Identification device and identification method

Abstract

The image analysis unit (62) performs the following processes: instruction processing (S10-S18), instructing the measuring camera (53) to capture images of the electronic component (80) while varying its shutter speed between a predetermined lower limit speed and a predetermined upper limit speed; calculation processing (S20-S30), comparing the images of the lower surfaces (82a) of each lead (82) included in the multiple capture data obtained from the measuring camera (53) according to the instruction processing with the ideal images of the lower surfaces (82a) of each lead (82) included in the capture data as ideal data, and calculating the missing ratio of the image of the lower surface (82a) of each lead (82) relative to the ideal image for each of the multiple capture data; detection processing (S40), detecting the capture data whose missing ratio is below a predetermined first threshold among the multiple missing ratios calculated by the calculation processing; and selection processing (S44), selecting the shutter speed used for capturing the capture data detected by the detection processing.

Description

Technical Field

[0001] This disclosure relates to an identification device and a identification method for identifying the state of predetermined features of an element mounted on a substrate. Background Technology

[0002] Patent document 1 describes the following identification device: using an imaging device to take multiple pictures of the front end of the lead of the lead element at different shutter speeds, generating multiple shooting data, determining whether the position of the front end of the lead can be identified based on each of these multiple shooting data, and determining the optimal shutter speed as the shutter speed between the fastest and slowest shutter speeds among the shutter speeds at which the shooting data is determined to be identifiable.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: International publication number WO 2018 / 047252 A1. Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, the proportion of missing images in the generated image data varies depending on the shutter speed at which the image was captured. Therefore, when performing image recognition based on the captured image data, to improve the accuracy of the image recognition, the captured image data should have a smaller proportion of missing images. Consequently, the shutter speed used to generate the captured image data should be selected at a speed where the proportion of missing images is below a predetermined threshold.

[0008] However, the identification device described in Patent Document 1 does not take into account the situation where the proportion of missing images in the generated shooting data changes accordingly with the shutter speed at the time of shooting.

[0009] The purpose of this disclosure is to provide a recognition device and a recognition method that can select a shutter speed at which the proportion of image missing data generated is below a predetermined threshold.

[0010] Technical solutions for solving the problem

[0011] To achieve the above objective, the identification device of this disclosure identifies the state of predetermined feature portions of an element mounted on a substrate. The identification device includes: a light source that illuminates the element including the predetermined feature portions; an imaging device that captures images of the element receiving the light from the light source; and an image analysis device that performs image analysis on the image data captured by the imaging device and obtained from the imaging device to identify the state of the predetermined feature portions of the element. The image analysis device performs the following processes: an instruction process that instructs the imaging device to capture images of the element while varying its shutter speed between a predetermined lower limit speed and a predetermined upper limit speed; a calculation process that compares images of the predetermined feature portions included in multiple images obtained from the imaging device according to the instruction process with an ideal image of the predetermined feature portions included in images that are ideal data, and calculates the missing proportion of the image of the predetermined feature portion relative to the ideal image for each of the multiple images; a detection process that detects images of images with a missing proportion of less than or equal to a predetermined first threshold among the multiple missing proportions calculated by the calculation process; and a selection process that selects the shutter speed used for capturing the images detected by the detection process.

[0012] Invention Effects

[0013] According to this disclosure, it is possible to select a shutter speed at which the proportion of image missing data generated is below a predetermined first threshold. Attached Figure Description

[0014] Figure 1 This is a top view showing the overall structure of the component mounting machine according to one embodiment of the present disclosure.

[0015] Figure 2 This is a block diagram representing the control device of a component mounting machine that uses an identification device.

[0016] Figure 3 This is a schematic diagram showing the positional relationship between the nozzle and the measuring unit.

[0017] Figure 4 It is a diagram showing the inspection surface of an electronic component obtained from shape measurement.

[0018] Figure 5 It is the data from shooting at different shutter speeds, equivalent to Figure 4 A magnified view of region A in the image.

[0019] Figure 6 It means Figure 2 The flowchart shows the steps of shutter speed selection processing performed by the image analysis unit.

[0020] Figure 7 It means Figure 6The flowchart shows the subsequent steps of the shutter speed selection process. Detailed Implementation

[0021] Hereinafter, embodiments of the present disclosure will be described in detail based on the accompanying drawings. Figure 1 This refers to component mounting machine 1. Component mounting machine 1 is a device used to perform mounting operations on electronic components relative to the circuit board 70. For example... Figure 1 As shown, the component mounting machine 1 includes a substrate handling device 10, a component supply device 20, a component transfer device 30, a component camera 41, a substrate camera 42, an identification device 50, and a control device 60. In the following description, the horizontal width direction of the component mounting machine 1 ( Figure 1 The left and right directions are set as the X-axis direction, and the horizontal length direction of component mounting machine 1 is set as the X-axis direction. Figure 1 The vertical direction (up and down) is set as the Y-axis direction, and the vertical direction perpendicular to both the X-axis and Y-axis ( Figure 1 The front and back directions are set as the Z-axis direction.

[0022] The substrate transport apparatus 10, consisting of a belt conveyor or the like, sequentially transports the circuit boards 70 in the transport direction. The substrate transport apparatus 10 positions the circuit boards 70 at a predetermined position within the component mounting machine 1. Furthermore, after performing the mounting process of the component mounting machine 1, the substrate transport apparatus 10 removes the circuit boards 70 from the machine.

[0023] The component supply device 20 supplies electronic components to be assembled onto the circuit board 70. The component supply device 20 has multiple slots arranged side-by-side in the X-axis direction. Feeders 21 are detachably disposed in each of the multiple slots. The component supply device 20 conveys and moves a carrier belt via the feeders 21, at the front end side of the feeders 21 (…). Figure 1 The upper part of the device supplies electronic components.

[0024] In addition, the component supply device 20 supplies relatively large electronic components, such as lead components, in a side-by-side arrangement on the tray 22. The component supply device 20 stores multiple trays 22 on storage shelves 23 divided in the vertical direction, and pulls out predetermined trays 22 according to the installation process to supply electronic components such as lead components.

[0025] The component transfer device 30 is configured to move in both the X-axis and Y-axis directions. The component transfer device 30 is located at the rear of the component mounting machine 1 along its length. Figure 1 The component transfer device 30 is positioned above the component supply device 20 on the front side (on the upper side). The component transfer device 30 includes a head drive device 31, a moving stage 32, and an assembly head 33. The head drive device 31 is configured to move the moving stage 32 in the XY axis direction via a linear motion mechanism.

[0026] The assembly head 33 is a holding device that is detachably mounted on the moving stage 32 of the head drive device 31 and holds electronic components. Additionally, the assembly head 33 supports multiple suction nozzles 34 detachably mounted on multiple nozzle holders (see reference). Figure 3 The assembly head 33 supports the nozzles 34 in a manner that allows it to rotate about an R axis parallel to the Z axis and to move up and down.

[0027] Each of the suction nozzles 34 is controlled relative to the assembly head 33 in terms of its lifting position (Z-axis position), angle, and negative pressure supply state. The suction nozzles 34 are supplied with negative pressure to adsorb and hold electronic components supplied in the take-off section of the feeder 21 and those supplied by the tray 22. With this structure, the assembly head 33 of this embodiment holds electronic components by adsorption.

[0028] The component camera 41 and the substrate camera 42 are digital imaging devices equipped with imaging elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). The component camera 41 and the substrate camera 42 capture images within their field of view based on control signals from a control device 60 that is connected and capable of communication, and then send the captured data to the control device 60.

[0029] The component camera 41 is fixed to the base of the component mounting machine 1 with its optical axis vertical (Z-axis direction), configured to take pictures from below the component transfer device 30. More specifically, the component camera 41 is configured to photograph the lower surface of the electronic component held in the nozzle 34. Specifically, the lens unit of the component camera 41 is set to focus on an object at a certain distance from the component being photographed. In addition, the field of view of the lens unit of the component camera 41 is set to include the entire nozzle 34 supported by the mounting head 33.

[0030] A substrate camera 42 is mounted on the moving stage 32 of the component transfer device 30 with its optical axis pointing downwards in the vertical direction (Z-axis direction). The substrate camera 42 is configured to capture images of the circuit board 70. A control device 60, which acquires image data from the substrate camera 42, identifies, for example, positioning marks attached to the substrate through image processing, thereby identifying the positioning state of the circuit board 70 by the substrate transport device 10. Furthermore, the control device 60 corrects the position of the moving stage 32 based on the positioning state of the circuit board 70 to control the assembly process in a manner that allows for the assembly of electronic components.

[0031] The identification device 50 measures the three-dimensional position (spatial position represented by three-dimensional coordinates) of the measurement point set on the electronic component. Furthermore, since the identification device 50 is configured to include the image analysis unit 62 contained in the subsequent control device 60, a detailed description of the identification device 50 will be provided later.

[0032] The control device 60 mainly consists of a CPU, various memories, a display, and control circuits. Based on image data obtained from images captured by the component camera 41 and the substrate camera 42, and the judgment result of the identification device 50 (described later) regarding the suitability of the electronic components, the control device 60 controls the installation process of mounting electronic components onto the circuit board 70. Figure 2 As shown, the control device 60 is connected to the control unit 61, image analysis unit 62, and storage device 66 via a bus, and an input / output interface 67 is connected to it. A motor control circuit 68 and a shooting control circuit 69 are connected to the input / output interface 67.

[0033] The mounting control unit 61 controls the position of the mounting head 33 and the operation of the suction mechanism via the motor control circuit 68. More specifically, the mounting control unit 61 receives information output from various sensors provided in the component mounting machine 1 and the results of various recognition processes. Furthermore, based on the control program stored in the storage device 66, the information from various sensors, and the results of image processing and recognition processing, the mounting control unit 61 sends control signals to the motor control circuit 68. This controls the position and rotation angle of the suction nozzle 34 supported by the mounting head 33.

[0034] Since the image analysis unit 62 constitutes the recognition device 50 described later, the structure of the recognition device 50 will be explained in detail. The storage device 66 is composed of an optical drive device such as a hard disk or flash memory. This storage device 66 stores control programs for operating the component mounting machine 1, image capture data transferred from the component camera 41 and the substrate camera 42 to the control device 60 via a bus and communication cables, and temporary image processing data from the recognition device 50. The input / output interface 67 is located between the CPU, the storage device 66, and the control circuits 68 and 69, and adjusts the data format conversion and signal strength.

[0035] The motor control circuit 68 is used to control the motors of each axis of the component transfer device 30 based on the control signals from the mounting control unit 61. As a result, the assembly head 33 is positioned in each axial direction. In addition, through the control of the motors of each axis, the predetermined lifting position (Z-axis position) and rotation angle of the nozzle 34 are indexed.

[0036] The image capture control circuit 69 controls the image capture of the element camera 41, the substrate camera 42, and the measurement camera 53 of the recognition device 50 based on the image capture control signal sent by the control device 60. In addition, the image capture control circuit 69 acquires the image capture data obtained by the element camera 41, the substrate camera 42, and the measurement camera 53, and stores it in the storage device 66 via the input / output interface 67.

[0037] The identification device 50 is a device for determining whether an electronic component is suitable or not. In this embodiment, the identification device 50 is assembled as part of the component mounting machine 1. The identification device 50 determines the suitability of electronic components held by suction at the nozzle 34 of the component transfer device 30.

[0038] Here, the electronic component that the identification device 50 determines as suitable or unsuitable is an electronic component having a component body and multiple electrode portions. The electrode portions of the electronic component are provided on the component body and are electrically connected to the pads of the circuit board 70 after the electronic component is placed on the circuit board 70. Specifically, the electrode portions are leads of leaded components or protruding terminals of chip components. Hereinafter, the case where the electronic component 80 that the suitability determination is made is a leaded component will be explained.

[0039] like Figure 3 As shown, the electronic component 80 has a component body 81 and leads 82 corresponding to multiple electrode portions. Here, the outer surface of the component body 81 facing the side opposite to the assembly head 33 (the lower side in the vertical direction) and the outer surface of the multiple leads 82 in the electronic component 80 held in the assembly head 33 are defined as "inspection surfaces". That is, as Figure 3 As shown, when the electronic component 80 is held in an appropriate posture by adsorption, that is, when the upper surface of the component body 81 becomes the adsorption surface 81a adsorbed by the nozzle 34, the lower surface 81b of the component body 81 and the lower surface 82a of the lead wire 82 are "inspection surfaces". On the other hand, when the electronic component 80 is held in opposite positions, that is, when the lower surface 81b of the body becomes the adsorption surface, the upper surface of the component body 81 and the upper surface of the lead wire 82 are "inspection surfaces".

[0040] The identification device 50 measures the three-dimensional position of the measurement point set on the electronic component 80. In this embodiment, the identification device 50 measures the three-dimensional position of each measurement point by measuring the three-dimensional shape (hereinafter also simply referred to as "three-dimensional shape") of the inspection surface represented by three-dimensional coordinates.

[0041] The recognition device 50 includes: two projectors 51 and 52 for acquiring imaging data for measuring three-dimensional shape, and a measuring camera 53; and an image analysis unit 62 (see reference) that forms part of the control device 60. Figure 2Two projectors 51 and 52 and a measuring camera 53 are fixed to the base of the component mounting machine 1. The two projectors 51 and 52 are devices that are positioned 90° off the optical axis of the measuring camera 53 and project a predetermined pattern of light onto the object to be measured, which is a three-dimensional object.

[0042] Two projectors 51 and 52 generate predetermined patterned light through a slit or a transmissive liquid crystal, respectively, and project the patterned light onto the object through a projection lens. In this embodiment, the patterned light projected by the projectors 51 and 52 consists of stripes with a brightness that varies in a sinusoidal wave pattern.

[0043] Similar to the element camera 41, the measuring camera 53 is a digital camera with an imaging element. For example... Figure 3 As shown, the measuring camera 53 is configured to be separated from the projector 51 (52) by a predetermined distance Lp in the direction of the pattern light arrangement, and captures the pattern light projected onto the object. The measuring camera 53 captures images based on control signals from the control device 60, which is connected to it for communication, and sends the captured data obtained through the capture to the control device 60.

[0044] The image analysis unit 62 determines the three-dimensional shape of the object based on multiple image data obtained by the measurement camera 53. In this embodiment, the image analysis unit 62 uses multiple image data corresponding to each pattern light to measure the three-dimensional shape of the object using a phase-shifting method. Furthermore, since the phase-shifting method is well-known, a detailed description of its method is omitted.

[0045] Figure 4 The three-dimensional shape of the electronic component 80 visualized by the image analysis unit 62 is represented by the brightness of each part ( Figure 4 The height (Z coordinate) of a part is represented by the density of the ink. Figure 5 It is equivalent to Figure 4 An enlarged view of region A of the three-dimensional shape of electronic component 80. Furthermore, Figure 5 (a) and Figure 5 The difference in (b) is that it is visualized based on shooting data obtained at different shutter speeds. Figure 5 (a) and Figure 5 In (b), the regions 82a11–82a14 and 82a21–82a24, enclosed by single-dotted lines, are the regions where the visual images of the lower surfaces 82a of the four leads 82 contained in regions A1 and A2 exist. That is, ideally, the visual images of the lower surfaces 82a of the four leads 82 should cover the entire region within regions 82a11–82a14 and 82a21–82a24. However, regardless of… Figure 5 In region (a) 82a11~82a14, it is still in Figure 5 In regions 82a21–82a24 of (b), the visualization images of the lower surfaces 82a of the four leads 82 do not cover the entire region, resulting in image gaps. However, Figure 5 The proportion of missing images in regions 82a21–82a24 of (b) is higher than that of the missing images in region (b). Figure 5 The missing proportion of the image in regions 82a11 to 82a14 of (a) is small. This missing proportion varies depending on the shutter speed at which the shooting data is taken. Furthermore, since the smaller the missing proportion of the image, the higher the accuracy of image recognition, it is required to select the shutter speed with the smallest missing proportion of the image.

[0046] Figure 6 as well as Figure 7 This refers to the shutter speed selection process performed by the image analysis unit 62, particularly the CPU described above. Hereinafter, each step of the process will be marked with "S". The shutter speed selection process is appropriately performed before the installation of the starting component, when the component to be installed is changed, or when the recognition device 50, including the measuring camera 53, has undergone changes over the years.

[0047] exist Figure 6 First, the CPU sets the shutter speed of the measuring camera 53 to an initial value (S10). In this embodiment, since the component is photographed while the shutter speed is varied in multiple stages between a predetermined lower limit speed and a predetermined upper limit speed, the initial value is, for example, the predetermined lower limit speed. The predetermined lower limit speed can be the slowest shutter speed that can be set by the measuring camera 53, or it can be a shutter speed faster than the slowest shutter speed. Furthermore, before entering S10, that is, before performing the shutter speed selection process, or immediately after completing the S10 process, the CPU picks up the electronic component 80 to be measured through the nozzle 34 and positions the mounting head 33 in each axial direction, thereby moving the electronic component 80 to a measurement position above the measuring camera 53.

[0048] Next, the CPU instructs the measuring camera 53 to take a picture at the set shutter speed (S12). According to this instruction, the measuring camera 53 takes a picture of the inspection surface of the electronic component 80 at the set shutter speed. The CPU obtains the generated image data from the measuring camera 53, binarizes it, and saves it to the aforementioned storage device 66 (see reference). Figure 2(S14). Each pixel in the shooting data obtained from the measuring camera 53 has, for example, any integer value from 0 to 255, i.e., a brightness value. Binarization refers to the process of setting pixels with brightness values ​​exceeding a predetermined threshold to "1" and pixels with brightness values ​​below the predetermined threshold to "0". After binarization, pixels that will become "0" are judged as missing pixels, and pixels that will become "1" are judged as pixels that are not missing. Thus, judging missing pixels becomes easier than judging the shooting data before binarization. Furthermore, in S14, the shooting data of the binarized object is shooting data directly obtained from the measuring camera 53, but it actually represents data representing the three-dimensional shape visualized based on the shooting data directly obtained from the measuring camera 53. The reason for this description is to avoid complicating the explanation.

[0049] Next, the CPU determines whether to end the shooting of the measuring camera 53 (S16). This determination is made by checking whether the shutter speed should be changed to the predetermined upper limit speed. In this determination, if the shutter speed is not changed to the predetermined upper limit speed, that is, if the shooting of the measuring camera 53 has not ended (S16: No), the CPU changes the current shutter speed to a shutter speed with a predetermined step size (S18) and returns the process to S12. Then, the CPU continues to perform the following process until the shutter speed reaches the predetermined upper limit speed: while sequentially increasing the shutter speed (S18), it instructs the measuring camera 53 to shoot (S12), and accordingly, it binarizes the shooting data obtained from the measuring camera 53 and saves it to the storage device 66 (S14). And when the shutter speed reaches the predetermined upper limit speed, the CPU determines that the shooting of the measuring camera 53 should end (S16: Yes) and the process proceeds to S20. Furthermore, the predetermined step size increased in S18 above can remain constant from the predetermined lower limit speed to the predetermined upper limit speed, or it can be divided into several stages and vary in the middle.

[0050] In S20, the CPU reads one of the multiple binarized image data stored in S14 from the storage device 66. In the following S22, the CPU compares the image of the feature portion of the read image data with the image of the feature portion of the image data used as ideal data. Here, the image data used as ideal data, which is the object of comparison, is of course the data obtained by binarizing the image data used as ideal data. Furthermore, in this embodiment, the feature portion is the part of the inspection surface to be height measured; specifically, it is the lower surface 82a of each lead 82. If the electronic component 80 to be measured and its inspection surface are determined, and the measurement position of the electronic component 80 above the measuring camera 53 is determined, then the information determining the feature portion, such as the coordinates and size, in the image data obtained from the measuring camera 53 is determined. Therefore, if the information determining the feature portion in the image data is stored in the storage device 66 beforehand, in S22, the CPU determines the feature portion of the image data based on the read information, and can easily compare the image contained in the determined feature portion in the read image data with the image contained in the determined feature portion in the image data used as ideal data.

[0051] Next, the CPU calculates the proportion of the image missing from the determined feature regions in the read-out image data relative to the proportion of the image missing from the determined feature regions in the image data used as ideal data (S24). Currently, the image data of the object being processed is... Figure 5 The shooting data shown in (a). However, in Figure 5 (a) shows only a portion of the total captured data, including the data contained in region A1. Figure 5 In (a), the identified feature regions are regions 82a11 to 82a14. Figure 5 In (a), the denser portions of the captured data, i.e., the unmissing parts of the image, are equivalent to "1" in binarization, while the thinner portions, i.e., the missing parts of the image, are equivalent to "0" in binarization. Therefore, the missing proportion of the image in each region 82a11 to 82a14 is calculated to be a value between 20% and 50%. Furthermore, the determined feature not only covers regions 82a11 to 82a14 but also the entire region corresponding to the lower surfaces 82a of all leads 82, so the missing proportion is calculated for each region. Since the determined feature covers multiple regions within the captured data, the missing proportion is calculated for each region, thus enabling the calculation of multiple missing proportions. In this embodiment, when multiple missing proportions are calculated, the CPU also calculates the average of the calculated multiple missing proportions.

[0052] Next, the CPU saves the calculated missing proportion to storage device 66 (S26). At this time, if multiple calculated missing proportions exist, their average value is calculated as described above, and the CPU saves the average value of the calculated missing proportions in S26. Additionally, the shutter speed of the shooting data, which serves as the basis for calculating the missing proportion, is also saved along with the missing proportion.

[0053] Next, the CPU determines whether the missing proportion has been calculated for all the stored captured data (S28). If, in this determination, captured data for which the missing proportion has not yet been calculated still remains in the storage device 66 (S28: No), the CPU changes the captured data to the next captured data (S30) and then returns to the process described in S20. Thereafter, the CPU continues to process the following until the captured data stored in the storage device 66 disappears: while sequentially changing the captured data to be read (S30), it reads captured data (S20), calculates the missing proportion of the feature determined based on the read captured data (S22, S24), and stores the calculated missing proportion in the storage device 66 (S26). Furthermore, if there is no captured data in the storage device 66 for which the missing proportion has not been calculated (S28: Yes), the CPU initiates further processing. Figure 7 The S40.

[0054] In S40, the CPU detects the smallest missing percentage among multiple missing percentages stored in storage device 66. Figure 5 (b) shows the relationship as described above with Figure 5 (a) Shooting data captured at different shutter speeds. Due to Figure 5 The proportion of missing images in regions 82a21–82a24 of (b) is calculated to be between a few percent and 10%. Therefore, if the proportion of missing images of identified feature areas other than regions 82a21–82a24 in the captured data also exhibits the same tendency, then the average proportion of missing images of identified feature areas in the captured data is higher than that of missing images of other feature areas. Figure 5 The missing percentage (average) of (a) with respect to the captured data is small. Thus, since the missing percentage of the image of the feature determined based on the captured data changes, the smallest missing percentage can be detected.

[0055] Next, the CPU determines whether the detected minimum missing percentage is above a predetermined value (an example of a "predetermined second threshold") (S42). The predetermined value refers to the maximum allowed missing percentage of the image of a feature region for the image analysis unit 62 to perform image analysis of the feature region determined based on the captured data. Therefore, in S42, even if the missing percentage of the image of the feature region is the minimum, the CPU determines whether it exceeds the allowable range for performing image analysis of that feature region. In the determination in S42, if the detected minimum missing percentage is less than the predetermined value (S42: No), that is, if the minimum missing percentage of the image of the feature region is within the allowable range for performing image analysis of that feature region, the CPU selects the shutter speed at which the captured data with the calculated minimum missing percentage is captured (S44). As described above, the shutter speed corresponding to the calculated missing percentage is also stored in the storage device 66, so in S44, the CPU reads and selects the shutter speed corresponding to the detected minimum missing percentage. The selected shutter speed is stored in the storage device 66 as the shutter speed of the measuring camera 53 when the starting element is installed. After processing by S44, the CPU ends the shutter speed selection process.

[0056] On the other hand, in the determination of S42, if the detected minimum missing ratio is above a predetermined value (S42: Yes), that is, if the minimum missing ratio of the feature image exceeds the allowable range for image analysis of that feature, the CPU notifies the operator of this situation (S46). The warning is given, for example, by displaying warning text on the display included in the recognition device 50. Alternatively, an audible warning may also be given. Furthermore, a warning may be given simultaneously by display and sound.

[0057] Next, the CPU asks the operator whether to change the conditions and re-execute the process from S12 (S48). The questioning method is the same as the warning notification in S46, considering methods such as displaying on the screen, emitting sound, or both. If the operator refuses to re-execute after changing the conditions (S48: No), the CPU ends the shutter speed selection process. On the other hand, if the operator agrees to re-execute after changing the conditions (S48: Yes), the CPU changes the conditions according to the operator's instructions (S50) and returns the process to S12 (S48: Yes). Figure 6 Specifically, the changes to the conditions may include changing the predetermined lower speed and the predetermined upper speed to other predetermined values, changing the predetermined step size increased in S18 to other predetermined values, and changing lighting conditions such as lighting intensity and lighting angle.

[0058] As explained above, the identification device 50 of this embodiment is an identification device for identifying the state of the lower surface 82a of each lead 82 of an electronic component 80 mounted to a circuit board 70. The identification device 50 includes: projectors 51 and 52 that illuminate the electronic component 80 including the lower surface 82a of each lead 82; a measuring camera 53 that captures images of the electronic component 80 receiving the light illuminated by the projectors 51 and 52; and an image analysis unit 62 that performs image analysis on the image data captured by and obtained from the measuring camera 53 to identify the state of the lower surface 82a of each lead 82 of the electronic component 80. Furthermore, the image analysis unit 62 performs the following processes: instruction processing (S10-S18), instructing the measuring camera 53 to capture images of the electronic component 80 while varying its shutter speed in multiple stages between a predetermined lower limit speed and a predetermined upper limit speed; calculation processing (S20-S30), comparing the images of the lower surface 82a of each lead 82 included in the multiple shooting data obtained from the measuring camera 53 according to the instruction processing with the ideal image of the lower surface 82a of each lead 82 included in the shooting data as ideal data, and calculating the missing ratio of the image of the lower surface 82a of each lead 82 relative to the ideal image for each of the multiple shooting data; detection processing (S40), detecting the shooting data with the smallest missing ratio among the multiple missing ratios calculated by the calculation processing; and selection processing (S44), selecting the shutter speed used in capturing the shooting data detected by the detection processing.

[0059] Thus, in the identification device 50 of this embodiment, the shutter speed with the lowest proportion of image loss in the generated captured data can be selected. Furthermore, the shutter speed selection is automatic, thus saving the operator the trouble of manually selecting the shutter speed. The operator can use this idle time for other tasks, thereby further improving time efficiency. Moreover, by automatically selecting the shutter speed, the selection is stable and does not deviate from the selection for each operator.

[0060] Incidentally, in this embodiment, the circuit board 70 is an example of a "board". The projectors 51 and 52 are examples of a "light source". The measuring camera 53 is an example of an "image capturing device". The electronic component 80 is an example of a "component". The lower surface 82a of each lead 82 is an example of a "predetermined feature". The image analysis unit 62 is an example of an "image analysis device".

[0061] Furthermore, in this embodiment, while detecting the minimum missing percentage in S40 and selecting the shutter speed for capturing data with the calculated minimum missing percentage in S44, this is not a limitation. Alternatively, a threshold for the missing percentage (an example of a "predetermined first threshold") can be predetermined based on an acceptable missing percentage, and the shutter speed for capturing data with a missing percentage below the predetermined threshold can be selected. In this case, if a certain set of data is calculated to be below the predetermined threshold, the shutter speed for capturing that data can be selected, and the detection process for the remaining data can be stopped.

[0062] Furthermore, in this embodiment, the image is captured while the shutter speed is varied in multiple stages between a predetermined lower limit and a predetermined upper limit. After all stages of capturing are completed, detection processing is performed, but this is not limited to this method. Alternatively, after capturing an image at a certain shutter speed, the captured data can be processed as described in S22 to S26, and then the image is captured at the next shutter speed. In this case, after capturing an image at a certain shutter speed, the missing percentage of the captured data can be calculated. If the missing percentage is detected to be below a predetermined threshold, the shutter speed at which the captured data was captured is selected, and capturing at the remaining shutter speed stages is stopped. If the missing percentage is detected to be greater than the predetermined threshold, the image is captured at the next shutter speed stage.

[0063] Furthermore, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from its spirit.

[0064] (1) In the above embodiment, the identification device 50 is included in the component mounting machine 1, but it is not limited thereto. At least the image analysis unit 62 in the identification device 50 may also be provided outside the component mounting machine 1. Specifically, for example, it is possible to connect a PC to the component mounting machine 1 and have the PC perform the shutter speed selection process performed by the image analysis unit 62. Figure 6 as well as Figure 7 ).

[0065] (2) In the above embodiment, the component to be identified by the identification device 50 is the electronic component 80 that is actually installed onto the circuit board 70 by the component mounting machine 1, and the image data used as the basis for image recognition by the identification device 50 is the data captured by the measuring camera 53 during the installation of the electronic component 80. However, it is not limited to this. It is also possible to use an imaging device provided in a component data generation device that is not assembled outside the mounting line to obtain the imaging data of the component adsorbed by the nozzle provided in the component data generation device, and to perform image analysis by an identification device provided in the component data generation device (or other device connected to the component data generation device).

[0066] (3) In the above embodiment, the lower surface 82a of each lead 82 of the electronic component 80 is used as the feature part for calculating the missing proportion of the image, but it is not limited to this.

[0067] (4) In the above embodiment, the image used by the recognition device 50 for image recognition is a three-dimensional image visualized by the phase-shifting method. However, the method for visualizing three-dimensional images is not limited to the phase-shifting method. In addition, it is not limited to three-dimensional images, but can also be two-dimensional images, that is, the shooting data obtained from the measuring camera 53 itself.

[0068] Explanation of reference numerals in the attached figures

[0069] 1. Component mounting machine; 33. Assembly head; 34. Nozzle; 50. Identification device; 51, 52. Projector; 53. Measuring camera; 60. Control device; 61. Mounting control unit; 62. Image analysis unit; 66. Storage device; 67. Input / output interface; 68. Motor control circuit; 69. Imaging control circuit; 70. Circuit board; 80. Electronic component; 82. Lead wire; 82a. Lower surface.

Claims

1. An identification device for identifying the state of predetermined feature portions of an element mounted on a substrate. The identification device includes: A light source illuminates the element including the predetermined feature portion; A photographing device for capturing images of the element that receives light emitted by the light source; as well as An image analysis device performs image analysis on image data captured by and obtained from the imaging device, and identifies the state of the predetermined feature portion of the element. The image analysis device performs the following processing: The instruction process instructs the imaging device to capture images of the element while varying its shutter speed between a predetermined lower limit speed and a predetermined upper limit speed; The calculation process compares the images of the predetermined feature portions contained in the multiple shooting data obtained from the shooting device according to the instruction with the ideal images of the predetermined feature portions contained in the shooting data as ideal data without image loss, and calculates the loss ratio of the image of the predetermined feature portion relative to the ideal image for each of the multiple shooting data. The detection process detects captured data whose missing proportion is below a predetermined first threshold from among the multiple missing proportions calculated by the calculation process. as well as Select the processing method, and choose the shutter speed used to capture the shooting data detected by the detection processing.

2. The identification device according to claim 1, wherein, The image analysis device performs the following warning notification process: if the missing proportion of the captured data detected by the detection process is calculated by the calculation process and is above a predetermined second threshold, a warning is issued.

3. The identification device according to claim 1, wherein, The image analysis device performs binarization processing on the captured data obtained from the imaging device. In the calculation process, the image of the predetermined feature contained in the binarized shooting data after binarization is compared with the ideal image of the predetermined feature contained in the binarized shooting data as ideal data without image loss, and the loss ratio of the image of the predetermined feature relative to the ideal image is calculated.

4. The identification device according to claim 2, wherein, The image analysis device performs binarization processing on the captured data obtained from the imaging device. In the calculation process, the image of the predetermined feature contained in the binarized shooting data after binarization is compared with the ideal image of the predetermined feature contained in the binarized shooting data as ideal data without image loss, and the loss ratio of the image of the predetermined feature relative to the ideal image is calculated.

5. The identification device according to any one of claims 1 to 4, wherein, The image analysis device performs a three-dimensional image generation process to generate a three-dimensional image based on the shooting data obtained from the shooting device, performs image analysis on the three-dimensional image generated by the three-dimensional image generation process, and identifies the state of the predetermined feature portion of the element.

6. An identification method for identifying the state of predetermined feature portions of a component assembled onto a substrate. The identification method includes the following image analysis steps: performing image analysis on image data captured by and obtained from the imaging device, identifying the state of the predetermined feature portion of the element; the imaging device capturing an image of the element receiving light from a light source; and the light source illuminating the element containing the predetermined feature portion. The following processing is performed in the image analysis process: The instruction process instructs the imaging device to capture images of the element while varying its shutter speed between a predetermined lower limit speed and a predetermined upper limit speed; The calculation process compares the images of the predetermined feature portions contained in the multiple shooting data obtained from the shooting device according to the instruction with the ideal images of the predetermined feature portions contained in the shooting data as ideal data without image loss, and calculates the loss ratio of the image of the predetermined feature portion relative to the ideal image for each of the multiple shooting data. The detection process detects captured data whose missing proportion is below a predetermined first threshold from among the multiple missing proportions calculated by the calculation process. as well as Select the processing method, and choose the shutter speed used to capture the shooting data detected by the detection processing.

Images