A label management method for LED chip sorting

Abstract

The application discloses a label management method for LED chip sorting, and relates to the technical field of LED chip sorting, and comprises the following steps: removing unqualified LED chips to obtain selected mother chips, and generating a mother label; pasting a blank blue film on a bearing plate with a fixed label to obtain a blank subplate, and the surface of the fixed label is provided with a protective layer; dividing the selected mother chips into a plurality of blank subplates to obtain a plurality of first subchips, and generating a plurality of sublabels; printing the plurality of sublabels and pasting them on the corresponding first subchips one by one to obtain second subchips; associating the sublabel on each second subchip with the fixed label through an MES system; removing the sublabel on each second subchip to obtain third subchips. The sublabel on the subchips is associated with the fixed label, the surface of the fixed label is provided with a protective layer, and the subchips are sorted by using the fixed label, so that the information loss of the subchips can be effectively prevented, and the normal sorting of the subchips is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of LED chip sorting technology, and more specifically to a method for LED chip sorting and label management. Background Technology

[0002] LED chips are typically sorted in two ways: full sorting and partial sorting. Partial sorting is also known as reverse gripping sorting.

[0003] When customer requirements for LED chips are relatively simple, there will be fewer LED chips on the original master wafer that do not meet the customer's requirements. In this case, a reverse sorting method is usually used, which simply involves sorting out and removing the LED chips that do not meet the customer's requirements from the original master wafer. Since the original master wafer is relatively large, it is necessary to divide the original master wafer, after removing the LED chips that do not meet the customer's requirements, into several smaller sub-wafers to facilitate subsequent wafer fabrication (wafer fabrication refers to the transfer of sub-wafers to the next process) and processing. To facilitate information transmission, workers will attach sub-labels to the sub-wafers (the sub-labels are disposable and need to be removed before warehousing) to record and transmit relevant information. However, these sub-labels are at risk of falling off or being damaged, i.e., there is a risk of losing sub-wafer information, which will affect the subsequent wafer fabrication of the sub-wafers. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a method for managing LED chip selection tags. By associating sub-tags on sub-chips with fixed tags, and providing a protective layer on the surface of the fixed tags, the chip fabrication process can effectively prevent the loss of information from sub-chips and ensure the normal fabrication of sub-chips.

[0005] This invention provides a method for managing LED chip selection tags, comprising the following steps:

[0006] A. Place the original master chip with the original label into a sorting machine to remove unqualified LED chips and obtain a selected master chip. Generate a master label based on the original label. The master label contains the photoelectric parameters and original coordinate data of each LED chip on the selected master chip.

[0007] B. A blank blue film is pasted onto a carrier plate with a fixed label to obtain a blank sub-board; wherein, the surface of the fixed label is provided with a protective layer;

[0008] C. The LED chips on the selected master wafer are distributed onto several blank sub-boards by a film casting process to obtain several first sub-wafers; and several sub-labels are generated based on the master label.

[0009] D. Print out the aforementioned sub-labels and paste them one by one onto the corresponding first sub-piece to obtain the second sub-piece;

[0010] E. Associate the sub-tags and fixed tags on each of the second sub-pieces using the MES system;

[0011] F. Remove the sub-labels on each of the second sub-pieces to obtain the third sub-piece.

[0012] Specifically, the original label contains information about the type, size, and unique code of the original master film.

[0013] Specifically, the fixed label is a 1- to 7-digit barcode.

[0014] Specifically, the label paper used for the fixed label is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper.

[0015] Specifically, the protective layer is a transparent tape, the area of ​​which is larger than the area of ​​the fixing label; or the protective layer is a transparent resin layer, the area of ​​which is larger than the area of ​​the fixing label.

[0016] Specifically, generating several child tags based on the parent tag includes:

[0017] Add 1 to 4 natural numbers after the code of the parent tag to generate several child tags in sequence.

[0018] Specifically, the label paper used for the sub-label is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper.

[0019] Specifically, the bearing plate is a square stainless steel plate, and the middle area of ​​the square stainless steel plate is hollowed out to form a bearing area.

[0020] Specifically, in step C, the LED chips on the selected master wafer are distributed to 2 to 4 blank daughter boards.

[0021] Specifically, in step E, a first list is established based on the information of the sub-tags, a second list is established based on the information of the fixed tags, and the information of the sub-tags and fixed tags on the same second sub-piece are associated based on the first list and the second list.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] The LED chip sorting and label management method provided by this invention involves placing original master wafers with original labels into a sorting machine to remove unqualified LED chips, obtaining selected master wafers, and generating master labels based on the original labels. Blank blue films are pasted onto a carrier plate with fixed labels to obtain blank sub-boards. When the selected master wafers are sorted onto several blank sub-boards, each first sub-board obtained has a fixed label. In addition, several sub-labels are generated based on the master label, and these sub-labels are printed out and pasted onto the corresponding first sub-boards, resulting in each second sub-board having both a fixed label and a sub-label. Then, the sub-labels and fixed labels on the same sub-board are associated through the MES system, binding the information of the sub-labels to the fixed labels. After removing the sub-labels, the fixed labels on each third sub-board obtained are associated with the information of the sub-labels. The sub-labels are then continued from the master label, making the information chain complete and traceable. The fixed labels are fixed to the carrier plate, and their surfaces are provided with a protective layer, making them less prone to falling off or being damaged. The use of fixed labels in subsequent wafer fabrication effectively prevents the loss of sub-board information and ensures the normal transfer of sub-boards between processes. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a flowchart of the LED chip selection and label management method in an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the support plate in an embodiment of the present invention. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Figure 1 The flowchart of the LED chip sorting and tag management method in an embodiment of the present invention is shown, including the following steps:

[0029] S1. Remove defective LED chips and generate a master label;

[0030] The original master wafers with their original labels are placed into a sorting machine to remove unqualified LED chips, resulting in selected master wafers. Unqualified LED chips refer to those that do not meet customer requirements, typically including LED chips with unacceptable photoelectric parameters, abnormal photoelectric parameters, or appearance defects. When the customer's requirements for LED chips are relatively simple, there will be fewer unqualified LED chips on the original master wafers. By using the method of removing unqualified LED chips (i.e., reverse grab sorting), the workload will be less and the sorting efficiency will be higher.

[0031] A master label is generated based on the original label. The master label contains the photoelectric parameters and original coordinate data of each LED chip on the selected master chip. That is, the master label is generated by associating the original label with the photoelectric parameters and original coordinate data of each LED chip on the selected master chip. The original label contains the type information, size information and unique code of the original master chip, and is then associated with the photoelectric parameters and original coordinate data of each LED chip on the selected master chip, which ensures the integrity of the information and facilitates information transmission and traceability.

[0032] S2. Prepare blank sub-boards with fixed labels;

[0033] Figure 2 A schematic diagram of the structure of the support plate in an embodiment of the present invention is shown.

[0034] A blank blue film is pasted onto the carrier plate 1 with the fixed label 3 to obtain a blank sub-plate.

[0035] Blank blue film refers to blue film without LED chips attached. Blue film, also known as electronic grade tape, is a blue film with constant adhesion. It can stick LED chips to the film, ensuring that the LED chips will not shift or fall off during normal transportation.

[0036] Blank blue film is pasted on the lower surface of the carrier plate 1. The carrier plate 1 is a square stainless steel plate. The middle area of ​​the square stainless steel plate is hollowed out to form a carrier area 2. The blue film located in the carrier area 2 can maintain a certain degree of tension and elasticity for pasting LED chips. This facilitates the subsequent casting process to support the LED chips from the selected master wafer without crushing the LED chips. Specifically, the square stainless steel plate has a size of 205*205mm and a thickness of 1.5mm. It is relatively thin and light, which is convenient for wafer fabrication.

[0037] The fixed tag 3 is fixed to the upper surface of the carrier plate 1, so that it will not be covered by the blue film and will not affect the reading of the fixed tag 3. The fixed tag 3 is a unique identifier of the carrier plate 1, with no duplicate codes, and can be used to effectively distinguish each carrier plate 1. Specifically, the fixed tag 3 is fixed to one side of the carrier plate 1, and the fixed tag 3 is centered. The surface of the fixed tag 3 is provided with a protective layer, which can prevent the fixed tag 3 from being damaged and enhance the firmness of the fixed tag 3, thereby effectively preventing information loss.

[0038] Specifically, the fixed label is a 1- to 7-digit barcode, which is easy for machines to recognize. Moreover, the large number of codes prevents repeated use and ensures that each blank sub-board has a unique identifier.

[0039] Furthermore, the label paper used for the fixed label is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper, which is conducive to clear and firm printed barcodes. Moreover, the plastic label paper has the advantages of being oil-proof, waterproof, tear-resistant, clear printing, and long-lasting, which helps to extend the service life of the fixed label. Self-adhesive label paper, also known as self-adhesive label paper, has an adhesive coating on the back, and the fixed labels made from it can be easily pasted onto the carrier plate.

[0040] In some specific embodiments, the protective layer is transparent tape, the area of ​​which is larger than the area of ​​the fixing label. Transparent tape is convenient to use, simple to operate, and low in cost, without affecting the clarity of the fixing label. It also enhances the scratch resistance and firmness of the fixing label, effectively preventing information loss. Specifically, the thickness of the transparent tape is 0.4–0.6 mm.

[0041] Furthermore, even if the fixing label is damaged, replacement is very convenient. Simply tear off the damaged transparent tape and fixing label, replace and paste a new fixing label, and then stick the transparent tape on the surface.

[0042] In some specific embodiments, the protective layer is a transparent resin layer, the area of ​​which is larger than the area of ​​the fixing label. The transparent resin layer enhances the scratch resistance and durability of the fixing label, thereby effectively preventing information loss. Specifically, the thickness of the transparent resin layer is 0.5–1.0 mm.

[0043] In some specific embodiments, the fixed label is a barcode laser-printed on a square stainless steel plate, which is more secure and reliable.

[0044] S3. Split the film into pieces and generate sub-tags;

[0045] The LED chips on the selected master wafer are transferred to several blank daughter boards by a film casting process to obtain several first daughter wafers. Film casting is usually done manually. The LED chips on the selected master wafer are divided into several regions, the selected master wafer is flipped, and the LED chips are transferred to the blue film of the blank daughter board according to the regions, thereby obtaining several first daughter wafers.

[0046] Specifically, the LED chips on the selected master wafer are distributed to 2 to 4 blank daughter boards. Preferably, the LED chips on the selected master wafer are distributed to 3 blank daughter boards. This way, the number of LED chips on the first daughter board will not be too large, which is convenient for subsequent film expansion and processing. Moreover, this method has a high cost-performance ratio and can save the cost of using blue film.

[0047] Simultaneously, several sub-labels are generated based on the parent label, ensuring the integrity of the information chain and facilitating information transmission and traceability. Specifically, several sub-labels are generated sequentially by adding 1 to 4 natural numbers after the code of the parent label. For example, if the code of the parent label is A, then the codes of the sub-labels are A01, A02, A03, etc., which is simple, clear, easy to understand, and convenient for traceability.

[0048] In addition, sub-labels also contain information such as date and batch number to distinguish them and facilitate management.

[0049] S4. Print and paste the sub-labels;

[0050] Print out the sub-labels and paste them one by one onto the corresponding first sub-piece to obtain the second sub-piece. Each second sub-piece obtained at this time has a fixed label and sub-labels.

[0051] Specifically, the label paper used for the sub-labels is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper. These are all plastic label papers that are oil-proof, waterproof, tear-resistant, and have clear printing. The resulting sub-labels have good clarity, making it easy to read the information on the sub-labels. Moreover, self-adhesive label paper is easy to stick, and combined with the tear-resistant plastic material, it is also easy to peel off later.

[0052] Furthermore, the printed sub-label is pasted on the first sub-piece at the end furthest from the fixed label. This prevents the sub-label from being too close to the fixed label, making it less prone to errors when reading the label.

[0053] S5. Associate sub-tags and fixed tags, and bind information;

[0054] The MES system associates the sub-tags on each of the second sub-pieces with fixed tags, binding the information of the sub-tags to the fixed tags. By reading the fixed tags, the complete sub-tag information can be obtained.

[0055] MES, or Manufacturing Execution System, is a complete production information system that starts with low-level data acquisition, moves to process monitoring and online management, and manages cost-related data. Using the MES system, sub-tags and fixed tags on the same component are associated, incorporating the component's information into the MES system for easy and efficient information traceability and management.

[0056] Specifically, in the MES system, a first list is established based on the information of the sub-tags, and a second list is established based on the information of the fixed tags. Based on the first list and the second list, the information of the sub-tags and fixed tags on the same second sub-piece are associated. The logic is simple and not prone to errors.

[0057] S6. Remove child tags;

[0058] The sub-labels on each of the second sub-pieces are removed to obtain the third sub-piece. The fixed label on each of the obtained third sub-pieces is associated with the information of the sub-label. The sub-label is in turn connected to the parent label, so the information chain is complete and traceable. The fixed label is fixed to the carrier plate and its surface is provided with a protective layer, so it is not easy to fall off or be damaged. The use of the fixed label for subsequent wafer fabrication can effectively prevent the loss of information of the sub-piece and ensure the normal transfer of the sub-piece between processes.

[0059] The LED chip sorting and label management method provided by this invention involves placing original master wafers with original labels into a sorting machine to remove unqualified LED chips, obtaining selected master wafers, and generating master labels based on the original labels. Blank blue films are pasted onto a carrier plate with fixed labels to obtain blank sub-boards. When the selected master wafers are sorted onto several blank sub-boards, each first sub-board obtained has a fixed label. In addition, several sub-labels are generated based on the master label, and these sub-labels are printed out and pasted onto the corresponding first sub-boards, resulting in each second sub-board having both a fixed label and a sub-label. Then, the sub-labels and fixed labels on the same sub-board are associated through the MES system, binding the information of the sub-labels to the fixed labels. After removing the sub-labels, the fixed labels on each third sub-board obtained are associated with the information of the sub-labels. The sub-labels are then continued from the master label, making the information chain complete and traceable. The fixed labels are fixed to the carrier plate, and their surfaces are provided with a protective layer, making them less prone to falling off or being damaged. The use of fixed labels in subsequent wafer fabrication effectively prevents the loss of sub-board information and ensures the normal transfer of sub-boards between processes.

[0060] Furthermore, the LED chip sorting and tag management method of the present invention is simple, efficient, and can effectively save management costs.

[0061] The above provides a detailed description of an LED chip sorting and label management method provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for managing LED chip selection tags, characterized in that, Includes the following steps: A. Place the original master chip with the original label into a sorting machine to remove unqualified LED chips and obtain a selected master chip. Generate a master label based on the original label. The master label contains the photoelectric parameters and original coordinate data of each LED chip on the selected master chip. B. A blank blue film is pasted onto a carrier plate with a fixed label to obtain a blank sub-board; wherein, the surface of the fixed label is provided with a protective layer; C. The LED chips on the selected master wafer are distributed onto several blank sub-boards by a film casting process to obtain several first sub-wafers; and several sub-labels are generated based on the master label. D. Print out the aforementioned sub-labels and paste them one by one onto the corresponding first sub-piece to obtain the second sub-piece; E. Associate the sub-tags and fixed tags on each of the second sub-pieces using the MES system; F. Remove the sub-labels on each of the second sub-pieces to obtain the third sub-piece.

2. The LED chip sorting and tagging management method as described in claim 1, characterized in that, The original label contains information about the type, size, and unique code of the original master film.

3. The LED chip sorting and labeling management method as described in claim 1, characterized in that, The fixed label is a 1- to 7-digit barcode.

4. The LED chip sorting and labeling management method as described in claim 3, characterized in that, The label paper used for the fixed label is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper.

5. The LED chip sorting and labeling management method as described in claim 1, characterized in that, The protective layer is a transparent tape, the area of ​​which is larger than the area of ​​the fixing label; or the protective layer is a transparent resin layer, the area of ​​which is larger than the area of ​​the fixing label.

6. The LED chip sorting and labeling management method as described in claim 1, characterized in that, The generation of several child tags based on the parent tag includes: Add 1 to 4 natural numbers after the code of the parent tag to generate several child tags in sequence.

7. The LED chip sorting and labeling management method as described in claim 6, characterized in that, The label paper used for the sub-labels is polyvinyl chloride self-adhesive label paper, or polyester self-adhesive label paper, or polypropylene self-adhesive label paper.

8. The LED chip sorting and labeling management method as described in claim 1, characterized in that, The support plate is a square stainless steel plate, and the middle area of ​​the square stainless steel plate is hollowed out to form a support area.

9. The LED chip sorting and labeling management method as described in claim 1, characterized in that, In step C, the LED chips on the selected master wafer are distributed to 2 to 4 blank daughter boards.

10. The LED chip sorting and labeling management method as described in claim 1, characterized in that, In step E, a first list is established based on the information of the sub-tags, a second list is established based on the information of the fixed tags, and the information of the sub-tags and fixed tags on the same second sub-piece are associated based on the first list and the second list.

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