Chip press device and chip press method

Abstract

The application relates to a chip pressing device for pressing a plurality of light-emitting chips on a backboard assembly, the plurality of light-emitting chips comprising first state light-emitting chips electrically connected with the backboard assembly and second state light-emitting chips not electrically connected with the backboard assembly. The chip pressing device comprises a pressing plate, a shooting device and a terminal, the pressing plate is aligned with the backboard assembly and keeps a predetermined interval, a plurality of grooves corresponding to the light-emitting chips are formed on the side of the pressing plate facing the light-emitting chips, and conductive elements and pressing elements are arranged in the grooves. The shooting device cooperates with the terminal to obtain position information of the second state light-emitting chips, the terminal energizes the conductive elements in the grooves corresponding to the second state light-emitting chips according to the position information, drives the pressing elements to extend out of the grooves and press the second state light-emitting chips, so that the second state light-emitting chips are electrically connected with the backboard assembly, and the problem that the light-emitting chips cannot emit light because the light-emitting chips are not electrically connected with the backboard assembly is solved. The application also relates to a chip pressing method.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a chip bonding apparatus and a chip bonding method. Background Technology

[0002] Micro LEDs (Micro Light Emitting Diodes) have broad application prospects due to their advantages such as high brightness, high contrast, high responsiveness, and low power consumption. Furthermore, with the maturation of manufacturing processes and the decrease in prices, Micro LED-related products (such as Micro LED display panels) have become increasingly common in recent years. Currently, achieving mass production of Micro LED display panels requires overcoming several technological bottlenecks, including the mass transfer of Micro LEDs.

[0003] Currently, there are various transfer routes for achieving mass transfer of Micro LEDs within the industry, one of which is the direct transfer route. The direct transfer route involves aligning the wafer with the attached Micro LED chip to a backplane, and then bonding the Micro LED chip and backplane together using anisotropic conductive film (ACF). However, during the direct transfer process, the warping of the wafer and backplane can lead to inconsistent heights of the stripped Micro LED chips on the backplane, and may even prevent some Micro LED chips from achieving electrical connection with the ACF film, thus preventing them from emitting light.

[0004] Therefore, how to achieve a uniform height of Micro LED chips on the backplane after being stripped during the direct transfer process, so as to electrically connect all Micro LED chips to the ACF film, is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a chip bonding apparatus and a chip bonding method, which aims to solve the problem that the light-emitting chips are not electrically connected to the backplane assembly and thus cannot emit light because the height of the light-emitting chips after being peeled off during the direct transfer process is uniform on the backplane assembly.

[0006] A chip bonding apparatus is disclosed for bonding multiple light-emitting chips on a backplane assembly. The multiple light-emitting chips include a first-state light-emitting chip electrically connected to the backplane assembly and a second-state light-emitting chip not electrically connected to the backplane assembly. The chip bonding apparatus includes a bonding plate, an imaging device, and a terminal. The bonding plate is disposed on the side of the light-emitting chip facing away from the backplane assembly and maintains a predetermined distance from the backplane assembly. The imaging device is spaced apart on the side of the bonding plate facing away from the light-emitting chip. The terminal is electrically connected to both the bonding plate and the imaging device. The bonding plate has multiple grooves corresponding to the light-emitting chips on the side facing the light-emitting chips. Each groove contains a conductive element and a bonding element. The imaging device acquires images of the multiple light-emitting chips. The terminal obtains position information of the second-state light-emitting chip on the backplane assembly based on the images and controls the conductive element in the groove corresponding to the second-state light-emitting chip to be energized according to the position information. The bonding element, driven by the conductive element, bonds the second-state light-emitting chip, thereby electrically connecting the second-state light-emitting chip to the backplane assembly.

[0007] The aforementioned chip bonding device includes a bonding plate, an imaging device, and a terminal. The bonding plate has multiple grooves corresponding to the light-emitting chip on its side facing the chip. Each groove contains a conductive element and a bonding element. Therefore, the imaging device, in conjunction with the terminal, obtains the position information of the second-state light-emitting chip on the backplane assembly. The terminal, based on this position information, controls the conductive element in the corresponding groove of the second-state light-emitting chip to be energized, and drives the bonding element to extend out of the groove and bond the second-state light-emitting chip, thereby electrically connecting the second-state light-emitting chip to the backplane assembly. This solves the problem of the light-emitting chip failing to emit light due to not being electrically connected to the backplane assembly.

[0008] Optionally, the conductive element is a heating element, and the pressing element is a thermally expanding material. The heating element is disposed at the bottom of the groove, and the thermally expanding material fills the groove and is located on the side of the heating element opposite to the bottom of the groove. When the heating element is energized, it generates heat, causing the temperature of the thermally expanding material to rise and expand to extend out of the groove to press the second-state light-emitting chip.

[0009] Optionally, the conductive element is two electrodes, and the pressing element is an electrostrictive material. The two electrodes are disposed opposite each other on the peripheral wall of the groove, and the electrostrictive material is filled between the two electrodes. When the two electrodes are energized, they form a corresponding electric field. Under the action of the electric field, the electrostrictive material expands to extend out of the groove to press the second-state light-emitting chip.

[0010] Optionally, the chip bonding device further includes a signal generator. The signal generator is electrically connected between the terminal and the bonding plate, and the terminal controls the signal generator to energize the conductive element in the groove corresponding to the second-state light-emitting chip according to the position information.

[0011] Optionally, the pressing plate further includes a signal transmission unit. The signal transmission unit is disposed within the pressing plate, electrically connected to the signal generator, and electrically connected to each of the conductive elements respectively. The signal generator provides electrical signals to the conductive elements through the signal transmission unit.

[0012] Optionally, the signal transmission unit includes a plurality of first connecting lines spaced apart and a plurality of second connecting lines spaced apart. Each conductive element is simultaneously electrically connected to one first connecting line and one second connecting line, and the first connecting line and the second connecting line directly provide electrical signals to the conductive element.

[0013] Optionally, the signal transmission unit includes a plurality of first connecting lines spaced apart, a plurality of second connecting lines spaced apart, and a plurality of protection circuits. Each conductive element is electrically connected to one of the protection circuits, and each protection circuit is simultaneously electrically connected to one of the first connecting lines, one of the second connecting lines, and a power supply voltage. The first connecting line provides a first electrical signal to the protection circuit, and the second connecting line provides a second electrical signal to the protection circuit. The protection circuit transmits the power supply voltage to the conductive element according to the first electrical signal and the second electrical signal.

[0014] Optionally, the protection circuit includes a first transistor, a second transistor, and a capacitor. The gate of the first transistor is electrically connected to a first connection line, the source of the first transistor is electrically connected to a second connection line, the drain of the first transistor is electrically connected to the gate of the second transistor and a first terminal of the capacitor, the source of the second transistor is electrically connected to the conductive element, and the drain of the second transistor and a second terminal of the capacitor are electrically connected to the power supply voltage.

[0015] Optionally, the backplate assembly includes a first alignment mark disposed on the same side as the light-emitting chip, and the laminating plate includes a second alignment mark disposed on the same side as the groove. The first alignment mark and the second alignment mark are aligned to correspond one-to-one between the position of the groove and the position of the light-emitting chip.

[0016] Optionally, the chip bonding device further includes a first fixing member, a fixing rod, a sliding rod, and a top plate. The first fixing member is disposed on the side of the bonding plate opposite to the groove. One end of the fixing rod is disposed on the side of the first fixing member opposite to the bonding plate. The sliding rod is slidably connected to the other end of the fixing rod opposite to the first fixing member. The end of the sliding rod opposite to the fixing rod is slidably connected to the top plate. The first fixing member fixes the bonding plate. The sliding rod slides relative to the top plate to align the bonding plate with the backplate assembly. The fixing rod slides relative to the sliding rod to maintain the predetermined distance between the bonding plate and the backplate assembly.

[0017] Optionally, the chip bonding apparatus further includes a second fixing member and a stage. The second fixing member fixes the backplane assembly, and the stage carries the second fixing member and the backplane assembly.

[0018] Based on the same inventive concept, this application also provides a chip bonding method, comprising:

[0019] A backplane assembly is provided, the backplane assembly having a plurality of light-emitting chips, wherein the light-emitting chips include a plurality of first-state light-emitting chips electrically connected to the backplane assembly and a plurality of second-state light-emitting chips not electrically connected to the backplane assembly;

[0020] Images of multiple light-emitting chips are acquired, and the position information of the second-state light-emitting chip on the backplane assembly is obtained based on the images;

[0021] Align the pressing plate with the backplate assembly and maintain a predetermined distance. The pressing plate has a plurality of grooves corresponding to the light-emitting chip on the side facing the light-emitting chip. Each groove is provided with a conductive element and a pressing element.

[0022] According to the position information, the conductive element in the groove corresponding to the second state light-emitting chip is energized, and the pressing element extends out of the groove and presses the second state light-emitting chip under the drive of the conductive element, so that the second state light-emitting chip is electrically connected to the backplane assembly.

[0023] Optionally, aligning the press plate with the backplate assembly while maintaining a predetermined distance includes:

[0024] Take alignment images of the first alignment mark of the backplate assembly and the second alignment mark of the lamination plate;

[0025] The distance between the center point of the first alignment mark and the center point of the second alignment mark is obtained from the alignment image;

[0026] The pressing plate is aligned with the back panel assembly according to the distance, and the pressing plate and the back panel assembly are controlled to maintain the predetermined distance.

[0027] The above-described manufacturing method includes: providing a backplane assembly having a plurality of light-emitting chips, wherein the light-emitting chips include a plurality of first-state light-emitting chips electrically connected to the backplane assembly and a plurality of second-state light-emitting chips not electrically connected to the backplane assembly; acquiring images of the plurality of light-emitting chips and obtaining position information of the second-state light-emitting chips on the backplane assembly based on the images; aligning a pressing plate with the backplane assembly while maintaining a predetermined distance, wherein the pressing plate has a plurality of grooves corresponding to the light-emitting chips on the side facing the light-emitting chips, and each groove is provided with a conductive element and a pressing element; controlling the conductive element in the groove corresponding to the second-state light-emitting chip to be energized according to the position information, and the pressing element extends out of the groove and presses the second-state light-emitting chip under the drive of the conductive element, so that the second-state light-emitting chip is electrically connected to the backplane assembly. Therefore, by obtaining the position information of the second-state light-emitting chip on the backplane assembly, and controlling the conductive element in the groove corresponding to the second-state light-emitting chip to be energized according to the position information, and driving the pressing element to extend out of the groove and press the second-state light-emitting chip, the second-state light-emitting chip is electrically connected to the backplane assembly, thus solving the problem that the light-emitting chip cannot emit light because it is not electrically connected to the backplane assembly. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the backplane assembly and light-emitting chip disclosed in the embodiments of this application;

[0029] Figure 2 This is a top view of the backplane assembly and light-emitting chip disclosed in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the chip bonding apparatus disclosed in the embodiments of this application;

[0031] Figure 4 for Figure 3 An enlarged schematic diagram of structure IV-IV in the chip bonding device shown;

[0032] Figure 5 for Figure 3 A bottom view of the pressing plate of the chip pressing device shown;

[0033] Figure 6 This is a schematic diagram of a first structure of the conductive element and the pressing element disclosed in the embodiments of this application;

[0034] Figure 7 This is a schematic diagram of a second structure of the conductive element and the pressing element disclosed in the embodiments of this application;

[0035] Figure 8 This is a schematic diagram of a first structure of the signal transmission unit of the pressing plate disclosed in an embodiment of this application;

[0036] Figure 9 This is a schematic diagram of a second structure of the signal transmission unit of the pressing plate disclosed in the embodiments of this application;

[0037] Figure 10 for Figure 9 An enlarged schematic diagram of the circuit structure X in the signal transmission unit shown;

[0038] Figure 11 This is a schematic flowchart of the chip bonding method disclosed in the embodiments of this application;

[0039] Figure 12 This is a flowchart illustrating step S30 of the chip bonding method disclosed in this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100 - Backsheet assembly;

[0042] 110 - Backplate;

[0043] 130-bonding layer;

[0044] 170 - First alignment mark;

[0045] 300-Light Emitting Chip;

[0046] 300a - First-state light-emitting chip;

[0047] 300b - Second-state light-emitting chip;

[0048] 500-Chip bonding device;

[0049] 510 - Pressed plate;

[0050] 511-groove

[0051] 513-Conductive Components

[0052] 515-Press-in Components

[0053] 518 - Signal transmission unit;

[0054] 518a - First connecting wire;

[0055] 518b - Second connecting wire;

[0056] 518c - Protection Circuit;

[0057] 519 - Second alignment marker;

[0058] 528a - First transistor;

[0059] 528b - Second transistor;

[0060] 528c - Capacitor;

[0061] VDD - Power supply voltage;

[0062] 530 - Filming equipment;

[0063] 550-Terminal;

[0064] 570 - Signal Generator;

[0065] 610 - First fastener;

[0066] 630 - Fixed rod;

[0067] 650-Sliding bar;

[0068] 670 - Top plate;

[0069] 710 - Second fastener;

[0070] 730-Platform;

[0071] Steps of the S10-S40 chip bonding method;

[0072] S31-S33-Step S30. Detailed Implementation

[0073] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0075] Micro LEDs (Micro Light Emitting Diodes) have broad application prospects due to their advantages such as high brightness, high contrast, high responsiveness, and low power consumption. With the maturation of manufacturing processes and the decrease in prices, Micro LED-related products (such as Micro LED display panels) have become increasingly common in recent years. Currently, achieving mass production of Micro LED display panels requires overcoming several technical bottlenecks, including mass transfer of Micro LEDs. There are currently different transfer routes for achieving mass transfer of Micro LEDs in the industry, including a direct transfer route. The direct transfer route involves aligning the wafer with the attached Micro LED chip to a backplane, and then bonding the Micro LED chip and the backplane using anisotropic conductive film (ACF). However, during the direct transfer process, the warping of the wafer and backplane can lead to inconsistent heights of the stripped Micro LED chips on the backplane, and may even prevent some Micro LED chips from achieving electrical connection with the ACF film, thus preventing them from emitting light.

[0076] Based on this, the present application seeks to provide a solution to the above-mentioned technical problems, which can achieve a uniform height of the Micro LED chips after being stripped during the direct transfer process on the backplane, so as to electrically connect all Micro LED chips to the ACF film. The details will be described in subsequent embodiments.

[0077] The chip bonding apparatus and chip bonding method described in detail in this application are as follows.

[0078] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the backplane assembly and light-emitting chip disclosed in the embodiments of this application. Figure 2 This is a top view of the backplane assembly and light-emitting chips disclosed in an embodiment of this application. The backplane assembly 100 provided in this embodiment includes a backplane 110 and a bonding layer 130 stacked together. A plurality of light-emitting chips 300 are arrayed on the side of the bonding layer 130 opposite to the backplane 100, that is, multiple rows and columns of light-emitting chips 300 are disposed on the bonding layer 130. The end of each light-emitting chip 300 facing the bonding layer 130 is embedded within the bonding layer 130.

[0079] In the embodiments of this application, the plurality of light-emitting chips 300 include a plurality of first-state light-emitting chips 300a and a plurality of second-state light-emitting chips 300b. That is, a plurality of first-state light-emitting chips 300a and a plurality of second-state light-emitting chips 300b are disposed on the side of the bonding layer 130 opposite to the backplate 100.

[0080] In an exemplary embodiment, when the bonding layer 130 is energized, the first-state light-emitting chip 300a emits light, while the second-state light-emitting chip 300b does not emit light. That is, the first-state light-emitting chip 300a is electrically connected to the bonding layer 130, while the second-state light-emitting chip 300b is not electrically connected to the bonding layer 130.

[0081] In an exemplary embodiment, the end of the second state-emitting chip 300b facing away from the bonding layer 130 is higher than the end of the first state-emitting chip 300a facing away from the bonding layer 130. That is, the embedding depth of the first state-emitting chip 300a within the bonding layer 130 is greater than the embedding depth of the second state-emitting chip 300b.

[0082] In an exemplary embodiment, the bonding layer 130 contains uniformly distributed conductive particles, each covered with an insulating film. When the conductive particles are pressed, the insulating film on their surface breaks, transforming them into conductors. It is understood that because the embedding depth of the second-state light-emitting chip 300b is insufficient, the pressure exerted by the second-state light-emitting chip 300b on the conductive particles is insufficient to cause the insulating film on the surface of the conductive particles to break and become conductive. Therefore, although the second-state light-emitting chip 300b is embedded in the bonding layer 130, due to insufficient embedding depth, the second-state light-emitting chip 300b is not electrically connected to the bonding layer 130, and thus does not emit light.

[0083] Please see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the chip bonding apparatus disclosed in the embodiments of this application. Figure 4 for Figure 3The diagram shows an enlarged view of structure IV-IV in the chip bonding apparatus. The chip bonding apparatus 500 may include at least a bonding plate 510, an imaging device 530, and a terminal 550. The bonding plate 510 is disposed on the side of the light-emitting chip 300 facing away from the backplate assembly 100 and maintains a predetermined distance from the backplate assembly 100. The terminal 550 is electrically connected to both the bonding plate 510 and the imaging device 530. The bonding plate 510 has a plurality of grooves 511 corresponding one-to-one with the light-emitting chip 300 on the side facing the light-emitting chip 300. Each groove 511 contains a conductive element 513 and a bonding element 515. The imaging device 530 is located above the side of the pressing plate 510 facing away from the light-emitting chip 300, and is used to acquire images of multiple light-emitting chips 300. The terminal 550 obtains the position information of the second-state light-emitting chip 300b on the backplate assembly 100 based on the image, and controls the conductive element 513 in the groove 511 corresponding to the second-state light-emitting chip 300b to be energized based on the position information. The pressing element 515 extends out of the groove 511 under the drive of the conductive element 513 and presses the second-state light-emitting chip 300b, so that the second-state light-emitting chip 300b is electrically connected to the bonding layer 130, that is, the second-state light-emitting chip 300b is electrically connected to the backplate assembly 100.

[0084] In this embodiment of the application, the chip pressing device 500 further includes a signal generator 570, which is electrically connected between the terminal 550 and the pressing plate 510. The terminal 550 controls the signal generator 570 to energize the conductive element 513 in the groove 511 corresponding to the second state light-emitting chip 300b according to the position information.

[0085] It is understood that the signal generator 570 is electrically connected to each of the conductive elements 513 of the pressing plate 510, so that the terminal 550 can control whether each conductive element 513 is energized individually or synchronously through the signal generator 570, thereby reducing the operating cost of the chip pressing device 500 and simplifying the process of the terminal 550 controlling the energization of the conductive elements 513.

[0086] It is understood that the back panel assembly 100 is powered on before the imaging device 530 acquires images of the multiple light-emitting chips 300. At this time, the back panel assembly 100 has multiple first-state light-emitting chips 300a (emitting light after being powered on) and multiple second-state light-emitting chips 300b (not emitting light after being powered on). The imaging device 530 sends the acquired images of the multiple light-emitting chips 300 to the terminal 550. The terminal 550 has an image recognition function. The terminal 550 uses the image recognition function to filter out the first-state light-emitting chips 300a and second-state light-emitting chips 300b corresponding to the images, and then obtains the corresponding position information of the second-state light-emitting chips 300b on the back panel assembly 100. The terminal 550 controls the signal generator 570 to energize the conductive element 513 in the groove 511 corresponding to the second-state light-emitting chip 300b according to the position information. The conductive element 513 drives the pressing element 515 to extend out of the groove 511 to press the second-state light-emitting chip 300b, so that the second-state light-emitting chip 300b is electrically connected to the bonding layer 130, that is, the light-emitting chip 300 on the backplane assembly 100 in the non-light-emitting state is electrically connected to the bonding layer 130, and then becomes light-emitting after being energized.

[0087] In an exemplary embodiment, the image recognition function can filter out the first state light-emitting chip 300a and the second state light-emitting chip 300b in the image based on the grayscale level of the image. The image recognition function can obtain the position information of the second state light-emitting chip 300b on the backplane assembly 100 based on the number of pixels between the first state light-emitting chip 300a and the second state light-emitting chip 300b in the image.

[0088] In an exemplary embodiment, the imaging device 530 may be a charge-coupled device (CCD) camera, a complementary metal-oxide-semiconductor (CMOS) camera, a digital camera, an SLR camera, a mirrorless camera, or any device with imaging capabilities; this application does not impose specific limitations on this. The terminal 550 may be a laptop computer, a tablet computer, a computer, a workstation, or any device with image recognition software installed; this application does not impose specific limitations on this.

[0089] In an exemplary embodiment, the signal generator 570 and the terminal 550 can be two independent devices. The signal generator 570 can also be integrated into the terminal 550, that is, after the terminal 550 filters out the first state light-emitting chip 300a and the second state light-emitting chip 300b, it also energizes the conductive element 513 in the groove 511 corresponding to the second state light-emitting chip 300b according to the position information of the second state light-emitting chip 300b.

[0090] In an exemplary embodiment, the grooves 511 are positioned on the pressing plate 510 in a one-to-one correspondence with the positions of the light-emitting chips 300, that is, the pressing plate 510 has multiple rows and columns of grooves 511 on the side facing the light-emitting chips 300.

[0091] In an exemplary implementation, please refer to Figure 2 and Figure 5 , Figure 5 for Figure 3 The diagram shows a bottom view of the pressing plate of the chip pressing device. The backplate assembly 100 includes a first alignment mark 170 disposed on the same side as the light-emitting chip 300, and the pressing plate 510 includes a second alignment mark 519 disposed on the same side as the groove 511. The first alignment mark 170 and the second alignment mark 519 are aligned to correspond the position of the groove 511 to the position of the light-emitting chip 300.

[0092] In an exemplary embodiment, the number of the first alignment marks 170 may be multiple, and correspondingly, the number of the second alignment marks 519 may also be multiple. In this embodiment, an example is given where the number of both the first alignment marks 170 and the second alignment marks 519 is two. Both first alignment marks 170 are disposed at the periphery of the back panel assembly 100, and both second alignment marks 519 are disposed at the periphery of the pressing plate 510.

[0093] It is understood that the periphery of the back panel assembly 100 and the periphery of the pressing plate 510 have good transparency. The first pair of marks 170 are disposed at the periphery of the back panel assembly 100 and the second alignment mark 170 is disposed at the periphery of the pressing plate 510, so as to facilitate observation of the alignment of the second pair of marks 519 and the first alignment mark 170.

[0094] In summary, the chip bonding apparatus 500 provided in this application embodiment includes a bonding plate 510, an imaging device 530, and a terminal 550. The bonding plate 510 is disposed on the side of the light-emitting chip 300 facing away from the backplate assembly 100 and maintains a predetermined distance from the backplate assembly 100. The terminal 550 is electrically connected to the bonding plate 510 and the imaging device 530, respectively. The side of the bonding plate 510 facing the light-emitting chip 300 has a plurality of grooves 511 corresponding one-to-one with the light-emitting chip 300. Each groove 511 is provided with a conductive element 513 and a bonding element 515. The imaging device 530 is located above the side of the pressing plate 510 facing away from the light-emitting chip 300, and is used to acquire images of multiple light-emitting chips 300. The terminal 550 obtains the position information of the second-state light-emitting chip 300b on the back plate assembly 100 based on the image, and controls the conductive element 513 in the groove 511 corresponding to the second-state light-emitting chip 300b to be energized based on the position information. The pressing element 515 extends out of the groove 511 under the drive of the conductive element 513 and presses the second-state light-emitting chip 300b, so that the second-state light-emitting chip 300b is electrically connected to the bonding layer 130. Therefore, the imaging device 530, in cooperation with the terminal 550, obtains the position information of the second-state light-emitting chip 300b on the backplane assembly 100. Based on this position information, the terminal 550 controls the conductive element 513 within the corresponding groove 511 of the second-state light-emitting chip 300b to be energized, and drives the pressing element 515 to extend out of the groove 511 and press the second-state light-emitting chip 300b. This solves the problem that the light-emitting chip 300 cannot emit light because it is not electrically connected to the bonding layer 130.

[0095] In one embodiment of this application, please refer to Figure 6 , Figure 6 This is a schematic diagram of a first structure of the conductive element and the pressing element disclosed in this application. The conductive element 513 may be a heating element, and the pressing element 515 may be a thermally expanding material. The heating element is disposed at the bottom of the groove 511, and the thermally expanding material is filled into the groove 511 and located on the side of the heating element opposite to the bottom of the groove 511. When the heating element is energized, it generates heat and conducts the heat to the thermally expanding material. The temperature of the thermally expanding material rises and it expands to extend out of the groove 511 and presses against the non-emitting light-emitting chip (i.e., the second-state light-emitting chip 300b), so that the light-emitting chip 300 in the non-emitting state on the backplate assembly 100 is electrically connected to the bonding layer 130, and then emits light when energized.

[0096] In an exemplary embodiment, the surface of the thermal expansion material facing away from the heating element may be flush with the opening of the groove 511.

[0097] In exemplary embodiments, the heating element may be a resistance wire, ceramic, semiconductor, infrared heater, or any element that generates heat when energized, etc., and this application does not impose specific limitations on it. The thermal expansion material may be magnesium oxide, forsterite (Mg2SiO4), aluminum oxide, stabilized zirconium oxide (ZrO2), enstatite (MgSiO3), thorium dioxide, beryllium oxide (BeO), spinel (MgAl2O4), or chrysoberyl (BeAl2O4), etc., and this application does not impose specific limitations on it.

[0098] In another embodiment of this application, please refer to Figure 7 , Figure 7 This is a schematic diagram of a second structure of the conductive element and the bonding element disclosed in this application. The conductive element 513 may be two electrodes, and the bonding element 515 may be an electrostrictive material. The two electrodes are disposed opposite each other on the peripheral wall of the groove 511, and the electrostrictive material fills the space between the two electrodes. When the two electrodes are energized, a corresponding electric field is formed. Under the action of the electric field, the electrostrictive material expands to extend out of the groove 511 and presses against the non-emitting light-emitting chip (i.e., the second-state light-emitting chip 300b), so that the light-emitting chip 300 in the non-emitting state on the backplane assembly 100 is electrically connected to the bonding layer 130, and then emits light when energized.

[0099] In an exemplary embodiment, the end face of the electrode facing away from the bottom of the groove 511 may be flush with the opening of the groove 511 and the surface of the electrostrictive material facing away from the bottom of the groove 511.

[0100] In an exemplary embodiment, the electrostrictive material may be a silicone rubber oligomer, a polyurethane oligomer, an acrylate rubber oligomer, or a composite of any of the aforementioned materials with inorganic micro / nano materials, etc., and this application does not impose any specific limitations on it.

[0101] Please refer again to the embodiments described in this application. Figure 4The pressing plate 510 further includes a signal transmission unit 518, which is disposed within the pressing plate 510. The signal transmission unit 518 is electrically connected to the signal generator 570 and to each of the conductive elements 513. The signal generator 570 energizes the conductive elements 513 through the signal transmission unit 518, meaning that the signal generator 570 can individually control each conductive element 513 through the signal transmission unit 518. This allows for accurate and reliable energization of the conductive elements 513 within the groove 511 corresponding to the second-state light-emitting chip 300b, thus the signal transmission unit 518 has an addressing function.

[0102] In one embodiment of this application, please refer to Figure 8 , Figure 8 This is a schematic diagram of a first structural embodiment of the signal transmission unit of the laminating plate disclosed in this application. The signal transmission unit 518 includes a plurality of first connecting lines 518a spaced apart and a plurality of second connecting lines 518b spaced apart. Each conductive element 513 is electrically connected to both one first connecting line 518a and one second connecting line 518b. The first connecting lines 518a and the second connecting lines 518b are used to provide electrical signals to the conductive elements 513.

[0103] In an exemplary embodiment, the number of the first connecting lines 518a may be the same as the number of rows of the conductive elements 513 within the groove 511, and the number of the second connecting lines 518b may be the same as the number of columns of the conductive elements 513 within the groove 511. In other embodiments of this application, the number of the first connecting lines 518a may be the same as the number of columns of the conductive elements 513, and the number of the second connecting lines 518b may be the same as the number of rows of the conductive elements 513; this application does not impose specific limitations in this regard.

[0104] In an exemplary embodiment, among the plurality of conductive elements 513 in the same row, each conductive element 513 is electrically connected to the same first connecting line 518a, and each conductive element 513 is electrically connected to second connecting lines 518b in different columns. In the plurality of conductive elements 513 in the same column, each conductive element 513 is electrically connected to the same second connecting line 518b, and each conductive element 513 is electrically connected to the first connecting line 518a in different rows.

[0105] It is understood that if the conductive element 513 is the heating element, one end of the heating element is electrically connected to the first connecting line 518a, and the other end of the heating element is electrically connected to the second connecting line 518b. If the conductive element 513 consists of two electrodes, one electrode is electrically connected to the first connecting line 518a, and the other electrode is electrically connected to the second connecting line 518b.

[0106] It is understood that, in the first connecting line 518a and the second connecting line 518b electrically connected to the conductive element 513, the conductive element 513 is energized only when the first connecting line 518a is at a high potential and the second connecting line 518b is at a low potential, or when the first connecting line 518a is at a low potential and the second connecting line 518b is at a high potential. Therefore, individual control of each conductive element 513 is achieved, allowing the signal generator 570 to accurately energize the conductive element 513 within the groove 511 corresponding to the second state light-emitting chip 300b.

[0107] In an exemplary embodiment, the conductive element 513 is directly powered through the first connecting line 518a and the second connecting line 518b, which makes the circuit structure of the signal transmission unit 518 relatively simple, simplifies the manufacturing process of the signal transmission unit 518, and reduces the manufacturing cost of the signal transmission unit 518.

[0108] In another embodiment of this application, please refer to Figure 9 , Figure 9 This is a schematic diagram of a second structure of the signal transmission unit for the laminating plate disclosed in this application. The signal transmission unit 518 includes a plurality of first connecting lines 518a spaced apart, a plurality of second connecting lines 518b spaced apart, and a plurality of protection circuits 518c. Each conductive element 513 is electrically connected to one of the protection circuits 518c. Each protection circuit 518c is simultaneously electrically connected to the first connecting line 518a, the second connecting line 518b, and the power supply voltage VDD. The first connecting line 518a provides a first electrical signal to the protection circuit 518c, and the second connecting line 518b provides a second electrical signal to the protection circuit 518c. The protection circuit 518c transmits the power supply voltage VDD to the conductive element 513 according to the first and second electrical signals, thereby energizing the conductive element 513.

[0109] In an exemplary embodiment, the number of first connecting lines 518a may be the same as the number of rows of the conductive elements 513, the number of second connecting lines 518b may be the same as the number of columns of the conductive elements 513, and the number of protection circuits 518c may be the same as the number of conductive elements 513. In other embodiments of this application, the number of first connecting lines 518a may be the same as the number of columns of the conductive elements 513, and the number of second connecting lines 518b may be the same as the number of rows of the conductive elements 513. This application does not impose specific limitations on this.

[0110] It is understood that, among the multiple conductive elements 513 in the same row, each conductive element 513 is connected to a protection circuit 518c, and the multiple protection circuits 518c in the same row are simultaneously electrically connected to the same first connecting line 518a. Furthermore, the multiple protection circuits 518c in the same row are also electrically connected to different second connecting lines 518b. Similarly, among the multiple conductive elements 513 in the same column, each conductive element 513 is connected to a protection circuit 518c, and the multiple protection circuits 518c in the same column are simultaneously electrically connected to the same second connecting line 518b. Furthermore, the multiple protection circuits 518c in the same column are also electrically connected to different first connecting lines 518a.

[0111] It is understood that if the conductive element 513 is the heating element, one end of the heating element is electrically connected to the protection circuit 518c, and the other end of the heating element is grounded. If the conductive element 513 consists of two electrodes, one electrode is electrically connected to the protection circuit 518c, and the other electrode is grounded.

[0112] In an exemplary embodiment, the power supply voltage VDD may be provided by the signal generator 570.

[0113] In an exemplary implementation, please refer to Figure 10 , Figure 10 for Figure 9 The diagram shows an enlarged view of the circuit structure X in the signal transmission unit. The protection circuit 518c includes a first transistor 528a, a second transistor 528b, and a capacitor 528c. The gate of the first transistor 528a is electrically connected to the first connection line 518a, the source of the first transistor 528a is electrically connected to the second connection line 518b, the drain of the first transistor 528a is electrically connected to the gate of the second transistor 528b and the first terminal of the capacitor 528c, the source of the second transistor 528b is electrically connected to the conductive element 513, and the drain of the second transistor 528b and the second terminal of the capacitor 528c are electrically connected to the power supply voltage VDD.

[0114] It is understood that the signal generator 570 outputs the first electrical signal to the first connection line 518a and the second electrical signal to the second connection line 518b. The first electrical signal is transmitted to the gate of the first transistor 528a, causing the source and drain of the first transistor 528a to conduct. The second electrical signal is transmitted to the gate of the second transistor 528b, causing the source and drain of the second transistor 528b to conduct. That is, the power supply voltage VDD is electrically connected to the conductive element 513, realizing the energization of the conductive element 513. The second electrical signal is also used to charge the capacitor 528c, so that after the first and second electrical signals stop, the source and drain of the second transistor 528b remain conducting, that is, the conductive element 513 continues to be energized.

[0115] In an exemplary embodiment, both the first electrical signal and the second electrical signal can be at a high level.

[0116] It is understood that in the first connecting line 518a and the second connecting line 518b, which are electrically connected to the protection circuit 518c, the conductive element 513 is only turned on by the power supply voltage VDD when both the first electrical signal provided by the first connecting line 518a and the second electrical signal provided by the second connecting line 518b are at a high level. Therefore, individual control of each conductive element 513 is achieved, allowing the signal generator 570 to accurately energize the conductive element 513 in the groove 511 corresponding to the second state light-emitting chip 300b.

[0117] It is also understood that the protection circuit 518c can be configured as a switching circuit, receiving the first electrical signal provided by the first connecting line 518a and the second electrical signal provided by the second connecting line 518b. This avoids excessive voltage supplied directly to the conductive element 513 by the signal transmission unit 518, which could lead to excessive load or leakage in the signal transmission unit 518. The second electrical signal charges the capacitor 528c, improving the efficiency of pressing the second-state light-emitting chip 300b. When the first and second electrical signals stop, the conductive element 513 remains energized. At this time, the signal generator 570 controls another conductive element 513 to be energized, meaning the generator 570 can simultaneously control multiple conductive elements 513 to be energized, thereby improving the efficiency of pressing the second-state light-emitting chip 300b.

[0118] Please refer again to the embodiments described in this application. Figure 3The pressing device 500 further includes a first fixing member 610, a fixing rod 630, a sliding rod 650, and a top plate 670. The first fixing member 610 is disposed on the side of the pressing plate 510 opposite to the groove 511. The fixing rod 630 is disposed on the side of the first fixing member 610 opposite to the pressing plate 510. The sliding rod 650 is slidably connected to one end of the fixing rod 630 opposite to the first fixing member 610, and the other end of the sliding rod 650 opposite to the fixing rod 630 is slidably connected to the top plate 670. The first fixing member 610 fixes the pressing plate 510, and the sliding rod 650 slides relative to the top plate 670 to align the pressing plate 510 with the back plate assembly 100, that is, aligning the second alignment mark 519 of the pressing plate 510 with the first alignment mark 170 of the back plate assembly 100. The fixing rod 630 slides relative to the sliding rod 650 to maintain the predetermined distance between the pressing plate 510 and the back plate assembly 100.

[0119] It is understood that the fixing rod 630 cooperates with the sliding rod 650 to form a telescopic structure, allowing the fixing rod 630 to drive the first fixing member 610 and the pressing plate 510 to move towards or away from the back panel assembly 100. In an exemplary embodiment, the sliding direction of the fixing rod 630 relative to the sliding rod 650 is the direction in which the pressing plate 510 faces or moves away from the back panel assembly 100. The sliding direction of the sliding rod 650 relative to the top plate 670 is perpendicular to the sliding direction of the fixing rod 630.

[0120] Understandably, the imaging device 530 captures alignment images of the first alignment mark 170 and the second alignment mark 519. The terminal 550 determines the distance between the center point of the first alignment mark 170 and the center point of the second alignment mark 519 based on the alignment images, and controls the sliding rod 650 to slide relative to the top plate 670, thereby causing the pressing plate 510 to translate. The above steps can be repeated multiple times until the center point of the first alignment mark 170 and the center point of the second alignment mark 519 are aligned.

[0121] In an exemplary embodiment, the side of the pressing plate 510 facing away from the groove 511 is embedded in the first fixing member 610, and the side of the pressing plate 510 with the groove 511 is exposed above the first fixing member 610. The first fixing member 610 and the pressing plate 510 can be fixed by a detachable connection method such as snap-fit ​​connection, bolt connection, or spring clip pressing.

[0122] In an exemplary embodiment, the top plate 670 is also used to fix the shooting device 530.

[0123] In this embodiment of the application, the chip bonding device 500 further includes a second fixing member 710 and a stage 730. The second fixing member 710 is disposed on one side of the stage 730 and is used to fix the backplane assembly 100. The stage 730 carries the second fixing member 710 and the backplane assembly 100.

[0124] In an exemplary embodiment, the side of the backplate assembly 100 facing away from the light-emitting chip 300 is embedded in the second fixing member 710, and the side of the backplate assembly 100 with the light-emitting chip protrudes from the second fixing member 710, so that the light-emitting chip 300 is exposed. The second fixing member 710 and the backplate assembly 100 can be fixed by a detachable connection method such as snap-fit ​​connection, bolt connection, or spring clip pressing.

[0125] In summary, the chip bonding apparatus 500 provided in this application embodiment includes a bonding plate 510, an imaging device 530, and a terminal 550. The bonding plate 510 is disposed on the side of the light-emitting chip 300 facing away from the backplate assembly 100 and maintains a predetermined distance from the backplate assembly 100. The terminal 550 is electrically connected to the bonding plate 510 and the imaging device 530, respectively. The side of the bonding plate 510 facing the light-emitting chip 300 has a plurality of grooves 511 corresponding one-to-one with the light-emitting chip 300. Each groove 511 is provided with a conductive element 513 and a bonding element 515. The imaging device 530 is located above the side of the pressing plate 510 facing away from the light-emitting chip 300, and is used to acquire images of multiple light-emitting chips 300. The terminal 550 obtains the position information of the second-state light-emitting chip 300b on the backplane assembly 100 based on the images, and controls the conductive element 513 in the corresponding groove 511 of the second-state light-emitting chip 300b to be energized according to the position information. The pressing element 515 extends out of the groove 511 under the drive of the conductive element 513 and presses the second-state light-emitting chip 300b, so that the second-state light-emitting chip 300b is electrically connected to the bonding layer 130. The chip pressing device 500 also includes a signal generator 570, which is electrically connected between the terminal 550 and the pressing plate 510. The terminal 550 controls the signal generator 570 to energize the conductive element 513 in the corresponding groove 511 of the second-state light-emitting chip 300b according to the position information. Therefore, the imaging device 530, in cooperation with the terminal 550, obtains the position information of the second-state light-emitting chip 300b on the backplane assembly 100. Based on this position information, the terminal 550 controls the conductive element 513 within the corresponding groove 511 of the second-state light-emitting chip 300b to be energized, and drives the pressing element 515 to extend out of the groove 511 and press the second-state light-emitting chip 300b. This solves the problem that the light-emitting chip 300 cannot emit light because it is not electrically connected to the bonding layer 130.

[0126] Based on the same inventive concept, this application also provides a chip bonding method, wherein the chip bonding method comprises the above-described... Figures 1 to 10 The chip bonding apparatus 500 of the illustrated embodiment is used for execution. For a description of the similarities between the chip bonding method and the chip bonding apparatus 500, please refer to the description of the chip bonding apparatus 500; it will not be repeated here. Please refer to... Figure 11 , Figure 11 This is a schematic flowchart of the chip bonding method disclosed in the embodiments of this application. The chip bonding method may include at least the following steps.

[0127] S10. A backplane assembly is provided, the backplane assembly having a plurality of light-emitting chips, wherein the light-emitting chips include a plurality of first-state light-emitting chips electrically connected to the backplane assembly and a plurality of second-state light-emitting chips not electrically connected to the backplane assembly.

[0128] Specifically, in this embodiment of the application, the back panel assembly 100 is fixed by the second fastener 710 and the power supply is turned on to the back panel assembly 100. At this time, the back panel assembly 100 has a plurality of first state light-emitting chips 300a (light-emitting after being powered on) and a plurality of second state light-emitting chips 300b (not light-emitting after being powered on).

[0129] In an exemplary embodiment, the backplane assembly 100 includes a backplane 110 and a bonding layer 130 stacked together, and a plurality of first-state light-emitting chips 300a and a plurality of second-state light-emitting chips 300b are disposed on the side of the bonding layer 130 opposite to the backplane 100.

[0130] It is understood that the first-state light-emitting chip 300a is electrically connected to the bonding layer 130, while the second-state light-emitting chip 300b is not electrically connected to the bonding layer 130. The embedding depth of the first-state light-emitting chip 300a within the bonding layer 130 is greater than the embedding depth of the second-state light-emitting chip 300b. Due to insufficient embedding depth, the second-state light-emitting chip 300b is not electrically connected to the bonding layer 130.

[0131] S20. Acquire images of the plurality of light-emitting chips, and obtain the position information of the second-state light-emitting chip on the backplane assembly based on the images.

[0132] Specifically, in this embodiment, an imaging device 530 acquires images of multiple light-emitting chips 300, and a terminal 550 obtains the position information of the second-state light-emitting chip 300b on the backplane assembly 100 based on the images. In this embodiment, the imaging device 530 captures images of multiple light-emitting chips 300 and sends them to the terminal 550. The terminal 550 has an image recognition function. The terminal 550 uses this function to filter out the first-state light-emitting chip 300a and the second-state light-emitting chip 300b corresponding to the images, and then obtains the corresponding position information of the second-state light-emitting chip 300b on the backplane assembly 100.

[0133] S30. Align the pressing plate with the backplate assembly and maintain a predetermined distance, wherein the side of the pressing plate facing the light-emitting chip has a plurality of grooves corresponding to the light-emitting chip, and each groove is provided with a conductive element and a pressing element.

[0134] S40. According to the position information, the conductive element in the groove corresponding to the second state light-emitting chip is energized, and the pressing element extends out of the groove and presses the second state light-emitting chip under the drive of the conductive element, so that the second state light-emitting chip is electrically connected to the backplane assembly.

[0135] Specifically, in this embodiment, the terminal 550 controls the conductive element 513 in the groove 511 corresponding to the second state light-emitting chip 300b to be energized according to the position information, and the pressing element 515 extends out of the groove 511 and presses the second state light-emitting chip 300b under the drive of the conductive element 513, so that the second state light-emitting chip 300b is electrically connected to the backplane assembly 100.

[0136] In one embodiment of this application, the conductive element 513 may be a heating element, and the pressing element 515 may be a thermally expanding material. The heating element is disposed at the bottom of the groove 511, and the thermally expanding material is filled into the groove 511 and located on the side of the heating element opposite to the bottom of the groove 511. When the heating element is energized, it generates heat and conducts the heat to the thermally expanding material. The temperature of the thermally expanding material rises and it expands to extend out of the groove 511 and presses against the second-state light-emitting chip 300b.

[0137] In exemplary embodiments, the heating element may be a resistance wire, ceramic, semiconductor, infrared heater, or any element that generates heat when energized, etc., and this application does not impose specific limitations on it. The thermal expansion material may be magnesium oxide, forsterite (Mg2SiO4), aluminum oxide, stabilized zirconium oxide (ZrO2), enstatite (MgSiO3), thorium dioxide, beryllium oxide (BeO), spinel (MgAl2O4), or chrysoberyl (BeAl2O4), etc., and this application does not impose specific limitations on it.

[0138] In another embodiment of this application, the conductive element 513 may be two electrodes, and the pressing element 515 may be an electrostrictive material. The two electrodes are disposed opposite each other on the peripheral wall of the groove 511, and the electrostrictive material fills the space between the two electrodes. When the two electrodes are energized, a corresponding electric field is formed. Under the action of the electric field, the electrostrictive material expands to extend out of the groove 511 and presses against the second-state light-emitting chip 300b. In an exemplary embodiment, the electrostrictive material may be a silicone rubber oligomer, a polyurethane oligomer, an acrylate rubber oligomer, or any of the aforementioned materials combined with inorganic micro / nanomaterials, etc. This application does not impose specific limitations on this.

[0139] Please see Figure 12 , Figure 12 This is a flowchart illustrating step S30 of the chip bonding method disclosed in this application. Step S30 may include at least the following steps.

[0140] S31. Take an alignment image of the first alignment mark of the backplate assembly and the second alignment mark of the press plate.

[0141] Specifically, in this embodiment of the application, the imaging device 530 captures an alignment image of the first alignment mark 170 of the back panel assembly 100 and the second alignment mark 519 of the pressing plate 510.

[0142] In this embodiment, the focal length of the imaging device 530 is adjusted to capture an alignment image of the first alignment mark 170 of the back panel assembly 100 and the second alignment mark 519 of the pressing plate 510, and the alignment image is sent to the terminal 550. While keeping the focal length of the imaging device constant, a calibration image is captured and sent to the terminal 550. Since the focal lengths of the alignment image and the calibration image are the same, the actual length corresponding to each pixel in the calibration image is the same as the actual length corresponding to each pixel in the alignment image.

[0143] In an exemplary embodiment, the first pair of markings 170 are disposed at the periphery of the back panel assembly 100, and the second alignment markings 170 are disposed at the periphery of the pressing plate 510.

[0144] S32. Obtain the distance between the center point of the first alignment mark and the center point of the second alignment mark based on the alignment image.

[0145] Specifically, in this embodiment of the application, the distance between the center point of the first alignment mark 170 and the center point of the second alignment mark 519 is obtained by the terminal 550 based on the alignment image.

[0146] In this embodiment, the terminal 550 obtains the length corresponding to a pixel in the calibration image through the image recognition function. Then, the terminal 550 obtains the number of pixels at the center point of the first alignment mark 170 and the center point of the second alignment mark 519 based on the alignment image using the image recognition function. The distance between the center points of the first alignment mark 170 and the second alignment mark 519 is obtained based on the length corresponding to a pixel and the number of pixels.

[0147] S33. Align the pressing plate with the back plate assembly according to the distance, and control the pressing plate and the back plate assembly to maintain a predetermined distance.

[0148] Specifically, in this embodiment of the application, the terminal 550 controls the sliding rod 650 to move according to the distance to align the pressing plate 510 with the back panel assembly 100, and the terminal 550 controls the fixing rod to maintain a predetermined distance between the pressing plate 510 and the back panel assembly 100.

[0149] In this embodiment, the chip bonding device 500 includes a first fixing member 610, a fixing rod 630, a sliding rod 650, and a top plate 670. The first fixing member 610 is disposed on the side of the bonding plate 510 opposite to the groove 511. The fixing rod 630 is disposed on the side of the first fixing member 610 opposite to the bonding plate 510. The sliding rod 650 is slidably connected to one end of the fixing rod 630 opposite to the first fixing member 610, and the other end of the sliding rod 650 opposite to the fixing rod 630 is slidably connected to the top plate 670. The sliding rod 650 slides relative to the top plate 670, thereby causing the fixing rod 630, the first fixing member 610, and the bonding plate 510 to slide relative to the top plate 670, until the bonding plate 510 is aligned with the backplate assembly 100. The fixing rod 630 slides relative to the sliding rod 650 to drive the first fixing member 610 and the pressing plate 510 to move toward facing or away from the back panel assembly 100, so that the pressing plate 510 and the back panel assembly 100 maintain a predetermined distance.

[0150] It is understood that the predetermined spacing can be determined based on the height of the light-emitting chip 300, the length of the pressing element 515 extending out of the groove 511, and the spacing between the light-emitting chip 300 and the pressing plate 510. The predetermined spacing can be from 500um to 1500um, for example, 500um, 600um, 720um, 975um, 1000um, 1240um, 1390um, 1500um, or other values, and this application does not impose specific limitations on it.

[0151] It is understood that the pressing plate 510 is aligned with the back plate assembly 100, that is, the groove 511 corresponds one-to-one with the light-emitting chip 300, that is, the center point of the first alignment mark 170 is aligned with the center point of the second alignment mark 519.

[0152] In summary, the chip bonding method provided in this application includes: providing a backplane assembly 100, wherein the backplane assembly 100 has a plurality of light-emitting chips 300, wherein the light-emitting chips 300 include a plurality of first-state light-emitting chips 300a electrically connected to the backplane assembly 100 and a plurality of second-state light-emitting chips 300b not electrically connected to the backplane assembly 100; acquiring images of the plurality of light-emitting chips 300, and obtaining position information of the second-state light-emitting chips 300b on the backplane assembly 100 based on the images; aligning a bonding plate 510 with the backplane assembly 100 while maintaining a predetermined distance. The pressing plate 510 has multiple grooves 511 corresponding to the light-emitting chip 300 on its side facing the light-emitting chip 300. Each groove 511 contains a conductive element 513 and a pressing element 515. Based on the position information, the conductive element 513 in the groove 511 corresponding to the second-state light-emitting chip 300b is energized. Driven by the conductive element 513, the pressing element 515 extends out of the groove 511 and presses against the second-state light-emitting chip 300b, thus electrically connecting the second-state light-emitting chip 300b to the back panel assembly 100. Therefore, the imaging device 530, in cooperation with the terminal 550, obtains the position information of the second-state light-emitting chip 300b on the back panel assembly 100. The terminal 550, based on the position information, energizes the conductive element 513 in the groove 511 corresponding to the second-state light-emitting chip 300b and drives the pressing element 515 to extend out of the groove 511 and press against the second-state light-emitting chip 300b. This solves the problem that the light-emitting chip 300 cannot emit light because it is not electrically connected to the bonding layer 130.

[0153] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A chip bonding apparatus for bonding a plurality of light-emitting chips on a backplane assembly, wherein the plurality of light-emitting chips includes a first-state light-emitting chip electrically connected to the backplane assembly and a second-state light-emitting chip not electrically connected to the backplane assembly, characterized in that, The chip bonding device includes a bonding plate, an imaging device, and a terminal. The bonding plate is disposed on the side of the light-emitting chip facing away from the backplate assembly and maintains a predetermined distance from the backplate assembly. The imaging device is disposed at intervals on the side of the bonding plate facing away from the light-emitting chip. The terminal is electrically connected to the bonding plate and the imaging device respectively. The side of the bonding plate facing the light-emitting chip has multiple grooves corresponding to the light-emitting chip. Each groove is provided with a conductive element and a bonding element. The imaging device acquires images of multiple light-emitting chips. The terminal obtains the position information of the second-state light-emitting chip on the backplate assembly based on the images, and controls the conductive element in the groove corresponding to the second-state light-emitting chip to be energized according to the position information. The bonding element presses the second-state light-emitting chip under the drive of the conductive element, so that the second-state light-emitting chip is electrically connected to the backplate assembly.

2. The chip bonding apparatus as described in claim 1, characterized in that, The conductive element is a heating element, and the pressing element is a thermal expansion material. The heating element is disposed at the bottom of the groove, and the thermal expansion material is filled into the groove and located on the side of the heating element opposite to the bottom of the groove. When the heating element is powered on, it heats up, causing the temperature of the thermal expansion material to rise and expand to extend out of the groove to press the second state light-emitting chip.

3. The chip bonding apparatus as described in claim 1, characterized in that, The conductive element consists of two electrodes, and the pressing element is an electrostrictive material. The two electrodes are disposed opposite each other on the periphery of the groove. The electrostrictive material is filled between the two electrodes. When the two electrodes are energized, they form a corresponding electric field. Under the action of the electric field, the electrostrictive material expands to extend out of the groove to press the second-state light-emitting chip.

4. The chip bonding apparatus as described in claim 1, characterized in that, The chip bonding device further includes a signal generator, which is electrically connected between the terminal and the bonding plate. The terminal controls the signal generator to supply power to the conductive element in the groove corresponding to the second state light-emitting chip according to the position information.

5. The chip bonding apparatus as described in claim 4, characterized in that, The pressing plate also includes a signal transmission unit disposed within the pressing plate. The signal transmission unit is electrically connected to the signal generator and to each of the conductive elements. The signal generator provides electrical signals to the conductive elements through the signal transmission unit.

6. The chip bonding apparatus as described in claim 5, characterized in that, The signal transmission unit includes a plurality of first connecting lines spaced apart and a plurality of second connecting lines spaced apart. Each conductive element is electrically connected to both a first connecting line and a second connecting line simultaneously. The first connecting line and the second connecting line directly provide electrical signals to the conductive element.

7. The chip bonding apparatus as described in claim 5, characterized in that, The signal transmission unit includes a plurality of first connecting lines spaced apart, a plurality of second connecting lines spaced apart, and a plurality of protection circuits. Each conductive element is electrically connected to one of the protection circuits. Each protection circuit is simultaneously electrically connected to one of the first connecting lines, one of the second connecting lines, and a power supply voltage. The first connecting line provides a first electrical signal to the protection circuit, and the second connecting line provides a second electrical signal to the protection circuit. The protection circuit transmits the power supply voltage to the conductive element according to the first electrical signal and the second electrical signal.

8. The chip bonding apparatus as described in claim 7, characterized in that, The protection circuit includes a first transistor, a second transistor, and a capacitor. The gate of the first transistor is electrically connected to a first connection line, the source of the first transistor is electrically connected to a second connection line, the drain of the first transistor is electrically connected to the gate of the second transistor and a first terminal of the capacitor, the source of the second transistor is electrically connected to the conductive element, and the drain of the second transistor and a second terminal of the capacitor are electrically connected to the power supply voltage.

9. The chip bonding apparatus according to any one of claims 1-8, characterized in that, The backplate assembly includes a first alignment mark disposed on the same side as the light-emitting chip, and the pressing plate includes a second alignment mark disposed on the same side as the groove. The first alignment mark and the second alignment mark are aligned to correspond the position of the groove to the position of the light-emitting chip.

10. The chip bonding apparatus according to any one of claims 1-8, characterized in that, The chip bonding device further includes a first fixing member, a fixing rod, a sliding rod, and a top plate. The first fixing member is disposed on the side of the bonding plate opposite to the groove. One end of the fixing rod is disposed on the side of the first fixing member opposite to the bonding plate. The sliding rod is slidably connected to the other end of the fixing rod opposite to the first fixing member. The end of the sliding rod opposite to the fixing rod is slidably connected to the top plate. The first fixing member fixes the bonding plate. The sliding rod slides relative to the top plate to align the bonding plate with the backplate assembly. The fixing rod slides relative to the sliding rod to maintain the predetermined distance between the bonding plate and the backplate assembly.

11. The chip bonding apparatus as described in claim 10, characterized in that, The chip bonding device further includes a second fixing member and a platform. The second fixing member fixes the backplate assembly, and the platform carries the second fixing member and the backplate assembly.

12. A chip lamination method, characterized in that, include: A backplane assembly is provided, the backplane assembly having a plurality of light-emitting chips, wherein the light-emitting chips include a plurality of first-state light-emitting chips electrically connected to the backplane assembly and a plurality of second-state light-emitting chips not electrically connected to the backplane assembly; Images of multiple light-emitting chips are acquired, and the position information of the second-state light-emitting chip on the backplane assembly is obtained based on the images; Align the pressing plate with the backplate assembly and maintain a predetermined distance. The pressing plate has a plurality of grooves corresponding to the light-emitting chip on the side facing the light-emitting chip. Each groove is provided with a conductive element and a pressing element. According to the position information, the conductive element in the groove corresponding to the second state light-emitting chip is energized, and the pressing element extends out of the groove and presses the second state light-emitting chip under the drive of the conductive element, so that the second state light-emitting chip is electrically connected to the backplane assembly.

13. The chip bonding method as described in claim 12, characterized in that, The step of aligning the press plate with the back plate assembly while maintaining a predetermined distance includes: Take alignment images of the first alignment mark of the backplate assembly and the second alignment mark of the lamination plate; The distance between the center point of the first alignment mark and the center point of the second alignment mark is obtained from the alignment image; The pressing plate is aligned with the back panel assembly according to the distance, and the pressing plate and the back panel assembly are controlled to maintain the predetermined distance.

Images