Feeding system and antenna

Abstract

The application relates to a feeding system and an antenna. The feeding system comprises a phase shifter, the phase shifter comprising a cavity and a phase shift circuit arranged inside the cavity; a microstrip circuit board arranged on the top side of the phase shifter, the microstrip circuit board comprising a substrate and a signal layer and a ground layer on the substrate; a probe comprising an outer conductor and an inner conductor penetrating the outer conductor, one end of the inner conductor being arranged inside the cavity and electrically connected with the phase shift circuit, the other end of the inner conductor extending out of the cavity and electrically connected with the signal layer, the signal layer being used for electrically connecting with a feed core of a radiation unit, one end of the outer conductor being coupled with the cavity, and the other end of the outer conductor being electrically connected with the ground layer. The cavity and the ground layer are connected in radio frequency without the aid of a reflecting plate, and the outer conductor of the probe and the ground layer are directly electrically connected, so that when the feeding system in the embodiment of the application is applied to the antenna, the stability of the signal can be improved.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and in particular to a feeding system and antenna. Background Technology

[0002] Antennas are a crucial component of mobile communication networks, and their performance directly impacts network coverage. Base station antennas are typically electrically tunable antennas, mainly consisting of a power supply system, a reflector, and a radiating element. The power supply system primarily includes a phase shifter, which comprises a cavity and a phase-shifting circuit located within the cavity.

[0003] Figure 1 This is a schematic diagram of the structure of an antenna in related technologies, such as... Figure 1 As shown, in one type of antenna in the related technology, a printed circuit board 3' is disposed on the side of the reflector 1' facing away from the phase shifter 2'. The feed core and phase shifting circuit of the radiating element 4' are electrically connected to the signal layer of the printed circuit board 3'. The ground layer S1 of the printed circuit board 3' is coupled to the upper surface S2 of the reflector 1', and the lower surface S3 of the reflector 1' is further coupled to the cavity surface S4 of the phase shifter 2'. This multi-coupling structure results in poor signal stability of the antenna. Especially in the high-frequency band, the multi-coupling transmission structure is prone to resonance, affecting the antenna performance. Summary of the Invention

[0004] Based on this, a power supply system and antenna are provided to improve the signal stability of the antenna.

[0005] An embodiment of the first aspect of this application provides a power supply system comprising: a phase shifter, the phase shifter including a cavity and a phase shifting circuit disposed inside the cavity; a microstrip circuit board disposed on the top side of the phase shifter, the microstrip circuit board including a substrate and a signal layer and a ground layer located on the substrate; and a probe including an outer conductor and an inner conductor passing through the outer conductor, one end of the inner conductor being located inside the cavity and electrically connected to the phase shifting circuit, the other end of the inner conductor extending out of the cavity and electrically connected to the signal layer, the signal layer being used for electrical connection to the feed core of a radiating unit, one end of the outer conductor being coupled to the cavity, and the other end of the outer conductor being electrically connected to the ground layer.

[0006] The feeding system in this embodiment includes a probe and a microstrip circuit board. The probe includes an inner conductor, one end of which is located inside the cavity of the phase shifter and electrically connected to the phase shifting circuit. The other end of the inner conductor extends out of the cavity and is electrically connected to the signal layer of the microstrip circuit board. The signal layer is also used for electrical connection with the feed core of the radiating element. Thus, the inner conductor of the probe enables electrical connection between the feed core and the phase shifting circuit. Furthermore, the probe includes an outer conductor, one end of which is coupled to the cavity, and the other end of which is electrically connected to the ground plane of the microstrip circuit board. This allows for radio frequency connection between the cavity and the ground plane without the need for a reflector. Moreover, the outer conductor of the probe is directly electrically connected to the ground plane, reducing one coupling connection compared to related technologies. Since direct electrical connection offers better stability than coupling connection, the feeding system in this embodiment can improve signal stability when applied to an antenna.

[0007] Furthermore, the electrical connection between the radiating unit and the phase-shifting circuit is achieved through the connection of the probe and the microstrip circuit board, so that the cavity and the feed core of the radiating unit do not need to be aligned vertically. When there are multiple radiating units corresponding to the cavity, the multiple radiating units do not need to be on the same straight line. In other words, multiple radiating units can form a non-linear array, thus achieving a more flexible horizontal beamwidth.

[0008] In addition, the microstrip circuit board also includes a ground plane, and the probe includes an outer conductor. One end of the outer conductor is coupled to the cavity of the phase shifter, and the other end of the outer conductor is electrically connected to the ground plane. When the antenna has a design requirement of no electroplating, the feed balun of the radiating element can be electrically connected to the ground plane. In this way, the phase shifter cavity can be made electroplating-free, and the connection between the cavity and the feed balun can be made cable-free, thus making it more environmentally friendly.

[0009] Furthermore, in related technologies, array antennas (such as 8TR array antennas) each column has an independent cavity. The feed core of the radiating element extends into the cavity and connects to the phase-shifting circuit within the cavity. Due to the close proximity of the cavities, the operating holes on the sidewalls of the cavities are partially obstructed, making it difficult to solder the feed core to the phase-shifting circuit within the cavity. When the feeding system in this embodiment is applied to an array antenna, the probe can be assembled with the phase shifter first, and the radiating element can be assembled with the microstrip circuit board. Then, the probe is connected to the signal layer on the microstrip circuit board. This solves the problem of assembly difficulties caused by obstruction.

[0010] Furthermore, no RF cable is needed between the radiating element and the feeding system, thereby reducing network insertion loss and improving antenna gain performance. Therefore, for the same coverage distance, the base station supplies less energy to the antenna, which is more energy-efficient and environmentally friendly. Of course, in scenarios where loss and gain requirements are not urgent, the signal layer and the feed core of the radiating element can also be connected via an RF cable, thus forming a wired electrically tunable antenna.

[0011] In some embodiments, the probe further includes an insulating medium disposed between the outer conductor and the inner conductor.

[0012] In some embodiments, the cavity has a top plate with a coupling hole, the outer conductor includes a first conductive portion in the form of a tubular structure, the inner conductor passes through the inner cavity of the tubular structure, and the tubular structure is at least partially disposed within the coupling hole for coupling connection with the sidewall of the coupling hole.

[0013] In some embodiments, a first gap exists between the tubular structure and the sidewall of the coupling hole, the first gap being greater than 0 mm and less than or equal to 1 mm.

[0014] In some embodiments, an insulating film is provided between the tubular structure and the sidewall of the coupling hole.

[0015] In some embodiments, the outer conductor includes a first conductive portion, which has a block structure, and the bottom surface of the block structure is coupled to the top surface of the cavity; the first conductive portion is provided with a first through hole, and the inner conductor passes through the first through hole.

[0016] In some embodiments, a second gap exists between the bottom surface of the block structure and the top surface of the cavity, the second gap being greater than 0 mm and less than or equal to 1 mm.

[0017] In some embodiments, an insulating film is provided between the bottom surface of the block structure and the top surface of the cavity.

[0018] In some embodiments, the cavity has a top plate, and the top plate is provided with a second through hole opposite to the first through hole, and the inner conductor also passes through the second through hole.

[0019] In some embodiments, the cavity has a top plate and a side plate, and the phase shifter further includes a side edge connected to the top of the cavity, the side edge protruding outward from the side plate, the side edge being parallel to the top plate, and the side edge being used for connection with a reflector.

[0020] In some embodiments, the top surface of the side is higher than the top surface of the top plate, the bottom surface of the block structure is coupled to the top surface of the top plate, and the top surface of the block structure is flush with the top surface of the side.

[0021] In some embodiments, the signal layer is located on the top side of the substrate, the ground layer is located on the bottom side of the substrate, and a ground copper foil is also provided on the top side of the substrate. The ground copper foil is electrically connected to the ground layer through a metal hole provided on the substrate. The outer conductor also includes a second conductive part connected to the top end of the first conductive part. The second conductive part passes through the substrate and is soldered to the ground copper foil.

[0022] In some embodiments, the second conductive portion is welded to the first conductive portion; or, the second conductive portion and the first conductive portion are integrally formed.

[0023] In some embodiments, the signal layer is located on the top side of the substrate, the ground layer is located on the bottom side of the substrate, and the top end of the first conductive portion is soldered to the ground layer.

[0024] An embodiment of the second aspect of this application provides an antenna, the antenna including a radiating element, a reflector, and a feeding system as described in any of the above embodiments; the phase shifter is disposed on the bottom surface of the reflector, the microstrip circuit board is disposed on the top surface of the reflector, the radiating element is disposed on the top surface of the reflector, the radiating element includes a feed core, and the feed core is electrically connected to the signal layer.

[0025] In some embodiments, the radiating element further includes a feed balun and a radiating arm, wherein the feed balun is electrically connected to the radiating arm and the feed core is coupled to the radiating arm.

[0026] In some embodiments, the power supply balun is electrically connected to the formation.

[0027] In some embodiments, the bottom of the power supply balun is provided with a conductive protrusion structure, which passes through the substrate and is welded to the ground layer.

[0028] In some embodiments, the plane in which the phase-shifting circuit is located is perpendicular to or parallel to the reflector.

[0029] In some embodiments, the radiation unit is a dual-polarized radiation unit, and the cavity includes a first sub-cavity and a second sub-cavity. The first sub-cavity and the second sub-cavity are respectively provided with a phase-shifting circuit. The number of probes corresponding to each dual-polarized radiation unit is two, and the outer conductors of the two probes are connected to each other to form an integrated structure. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an antenna in related technologies;

[0031] Figure 2 This is a schematic diagram of the antenna structure in one embodiment of this application;

[0032] Figure 3 This is an exploded view of the antenna in one embodiment of this application;

[0033] Figure 4 for Figure 3 A partially enlarged schematic diagram of the structure shown;

[0034] Figure 5 This is a front view of the antenna in one embodiment of this application;

[0035] Figure 6 This is a schematic diagram of the installation of the phase shifter and probe in one embodiment of this application;

[0036] Figure 7 This is a schematic diagram of the antenna structure in another embodiment of this application;

[0037] Figure 8 This is a schematic diagram of the probe structure in one embodiment of this application;

[0038] Figure 9 This is a cross-sectional view of the probe in one embodiment of this application;

[0039] Figure 10 This is a cross-sectional view of the probe in another embodiment of this application;

[0040] Figure 11 This is a cross-sectional view of the probe in another embodiment of this application;

[0041] Figure 12 This is a schematic diagram of the antenna structure in another embodiment of this application;

[0042] Figure 13 This is an exploded view of the antenna in another embodiment of this application;

[0043] Figure 14 This is a front view of the antenna in another embodiment of this application;

[0044] Figure 15 This is a schematic diagram of the probe structure in another embodiment of this application;

[0045] Figure 16 Figure 15 A schematic diagram of the probe's structure from another perspective;

[0046] Figure 17 This is a schematic diagram of a phase shifter and a probe in another embodiment of this application;

[0047] Figure 18 This is a front view of the antenna in another embodiment of this application;

[0048] Figure 19 This is a schematic diagram of the installation of the radiating unit and the microstrip circuit board in one embodiment of this application;

[0049] Figure 20 This is a schematic diagram of the probe structure in another embodiment of this application;

[0050] Figure 21 This is a cross-sectional view of the probe in another embodiment of this application;

[0051] Figure 22 This is a cross-sectional view of the probe in another embodiment of this application;

[0052] Figure 23 This is a schematic diagram of the mounting of the probe and microstrip circuit board in one embodiment of this application;

[0053] Figure 24 This is a schematic diagram of the installation of the probe and microstrip circuit board in one embodiment of this application from another perspective;

[0054] Figure 25 This is a schematic diagram of the structure of a radiating unit in another embodiment of this application;

[0055] Figure 26 This is a front view of the antenna in another embodiment of this application;

[0056] Figure 27 This is a schematic diagram of the installation of the radiating unit and the microstrip circuit board in another embodiment of this application;

[0057] Figure 28 This is a schematic diagram of the installation of the radiating unit and microstrip circuit board in another embodiment of this application from another perspective.

[0058] Figure label:

[0059] 10. Antenna;

[0060] 100. Power supply system;

[0061] 110. Phase shifter; 111. Cavity; 1111. Top plate; 1112. Coupling hole; 1113. Second through hole; 1114. Side plate; 1115. Operating hole; 1116. Side edge; 1117. Fastener;

[0062] 112. Phase-shifting circuit; 113. Sliding medium; 115. First sub-cavity; 116. Second sub-cavity;

[0063] 120. Probe; 121. Outer conductor; 1211. First conductive part; 1212. First through hole; 1213. Second conductive part; 1214. Boss;

[0064] 122. Inner conductor; 123. Insulating medium; 124. Insulating film;

[0065] 130. Microstrip circuit board; 131. Substrate; 132. Signal layer; 134. Ground layer; 135. Grounding copper foil;

[0066] 200. Radiation unit;

[0067] 210. Feed core; 220. Feed balun; 221. Conductive protrusion structure; 230. Radial arm; 240. Filter stub;

[0068] 300. Reflector. Detailed Implementation

[0069] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0070] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0071] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0072] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0073] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0074] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0075] Antennas are a crucial component of mobile communication networks, and their performance directly impacts network coverage. Base station antennas are typically electrically tunable antennas, mainly consisting of a power supply system, a reflector, and a radiating element. The power supply system primarily includes a phase shifter, which comprises a cavity and a phase-shifting circuit located within the cavity.

[0076] One type of antenna in related technology has a printed circuit board (PCB) mounted on the side of the reflector away from the phase shifter. The feed element of the radiating element and the phase shifting circuit are electrically connected to the signal layer of the PCB. The ground layer of the PCB is coupled to the upper surface of the reflector, and the lower surface of the reflector is further coupled to the cavity surface of the phase shifter. This multi-coupling structure results in poor signal stability. Especially in the high-frequency band, the multi-coupling transmission structure is prone to resonance, i.e., standing wave spikes or power curve dips, affecting antenna performance.

[0077] To address the aforementioned problems, the embodiments of the first aspect of this application propose a feeding system aimed at improving the signal stability of the antenna.

[0078] like Figures 2 to 6 As shown, the power supply system 100 in the first aspect embodiment of this application includes a phase shifter 110, a microstrip circuit board 130, and a probe 120. Specifically, the phase shifter 110 includes a cavity 111 and a phase shifting circuit 112 disposed inside the cavity 111. The microstrip circuit board 130 is disposed on the top side of the phase shifter 110. The microstrip circuit board 130 includes a substrate 131 and a signal layer 132 and a ground layer 134 located on the substrate 131 (please refer to...). Figure 24 The probe 120 includes an outer conductor 121 and an inner conductor 122 passing through the outer conductor 121. One end of the inner conductor 122 is located inside the cavity 111 and is electrically connected to the phase shifting circuit 112. The other end of the inner conductor 122 extends out of the cavity 111 and is electrically connected to the signal layer 132. The signal layer 132 is used to electrically connect to the feed core 210 of the radiation unit 200. One end of the outer conductor 121 is coupled to the cavity 111, and the other end of the outer conductor 121 is electrically connected to the ground layer 134.

[0079] In this context, electrical coupling refers to a connection between two conductive components that are not in direct contact (e.g., separated by a gap or equipped with an insulating medium 123), yet are still capable of energy transfer. Common coupling methods include capacitive coupling, optoelectronic coupling, and transformer coupling.

[0080] In addition, the signal layer 132 and the ground layer 134 on the microstrip circuit board 130 are insulated from each other.

[0081] The power supply system 100 in this embodiment includes a probe 120 and a microstrip circuit board 130. The probe 120 includes an inner conductor 122. One end of the inner conductor 122 is located inside the cavity 111 of the phase shifter 110 and is electrically connected to the phase shifting circuit 112. The other end of the inner conductor 122 extends out of the cavity 111 and is electrically connected to the signal layer 132 of the microstrip circuit board 130. The signal layer 132 is also used for electrical connection with the feed core 210 of the radiating unit 200. Thus, the electrical connection between the feed core 210 and the phase shifting circuit 112 can be achieved through the inner conductor 122 of the probe 120. Furthermore, the probe 120 also includes an outer conductor 121. One end of the outer conductor 121 is coupled to the cavity 111, and the other end is electrically connected to the ground plane 134 of the microstrip circuit board 130. This allows for radio frequency connection between the cavity 111 and the ground plane 134 without the need for a reflector. Moreover, the direct electrical connection between the outer conductor 121 and the ground plane 134 reduces one coupling connection compared to related technologies. Since direct electrical connection offers better stability than coupling connection, the feeding system 100 in this embodiment can improve signal stability when applied to an antenna. It also helps avoid resonance problems at high frequencies, thereby improving antenna performance.

[0082] Furthermore, the electrical connection between the radiating unit 200 and the phase-shifting circuit 112 is achieved through the connection between the probe 120 and the microstrip circuit board 130. This eliminates the need for vertical alignment between the cavity 111 and the feed core 210 of the radiating unit 200. When there are multiple radiating units 200 corresponding to the cavity 111, these multiple radiating units 200 do not need to be on the same straight line. In other words, multiple radiating units 200 can form a non-linear array (see reference). Figure 12 This allows for more flexible horizontal beamwidths.

[0083] In addition, the microstrip circuit board 130 also includes a ground plane 134, and the probe 120 also includes an outer conductor 121. One end of the outer conductor 121 is coupled to the cavity 111 of the phase shifter 110, and the other end of the outer conductor 121 is electrically connected to the ground plane 134. When the antenna 10 has a design requirement of no electroplating, the feed balun 220 of the radiating element 200 can be electrically connected to the ground plane 134. In this way, the cavity 111 of the phase shifter 110 can be free of electroplating, and the connection between the cavity 111 and the feed balun 220 can be free of cable soldering, thus making it more environmentally friendly.

[0084] Furthermore, array antennas in related technologies (e.g.) Figure 7The 8TR array antenna shown has an independent cavity in each column. The feed core of the radiating element extends into the cavity and is connected to the phase-shifting circuit inside the cavity. Due to the close proximity of the cavities, the operation holes on the sidewalls of the cavities are partially obstructed, making it difficult to solder the feed core to the phase-shifting circuit inside the cavity. When the feeding system 100 in this embodiment is applied to the array antenna, the probe 120 can be assembled with the phase shifter 110 first, and the radiating element 200 can be assembled with the microstrip circuit board 130. Then, the probe 120 is connected to the signal layer 132 on the microstrip circuit board 130. This solves the problem of difficult assembly due to obstruction.

[0085] Furthermore, no radio frequency (RF) cable is needed between the radiating element 200 and the feeding system 100, thereby reducing network insertion loss and improving the gain performance of the antenna 10. Therefore, for the same coverage distance, the base station supplies less energy to the antenna 10, which is more energy-efficient and environmentally friendly. Of course, in scenarios where loss and gain requirements are not urgent, the signal layer 132 and the feed core 210 of the radiating element 200 can also be connected via an RF cable, thus forming a wired electrically tunable antenna 10.

[0086] In some embodiments, such as Figure 6 , Figure 8 As shown, the probe 120 also includes an insulating medium 123 disposed between the outer conductor 121 and the inner conductor 122. By providing the insulating medium 123, the inner conductor 122 is separated from the outer conductor 121, thereby ensuring that the inner conductor 122 and the outer conductor 121 are mutually insulated.

[0087] In some embodiments, such as Figure 5 , Figure 6 and Figure 8 As shown, the cavity 111 has a top plate 1111 with a coupling hole 1112. The outer conductor 121 includes a first conductive portion 1211, which has a tubular structure. The inner conductor 122 passes through the inner cavity of the tubular structure. At least a portion of the tubular structure is disposed within the coupling hole 1112 for coupling connection with the sidewall of the coupling hole 1112. In this embodiment, the coupling hole 1112 is provided in the top plate 1111 of the cavity 111, and at least a portion of the tubular first conductive portion 1211 is disposed within the coupling hole 1112, thereby enabling coupling connection between the outer conductor 121 and the cavity 111.

[0088] Specifically, such as Figure 8 , Figure 9 , Figure 10 and Figure 11As shown, the cross-sectional shape of the first conductive portion 1211 can be circular, elliptical, square, or polygonal, and this application does not impose any restrictions on it. The cross-sectional shape of the inner conductor 122 can be circular, elliptical, square, or polygonal.

[0089] Furthermore, such as Figure 6 , Figure 8 As shown, there is a first gap between the tubular structure and the sidewall of the coupling hole 1112, which is greater than 0 mm and less than or equal to 1 mm. This helps to maintain good coupling performance between the outer conductor 121 and the cavity 111.

[0090] Furthermore, such as Figure 6 , Figure 8 As shown, an insulating film 124 can be provided between the tubular structure and the sidewall of the coupling hole 1112. This helps to maintain good coupling performance between the outer conductor 121 and the cavity 111. Specifically, the insulating film 124 can be a plastic film, which can be formed on the outer wall of the tubular structure. The insulating film 124 can be interference-fitted into the coupling hole 1112, thereby fixing the tubular structure to the coupling hole 1112.

[0091] In other embodiments, such as Figure 12 , Figure 13 , Figure 14 , Figure 15 as well as Figure 16 As shown, the outer conductor 121 includes a first conductive portion 1211, which has a block-shaped structure. The bottom surface of the block-shaped structure is coupled to the top surface of the cavity 111. The first conductive portion 1211 is provided with a first through hole 1212, through which the inner conductor 122 passes. In this embodiment, the first conductive portion 1211 has a block-shaped structure. By coupling the bottom surface of the block-shaped structure to the top surface of the cavity 111, the coupling connection between the outer conductor 121 and the cavity 111 can also be achieved.

[0092] Furthermore, such as Figure 13 , Figure 14 and Figure 15 As shown, the cavity 111 has a top plate 1111, on which a second through hole 1113 opposite to the first through hole 1212 is provided, and the inner conductor 122 also passes through the second through hole 1113. When the first conductive part 1211 has a block structure and the bottom surface of the block structure is coupled to the top surface of the cavity 111, the top plate 1111 of the cavity 111 has a second through hole 1113 opposite to the first through hole 1212 on the first conductive part 1211. This allows one end of the inner conductor 122 to pass through the first through hole 1212 and the second through hole 1113 and extend into the cavity 111 to connect with the phase shifting circuit 112 located in the cavity 111.

[0093] Furthermore, a second gap exists between the bottom surface of the block structure and the top surface of the cavity 111, the second gap being greater than 0 mm and less than or equal to 1 mm. This facilitates maintaining good coupling performance between the outer conductor 121 and the cavity 111.

[0094] Furthermore, an insulating film is provided between the bottom surface of the block structure and the top surface of the cavity 111. This helps to maintain good coupling performance between the outer conductor 121 and the cavity 111.

[0095] In one embodiment, optionally, such as Figure 17 , Figure 18 As shown, the cavity 111 has a top plate 1111 and a side plate 1114. The phase shifter 110 also includes a side edge 1116 connected to the top of the cavity 111. The side edge 1116 protrudes outward from the side plate 1114 and is parallel to the top plate 1111. The side edge 1116 is used to connect with the reflector 300 of the antenna 10. Typically, the antenna 10 includes a reflector 300, the phase shifter 110 is usually located on the bottom surface of the reflector 300, and the radiating element 200 is usually located on the top surface of the reflector 300. In this embodiment, the phase shifter 110 also includes a side edge 1116 connected to the top of the cavity 111. The side edge 1116 protrudes outward from the side plate 1114 and is parallel to the top plate 1111. Thus, the side edge 1116 can be connected to the reflector 300 by a fastener 1117 (e.g., a bolt), thereby realizing the connection between the phase shifter 110 and the reflector 300.

[0096] Specifically, a protrusion (not shown in the figure) can be provided on the top surface of the side 1116, which can reduce the contact area between the phase shifter 110 and the reflector 300, and help to improve the magnitude of passive inter-modulation (PIM).

[0097] Furthermore, the top surface of side 1116 is higher than the top surface of top plate 1111, the bottom surface of the block structure is coupled to the top surface of top plate 1111, and the top surface of the block structure is flush with the top surface of side 1116. That is, when the first conductive part 1211 is a block structure, and the bottom surface of the block structure is coupled to the top surface of cavity 111, the height difference between the top surface of side 1116 and the top surface of top plate 1111 can be set to be equal to the height of the block structure. Thus, when the bottom surface of the block structure is coupled to the top surface of top plate 1111, the top surface of the block structure can be flush with the top surface of side 1116. This arrangement ensures that the phase shifter 110 will not be interfered with by the first conductive part 1211 when connected to the reflector 300.

[0098] In some embodiments, such as Figure 5 , Figure 8and Figure 19 As shown, signal layer 132 is located on the top side of substrate 131, and ground layer 134 is located on the bottom side of substrate 131. A grounding copper foil 135 is also provided on the top side of substrate 131, and the grounding copper foil 135 is electrically connected to the ground layer 134 through a metal hole provided on substrate 131. The outer conductor 121 also includes a second conductive portion 1213 connected to the top end of the first conductive portion 1211. The second conductive portion 1213 passes through substrate 131 and is soldered to the grounding copper foil 135. In this embodiment, a grounding copper foil 135 is provided on the top side of substrate 131, and the grounding copper foil 135 is electrically connected to the ground layer 134 located on the bottom side of substrate 131. The grounding copper foil constitutes a transition portion for the electrical connection between ground layer 134 and external structures. In this case, the outer conductor 121 may include a second conductive part 1213 connected to the top end of the first conductive part 1211. The second conductive part 1213 passes through the substrate 131 and is soldered to the ground copper foil 135, so that the outer conductor 121 can be electrically connected to the ground layer 134.

[0099] Specifically, such as Figure 8 , Figure 15 As shown, the second conductive part 1213 can be welded to the first conductive part 1211, or the second conductive part 1213 and the first conductive part 1211 are integrally formed.

[0100] Specifically, the number of second conductive parts 1213 can be one or more, and the second conductive parts 1213 can be columnar structures or curved strip structures.

[0101] In other embodiments, such as Figure 20 , Figure 21 , Figure 22 , Figure 23 as well as Figure 24 As shown, the signal layer 132 is located on the top side of the substrate 131, the ground layer 134 is located on the bottom side of the substrate 131, and the top end of the first conductive portion 1211 is soldered to the ground layer 134. In this embodiment, the top end of the first conductive portion 1211 is directly soldered to the ground layer 134 located on the bottom side of the substrate 131, so that the outer conductor 121 is electrically connected to the ground layer 134.

[0102] Furthermore, such as Figure 22 , Figure 24 As shown, when a coupling hole 1112 is provided in the top plate 1111, and the first conductive part 1211 has a tubular structure, and the tubular structure is at least partially disposed in the coupling hole 1112, the first conductive part 1211 may also include a boss 1214 disposed on the top of the tubular structure. The boss 1214 protrudes from the outer wall surface of the tubular structure. In this way, the top area of ​​the first conductive part 1211 can be increased, thereby making the top of the first conductive part 1211 more firmly welded to the ground layer 134.

[0103] In some embodiments, the phase-shifting circuit 112 includes a sheet metal strip and a dielectric layer for fixing the sheet metal strip. The sheet metal strip is a strip manufactured using sheet metal processing. There can be two dielectric layers, and the sheet metal strip can be fixed between the two dielectric layers, thereby securing the sheet metal strip through the dielectric layers. In related technologies, strips are often formed by double-sided copper plating on a PCB and connections via metallized vias. Compared to strips in related technologies, sheet metal strips can have lower insertion loss.

[0104] Specifically, the microstrip circuit board 130 can be a printed circuit board.

[0105] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, the cavity 111 has a top plate 1111 and a side plate 1114. The side plate 1114 is provided with an operation hole 1115. The operation hole 1115 can be used to conveniently connect one end of the inner conductor 122 to the phase shifting circuit 112 in the cavity 111.

[0106] In some embodiments, such as Figure 5 , Figure 6 As shown, the phase shifter 110 also includes two sliding media 113 disposed within the cavity 111, with the two sliding media 113 respectively disposed on opposite sides of the phase shifting circuit 112. The sliding media 113 are configured to move along the direction of the radiation unit 200, thereby adjusting the phase.

[0107] An embodiment of the second aspect of this application provides an antenna 10, which includes a radiating element 200, a reflector 300, and a feeding system 100 as described in any of the above embodiments. A phase shifter 110 is disposed on the bottom surface of the reflector 300, a microstrip circuit board 130 is disposed on the top surface of the reflector 300, and the radiating element 200 is disposed on the top surface of the reflector 300. The radiating element 200 includes a feed core 210, which is electrically connected to the signal layer 132.

[0108] In this embodiment of the antenna 10, the feed system 100 is provided with a probe 120 and a microstrip circuit board 130. The probe 120 includes an inner conductor 122. One end of the inner conductor 122 is located inside the cavity 111 of the phase shifter 110 and is electrically connected to the phase shifting circuit 112. The other end of the inner conductor 122 extends out of the cavity 111 and is electrically connected to the signal layer 132 of the microstrip circuit board 130. The signal layer 132 is also used for electrical connection with the feed core 210 of the radiating element 200. Thus, the electrical connection between the feed core 210 and the phase shifting circuit 112 can be achieved through the inner conductor 122 of the probe 120. Furthermore, the probe 120 also includes an outer conductor 121. One end of the outer conductor 121 is coupled to the cavity 111, and the other end is electrically connected to the ground plane 134 of the microstrip circuit board 130. This allows for radio frequency connection between the cavity 111 and the ground plane 134 without the need for a reflector. Moreover, the direct electrical connection between the outer conductor 121 and the ground plane 134 reduces one coupling connection compared to related technologies. Since direct electrical connection offers better stability than coupling connection, the antenna 10 in this embodiment improves signal stability. It also helps avoid resonance problems at high frequencies, thus improving antenna performance.

[0109] Furthermore, such as Figure 2 As shown, the number of radiating elements 200 can be multiple, and the operating frequency band of the multiple radiating elements 200 can be one or more of low frequency (617~960MHz), medium frequency (1700~2700MHz), or high frequency (3300~3800MHz).

[0110] In some embodiments, such as Figure 25 , Figure 27 As shown, the radiating unit 200 also includes a feed balun 220 and a radiating arm 230. The feed balun 220 is electrically connected to the radiating arm 230, and the feed core 210 is coupled to the radiating arm 230.

[0111] Furthermore, the power supply balun 220 can also be electrically connected to the ground layer 134. In this case, a pathway is formed between the power supply balun 220, the ground layer 134, and the cavity 111 of the phase shifter 110. This allows for the elimination of electroplating on the cavity 111 of the phase shifter 110 and the elimination of cable welding between the cavity 111 and the power supply balun 220, making it more environmentally friendly.

[0112] Specifically, such as Figure 27 , Figure 28 As shown, a conductive protrusion structure 221 is provided at the bottom of the power supply balun 220. The conductive protrusion structure 221 passes through the substrate and is soldered to the ground layer 134. Thus, an electrical connection can be achieved between the power supply balun 220 and the ground layer 134.

[0113] Furthermore, the feed balun 220 and the radiating arm 230 can be of PCB structure (see reference). Figure 25 In this case, the feed balun 220 and the radiating arm 230 can be formed using PCB manufacturing processes. In other embodiments, the feed balun 220 and the radiating arm 230 can also be metal structures (see [reference]). Figure 27 , Figure 28 In this case, the power supply balun 220 and the radiating arm 230 can be formed by metal die casting or sheet metal processing.

[0114] Furthermore, such as Figure 25 As shown, when the feed balun 220 and radiating arm 230 adopt a PCB structure, the radiating element 200 may also include a filter stub 240 disposed near the feed core 210. The filter stub 240 is connected to the radiating arm 230 to form a filter circuit. Typically, the multi-frequency antenna 10 requires filtering of the radiating element 200; therefore, the radiating element 200 with the filter stub 240 can meet the application requirements of the multi-frequency antenna 10.

[0115] In some embodiments, such as Figure 5 , Figure 26 As shown, the plane containing the phase-shifting circuit 112 is perpendicular or parallel to the reflector 300. For example... Figure 5 As shown, when the plane containing the phase-shifting circuit 112 is perpendicular to the reflector 300, the height of the cavity 111 is greater than its width. In this case, the cavity 111 can be considered to be arranged vertically. Figure 26 As shown, when the plane of the phase shifting circuit 112 is parallel to the reflector 300, the width of the cavity 111 is greater than the height of the cavity 111. In this case, the cavity 111 can be considered to be arranged in a horizontal direction (or laid flat).

[0116] Furthermore, the radiating element 200 can be a single-polarized radiating element or a dual-polarized radiating element (e.g., a 45° dual-polarized element). Figure 5 As shown, when the radiation unit is a dual-polarized radiation unit, the cavity 111 may include a first sub-cavity 115 and a second sub-cavity 116. A phase-shifting circuit 112 is respectively provided in the first sub-cavity 115 and the second sub-cavity 116. The number of probes 120 corresponding to each dual-polarized radiation unit is two. The two probes 120 extend into the first sub-cavity 115 and the second sub-cavity 116 respectively, and are electrically connected to the phase-shifting circuit 112 in the corresponding sub-cavity 111.

[0117] In a specific embodiment, such as Figure 16As shown, the outer conductors 121 of the two probes 120 corresponding to the same dual-polarized radiation unit can be connected to each other to form an integrated structure. In this case, the two probes 120 form a component, which helps to simplify the assembly process.

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A power supply system, characterized in that, include: A phase shifter, the phase shifter including a cavity and a phase shifting circuit disposed inside the cavity; A microstrip circuit board is disposed on the top side of the phase shifter, and the microstrip circuit board includes a substrate and a signal layer and a ground layer located on the substrate; The probe includes an outer conductor and an inner conductor passing through the outer conductor. One end of the inner conductor is located inside the cavity and electrically connected to the phase-shifting circuit. The other end of the inner conductor extends out of the cavity and is electrically connected to the signal layer. The signal layer is used to electrically connect to the feed core of the radiation unit. One end of the outer conductor is coupled to the cavity, and the other end of the outer conductor is electrically connected to the ground plane. The cavity has a top plate with a coupling hole. The outer conductor includes a first conductive part in the form of a tubular structure. The inner conductor passes through the inner cavity of the tubular structure. The tubular structure is at least partially disposed within the coupling hole to be coupled to the side wall of the coupling hole.

2. The power supply system according to claim 1, characterized in that, The probe also includes an insulating medium disposed between the outer conductor and the inner conductor.

3. The power supply system according to claim 1, characterized in that, There is a first gap between the tubular structure and the sidewall of the coupling hole, the first gap being greater than 0 mm and less than or equal to 1 mm.

4. The power supply system according to claim 1, characterized in that, An insulating film is provided between the tubular structure and the sidewall of the coupling hole.

5. The power supply system according to any one of claims 1 to 4, characterized in that, The signal layer is located on the top side of the substrate, the ground layer is located on the bottom side of the substrate, and a grounding copper foil is also provided on the top side of the substrate. The grounding copper foil is electrically connected to the ground layer through a metal hole provided on the substrate. The outer conductor also includes a second conductive portion connected to the top end of the first conductive portion, the second conductive portion passing through the substrate and being soldered to the grounded copper foil.

6. The power supply system according to claim 5, characterized in that, The second conductive part is welded to the first conductive part; Alternatively, the second conductive part and the first conductive part are integrally formed.

7. The power supply system according to any one of claims 1 to 4, characterized in that, The signal layer is located on the top side of the substrate, the ground layer is located on the bottom side of the substrate, and the top end of the first conductive portion is soldered to the ground layer.

8. An antenna, characterized in that, Includes a radiating unit, a reflector, and a power supply system as described in any one of claims 1 to 7; The phase shifter is disposed on the bottom surface of the reflector, the microstrip circuit board is disposed on the top surface of the reflector, the radiation unit is disposed on the top surface of the reflector, and the radiation unit includes a feed core, which is electrically connected to the signal layer.

9. The antenna according to claim 8, characterized in that, The radiating unit also includes a feed balun and a radiating arm, wherein the feed balun is electrically connected to the radiating arm, and the feed core is coupled to the radiating arm.

10. The antenna according to claim 9, characterized in that, The power supply balun is electrically connected to the formation.

11. The antenna according to claim 10, characterized in that, The bottom of the power supply balun is provided with a conductive protrusion structure, which passes through the substrate and is welded to the ground layer.

12. The antenna according to claim 8, characterized in that, The plane containing the phase-shifting circuit is perpendicular or parallel to the reflector.

13. The antenna according to claim 8, characterized in that, The radiation unit is a dual-polarized radiation unit, and the cavity includes a first sub-cavity and a second sub-cavity, with a phase-shifting circuit respectively disposed in the first sub-cavity and the second sub-cavity; Each of the dual-polarized radiation units corresponds to two probes, and the outer conductors of the two probes are connected to each other to form an integrated structure.

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