一种检测系统及方法
By combining multiple light processing units and image acquisition devices of detection light and image acquisition equipment, the problem of rapid and accurate detection of internal defects in semiconductor material rods is solved, achieving automated and high-precision detection results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 南京注势智能科技有限公司
- Filing Date
- 2023-08-31
- Publication Date
- 2026-07-17
AI Technical Summary
Existing semiconductor material rod inspection technologies are difficult to quickly and accurately detect internal defects such as twins, dislocations, and cracks, resulting in a complex inspection process and a high false alarm rate, which affects device reliability and lifespan.
By employing a combination of various detection light and image acquisition devices, and through first and second detection light processing units and first and second image acquisition devices, rapid and accurate detection of internal defects in semiconductor materials can be achieved. This includes light processing using polarizers or polarizing beam splitters, and image acquisition using an indium gallium arsenide camera.
It enables rapid, convenient, and accurate detection of internal defects in semiconductor materials, can automate manual inspection, adapts to materials with different outer contours and diameters, and improves detection accuracy.
Smart Images
Figure CN117269050B_ABST