Alignment device and substrate superposition device

Abstract

An alignment device, a substrate superposition device, and an alignment method, which perform positioning of substrates in a circumferential direction when performing alignment of the substrates, and which cause the substrates to be superposed well with each other. The alignment device (60) is an alignment device (60) which positions substrates (S1, S2) in which notches (99) are formed in outer peripheral portions, and which is provided with a substrate support portion (20) which places the substrates (S1, S2); a rotation restriction portion (63) which is inserted into the notches (99) of the substrates (S1, S2) placed on the substrate support portion (20); and a plurality of blocks (61a, 62a) which are sandwiched from a direction along a surface of the substrates (S1, S2) with respect to the substrates (S1, S2) placed on the substrate support portion (20).

Description

Technical Field

[0001] This invention relates to an alignment device and a substrate alignment device. Background Technology

[0002] Substrate alignment devices that overlap multiple substrates in an overlapping state are known. One such substrate alignment device discloses a structure in which a first wafer (support plate) is placed on a second wafer (substrate) held on a stage, thereby aligning the first and second wafers (for example, see Patent Document 1). The substrate alignment device disclosed in Patent Document 1 includes an alignment device (position adjustment unit) that adjusts the horizontal position of the first and second wafers before pressurizing and bonding them. Multiple such alignment devices are provided at intervals in the circumferential direction outside the radial direction of the first and second wafers. Alignment is performed by pressing the alignment devices against the first and second wafers using a stepper motor, cylinder, or similar pressing unit.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-243226 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the alignment device disclosed in Patent Document 1, there is a problem that the positions of the first wafer and the second wafer cannot be adjusted in the circumferential direction (around an axis parallel to the vertical axis).

[0008] The purpose of this invention is to provide an alignment apparatus, a substrate alignment apparatus, and an alignment method that can position substrates in the circumferential direction and make the substrates overlap well during substrate alignment.

[0009] The means to solve the problem

[0010] In a first aspect of the present invention, an alignment device is provided for positioning a substrate with a notch formed on its outer periphery. The device includes a substrate support, a rotation limiting part, and a plurality of blocks. The substrate support holds the substrate. The rotation limiting part is inserted into the notch of the substrate held on the substrate support. The plurality of blocks are clamped relative to the substrate held on the substrate support from a direction along the surface of the substrate.

[0011] In a second aspect of the present invention, a substrate overlapping device is provided, comprising an alignment device, a lifting pin, a holding portion, and an upper pressing portion as described in the first aspect. The lifting pin is disposed on the substrate support portion and supports the substrate for lifting. The holding portion receives the substrate from the lifting pin and holds it. The upper pressing portion is disposed above the substrate support portion, and the multiple substrates positioned by the alignment device are clamped by the substrate support portion or by the lifting pin and the upper pressing portion to overlap the multiple substrates.

[0012] In a third aspect of the present invention, an alignment method is provided, which is an alignment method for positioning a substrate with a notch formed on its outer periphery, wherein the method includes the steps of inserting a rotation limiting part into the notch to limit the rotation of the substrate; and the steps of clamping the substrate with a plurality of blocks relative to the substrate from a direction along the surface of the substrate.

[0013] The effects of the invention

[0014] According to the present invention, since the substrates are positioned in the circumferential direction during substrate alignment, the substrates can be made to overlap well with each other. Attached Figure Description

[0015] Figure 1 This is a diagram illustrating an example of a substrate overlapping device according to an embodiment.

[0016] Figure 2 This is a view of the substrate from below, looking at the top side.

[0017] Figure 3 This is a cross-sectional view of the upper substrate.

[0018] Figure 4 This is a top view of the side panel and alignment device.

[0019] Figure 5 yes Figure 4 AA-direction sectional view.

[0020] Figure 6 This is a flowchart illustrating an example of a substrate overlap method according to an embodiment.

[0021] Figure 7 It continues Figure 6 A flowchart illustrating an example of a substrate overlap method according to an embodiment.

[0022] Figure 8 An example illustrating the operation of the substrate overlapping device is a diagram showing the upper substrate being moved into the cavity and supported by a lifting pin.

[0023] Figure 9An example illustrating the operation of the substrate overlapping device is a diagram showing the upper substrate being placed on a support member.

[0024] Figure 10 An example illustrating the operation of the substrate overlapping device is a diagram showing the lower substrate being moved into the cavity and supported by a lifting pin.

[0025] Figure 11 An example illustrating the operation of the substrate overlapping device is a diagram showing the substrate supported by the lower side plate.

[0026] Figure 12 An example illustrating the operation of the substrate overlapping device is a diagram showing the lifting pin rising and causing the upper and lower substrates to overlap.

[0027] Figure 13 This is a flowchart illustrating an example of an alignment method for a particular implementation.

[0028] Figure 14 An example illustrating the operation of the alignment device is a diagram showing the insertion of a notch pin into a notch in the substrate.

[0029] Figure 15 An example illustrating the operation of the alignment device is a diagram showing the first pair of pieces coming into contact with the substrate.

[0030] Figure 16 An example illustrating the action of the alignment device is a diagram showing one of the two second blocks pushing against the substrate.

[0031] Figure 17 An example illustrating the action of the alignment device is a diagram showing the other side of a pair of second blocks pressing against the substrate.

[0032] Figure 18 An example illustrating the action of the alignment device is a diagram showing the retraction of the notch pin, a pair of first pieces, and a pair of second pieces. Detailed Implementation

[0033] In order to implement the invention

[0034] While referring to the appendix Figure 1The embodiments will be described below. However, the present invention is not limited to the content described below. In addition, in the accompanying drawings, some parts are omitted to facilitate understanding of the embodiments. Furthermore, some parts are enlarged or emphasized to appropriately change the scale, and there may be cases where the size and shape differ from the actual product. In the following figures, the directions in the figures are explained using an XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, the plane parallel to the horizontal plane is designated as the XY plane. In this XY plane, the direction parallel to the transport direction of substrate S1 and substrate S2 is designated as the X direction, and the direction orthogonal to the X direction is designated as the Y direction. In addition, the direction perpendicular to the XY plane is designated as the Z direction (height direction). The X direction, Y direction, and Z direction are explained by assuming that the direction indicated by the arrow in the figure is the + direction and the direction opposite to the direction indicated by the arrow is the - direction.

[0035] <Substrate overlay device>

[0036] The substrate overlapping device 100 of the relevant embodiment will be described. Figure 1 This diagram illustrates an example of a substrate overlapping apparatus 100 according to an embodiment. The substrate overlapping apparatus 100 overlaps substrate S1, on which adhesive layers F are formed, and substrate S2, on which adhesive layers F are formed, by bringing their adhesive layers F abut against each other. Furthermore, the adhesive layers F are not limited to being formed on both substrates S1 and S2; they can be formed on either substrate S1 or substrate S2. The adhesive layers F are formed by applying them to substrates S1 and S2 using a coating apparatus, for example, before they are brought into the substrate overlapping apparatus 100, and then drying them. Alternatively, this coating apparatus may be equipped on the substrate overlapping apparatus 100 itself.

[0037] In this embodiment, the upper substrate of the two overlapping substrates is referred to as substrate S1, and the lower substrate is referred to as substrate S2. Substrate S1 and substrate S2 are, for example, glass substrates, semiconductor substrates, resin substrates, etc. In this embodiment, for example, the upper substrate S1 is a glass substrate, and the lower substrate S2 is a silicon substrate. Furthermore, the configuration in which substrates S1 and S2 overlap is referred to as substrate S (see reference). Figure 18 Both substrate S1 and substrate S2 are circular substrates that appear circular in top view (from the Z direction), but are not limited to circular substrates. They can also be square substrates, elliptical substrates, oblong substrates, etc., that appear rectangular (square, rectangular) in top view.

[0038] Figure 2 This is a view of the substrate S1 from below, looking at the top side. (See diagram below.) Figure 2As shown, substrates S1 and S2 have a notch 99. The notch 99 is formed on the outer periphery of substrates S1 and S2. The notch 99 is formed at one location in the circumferential direction on the outer periphery of substrates S1 and S2. The notch 99 is formed to be recessed from the outer periphery of substrates S1 and S2 toward the radial direction of substrates S1 and S2. The notch 99 is semi-circular when viewed from below.

[0039] Figure 3 This is a cross-sectional view of the upper substrate S1. (Example) Figure 2 , Figure 3 As shown, an adhesive layer F is formed on the upper substrate S1, on the lower surface facing downward in the state of being transported into the chamber 10.

[0040] like Figure 1 As shown, the substrate alignment device 100 includes a chamber 10, a substrate support 20, an upper pressing part 30, a lifting part 40, a shaft part 51, an alignment device 60, and a control part C. The control part C controls the operation of each part in the substrate alignment device 100 in general.

[0041] In the substrate overlapping apparatus 100, to overlap substrates S1 and S2, firstly, substrate S1 is transported into the chamber 10. After alignment by the alignment device 60, substrate S1 is raised by the lifting part 40 and held by the upper pressing part 30. Next, substrate S2 is transported into the chamber 10. After alignment by the alignment device 60, substrate S2 is raised by the lifting part 40 and overlaps with substrate S1 held by the upper pressing part 30. When substrate S2 is transported into the chamber 10, substrate S2 is transported with the adhesive layer F facing upwards (+Z direction).

[0042] The chamber 10 is disposed on the base 15 of the substrate overlapping device 100. The chamber 10 is box-shaped, having a side wall 10a rising upward from the outer periphery of the base 15 and a top plate 10b covering the top of the side wall 10a. The chamber 10 houses the substrate support 20, the upper pressing part 30, the lifting part 40, a portion of the shaft part 51, and the alignment device 60. The chamber 10 is box-shaped and has an opening 11 on a portion of the side wall 10a. The opening 11 is formed on the -X side surface of the chamber 10, allowing communication between the interior and exterior of the chamber 10. The opening 11 is sized to allow the substrates S1 and S2 held on the transport device 90, and thus the substrate S that has been overlapped, to pass through.

[0043] Substrates S1 and S2 are respectively transported into the chamber 10 through the opening 11 by the arms 91 of the transport device 90. Substrates S are also transported out of the chamber 10 through the opening 11. In this embodiment, the transport device 90 has two flat arms 91. When transporting substrate S1 into the chamber 10, the arms 91 hold substrate S1 by adsorption from its upper side. When transporting substrate S2 and S2 and when transporting substrate S2 out of the chamber 10, the arms 91 hold substrate S2 and S2 by adsorption from their lower sides. Alternatively, the arms 91 may hold substrate S2 and S2 without adsorbing them during transport, simply by placing them on their upper side. Furthermore, the number of arms 91 is not limited to two; three or more arms may be used.

[0044] The chamber 10 is equipped with a gate valve 12 for opening and closing the opening 11. The gate valve 12 is disposed on the outer side of the X-side of the chamber 10 and can slide in the vertical direction (Z direction) by a drive unit (not shown). The gate valve 12 opens and closes the opening 11 by sliding. Even when the opening 11 is closed by the gate valve 12, the chamber 10 remains open to the atmosphere. Alternatively, the opening 11 can be closed to create a sealed environment within the chamber 10, thus creating a vacuum environment. Furthermore, a through section 10h, through which the shaft 51 (described later) passes, is provided on the top of the chamber 10. The shaft 51 is inserted into the through section 10h. The shaft 51 may also be height-adjustable.

[0045] Furthermore, whether the substrate overlapping device 100 includes a chamber 10 is optional; it can also be configured without a chamber 10 (atmospheric open type). When creating a vacuum environment inside the chamber 10, the chamber 10 is connected to a suction device (not shown). By suctioning (exhausting) the chamber 10 through this suction device, a vacuum environment can be created inside the chamber 10. Furthermore, the chamber 10 may also be equipped with a valve that can be opened to the outside to open the internal vacuum environment. Additionally, the chamber 10 may be connected to a gas supply device (not shown). By supplying a predetermined gas into the chamber 10 through this gas supply device, a predetermined gaseous environment can be created inside the chamber 10. The predetermined gas may be, for example, nitrogen or other gases that are inert relative to the thin films formed on the substrates S1 and S2, or dry air.

[0046] The substrate support portion 20 supports the substrates S1 and S2 that are transported into the chamber 10 from below. The substrate support portion 20 is circular when viewed from above, but is not limited to this shape. For example, it can also be rectangular (square, elongated), elliptical, oblong, etc. The substrate support portion 20 is set to have an outer diameter larger than that of the substrates S1 and S2.

[0047] The substrate support 20 includes a support plate 21, a heater (heating part) 22, and a base plate 23. The support plate 21, heater 22, and base plate 23 are stacked in this order, starting from the lower side (-Z side). The substrate support 20 is supported by a plurality of pillars 24 provided on the lower side of the support plate 21. The support plate 21 and the heater 22, as well as the heater 22 and the base plate 23, are fixed together, for example, by fastening connecting parts such as bolts. A plurality of through holes 20h are provided in the vertical direction on the support plate 21, the heater 22, and the base plate 23, through which the lifting pin 41 of the lifting part 40 (described later) passes. Furthermore, whether or not the heater (heating part) 22 is provided is arbitrary, and the substrate support 20 may also be provided without the heater (heating part) 22.

[0048] The support plate 21 is, for example, a plate-shaped body made of materials such as metal, resin, or ceramic. The heater 22 is an example of a heating element; for example, it is a hot plate with a heating mechanism (heat source) such as heating wires inside. The substrates S1 and S2 are heated by the heater 22 via the base plate 23. Alternatively, the heater 22 may be a laminated structure with sheet-shaped heat sources sandwiched between them. The base plate 23 has substrates S1, S2, and substrate S disposed on its upper surface 23f, which is the +Z side. The base plate 23 is, for example, a plate-shaped body made of ceramic, but it may also be made of metal, resin, or the like. The upper surface 23f of the base plate 23 may also be the surface in contact with substrate S2. Therefore, it is preferable that the upper surface 23f has high flatness and low surface roughness (or a mirror finish).

[0049] Multiple support pillars 24 are provided on the underside of the support plate 21. The multiple support pillars 24 are used to support the substrate support portion 20 on the base 15 at the bottom of the chamber 10. Furthermore, the number and arrangement of the support pillars 24 are not limited to the above-described manner, and any structure that can support the substrate support portion 20 can be applied.

[0050] like Figure 1 As shown, the upper pressing part 30 pushes the upper substrate S1 toward the substrate S2 side (substrate support part 20 side) when the substrate S1 and substrate S2 are overlapped. The upper pressing part 30 has a base 31 provided at the lower part of the shaft part 51 and an adsorption pad (holding part) 32 provided on the lower side of the base 31. The base 31 and the adsorption pad 32 are circular in shape when viewed from above, but are not limited to this shape. For example, they can also be rectangular (square, elongated), elliptical, oblong, etc. The base 31 and the adsorption pad 32 are set to have an outer diameter smaller than that of the substrates S1 and S2. In addition, the outer diameter of the base 31 and the adsorption pad 32 can be set arbitrarily.

[0051] The upper pressing part 30 is provided at the lower end of the shaft part 51, and its position is fixed in the vertical direction. However, when the shaft part 51 is height-adjustable, the upper pressing part 30 can also be integrated with the shaft part 51 for height adjustment. The adsorption pad 32 can use its lower surface 32a as an adsorption surface to adsorb the substrate S1 that is supported on the lifting pin 41 and hold the substrate S1 in place. The adsorption pad 32 is fixed relative to the base 31 by fastening connecting parts such as bolts. The structure of the adsorption pad 32 is arbitrary; for example, a vacuum adsorption pad or an electrostatic adsorption pad can be used. In addition, the upper pressing part 30 can also be equipped with a heater (heating part). Alternatively, instead of the upper pressing part 30, a heater can be provided to heat the cavity 10.

[0052] A lifting unit 40 is disposed below the substrate support unit 20. The lifting unit 40 supports substrates S1, S2, and S above the substrate support unit 20, causing these substrates S1, S2, and S to rise and fall. The lifting unit 40 lowers the supported substrates S1 and S2 onto the substrate support unit 20 to align them with the alignment device 60 after they have been transported into the chamber 10. The lifting unit 40 raises the supported substrate S1 to hold the aligned substrate S1 on the adsorption pad 32. The lifting unit 40 raises the substrate S2 to align it with the substrate S1.

[0053] The lifting section 40 has a plurality of lifting pins 41; a moving section 42 connected to the lower ends of these lifting pins 41 and capable of moving up and down in the Z direction; and a lifting pin drive section 43 for moving the moving section 42 up and down. The plurality of lifting pins 41 are disposed at the center of the substrate support section 20. The plurality of lifting pins 41 support the substrates S1 and S2 by contacting the center of the substrates S1 and S2 from below. Furthermore, after the substrates S1 and S2 are placed on the substrate support section 20, the upper ends of the lifting pins 41 do not contact the substrates S1 and S2.

[0054] Figure 4 This is a top view of the substrate support portion 20. (See attached image.) Figure 4 As shown, the lifting pins 41 are respectively disposed through a plurality of through holes 20h in the substrate support portion 20. The upper ends of the plurality of lifting pins 41 are aligned at the same or approximately the same height. The lifting pins 41 may also be formed of, for example, a non-conductive material (e.g., resin, metal, ceramic, etc.).

[0055] like Figure 1 As shown, the moving part 42 rises and falls by driving the lifting pin drive part 43. Multiple lifting pins 41 rise and fall simultaneously with the moving part 42. The lifting pin drive part 43, for example, uses an electric rotary motor, linear motor, cylinder device, hydraulic cylinder device, etc., and transmits driving force to the moving part 42 via a transmission mechanism (not shown).

[0056] Figure 5 yes Figure 4 A sectional view from angle AA. For example... Figure 4 , Figure 5 As shown, the substrate support portion 20 includes a support member 80. The support member 80 supports the lower outer periphery F1 of the substrate S1 from below when the alignment device 60 positions the substrate S1. The support member 80 is provided on the base plate 23 of the substrate support portion 20.

[0057] The support member 80 abuts against the lower outer periphery F1 of the substrate S1 when the lifting pin 41 supporting the substrate S1 descends, thereby supporting the substrate S1. The support member 80 is provided at three or more locations spaced apart in the circumferential direction of the substrate support portion 20. For example, the support member 80 is provided at four locations spaced apart in the circumferential direction of the substrate support portion 20. The support member 80 is, for example, a pin 81 protruding from the upper surface of the substrate support portion 20. By abutting the pin 81 against the lower outer periphery F1 of the substrates S1 and S2, the substrates S1 and S2 can be stably supported with a simple structure.

[0058] The shape of the tip of pin 81 is not limited to hemispherical, and other shapes can be made appropriately. In addition, the structure of support member 80 can be modified appropriately. Furthermore, support member 80 may be omitted, and multiple lifting pins configured to extend upward from the top 23f of base plate 23 may support base plates S1 and S2 from below.

[0059] like Figure 1 , Figure 4 As shown, the alignment device 60 positions substrates S1 and S2 relative to the substrate support portion 20. The alignment device 60 positions substrates S1 and S2, whose outer peripheral portions have notches 99 formed. The alignment device 60 includes a pair of first unit blocks 61, a pair of second unit blocks 62, and a rotation limiting portion 63. The pair of first unit blocks 61 are disposed on one side of the substrates S1 and S2 relative to the rotation limiting portion 63. The pair of second unit blocks 62 are disposed on the other side of the substrates S1 and S2 relative to the pair of first unit blocks 61 and relative to the rotation limiting portion 63.

[0060] A pair of first unit blocks 61 are arranged at intervals around the central axis AX of the substrate support portion 20. In this embodiment, the pair of first unit blocks 61 are arranged at intervals of, for example, 90 degrees around the central axis AX. Each first unit block 61 includes a first block 61a and a first drive unit 64.

[0061] The first block 61a is configured to move forward and backward along the radial direction of the substrates S1 and S2 supported on the substrate support portion 20. When the first block 61a moves to the inner radial direction of the substrates S1 and S2, it can abut against the outer periphery of the substrates S1 and S2. The first block drive portion 64 causes the first block 61a to move forward and backward in the radial direction of the substrates S1 and S2. The first block drive portion 64 may be, for example, an electric rotary motor, a cylinder device, or a hydraulic cylinder device. The operation of the first drive portion 64 is controlled by the control portion C.

[0062] A pair of second units 62 are arranged spaced apart in the circumferential direction of substrates S1 and S2. In this embodiment, the pair of second units 62 are arranged spaced apart at an angle of, for example, 90 degrees in the circumferential direction around the central axis AX. Each side of the pair of second units 62 is arranged facing each other relative to each side of the pair of first units 61, sandwiching the central axis AX of the substrate support portion 20. Each second unit 62 includes a second block 62a and a second drive portion 65.

[0063] The second block 62a is configured to move forward and backward along the radial direction of the substrates S1 and S2 supported by the substrate support 20. When the second block 62a moves inward to the radial direction inside the substrates S1 and S2, it can abut against the outer periphery of the substrates S1 and S2. The second block drive unit 65 causes the second block 62a to move forward and backward in the radial direction of the substrates S1 and S2. The second block drive unit 65 may be, for example, an electric rotary motor, a cylinder, or a hydraulic cylinder. The operation of the second block drive unit 65 is controlled by the control unit C. The second block drive unit 65 includes an elastic member 66 that elastically supports the second block 62a to push it toward the outer periphery of the substrates S1 and S2. The elastic member 66 may be, for example, a coil spring.

[0064] A rotation limiting part 63 is disposed between a pair of second units 62 in the circumferential direction of substrates S1 and S2. The rotation limiting part 63 includes a notched pin 67, a pin drive part 68, and a pin loading member 69. The notched pin 67 can be inserted into the notches 99 of substrates S1 and S2. The top end of the notched pin 67 is semi-circular when viewed from above. The pin drive part 68 moves the notched pin 67 forward and backward in the radial direction of substrates S1 and S2. The pin drive part 68 can be, for example, an electric rotary motor, a cylinder, or a hydraulic cylinder. The operation of the pin drive part 68 is controlled by a control part C. The pin loading member 69 loads the notched pin 67 toward the radially inward side of substrates S1 and S2. By inserting the notched pin 67 into the notches 99 of substrates S1 and S2, the circumferential movement of substrates S1 and S2 is restricted.

[0065] The alignment device 60 comprises a first block 61a having a pair of first block units 61 and a second block 62a having a pair of second block units 62. The pair of first blocks 61a and the pair of second blocks 62a clamp multiple portions of substrates S1 and S2, which are spaced apart in the circumferential direction, onto the substrate support portion 20, from a direction along the surface of substrates S1 and S2. In the alignment device 60, the notched pin 67 of the rotation limiting portion 63 is inserted into the notch 99 of the substrates S1 and S2 on the substrate support portion 20. With this structure, substrates S1 and S2 are aligned while rotation in the circumferential direction is constrained.

[0066] In the alignment device 60, a pair of first blocks 61a are disposed opposite to the notched pins 67 of the rotation limiting part 63 on the opposite sides of the substrates S1 and S2. The pair of first blocks 61a are disposed at intervals on opposite sides of the notched pins 67 in the radial direction, relative to the center of the substrates S1 and S2, on both sides in the circumferential direction. The pair of first blocks 61a, opposite to the notched pins 67, are disposed in contact with the outer periphery of the substrates S1 and S2 on the opposite sides of the substrates S1 and S2. A pair of second blocks 62a are disposed opposite to the pair of first blocks 61a on the opposite side of the substrates S1 and S2. The pair of second blocks 62a are disposed at intervals on both sides of the substrates S1 and S2 in the circumferential direction, away from the notch 99.

[0067] A pair of second blocks 62a are positioned on both sides of the substrates S1 and S2 in the circumferential direction, sandwiching the notch 99, and are grounded against the outer periphery of the substrates S1 and S2. The position of the substrates S1 and S2 along the surface of the substrates S1 and S2 is defined by these first blocks 61a and second blocks 62a abutting against the substrates S1 and S2. To prevent the substrates S1 and S2 from becoming charged, it is preferable that the first blocks 61a, second blocks 62a, and the notch pin 67 are formed of a conductive material.

[0068] A pair of second blocks 62a elastically support substrates S1 and S2 by being pushed toward the outer periphery of substrates S1 and S2 by the pin loading member 69. Additionally, the notched pin 67 reliably engages with the notch 99 by being loaded inward in the radial direction by the pin loading member 69 toward substrates S1 and S2. The contact force of the first block 61a, the second block 62a, and the rotation limiting part 63 relative to the outer periphery of substrates S1 and S2 is set to increase in the order of the second block 62a, the first block 61a, and the notched pin 67.

[0069] The operation of the alignment device 60 is controlled by the control unit C. The control unit C, for example, reads the shape, diameter, and position of the notch 99 of the substrates S1 and S2 obtained from other units (not shown), determines their respective alignment positions relative to the substrates S1 and S2, and then operates the alignment device 60. During the alignment adjustment of the substrates S1 and S2, the notch pin 67 advances inward in the radial direction of the substrates S1 and S2 via a pin drive 68 controlled by the control unit C, inserting into the notch 99. A pair of first blocks 61a advance inward in the radial direction of the substrates S1 and S2 via a first block drive 64 controlled by the control unit C. The pair of first blocks 61a are positioned based on the outer diameter dimensions of the substrates S1 and S2 obtained in advance by the control unit C.

[0070] A pair of second blocks 62a, operated by a second drive unit 65 controlled by a control unit C, advances radially inward toward the inner side of substrates S1 and S2, abutting against the outer periphery of substrates S1 and S2. The pair of second blocks 62a are pushed against the outer periphery of substrates S1 and S2 by the second drive unit 65. By pushing the outer periphery of substrates S1 and S2 radially inward with each second block 62a, substrates S1 and S2 come into contact with the first block 61a sandwiching the opposite side of substrates S1 and S2. After pushing one of the pair of second blocks 62a against the outer periphery of substrates S1 and S2, the second drive unit 65 pushes the other of the pair of second blocks 62a against the outer periphery of substrates S1 and S2.

[0071] The second drive unit 65 alternately and repeatedly pushes each of the pair of second blocks 62a against the outer periphery of the substrates S1 and S2 a predetermined number of times, and then retracts from the outer periphery of the substrates S1 and S2. Through this action, the substrates S1 and S2 are positioned with reference to the pair of first blocks 61a fixed at positions based on the outer diameter dimensions of the substrates S1 and S2. The circumferential positions of the substrates S1 and S2 are defined by inserting a notch pin 67 into a notch 99.

[0072] like Figure 4 As shown, the plurality of first blocks 61a and second blocks 62a are respectively arranged in a state offset relative to the plurality of pins 81 in the circumferential direction of the substrate support portion 20. According to this structure, when the alignment device 60 positions the substrates S1 and S2, when the plurality of first blocks 61a and second blocks 62a move forward and backward along the direction of the surface of the substrates S1 and S2 to clamp the substrates S1 and S2, interference between the first blocks 61a and second blocks 62a and the pins 81 can be suppressed.

[0073] <Substrate overlay method>

[0074] Next, the substrate overlap method of the relevant embodiments will be described. Figure 6 This is a flowchart illustrating an example of a substrate overlap method according to an embodiment. Figure 7 It continues Figure 6 This is a flowchart illustrating an example of a substrate alignment method according to an embodiment. This substrate alignment method is performed, for example, according to instructions from the control unit C. Figures 8 to 18 This is a process diagram illustrating an example of the operation of the substrate overlapping device 100. Furthermore, in these process diagrams, the descriptions have been simplified for ease of understanding of the operation of each part. The following follows... Figure 6 , Figure 7 The flowchart is used for illustration.

[0075] First, open the gate valve 12 of chamber 10 and insert the base plate (step S01). Figure 8 As shown, the control unit C drives a drive unit (not shown) to raise the gate valve 12, opening the opening 11. Next, the substrate S1 (upper substrate) is transported into the chamber 10. At this time, the control unit C pre-raises the lifting pin 41 to the junction height of the substrate S1. The arm 91 of the transport device 90, holding the substrate S1 on its lower side, enters the chamber 10 through the opening 11, positioning the substrate S1 above the lifting pin 41. The arm 91 is held by an adsorption pad (not shown) or similar material provided on its lower side. Furthermore, the outer diameter and the circumferential position of the notch 99 are measured before the substrate S1 is transported into the chamber 10. The substrate S1 is held on the arm 91 with the circumferential position of the notch 99 aligned with a predetermined position.

[0076] Subsequently, the control unit C lowers the arm 91, handing the substrate S1 from the arm 91 to the lifting pin 41 (step S02). The lifting pin 41 contacts the center of the lower inner periphery F2 of the substrate S1 from below. Afterward, the arm 91 retracts from the chamber 10. In addition, if the substrate S1 is provided with an adhesive layer F, the adhesive layer F becomes the lower side when the substrate S1 is transported into the chamber 10.

[0077] Next, control unit C, such as Figure 9 As shown, the lifting pin 41 supporting the substrate S1 is lowered, and the substrate S1 is placed on the plurality of support members 80 (pins 81) of the substrate support portion 20 (step S03). At this time, the lifting pin 41 is lowered to a lower position compared to the plurality of support members 80 (i.e., the lower surface of the substrate S1), so that the substrate S1 is supported by the plurality of support members 80. With this structure, the substrate S1 does not contact the lifting pin 41, and is supported only by the plurality of support members 80 that contact the lower outer periphery F1 from below. Alternatively, the substrate S1 can be heated by the heater 22.

[0078] Next, an alignment operation is performed relative to the substrate S1 (step S04). The alignment operation relative to the substrate S1 is performed by the alignment device 60 as will be described in detail later.

[0079] After the alignment operation, the control unit C lifts the substrate S1 upward by raising the lifting pin 41. Then, the substrate S1 is held by the adsorption pad 32 (step S05).

[0080] Next, the substrate S2 (lower substrate) is transported into the chamber 10 (step S06). For example... Figure 10 As shown, the control unit C lowers the lifting pin 41 to the junction height of the substrate S2. Then, the arm 91 transports the substrate S2 into the chamber 10 and positions it above the lifting pin 41. The arm 91 holds the substrate S2 on its underside. Then, the control unit C lowers the arm 91, transferring the substrate S2 from the arm 91 to the lifting pin 41. Then, the arm 91 withdraws from the chamber 10. Furthermore, when the substrate S2 is transported into the chamber 10, the adhesive layer F becomes the upper side.

[0081] Next, the gate valve 12 is closed, and the substrate is baked (step S07).

[0082] Next, as Figure 11 As shown, the lifting pin 41 is lowered, placing the substrate S2 on the substrate support portion 20. The lifting pin 41 is lowered to a lower position compared to the plurality of support members 80, and the substrate S2 is supported only by the plurality of support members 80. With this structure, the substrate S2 does not contact the lifting pin 41, and is supported by the plurality of support members 80 that contact the lower outer periphery F1 from below. Then, the substrate S2 can be heated by the heater 22, and baking can be performed either in an open-atmosphere state or in a vacuum environment within the chamber 10.

[0083] Next, an alignment operation is performed relative to substrate S2 (step S08). This alignment operation is the same as in step S04 described above, and is performed by the alignment device 60 as will be detailed later. Therefore, substrates S1 and S2 are positioned approximately at the same location in the top view. At this time, substrate S2 is supported by a plurality of support members 80 on its lower outer periphery F1. Therefore, if substrate S2 is moved along its lower surface by the alignment device 60 in order to position it, friction is generated only between the plurality of support members 80 and the lower outer periphery F1 of substrate S1. The alignment operation in step S08 is the same as the alignment operation in step S04.

[0084] Next, control unit C, such as Figure 12As shown, by raising the lifting pin 41, the substrate S2 is raised, causing substrates S1 and S2 to overlap (step S09). At this time, the suction pad 32 of the upper pressing part 30 presses the upper surface of substrate S1, and substrate S2 is raised by the lifting pin 41 to overlap with substrate S1, thereby making substrates S1 and S2 overlap. That is, the suction pad 32 has both the function of holding substrate S1 and the function of pressing the upper surface of substrate S1 by abutting against it. In step S09, substrates S1 and S2 are overlapped by the abutting of the adhesive layer F of substrate S1 and the adhesive layer F of substrate S2. Furthermore, the force for overlapping substrates S1 and S2 is controlled by the force of the lifting pin 41 rising. In addition, instead of raising the lifting pin 41, the upper pressing part 30 holding substrate S1 can be lowered, or the lifting pin 41 can be raised and the upper pressing part 30 can be lowered.

[0085] Next, the adsorption pad 32 releases its adsorption of the substrate S1 (step S10). After the substrate S1 and substrate S2 are aligned, the control unit C releases the adsorption of the substrate S1 by the adsorption pad 32. The lifting pin 41 is lowered, and the substrate S, now aligned, is positioned at the transport height. In this process, the substrate S is separated from both the substrate support 20 and the upper pressing part 30. Next, the gate valve 12 is opened, and the substrate S is transported out of the chamber 10 (step S11).

[0086] After the gate valve 12 is raised to open the opening 11, the arm 91 of the transport device 90 enters the interior of the chamber 10 through the opening 11, positioning the arm 91 below the substrate S supported by the lifting pin 41. Then, the control unit C raises the arm 91, causing the substrate S to be attracted and held on top of the arm 91, thereby transferring the substrate S from the lifting pin 41 to the arm 91. Alternatively, the arm 91 can be positioned without attracting and holding the substrate S, simply placing it on top of the arm 91 for support. Afterward, the arm 91 withdraws from the chamber 10, transporting the substrate S out of the chamber 10. Finally, the control unit C closes the gate valve 12, completing the series of processes.

[0087] Alignment Method

[0088] Next, the alignment method of the relevant implementation method will be described. Figure 13 This is a flowchart illustrating an example of an alignment method according to an embodiment. This alignment method is performed, for example, according to instructions from the control unit C in steps S04 and S08 described above. Figures 14-18 This is a process diagram illustrating one example of the operation of the alignment device 60. Furthermore, in these process diagrams, the descriptions of each part have been simplified for ease of understanding.

[0089] Furthermore, in step S04, alignment is performed by the alignment device 60 relative to substrate S1. In step S08, alignment is performed by the alignment device 60 relative to substrate S2. In other words, regarding the alignment method of this embodiment, the only difference is that substrate S1 is the alignment target in step S04 and substrate S2 is the alignment target in step S08; the operation of the alignment device 60 is the same. The following follows... Figure 13 The flowchart is used for illustration.

[0090] In the initial stages of steps S04 and S08, substrates S1 and S2 are supported by multiple support members 80. For example... Figure 14 As shown, the control unit C drives the pin drive unit 68 to insert the notched pin 67 into the notches 99 of the substrates S1 and S2 (step S041). By inserting the notched pin 67 into the notches 99, the circumferential movement (rotation) of the substrates S1 and S2 is restricted.

[0091] Next, the control unit C drives the first drive unit 64 based on the pre-obtained outer diameter dimensions of the substrates S1 and S2, such as... Figure 15 As shown, a pair of first blocks 61a are moved inward in the radial direction of substrates S1 and S2 and positioned at a predetermined position based on the outer diameter of substrates S1 and S2 (step S042). Depending on the position of substrates S1 and S2 at this time, there may be a case where the pair of first blocks 61a do not come into contact with substrates S1 and S2.

[0092] Next, the control unit C drives the second drive unit 65, as follows: Figure 16 As shown, one of the pair of second blocks 62a advances inward along the radial direction of the substrates S1 and S2, abutting against the outer peripheral surfaces of the substrates S1 and S2 (step S043). One of the second blocks 62a advances to a predetermined position based on the outer diameter dimensions of the substrates S1 and S2 obtained in advance by the control unit C, and pushes the substrates S1 and S2. The substrates S1 and S2, the second block 62a that is being pushed, and the first block 61a facing this second block 62a, sandwiching the substrates S1 and S2, are then clamped together.

[0093] Next, the control unit C drives the second drive unit 65, as follows: Figure 17 As shown, the inner radial direction of one of the pair of second blocks 62a is advanced to abut against the outer peripheral surface of the substrates S1 and S2 (step S044). The other second block 62a advances to a predetermined position based on the outer diameter dimensions of the substrates S1 and S2 obtained in advance by the control unit C, and pushes the substrates S1 and S2. As a result, the substrates S1 and S2 are clamped by the pair of second blocks 62a and the pair of first blocks 61a that push the substrates S1 and S2.

[0094] Then, the control unit C drives the second drive unit 65, causing both sides of the pair of second blocks 62a to retract outward in the radial direction toward the substrates S1 and S2 (step S045). Next, the control unit C drives the second drive unit 65, causing the other side of the pair of second blocks 62a to advance in the radial direction toward the substrates S1 and S2, and abut against the outer peripheral surface of the substrates S1 and S2 (step S046). In step S046, the other second block 62a that abutted against the substrates S1 and S2 in step S044 abuts against the substrates S1 and S2 first.

[0095] Next, the control unit C drives the second drive unit 65, causing one of the pair of second blocks 62a to advance inward in the radial direction towards the substrates S1 and S2, abutting against the outer peripheral surfaces of the substrates S1 and S2 (step S047). In step S047, similar to step S044 described above, the substrates S1 and S2 are sandwiched between the pair of second blocks 62a and the pair of first blocks 61a. As shown in steps S043 to S047, by changing the second block 62a that abuts against the substrates S1 and S2 first to sandwich the substrates S1 and S2, the substrates S1 and S2 can be properly aligned.

[0096] Then, it is confirmed whether steps S043 to S047 have been repeated a predetermined number of times (step S048). If the number of times steps S043 to S047 have been repeated has not reached the predetermined number (step S048 is No), then the control unit C drives the second drive unit 65 to retract the pair of second blocks 62a outward in the radial direction towards the outer side of the substrates S1 and S2 (step S049). After the pair of second blocks 62a are retracted, the process returns to step S043 and repeats the process after step S043. If the number of times steps S043 to S047 have been repeated reaches the predetermined number (step S048 is Yes), the process proceeds to step S050. That is, the control unit C drives the second drive unit 65 to repeatedly and alternately perform the actions of sequentially pushing the pair of second blocks 62a onto the outer periphery of the substrates S1 and S2 and retracting them from the outer periphery of the substrates S1 and S2 a predetermined number of times. This action allows substrates S1 and S2 to be properly aligned with a pair of first blocks 61a fixed at positions based on the outer diameter dimensions of substrates S1 and S2.

[0097] Next, the control unit C drives the pin drive unit 68, causing the notched pin 67 to retract radially outward from the substrates S1 and S2, thus retracting from the notch 99 (step S050). Next, the control unit C drives the second drive unit 65, causing a pair of second blocks 62a to retract radially outward from the substrates S1 and S2, thus retracting from the outer peripheral surfaces of the substrates S1 and S2 (step S051). In step S051, for example, both of the pair of second blocks 62a retract simultaneously from the outer peripheral surfaces of the substrates S1 and S2.

[0098] Next, the control unit C drives the first drive unit 64, causing the pair of first blocks 61a to retract radially outward from the outer periphery of substrates S1 and S2 (step S052). In step S052, for example, both of the pair of first blocks 61a retract simultaneously from the outer periphery of substrates S1 and S2. By executing step S052, as... Figure 18 As shown, the first piece 61a and the second piece 62a are now separated from the substrates S1 and S2. This series of actions concludes the alignment process in steps S04 and S08.

[0099] In this way, the alignment device 60 of this embodiment inserts the rotation limiting part 63 into the recess 99 of the substrates S1 and S2, and clamps the substrates S1 and S2 from the direction along the surface of the substrates S1 and S2 by the plurality of blocks 61a and 62a. Therefore, it is possible to align the substrates S1 and S2 while restraining their rotation. As a result, the substrates S1 and S2 can be positioned in the circumferential direction during the alignment of the substrates S1 and S2, so that the substrates S1 and S2 are overlapped with each other with good quality.

[0100] The embodiments and modifications have been described above, but the technical scope of the present invention is not limited to the embodiments and modifications described above. It will be apparent to those skilled in the art that various changes or improvements can be made to the embodiments and modifications described above. Furthermore, such changes or improvements are also included within the technical scope of the present invention. There are instances where one or more technical features described in the embodiments and modifications described above are omitted. Additionally, the technical features described in the embodiments and modifications described above can be appropriately combined. Furthermore, the execution order of the actions shown in the embodiments and modifications can be implemented in any order, as long as the result of the preceding action is not used in the subsequent action. Furthermore, regarding the actions in the above embodiments, even if terms such as "firstly," "next," or "following" are used for convenience, they do not necessarily have to be implemented in this order.

[0101] Furthermore, in the above embodiment, the method of overlapping two substrates S1 and S2 was described as an example, but it is not limited to this method. For example, it is also possible to further overlap other substrates on the substrate S on which substrates S1 and S2 have been overlapped.

[0102] Furthermore, in the above embodiment, when the alignment device 60 positions the substrate S2, the adsorption pad 32 adsorbs and holds the substrate S1, but this is not a limitation. The substrate S1 may also be supported by a plurality of spacers disposed above the substrate support portion 20, which clamp the outer periphery of the substrate S1.

[0103] Explanation of symbols

[0104] 10: Chamber; 20: Substrate support; 30: Upper pressing part; 41: Lifting pin; 60: Alignment device; 61a: First block; 62a: Second block; 63: Rotation limiting part; 64: First block driving part; 65: Second block driving part; 66: Elastic member; 67: Notched pin; 68: Pin driving part; 69: Pin loading member; 99: Notch; 100: Substrate overlapping device.

Claims

1. An alignment device that positions a substrate with a notch formed on its outer periphery, wherein, It includes a substrate support, a rotation limiting part, and multiple blocks. The substrate support portion holds the aforementioned substrate; The rotation limiting part is inserted into the recess of the substrate placed in the substrate support part; The substrate, in which the plurality of blocks are inserted into the recess relative to the aforementioned rotation limiting portion, is clamped in a direction along the surface of the substrate. The aforementioned plurality of blocks includes a pair of first blocks disposed opposite to the rotation limiting portion on the side clamping the substrate; and a pair of second blocks disposed opposite to the pair of first blocks on the side clamping the substrate. The aforementioned pair of second substrates are arranged at intervals in the circumferential direction of the substrate, which is located away from the aforementioned notch, and are configured such that the substrate support portion can move forward and backward in the radial direction of the substrate. The alignment device described above includes a second drive unit that moves the pair of second blocks forward and backward in the radial direction of the substrate. The second driving unit moves the pair of second blocks forward while the pair of first blocks are in contact with the outer periphery of the substrate, pushing the pair of second blocks against the outer periphery of the substrate. The aforementioned second drive unit alternately and repeatedly performs a determined number of push-to-the-outer periphery action and a retraction action from the outer periphery of the substrate on each of the pair of second blocks.

2. The alignment device as claimed in claim 1, wherein, After the second drive unit pushes one of the pair of second blocks to the outer periphery of the substrate, it also pushes the other of the pair of second blocks to the outer periphery of the substrate.

3. An alignment device, wherein the alignment device positions a substrate with a notch formed on its outer periphery, wherein, It includes a substrate support, a rotation limiting part, and multiple blocks. The substrate support portion holds the aforementioned substrate; The rotation limiting part is inserted into the recess of the substrate placed in the substrate support part; The plurality of blocks are clamped into the substrate placed on the substrate support from a direction along the surface of the substrate. The aforementioned plurality of blocks includes a pair of first blocks disposed opposite to the rotation limiting portion on the side clamping the substrate; and a pair of second blocks disposed opposite to the pair of first blocks on the side clamping the substrate. The aforementioned pair of second substrates are arranged at intervals in the circumferential direction of the substrate, which is located away from the aforementioned notch, and are configured such that the substrate support portion can move forward and backward in the radial direction of the substrate. The alignment device described above includes a second drive unit that moves the pair of second blocks forward and backward in the radial direction of the substrate. The second driving unit moves the pair of second blocks forward while the pair of first blocks are in contact with the outer periphery of the substrate, pushing the pair of second blocks against the outer periphery of the substrate. The aforementioned second drive unit alternately and repeatedly performs a determined number of push-to-the-outer periphery action and a retraction action from the outer periphery of the substrate on each of the pair of second blocks.

4. An alignment device, wherein the alignment device positions a substrate with a notch formed on its outer periphery, wherein, It includes a substrate support, a rotation limiting part, and multiple blocks. The substrate support portion holds the aforementioned substrate; The rotation limiting part is inserted into the recess of the substrate placed in the substrate support part; The plurality of blocks are clamped into the substrate placed on the substrate support from a direction along the surface of the substrate. The aforementioned plurality of blocks includes a pair of first blocks disposed opposite to the rotation limiting portion on the side clamping the substrate; and a pair of second blocks disposed opposite to the pair of first blocks on the side clamping the substrate. The aforementioned pair of second substrates are arranged at intervals in the circumferential direction of the substrate, which is located away from the aforementioned notch, and are configured such that the substrate support portion can move forward and backward in the radial direction of the substrate. The alignment device described above includes a second drive unit that moves the pair of second blocks forward and backward in the radial direction of the substrate. The second driving unit moves the pair of second blocks while the pair of first blocks are in contact with the outer periphery of the substrate. After pushing one of the pair of second blocks to the outer periphery of the substrate, it pushes the other of the pair of second blocks to the outer periphery of the substrate. The aforementioned second drive unit alternately and repeatedly performs a determined number of push-to-the-outer periphery action and a retraction action from the outer periphery of the substrate on each of the pair of second blocks.

5. An alignment device, wherein the alignment device positions a substrate with a notch formed on its outer periphery, wherein, It includes a substrate support, a rotation limiting part, and multiple blocks. The substrate support portion holds the aforementioned substrate; The rotation limiting part is inserted into the recess of the substrate placed in the substrate support part; The plurality of blocks are clamped into the substrate placed on the substrate support from a direction along the surface of the substrate. The aforementioned plurality of blocks includes a pair of first blocks disposed opposite to the rotation limiting portion on the side clamping the substrate; and a pair of second blocks disposed opposite to the pair of first blocks on the side clamping the substrate. The aforementioned pair of second substrates are arranged at intervals in the circumferential direction of the substrate, which is located away from the aforementioned notch, and are configured such that the substrate support portion can move forward and backward in the radial direction of the substrate. The alignment device described above includes a second drive unit that moves the pair of second blocks forward and backward in the radial direction of the substrate. The aforementioned second drive unit alternately and repeatedly performs a determined number of push-to-the-outer periphery action and a retraction action from the outer periphery of the substrate on each of the pair of second blocks.

6. An alignment device that positions a substrate with a notch formed on its outer periphery, wherein, It includes a substrate support, a rotation limiting part, and multiple blocks. The substrate support portion holds the aforementioned substrate; The rotation limiting part is inserted into the recess of the substrate placed in the substrate support part; The plurality of blocks are clamped into the substrate placed on the substrate support from a direction along the surface of the substrate. The aforementioned plurality of blocks includes a pair of first blocks disposed opposite to the rotation limiting portion on the side clamping the substrate; and a pair of second blocks disposed opposite to the pair of first blocks on the side clamping the substrate. The aforementioned pair of second substrates are arranged at intervals in the circumferential direction of the substrate, which is located away from the aforementioned notch, and are configured such that the substrate support portion can move forward and backward in the radial direction of the substrate. The alignment device described above includes a second drive unit that moves the pair of second blocks forward and backward in the radial direction of the substrate. The aforementioned rotation limiting part is equipped with a notched pin that can be inserted into the aforementioned recess. Regarding the contact force between the first piece, the second piece, and the notched pin and the outer periphery of the substrate, the contact force increases in the order of the second piece, the first piece, and the notched pin. The aforementioned second drive unit alternately and repeatedly performs a determined number of push-to-the-outer periphery action and a retraction action from the outer periphery of the substrate on each of the pair of second blocks.

7. The alignment device according to any one of claims 1 to 5, wherein, The aforementioned rotation limiting part is equipped with a notched pin that can be inserted into the aforementioned notch.

8. The alignment device as claimed in claim 7, wherein, The notched pin is configured to move in and out radially along the substrate. The alignment device described above includes a pin drive unit that moves the notched pin forward and backward in the radial direction of the substrate.

9. The alignment device as claimed in claim 8, wherein, The aforementioned pin drive unit moves the notched pin in and out of the radial direction of the substrate based on the pre-obtained outer diameter of the substrate.

10. The alignment device as claimed in claim 6, wherein, The aforementioned rotation limiting part includes a pin loading member that loads the aforementioned notched pin toward the radial inward side of the aforementioned substrate.

11. The alignment device according to any one of claims 1 to 6, wherein, The aforementioned pair of first blocks are arranged at intervals in the circumferential direction of the substrate and are configured to be able to move forward and backward in the radial direction of the substrate support portion. The alignment device described above includes a first drive unit that moves the pair of first blocks forward and backward in the radial direction of the substrate.

12. The alignment device according to any one of claims 1 to 6, wherein, The aforementioned pair of second pieces are configured to abut against the aforementioned substrate in the circumferential direction, which clamps the aforementioned notch.

13. The alignment device according to any one of claims 1 to 6, wherein, The aforementioned second drive unit has an elastic member that elastically supports the pair of second blocks so as to push them toward the outer periphery of the aforementioned substrate.

14. The alignment device as claimed in claim 9, wherein, Regarding the contact force between the first piece, the second piece, and the rotation limiting part and the outer periphery of the substrate, the contact force increases in the order of the second piece, the first piece, and the notched pin.

15. A substrate overlapping device, wherein, Equipped with the alignment device, lifting pin, holding part, and upper pressing part as described in claim 1, The lifting pin is provided on the substrate support portion to support the substrate for lifting. The holding part receives and holds the substrate from the lifting pin; The upper pressing part is positioned above the aforementioned substrate support part. By clamping the multiple substrates positioned by the alignment device into the substrate support or the lifting pin and the upper pressing part, the multiple substrates are made to overlap.

16. The substrate overlapping apparatus as claimed in claim 15, wherein, It has a chamber that houses the alignment device, the lifting pin, the holding part, and the upper pressing part.

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