Full-automatic bonding machine for semiconductor production

Abstract

The application provides a full-automatic bonding machine for semiconductor production, which comprises a conveying table, a storage cylinder and a telescopic motor arranged in sequence along the conveying direction of the conveying table, the storage cylinder is fixedly installed on the top of the conveying table and a plurality of packaging boards are stacked in the storage cylinder, the telescopic motor is arranged directly above the conveying table, the output shaft of the telescopic motor is vertically downward, the end of the output shaft is fixedly installed with an elastic component, the bottom of the elastic component is provided with a three-axis mover, and the three-axis mover is assembled with a bonding head. The full-automatic bonding machine for semiconductor production provided by the application is characterized in that after the telescopic motor is started and extended downward, the first substrate and the second substrate are synchronously lowered until the second substrate stops abutting against the top of the conveying table, the first substrate is continuously lowered by the first spring, the bonding head is synchronously lowered and passes through the through hole until the bonding head is bonded to the pins of the packaging board, and in the process, the bonding head can be buffered by the first spring, so that the pressure of the bonding head on the pins is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor bonding technology, and more specifically to a fully automatic bonding machine for semiconductor production. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small wafers, and then the diced wafers are glued onto the corresponding packaging substrate. Then, ultra-fine metal wires or conductive resin are used to connect the bonding pads of the wafers to the corresponding pins of the packaging substrate, forming the required circuit to create a semiconductor chip.

[0003] The process of soldering the lead of the package substrate to the metal wire is called bonding, which is completed by a bonding machine. The bonding head of the bonding machine needs to contact the lead of the package substrate. However, the bonding head presses down quickly, which can cause compression on the lead of the package substrate, thus affecting the uniformity of the solder joint and consequently affecting the final performance of the semiconductor chip. On the other hand, existing bonding machines cannot perform automatic feeding, or the cost of achieving automatic feeding is too high. Therefore, we propose a fully automatic bonding machine for semiconductor production. Summary of the Invention

[0004] 1. The technical problem that the invention aims to solve This invention provides a fully automated bonding machine for semiconductor manufacturing, which solves the technical problems existing in the background art.

[0005] 2. Technical Solution To achieve the above objectives, the technical solution provided by the present invention is as follows: a fully automatic bonding machine for semiconductor production, comprising a conveyor table, and a storage cylinder and a telescopic motor arranged sequentially along the conveyor table belt conveying direction. The storage cylinder is fixedly installed on the top of the conveyor table and has a number of packaging carriers stacked inside it. The telescopic motor is located directly above the conveyor table, with its output shaft pointing vertically downward and an elastic component fixedly installed at its end. A three-axis mover is provided at the bottom of the elastic component, and a bonding head is mounted on the three-axis mover.

[0006] Furthermore, two limiting rings are fixedly installed inside the conveyor table, and are respectively located on both sides of the conveyor table's belt. Each limiting ring includes an outer ring and an inner ring. The side of the belt is movably assembled with the outer ring and is wrapped by the inner ring. The top of the inner ring has a first groove and a second groove. The first groove is coaxially distributed with the storage cylinder, and the second groove is located at the discharge end of the conveyor table.

[0007] Furthermore, the elastic component includes a first substrate and a second substrate. The second substrate has a through hole at its center and first guide rods fixedly installed on both sides of its top. A first spring is provided on the first guide rod. The first substrate is slidably installed on the two first guide rods. One end of the first substrate is fixedly connected to the output end of the telescopic motor, and the other end is fixedly provided with an extension rod. The extension rod and the through hole are coaxially distributed, and its end is fixedly connected to the three-axis mover.

[0008] Furthermore, a limiting mechanism is provided on the conveyor platform. The limiting mechanism includes two symmetrically distributed limiting components. Each limiting component includes a mounting plate fixedly installed on both sides of the conveyor platform. A second guide rod is fixedly installed on the top of the mounting plate. The second guide rod extends vertically and is provided with a second spring. A limiting plate is slidably installed on the two second guide rods. The limiting plate is located directly below the second base plate.

[0009] Furthermore, all of them are placed inside a protective cover, and a control panel is provided on the front of the protective cover.

[0010] Furthermore, the protective cover has a feed inlet on the top and a slot on one side. The feed inlet is connected to the storage cylinder. A collection box is inserted into the slot. A feed plate is provided above the collection box. The end of the feed plate is connected to the second groove.

[0011] 3. Beneficial effects Compared with the prior art, the technical solution provided by this invention has the following advantages: when the conveyor belt passes the bottom of the storage cylinder, it will carry away the bottommost packaging carrier plate in the conveyor through the friction of its belt surface, thereby realizing automatic feeding of the packaging carrier plate, which is simple, practical and low in cost. After the telescopic motor starts and extends downward, the first substrate and the second substrate descend synchronously until the second substrate stops when it touches the top of the conveyor. The first substrate continues to descend by squeezing the first spring. The bonding head descends synchronously and passes through the through hole until it touches the pin of the packaging carrier for bonding. During this process, the first spring can buffer the bonding head, thereby reducing the pressure of the bonding head on the pin. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the protective cover of the present invention; Figure 3 This is an exploded structural diagram of the storage cylinder and conveyor table of the present invention; Figure 4 This is a schematic diagram of the limiting ring structure of the present invention; Figure 5This is an exploded view of the elastic component and limiting mechanism of the present invention.

[0013] Figure Labels 1. Conveyor; 2. Storage cylinder; 3. Telescopic motor; 4. Elastic component; 401. First base plate; 402. Second base plate; 4021. Through hole; 403. First guide rod; 404. First spring; 405. Extension rod; 5. Three-axis mover; 6. Bonding head; 7. Limiting ring; 701. Outer ring; 702. Inner ring; 7021. First groove; 7022. Second groove; 8. Limiting mechanism; 801. Limiting component; 8011. Mounting plate; 8012. Second guide rod; 8013. Limiting plate; 8014. Second spring; 9. Protective cover; 901. Feed port; 902. Slot; 10. Control panel; 11. Feeding plate; 12. Collection box. Detailed Implementation

[0014] To facilitate understanding of the present invention, a more complete description of the invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the invention. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the invention will be more thorough and complete.

[0015] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "page," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0016] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0017] In this invention, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," "fixed," and "equipped" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Example

[0018] See attached document Figure 1-5 A fully automatic bonding machine for semiconductor manufacturing includes a conveyor table 1, and a storage cylinder 2 and a telescopic motor 3 arranged sequentially along the belt conveying direction of the conveyor table 1. The storage cylinder 2 is fixedly installed on the top of the conveyor table 1 and has a number of packaging carriers stacked inside it. The telescopic motor 3 is located directly above the conveyor table 1. The output shaft of the telescopic motor 3 is vertically downward and an elastic component 4 is fixedly installed at its end. A three-axis mover 5 is provided at the bottom of the elastic component 4, and a bonding head 6 is mounted on the three-axis mover 5.

[0019] The above specific implementation method is as follows: after the conveyor 1 is started, when the belt of the conveyor 1 passes the bottom of the storage cylinder 2, it will carry away the bottommost packaging carrier plate in the conveyor 1 through the friction of its belt surface, thereby realizing the automatic feeding of the packaging carrier plate. It is simple, practical and low cost. When the packaging substrate is transported to directly below the bonding head 6, the conveyor 1 stops transporting, the telescopic motor 3 starts to drive the elastic component 4 to descend, and the bonding head 6 descends synchronously until it contacts the pins on the packaging substrate. At this time, the three-axis mover 5 drives the bonding head 6 to move along the X, Y, and Z axes to perform bonding. After the bonding of the packaging substrate is completed, the conveyor 1 continues to transport the next packaging substrate for bonding. Repeating the above steps can realize automated bonding. The elastic component 4 will deform during the descent, thereby buffering the bonding head 6 and reducing the pressure of the bonding head 6 on the pins, so as to make the solder joints more uniform.

[0020] Two limiting rings 7 are fixedly installed inside the conveyor 1, and are located on both sides of the belt of the conveyor 1 respectively. The limiting ring 7 includes an outer ring 701 and an inner ring 702. The side of the belt is movably assembled with the outer ring 701 and is wrapped by the inner ring 702. The top of the inner ring 702 has a first groove 7021 and a second groove 7022. The first groove 7021 is coaxially distributed with the storage cylinder 2, and the second groove 7022 is located at the discharge end of the conveyor 1.

[0021] The above specific implementation means that the side of the belt and the outer ring 701 are movably assembled, so the belt will not affect the limiting ring 7 when it is conveying, that is, the limiting ring 7 is always fixed. The packaging substrate at the bottom of the storage cylinder 2 will fall onto the belt from the first groove 7021 and be wrapped in the inner ring 702 on both sides during the transport of the packaging substrate. This ensures that the packaging substrate can avoid shifting during the transport and affecting the subsequent bonding. After the bonding is completed, the packaging substrate will continue to be transported with the belt and will be transported out from the second groove 7022.

[0022] The elastic component 4 includes a first substrate 401 and a second substrate 402. The second substrate 402 has a through hole 4021 at its center and first guide rods 403 fixedly installed on both sides of its top. A first spring 404 is provided on the first guide rods 403. The first substrate 401 is slidably installed on the two first guide rods 403. One end of the first substrate 401 is fixedly connected to the output end of the telescopic motor 3, and the other end is fixedly provided with an extension rod 405. The extension rod 405 and the through hole 4021 are coaxially distributed, and its end is fixedly connected to the three-axis mover 5.

[0023] In the above specific implementation, after the telescopic motor 3 starts and extends downward, the first substrate 401 and the second substrate 402 descend synchronously until the second substrate 402 stops after abutting the top of the conveyor table 1. The first substrate 401 then continues to descend by squeezing the first spring 404. The bonding head 6 descends synchronously and passes through the through hole 4021 until it abuts against the pin of the packaging carrier board for bonding. During this process, the first spring 404 can buffer the bonding head 6, thereby reducing the pressure of the bonding head 6 on the pin.

[0024] Based on the above embodiments, a more preferred embodiment is provided here. A limiting mechanism 8 is provided on the conveyor table 1. The limiting mechanism 8 includes two symmetrically distributed limiting components 801. Each limiting component 801 includes a mounting plate 8011 fixedly installed on both sides of the conveyor table 1. A second guide rod 8012 is fixedly installed on the top of the mounting plate 8011. The second guide rod 8012 extends vertically and is provided with a second spring 8014. A limiting plate 8013 is slidably installed on the two second guide rods 8012. The limiting plate 8013 is located directly below the second base plate 402.

[0025] In the above specific implementation, during the descent of the second substrate 402, it will abut against the two limiting plates 8013. The two limiting plates 8013 will compress the second spring 8014 and slide downward on the second guide rod 8012 until the limiting plates 8013 abut against the belt. At this time, the two limiting plates 8013 are respectively placed on both sides of the packaging carrier, thereby limiting it and preventing it from shifting during bonding.

[0026] All of the above structures are housed inside the protective cover 9 for dust protection, and a control panel 10 is provided on the front of the protective cover 9 for controlling the circuit of the entire device.

[0027] The protective cover 9 has a feed inlet 901 on the top and a slot 902 on one side. The feed inlet 901 is connected to the storage cylinder 2. A collection box 12 is inserted into the slot 902. A guide plate 11 is provided above the collection box 12. The end of the guide plate 11 is connected to the second groove 7022.

[0028] In the above specific implementation, the packaging substrate can be stacked in the storage cylinder 2 through the feed port 901. After the bonding is completed, the packaging substrate will come out from the second groove 7022 and fall on the feed plate 11. Under the action of gravity, it will slide from the feed plate 11 into the collection box 12. Then, the collection box 12 can be pulled out from the slot 902 to complete the collection.

[0029] The above-described embodiments are merely illustrative of certain implementations of the present invention, and are described in a relatively specific and detailed manner. However, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

[0030] It should be noted that the above content falls within the scope of the inventor's technical knowledge. Due to the vast and complex nature of the technical content in this field, the above content of this application does not necessarily constitute prior art.

Claims

1. A fully automatic bonding machine for semiconductor manufacturing, characterized in that: The system includes a conveyor (1), and storage cylinders (2) and telescopic motors (3) arranged sequentially along the belt conveying direction of the conveyor (1). The storage cylinders (2) are fixedly installed on the top of the conveyor (1) and have a number of packaging carriers stacked inside. The telescopic motors (3) are located directly above the conveyor (1). The output shaft of the telescopic motors (3) is vertically downward and has an elastic component (4) fixedly installed at its end. A three-axis mover (5) is provided at the bottom of the elastic component (4), and a bonding head (6) is mounted on the three-axis mover (5). The elastic component (4) includes a first substrate (401) and a second substrate (402). The second substrate (402) has a through hole (4021) at its center and first guide rods (403) fixedly installed on both sides of its top. A first spring (404) is provided on the first guide rod (403). The first substrate (401) is slidably installed on the two first guide rods (403). One end of the first substrate (401) is fixedly connected to the output end of the telescopic motor (3), and the other end is fixedly provided with an extension rod (405). The extension rod (405) and the through hole (4021) are coaxially distributed, and the end is fixedly connected to the three-axis mover (5). The conveyor (1) is provided with a limiting mechanism (8), which includes two symmetrically distributed limiting components (801). Each limiting component (801) includes a mounting plate (8011) fixedly installed on both sides of the conveyor (1). A second guide rod (8012) is fixedly installed on the top of the mounting plate (8011). The second guide rod (8012) extends vertically and is provided with a second spring (8014). A limiting plate (8013) is slidably installed on the two second guide rods (8012). The limiting plate (8013) is located directly below the second base plate (402).

2. The fully automatic bonding machine for semiconductor manufacturing according to claim 1, characterized in that: Two limiting rings (7) are fixedly installed inside the conveyor (1) and are located on both sides of the belt of the conveyor (1). Each limiting ring (7) includes an outer ring (701) and an inner ring (702). The side of the belt is movably assembled with the outer ring (701) and is wrapped by the inner ring (702). The top of the inner ring (702) is provided with a first groove (7021) and a second groove (7022). The first groove (7021) and the storage cylinder (2) are coaxially distributed. The second groove (7022) is located at the discharge end of the conveyor (1).

3. The fully automatic bonding machine for semiconductor manufacturing according to claim 2, characterized in that: All of the above structures are placed inside the protective cover (9), and the front of the protective cover (9) is provided with a control panel (10).

4. The fully automatic bonding machine for semiconductor manufacturing according to claim 3, characterized in that: The protective cover (9) has a feed inlet (901) on the top and a slot (902) on one side. The feed inlet (901) is connected to the storage cylinder (2). A collection box (12) is inserted into the slot (902). A feed plate (11) is provided above the collection box (12). The end of the feed plate (11) is connected to the second groove (7022).

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