A system and method for manufacturing a small-aperture circuit board with an ultra-high thickness-to-diameter ratio

Abstract

The application relates to a small-aperture circuit board manufacturing system and method with an ultrahigh thickness-diameter ratio, which comprises a first conveying mechanism, a second conveying mechanism, a first supporting mechanism, a second supporting mechanism, a drilling mechanism and a laminating mechanism. The first supporting mechanism and the second supporting mechanism support and position the base plate and the insulating plate respectively, the drilling mechanism is accurate in hole positioning of the base plate and the insulating plate, the laminating mechanism is high in laminating precision of the laminating of the base plate, the insulating plate and the circuit copper plate, and the yield is high. The application solves the technical problem of the existing circuit board manufacturing system, which is difficult in hole opening and positioning of the circuit board and low in yield.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a system and method for manufacturing circuit boards with ultra-high aspect ratio and small aperture. Background Technology

[0002] A circuit board is a conductive pattern, consisting of printed lines, printed components, or a combination of both, fabricated on an insulating material according to a predetermined design. The conductive pattern on the insulating substrate that provides electrical connections between components is called a printed line. Thus, the finished board of printed circuits or printed lines is called a printed circuit board, also known as a printed board or printed circuit board.

[0003] Printed circuit boards can be classified into three main categories based on the number of layers: single-sided boards, double-sided boards, and multilayer boards. Among them, double-sided boards are printed circuit boards with metal on both sides, including the top and bottom layers. They can be wired and soldered on both sides, with an insulating layer in the middle. This is a commonly used type of printed circuit board, and the fact that it can be wired on both sides greatly reduces the difficulty of wiring, so it is widely used.

[0004] Patent document with patent number CN216253358U (e.g.) Figure 1 The diagram shows a high-precision small-aperture electronic circuit board, comprising a substrate, an insulating plate, and a circuit copper plate stacked sequentially. The substrate has a vertically penetrating countersunk hole and a spherical expansion portion. The top of the spherical expansion portion has an inclined vent hole. The countersunk hole has an inverted conical structure, and the diameter of the spherical expansion portion is larger than the maximum diameter of the countersunk hole. A preheating plate is embedded on the top of the insulating plate, and both the insulating plate and the preheating plate have vertically penetrating through holes that communicate with the spherical expansion portion.

[0005] However, in actual use, the inventors found that existing circuit board manufacturing systems usually perform unified hole drilling after the substrate, insulating board and circuit copper board are laminated, which makes it difficult to process the spherical expansion part. If the spherical expansion part is processed before lamination, it will cause positioning difficulties when the boards are laminated, which will lead to a decrease in product yield due to insufficient precision. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of existing technologies by providing a high aspect ratio, small-aperture circuit board manufacturing system and method. This system includes a first conveying mechanism, a second conveying mechanism, a first support mechanism, a second support mechanism, a drilling mechanism, and a stacking mechanism. With the first and second support mechanisms supporting and positioning the substrate and insulating plate respectively, the drilling mechanism accurately positions the holes in the substrate and insulating plate. Furthermore, given accurate positioning in the preceding processes, the stacking mechanism achieves high precision in stacking the substrate, insulating plate, and circuit copper plate, thereby improving the yield rate. This solves the problems of difficulty in drilling and positioning circuit boards, and low yield rates in existing circuit board manufacturing systems.

[0007] To address the above technical problems, the following technical solution is adopted: A system for fabricating small-aperture circuit boards with ultra-high aspect ratios, comprising: The system includes a frame, a first conveying mechanism disposed in front of the frame for conveying a substrate and an insulating plate, a first support mechanism movable along the front-back and up-down directions on the frame for supporting the substrate, a second support mechanism movable along the front-back direction below the first support mechanism for supporting the insulating plate, a drilling mechanism disposed on the frame for drilling, a second conveying mechanism disposed behind the frame for conveying copper plates for the circuit, and a stacking mechanism disposed behind the drilling mechanism. Both the first support mechanism and the second support mechanism include a first support component that is movably mounted on the frame in the front-back direction and is used to limit the radial misalignment of the plate, a second support component that is mounted on the first support component and is used to limit the axial misalignment of the plate, and a drive component that is mounted on the frame and is used to drive the first support component and the second support component to work.

[0008] Preferably, the drilling mechanism includes a first drilling assembly that is movable in the vertical direction on the frame and is used to drill positioning holes on the substrate; a second drilling assembly that is movable in the vertical direction on the frame and is used to drill holes on the insulating plate at positions corresponding to the positioning holes; and a third drilling assembly that is movable in the vertical direction behind the first drilling assembly and is used to drill holes on the substrate through the positioning holes.

[0009] Preferably, the first drilling assembly includes a drilling component and a dust collection component that are respectively movable in the vertical direction on both sides of the substrate. The second drilling assembly includes a drilling machine disposed above the insulating plate and a storage box disposed below the insulating plate; The third drilling assembly includes two drilling components that are respectively movable in the vertical direction and disposed on both sides of the substrate. The drilling component includes a drilling machine that is movable on the frame in the vertical direction, a first dust suction hood that is slidably disposed on the drilling end of the drilling machine in the vertical direction and used for dust suction, and a first elastic member disposed between the first dust suction hood and the drilling machine and used to force the first dust suction hood to slide away from the drilling machine. The vacuuming component includes a mounting column that is movable on the frame in the vertical direction, a second vacuum hood that is slidably disposed on the mounting column in the vertical direction and used for vacuuming, and a second elastic member disposed between the second vacuum hood and the mounting column and used to force the second vacuum hood to slide away from the mounting column.

[0010] Preferably, the first drilling assembly, the second drilling assembly, and the third drilling assembly are all provided with support plates for supporting the plate material.

[0011] Preferably, the first support assembly includes two mounting seats that are movable on the frame in the front-back direction, two side limiting plates that are slidably disposed on the two mounting seats in the left-right direction, two rear limiting plates that are disposed at the rear ends of the two side limiting plates, and two front limiting members that are disposed at the front ends of the two side limiting plates and can be opened and closed. The second support component includes an upper limit plate and a lower limit plate that are slidably disposed on the two side limit plates in the left-right direction, respectively.

[0012] Preferably, the side limiting plate is provided with a first guide wheel and a third elastic member disposed between the side limiting plate and the mounting base for forcing the two side limiting plates to slide towards each other; The upper limit plate and the lower limit plate are connected to each other to form a U-shaped structure. The U-shaped structure is provided with a second guide wheel and a fourth elastic member disposed between the U-shaped structure and the mounting base to force the two U-shaped structures to slide towards each other. The drive assembly includes a first guide plate disposed on the frame and connected to the first guide wheel, and a second guide plate disposed on the frame and connected to the second guide wheel; When the mounting base moves forward, the first guide plate forces the two side limiting plates to slide in opposite directions via the first guide wheel; when the mounting base moves backward, the second guide plate forces the two U-shaped structures to slide in opposite directions via the second guide wheel.

[0013] Preferably, the front limiting member includes a front limiting plate that is slidably disposed on the side limiting plate in the left-right direction, a fifth elastic member disposed between the front limiting plate and the mounting base and used to force the two front limiting plates to slide towards each other, and a third guide wheel disposed on the front limiting plate and used to push the two front limiting plates to slide in opposite directions in conjunction with the conveying of the plate.

[0014] Preferably, both the first conveying mechanism and the second conveying mechanism include a conveyor body and a pusher disposed at one end of the conveyor body near the frame for pushing the plate.

[0015] Preferably, the stacking mechanism includes a limiting member disposed on the frame for positioning the copper plates of the circuit, a conveying member disposed below the limiting member for conveying the carrier, and a pressing member disposed above the frame for pressing and stacking the various plates on the carrier.

[0016] A method for manufacturing a small-aperture circuit board includes the following steps: Step 1: Loading process. The substrate is transported to the first support mechanism for positioning through the first conveying mechanism, the insulating board is transported to the second support mechanism for positioning through the first conveying mechanism, and the circuit copper board is transported to the stacking mechanism through the second conveying mechanism. Step 2: In a single drilling process, the first support mechanism with a substrate and the second support mechanism with an insulating plate move simultaneously into the drilling mechanism. The drilling mechanism first drills positioning holes on the substrate and drills through holes at the positions corresponding to the positioning holes on the insulating plate. Step 3: Secondary drilling process. The drilling mechanism first drills the spherical expansion part on the lower surface of the substrate through the positioning hole. Then, the drilling mechanism drills the countersunk hole and ventilation hole on the upper surface of the substrate through the positioning hole. Step 4: Stacking process. When the drilled substrate moves into the stacking mechanism along with the first support mechanism and the drilled insulating plate along with the second support mechanism, the first support mechanism moves downward and stacks with the second support mechanism. Then, the stacking mechanism presses the substrate, the insulating plate and the circuit copper plate to stack.

[0017] The beneficial effects of this invention are: (1) In use, the substrate and the insulating plate are first conveyed to the first support mechanism and the second support mechanism respectively by the first conveying mechanism. Then, the substrate and the insulating plate are supported and positioned by the first support component and the second support component. The positioning effect is good and the positioning is accurate. Then, the first support mechanism with the substrate and the second support mechanism with the insulating plate move to the drilling mechanism at the same time. Then, the drilling mechanism performs drilling work. Under the support and positioning of the first support mechanism and the second support mechanism, the opening of the substrate and the insulating plate is convenient and the positioning is more accurate. Finally, when the drilled substrate moves to the stacking mechanism at the same time with the first support mechanism and the drilled insulating plate with the second support mechanism, the first support mechanism moves down and stacks with the second support mechanism. The stacking mechanism can press the substrate, the insulating plate and the circuit copper plate to stack. Under the premise that the previous process is accurately positioned, the stacked circuit board has high precision and high yield.

[0018] (2) In this invention, by setting a drilling mechanism including a first drilling assembly, a second drilling assembly and a third drilling assembly, the drilling process is divided into two steps. Under the support and positioning of the first support mechanism and the second support mechanism, the first drilling assembly drills a positioning hole on the substrate, and the second drilling assembly drills a through hole on the insulating plate at the position corresponding to the positioning hole. Then the third drilling assembly can open the hole through the positioning of the positioning hole, so that the spherical expansion part, countersunk hole and ventilation hole drilled on the substrate are accurately positioned with the through hole on the insulating plate.

[0019] In summary, this equipment facilitates the drilling of circuit boards, provides accurate positioning, and achieves a high yield rate, making it particularly suitable for the field of circuit board manufacturing technology. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a high-precision small-aperture electronic circuit board provided by the present invention.

[0022] Figure 2 A perspective view of a small-aperture circuit board fabrication system with an ultra-high aspect ratio provided by the present invention.

[0023] Figure 3 A side view of a small-aperture circuit board fabrication system with ultra-high thickness-to-diameter ratio provided by the present invention.

[0024] Figure 4This is a top view of a small-aperture circuit board fabrication system with an ultra-high thickness-to-diameter ratio provided by the present invention.

[0025] Figure 5 Provided by the present invention Figure 4 A cross-sectional view along point A in the middle.

[0026] Figure 6-7 This invention provides a schematic diagram of the operation process of a small-aperture circuit board manufacturing system with an ultra-high thickness-to-diameter ratio.

[0027] Figure 8 A perspective view of the drilling mechanism provided by the present invention.

[0028] Figure 9 Provided by the present invention Figure 5 A magnified view of a section at point B in the middle.

[0029] Figure 10 A perspective view of the first support mechanism provided by the present invention.

[0030] Figure 11 The diagram shows the structure of the first support component and the second support component provided by the present invention.

[0031] Figure 12 A perspective view of the second support component provided by the present invention.

[0032] Figure 13 A top view of the first support mechanism provided by the present invention.

[0033] Figure 14 Provided by the present invention Figure 13 A schematic diagram of the first support mechanism sliding forward.

[0034] Figure 15 Provided by the present invention Figure 13 A schematic diagram of the first support mechanism sliding backward.

[0035] Figure 16 A schematic diagram of the structure of the first conveying mechanism provided by the present invention.

[0036] Figure 17 This is a schematic diagram of the stacking mechanism provided by the present invention. Detailed Implementation

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0038] Example 1 like Figure 1-17 As shown, a system for fabricating small-aperture circuit boards with ultra-high aspect ratios includes: Frame 1, a first conveying mechanism disposed in front of frame 1 for conveying substrate and insulating board; 2, a first support mechanism movable in the front-back and up-down directions disposed on frame 1 for supporting substrate; 3, a second support mechanism movable in the front-back direction disposed below the first support mechanism 3 for supporting insulating board; 4, a drilling mechanism disposed on frame 1 for drilling; 5, a second conveying mechanism disposed behind frame 1 for conveying circuit copper plate; 6, and a stacking mechanism disposed behind drilling mechanism 5; Both the first support mechanism 3 and the second support mechanism 4 include a first support component 31 that is movable on the frame 1 in the front-back direction and is used to limit the radial misalignment of the plate; a second support component 32 that is disposed on the first support component 31 and is used to limit the axial misalignment of the plate; and a drive component 33 that is disposed on the frame 1 and is used to drive the first support component 31 and the second support component 32 to work.

[0039] In this embodiment, by setting the first support mechanism 3 and the second support mechanism 4, the substrate and the insulating plate are supported and positioned, so that the substrate and the insulating plate can be accurately positioned during the entire production process. Then, the drilling mechanism 5 is used to perform separate drilling processing on the substrate and the insulating plate before stacking, which is convenient. Then, the stacking mechanism 7 is used to stack the substrate, the insulating plate and the circuit copper plate under accurate positioning, thereby improving the product yield. In detail, the substrate and the insulating plate are first conveyed to the first support mechanism 3 and the second support mechanism 4 respectively by the first conveying mechanism 2, and then the substrate and the insulating plate are supported and positioned by the first support component 31 and the second support component 32. Next, the first support mechanism 3 with the substrate and the second support mechanism 4 with the insulating plate move simultaneously into the drilling mechanism 5, and then the drilling process is carried out through the drilling mechanism 5. Finally, when the drilled substrate moves into the stacking mechanism 7 along with the first support mechanism 3 and the drilled insulating plate along with the second support mechanism 4, the first support mechanism 3 moves downward and stacks with the second support mechanism 4, and the stacking mechanism 7 presses the substrate, the insulating plate and the circuit copper plate to stack.

[0040] It should be noted that the preheating plate on the circuit board is first embedded in the insulating plate, and then enters the ultra-high thickness-to-diameter ratio small aperture circuit board manufacturing system together with the insulating plate for processing. The through holes on the preheating plate and the insulating plate can be processed at the same time, which is convenient for processing. In addition, the frame 1 is provided with a first mounting bracket 11 that moves in the vertical direction and is used to install the first support mechanism 3, so as to realize the vertical movement of the first support mechanism 3. A second mounting bracket 12 for installing the second support mechanism 4 is fixedly connected to the frame 1.

[0041] Furthermore, such as Figure 8-9 As shown, the drilling mechanism 5 includes a first drilling assembly 51 that is movable in the vertical direction on the frame 1 and used to drill positioning holes on the substrate; a second drilling assembly 52 that is movable in the vertical direction on the frame 1 and used to drill holes on the insulating plate at positions corresponding to the positioning holes; and a third drilling assembly 53 that is movable in the vertical direction behind the first drilling assembly 51 and used to drill holes on the substrate through the positioning holes.

[0042] In this embodiment, by setting the first drilling assembly 51 and the second drilling assembly 52 in conjunction with the first support mechanism 3 and the second support mechanism 4 for support and positioning, the processing and positioning of the positioning holes on the substrate and the through holes on the insulating plate are realized. By setting the third drilling assembly 53 in conjunction with the positioning holes, the positioning and opening of the spherical expansion part, countersunk hole and ventilation hole on the substrate are realized. Even if the third drilling assembly 53 extends into the positioning hole to perform drilling operation, the hole positions on the substrate and the insulating plate are accurately positioned.

[0043] In detail, the drilling process is divided into two steps. Under the support and positioning of the first support mechanism 3 and the second support mechanism 4, the first drilling assembly 51 drills a positioning hole on the substrate, and the second drilling assembly 52 drills a through hole on the insulating plate at the position corresponding to the positioning hole. Then, the third drilling assembly 53 can open the positioning hole through the positioning hole, so that the spherical expansion part, countersunk hole and ventilation hole drilled on the substrate are accurately positioned with the through hole on the insulating plate.

[0044] It should be noted that the third drilling assembly 53 first processes the spherical expansion section before processing the counterbore and vent hole. This means that the processing is completed when the counterbore and vent hole are processed to the point of connecting with the spherical expansion section, which makes it easier to control the processing time and improve production efficiency. In addition, there are multiple first drilling assemblies, second drilling assemblies 52 and third drilling assemblies 53, which are spaced apart in the left and right direction, which further improves the drilling speed and increases production efficiency.

[0045] Furthermore, such as Figure 8-9 As shown, the first drilling assembly 51 includes a drilling component 511 and a dust collection component 512 that are respectively movable in the vertical direction on both sides of the substrate. The second drilling assembly 52 includes a drilling machine 5111 disposed above the insulating plate and a storage box 521 disposed below the insulating plate. The third drilling assembly 53 includes two drilling components 511 that are respectively movable in the vertical direction and disposed on both sides of the substrate. The drilling component 511 includes a drilling machine 5111 that is movable in the vertical direction on the frame 1, a first dust suction hood 5112 that is slidably disposed in the vertical direction at the drilling end of the drilling machine 5111 and used for dust suction, and a first elastic member 5113 disposed between the first dust suction hood 5112 and the drilling machine 5111 and used to force the first dust suction hood 5112 to slide away from the drilling machine 5111. The vacuuming component 512 includes a mounting post 5121 that is movable in the vertical direction on the frame 1, a second vacuum hood 5122 that is slidably disposed on the mounting post 5121 in the vertical direction and used for vacuuming, and a second elastic member 5123 disposed between the second vacuum hood 5122 and the mounting post 5121 and used to force the second vacuum hood 5122 to slide away from the mounting post 5121.

[0046] In this embodiment, by setting a first dust suction hood 5112 in conjunction with a second dust suction hood 5122 or a storage box 521, the timely cleaning of drilled debris is achieved, avoiding the debris from interfering with the drilling machine 5111's drilling, and also preventing gaps between the stacked boards due to debris residue, which would result in product defects. By setting the first elastic element 5113 and the second elastic element 5123, the first dust cover 5112 and the second dust cover 5122 are made to fit the surface of the board more closely, preventing debris from leaking out.

[0047] In detail, during drilling, the drilling machine 5111 and the mounting post 5121 are moved closer to the board material until the first elastic element 5113 and the second elastic element 5123 are compressed. After the first dust suction cover 5112 and the second dust suction cover 5122 are in contact with the surface of the board material, the drilling machine 5111 starts drilling, and the first dust suction cover 5112, the second dust suction cover 5122 and the storage box 521 can clean up the debris in time.

[0048] It should be noted that the first dust hood 5112, the second dust hood 5122, and the storage box 521 are all connected to the negative pressure device. The negative pressure device itself and its installation method are existing technologies and will not be described in detail here.

[0049] Furthermore, such as Figure 8-9 As shown, the first drilling assembly 51, the second drilling assembly 52 and the third drilling assembly 53 are all provided with support plates 54 for supporting the plate.

[0050] In this embodiment, by setting a support plate 54 to support the plate, when the first drilling assembly 51, the second drilling assembly 52 and the third drilling assembly 53 move toward the plate to drill holes, the support plate 54 first supports the plate to avoid the plate bending during drilling, which would reduce the positioning accuracy.

[0051] It should be noted that the support plate 54 is set on the first dust hood 5112, the second dust hood 5122 and the storage box 521, which not only provides good support but also further reduces the possibility of debris leakage.

[0052] Furthermore, such as Figure 10-11 As shown, the first support assembly 31 includes two mounting seats 311 that are movable in the front-back direction on the frame 1, two side limiting plates 312 that are slidably disposed on the two mounting seats 311 in the left-right direction, two rear limiting plates 313 that are disposed at the rear ends of the two side limiting plates 312, and two front limiting members 314 that are disposed at the front ends of the two side limiting plates 312 and can be opened and closed. The second support component 32 includes an upper limit plate 321 and a lower limit plate 322 that are respectively slidably disposed on two side limit plates 312 in the left and right directions.

[0053] In this embodiment, by setting the side limiting plate 312, the rear limiting plate 313, the front limiting member 314, the upper limiting plate 321, and the lower limiting plate 322, a limiting area is formed to restrict the misalignment of the plate material in the radial and axial directions.

[0054] In detail, when the mounting base 311 moves forward, the two side limiting plates 312 move in opposite directions to prevent the interference plate from entering the limiting area; When the sheet material is conveyed into the limiting area, the front limiting member 314 opens (i.e., the limiting area opens) until the sheet material has completely moved into the limiting area, at which point the front limiting member 314 closes, restricting the sheet material within the limiting area. When the mounting base 311 moves toward the drilling mechanism 5, the two side limiting plates 312 move toward each other and hold the supporting plate, restricting the plate from misaligning in the radial direction. When the mounting base 311 moves toward the stacking mechanism 7, the two upper limit plates 321 and the two lower limit plates 322 move toward the outside of the plate, and the two side limit plates 312 are able to support the plate in the air, so that the stacking machine can stack the plates together.

[0055] It should be noted that the upper limit plate 321 and the lower limit plate 322 may have chamfers or rounded corners at the ends near the first conveying mechanism 2 so that the guide plate can enter between the upper limit plate 321 and the lower limit plate 322.

[0056] Furthermore, such as Figure 10-15 As shown, the side limiting plate 312 is provided with a first guide wheel 3121 and a third elastic member 3122 disposed between the side limiting plate 312 and the mounting base 311 and used to force the two side limiting plates 312 to slide towards each other. The upper limit plate 321 and the lower limit plate 322 are connected to each other to form a U-shaped structure. The U-shaped structure is provided with a second guide wheel 3211 and a fourth elastic element 3212 disposed between the U-shaped structure and the mounting base 311 and used to force the two U-shaped structures to slide towards each other. The drive assembly 33 includes a first guide plate 331 disposed on the frame 1 and connected to the first guide wheel 3121, and a second guide plate 332 disposed on the frame 1 and connected to the second guide wheel 3211; When the mounting base 311 moves forward, the first guide plate 331 forces the two side limiting plates 312 to slide in opposite directions via the first guide wheel 3121; when the mounting base 311 moves backward, the second guide plate 332 forces the two U-shaped structures to slide in opposite directions via the second guide wheel 3211.

[0057] In this embodiment, by setting a first guide plate 331 in conjunction with a first guide wheel 3121 and a third elastic element 3122, the first support component 31 will present different working states as it moves to different work positions with the mounting base 311. By setting a second guide plate 332 in conjunction with a second guide wheel 3211 and a fourth elastic element 3212, the second support component will present different working states as it moves to different work positions with the mounting base 311. Thus, the operation of the first support component 31 and the second support component 32 is realized, and the continuity of the device operation is improved.

[0058] In detail, when the mounting base 311 moves forward, the first guide plate 331 forces the two side limiting plates 312 to slide in opposite directions via the first guide wheel 3121. At this time, the fourth elastic element 3212 forces the two U-shaped structures to move towards each other, thereby enabling the upper limiting plate 321 and the lower limiting plate 322 to perform a limiting function (e.g., Figure 14 (as shown) When the mounting base 311 moves backward, the third elastic element 3122 forces the two side limiting plates 312 to move towards each other and supports the support plate, so that the two side limiting plates 312 perform the limiting function. At this time, the second guide plate 332 forces the two U-shaped structures to slide backward through the second guide wheel 3211, releasing the limiting of the upper limiting plate 321 and the lower limiting plate 322, and avoiding interference with the operation of the overlapping mechanism 7 (e.g., Figure 15 (As shown).

[0059] It should be noted that, in order to improve the stability of the device, the number of the first guide wheel 3121, the second guide wheel 3211, the third elastic element 3122, and the fourth elastic element 3212 is set to multiple.

[0060] Furthermore, such as Figure 11As shown, the front limiting member 314 includes a front limiting plate 3141 that is slidably disposed on the side limiting plate 312 in the left-right direction, a fifth elastic member 3142 disposed between the front limiting plate 3141 and the mounting base 311 and used to force the two front limiting plates 3141 to slide towards each other, and a third guide wheel 3143 disposed on the front limiting plate 3141 and used to push the two front limiting plates 3141 to slide in opposite directions in conjunction with the conveying of the plate.

[0061] In this embodiment, the automatic opening and closing function of the front limit member 314 is achieved by setting the fifth elastic member 3142 and the third guide wheel 3143 in conjunction with the conveying of the plate. The structure is ingenious and easy to use.

[0062] In detail, when the plate moves into the limiting area, the plate forces the two front limiting plates 3141 to slide back to back to open the limiting area through the third guide wheel 3143. After the plate has completely moved into the limiting area, the fifth elastic element 3142 forces the two front limiting plates 3141 to slide towards each other to close the limiting area.

[0063] It should be noted that both front limit plates 3141 have chamfers or rounded corners at the ends near the plate. When the plate moves into the limit area, the fifth elastic element 3142 forces the two front limit plates 3141 to move towards each other. The chamfers or rounded corners serve both as guides to avoid significant interference between the front limit plates 3141 and the plate when they move, and as pushes the plate so that the plate fits against the front limit plates 3141 and the rear limit plates 313. In addition, the third guide wheel 3143 can also restrict the conveying direction of the plate, thereby facilitating the movement of the plate between the upper limit plate 321 and the lower limit plate 322.

[0064] Furthermore, such as Figure 16 As shown, both the first conveying mechanism 2 and the second conveying mechanism 6 include a conveyor body 21 and a pusher 22 disposed at one end of the conveyor body 21 near the frame 1 for pushing the plate.

[0065] In this embodiment, by setting the conveyor body 21 to push the conveyor to the first support mechanism 3 or the second support mechanism 4 or the stacking assembly, the plate is easily pushed into the first support mechanism 3 or the second support mechanism 4 or the stacking assembly.

[0066] It should be noted that this application does not limit the specific structure of the pusher. The following is only one structure for reference. For example, the pusher includes a telescopic rod disposed on the conveyor body 21, a pusher plate rotatably disposed on the telescopic rod, and a sixth elastic member disposed between the telescopic rod and the pusher plate to force the pusher plate to rotate from a horizontal position to a vertical position. In use, when the conveyor body 21 conveys the plate, the plate presses the pusher plate to rotate to a horizontal position. When the plate moves to the end of the conveyor body 21, the sixth elastic member forces the pusher plate to rotate to a vertical position, thereby extending the telescopic rod to control the pusher plate to push the plate into the first support mechanism 3 or the second support mechanism 4 or the stacking assembly.

[0067] In addition, the first elastic element 5113, the second elastic element 5123, the third elastic element 3122, the fourth elastic element 3212, the fifth elastic element 3142 and the sixth elastic element can be helical springs, leaf springs or torsion springs, etc., and their own and installation methods are existing technologies, which will not be described in detail here.

[0068] Furthermore, such as Figure 1-2 as well as Figure 17 As shown, the stacking mechanism 7 includes a limiting member 71 disposed on the frame 1 for positioning the copper plates of the circuit, a conveying member 73 disposed below the limiting member 71 for conveying the carrier 72, and a pressing member 74 disposed above the frame 1 for pressing and stacking the various plates on the carrier 72.

[0069] In this embodiment, by setting up the pressing member 74 in conjunction with the conveying member 73, the automated stacking operation between the substrate, the insulating plate and the circuit copper plate is realized, and the positioning is accurate during stacking under the positioning action of the first support mechanism 3, the second support mechanism 4 and the limiting member 71. In detail, during use, the carrier 72 is first transported to the underside of the limiting member 71 by the conveying member 73. Then, the second conveying mechanism 6 transports the circuit copper plate into the limiting member 71 to position the circuit copper plate and the carrier 72. At the same time, the first support mechanism 3 and the second support mechanism 4 move the perforated substrate and the insulating plate to the top of the limiting member 71. The first support mechanism 3 moves downward to stack with the second support mechanism 4 to prevent the substrate from moving out of the gap between the first support mechanism 3 and the second support mechanism 4 during stacking. Finally, the pressing member 74 presses the substrate, the insulating plate and the circuit copper plate into the carrier 72 from top to bottom. Then, the conveying member 73 transports the carrier 72 with the stacked circuit board out to complete the stacking operation.

[0070] It should be noted that this application does not limit the specific structure of the limiting member 71. It can be similar to the structure of the first support component 31 and the second support component 32. The only difference is that the side limiting plate 312 of the limiting member 71 is fixedly connected to the frame 1.

[0071] Example 2 like Figure 1-7 As shown, a method for manufacturing a small-aperture circuit board includes the following steps: Step 1: Loading process. The substrate is transported to the first support mechanism 3 for positioning through the first conveying mechanism 2, the insulating board is transported to the second support mechanism 4 for positioning through the first conveying mechanism 2, and the circuit copper plate is transported to the stacking mechanism 7 through the second conveying mechanism 6. Step 2: In a single drilling process, the first support mechanism 3 with a substrate and the second support mechanism 4 with an insulating plate move simultaneously into the drilling mechanism 5. The drilling mechanism 5 first drills positioning holes on the substrate and drills through holes at the positions corresponding to the positioning holes on the insulating plate. Step 3: Secondary drilling process. The drilling mechanism 5 first drills the spherical expansion part on the lower surface of the substrate through the positioning hole. Then, the drilling mechanism 5 drills the countersunk hole and the vent hole that communicate with the spherical expansion part on the upper surface of the substrate through the positioning hole. Step 4: Stacking process. When the drilled substrate moves into the stacking mechanism 7 along with the first support mechanism 3 and the drilled insulating plate along with the second support mechanism 4, the first support mechanism 3 moves downward and stacks with the second support mechanism 4. Then, the stacking mechanism 7 presses the substrate, the insulating plate and the circuit copper plate to stack.

[0072] In the description of this invention, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0073] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0074] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A system for fabricating small-aperture circuit boards with ultra-high aspect ratios, characterized in that, include: The system includes a frame, a first conveying mechanism disposed in front of the frame for conveying a substrate and an insulating plate, a first support mechanism movable along the front-back and up-down directions on the frame for supporting the substrate, a second support mechanism movable along the front-back direction below the first support mechanism for supporting the insulating plate, a drilling mechanism disposed on the frame for drilling, a second conveying mechanism disposed behind the frame for conveying copper plates for the circuit, and a stacking mechanism disposed behind the drilling mechanism. Both the first support mechanism and the second support mechanism include a first support component that is movably mounted on the frame in the front-back direction and is used to limit the radial misalignment of the plate, a second support component that is mounted on the first support component and is used to limit the axial misalignment of the plate, and a drive component that is mounted on the frame and is used to drive the first support component and the second support component to work.

2. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 1, characterized in that, The drilling mechanism includes a first drilling assembly that is movable in the vertical direction on the frame and is used to drill positioning holes on the substrate; a second drilling assembly that is movable in the vertical direction on the frame and is used to drill holes on the insulating plate at positions corresponding to the positioning holes; and a third drilling assembly that is movable in the vertical direction behind the first drilling assembly and is used to drill holes on the substrate through the positioning holes.

3. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 2, characterized in that, The first drilling assembly includes a drilling component and a dust collection component that are respectively movable in the vertical direction on both sides of the substrate; The second drilling assembly includes a drilling machine disposed above the insulating plate and a storage box disposed below the insulating plate; The third drilling assembly includes two drilling components that are respectively movable in the vertical direction and disposed on both sides of the substrate. The drilling component includes a drilling machine that is movable on the frame in the vertical direction, a first dust suction hood that is slidably disposed on the drilling end of the drilling machine in the vertical direction and used for dust suction, and a first elastic member disposed between the first dust suction hood and the drilling machine and used to force the first dust suction hood to slide away from the drilling machine. The vacuuming component includes a mounting column that is movable on the frame in the vertical direction, a second vacuum hood that is slidably disposed on the mounting column in the vertical direction and used for vacuuming, and a second elastic member disposed between the second vacuum hood and the mounting column and used to force the second vacuum hood to slide away from the mounting column.

4. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 2, characterized in that, The first drilling assembly, the second drilling assembly, and the third drilling assembly are all provided with support plates for supporting the plate material.

5. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 1, characterized in that, The first support assembly includes two mounting seats that are movable on the frame in the front-to-back direction, two side limiting plates that are slidably disposed on the two mounting seats in the left-to-right direction, two rear limiting plates that are disposed at the rear ends of the two side limiting plates, and two front limiting members that are disposed at the front ends of the two side limiting plates and can be opened and closed. The second support component includes an upper limit plate and a lower limit plate that are slidably disposed on the two side limit plates in the left-right direction, respectively.

6. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 5, characterized in that, The side limiting plate is provided with a first guide wheel and a third elastic member disposed between the side limiting plate and the mounting base and used to force the two side limiting plates to slide towards each other; The upper limit plate and the lower limit plate are connected to each other to form a U-shaped structure. The U-shaped structure is provided with a second guide wheel and a fourth elastic member disposed between the U-shaped structure and the mounting base to force the two U-shaped structures to slide towards each other. The drive assembly includes a first guide plate disposed on the frame and connected to the first guide wheel, and a second guide plate disposed on the frame and connected to the second guide wheel; When the mounting base moves forward, the first guide plate forces the two side limiting plates to slide in opposite directions via the first guide wheel; when the mounting base moves backward, the second guide plate forces the two U-shaped structures to slide in opposite directions via the second guide wheel.

7. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 5, characterized in that, The front limiting member includes a front limiting plate that is slidably disposed on the side limiting plate in the left-right direction, a fifth elastic member disposed between the front limiting plate and the mounting base and used to force the two front limiting plates to slide towards each other, and a third guide wheel disposed on the front limiting plate and used to push the two front limiting plates to slide in opposite directions in conjunction with the conveying of the plate.

8. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 1, characterized in that, Both the first conveying mechanism and the second conveying mechanism include a conveyor body and a pusher disposed at one end of the conveyor body near the frame for pushing the plate.

9. The ultra-high aspect ratio small aperture circuit board fabrication system according to claim 1, characterized in that, The stacking mechanism includes a limiting member disposed on the frame for positioning the copper plates of the circuit, a conveying member disposed below the limiting member for conveying the carrier, and a pressing member disposed above the frame for pressing and stacking the various plates on the carrier.

10. A method for manufacturing a small-aperture circuit board with an ultra-high aspect ratio according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Loading process. The substrate is transported to the first support mechanism for positioning through the first conveying mechanism, the insulating board is transported to the second support mechanism for positioning through the first conveying mechanism, and the circuit copper board is transported to the stacking mechanism through the second conveying mechanism. Step 2: In a single drilling process, the first support mechanism with a substrate and the second support mechanism with an insulating plate move simultaneously into the drilling mechanism. The drilling mechanism first drills positioning holes on the substrate and drills through holes at the positions corresponding to the positioning holes on the insulating plate. Step 3: Secondary drilling process. The drilling mechanism first drills the spherical expansion part on the lower surface of the substrate through the positioning hole. Then, the drilling mechanism drills the countersunk hole and ventilation hole on the upper surface of the substrate through the positioning hole. Step 4: Stacking process. When the drilled substrate moves into the stacking mechanism along with the first support mechanism and the drilled insulating plate along with the second support mechanism, the first support mechanism moves downward and stacks with the second support mechanism. Then, the stacking mechanism presses the substrate, the insulating plate and the circuit copper plate to stack.

Images