Piezoelectric vibration device and method for manufacturing piezoelectric vibration device

Abstract

The present application relates to a piezoelectric vibration device capable of discharging gas in the holding member without increasing the operation time and a manufacturing method thereof. The manufacturing method has: a member preparation step (S110) of providing a frame-shaped sealing material configured to be rectangular in plan view in a portion of either one of a lid member (10) and a holding member (2) that contacts the other, and preparing the lid member (10) or the holding member (2) having a thick wall portion; a lid member mounting step (S120) of mounting the lid member (10) on the holding member (2) with the thick wall portion contacting the other, with the piezoelectric element (7) bonded to the holding member (2); a temporary fixing step (S130) of heating the lid member (10) mounted on the holding member (2) to melt a portion of the thick wall portion to temporarily fix the lid member (10) to the holding member (2); and a sealing step (S140) of melting the sealing material (11) including the thick wall portion to seal the lid member (10) to the holding member (2).

Description

Technical Field

[0001] This invention relates to piezoelectric vibrating devices and methods for manufacturing piezoelectric vibrating devices. Background Technology

[0002] Piezoelectric vibrating devices include, for example, crystal oscillators that utilize crystal resonators. The crystal oscillator has a crystal resonator as a piezoelectric element, a holding member for holding the crystal resonator, and a cover member for sealing the holding member. The crystal oscillator holds the crystal resonator within the box-shaped holding member, which is made of an insulator such as ceramic. The crystal oscillator is sealed by the cover member with the electrodes of the crystal resonator engaged with electrodes within the holding member.

[0003] The manufacturing method of such a piezoelectric vibrating device includes a piezoelectric element mounting step, a cover configuration step, a cover temporary mounting step, and a cover joining step. In the piezoelectric element mounting step, the piezoelectric element is joined to an electrode pad within a retaining member coated with a conductive bonding material. In the cover configuration step, a cover having a bonding member is positioned at the opening of the retaining member to which the piezoelectric element is joined. In the cover temporary mounting step, a portion of the bonding member of the cover disposed on the retaining member is melted and temporarily mounted on the retaining member. In the cover joining step, the retaining member is joined to the cover in a nitrogen atmosphere or a vacuum atmosphere. For example, Patent Document 1 discloses a cover temporary mounting step in which a metal rod is pressed against a portion of the cover and energized, thereby using resistance heating to melt a portion of the bonding member of the cover and temporarily mount it to the retaining member.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-88563 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] In the manufacturing method of the piezoelectric vibration device described in Patent Document 1, during the temporary mounting process of the cover, the cover is temporarily fixed to the retaining member while being pressed against it using the metal rod. Thus, the cover is temporarily mounted to the retaining member in a state of close contact with it. Therefore, during the cover joining process, gas generated from the joining material or the like within the retaining member is difficult to escape from the gap between the cover and the retaining member.

[0009] The object of the present invention is to provide a piezoelectric vibrating device capable of discharging gas generated from bonding materials or the like within a retaining component, and a method for manufacturing the piezoelectric vibrating device.

[0010] Solution to the above technical problems

[0011] The inventors have studied a piezoelectric vibrating device capable of discharging gas generated from bonding materials or the like within a holding component, and a method for manufacturing such a piezoelectric vibrating device. As a result of in-depth research, the inventors conceived of the following configuration.

[0012] In a method for manufacturing a piezoelectric vibrating device according to an embodiment of the present invention, the piezoelectric vibrating device includes at least a piezoelectric element, a retaining member to which the piezoelectric element is joined, and a cover member covering the piezoelectric element to which the retaining member is joined, wherein the cover member is joined to the retaining member to which the piezoelectric element is joined by a sealing material.

[0013] The manufacturing method of the piezoelectric vibration device includes:

[0014] The component preparation process with sealing material involves, when the piezoelectric element, which is engaged with the retaining member, is covered by the cover component, at least a portion of the portion of either the cover component or the retaining member that contacts the other is provided with the sealing material, which is rectangular in shape when viewed from above. The cover component or the retaining member has a thick-walled portion of the sealing material, which is thicker at at least one corner than the portion other than the corner. The cover component mounting process involves bringing the thick-walled portion of either the cover component or the retaining member into contact with the other and mounting the cover component onto the retaining member to which the piezoelectric element is engaged. The temporary fixing process involves heating at least the cover component mounted on the retaining member, melting at least a portion of the thick-walled portion to temporarily fix the cover component and the retaining member. The sealing process involves heating the temporarily fixed cover component and the retaining member respectively, melting the sealing material including the thick-walled portion to seal the cover component and the retaining member.

[0015] In the above configuration, during the cover component mounting process, the cover component is mounted on the retaining member via a sealing material having the thick-walled portion. The cover component is supported by the thick-walled portion at a distance from the retaining member corresponding to the thickness of the thick-walled portion. Therefore, during the temporary fixing process, a gap is created between the cover component and the retaining member, which are temporarily fixed by melting a portion of the thick-walled portion. Therefore, during the sealing process, when the cover component and the retaining member are heated in an atmospheric gas, the atmospheric gas rapidly flows into the retaining member from the gap between the cover component and the retaining member. This allows gas generated from the bonding material or the like within the retaining member to be discharged.

[0016] According to other viewpoints, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: In the temporary fixing step, the heating element is brought into contact with a portion of the cover component to heat the cover component.

[0017] In the above configuration, the sealing material is in contact with the cover member, which is directly heated by the heating element, thus heat is efficiently transferred from the heating element through the cover member. Therefore, during the temporary fixing process, even if the sealing material has a thick-walled portion, the cover member can be temporarily fixed to the retaining member without reducing the melting rate of the sealing material. This allows gases generated from the bonding material or the like within the retaining member to be released.

[0018] According to other viewpoints, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: In the temporary fixing step, the cover member is heated while being held by the mounting unit.

[0019] In the above configuration, during the cover component mounting process, the cover component is held in position relative to the retaining member by mounting the cover component onto the retaining member's mounting unit. Therefore, the positional accuracy of the cover component, which is temporarily fixed to the retaining member by the temporary fixing process, is improved, and the time required to transfer from the cover component mounting process to the temporary fixing process is shortened. This allows for the removal of gases generated from bonding materials or the like within the retaining member.

[0020] According to other viewpoints, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: In the temporary fixing step, the cover component is pressed by the heating element.

[0021] In the above configuration, during the temporary fixing process, the cover member is heated by the heating element while being pressed against the retaining member. Therefore, the melting rate of the thick-walled portion located between the cover member and the retaining member increases. This allows gases generated from the bonding material or the like within the retaining member to be expelled.

[0022] According to other viewpoints, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: In the temporary fixing step, at least a portion of the cover component that overlaps with at least a portion of the sealing material when viewed from above is pressed.

[0023] In the above configuration, the sealing material is located closest to the cover member that is directly heated by the heating element, thus heat is efficiently transferred from the heating element through the cover member. Therefore, during the temporary fixing process, even if the sealing material has a thick-walled portion, the cover member can be temporarily fixed to the retaining member without reducing the melting rate of the thick-walled portion. This allows gases generated from the bonding material or the like within the retaining member to be expelled.

[0024] According to other viewpoints, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: In the temporary fixing step, the heating element is brought into contact with a position located at an arbitrary outer edge side of the cover component, which is further from the center of the cover component when viewed from above, to heat the cover component.

[0025] In the above configuration, during the temporary fixing process, the cover member is pressed by the heating element between the center and any outer edge of the cover member in plan view. That is, the cover member, whose outer edge is supported by the retaining member, is pressed by the heating element to a position closer to the portion supported by the retaining member than to the center. The elastic deformation of the cover member when pressed by the heating element to this position, which is any outer edge closer to the center of the cover member, is smaller than the elastic deformation when pressed by the heating element to the center of the cover member. Therefore, even if the cover member returns to its state before elastic deformation after temporary fixing, the impact on the joint portion is suppressed, and thus the cover member is appropriately and temporarily fixed to the retaining member.

[0026] According to other viewpoints, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration: the sealing material is a gold-tin alloy.

[0027] In the above configuration, the sealing material is a gold-tin alloy, which therefore has high thermal conductivity. That is, the thick-walled portion of the sealing material is rapidly heated to its melting temperature. Therefore, during the temporary fixing process, the cover component can be temporarily fixed to the retaining component without reducing the melting rate of the thick-walled portion. This allows gases generated from the bonding material or the like within the retaining component to be released.

[0028] According to other viewpoints, the piezoelectric vibrating device of the present invention preferably comprises the following configuration: It is a piezoelectric vibrating device manufactured by the manufacturing methods described above for each of the piezoelectric vibrating devices.

[0029] In the above configuration, during the sealing process, when the piezoelectric vibrating device seals the retaining member through the cover, it can discharge gas generated from the bonding material or the like within the retaining member through the gap. Therefore, the piezoelectric vibrating device can suppress the deterioration of the piezoelectric elements within the retaining member.

[0030] According to other viewpoints, the piezoelectric vibrating device of the present invention preferably comprises the following configuration. The piezoelectric vibrating device is a piezoelectric vibrating device manufactured by the manufacturing methods described above, wherein the sealing material comprises a eutectic alloy and an aneutectic alloy with a melting point higher than the eutectic alloy, and the sealing material at least one corner of the rectangular frame-shaped sealing material in plan view comprises the aneutectic alloy.

[0031] In the above configuration, the corner portion of the sealing material contains a non-eutectic alloy with a higher melting point than the eutectic alloy, making it more difficult to melt than corner portions without the non-eutectic alloy. Furthermore, since the corner portion of the sealing material with the thick wall is relatively larger in volume compared to the straight portion, it is more difficult to melt compared to the edge portion. Therefore, when the piezoelectric vibrator is mounted (reflow mounted) to the external substrate by melting the solder, the sealing material is less likely to melt and flow out towards the cavity side. This prevents poor airtightness when the piezoelectric vibrator is mounted to the external substrate.

[0032] [eutectic alloy]

[0033] In this specification, a eutectic alloy refers to an alloy that solidifies from a liquid phase to a state having two solid phases during solidification. In this embodiment, the eutectic alloy is a gold-tin alloy. Eutectic alloys have lower melting points than aeutectic alloys.

[0034] Invention Effects

[0035] According to one embodiment of the present invention, it is possible to discharge gases generated from the bonding material or the like within the retaining member. Attached Figure Description

[0036] Figure 1 This is a schematic exploded perspective view showing the overall structure of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0037] Figure 2 yes Figure 1 Sectional view along direction A.

[0038] Figure 3 This is a top view of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0039] Figure 4 This is a flowchart of the piezoelectric element sealing process included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0040] Figure 5A This is a top view of the cover component prepared in the component preparation step with sealing material included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0041] Figure 5BThis is a side view along the length of a cover component prepared in the component preparation step with sealing material included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0042] Figure 5C This is a side view in the width direction of the cover component prepared in the component preparation step with sealing material included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0043] Figure 6 The holding component is included in the cover component mounting process in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention. Figure 3 A sectional view along direction A and a side view of the cover component mounted on the retaining component.

[0044] Figure 7 In the temporary fixing step included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention, a side view of the cover member heated by the heating element and the holding member heated by the holding member heating device are shown. Figure 3 Sectional view along direction A.

[0045] Figure 8 This is a cross-sectional view showing the cover member heated and pressed by the cover member heating device and the retaining member heated by the retaining member heating device in the sealing process included in the manufacturing method of the piezoelectric vibration device according to Embodiment 1 of the present invention.

[0046] Figure 9 In the temporary fixing step included in the manufacturing method of the piezoelectric vibration device according to Embodiment 2 of the present invention, the side view of the cover member heated by the heating element while held by the suction nozzle and the holding member heated by the holding member heating device are shown. Figure 3 Sectional view along direction A.

[0047] Figure 10 In the temporary fixing step included in the manufacturing method of the piezoelectric vibration device according to Embodiment 3 of the present invention, the side view of the cover member heated by the heating element while held by the suction nozzle and the holding member heated by the holding member heating device are shown. Figure 3 Sectional view along direction A.

[0048] Figure 11 This is a partial cross-sectional view of a piezoelectric vibrating device according to another embodiment of the present invention.

[0049] Figure 12 In the temporary fixing step included in the manufacturing method of the piezoelectric vibration device of the present invention, the side view of the cover member heated by the heating element while held by the suction nozzle is compared with the holding member heated by the holding member heating device. The holding member has a long side of 1.2 mm and a short side of 1.0 mm. Figure 3Sectional view along direction A. Detailed Implementation

[0050] Hereinafter, each embodiment will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are used to label the same parts, and the description of the same parts will not be repeated. In addition, the dimensions of the constituent parts in the drawings do not faithfully represent the actual dimensions of the constituent parts or the dimensional ratios of each constituent part.

[0051] Furthermore, in the following description of the piezoelectric vibrating device 1 as an embodiment of the present invention, the length direction of the piezoelectric vibrating device 1 is defined as the "X direction," the width direction as the "Y direction," and the opening direction of the opening of the holding member 2 that holds the piezoelectric element 7, which is orthogonal to the X and Y directions, is defined as the "Z direction." In this embodiment, the X and Y directions are horizontal directions. The Z direction is a vertical direction; that is, the Z direction is the up-down direction. However, this definition is not intended to limit the orientation of the piezoelectric vibrating device 1 during use.

[0052] Furthermore, in the following explanation, the terms "fixed," "connected," "joined," and "installed" (hereinafter referred to as "fixed, etc.") include not only cases where components are directly fixed to each other, but also cases where they are fixed via other components. That is, in the following explanation, the term "fixed, etc." includes both direct and indirect fixing of components to each other.

[0053] [Implementation Method 1]

[0054] <Composition of piezoelectric vibration device 1>

[0055] use Figures 1 to 3 The piezoelectric vibration device 1 of the present invention will be described. Figure 1 This is a schematic exploded perspective view showing the overall structure of the piezoelectric vibrating device 1. Figure 2 yes Figure 1 Sectional view along direction A. Figure 3 This is a top view of piezoelectric vibrating device 1.

[0056] like Figure 1 and Figure 2 As shown, the piezoelectric vibrating device 1 refers to a device having a piezoelectric element 7 that converts a force applied to a piezoelectric body into a voltage, or converts a voltage applied to a piezoelectric body into a force. The piezoelectric vibrating device 1 has a holding member 2, a piezoelectric element 7, and a cover member 10.

[0057] The retaining component 2 refers to a container made of an insulator used to hold the piezoelectric element 7. In this embodiment, the retaining component 2 is a ceramic shell. The retaining component 2 is constructed by sintering ceramic powder. Alternatively, the retaining component 2 can also be constructed by stacking multiple insulators. The retaining component 2 has a bottom 3, an electrode pad 4, a side wall portion 6, and an external terminal 5.

[0058] Bottom 3 is the portion that forms the bottom surface of the retaining member 2. Bottom 3 is composed of a rectangular plate-like member. On the upper surface of one side of bottom 3, an electrode pad 4, which is a conductive metal, is formed along one short side of the rectangular plate-like member. The electrode pad 4 is electrically connected to the piezoelectric element 7. The electrode pad 4 is part of the electrical circuit that applies voltage to the piezoelectric element 7. On the lower surface of the other side of bottom 3, an external terminal 5, which is a conductive metal, is deposited. The external terminal 5 is electrically connected to an external substrate (not shown). The external terminal 5 is a terminal used to send signals and apply voltage from the external substrate to the piezoelectric element 7. The electrode pad 4 and the external terminal 5 are electrically connected by a wiring pattern (not shown).

[0059] The sidewall portion 6 is the part that forms the side of the retaining member 2. The sidewall portion 6 is located at the outer edge of the bottom 3. The sidewall portion 6 is a frame-shaped wall surrounding the bottom 3. The sidewall portion 6 extends upward from the upper surface of the bottom 3. Furthermore, the sidewall portion 6 has a predetermined thickness from the outer side to the inner side. The upper end of the sidewall portion 6 has a mating surface 6a that engages with the cover member 10. The retaining member 2 thus configured forms an internal space S for accommodating the piezoelectric element 7 through the upper surface of the bottom 3 and the inner side of the sidewall portion 6. The retaining member 2 opens upward from the upper surface of the bottom 3. The electrode pad 4 is located within the internal space S.

[0060] The piezoelectric element 7 is a piezoelectric body that converts applied force into voltage or applied voltage into force. In this embodiment, the piezoelectric element 7 is a rectangular crystal vibrating plate obtained by cutting crystal in a specific direction. In the piezoelectric element 7, electrodes 8 are deposited on both sides of the pair of main surfaces with the largest area. A portion of the electrodes 8 is led out to one end in the longitudinal direction of the crystal vibrating plate. The piezoelectric element 7 is located within the internal space S of the holding member 2. The electrodes 8 of the piezoelectric element 7 are bonded to the electrode pads 4 of the holding member 2 by a conductive bonding material 9. Thus, the piezoelectric element 7 can be electrically connected to an external substrate via wiring patterns (not shown) from the electrodes 8 to the electrode pads 4 and external terminals 5. Furthermore, the piezoelectric element 7 is held in a cantilevered state by the holding member 2. Thus, the piezoelectric element 7 oscillates at a predetermined frequency by the voltage applied from the external substrate.

[0061] The cover member 10 is a component that seals the internal space S of the retaining member 2. The cover member 10 is made of a metallic material such as a Korva iron-nickel-cobalt alloy. Furthermore, the cover member 10 is, for example, coated with electrolytic nickel plating or non-electrolytic nickel plating. The lower surface of the cover member 10, which is a face, is located at the upper end of the retaining member 2 opposite to the retaining member 2. Viewed from above in the Z direction, the cover member 10 has an opening size that covers the internal space S in the retaining member 2. Furthermore, viewed from the Z direction, the cover member 10 is smaller than the retaining member 2.

[0062] like Figure 3 As shown, viewed from the Z direction, a frame-shaped sealing material 11 is provided in the cover member 10 at the portion coinciding with the mating surface 6a of the side wall portion 6 of the retaining member 2. That is, viewed from the Z direction, when the cover member 10 covers the internal space S containing the piezoelectric element 7 that engages with the retaining member 2, the portion in contact with the mating surface 6a of the retaining member 2 has a sealing material 11 surrounding the opening portion of the retaining member 2. The sealing material 11 is a gold-tin alloy. Viewed from the Z direction, the sealing material 11 has two linear portions 11b extending in the X direction along the length direction, two linear portions 11a extending in the Y direction along the width direction, and four corner portions 11c connecting the linear portions 11b along the length direction and the linear portions 11a along the width direction.

[0063] Viewed from the Z direction, the area Ar (refer to the shaded area) of the corners per unit length in the extension direction of the four corners 11c is larger than the area Al (refer to the shaded area) of the straight section in the length direction 11b per unit length in the extension direction of the straight section in the width direction 11a per unit length in the extension direction of the straight section in the width direction 11a (refer to the shaded area).

[0064] The sealing material 11 comprises a eutectic alloy and a non-eutectic alloy with a higher melting point than the eutectic alloy. In this embodiment, the corner portion 11c comprises a non-eutectic alloy. Furthermore, the non-eutectic alloy may be included not only in the corner portion 11c, but also in at least one of the straight portions 11a in the width direction or 11b in the length direction. The cover member 10 is joined to the mating surface 6a of the retaining member 2 via the sealing material 11. The internal space S of the retaining member 2 is a vacuum. Alternatively, the internal space S of the retaining member 2 may be sealed with nitrogen or the like.

[0065] In this manner, the piezoelectric vibrator 1 is sealed by the cover member 10, which houses the piezoelectric element 7 within the internal space S and is filled with nitrogen by the retaining member 2. The gold-tin alloy that joins the cover member 10 and the retaining member 2 contains a non-eutectic alloy with a melting point higher than that of a eutectic alloy. Furthermore, the corner portion 11c has a larger volume per unit length compared to the straight portions 11a in the width direction and 11b in the length direction, making it more difficult to melt than the straight portions. Therefore, when the piezoelectric vibrator 1 is mounted (reflow mounted) to the external substrate by melting the solder, even if the sealing material 11 melts due to the heat of the solder, it is difficult for it to flow out towards the cavity side. As a result, poor airtightness when mounting the piezoelectric vibrator 1 to the external substrate can be suppressed.

[0066] <Manufacturing Method of Piezoelectric Vibration Device 1>

[0067] Next, use Figures 4 to 8 The piezoelectric element sealing process S100 included in the manufacturing method of the piezoelectric vibration device 1 of the present invention will be described. Figure 4 This is a flowchart of the piezoelectric element sealing process S100 included in the manufacturing method of the piezoelectric vibration device 1. Figure 5A This is a top view of the cover component 10 prepared in the component preparation step S110 with sealing material included in the manufacturing method of the piezoelectric vibrating device 1. Figure 5B This is a side view along the length of the cover component 10 prepared in the component preparation step S110 with sealing material included in the manufacturing method of the piezoelectric vibrating device 1. Figure 5C This is a side view in the width direction of the cover component 10 prepared in the component preparation step S110 with sealing material included in the manufacturing method of the piezoelectric vibrating device 1. Figure 6 In the method for manufacturing the piezoelectric vibrating device 1, the cover component mounting step S120 is used to hold component 2. Figure 3 A sectional view along direction A and a side view of the cover member 10 mounted on the retaining member 2. Figure 7 This is a side view of the cover member 10 heated by the soldering iron 13 and a cross-sectional view of the retaining member 2 heated by the retaining member heating device 14, shown in the temporary fixing step S130 included in the manufacturing method of the piezoelectric vibrating device 1. Figure 8 This is a cross-sectional view showing the cover member 10 heated and pressed by the cover member heating device 15 and the retaining member 2 heated by the retaining member heating device 14 in the sealing process S140 included in the manufacturing method of the piezoelectric vibration device 1.

[0068] like Figure 4 As shown, the piezoelectric element sealing process S100 is a process in which the piezoelectric element 7 located in the internal space S of the retaining member 2 is sealed by the cover member 10 (see reference). Figure 2The piezoelectric element sealing process S100 includes a component preparation process with sealing material S110, a cover component mounting process S120, a temporary fixing process S130, and a sealing process S140.

[0069] As the initial state of the piezoelectric vibrating device 1, a piezoelectric element 7 is assembled in the holding member 2. The piezoelectric element 7 is bonded to the electrode pad 4 of the holding member 2 by a fusion bonding material. That is, within the internal space S of the holding member 2, the piezoelectric element 7 is assembled in a state that allows it to oscillate by the application of voltage.

[0070] like Figure 4 , Figure 5A , Figure 5B and Figure 5C As shown, the component preparation process S110 with sealing material is a process of preparing a component with sealing material 11, namely a cover component 10, in which sealing material 11 is provided in a specified state. In the component preparation process S110 with sealing material, in the prepared cover component 10, when the piezoelectric element 7, which is engaged with the retaining member 2, is covered by the cover component 10, the portion of the lower surface of the cover component 10 that is opposite to the piezoelectric element 7 and contacts the retaining member 2 is coated with sealing material 11 (see reference). Figure 3 The sealing material 11 is a gold-tin alloy in a eutectic state.

[0071] Viewed from above, i.e., perpendicular to the lower surface, the sealing material 11 provided on the cover member 10 is configured as a rectangular frame. Specifically, the sealing material 11 includes two straight sides extending in the width direction of the cover member 10 (straight side), two straight sides extending in the length direction of the cover member 10 (straight side), and four arc-shaped corner portions 11c connecting the width direction straight portions 11a and the length direction straight portions 11b. The width direction straight portions 11a and the length direction straight portions 11b extend in directions substantially perpendicular to each other. The four corner portions 11c have a predetermined curvature. The corner portions 11c contain a non-eutectic alloy.

[0072] The radial width Wr of the four corner portions 11c is larger than the width Wl of the cover member 10 in the two longitudinal straight portions 11b and the longitudinal width Ws of the cover member 10 in the two width straight portions 11a. Furthermore, each of the four corner portions 11c has a thick-walled portion with a thickness Tr that is thicker than the thickness Tl of the two longitudinal straight portions 11b in the direction perpendicular to the lower surface and the thickness Ts of the two width straight portions 11a in the direction perpendicular to the lower surface. In other words, the four corner portions 11c protrude in a direction perpendicular to the lower surface of the cover member 10 than the width straight portions 11a and the length straight portions 11b. Therefore, the volume per unit length of the four corner portions 11c of the sealing material 11 in the extension direction is larger than the volume per unit length of the width straight portions 11a and the length straight portions 11b.

[0073] like Figure 4 , Figure 6 and Figure 7 As shown, the cover component mounting process S120 is a process in which the cover component 10, which is a component with sealing material prepared in the component preparation process S110 with sealing material, is mounted on the holding component 2. In the cover component mounting process S120, the holding component 2 is placed on the holding component heating device 14. Furthermore, the holding component 2 is preheated by the holding component heating device 14 and maintained at a predetermined temperature. The cover component 10 is adsorbed by the suction nozzle 12 of the mounting unit, i.e., the conveying device. The lower surface of the cover component 10, which is provided with sealing material 11, faces the holding component 2 and is mounted on the holding component 2 through the suction nozzle 12. The thick-walled portion of the corner 11c of the sealing material 11 on the lower surface of the cover component 10 contacts the mating surface 6a of the holding component 2. On the other hand, the straight portion 11a in the width direction and the straight portion 11b in the length direction of the sealing material 11 do not contact the mating surface 6a.

[0074] like Figure 4 and Figure 7 As shown, the temporary fixing process S130 is a process in which the cover component 10, which was mounted on the holding component 2 in the cover component mounting process S120, is temporarily fixed to the holding component 2. In the temporary fixing process S130, the soldering iron 13, which serves as a heating element, contacts the upper surface of the cover component 10. The soldering iron 13 is located approximately at the center in the width direction and approximately at the center in the length direction of the cover component 10. The cover component 10 is heated to a predetermined temperature by the soldering iron 13. Next, the sealing material 11 provided on the cover component 10 is heated by the cover component 10. Further, the sealing material 11 is heated by the holding component 2, which is maintained at a predetermined temperature by the holding component heating device 14.

[0075] A portion of the thick-walled portion of the corner 11c of the cover member 10 melts. If a predetermined heating temperature and a predetermined heating time are reached, the soldering iron 13 detaches from the cover member 10. In this way, during the cover member mounting process S120, while the holding member 2 is being heated by the holding member heating device 14, the cover member 10 is heated by the soldering iron 13. Therefore, the sealing material 11 melts faster than melting solely based on heat from the soldering iron 13. Furthermore, the amount of melting in the thick-walled portion of the corner 11c is adjusted by the contact position between the soldering iron and the cover member 10, the contact area between the soldering iron and the cover member 10, the heating time of the cover member 10 by the soldering iron, and the heating temperature of the cover member 10 by the soldering iron.

[0076] The sealing material 11 is bonded to the mating surface 6a of the retaining member 2 when the thickness Tr of the thick wall portion of the corner 11c is reduced accordingly by the amount of melting caused by the heating of the soldering iron 13. After a temporary fixing process S130, the sealing material 11 solidifies after being melted by the soldering iron 13 and the heated retaining member 2, thereby generating an aeutectic alloy with a higher melting point than a eutectic alloy. On the other hand, the straight portion 11a in the width direction and the straight portion 11b in the length direction of the sealing material 11 do not contact the mating surface 6a of the retaining member 2. That is, a gap is generated between the straight portion 11a in the width direction and the straight portion 11b in the length direction of the sealing material 11 of the cover member 10 and the mating surface 6a of the side wall portion 6 of the retaining member 2.

[0077] like Figure 4 , Figure 7 and Figure 8 As shown, the sealing process S140 is a process of sealing the retaining member 2 by temporarily fixing the cover member 10 to the retaining member 2 in the temporary fixing process S130. In the sealing process S140, the cover member 10 and the retaining member 2 are heated in a vacuum. The retaining member 2 is heated to a predetermined temperature by the retaining member heating device 14. The cover member 10 is pressed against the retaining member 2 while being heated to a predetermined temperature by the cover member heating device 15. The sealing material 11 is melted by the heat from the retaining member heating device 14 and the cover member heating device 15.

[0078] As the thick-walled portion of corner 11c melts, the straight portions 11a in the width direction and 11b in the length direction of the sealing material 11 approach the mating surface 6a. At this time, gas is generated in the internal space S of the retaining member 2 from the bonding material 9 that bonds the piezoelectric element 7 to the electrode pad 4. The generated gas is discharged to the outside of the internal space S from the gap between the straight portions 11a and 11b in the width direction and the mating surface 6a.

[0079] Due to the melting of the thick-walled portion of corner 11c, if the thickness Ts of the straight portion 11a in the width direction, the thickness Tl of the straight portion 11b in the length direction, and the thickness Tr of corner 11c are approximately the same, then the straight portion 11a in the width direction, the straight portion 11b in the length direction, and the corner 11c will contact the mating surface 6a. That is, the cover member 10 contacts the mating surface 6a via the sealing material 11. If the sealing material 11 cools, it will hold the member 2 together with the cover member 10. Thus, the opening of the member 2 is sealed by the cover member 10. At this time, the internal space S of the member 2 is a vacuum.

[0080] In the cover component mounting step S120 of the manufacturing method of the piezoelectric vibrating device 1 configured in this way, the cover component 10 is mounted on the retaining member 2 via a sealing material 11. The cover component 10 is supported by the thick-walled portion of the corner portion 11c at a position corresponding to the thickness Tr of the corner portion 11c at the joint surface 6a of the side wall portion 6. Therefore, in the temporary fixing step S130, a gap is formed between the cover component 10, which is temporarily fixed by melting the thick-walled portion of the corner portion 11c, and the joint surface 6a of the side wall portion 6 of the retaining member 2, except for the thick-walled portion of the corner portion 11c.

[0081] Therefore, in the sealing process S140, when the retaining member 2 and the cover member 10 are heated in a vacuum, the gas generated from the bonding material 9 and the like located in the internal space S of the retaining member 2 is discharged to the outside of the internal space S through the gap between the retaining member 2 and the cover member 10. Furthermore, since the cover member 10, which is provided with the sealing material 11, is directly heated by the soldering iron 13, the heat from the soldering iron 13 is efficiently transferred to the sealing material 11 via the metal cover member 10. Thus, the gas generated from the bonding material 9 and the like located in the internal space S of the retaining member 2 can be discharged.

[0082] The holding member 2 of the piezoelectric vibrating device 1 manufactured using the above-described manufacturing method is joined to the cover member 10 by a sealing material 11 whose thickness Tr of the corner 11c is greater than the thickness Ts of the straight portion 11a in the width direction and the thickness Tl of the straight portion 11b in the length direction. Therefore, viewed from the Z direction, the corner area Ar per unit length in the extension direction of the four corners 11c of the sealing material 11 is larger than the length direction straight portion area Al per unit length in the extension direction of the straight portion 11b in the length direction and the width direction straight portion area As per unit length in the extension direction of the straight portion 11a in the width direction. Furthermore, in the temporary fixing process S130, the sealing material 11 is formed into the non-eutectic alloy by melting and solidification. Therefore, the corners 11c of the sealing material 11 are more difficult to melt than the straight portions 11a in the width direction and the straight portions 11b in the length direction. Even when the sealing material 11 of the piezoelectric vibrating device 1 constructed in this way melts during the installation (reflow mounting) of the solder onto the external substrate, it is difficult for it to flow out to the cavity side.

[0083] [Implementation Method 2]

[0084] use Figure 4 and Figure 9 The piezoelectric element sealing process S100A included in the manufacturing method of the piezoelectric vibration device 1 according to Embodiment 2 of the present invention will be described. Figure 9 In the temporary fixing step S130A included in the manufacturing method of the piezoelectric vibration device 1, the side view of the cover member 10 heated by the soldering iron 13 and the retaining member 2 heated by the retaining member heating device 14 are shown. Figure 3 The A-direction sectional view is shown in the figure. Furthermore, in the following embodiments, details of points identical to those in the already described embodiments are omitted, and the description focuses on the different parts.

[0085] like Figure 4 As shown, the piezoelectric element sealing process S100A includes a component preparation process with sealing material S110, a cover component mounting process S120, a temporary fixing process S130A, and a sealing process S140.

[0086] In the cover component mounting process S120, the cover component 10 is adsorbed by the suction nozzle 12 of the mounting unit, i.e., the conveying device. The suction nozzle 12 is located approximately at the center of the cover component 10 in the width direction, offset to one side from the approximately center of the cover component 10 in the length direction. The lower surface of the cover component 10, which is provided with sealing material 11, faces the holding member 2 and is mounted on the holding member 2.

[0087] like Figure 4 and Figure 9 As shown, the temporary fixing process S130A is a process in which the cover component 10, which was mounted on the holding component 2 in the cover component mounting process S120, is temporarily fixed to the holding component 2. In the temporary fixing process S130A, while the cover component 10 is being held by the mounting unit, i.e., the suction nozzle 12, the soldering iron 13, which is a heating element, contacts the upper surface of the cover component 10. The soldering iron 13 is located approximately at the center of the cover component 10 in the width direction, but is offset to the opposite side from the approximately center of the cover component 10 in the length direction. That is, in the temporary fixing process S130A, the cover component 10 contacts the soldering iron 13 at a position on the outer edge of the cover component 10 that is offset from the center of the cover component 10 in the length direction when viewed from above. Therefore, the soldering iron 13 contacts the cover component 10 at a certain distance away from the suction nozzle 12.

[0088] Furthermore, while the cover component 10 is held in place by the suction nozzle 12, it is heated to a predetermined temperature by the soldering iron 13. The cover component 10 is heated by the soldering iron 13 and also heated by the holding member 2, which is maintained at a predetermined temperature by the holding member heating device 14. A portion of the thick-walled portion of the corner 11c of the sealing material 11 of the cover component 10 melts. At this time, the cover component 10, while held in position relative to the holding member 2 by the suction nozzle 12, engages with the mating surface 6a of the holding member 2. If the predetermined heating temperature and predetermined heating time are reached, the soldering iron 13 detaches from the cover component 10.

[0089] In the above configuration, the cover component 10 is temporarily fixed to the holding component 2 while being held in position relative to the holding component 2 by the suction nozzle 12. That is, when the thick-walled portion of the corner 11c melts, the cover component 10 does not shift position relative to the holding component 2. Therefore, the positional accuracy of the cover component 10, temporarily fixed to the holding component 2 via the thick-walled portion of the corner 11c, relative to the holding component 2 is improved, and the time required to transfer from the cover component mounting process S120 to the temporary fixing process S130 can be shortened. As a result, gases generated from the bonding material 9 and the like within the internal space S of the holding component 2 can be discharged without increasing the operation time.

[0090] [Implementation Method 3]

[0091] use Figure 4 and Figure 10 The piezoelectric element sealing process S100B included in the manufacturing method of the piezoelectric vibration device 1 according to Embodiment 3 of the present invention will be described. Figure 10 In the temporary fixing step S130B included in the manufacturing method of the piezoelectric vibration device 1, the side view of the cover member 10 heated by the soldering iron 13 and the retaining member 2 heated by the retaining member heating device 14 are shown. Figure 3 Sectional view along direction A.

[0092] like Figure 4 As shown, the piezoelectric element sealing process S100B includes a component preparation process with sealing material S110, a cover component mounting process S120, a temporary fixing process S130B, and a sealing process S140.

[0093] like Figure 4 and Figure 10As shown, the temporary fixing process S130B is a process of temporarily fixing the cover member 10 to the holding member 2. In the temporary fixing process S130B, while the cover member 10 is held by the suction nozzle 12, the soldering iron 13 is in contact with the upper surface of the cover member 10. Viewed from a direction perpendicular to the upper surface of the cover member 10 (top view), the soldering iron 13 is located at a portion that overlaps with at least a portion of the sealing material 11. In this embodiment, viewed from a direction perpendicular to the upper surface of the cover member 10, the soldering iron 13 is located at a portion that overlaps with the thick-walled portion of the corner 11c of the sealing material 11. That is, the soldering iron 13 is located at a position closest to the corner 11c, which has a thickness, in the sealing material 11.

[0094] Then, the cover member 10 is heated to a predetermined temperature by the soldering iron 13 and pressed against the retaining member 2 with a predetermined force. The sealing material 11 is heated and pressed by the cover member 10 heated by the soldering iron 13, and is heated by the retaining member 2, which is maintained at a predetermined temperature by the retaining member heating device 14. As a result, a portion of the thick-walled portion of the corner 11c melts. If the predetermined heating time and pressing time are reached, the soldering iron 13 detaches from the cover member 10.

[0095] In this embodiment, the soldering iron 13, when viewed from above, contacts a portion of the cover member 10 that overlaps with at least a portion of the sealing material 11. That is, the soldering iron 13, when viewed from above, contacts a position relative to the outer edge of the center of the cover member 10.

[0096] The cover member 10, supported by the outer edge of the retaining member 2, is pressed against the retaining member 2 by the soldering iron 13 at a position closer to the support of the retaining member 2 than the center of the cover member 10. The cover member 10 elastically deforms towards the retaining member 2 due to the pressure of the soldering iron 13. The amount of elastic deformation of the cover member 10 when pressed by the soldering iron 13 at any outer edge position closer to the center of the cover member 10 is smaller than the amount of elastic deformation when pressed by the soldering iron 13 at the center of the cover member 10. Therefore, by pressing the soldering iron 13 to a position any outer edge position closer to the center of the cover member 10, the influence on the joint portion when the cover member 10 returns to its state before elastic deformation after temporary fixing can be suppressed. Thus, the cover member 10 is appropriately and temporarily fixed to the retaining member 2.

[0097] Furthermore, in the temporary fixing process S130B, when the sealing material 11 of the cover member 10 adsorbed by the suction nozzle 12 is heated by the soldering iron 13, the heat transferred from the soldering iron 13 to the cover member 10 is transferred not only to the sealing material 11 but also to the suction nozzle 12. The heat transferred to the suction nozzle 12 does not melt the sealing material 11 and escape to the outside. Therefore, by suppressing the heat transferred from the soldering iron 13 to the suction nozzle 12, more heat is supplied to the sealing material 11. Therefore, in order to suppress the heat transferred to the suction nozzle 12, the soldering iron 13 is preferably heated to a position as far away from the suction nozzle 12 as possible.

[0098] In the temporary fixing process S130B, viewed from a direction perpendicular to the upper surface of the cover member 10, the portion of the cover member 10 that overlaps with the corner 11c of the sealing material 11 is heated by the soldering iron 13. Therefore, the heat from the soldering iron 13 is transferred more efficiently to the thick-walled portion of the sealing material 11. Thus, in the temporary fixing process S130, the cover member 10 can be temporarily fixed to the retaining member 2 without reducing the melting rate of the thick-walled portion, i.e., the corner 11c. This allows for the removal of gases generated from the bonding material 9 and the like within the internal space S of the retaining member 2 without increasing the operation time.

[0099] [Other Implementation Methods]

[0100] Furthermore, in the above embodiments, during the temporary fixing processes S130, S130A, and S130B, the cover component 10 is heated by the soldering iron 13 while being adsorbed by the suction nozzle 12. However, during the temporary fixing process, the cover component may also be heated by the soldering iron while not being adsorbed by the suction nozzle.

[0101] When the cover component is heated by a soldering iron without being adsorbed by the suction nozzle, during the cover component mounting process, the cover component is held by the suction nozzle at a position with a slight gap between it and the mating surface of the holding component.

[0102] Next, in the temporary fixing process, the cover component, which is attached to the suction nozzle, is detached from the suction nozzle and brought into contact with the holding component. For example, after the cover component is detached from the suction nozzle by a soldering iron moving towards the holding component, it is pressed against the holding component by the soldering iron. Furthermore, the cover component is heated while being pressed against the holding component by the soldering iron. That is, the cover component is heated by the soldering iron without being in contact with the suction nozzle. Therefore, the heat transferred from the soldering iron to the cover component is transferred to the sealing material instead of escaping to the outside through the suction nozzle.

[0103] In this temporary fixing process, the heat from the soldering iron is efficiently transferred to the sealing material instead of escaping from the suction nozzle, thus increasing the melting rate and expanding the melting range of the sealing material. This shortens the operation time of the temporary fixing process. Furthermore, the temporary fixing strength of the cover and retaining components based on the sealing material is improved. In addition, since heat is not dissipated from the suction nozzle, the temperature drop of the soldering iron can be suppressed when multiple cover components are continuously temporarily fixed. Therefore, the quality of the temporary fixing remains stable even when multiple cover components are continuously temporarily fixed by the soldering iron. This temporary fixing process, where the cover component is heated by the soldering iron while not being suctioned by the nozzle, is suitable for cases where the suction nozzle is made of a metal with high thermal conductivity.

[0104] Furthermore, in the above embodiment, a cover component 10 provided with sealing material 11 is prepared in the component preparation step S110. However, as... Figure 11 As shown, the component preparation process S110 with sealing material can also prepare a retaining component 2 with sealing material 11. In the cover component mounting process S120, the cover component 10 without sealing material 11 is mounted on the retaining component 2.

[0105] Furthermore, in the above embodiments, the retaining member 2 is, for example, rectangular in shape when viewed from above. The retaining member 2 is configured, for example, with a long side of 2.0 mm and a short side of 1.6 mm. Alternatively, the retaining member 2 is configured, for example, with a long side of 1.6 mm and a short side of 1.2 mm. Alternatively, the retaining member 2 is configured, for example, with a long side of 1.2 mm and a short side of 1.0 mm.

[0106] The diameter (adsorption area) of the suction nozzle 12 and the size (contact area) of the contact portion of the soldering iron 13 are determined based on the size of the retaining member 2 (cover member 10). For example, relative to the retaining member 2 with a long side of 1.2 mm and a short side of 1.0 mm, the diameter of the suction nozzle 12 is approximately 1 / 3 of the long side of the cover member 10 (see reference). Figure 12 For example, relative to the size of the holding member 2, which has a long side of 1.2 mm and a short side of 1.0 mm, the size of the tip of the soldering iron 13 is about 1 / 2 of the long side of the cover member 10 in the direction of the long side of the cover member 10.

[0107] Furthermore, in the above embodiments, the temporary fixing processes S130, S130A, and S130B involve heating the cover component 10 with a soldering iron 13 and heating the holding component 2 with a holding component heating device 14. However, the temporary fixing process can also be configured to heat only the cover component with a heating element.

[0108] Furthermore, in the above embodiments, the temporary fixing processes S130, S130A, and S130B heat the cover component 10 by directly contacting it with the soldering iron 13. However, the temporary fixing process may also heat the cover component without direct contact with a heating element such as a soldering iron. The temporary fixing process may, for example, involve heating the cover component 10 and the holding component in a heating furnace. Alternatively, heating based on far-infrared rays or lasers may also be used.

[0109] Furthermore, in the above embodiments, the temporary fixing processes S130, S130A, and S130B heat the cover member 10 by directly contacting it with the soldering iron 13. However, the temporary fixing process can also be configured to directly heat the cover member by pressing it with a heating element such as a soldering iron. In the temporary fixing process, the cover member is heated by the heating element while it is pressed against the holding member. Therefore, the melting rate of the thick-walled portion between the cover member and the holding member increases. As a result, gases generated from the bonding material or the like within the internal space of the holding member can be discharged.

[0110] Furthermore, in the above embodiment, the temporary fixing process S130A involves direct contact between the soldering iron 13 and the capping member 10, which is held in place by the suction nozzle 12. However, the temporary fixing process can also be configured to press the capping member while it is held in place by a mounting unit such as the suction nozzle. The capping member is heated by a heating element while being pressed against the holding member by the mounting unit. This allows gases generated from bonding materials or the like within the internal space of the holding member to be expelled.

[0111] Furthermore, in the above embodiment, the temporary fixing process S130A involves contacting the soldering iron 13 while the cover component 10 is held in place by the suction nozzle 12. However, the temporary fixing process can also be configured such that the cover component 10 is held in place by a mounting unit such as the suction nozzle, while the cover component is pressed by the mounting unit and a heating element such as the soldering iron. The cover component is heated by the heating element while being pressed by the mounting unit and the heating element respectively. At this time, the mounting unit and the heating element are positioned in a line-symmetrical manner that forms the center line in the length direction of the cover component. Therefore, in the temporary fixing process, the load per unit area applied to the sealing material can be made nearly uniform. As a result, deviations in the joint state at the four corners can be suppressed.

[0112] Furthermore, in the above embodiment, the temporary fixing process S130A involves contacting the soldering iron 13 while the cover member 10 is held by the suction nozzle 12. However, the temporary fixing process can also involve heating the cover member directly or indirectly by the suction nozzle, which is heated by a heating element, while the cover member is held by a mounting unit such as the suction nozzle. This allows gases generated from the bonding material or the like within the internal space of the holding member to be expelled.

[0113] Furthermore, in the above embodiment, the piezoelectric element 7 of the piezoelectric vibrating device 1 is located within the internal space S of the holding member 2. However, the piezoelectric element and electronic component of the piezoelectric vibrating device may also be located within the internal space of the holding member. The electronic component is an integrated circuit element that includes at least an oscillation circuit. Alternatively, the electronic component may be an oscillator with a built-in temperature sensor.

[0114] Furthermore, in the above embodiment, the sealing material 11 is a gold-tin alloy. However, the sealing material can be made of any material capable of sealing the retaining component through the cover component. Examples of sealing materials include brazing filler metal, thermoplastic resin, and glass.

[0115] Furthermore, in the above embodiment, the piezoelectric element sealing process S100 joins the cover member 10 to the single-piece retaining member 2. However, the piezoelectric element sealing process may also join the cover member to a sheet-like member formed by connecting multiple retaining members in a matrix.

[0116] Multiple retaining members 2 are integrally formed into interconnected sheet-like components. The size of the sheet-like components is the same as the size of the retaining members 2. That is, the number of retaining members 2 included in the sheet-like components varies depending on the size of the retaining members 2. By configuring it in this way, even if the size of the retaining members 2 changes, the manufacturing method of the piezoelectric vibrator does not require adjustment of the manufacturing apparatus to accommodate the size of the retaining members 2.

[0117] Furthermore, in the above embodiment, the piezoelectric element 7 of the piezoelectric vibrating device 1 is located within the internal space S of the holding member 2. However, the piezoelectric vibrating device can also be a so-called H-type piezoelectric vibrating device, having a bottom and frame-shaped sidewalls extending perpendicularly to the two opposing planes of the bottom. In the H-type piezoelectric vibrating device, the piezoelectric element is located on one plane of the bottom and inside one of the sidewalls. Furthermore, in the H-type piezoelectric vibrating device, an electronic component is mounted on the other plane of the bottom and inside the other sidewall. In the H-type piezoelectric vibrating device, a cover member is joined to the top ends of both the one and the other sidewalls by a sealing material.

[0118] The embodiments of the present invention have been described above, but these embodiments are merely illustrative of how to implement the present invention. Therefore, the present invention is not limited to the above embodiments and can be implemented with appropriate modifications without departing from its spirit.

[0119] Explanation of reference numerals in the attached figures

[0120] 1. Piezoelectric Vibration Device

[0121] 2 retaining components

[0122] 3 bottom

[0123] 4 electrode pads

[0124] 5 external terminals

[0125] 6 side wall sections

[0126] 6a joint surface

[0127] 7 Piezoelectric elements

[0128] 8 electrodes

[0129] 9. Bonding materials

[0130] 10 cover components

[0131] 11 Sealing materials

[0132] 11a Straight section in length direction

[0133] 11b Straight section in width direction

[0134] 11c Corner (Thick-walled section)

[0135] 12 suction nozzles

[0136] 13 soldering iron

[0137] 14 Holding component heating device

[0138] 15. Heating device for cover components

[0139] S interior space

[0140] Area of ​​the straight section in the width direction As

[0141] Area of ​​Al along the length direction (linear part)

[0142] Sealing process for S100, S100A, and S100B piezoelectric components

[0143] S110 Component Preparation Process with Sealing Material

[0144] S120 cover component assembly process

[0145] S130, S130A, S130B Temporary Fixing Procedures

[0146] S140 sealing process.

Claims

1. A method for manufacturing a piezoelectric vibrating device, wherein the piezoelectric vibrating device has at least: piezoelectric elements; The retaining component engages with the piezoelectric element; A cover component that covers the piezoelectric element that engages with the retaining component. The cover component is joined to the retaining component to which the piezoelectric element is attached by a sealing material. The manufacturing method of the piezoelectric vibration device is characterized by having: In the component preparation process with sealing material, when the piezoelectric element that is engaged with the retaining member is covered by the cover member, at least a portion of the portion of either the cover member or the retaining member that contacts the other is provided with the sealing material, which is rectangular in shape when viewed from above. The cover member or the retaining member has a thick-walled portion of the sealing material, where at least one corner is thicker than the portion other than the corner. In the cover component mounting process, the thick-walled portion of either the cover component or the retaining component is brought into contact with the other, and the cover component is mounted on the retaining component to which the piezoelectric element is joined; The temporary fixing process involves heating at least the cover component mounted on the retaining component, melting at least a portion of the thick-walled portion to temporarily fix the cover component to the retaining component. In the sealing process, the temporarily fixed cover component and the retaining component are heated respectively, so that the sealing material including the thick-walled portion melts to seal the cover component and the retaining component.

2. The method for manufacturing the piezoelectric vibration device as described in claim 1, characterized in that, In the temporary fixing process, the heating element is brought into contact with a portion of the cover component to heat the cover component.

3. The method for manufacturing a piezoelectric vibration device as described in claim 2, characterized in that, In the temporary fixing process, the cover component is heated while being held in place by the mounting unit.

4. The method for manufacturing the piezoelectric vibration device as described in claim 2 or claim 3, characterized in that, In the temporary fixing process, the cover component is pressed by the heating element.

5. The method for manufacturing the piezoelectric vibration device as described in claim 4, characterized in that, In the temporary fixing process, the portion of the cover component that overlaps with at least a portion of the sealing material when viewed from above is pressed.

6. A method for manufacturing a piezoelectric vibration device according to any one of claims 2 to 5, characterized in that, In the temporary fixing process, the heating element is brought into contact with a position on the outer edge of the cover component that is located at an arbitrary point further from the center of the cover component when viewed from above, thereby heating the cover component.

7. A method for manufacturing a piezoelectric vibrating device according to any one of claims 1 to 6, characterized in that, The sealing material is a gold-tin alloy.

8. A piezoelectric vibrating device, which is manufactured by the manufacturing method of the piezoelectric vibrating device according to any one of claims 1 to 7.

9. A piezoelectric vibrating device, manufactured by the method of manufacturing a piezoelectric vibrating device according to any one of claims 1 to 7, characterized in that, The sealing material comprises a eutectic alloy and an aeutectic alloy with a higher melting point than the eutectic alloy, and the sealing material in at least one corner of the rectangular frame-shaped sealing material in top view comprises the aeutectic alloy.

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