an intermediate plate assembly located between the upper mold assembly and the lower mold assembly;

[0044] The upper mold assembly includes an upper mold frame 1, an upper mold top plate 2, an upper mold support column 5, an upper mold pin plate 6, and an upper mold cavity strip 7. The upper mold pin plate 6 is equipped with an upper mold frame ejector pin 3, an upper mold product ejector pin 4, and an upper mold reset rod 11. The upper mold pin plate 6 is fixedly connected to the upper mold top plate 2. A limit ring 10 is fitted on the upper mold reset rod 11. The upper mold support column 5 and the upper mold cavity strip 7 are mounted on an upper mold cavity strip base 9. The upper mold frame ejector pin 3, the upper mold product ejector pin 4, and the upper mold reset rod 11 pass through the upper mold cavity strip 7 and the upper mold cavity strip base 9. The upper mold reset rod 11 rests against an intermediate plate 8 for demolding and reset. The upper mold support column 5 passes through the upper mold pin plate 6 and the upper mold top plate 2 and is supported on the upper mold frame 1. Simultaneously, the grooves on both sides of the upper mold frame 1 clamp the upper mold cavity strip base 9.

[0045] The intermediate plate assembly includes an intermediate plate 8, with intermediate plate latches 12 installed on both sides of the intermediate plate 8. Rotatable upper mold claws 13 and lower mold claws 14 are respectively installed on both sides of the upper mold frame 1 and the lower mold frame 16. The upper mold assembly, the intermediate assembly, and the lower mold assembly are fastened and locked together by the upper mold claws 13, the intermediate plate latches 12, and the lower mold claws 14.

[0046] The lower mold assembly includes a lower mold cavity strip base 15, a lower mold top plate 18, and a lower mold pin plate 20. A lower mold frame ejector pin 25, a lower mold flow channel ejector pin 26, and a lower mold reset rod 17 are mounted on the lower mold pin plate 20. A lower mold support column 19, a lower mold cavity strip 24, and a barrel mounting base 23 are mounted on the lower mold cavity strip base 15. A barrel 21 is mounted on the barrel mounting base 23. The barrel passes through the lower mold cavity strip base 15, the lower mold pin plate 20, and the lower mold top plate 18, and connects with the injection head assembly. The components 22 slide together. The lower mold frame ejector pin 25, the lower mold flow channel ejector pin 26, and the lower mold reset rod 17 pass through the lower mold cavity strip 24 and the lower mold cavity strip base 15. The lower mold reset rod 17 passes through the intermediate plate 8 and rests on the upper mold cavity strip 7 for demolding and auxiliary reset. The lower mold support column 19 is installed on the lower mold cavity strip base 15 and passes through the lower mold pin plate 20 and the lower mold top plate 18, and is supported on the lower mold frame 16. At the same time, the grooves on both sides of the lower mold frame 16 clamp the lower mold cavity strip base 15.

[0047] The usage process of this structure is as follows:

[0048] 1. Initial state (e.g.) Figure 1 As shown): The lower mold hook 14 is engaged and locked with the middle plate latch 12, while the upper mold hook 13 is disengaged, thus fixing the middle plate 8 to the lower mold of the mold.

[0049] 2. Mold making (e.g.) Figure 2 As shown): The lower mold base 16 moves downward, driving the lower mold and the intermediate plate 8 of the mold to move downward synchronously; the upper mold base 1 has a spring that presses down on the upper mold top plate 2, causing the upper mold pin plate 6 and the upper mold top plate 2 to drive the upper mold frame ejector pin 3, the upper mold product ejector pin 4 and the upper mold reset rod 11 to be ejected synchronously until the upper mold pin plate 6 is restricted by the limit ring 10 and stops.

[0050] 3. Place the frame (e.g.) Figure 3 (As shown): The frame is placed on the surface of the middle plate 8 by a manual or automatic mechanism;

[0051] 4. Mold closing (e.g.) Figure 4 As shown): The lower mold base 16 moves upward, driving the lower mold and the intermediate plate 8 of the mold to move upward synchronously; the upper mold reset rod 11 presses against the intermediate plate 8, overcoming the spring force in the upper mold base 1, so that the upper mold pin plate 6 and the upper mold top plate 2 drive the upper mold frame ejector pin 3 and the upper mold product ejector pin 4 to retract synchronously until the mold closing is completed and stops.

[0052] 5. Switch the hook (e.g.) Figure 5 (As shown): The lower mold hook 14 switches to the disengaged state, and the upper mold hook 13 is engaged with and locked to the middle plate latch 12, so that the middle plate 8 is fixed to the upper mold of the mold.

[0053] 6. Mold making (e.g.) Figure 6As shown): The lower mold base 16 moves downward, driving the lower mold of the mold to move downward synchronously;

[0054] 7. Place resin (e.g.) Figure 7 (As shown): The resin is placed into the barrel 21 by a manual or automatic mechanism;

[0055] 8. Mold closing (e.g.) Figure 8 As shown): The lower mold base 16 moves upward, driving the lower mold of the mold to move upward synchronously until the mold closing is completed and then stops;

[0056] 9. Begin applying adhesive (e.g.) Figure 9 As shown): The resin melts when heated, and the injection head assembly 22 moves upward under the push of the injection mechanism to inject the resin;

[0057] 10. Complete the glue injection (e.g.) Figure 10 As shown): The injection head assembly 22 moves upward under the push of the injection mechanism until all cavities are completely filled; the resin begins to cure, and the injection head assembly 22 continues to apply pressure to the resin to maintain pressure until the resin is completely cured;

[0058] 11. Mold making (e.g.) Figure 11 As shown): The lower mold base 16 moves downward, driving the lower mold of the mold to move downward synchronously; the ejector pin 26 of the lower mold runner has a barbed structure, which will be filled with resin and then interlock with it, so that the runner and the ejector pin 26 of the lower mold runner are tightly attached and will not separate; after the mold is opened, the runner separates from the intermediate plate 8 and the gate is pulled off.

[0059] 12. Flow channel ejection (e.g.) Figure 12 As shown): The lower mold frame 16 continues to descend, driving the lower mold cavity strip 24 to continue descending; a fixed ejector rod on the equipment holds the lower mold top plate 18, causing the lower mold frame ejector pin 25, the lower mold flow channel ejector pin 26, and the lower mold reset rod 17 to stop relative to the equipment. At this time, the lower mold cavity strip 24 and the lower mold flow channel ejector pin 26 move relative to each other, pushing the flow channel out and separating it from the lower mold cavity strip 24;

[0060] 13. Remove the flow channel (e.g.) Figure 13 (As shown): The runner is removed from the lower mold using a manual or automatic mechanism;

[0061] 14. Clean the mold surface (e.g.) Figure 14 (As shown): Use special tools to clean the upper and lower surfaces of the mold;

[0062] 15. Begin mold closing (e.g.) Figure 15 As shown): The lower mold frame 16 moves upward, and the mold begins to perform the reverse action of ejecting the runner until the lower mold frame ejector pin 25, the lower mold runner ejector pin 26 and the lower mold reset rod 17 are reset.

[0063] 16. Continue mold closing (e.g.) Figure 16As shown): The lower mold frame 16 continues to move upward, and the fixed push rod on the equipment separates from the lower mold top plate 18. The lower mold top plate 18 and other lower mold components move upward with the lower mold frame 16 until the mold closing is completed.

[0064] 17. Switch the hook (e.g.) Figure 17 As shown): The upper mold claw 13 switches to the disengaged state, and the lower mold claw 14 engages with and locks the middle plate latch 12, so that the middle plate 8 is fixed to the lower mold of the mold.

[0065] 18. Mold making (e.g.) Figure 18 As shown): The lower mold base 16 moves downward, driving the lower mold and intermediate plate 8 of the mold to move downward synchronously; the upper mold base 1 has a spring that presses down on the upper mold top plate 2, causing the upper mold pin plate 6 and the upper mold top plate 2 to drive the upper mold frame ejector pin 3, the upper mold product ejector pin 4 and the upper mold reset rod 11 to be ejected synchronously. The upper mold frame ejector pin 3 and the upper mold product ejector pin 4 eject the already packaged frame to separate it from the upper mold of the mold, until the upper mold pin plate 6 is restricted by the limiting ring 10 and stops; the lower mold base 16 continues to move downward, causing the upper mold product ejector pin 4 to separate from the product;

[0066] 19. Frame protrusion (e.g.) Figure 19 As shown): The lower mold frame 16 continues to descend, driving the intermediate plate 8 to continue descending; there is a fixed ejector rod on the equipment to hold the lower mold top plate 18, so that the lower mold frame ejector pin 25, the lower mold flow channel ejector pin 26 and the lower mold reset rod 17 and other relative equipment stop moving. At this time, the intermediate plate 8 and the lower mold frame ejector pin 25 move relative to each other, pushing the encapsulated frame out and separating it relative to the intermediate plate 8.

[0067] 20. Remove the frame (e.g.) Figure 20 (As shown): The encapsulated frame is removed from the lower mold using a manual or automatic mechanism;

[0068] 21. Clean the mold surface (e.g.) Figure 21 (As shown): Use special tools to clean the upper and lower surfaces of the mold;

[0069] 22. Proceed to the next production cycle (e.g.) Figure 22 As shown): The lower mold base 16 moves upward, and the mold begins to perform the reverse action of ejecting the frame until the lower mold frame ejector pin 25, the lower mold flow channel ejector pin 26 and the lower mold reset rod 17 are reset. The lower mold base 16 stops moving upward and waits for the frame to be placed before entering the next production cycle.

[0070] The applicant further declares that while the above embodiments illustrate the implementation method and apparatus structure of the present invention, the present invention is not limited to the above-described embodiments, meaning that the present invention must rely on the above methods and structures to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions for the selected implementation methods, additions to steps, and selections of specific methods all fall within the protection and disclosure scope of the present invention.

[0071] This invention is not limited to the above-described embodiments. All methods that employ similar structures and approaches to achieve the objectives of this invention are within the scope of protection of this invention.

Claims

1. A mold structure for sealing a press gate, comprising an upper mold assembly and a lower mold assembly, characterized in that: It also includes the intermediate plate assembly located between the upper mold assembly and the lower mold assembly; The upper mold assembly includes an upper mold frame (1), an upper mold top plate (2), an upper mold support column (5), an upper mold pin plate (6), and an upper mold cavity strip (7). The upper mold pin plate (6) is equipped with an upper mold frame ejector pin (3), an upper mold product ejector pin (4), and an upper mold reset rod (11). The upper mold pin plate (6) is fixedly connected to the upper mold top plate (2). A limit ring (10) is fitted on the upper mold reset rod (11). The upper mold support column (5) and the upper mold cavity strip (7) are installed... Upper mold cavity strip base (9); the upper mold frame ejector pin (3), upper mold product ejector pin (4) and upper mold reset rod (11) pass through the upper mold cavity strip (7) and the upper mold cavity strip base (9), the upper mold reset rod (11) rests on the intermediate plate (8) for demolding and reset; the upper mold support column (5) passes through the upper mold pin plate (6) and the upper mold top plate (2) and is supported on the upper mold frame (1), while the grooves on both sides of the upper mold frame (1) clamp the upper mold cavity strip base (9); The intermediate plate assembly includes an intermediate plate (8), and intermediate plate latches (12) are installed on both sides of the intermediate plate (8) to lock the upper mold assembly and the intermediate plate assembly, and the lower mold assembly and the intermediate plate assembly, through the intermediate plate latches (12). The lower mold assembly includes a lower mold cavity strip base (15), a lower mold top plate (18), and a lower mold pin plate (20). A lower mold frame ejector pin (25), a lower mold flow channel ejector pin (26), and a lower mold reset rod (17) are mounted on the lower mold pin plate (20). A lower mold support column (19), a lower mold cavity strip (24), and a barrel mounting seat (23) are mounted on the lower mold cavity strip base (15). A barrel (21) is mounted on the barrel mounting seat (23). The barrel passes through the lower mold cavity strip base (15), the lower mold pin plate (20), and the lower mold top plate (18), and connects with the injection head assembly. (22) The lower mold frame ejector pin (25), the lower mold flow channel ejector pin (26) and the lower mold reset rod (17) pass through the lower mold cavity strip (24) and the lower mold cavity strip base (15). The lower mold reset rod (17) passes through the intermediate plate (8) and rests on the upper mold cavity strip (7) for demolding and auxiliary reset. The lower mold support column (19) is installed on the lower mold cavity strip base (15) and passes through the lower mold pin plate (20) and the lower mold top plate (18) and is supported on the lower mold frame (16). At the same time, the grooves on both sides of the lower mold frame (16) clamp the lower mold cavity strip base (15). Rotatable upper mold claw (13) and lower mold claw (14) are respectively installed on both sides of the upper mold frame (1) and the lower mold frame (16). The upper mold assembly, the middle assembly, and the lower mold assembly are fastened and locked together by the upper mold claw (13), the middle plate latch (12), and the lower mold claw (14).

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